CN116013844B - Wafer boron coating fixture and boron coating device - Google Patents
Wafer boron coating fixture and boron coating device Download PDFInfo
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- CN116013844B CN116013844B CN202310301072.9A CN202310301072A CN116013844B CN 116013844 B CN116013844 B CN 116013844B CN 202310301072 A CN202310301072 A CN 202310301072A CN 116013844 B CN116013844 B CN 116013844B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The invention provides a wafer boron coating fixture and a boron coating device, which belong to the technical field of equipment for manufacturing semiconductor devices, and comprise: a turntable and a positioning component. The positioning assembly is provided with at least three groups along the circumferential array of the turntable, and comprises a sliding block which is arranged in a sliding manner along the normal direction of the turntable, the front end of the top surface of the sliding block is provided with a side pressing plate with an arc structure, the radius of the inner wall of the side pressing plate is the same as the outer diameter of the wafer, the inner wall of the side pressing plate is provided with a liquid outlet, when boron is coated, the inner wall of the side pressing plate is attached to the outer side wall of the wafer, and the bottom surface of the liquid outlet is positioned above the bottom surface of the wafer; the positioning assembly further comprises a swinging rod, the middle section of the swinging rod is hinged to the turntable, the upper section of the swinging rod is movably arranged at the rear end of the sliding block, and a pendulum bob is arranged at the lower end of the swinging rod. The boron coating device comprises the boron coating clamp, the turntable is rotationally arranged in a shell, and a motor is arranged at the bottom of the shell and used for driving the turntable to rotate. The scheme can effectively prevent the boron liquid from reversely penetrating to the bottom surface of the wafer.
Description
Technical Field
The invention belongs to the technical field of equipment for manufacturing semiconductor devices, and particularly relates to a wafer boron-coating clamp and a boron-coating device.
Background
A common process for diffusing a wafer is to coat an impurity source (a boron source is taken as an example in the present invention) on the surface of the wafer, and then diffuse boron atoms into a semiconductor silicon layer by high temperature to form a P-type. The existing boron coating device mainly adopts the following two modes to coat boron, firstly, a brush is used for dipping a boron source and then coating the boron on a rotating wafer, and the thickness of the boron liquid coated in the mode is different, and harmful impurities are easy to adhere to the surface of the wafer; the other is to drop the boron liquid at the center of the wafer, and then cover the surface of the wafer by using the centrifugal force when the wafer rotates. When manufacturing a single-layer PN structure wafer, only boron liquid needs to be coated on the front surface of the wafer in the diffusion process, if the boron liquid reversely seeps to the bottom surface of the wafer, a PNP structure is formed at the edge part of the wafer, so that the reverse breakdown voltage of a final product is reduced, the forward voltage drop is increased, and the quality of the final product is unqualified. The prior boron coating device cannot avoid the reverse osmosis of boron liquid from the edge of the wafer to the bottom surface of the wafer when adopting the two coating modes, thereby leading to the rejection of chips at the edge part of the wafer.
Disclosure of Invention
In order to solve the defects in the prior art, the invention provides a wafer boron coating clamp and a boron coating device, which can effectively prevent boron liquid from reversely penetrating to the bottom surface of a wafer.
In order to achieve the object of the invention, the following scheme is adopted:
a boron wafer chuck comprising: a turntable and a positioning component.
The top surface of the turntable is used for placing wafers.
The positioning assembly is provided with at least three groups along the circumferential array of the turntable, and comprises a sliding block which is arranged in a sliding manner along the normal direction of the turntable, the front end of the top surface of the sliding block is provided with a side pressing plate with an arc structure, the height of the side pressing plate is larger than the thickness of a wafer, the radius of the inner wall of the side pressing plate is the same as the outer diameter of the wafer, the inner wall of the side pressing plate is provided with a liquid outlet, when boron is coated, the inner wall of the side pressing plate is attached to the outer side wall of the wafer, the bottom surface of the liquid outlet is positioned above the bottom surface of the wafer, and the end parts of the side pressing plates of the adjacent positioning assemblies are attached; the positioning assembly further comprises a swinging rod, the middle section of the swinging rod is hinged to the turntable, the upper section of the swinging rod is movably arranged at the rear end of the sliding block, and a pendulum bob is arranged at the lower end of the swinging rod.
Further, the top surface of carousel has offered the collecting tank along the circumference, and the bottom of pressure measurement board has the liquid outlet with the leakage fluid dram intercommunication, when covering boron, the liquid outlet aligns with the collecting tank.
Further, the distances between the liquid outlet and the upper end of the liquid collecting groove and the axis of the rotary table are smaller than the distances between the lower ends of the liquid outlet and the axis of the rotary table.
Further, the liquid outlet and the liquid collecting groove are all in arc-shaped strip structures.
Further, the side pressure plate is provided with an arc groove along the arc track, the liquid outlet is communicated with the arc groove, and when boron is coated, the surface of the wafer is positioned in the height range of the arc groove.
Further, the rear end top surface of slider is equipped with the connecting block, links to each other through the elastic component between connecting block and the side pressure board, and the side pressure board is located on the slider along the normal direction removal of carousel.
Further, the top of connecting block is equipped with the backstop, and the front end of backstop sets up towards the middle part of carousel, and when the elastic component was the natural state, the front end face of backstop was located the top of side clamp plate, and when side clamp plate pressure wafer, the front end face of backstop was located the top of wafer.
Further, the circumference of the turntable is coaxially sleeved with a circular ring, and when the pendulum bob swings to the outer side of the turntable, the lower section of the pendulum rod pushes the circular ring to move upwards along the axis of the turntable.
Further, the T-shaped groove is formed in the rotary table along the circumferential array, the lower section of the sliding block is slidably arranged in the T-shaped groove, a triangular plate is arranged at one end, close to the middle of the rotary table, of the T-shaped groove, the bottom edge of the front end of the sliding block is in sliding contact with the inclined surface of the triangular plate, a cylindrical spring is arranged between the bottom surface of the triangular plate and the bottom of the T-shaped groove, when the side pressing plate loosens a wafer, the cylindrical spring is in a natural stretching state, at the moment, the top of the triangular plate protrudes out of the top surface of the rotary table and is used for supporting the wafer, and when the side pressing plate compresses the wafer, the top surface of the triangular plate is lower than the bottom surface of the rotary table.
The wafer boron coating device comprises the wafer boron coating clamp, wherein the turntable is rotationally arranged in a shell, and a motor is arranged at the bottom of the shell and used for driving the turntable to rotate.
The invention has the beneficial effects that: utilize the boron liquid that the liquid outlet discharge wafer edge was thrown away, prevent that the boron liquid from piling up in the border department of side pressure plate inner wall and wafer surface to avoid the boron thickness of covering at wafer border too big, and can prevent that the boron liquid from oozing to the bottom surface of wafer from the border of wafer, and utilize the laminating seal structure of the inner wall of side pressure plate and wafer lateral wall to further avoid the boron liquid to ooze to the bottom surface of wafer.
Drawings
The drawings described herein are for illustration of selected embodiments only and not all possible implementations, and are not intended to limit the scope of the invention.
Fig. 1 shows a schematic structural diagram of a boron-on-wafer device of the present application.
Fig. 2 shows a construction diagram of the positioning assembly of the present application.
Figure 3 shows a partial cross-sectional view of the drain, the outlet, the sump and the outlet.
Fig. 4 is a schematic view showing a state in which a wafer is placed on the boron coated jig of the present application.
Fig. 5 shows a partial enlarged view at a in fig. 4.
Fig. 6 shows an overall cross-sectional view of the boron coated fixture of the present application when placing a wafer.
Fig. 7 shows a partial enlarged view at B in fig. 6.
Fig. 8 shows a schematic view of the state of the boron-coated jig of the present application when boron is coated.
Fig. 9 shows a partial enlarged view at C in fig. 8.
Fig. 10 shows an overall cross-sectional view of the boron-coated fixture of the present application when boron is coated.
Fig. 11 shows a partial enlarged view at D in fig. 10.
The marks in the figure: the device comprises a turntable (1), a liquid collecting tank (11), an output port (12), a plug (13), a T-shaped tank (14), a sliding block (2), a connecting block (21), an elastic piece (22), an upper stop block (23), a side pressure plate (3), a liquid outlet (31), a liquid outlet (32), an arc-shaped tank (33), a swinging rod (4), a pendulum bob (41), a strip-shaped hole (42), a circular ring (5), a guide rod (51), a triangular plate (6), a cylindrical spring (61), a shell (7), a motor (71) and a wafer (9).
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the following detailed description of the embodiments of the present invention will be given with reference to the accompanying drawings, but the described embodiments of the present invention are some, but not all embodiments of the present invention.
Example 1
As shown in fig. 2, 4 and 8, a boron-coated wafer chuck includes: turntable 1 and positioning assembly.
Specifically, as shown in fig. 1, 4 and 8, the turntable 1 has a disk structure, and a top surface thereof is used for placing a wafer 9.
Specifically, the locating component is equipped with three at least groups along the circumference array of carousel 1, including the slider 2 that slides along carousel 1 normal direction and set up, the front end of the top surface of slider 2 is equipped with the side pressure board 3 of circular arc structure, the height of side pressure board 3 is greater than the thickness of wafer 9, the inner wall radius of side pressure board 3 is the same with the external diameter of wafer 9, the inner wall of side pressure board 3 is equipped with fluid-discharge port 31, when covering boron, the inner wall of side pressure board 3 is laminated with the outer lateral wall of wafer 9, and the bottom surface of fluid-discharge port 31 is located the top of wafer 9 bottom surface, utilize the boron liquid that fluid-discharge port 31 discharge wafer 9 border was thrown away, prevent that the boron liquid from piling up in the border department of side pressure board 3 inner wall and wafer 9 surface, thereby avoid the boron thickness of covering of wafer 9 border too big, and utilize the laminating seal structure of side pressure board 3 inner wall and wafer 9 lateral wall to prevent that the boron liquid from reverse oozing to the bottom surface of wafer 9 from the border of wafer 9. And the ends of the side pressing plates 3 of the adjacent positioning assemblies are attached to avoid overflow or even reverse osmosis of the boron liquid from the ends of the adjacent side pressing plates 3 to the bottom surface of the wafer 9. Therefore, the scheme can effectively prevent the boron liquid from reversely seeping to the bottom surface of the wafer no matter the mode of sticking or dripping the writing brush is adopted for coating the boron. In order to ensure the sealing effect between the end parts of the side pressing plates 3, rubber pads are arranged at the two ends of the side pressing plates 3. The positioning assembly further comprises a swing rod 4, the middle section of the swing rod is hinged to the rotary table 1, the upper section of the swing rod 4 is movably arranged at the rear end of the sliding block 2, and a pendulum 41 is arranged at the lower end of the swing rod 4.
More specifically, as shown in fig. 2, the movable connection structure of the upper section of the swing rod 4 and the rear end of the slider 2 is shown, the upper section of the swing rod 4 is provided with a bar-shaped hole 42 along the length direction, the rear end of the slider 2 is provided with a connecting shaft, the connecting shaft penetrates through the bar-shaped hole 42, when the swing rod 4 swings, the upper section of the swing rod 4 drives the slider 2 to move along the normal line of the turntable 1 through the connecting shaft, and the connecting shaft moves in the bar-shaped hole 42 so as to adapt to the relative position and angle change between the swing rod 4 and the slider 2.
As shown in fig. 4 and 6, when the turntable 1 is at rest, the pendulum 41 naturally sags, and the side pressure plate 3 is in a released state. As shown in fig. 8 and 10, when the turntable 1 rotates, the pendulum 41 swings to the outside of the turntable 1, and the upper section of the swing rod 4 pushes the slide block 2 to move to the middle of the turntable 1, so that the side pressing plate 3 presses and fixes the wafer 9, the pressing force of the pressing structure is more stable and soft, the pressing force of the pressing structure can effectively prevent the wafer from being crushed while the side pressing plate 3 presses the wafer, and the wafer can be pressed through three or four groups of positioning assemblies simultaneously, and the centering of the wafer and the turntable 1 can be effectively ensured, so that the wafer is positioned at the center position of the turntable 1.
Preferably, as shown in fig. 3 and 5, the top surface of the turntable 1 is provided with a plurality of liquid collecting grooves 11 along the circumference, the bottom of the pressure measuring plate 3 is provided with a liquid outlet 32 communicated with a liquid outlet 31, when boron is covered, namely, when the inner wall of the side pressure measuring plate 3 is attached to the outer side wall of the wafer 9, the liquid outlet 32 is aligned with the liquid collecting groove 11, so that the boron liquid discharged through the liquid outlet 31 and the liquid outlet 32 is temporarily stored in the liquid collecting groove 11 for reuse, thereby achieving the purpose of saving the boron liquid, the outer wall of the turntable 1 is provided with an output port 12 communicated with the liquid collecting groove 11 for outputting the boron liquid in the liquid collecting groove 11, and a plug 13 is arranged in the output port 12 to plug the output port 12.
Preferably, as shown in fig. 3, the distances between the upper ends of the liquid outlet 32 and the liquid collecting tank 11 and the axis of the turntable 1 are smaller than the distances between the lower ends of the liquid outlet 32 and the axis of the turntable 1, so that the liquid outlet 32 and the liquid collecting tank 11 are in an inclined state, the liquid outlet 32 is convenient to quickly discharge into the liquid collecting tank 11, the liquid boron is gathered at the bottom of the liquid collecting tank 11, and the structure can also prevent the liquid outlet 32 and the liquid boron in the liquid collecting tank 11 from flowing backwards when the turntable 1 rotates.
Preferably, as shown in fig. 2 and 5, the liquid outlet 31, the liquid outlet 32 and the liquid collecting tank 11 are all in arc-shaped strip structures, so as to increase the liquid discharging area and thereby increase the liquid discharging speed.
Preferably, as shown in fig. 2, 5, 9 and 11, the side pressure plate 3 is provided with an arc groove 33 along an arc track, the liquid drain port 31 is communicated with the arc groove 33, and when boron is coated, the surface of the wafer is positioned in the height range of the arc groove 33, so that excessive boron liquid can be quickly discharged into the arc groove 33 for temporary storage, and then is discharged through the liquid drain port 31. And simultaneously, the upper and lower sections of the inner wall of the side pressure plate 3 are separated by the arc-shaped groove 33, so that boron liquid is prevented from being discharged upwards along the inner wall of the side pressure plate 3 under the action of centrifugal force, and the boron liquid is prevented from scattering.
Preferably, as shown in fig. 2, 7 and 11, a connecting block 21 is arranged on the top surface of the rear end of the slider 2, the front end of the connecting block 21 is connected with the outer wall of the side pressing plate 3 through an elastic member 22, the side pressing plate 3 is movably arranged on the slider 2 along the normal direction of the turntable 1, the impact of the side pressing plate 3 when being attached to a wafer is buffered through the elastic member 22, so that the impact force on the wafer is reduced, and the elastic member 22 is a spring.
Preferably, as shown in fig. 2 and 5, the top of the connection block 21 is provided with an upper stop block 23, and the front end of the upper stop block 23 is disposed toward the middle of the turntable 1. As shown in fig. 7, when the elastic member 22 is in a natural state, the front end surface of the upper stopper 23 is located above the side pressing plate 3 to avoid interference with loading and unloading the wafer; as shown in fig. 11, when the side pressing plate 3 presses the wafer, the front end surface of the upper stopper 23 is located above the wafer, and the front end of the upper stopper 23 forms a blocking structure above the edge of the wafer, thereby preventing the wafer from flying out.
Preferably, as shown in fig. 4, 6, 8 and 10, a ring 5 is coaxially sleeved on the circumference of the turntable 1, when the pendulum 41 swings to the outside of the turntable 1, the ring 5 is pushed to move upwards along the axis of the turntable 1 by the lower section of the pendulum 4, so that the phenomenon that the swing amplitude of part of the pendulum 4 is too large to influence the consistency of all the pendulum 4 in swinging, and then the side pressing plate 3 shifts the wafer pressing position even the end parts of the adjacent side pressing plates 3 are misplaced, the ring 5 is arranged to limit the pendulum 4, so that the swing angles of all the pendulum 4 are kept consistent, the moving rhythm and the position of the side pressing plates 3 are kept consistent, the fixing of the wafer pressing position and the alignment and the adhesion of the end parts of the adjacent side pressing plates 3 are ensured, and after the turntable 1 stops rotating, the ring 5 automatically drops under the action of self weight, at the moment, the pendulum 4 loses the centrifugal force, the ring 5 cannot be pushed upwards, and the lower section of the pendulum 4 can be quickly folded towards the middle by contacting with the lower section of the pendulum 4, so that the side pressing plate 3 can be quickly released, and the wafer 3 can be kept in a state that the wafer pressing amplitude is also reduced by the swing plate 3; more specifically, the top surface of the ring 5 is vertically provided with a plurality of guide rods 51, and the guide rods 51 are upwardly penetrated at the outer circumferential side of the turntable 1 to maintain the coaxiality of the ring 5 and the turntable 1 and to enable the ring 5 to move along the axis of the turntable 1.
Preferably, as shown in fig. 4 to 11, a T-shaped groove 14 is formed in the turntable 1 along a circumferential array, the lower section of the slider 2 is slidably disposed in the T-shaped groove 14, a triangle 6 is disposed at one end of the T-shaped groove 14 near the middle of the turntable 1, the inclined surface of the triangle 6 faces the outer side of the turntable 1, the bottom edge of the front end of the slider 2 is slidably contacted with the inclined surface of the triangle 6, and a cylindrical spring 61 is disposed between the bottom surface of the triangle 6 and the bottom of the T-shaped groove 14. As shown in fig. 5 to 7, when the side pressure plate 3 releases the wafer, the cylindrical spring 61 is in a natural extended state, and the top of the triangular plate 6 protrudes from the top surface of the turntable 1 to support the wafer, and the wafer is separated from the turntable 1 by the triangular plate 6 both when the wafer is placed and when the wafer is removed. As shown in fig. 9 to 11, when the side pressing plate 3 presses the wafer, the top surface of the triangle 6 is lower than the bottom surface of the turntable 1, so as to avoid the triangle 6 from affecting the adhesion between the wafer and the top surface of the turntable 1, and the triangle 6 and the side pressing plate 3 are synchronously controlled by the slide block 2, that is, when the slide block 2 pushes the side pressing plate 3 to press the wafer, the triangle 6 is lowered below the top surface of the turntable 1. After the slide block 2 drives the side pressing plate 3 to loosen the wafer, the triangle 6 will upwards prop up the wafer under the action of the elasticity of the cylindrical spring 61, so that the wafer is separated from the turntable 1, and the wafer is conveniently taken out.
Example 2
As shown in fig. 1, 8 and 10, a boron wafer coating apparatus includes a boron wafer coating fixture according to embodiment 1, a turntable 1 is rotatably disposed in a housing 7 to prevent a pendulum 41 from being exposed, and to prevent a safety accident, and the boron wafer coating fixture is disposed in the housing 7, so that dust-proof production is easier to be performed, and a motor 71 is disposed at the bottom of the housing 7 for driving the turntable 1 to rotate.
The foregoing description of the preferred embodiments of the invention is merely exemplary and is not intended to be exhaustive or limiting of the invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention.
Claims (10)
1. The utility model provides a wafer covers boron anchor clamps which characterized in that includes:
the top surface of the turntable (1) is used for placing a wafer (9);
the positioning assembly is provided with at least three groups along the circumferential array of the turntable (1), and comprises a sliding block (2) which is arranged in a sliding manner along the normal direction of the turntable (1), the front end of the top surface of the sliding block (2) is provided with a side pressure plate (3) with an arc structure, the height of the side pressure plate (3) is larger than the thickness of a wafer (9), the radius of the inner wall of the side pressure plate (3) is the same as the outer diameter of the wafer (9), the inner wall of the side pressure plate (3) is provided with a liquid outlet (31), when boron is coated, the inner wall of the side pressure plate (3) is attached to the outer side wall of the wafer (9), the bottom surface of the liquid outlet (31) is positioned above the bottom surface of the wafer (9), and the end parts of the side pressure plates (3) of the adjacent positioning assemblies are attached; the positioning assembly further comprises a swinging rod (4), the middle section of the swinging rod is hinged to the rotary table (1), the upper section of the swinging rod (4) is movably arranged at the rear end of the sliding block (2), and a pendulum bob (41) is arranged at the lower end of the swinging rod (4).
2. The wafer boron-coating clamp according to claim 1, wherein the top surface of the turntable (1) is provided with a liquid collecting groove (11) along the circumference, the bottom of the pressure measuring plate (3) is provided with a liquid outlet (32) communicated with the liquid outlet (31), and the liquid outlet (32) is aligned with the liquid collecting groove (11) when boron is coated.
3. A wafer boron-coated fixture according to claim 2, wherein the spacing between the upper ends of the liquid outlet (32) and the liquid collecting tank (11) and the axis of the turntable (1) is smaller than the spacing between the respective lower ends and the axis of the turntable (1).
4. The wafer boron-coated fixture of claim 2, wherein the liquid outlet (31), the liquid outlet (32) and the liquid collecting tank (11) are all arc-shaped strip structures.
5. The wafer boron-coating clamp according to claim 1, wherein the side pressure plate (3) is provided with an arc-shaped groove (33) along an arc track, the liquid outlet (31) is communicated with the arc-shaped groove (33), and the surface of the wafer is positioned in the height range of the arc-shaped groove (33) when boron is coated.
6. The wafer boron-coated fixture of claim 1, wherein a connecting block (21) is arranged on the top surface of the rear end of the sliding block (2), the connecting block (21) is connected with the side pressing plate (3) through an elastic piece (22), and the side pressing plate (3) is movably arranged on the sliding block (2) along the normal direction of the turntable (1).
7. The boron-coated wafer clamp according to claim 6, wherein an upper stopper (23) is provided at the top of the connecting block (21), the front end of the upper stopper (23) is provided toward the middle of the turntable (1), and when the elastic member (22) is in a natural state, the front end surface of the upper stopper (23) is located above the side pressing plate (3), and when the side pressing plate (3) presses the wafer, the front end surface of the upper stopper (23) is located above the wafer.
8. A wafer boron-coated fixture according to claim 1, characterized in that the circumference of the turntable (1) is coaxially sleeved with a circular ring (5), and when the pendulum bob (41) swings towards the outer side of the turntable (1), the circular ring (5) is pushed by the lower section of the pendulum rod (4) to move upwards along the axis of the turntable (1).
9. The wafer boron coating clamp according to claim 1, wherein the turntable (1) is provided with T-shaped grooves (14) along a circumferential array, the lower section of the sliding block (2) is slidably arranged in the T-shaped grooves (14), one end of the T-shaped grooves (14) close to the middle of the turntable (1) is provided with a triangular plate (6), the bottom edge of the front end of the sliding block (2) is in sliding contact with the inclined surface of the triangular plate (6), a cylindrical spring (61) is arranged between the bottom surface of the triangular plate (6) and the bottom of the T-shaped grooves (14), when the side pressing plate (3) releases a wafer, the cylindrical spring (61) is in a natural extension state, at the moment, the top of the triangular plate (6) protrudes out of the top surface of the turntable (1) and is used for supporting the wafer, and when the side pressing plate (3) presses the wafer, the top surface of the triangular plate (6) is lower than the bottom surface of the turntable (1).
10. The boron wafer coating device is characterized by comprising the boron wafer coating clamp as claimed in any one of claims 1 to 9, wherein the turntable (1) is rotatably arranged in a shell (7), and a motor (71) is arranged at the bottom of the shell (7) and used for driving the turntable (1) to rotate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310301072.9A CN116013844B (en) | 2023-03-27 | 2023-03-27 | Wafer boron coating fixture and boron coating device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310301072.9A CN116013844B (en) | 2023-03-27 | 2023-03-27 | Wafer boron coating fixture and boron coating device |
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| CN116013844A CN116013844A (en) | 2023-04-25 |
| CN116013844B true CN116013844B (en) | 2023-06-16 |
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