CN215500284U - High heat conduction liquid cooling plate radiating assembly - Google Patents
High heat conduction liquid cooling plate radiating assembly Download PDFInfo
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- CN215500284U CN215500284U CN202122056208.3U CN202122056208U CN215500284U CN 215500284 U CN215500284 U CN 215500284U CN 202122056208 U CN202122056208 U CN 202122056208U CN 215500284 U CN215500284 U CN 215500284U
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Abstract
The utility model discloses a high-heat-conduction liquid-cooling plate heat dissipation assembly which comprises a liquid-cooling lower cover, a middle cover, an upper cover, support columns and a graphene heat conduction layer. The flow channel of the liquid cooling lower cover is filled with a cooling medium, the cooling medium absorbs the heat of the heat source, and then heat exchange is carried out on the middle cover and the temperature is reduced, so that the heat exchange efficiency is improved. The middle cover, the upper cover, the support columns and the graphene heat conduction layer jointly form the temperature equalizing plate. The temperature equalizing plate is combined with the liquid cooling lower cover at the bottom, so that the temperature of the whole body is uniform, and no area with a high temperature is arranged on a path through which a cooling medium passes. The graphene heat conduction layer is good in heat conduction performance, even in heat conduction and light in weight, can reduce the weight while achieving high heat conduction performance and integral temperature uniformity, is suitable for more service environments, and is not influenced by gravity. In addition, the liquid cooling lower cover, the middle cover, the upper cover and the support columns are connected into a whole by adopting a welding process, so that the strength is higher and the safety is higher.
Description
Technical Field
The utility model relates to the technical field of heat dissipation assemblies, in particular to a high-heat-conduction liquid cooling plate heat dissipation assembly.
Background
The thermal conductivity of graphene is 5300W/mK, the thermal conductivity of common metal copper is 401W/mK, the thermal conductivity of aluminum is 237W/mK, and the thermal conductivity of iron is 80W/mK; the thermal conductivity of graphene is much greater than that of common metals.
The graphene is limited by the structural strength factor of the graphene, cannot be used independently, and needs to be attached to other materials for use, but common metal is limited by heat conductivity coefficient and cannot achieve high heat conductivity and integral temperature uniformity.
In a conventional heat dissipation assembly, in order to improve the conducted heat, the amount of metal is often increased, but the mass density of the metal itself is large, and the application field of the heat dissipation assembly is limited due to the increased weight.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention is directed to the drawbacks of the prior art, and the main object of the present invention is to provide a high thermal conductivity liquid cooling plate heat dissipation assembly, which not only has high thermal conductivity and overall temperature uniformity, but also has light weight, thereby overcoming the disadvantages of the prior art.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the application provides a high-heat-conduction liquid cooling plate radiating assembly which comprises a liquid cooling lower cover, wherein at least one flow channel is arranged on the liquid cooling lower cover; the flow channel is filled with a cooling medium; the middle cover is welded to the liquid cooling lower cover; the middle cover is provided with a plurality of liquid injection ports which are communicated with the flow channel; an upper cover welded to the middle cover; at least one graphene heat conduction layer is arranged between the middle cover and the upper cover, and the middle cover and the upper cover are tightly pressed on the graphene heat conduction layer; the support columns penetrate through support column holes in the graphene heat conduction layer; one end of the supporting column is welded on the upper cover, and the other end of the supporting column is welded on the middle cover.
Preferably, the flow channel is arranged in a bent shape, and the head end and the tail end of the flow channel are respectively connected with the liquid injection port.
Furthermore, a plurality of connecting columns are arranged in the flow channel at intervals and connected with the middle cover.
Preferably, the graphene heat conduction layer is graphene paper.
Preferably, the liquid cooling lower cover, the middle cover, the upper cover and the support columns are fittings made of metal materials.
Preferably, the liquid cooling lower cover, the middle cover, the upper cover and the supporting columns are fittings made of aluminum or copper.
Preferably, the support posts penetrate through support post holes in the graphene heat conduction layer in a criss-cross distribution mode.
Preferably, the support columns and the support column holes are of an oblong structure or a circular structure.
Compared with the prior art, the high-heat-conduction liquid-cooling plate radiating assembly has obvious advantages and beneficial effects, and particularly, according to the technical scheme, the high-heat-conduction liquid-cooling plate radiating assembly comprises a liquid-cooling lower cover, a middle cover, an upper cover, supporting columns and a graphene heat conduction layer. The cooling medium is filled in the flow channel of the liquid cooling lower cover, absorbs the heat of the heat source, and then carries out heat exchange on the middle cover, so that the heat exchange efficiency is improved. The heat of well lid is transmitted the upper cover by graphite alkene heat-conducting layer and is dispelled the heat. Because graphite alkene heat-conducting layer heat conductivility is good, heat conduction is even, the quality is light, consequently can also reduce weight when realizing high heat conductivity and whole temperature uniformity, can be applicable to more environment. The liquid cooling lower cover, the middle cover, the upper cover and the support columns are connected into a whole by adopting a welding process, so that the strength is higher and the safety is higher. The middle cover, the upper cover, the support columns and the graphene heat conduction layer jointly form the temperature equalizing plate. Therefore, the combination of the surface temperature equalizing plate and the liquid cooling lower cover at the bottom ensures that the temperature is uniform, and the path of the cooling medium does not have a region with a high temperature.
In addition, the connecting column is connected with the middle cover, so that the flow channel can bear larger pressure without deformation.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is an overall schematic diagram of an embodiment of the present invention.
FIG. 2 is an exploded view of an embodiment of the present invention.
The attached drawings indicate the following:
10. liquid cooling lower cover 11 and flow passage
12. Middle cover 13 and liquid injection port
14. Upper cover 15, graphite alkene heat-conducting layer
16. Support column 17, support column hole
18. Connecting columns.
Detailed Description
Referring to fig. 1 to 2, a specific structure of a preferred embodiment of the utility model is shown, which is a high thermal conductive liquid-cooled plate heat dissipation assembly.
Wherein, well lid, upper cover, support column, graphite alkene heat-conducting layer constitute the samming board. The surface temperature equalizing plate is combined with the liquid cooling lower cover at the bottom, so that the temperature is uniform, and the path through which the cooling medium passes does not have a region with a special high temperature, and the problem that the cooling medium can bring the heat of a high-temperature region to a low-temperature region due to the special high temperature at a certain position is avoided.
The application provides a high-heat-conduction liquid-cooling plate radiating assembly which comprises a liquid-cooling lower cover 10, wherein at least one flow passage 11 is arranged on the liquid-cooling lower cover 10, and a cooling medium is filled in the flow passage 11; the middle cover 12 is welded on the liquid cooling lower cover 10, a plurality of liquid injection ports 13 are formed in the middle cover 12, and the liquid injection ports 13 are communicated with the flow channel 11; an upper cover 14 welded to the middle cover 12; at least one graphene heat conduction layer 15 is arranged between the middle cover 12 and the upper cover 14, and the graphene heat conduction layer 15 is pressed by the middle cover 12 and the upper cover 14; a plurality of support posts 16 passing through support post holes 17 on the graphene heat conduction layer 15; one end of the supporting column 16 is welded to the upper cover 14, and the other end of the supporting column 16 is welded to the middle cover 12. Preferably, the graphene heat conduction layer 15 is graphene paper. The number of layers of the graphene paper can be set to be multiple according to the use scene. Between the graphite alkene heat-conducting layer 15, between graphite alkene heat-conducting layer 15 and well lid 12, set up the heat-conducting glue between graphite alkene heat-conducting layer 15 and the upper cover 14, further improve heat conduction efficiency. The liquid-cooled lower cover 10, the middle cover 12, the upper cover 14 and the support columns 16 are fittings made of metal materials. Preferably, the liquid-cooled lower cover 10, the middle cover 12, the upper cover 14 and the supporting columns 16 are fittings made of aluminum or copper. The working principle is as follows: the liquid-cooled lower cover 10 is contacted with a heat source to absorb heat, and the cooling medium in the flow passage 11 absorbs the heat of the heat source, and then carries out heat exchange and temperature reduction in the middle cover 12. The liquid injection ports 13 are preferably arranged in two, and are respectively connected to the head end and the tail end of the flow channel 11, so that the cooling medium in the flow channel 11 can flow conveniently, and the heat dissipation efficiency is improved. The heat of the middle cover 12 is efficiently, quickly and uniformly transferred to the upper cover 14 by the graphene heat conduction layer 15 for heat dissipation. The graphene heat conduction layer 15 is pressed by the middle cover 12 and the upper cover 14, and the support columns 16 provide support for the middle cover 12 and the upper cover 14. Because graphite alkene heat-conducting layer 15's heat conductivility is good, heat conduction is even, the quality is light, and can not receive the influence of gravity, consequently can also reduce weight when realizing high heat conductivity and whole temperature uniformity, can be applicable to more environment. The liquid cooling lower cover 10, the middle cover 12, the upper cover 14 and the support columns 16 are connected into a whole by adopting a welding process, so that the strength is higher and the safety is higher. Wherein, the welding process preferably adopts diffusion welding for connection. The middle cover, the upper cover, the support columns and the graphene heat conduction layer jointly form the temperature equalizing plate. The heat of the liquid cooling lower cover is absorbed by the temperature equalizing plate and is rapidly radiated, so that the whole temperature is uniform, no area with special high temperature exists on the path where the cooling medium passes, and the problem that the cooling medium can bring the heat of a high-temperature area to a low-temperature area due to the special high temperature of a certain part is avoided.
Preferably, the flow channel 11 is arranged in a curved shape, and the head end and the tail end of the flow channel are respectively connected with the liquid injection port. The length of the flow channel can be increased by the curved flow channel, so that more cooling media can be injected, a better heat equalizing effect is achieved, and overhigh local temperature can be avoided. The cooling medium may be water or ethanol, or another cooling medium may be selected as needed. The flow passage 11 may be formed in various shapes such as a W shape, a V shape, a wave shape, etc. to adapt to different use environments.
Furthermore, a plurality of connecting columns 18 are arranged at intervals in the flow channel 11 and connected with the middle cover 12. The connecting column 18 is welded to the middle cap 12 so that the runner 11 can withstand a greater pressure without being deformed. The welding process for the connecting stud 18 is preferably diffusion welding. The connecting column 18 includes a cylindrical, arc-shaped, oblong column.
Preferably, the support columns 16 penetrate through the support column holes 17 in the graphene heat conduction layer 15 in a crisscross distribution manner, and then two ends of each support column 16 are respectively and correspondingly welded to the middle cover 12 and the upper cover 14, so that the middle cover 12 and the upper cover 14 are uniformly stressed and are not easily deformed after being connected.
Preferably, the support columns 16 and the support column holes 17 are of an oblong structure or a circular structure, which can prevent the graphene heat conduction layer 15 from being cut, thereby affecting the product quality.
The preparation method comprises the following steps: the middle cover 12, the support column 16 and the upper cover 14 are punched and cut to form by a punch and a punching die, the punched middle cover 12, the punched support column 16 and the punched upper cover 14 are reserved after being subjected to a surface oil removing process, the graphene heat conduction layer 15 is reserved after being cut and formed by a die cutting mode, the middle cover 12, the support column 16, the graphene heat conduction layer 15 and the punched upper cover 14 are assembled in sequence and put into a graphite welding jig, and a high-heat-conductivity composite accessory is formed after passing through welding equipment. And assembling and welding the high-heat-conductivity composite accessory formed by welding the middle cover 12, the support column 16, the graphene heat conduction layer 15 and the upper cover 14 and the liquid-cooling lower cover 10 into a product, and finally injecting a cooling medium into the flow channel 11.
In summary, the design of the present invention is focused on that the cover, the upper cover, the support pillars, and the graphene thermal conductive layer together form a uniform temperature plate. The heat of the liquid cooling lower cover can be absorbed by the temperature equalizing plate and quickly dissipated, so that the overall temperature is uniform, and no area with a high temperature is arranged on a path through which a cooling medium passes. The liquid cooling lower cover 10 is carried out heat exchange efficiency with the mode of liquid cooling higher, and it has graphite alkene heat-conducting layer 15 to press from both sides tightly between well lid 12 and the upper cover 14 simultaneously, can also reduce weight when realizing high heat conductivity and whole temperature uniformity, can also be applicable to more service environments.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.
Claims (8)
1. The utility model provides a high heat conduction liquid cooling board radiator unit which characterized in that: the liquid cooling device comprises a liquid cooling lower cover, wherein at least one flow channel is arranged on the liquid cooling lower cover; a cooling medium is filled in the flow channel; the middle cover is welded to the liquid cooling lower cover; the middle cover is provided with a plurality of liquid injection ports which are communicated with the flow channel; an upper cover welded to the middle cover; at least one graphene heat conduction layer is arranged between the middle cover and the upper cover, and the middle cover and the upper cover are tightly pressed on the graphene heat conduction layer; the support columns penetrate through support column holes in the graphene heat conduction layer; one end of the supporting column is welded on the upper cover, and the other end of the supporting column is welded on the middle cover.
2. The high thermal conductivity liquid cooled panel heat sink assembly of claim 1, wherein: the runner is the setting of crooked shape, just the head end and the end of runner are connected with respectively annotate the liquid mouth.
3. The high thermal conductivity liquid cooled panel heat sink assembly of claim 1, wherein: a plurality of connecting columns are arranged in the flow channel at intervals and connected with the middle cover.
4. The high thermal conductivity liquid cooled panel heat sink assembly of claim 1, wherein: the graphene heat conduction layer is graphene paper.
5. The high thermal conductivity liquid cooled panel heat sink assembly of claim 1, wherein: the liquid cooling lower cover, the middle cover, the upper cover and the support columns are fittings made of metal materials.
6. The high thermal conductivity liquid cooled panel heat sink assembly of claim 1, wherein: the liquid cooling lower cover, the middle cover, the upper cover and the support column are fittings made of aluminum or copper.
7. The high thermal conductivity liquid cooled panel heat sink assembly of claim 1, wherein: the support columns penetrate through support column holes in the graphene heat conduction layer in a longitudinally and transversely distributed mode.
8. The high thermal conductivity liquid cooled panel heat sink assembly of claim 1, wherein: the support columns and the support column holes are of oblong structures or circular structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122056208.3U CN215500284U (en) | 2021-08-30 | 2021-08-30 | High heat conduction liquid cooling plate radiating assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122056208.3U CN215500284U (en) | 2021-08-30 | 2021-08-30 | High heat conduction liquid cooling plate radiating assembly |
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| CN215500284U true CN215500284U (en) | 2022-01-11 |
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| CN202122056208.3U Active CN215500284U (en) | 2021-08-30 | 2021-08-30 | High heat conduction liquid cooling plate radiating assembly |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114421052A (en) * | 2022-01-18 | 2022-04-29 | 吉林大学 | Integral liquid cooling plate cooling system with graphene coating |
| CN116038166A (en) * | 2023-03-31 | 2023-05-02 | 河北宇天材料科技有限公司 | Composite uniform-temperature water cooling structure based on welding and manufacturing method thereof |
-
2021
- 2021-08-30 CN CN202122056208.3U patent/CN215500284U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114421052A (en) * | 2022-01-18 | 2022-04-29 | 吉林大学 | Integral liquid cooling plate cooling system with graphene coating |
| CN116038166A (en) * | 2023-03-31 | 2023-05-02 | 河北宇天材料科技有限公司 | Composite uniform-temperature water cooling structure based on welding and manufacturing method thereof |
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