CN116034011A - 具有带有密封中心凸台的塑料盖的电子设备 - Google Patents
具有带有密封中心凸台的塑料盖的电子设备 Download PDFInfo
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- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
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Abstract
一种电子设备包括壳体(10、10'),该壳体具有设置在壳体(10、10')的中心部分中的通孔(10A)。印刷电路板(14)连接到壳体(10、10')。印刷电路板(14)包括设置在其上的一个或多个电子组件。塑料壳体盖(12)连接到壳体(10、10')并覆盖(12)印刷电路板(14)。壳体盖(12)包括与壳体(10、10')成一体的中心定位的柱构件(16)。柱构件(16)延伸通过壳体(10、10')的通孔(10A)并与壳体(10、10')接合。壳体(10、10')和壳体盖(12)之间的接合防止壳体盖(12)向外偏转。
Description
技术领域
本发明总体上涉及一种用于电子控制单元壳体的壳体盖,其防止盖向外偏转。
背景技术
电子控制单元通常安装在车辆的发动机舱内。控制单元通常通过基于来自传感器的输入来控制一系列致动器而控制车辆的许多功能,诸如燃料喷射器驱动器、发动机操作等。典型的控制单元具有设置在壳体中的电路板。安装到壳体的盖覆盖电路板。当车辆和由此的控制单元暴露于高海拔时,内部压力可在控制单元内侧积聚。在盖相对于壳体密封的密封控制单元中,此类内部压力可导致盖向外偏转,从而降低密封装置的有效性。在控制单元中使用通风口可以平衡壳体内侧的压力,但当客户要求密封的ECU时,不能使用该解决方案。通过使用铸造盖可以限制盖偏转。然而,铸造盖昂贵且非常重。一些现有的实现方式利用螺钉和相关硬件将盖的中心部分固定到壳体,但是此类解决方案不具有成本效益。
发明内容
示例性的实施例总体上针对一种用于组装电子设备的方法以及所得的电子设备,其设计相对简单并且制造成本低廉。
根据示例性的实施例,一种电子设备包括壳体,该壳体具有设置在壳体的中心部分中的通孔。印刷电路板连接到壳体并且包括设置在其上的一个或多个电气或电子组件。壳体盖连接到壳体并覆盖印刷电路板。壳体盖包括与壳体成一体的中心定位的柱构件。柱构件延伸通过壳体的通孔并与壳体接合。壳体和壳体盖之间的接合防止壳体盖向外偏转。
壳体盖具有塑料组合物。柱构件的远端部分围绕壳体的通孔形成,从而形成接合。远端部分在限定通孔的壳体上方延伸。
在一种实现方式中,壳体盖进一步包括突起,该突起从壳体盖延伸并且沿柱构件的纵向段围绕柱构件。壳体还包括凹口,并且突起的远端部分设置在凹口中。密封剂设置在凹口中并接触突起的远端部分。密封剂在壳体和壳体盖之间形成密封。
在另一实现方式中,壳体的限定通孔的部分朝向壳体盖张开。密封剂设置在壳体的该部分的外表面和柱构件的外表面之间。
另一个实施例涉及一种用于组装电子设备的方法。该方法包括获得具有沿其中心部分设置的通孔的壳体、至少部分地填充有电子设备的印刷电路板、以及具有从其内表面延伸的柱构件的塑料壳体盖。该方法进一步包括将印刷电路板固定到壳体,将壳体盖放置在印刷电路板上方,使得柱构件延伸通过壳体的通孔,以及将壳体盖固定到壳体。将热和压力施加到柱构件的远端部分,使得柱构件形成在限定通孔并与壳体部分接合的、壳体的部分上。该接合防止壳体盖向外偏转。
壳体盖包括沿柱构件的纵向段围绕柱构件的突起,并且该方法进一步包括沿壳体放置密封剂,使得密封剂在放置壳体盖期间接触突起。密封剂与突起形成密封。特别地,壳体包括凹口并且放置密封剂的操作包括将密封剂放置在凹口中。在一种实现方式中,壳体的限定通孔的部分朝向壳体盖张开,并且放置密封剂的操作包括放置密封剂使得密封剂接触壳体的部分的外表面。
附图说明
下面结合附图结合示例性的实施例对本发明的各个方面进行详细说明,在附图中:
图1是根据示例性的实施例的电子设备的横截面侧视图;
图2是图1的电子设备的分解立体图;
图3是图1的电子设备在壳体盖与壳体接合之前的部分横截面侧视图;
图4是图1的电子设备的局部横截面侧视图,其中壳体盖附接到电子设备的壳体;
图5是图1的电子设备在壳体盖与壳体接合之前的简化横截面侧视图;
图6是图1的根据另一示例性的实施例的壳体盖的立体图;
图7是在壳体盖与壳体接合之前具有图6的壳体盖的电子设备的立体横截面视图;
图8是具有图6的壳体盖的电子设备的局部横截面侧视图,其中壳体盖附接到电子设备的壳体;
图9是图1的根据另一示例性的实施例的电子设备的局部横截面视图,其中壳体盖附接到电子设备的壳体;以及
图10是图1的电子设备的组装流程图。
具体实施方式
示例性的实施例的以下描述本质上仅是示例性的并且决不旨在限制本发明、其应用或用途。在附图和整个详细描述中,相同的附图标记用于标识相同或相似的元件。为了清楚起见,元件未按比例显示,除非另有说明。
一般而言,示例性的实施例涉及一种包括壳体和壳体盖的电子设备,其中壳体盖以非螺钉和/或无螺钉方式与壳体接合在壳体盖的中心区域中,使得防止壳体盖在变化的压力和温度条件下向外偏转。例如,电子设备可以是车辆的电子控制单元。
图1示出具有壳体10和壳体盖12的电子设备1,壳体盖12经由螺钉或其它附接机构附接至壳体10。印刷电路板(PCB)14设置在壳体10的内部并附接到其上。PCB 14可以至少部分地填充有电气和/或电子组件14A(图3),该电气和/或电子组件14A彼此电连接并且在电子设备的操作期间一起执行一个或多个预定功能。壳体10包括一个或多个插座17,该插座17提供电气和/或电子组件14A与电子设备1外部的设备之间的电连接。壳体盖12由塑料组合物构成。
参考图2和图3,电子设备1进一步包括设置在PCB 14和壳体10之间的热界面材料15。热界面材料15由导热组合物构成,以便在PCB 14和壳体10之间提供用于冷却PCB 14并且特别是冷却电子组件14A的导热路径。
电子设备1可以在不同的大气条件下操作,这可能导致在远离壳体10的方向中施加在壳体盖12上的压力。为了防止壳体盖12向外偏转,壳体盖12在壳体盖的中心区域中连接到壳体10。壳体盖12包括柱构件16,该柱构件16从盖的中心区域延伸并固定地附接到壳体10。壳体盖12的中心区域中的该固定附接有利地用于防止盖在远离壳体10的方向中向外偏转。
根据示例性的实施例,柱构件16与塑料壳体盖12一体形成。在一种实现方式中,壳体盖12与柱构件16形成为模制构件。在另一种实现方式中,柱构件16粘附到或以其它方式附接到壳体盖12以便与盖一体形成。柱构件16从壳体盖12的内表面延伸。如图3中所示,柱构件16包括肩部16A,PCB 14搁置在肩部16A上。
在图2和图3中最优可见的是,壳体10包括设置在壳体的中心区域中的通孔10A。特别地,通孔10A设置成使得壳体盖12的柱构件16延伸通过通孔10A(图3)。此外,壳体10包括肩部10C,该肩部10C朝向PCB 14延伸并提供接触表面,PCB 14抵靠该接触表面设置,从而在围绕柱构件16的区域中在壳体10和壳体盖12之间提供更稳定和刚性的连接。每个肩部10C具有环形形状。在图2和图3中所示的实施例中,肩部10C沿柱构件16的纵向段围绕柱构件16。应当理解,肩部10C可以具有不同于环形的形状,并且可以使用多于或少于两个的肩部10C。
在示例性的实施例中,柱构件16固定到壳体10。由于壳体10经由柱构件16固定到壳体盖12,并且柱构件16沿壳体盖12的中心区域设置,防止壳体盖向外偏转和/或弯曲。
在一种实现方式中,柱构件16使用热空气铆接和/或热熔接固定到壳体10。具体地,在柱构件16延伸通过通孔10A的情况下,柱构件16经受热空气(即,非接触加热),使得柱构件16的远端可以形成和/或塑性变形为不同的形状。使用温度较低的工具在压力下形成、夹紧和冷却这种桩(柱构件16)。而图2和图3示出在热空气铆接和/或热熔接之前的柱构件16,图4示出在其成形和冷却之后的柱构件16。如图所示,柱构件16的远端部分形成在壳体10的限定通孔10A的部分上方,从而将柱构件16(以及盖12)固定到壳体10。可以理解,热空气铆接和热熔接是众所周知的,因此为了方便起见,将不提供对柱构件16的远端再成形和/或塑性变形的过程的更详细描述。
在另一个示例性的实施例中,电子设备1包括在壳体10和壳体盖12之间提供附加密封的构件。参考图5-8,壳体盖12包括从壳体盖延伸并沿柱构件16的纵向段围绕柱构件16的突起20。突起20被示为具有大体圆柱形的形状,但是应当理解,突起20可以具有不同的形状。此外,壳体10包括沿壳体的内表面限定的凹口10B。凹口10B的大小和尺寸设计成用于接收突起20的远端部分,如图7和图8中所示,从而形成榫槽结构。密封剂22在凹口10B中设置在壳体10和突起20之间并且接触壳体10和突起20,从而在壳体10和壳体盖12之间提供密封(图8)。密封剂22可在施用热空气铆接/热熔接处理之前施加到凹口10B,以将柱构件16重新成形并将其连接到壳体10。在该示例性的实施例中,单个肩部10C用于在柱构件16的区域中提供壳体10和壳体盖12之间的刚性连接。
图9示出第三示例性的实施例。该实施例包括由金属片形成的壳体10'。如图所示,壳体10'的限定通孔10A的部分朝壳体盖12向内张开。此外,壳体盖12包括从壳体盖延伸的突起20',其沿柱构件16的纵向段主要围绕柱构件16,并提供接触表面23,PCB 14抵靠该接触表面23设置。突起20'和PCB 14形成围绕柱构件16的纵向段的凹槽21。壳体10'的张开部分的远端设置在突起20'内,并且特别是设置在凹槽21中,从而形成榫槽结构。在示例性的实施例中,壳体10'的张开端可以设置在凹槽21的中心部分中,在柱构件16和突起20'之间基本上等距地间隔开。在对柱构件16进行上述热空气铆接/热熔接处理之前,将密封剂22设置在凹槽21中,使得密封剂22围绕壳体10'的张开端并在张开端和壳体盖12之间形成密封。密封剂22可以在壳体10'的张开端插入凹槽21之前或之后添加到凹槽21中。
将参考图10描述组装电子设备1的方法。可以理解,下面描述的动作顺序可以以与图10中所示的顺序不同的顺序执行。最初,在1000处提供壳体10、PCB 14、热界面材料15和壳体盖12。在1002处,PCB 14诸如用一个或多个螺钉、粘合剂等固定到壳体10。在1004处将密封剂22施加到壳体10和/或柱构件16。然后在1006处将壳体盖12固定到壳体10。该固定可以通过使用螺钉、粘合剂或其它已知机构来执行。将壳体盖12固定到壳体10允许密封剂22接触、干燥/固化并在盖和壳体之间形成密封。目前延伸通过壳体10的通孔10A的柱构件16具有大致圆柱形的形状。在1008处执行热空气铆接和/或热熔接,这将柱构件16的远端重新成形,使得其设置在壳体10的直接围绕通孔10A的部分上方,从而将壳体盖12的中心部分接合到壳体10。
本发明已在本文中以说明性方式进行了描述,并且应理解,所使用的术语旨在具有描述词语的性质而不是限制性的。显然,根据上述教导,本发明的许多修改和变化是可能的。除了在所附权利要求的范围内具体描述的以外,本发明可以被实践。
Claims (13)
1.一种电子设备,包括:
壳体(10、10'),所述壳体(10、10')包括设置在所述壳体(10、10')的中心部分中的通孔(10A);
连接到所述壳体(10、10')的印刷电路板(14),所述印刷电路板(14)包括设置在其上的一个或多个电气或电子组件;以及
壳体盖(12),其连接到所述壳体(10、10')并覆盖所述印刷电路板(14),所述壳体盖(12)包括与所述壳体(10、10')成一体的位于中心的柱构件(16),所述柱构件(16)延伸通过所述壳体(10、10')的所述通孔(10A)并与所述壳体(10、10')接合,所述壳体(10、10')和所述壳体盖(12)之间的所述接合防止所述壳体盖(12)向外偏转。
2.根据权利要求1所述的电子设备,其中,所述壳体盖(12)包括塑料组合物。
3.根据权利要求2所述的电子设备,其中,所述柱构件(16)的远端部分形成在所述壳体(10、10')的所述通孔(10A)周围,从而形成所述接合。
4.根据权利要求3所述的电子设备,其中,所述远端部分在限定所述通孔(10A)的所述壳体(10、10')上方延伸。
5.根据权利要求1所述的电子设备,其中,所述壳体盖(12)进一步包括从所述壳体盖(12)延伸并沿所述柱构件(16)的纵向段围绕所述柱构件(16)的突起(20、20')。
6.根据权利要求5所述的电子设备,其中,所述壳体(10、10')包括凹口(10B),并且所述突起(20、20')的远端部分设置在所述凹口(10B)中。
7.根据权利要求6所述的电子设备,进一步包括密封剂(22),其设置在所述凹口(10B)中并且接触所述突起(20、20')的所述远端部分,所述密封剂(22)在所述壳体(10、10')和所述壳体盖(12)之间形成密封。
8.根据权利要求1所述的电子设备,其中,所述壳体(10、10')的、限定所述通孔(10A)的部分朝向所述壳体盖(12)张开。
9.根据权利要求8所述的电子设备,进一步包括密封剂(22),其设置在所述部分的外表面和所述柱构件(16)的外表面之间。
10.一种组装电子设备的方法,包括:
获得具有沿其中心部分设置的通孔(10A)的壳体(10、10')、至少部分地装有电子设备的印刷电路板(14)、以及具有从其内表面延伸的柱构件(16)的塑料壳体盖(12);
将所述印刷电路板(14)固定到所述壳体(10、10');
将所述壳体盖(12)放置在所述印刷电路板(14)上方,使得所述柱构件(16)延伸通过所述壳体(10、10')的所述通孔(10A);
将所述壳体盖(12)固定到所述壳体(10、10');以及
将热和压力施加到所述柱构件(16)的远端部分,使得所述柱构件(16)形成在所述壳体(10、10')的、限定所述通孔(10A)并与所述壳体(10、10')的部分接合的部分上,所述接合防止所述壳体盖(12)向外偏转。
11.根据权利要求10所述的方法,其中,所述壳体盖(12)包括沿所述柱构件(16)的纵向段围绕所述柱构件(16)的突起(20、20'),并且所述方法进一步包括沿所述壳体(10、10')放置密封剂(22),使得所述密封剂(22)在放置所述壳体盖(12)期间接触所述突起(20、20'),所述密封剂(22)与所述突起(20、20')形成密封。
12.根据权利要求10所述的方法,其中,所述壳体(10、10')包括凹口(10B),并且放置所述密封剂(22)的操作包括将所述密封剂(22)放置在所述凹口(10B)中。
13.根据权利要求11所述的方法,其中,所述壳体(10、10')的、限定所述通孔(10A)的部分朝向所述壳体盖(12)张开,并且放置所述密封剂(22)的操作包括放置所述密封剂(22)使得所述密封剂(22)接触所述壳体(10、10')的所述部分的外表面。
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