CN110360977B - Clamping mechanism for testing eccentricity of silicon wafer - Google Patents
Clamping mechanism for testing eccentricity of silicon wafer Download PDFInfo
- Publication number
- CN110360977B CN110360977B CN201810319582.8A CN201810319582A CN110360977B CN 110360977 B CN110360977 B CN 110360977B CN 201810319582 A CN201810319582 A CN 201810319582A CN 110360977 B CN110360977 B CN 110360977B
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- China
- Prior art keywords
- fixedly connected
- outer side
- silicon wafer
- rotating
- clamping mechanism
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/22—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring angles or tapers; for testing the alignment of axes
- G01B21/24—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring angles or tapers; for testing the alignment of axes for testing alignment of axes
Abstract
The invention discloses a clamping mechanism for silicon wafer eccentricity test, which comprises a base, wherein a supporting plate is fixedly connected to the upper surface of the front end and the rear end of the base, a threaded rod is connected to the inner side surface of the upper end of the supporting plate through threads, a placing groove is arranged on the inner side surface of the threaded rod, a rotating shaft is fixedly connected to the inner side surface of the placing groove of the threaded rod, a convex round rod is fixedly connected to the inner side surface of the rotating shaft, an extrusion block is slidably connected to the inner side surface of the convex round rod through a sliding groove, a first spring is fixedly connected to the inner side surface of the extrusion block, a silicon wafer is extruded on the inner side surface of the extrusion block, a first rotating disc is fixedly connected to the outer side surface of the threaded rod, an I-shaped cylindrical handle is fixedly connected to the outer side surface of the first rotating disc, a round, the silicon chip fixing device is convenient to fix the silicon chip, convenient to use, simple in structure and convenient to operate.
Description
Technical Field
The invention relates to the technical field of a clamping mechanism for testing eccentricity of a silicon wafer, in particular to a clamping mechanism for testing the eccentricity of the silicon wafer.
Background
The silicon chip is an important material for manufacturing an integrated circuit, various semiconductor devices can be manufactured by means of photoetching, ion injection and the like on the silicon chip, a chip made of the silicon chip has remarkable computing capability, the development of a semiconductor is continuously promoted by the development of scientific technology, the silicon chip needs to be rotated when the silicon chip is subjected to eccentric test, the silicon chip is inconvenient to fix and use in the conventional fixing and clamping mechanism for the eccentric test of the silicon chip, and the conventional clamping mechanism for the eccentric test of the silicon chip is complex in structure and high in cost and is inconvenient to operate when the silicon chip is rotated.
Disclosure of Invention
The invention aims to provide a clamping mechanism for a silicon wafer eccentricity test, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a clamping mechanism for silicon wafer eccentricity test comprises a base, wherein a supporting plate is fixedly connected to the upper surface of the front end and the rear end of the base, a threaded rod is connected to the inner side surface of the upper end of the supporting plate through threads, a placing groove is formed in the inner side surface of the threaded rod, a rotating shaft is fixedly connected to the inner side surface of the placing groove of the threaded rod, a convex round rod is fixedly connected to the inner side surface of the rotating shaft, an extrusion block is slidably connected to the inner side surface of the convex round rod through a sliding groove, a first spring is fixedly connected to the inner side surface of the extrusion block, a silicon wafer is extruded on the inner side surface of the extrusion block, a first rotary disc is fixedly connected to the outer side surface of the threaded rod, an I-shaped cylindrical handle is fixedly connected to the outer side surface of the first rotary disc, a circular tube is sleeved on, the outer surface of the rear upper end of the base is fixedly connected with a supporting block, the inner surface of the supporting block is connected with a rotating rod through threads, the lower surface of the rotating rod is fixedly connected with a rotating handle through a second rotating disc, and the upper surface of the rotating rod is rotatably connected to the outer surface of the lower end of the bearing plate through a rotating groove.
Preferably, the upper surface of the adapting plate is connected with a rotating rod through a motor in a rotating manner, the rear end outer side surface of the adapting plate is fixedly connected with a positioning sliding pipe, the inner side surface of the positioning sliding pipe is connected to the outer side surface of the positioning rod in a sliding manner, and the lower surface of the positioning rod is fixedly connected to the upper surface of the rear end of the supporting seat.
Preferably, a sleeve is connected to the outer side surface of the front end of the rotating rod in a sliding mode, and a rubber layer is attached to the outer side surface of the sleeve.
Preferably, the outer side surface of the sleeve is tightly attached to the outer side surface of the silicon chip through a rubber layer.
Preferably, the inner side surface of the sleeve is connected with a second spring and a circular chuck in a sliding mode through a limiting groove, and the outer side surface of the circular chuck is connected with the inner side surface of the upper end and the lower end of the sleeve in a sliding mode through round holes.
Preferably, the front end inner side surface of the rotating rod is provided with a cylindrical groove, the rear end outer side surface of the rotating rod is fixedly connected with a third spring through a positioning block, and the front end outer side surface of the third spring is extruded on the rear end outer side surface of the sleeve.
Preferably, the inner side surface of the supporting plate is fixedly connected with a placing ring, the inner side surface of the placing ring is slidably provided with a cylindrical bolt, and the upper surface of the cylindrical bolt is fixedly connected with a pull ring.
Preferably, the outer side surface of the cylindrical pin is slidably coupled to the inner side surface of the front end of the rotating lever through a cylindrical groove.
Preferably, the inner side surface of the convex round rod is fixedly connected with an annular rubber ring, the outer side surface of the annular rubber ring is extruded on the outer side surface of the silicon wafer, and the inner side surface of the annular rubber ring is provided with an annular round hole.
Compared with the prior art, the invention has the beneficial effects that: this eccentric test of silicon chip is with dress card mechanism, through rotating the threaded rod internal rotation and driving extrusion piece and the fixed silicon chip of annular rubber circle extrusion on the convex cylinder, drive the sleeve pipe through the motor, the accessible rubber layer drives the silicon chip rotation with the friction of silicon chip, can drive the convex cylinder rotation through the pivot, convenient fixed silicon chip, convenient to use, simple structure, convenient operation.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a side view of the overall structure of the present invention;
FIG. 3 is an enlarged view of the invention at A;
FIG. 4 is an enlarged view of the invention at B;
FIG. 5 is a side sectional view of a partial structure of the annular rubber ring of the present invention.
1 base, 2 threaded rods, 3 placing grooves, 4 rotating shafts, 5 convex round rods, 6 sliding grooves, 7 first springs, 8 extrusion blocks, 9 silicon chips, 10 first rotating discs, 11I-shaped cylindrical handles, 12 round tubes, 13 supporting seats, 14 supporting blocks, 15 rotating rods, 16 second rotating discs, 17 rotating handles, 18 rotating grooves, 19 bearing plates, 20 motors, 21 rotating rods, 22 positioning rods, 23 positioning sliding tubes, 24 sleeves, 25 rubber layers, 26 limiting grooves, 27 second springs, 28 circular clamping heads, 29 round holes, 30 cylindrical grooves, 31 positioning blocks, 32 third springs, 33 placing rings, 34 cylindrical inserting pins, 35 pull rings, 36 annular rubber rings, 37 annular round holes and 38 supporting plates.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description of the present invention, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a clamping mechanism for silicon wafer eccentricity test comprises a base 1, wherein a supporting plate 38 is fixedly connected to the upper surface of the front end and the rear end of the base 1, a threaded rod 2 is connected to the inner side surface of the upper end of the supporting plate 38 through threads, a placing groove 3 is arranged on the inner side surface of the threaded rod 2, a rotating shaft 4 is fixedly connected to the inner side surface of the placing groove 3 of the threaded rod 2, a convex round rod 5 is fixedly connected to the inner side surface of the rotating shaft 4, an annular rubber ring 36 is fixedly connected to the inner side surface of the convex round rod 5, the outer side surface of the annular rubber ring 36 is extruded on the outer side surface of a silicon wafer 9, an annular round hole 37 is arranged on the inner side surface of the annular rubber ring 36, an extruding block 8 is slidably connected to the inner side surface of the convex round rod 5 through a sliding groove 6, a first spring 7 is fixedly connected to the inner, the outer side surface of the first rotating disk 10 is fixedly connected with an I-shaped cylindrical handle 11, the outer side surface of the I-shaped cylindrical handle 11 is rotatably sleeved with a round tube 12, in order to drive the first rotating disk 10 and a threaded rod 2 to rotate inwards by grabbing the round tube 12 when fixing a silicon wafer 9, the silicon wafer 9 is extruded and fixed by a first spring 7 through an extrusion block 8, the silicon wafer 9 is secondarily extruded and fixed through an annular rubber ring 36, because the inner side of the annular rubber ring 36 is provided with an annular round hole 37, deformation can be generated during extrusion, the silicon wafer 9 can be firmly clamped through the elasticity of rubber, the fixing is convenient, the outer side surface of the rear lower end of the base 1 is fixedly connected with a supporting seat 13, the outer side surface of the rear upper end of the base 1 is fixedly connected with a supporting block 14, the inner side surface of the supporting block 14 is connected with a rotating rod 15 through threads, the lower surface of, the upper surface of the rotating rod 15 is rotatably connected to the lower end outer side surface of the bearing plate 19 through the rotating groove 18, the upper surface of the bearing plate 19 is rotatably connected with a rotating rod 21 through a motor 20, the model of the motor 20 is Y100L-2, the motor is connected to a power switch through a series circuit, the rear end outer side surface of the bearing plate 19 is fixedly connected with a positioning slide pipe 23, the inner side surface of the positioning slide pipe 23 is slidably connected to the outer side surface of the positioning rod 22, the lower surface of the positioning rod 22 is fixedly connected to the rear end upper surface of the supporting seat 13, the front end outer side surface of the rotating rod 21 is slidably connected with a sleeve pipe 24, the outer side surface of the sleeve pipe 24 is attached with a rubber layer 25, the outer side surface of the sleeve pipe 24 is closely attached to the outer side surface of the silicon chip 9 through the rubber layer 25, in order that when in use, the rotating handle 17 drives the second rotating disk 16 and the rotating, the bearing plate 19 is positioned, the outer side surface of the sleeve 24 is tightly attached to the outer side surface of the lower end of the silicon chip 9 through the rubber layer 25, the rotating rod 21 is driven to rotate through the motor 20, the sleeve 24 is driven to rotate, the silicon chip 9 can be driven to rotate, the convex round rod 5 can be driven to rotate under the condition of extruding and fixing the silicon chip 9 through the rotating shaft 4, the inner side surface of the sleeve 24 is connected with the second spring 27 and the round chuck 28 in a sliding mode through the limiting groove 26, the outer side surface of the round chuck 28 is connected to the inner side surfaces of the upper end and the lower end of the sleeve 24 in a sliding mode through the round hole 29, the inner side surface of the front end of the rotating rod 21 is provided with the cylindrical groove 30, the outer side surface of the rear end of the rotating rod 21 is fixedly connected with the third spring 32 through the positioning block 31, the outer side surface of, place the inboard surface slip of ring 33 and placed cylindrical bolt 34, the last fixed surface of cylindrical bolt 34 is connected with pull ring 35, the outside surface of cylindrical bolt 34 passes through cylinder groove 30 sliding connection at the front end inboard surface of dwang 21, this is for when dismantling sleeve pipe 24, cylindrical bolt 34 is taken off to accessible pull ring 35, insert the inboard surface of dwang 21 through cylinder groove 30, extrude circular dop 28 through cylinder groove 30 and break away from behind the round hole 29, third spring 32 extrudes sleeve pipe 24 at this moment and plays, convenient dismantlement, during the installation, through following the outside surface slip back of dwang 21 with sleeve pipe 24, cylindrical bolt 34 is taken off, second spring 27 plays circular dop 28 card down and fixes once more in the round hole 29, because third spring 32 extrudes sleeve pipe 24, can make circular dop 28 close inseparabler.
The invention is implemented as follows: when fixing the silicon chip 9, the round tube 12 is grasped to drive the first rotary disc 10 and the threaded rod 2 to rotate inwards, the silicon chip 9 is extruded and fixed by the first spring 7 through the extrusion block 8, the silicon chip 9 is extruded and fixed at a second time through the annular rubber ring 36, the annular round hole 37 is arranged on the inner side of the annular rubber ring 36, deformation is generated during extrusion, the silicon chip 9 can be firmly clamped through the elasticity of rubber, and the fixing is convenient, when in use, the second rotary disc 16 and the rotating rod 15 are driven to rotate upwards through the rotating handle 17, the bearing plate 19 can be driven to move upwards, the positioning sliding tube 23 slides on the positioning rod 22 at the moment, the positioning effect on the bearing plate 19 is achieved, the outer side surface of the sleeve 24 is clung to the outer side surface of the lower end of the silicon chip 9 through the rubber layer 25, the rotating rod 21 is driven to rotate through the motor 20, the sleeve 24 is driven to rotate, the silicon chip 9 can be driven to rotate, the convex round rod 5 can, when dismantling sleeve pipe 24, cylindrical bolt 34 can be taken off to accessible pull ring 35, insert the inside surface of dwang 21 through cylinder groove 30, break away from round hole 29 back through cylinder groove 30 extrusion circular dop 28, third spring 32 pushes away sleeve pipe 24 at this moment and plays, convenient dismantlement, during the installation, through with sleeve pipe 24 along dwang 21 outside surface cunning back, cylindrical bolt 34 is taken off, second spring 27 plays circular dop 28 card down and fixes once more in going into round hole 29, because third spring 32 pushes away sleeve pipe 24, can make circular dop 28 close inseparabler.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a dress card mechanism is used in eccentric test of silicon chip, includes base (1), its characterized in that: the upper surface of the front end and the rear end of the base (1) is fixedly connected with a supporting plate (38), the inner side surface of the upper end of the supporting plate (38) is connected with a threaded rod (2) through threads, the inner side surface of the threaded rod (2) is provided with a placing groove (3), the inner side surface of the placing groove (3) of the threaded rod (2) is fixedly connected with a rotating shaft (4), the inner side surface of the rotating shaft (4) is fixedly connected with a convex round rod (5), the inner side surface of the convex round rod (5) is slidably connected with an extrusion block (8) through a sliding groove (6), the inner side surface of the extrusion block (8) is fixedly connected with a first spring (7), the inner side surface of the extrusion block (8) is extruded with a silicon wafer (9), the outer side surface of the threaded rod (2) is fixedly connected with a first turntable (10), the outer side surface of the first turntable, a circular tube (12) is rotatably sleeved on the outer side surface of the I-shaped cylindrical handle (11), a supporting seat (13) is fixedly connected to the outer side surface of the rear lower end of the base (1), a supporting block (14) is fixedly connected to the outer side surface of the rear upper end of the base (1), a rotating rod (15) is connected to the inner side surface of the supporting block (14) through threads, a rotating handle (17) is fixedly connected to the lower surface of the rotating rod (15) through a second rotating disk (16), and the upper surface of the rotating rod (15) is rotatably connected to the outer side surface of the lower end of the bearing plate (19) through a rotating groove (18);
the upper surface of accepting board (19) rotates through motor (20) and is connected with dwang (21), the rear end outside fixed surface of accepting board (19) is connected with location slide tube (23), the inboard surface sliding connection of location slide tube (23) is on the outside surface of locating lever (22), the lower fixed surface of locating lever (22) is connected at the rear end upper surface of supporting seat (13).
2. The clamping mechanism for the eccentricity test of the silicon wafer according to claim 1, which is characterized in that: the surface sliding connection has sleeve pipe (24) in the front end outside of dwang (21), the outside surface of sleeve pipe (24) is attached with rubber layer (25).
3. The clamping mechanism for the eccentricity test of the silicon wafer according to claim 2, wherein: the outer side surface of the sleeve (24) is tightly attached to the outer side surface of the silicon chip (9) through a rubber layer (25).
4. The clamping mechanism for the eccentricity test of the silicon wafer according to claim 2, wherein: the inner side surface of the sleeve (24) is connected with a second spring (27) and a circular clamping head (28) through a limiting groove (26) in a sliding mode, and the outer side surface of the circular clamping head (28) is connected to the inner side surface of the upper end and the lower end of the sleeve (24) through a round hole (29) in a sliding mode.
5. The clamping mechanism for the eccentricity test of the silicon wafer according to claim 2, wherein: the front end inside surface of dwang (21) is equipped with cylinder groove (30), the rear end outside surface of dwang (21) passes through locating piece (31) fixedly connected with third spring (32), the front end outside surface extrusion of third spring (32) is at the rear end outside surface of sleeve pipe (24).
6. The clamping mechanism for the eccentricity test of the silicon wafer according to claim 1, which is characterized in that: the inner side surface of the supporting plate (38) is fixedly connected with a placing ring (33), the inner side surface of the placing ring (33) is slidably placed with a cylindrical bolt (34), and the upper surface of the cylindrical bolt (34) is fixedly connected with a pull ring (35).
7. The clamping mechanism for the eccentricity test of the silicon wafer according to claim 6, wherein: the outer side surface of the cylindrical plug pin (34) is slidably connected to the inner side surface of the front end of the rotating rod (21) through a cylindrical groove (30).
8. The clamping mechanism for the eccentricity test of the silicon wafer according to claim 1, which is characterized in that: the inner side surface of the convex round rod (5) is fixedly connected with an annular rubber ring (36), the outer side surface of the annular rubber ring (36) is extruded on the outer side surface of the silicon wafer (9), and an annular round hole (37) is formed in the inner side surface of the annular rubber ring (36).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810319582.8A CN110360977B (en) | 2018-04-11 | 2018-04-11 | Clamping mechanism for testing eccentricity of silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810319582.8A CN110360977B (en) | 2018-04-11 | 2018-04-11 | Clamping mechanism for testing eccentricity of silicon wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110360977A CN110360977A (en) | 2019-10-22 |
| CN110360977B true CN110360977B (en) | 2021-01-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810319582.8A Expired - Fee Related CN110360977B (en) | 2018-04-11 | 2018-04-11 | Clamping mechanism for testing eccentricity of silicon wafer |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112387220A (en) * | 2020-11-10 | 2021-02-23 | 河北乐开节能科技股份有限公司 | Self-suction type circulating low-pressure hydrogenation device for hydrogenation kettle |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101008575A (en) * | 2006-01-25 | 2007-08-01 | 刘海英 | Over-limit measuring instrument and method of railway transportation equipment |
| CN102818750A (en) * | 2012-07-31 | 2012-12-12 | 中国石油天然气股份有限公司 | Device for determining dilational viscoelasticity of liquid film |
| CN105387803A (en) * | 2015-10-22 | 2016-03-09 | 芜湖豫新世通汽车空调有限公司 | Multi-angle positioning detection tool |
| DE102015114213B4 (en) * | 2015-08-27 | 2017-06-22 | Jenoptik Industrial Metrology Germany Gmbh | Arrangement for clamping a rotatable workpiece |
| CN206982354U (en) * | 2017-05-18 | 2018-02-09 | 谢园园 | A kind of automobile rearview mirror edging device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103234466B (en) * | 2013-03-30 | 2015-12-23 | 大连海事大学 | A kind of oil film thickness measurement mechanism |
-
2018
- 2018-04-11 CN CN201810319582.8A patent/CN110360977B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101008575A (en) * | 2006-01-25 | 2007-08-01 | 刘海英 | Over-limit measuring instrument and method of railway transportation equipment |
| CN102818750A (en) * | 2012-07-31 | 2012-12-12 | 中国石油天然气股份有限公司 | Device for determining dilational viscoelasticity of liquid film |
| DE102015114213B4 (en) * | 2015-08-27 | 2017-06-22 | Jenoptik Industrial Metrology Germany Gmbh | Arrangement for clamping a rotatable workpiece |
| CN105387803A (en) * | 2015-10-22 | 2016-03-09 | 芜湖豫新世通汽车空调有限公司 | Multi-angle positioning detection tool |
| CN206982354U (en) * | 2017-05-18 | 2018-02-09 | 谢园园 | A kind of automobile rearview mirror edging device |
Non-Patent Citations (3)
| Title |
|---|
| Micro-clamps for precise positioning of 120° silicon double mirrors in a MOEMS gyroscope;Thalke Niesel;《Microelectronic Engineering》;20161230;全文 * |
| 一种新型制造抛物面玻璃方法的研究;邢玉龙;《机械工程师》;20171230;全文 * |
| 化学机械抛光中背垫对硅片表面接触压强分布及宏观表面形貌的影响;吕玉山;《兵工学报》;20081230;全文 * |
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Granted publication date: 20210119 |