CN116008763A - Test seat for semiconductor device - Google Patents

Test seat for semiconductor device Download PDF

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Publication number
CN116008763A
CN116008763A CN202211610157.7A CN202211610157A CN116008763A CN 116008763 A CN116008763 A CN 116008763A CN 202211610157 A CN202211610157 A CN 202211610157A CN 116008763 A CN116008763 A CN 116008763A
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CN
China
Prior art keywords
groove
piston
wall
test
fixedly connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211610157.7A
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Chinese (zh)
Inventor
李维繁星
沈红星
王悦
李北印
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongrun Semiconductor Suzhou Co ltd
Original Assignee
Hongrun Semiconductor Suzhou Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongrun Semiconductor Suzhou Co ltd filed Critical Hongrun Semiconductor Suzhou Co ltd
Priority to CN202211610157.7A priority Critical patent/CN116008763A/en
Publication of CN116008763A publication Critical patent/CN116008763A/en
Pending legal-status Critical Current

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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention relates to the technical field of semiconductor device testing, and provides a test seat for a semiconductor device, which comprises a test seat body, wherein a rotating groove is horizontally and penetratingly arranged above one side of the test seat body, piston grooves are symmetrically arranged at the top end and the bottom end of the rotating groove, a first mounting groove is arranged above the other side of the test seat body, an inflator pump is fixedly connected to the inner wall of the bottom end of the first mounting groove through bolts, an air outlet pipe of the inflator pump is communicated with two groups of inflation pipes through a three-way joint, an air outlet end of each inflation pipe is communicated with the piston groove, a piston is connected inside the piston groove in a sliding mode, and a filter screen is fixedly connected to the outer side of the first mounting groove through bolts. Through the technical scheme, the problems that dust is adhered to the surface of the contact of the semiconductor device, the testing precision is affected and the relative position of the contact of the semiconductor device and the contact of the test board is inconvenient to adjust in the prior art are solved.

Description

Test seat for semiconductor device
Technical Field
The invention relates to the technical field of semiconductor device testing, in particular to a test seat for a semiconductor device.
Background
Various performance tests are required in the large-scale research and development and production processes of semiconductor chips, chip test seats are key components in the test, and the function of the test seats is to achieve the test effect by means of electronic signal current transmission among lines after the chips are positioned, and the quality and the matching degree of the test seats directly influence the test judgment accuracy.
The searched publication number is CN111707920A, discloses a test seat for a ceramic embedded positioning type semiconductor device, which comprises a base; the switching support is arranged on the base; a supporting block, an integrated test piece, a main body and a limiting cover plate are sequentially arranged above the switching support from bottom to top; a ceramic positioning component is embedded in the main body and used for limiting the chip; a chip is arranged in the ceramic positioning component; a through hole for accommodating the chip to pass through is formed in the limit cover plate; wherein the integrated test piece comprises symmetrically arranged test piece mechanisms; the test piece mechanism comprises a first pressing plate, a second pressing plate and a third pressing plate which are sequentially connected up and down, and four first test pieces are arranged between the first pressing plate and the second pressing plate.
In the process of realizing the invention, the inventor finds that at least the following problems in the prior art are not solved, 1, dust is adhered to the surface of the contact of the semiconductor device to influence the bonding effect with the pins of the test board, 2, the relative positions of the contact of the semiconductor device and the pins of the test board are inconvenient to adjust by staff, 3, the staff needs to detach the tested semiconductor device immediately after testing the semiconductor device, and then another group of semiconductor devices are installed, so that the working efficiency is low.
Disclosure of Invention
The invention provides a test seat for a semiconductor device, which solves the problem of the test seat for the semiconductor device in the related technology.
The technical scheme of the invention is as follows:
the test seat for the semiconductor device comprises a test seat body, wherein a rotating groove is horizontally and penetratingly arranged above one side of the test seat body, a piston groove is symmetrically arranged at the top end and the bottom end of the rotating groove, a first mounting groove is arranged above the other side of the test seat body, an inflator pump is fixedly connected to the inner wall of the bottom end of the first mounting groove through bolts, an air outlet pipe of the inflator pump is communicated with two groups of inflation pipes through three-way connectors, the air outlet end of the inflation pipe is communicated with the piston groove, a piston is slidingly connected inside the piston groove, a filter screen is fixedly connected to the outer side of the first mounting groove through bolts, a connecting groove is vertically and penetratingly arranged on the inner wall of the piston groove close to one side of the rotating groove, a connecting rod is vertically and fixedly arranged in the middle of the piston close to one side of the rotating groove, the other end of the connecting rod penetrates through the connecting groove and is fixedly connected with the middle of one side of the test plate, the other side of the test board is fixedly connected with a pin, one side of the piston provided with a connecting rod is provided with a first spring, the inner wall of one side of the piston groove away from the test board is penetrated and communicated with an exhaust pipe, the inside of the exhaust pipe is provided with an electromagnetic valve, one side of the rotating groove is vertically provided with a through groove, the inner wall of one side of the through groove is horizontally penetrated and is provided with an exhaust hole, the through groove is communicated with the rotating groove through the exhaust hole, the inner wall of one side of the piston groove is horizontally penetrated and is provided with an air inlet groove, the inner wall of the other side of the piston groove is provided with an air outlet groove, the inner side of the rotating groove is rotationally connected with a turntable, the outer side of the turntable is provided with a fixed groove, the inner walls of two sides of the fixed groove are symmetrically provided with sliding grooves, the sliding grooves are internally and slidably connected with sliding blocks, the middle part of the sliding blocks, which are close to one side of the fixed groove, is horizontally and fixedly provided with a push rod, the push rod penetrates through the sliding groove and is fixedly connected with the middle part of one side of the clamping block, two groups of second springs are arranged on the other side of the sliding block, and a clamping groove is formed in the middle part of the other side of the clamping block.
The middle part of test seat body upper surface one side has been seted up the second mounting groove, the bottom inner wall of second mounting groove passes through bolt fixedly connected with driving motor, driving motor's motor shaft fixedly connected with dwang, the top of dwang and the middle part fixed connection of carousel downside, control driving motor work can drive the carousel through the dwang and rotate, conveniently drives the semiconductor device in the fixed slot and rotate to the rotation inslot and detect the operation.
The upper surface of carousel passes through screw fixedly connected with infrared emitter, infrared emitter and fixed slot one-to-one, the top inner wall of rotating the groove passes through screw fixedly connected with infrared receiver, infrared receiver is vertical parallel and level with infrared emitter, infrared emitter's signal output part is connected with infrared receiver's signal input part, and the carousel rotates the in-process, can drive the infrared emitter corresponding with the fixed slot and rotate, and when infrared emitter rotated to infrared receiver under, infrared receiver can receive the signal that infrared emitter sent, further industrial computer can automatic drive motor stop work to fix a position the semiconductor device on the carousel voluntarily, degree of automation is high.
The end of giving vent to anger of air tank and logical groove intercommunication, the inside intercommunication of air inlet tank and air tank has the check valve, through installing the check valve, can avoid the air reflux in air inlet tank and the air tank of giving vent to anger, can impress the air in the piston tank to logical inslot, discharge through the exhaust hole, can effectively clear up the dust in the fixed inslot semiconductor device outside.
The inner wall fixedly connected with stopper in piston groove one side, the stopper is arranged in between air inlet tank and the piston, can carry out spacingly to the piston through installing the stopper, further carries out spacingly to the test board, avoids the test board too big to the extrusion dynamics of semiconductor device, causes the pin to warp.
The sealing ring is bonded on the outer side of the piston, the sealing ring is bonded with the inner wall of the piston groove, the sealing sleeve is bonded on the inner wall of the connecting groove, and the sealing sleeve is bonded with the outer side of the connecting rod, so that the sealing performance of the piston groove can be improved through the sealing ring and the sealing sleeve.
The quantity of fixed slot is four groups, four groups the fixed slot evenly arranges the outside of carousel in, fixed slot and test plate size match, and the connecting rod can promote the test plate to insert to in the fixed slot to detect the operation to the semiconductor device in the fixed slot.
The middle part demountable installation of test seat body front side has the containing box, the middle part vertical fixed mounting of containing box bottom inner wall has the baffle, conveniently accomodates semiconductor device.
The first spring is sleeved outside the connecting rod, guide grooves are horizontally and fixedly arranged on the front side and the rear side of the sliding block, guide rods are fixedly arranged on the front side and the rear side of the inside of the sliding groove, the guide grooves are in sliding connection with the guide rods, the second spring is sleeved outside the guide rods, the connecting rod and the guide rods can limit the first spring and the second spring, and the use stability of the first spring and the second spring is improved.
One side of the upper surface of the test seat body is fixedly connected with an industrial computer through a screw, the data output end of the infrared receiver is connected with the data input end of the industrial computer, and the signal output end of the industrial computer is connected with the signal input ends of the inflator pump, the electromagnetic valve and the driving motor.
The working principle and the beneficial effects of the invention are as follows:
1. according to the invention, the semiconductor device in the fixed groove can be clamped by pushing the two groups of clamping blocks through the elasticity of the second spring, the inflator pump is controlled to work, the inflation tube can inflate the piston groove, the two groups of pistons can be pushed to move relatively, the two groups of test boards can be pushed to move relatively through the connecting rod, the pins are attached to the contacts on the outer side of the semiconductor device, further test operation is carried out, in the process of pushing the test boards by the pistons, air in the piston groove can be pressed into the through groove through the air outlet groove, and discharged through the air outlet hole, so that dust on the outer side of the semiconductor device in the fixed groove can be automatically cleaned, the dust is prevented from adhering to the contact surface on the outer side of the semiconductor device, and the test precision is prevented from being influenced.
2. According to the invention, the driving motor is controlled to work, the rotating rod can drive the turntable to rotate, so that the semiconductor device in the fixed groove is driven to rotate into the rotating groove for detection operation, when the infrared transmitter rotates to the position right below the infrared receiver, the infrared receiver can receive signals sent by the infrared transmitter, and the industrial control computer can further automatically drive the motor to stop working, so that the semiconductor device on the turntable is automatically positioned, the degree of automation is high, the contact on the outer side of the semiconductor device and pins on the surface of the test board are prevented from being deviated, the test precision is influenced, and in the process of testing the semiconductor device in the fixed groove, the semiconductor device to be tested can be fixed in another group of fixed grooves, and the test efficiency of the semiconductor device can be improved.
Drawings
The invention will be described in further detail with reference to the drawings and the detailed description.
FIG. 1 is a front view of the present invention;
FIG. 2 is a schematic diagram of the structure of the present invention;
FIG. 3 is a top view of the turntable of the present invention;
FIG. 4 is a schematic view of the structure of the portion A of the present invention;
FIG. 5 is a schematic view of a clamp block according to the present invention.
In the figure: 1. a test seat body; 10. a rotating groove; 11. a piston groove; 12. a first mounting groove; 13. an inflator pump; 14. an air outlet pipe; 15. an inflation tube; 16. a piston; 17. a seal ring; 18. a filter screen; 2. a connecting groove; 21. a connecting rod; 22. a test board; 23. pins; 24. a first spring; 25. a limiting block; 26. an exhaust pipe; 27. an electromagnetic valve; 3. a through groove; 31. an exhaust hole; 32. an air inlet groove; 33. an air outlet groove; 34. a one-way valve; 35. sealing sleeve; 4. a turntable; 41. a fixing groove; 42. a chute; 43. a slide block; 44. a push rod; 45. clamping blocks; 46. a second spring; 47. a guide groove; 48. a guide rod; 49. a clamping groove; 5. a second mounting groove; 51. a driving motor; 52. a rotating lever; 53. an infrared emitter; 54. an infrared receiver; 55. an industrial control computer; 6. a storage box; 61. a partition board.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
As shown in fig. 1 to 5, the embodiment provides a test seat for a semiconductor device, which comprises a test seat body 1, a rotating groove 10 is horizontally penetrated and arranged above one side of the test seat body 1, a piston groove 11 is symmetrically arranged at the top end and the bottom end of the rotating groove 10, a first mounting groove 12 is arranged above the other side of the test seat body 1, an inflator 13 is fixedly connected with the inner wall of the bottom end of the first mounting groove 12 through bolts, an air outlet pipe 14 of the inflator 13 is communicated with two groups of inflation pipes 15 through a three-way joint, the air outlet end of the inflation pipe 15 is communicated with the piston groove 11, a piston 16 is slidingly connected with the inside of the piston groove 11, a sealing ring 17 is adhered to the outer side of the piston 16, the sealing ring 17 is attached to the inner wall of the piston groove 11, a filter screen 18 is fixedly connected with the outer side of the first mounting groove 12 through bolts, a connecting groove 2 is vertically penetrated and arranged on the inner wall of one side of the piston groove 11 close to the rotating groove 10, the middle part of one side of the piston 16, which is close to the rotating groove 10, is vertically and fixedly provided with a connecting rod 21, the other end of the connecting rod 21 penetrates through the connecting groove 2 and is fixedly connected with the middle part of one side of the test plate 22, the other side of the test plate 22 is fixedly connected with a pin 23, one side of the piston 16, which is provided with the connecting rod 21, is provided with a first spring 24, the outer side of the connecting rod 21 is sleeved with the first spring 24, the inner wall of one side of the piston groove 11 is fixedly connected with a limiting block 25, the inner wall of one side of the piston groove 11, which is far away from the test plate 22, is communicated with an exhaust pipe 26 in a penetrating way, an electromagnetic valve 27 is arranged in the exhaust pipe 26, one side of the rotating groove 10 is vertically provided with a through groove 3, the inner wall of one side of the through groove 3 is horizontally penetrated and provided with an exhaust hole 31, the through groove 3 is communicated with the rotating groove 10 through the exhaust hole 31, the inner wall of one side of the piston groove 11 is horizontally penetrated and provided with an air inlet groove 32, the end of giving vent to anger of air tank 33 communicates with logical groove 3, the inside intercommunication of air inlet tank 32 and air outlet tank 33 has check valve 34, the inner wall bonding of spread groove 2 has seal cover 35, seal cover 35 is laminated with the outside of connecting rod 21, the inboard rotation of rotary tank 10 is connected with carousel 4, fixed slot 41 has been seted up in the outside of carousel 4, the quantity of fixed slot 41 is four groups, the outside of carousel 4 is evenly arranged in to four groups of fixed slots 41, spout 42 has been seted up to the inner wall symmetry of fixed slot 41 both sides, the inside sliding connection of spout 42 has slider 43, slider 43 is close to the middle part horizontal fixed mounting of fixed slot 41 one side has push rod 44, push rod 44 runs through spout 42 and is fixedly connected with the middle part of one side of clamp block 45, slider 43's opposite side is provided with two sets of second springs 46, the front and back both sides of slider 43 all horizontally run through and have seted up guide slot 47, guide slot 47 and 48 sliding connection are all set up in the outside of guide slot 48, second spring 46 cover is located in the outside of guide slot 48, second spring 46 and the size of guide slot 47 cooperate with guide slot 47, clamp block 45 opposite side's middle part has been seted up clamp slot 49.
In this embodiment, the two sets of sliders 43 can be pushed to move in the sliding groove 42 by the elastic force of the second spring 46, the two sets of clamping blocks 45 can be pushed to move relatively in the fixed groove 41 by the push rod 44, so that the semiconductor device is horizontally fixed in the fixed groove 41, the inflator 13 is controlled to work, the two sets of pistons 16 can be pushed to move relatively in the two sets of piston grooves 11 by inflating the air inflation pipe 15 communicated with the air outlet pipe 14, the two sets of test boards 22 can be pushed to move relatively by the connecting rod 21, the pins 23 are attached to contacts on two sides of the semiconductor device, further test operation is performed, in the process of pushing the test boards 22 by the pistons 16, air in the piston grooves 11 can be pushed into the through groove 3 by the push rod 44, dust outside the semiconductor device in the fixed groove 41 can be cleaned automatically by the air outlet groove 33, after the semiconductor device is tested, the electromagnetic valve 27 is controlled to be opened, compressed air in the piston grooves 11 can be discharged by the exhaust pipe 26, the two sets of pistons 16 can be pushed to move relatively by the elastic force of the first spring 24, the two sets of pistons 16 can be pulled to move relatively to the two sets of pistons 22 and the air can be further pulled to be separated from the air inlet grooves 11 by the air outlet holes 31 to the outside, and the air can be separated from the semiconductor device 11.
Example 2
As shown in fig. 1 to 3, based on the same concept as that of the above embodiment 1, this embodiment further proposes that a second installation groove 5 is provided in the middle of one side of the upper surface of the test seat body 1, the bottom inner wall of the second installation groove 5 is fixedly connected with a driving motor 51 through a bolt, a motor shaft of the driving motor 51 is fixedly connected with a rotating rod 52, the top end of the rotating rod 52 is fixedly connected with the middle of the bottom side of the turntable 4, the upper surface of the turntable 4 is fixedly connected with an infrared emitter 53 through a screw, the infrared emitters 53 are in one-to-one correspondence with the fixing grooves 41, the top inner wall of the rotating groove 10 is fixedly connected with an infrared receiver 54 through a screw, the infrared receiver 54 is vertically flush with the infrared emitter 53, the signal output end of the infrared emitter 53 is connected with the signal input end of the infrared receiver 54, one side of the upper surface of the test seat body 1 is fixedly connected with an industrial control computer 55 through a screw, the middle of the front side of the test seat body 1 is detachably mounted with a storage box 6, and the middle of the bottom inner wall of the storage box 6 is vertically and fixedly mounted with a partition 61.
In this embodiment, the driving motor 51 is controlled to work, the rotating rod 52 can drive the turntable 4 to rotate, so as to drive the semiconductor device in the fixed slot 41 to rotate into the rotating slot 10 for detection, in the rotating process of the turntable 4, the infrared emitter 53 corresponding to the fixed slot 41 can be driven to rotate, when the infrared emitter 53 rotates to the position right below the infrared receiver 54, the infrared receiver 54 can receive the signal sent by the infrared emitter 53, the industrial personal computer 55 can further automatically drive the motor 51 to stop working, thereby automatically positioning the semiconductor device on the turntable 4, the degree of automation is high, in the testing process of the semiconductor device in the fixed slot 41, the semiconductor device to be tested can be fixed in another group of fixed slots 41, and the testing efficiency of the semiconductor device can be improved.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.

Claims (10)

1. The utility model provides a test seat for semiconductor device, its characterized in that includes test seat body (1), rotary groove (10) have been seted up in the top level of test seat body (1) one side run through, piston groove (11) have been seted up to the top and the bottom symmetry of rotary groove (10), first mounting groove (12) have been seted up to the top of test seat body (1) opposite side, the bottom inner wall of first mounting groove (12) is through bolt fixedly connected with inflator pump (13), outlet duct (14) of inflator pump (13) are through tee bend joint and two sets of inflation tube (15) intercommunication, the end of giving vent to anger of inflation tube (15) communicates with piston groove (11), the inside sliding connection of piston groove (11) has piston (16), the outside of first mounting groove (12) is through screw fixedly connected with filter screen (18), the vertical running through of inner wall of piston groove (11) near rotary groove (10) one side has been seted up spread groove (2), the vertical fixed mounting in middle part of connecting rod (21) that piston (16) is close to one side of rotary groove (10), the other end (21) is connected with connecting rod (22) and is connected with pin (23) fixedly connected with test plate (22) in the middle part of another side, the utility model discloses a push rod device, including piston (16), connecting rod (21) and fixed slot (41), piston groove (11) are kept away from the inner wall of test board (22) one side and are run through the intercommunication and have blast pipe (26), the inside of blast pipe (26) is provided with solenoid valve (27), open groove (3) have been vertically seted up to one side of rotary slot (10), vent hole (31) have been seted up in the inner wall level of open groove (3) one side run through, vent hole (31) and rotary slot (10) intercommunication are run through to open groove (3), air inlet groove (32) have been run through to the inner wall level of piston groove (11) one side, air outlet groove (33) have been seted up to the inner wall of piston groove (11) opposite side, the inboard rotation of rotary slot (10) is connected with carousel (4), fixed slot (41) have been seted up in the outside of carousel (4), spout (42) have been seted up to the inner wall symmetry of fixed slot (41) both sides, the inside sliding connection of spout (42) has slider (43), slider (43) are close to the horizontal clamp block (44) of fixed slot (41) one side and are installed in advance groove (45) one side and are connected with two push rod sets of push rod (46), a clamping groove (49) is formed in the middle of the other side of the clamping block (45).
2. The test socket for semiconductor devices according to claim 1, wherein a second mounting groove (5) is formed in the middle of one side of the upper surface of the test socket body (1), a driving motor (51) is fixedly connected to the inner wall of the bottom end of the second mounting groove (5) through a bolt, a rotating rod (52) is fixedly connected to a motor shaft of the driving motor (51), and the top end of the rotating rod (52) is fixedly connected with the middle of the bottom side of the turntable (4).
3. The test socket for semiconductor devices according to claim 1, wherein an infrared emitter (53) is fixedly connected to the upper surface of the turntable (4) through a screw, the infrared emitters (53) are in one-to-one correspondence with the fixing grooves (41), an infrared receiver (54) is fixedly connected to the inner wall of the top end of the rotating groove (10) through a screw, the infrared receiver (54) is vertically flush with the infrared emitter (53), and a signal output end of the infrared emitter (53) is connected with a signal input end of the infrared receiver (54).
4. The test socket for a semiconductor device according to claim 1, wherein an air outlet end of the air outlet groove (33) communicates with the through groove (3), and the air inlet groove (32) and the air outlet groove (33) communicate with each other with a check valve (34).
5. The test socket for semiconductor devices according to claim 1, wherein a stopper (25) is fixedly connected to an inner wall of one side of the piston groove (11), and the stopper (25) is interposed between the air intake groove (32) and the piston (16).
6. The test socket for semiconductor devices according to claim 1, wherein a sealing ring (17) is bonded to the outer side of the piston (16), the sealing ring (17) is bonded to the inner wall of the piston groove (11), a sealing sleeve (35) is bonded to the inner wall of the connecting groove (2), and the sealing sleeve (35) is bonded to the outer side of the connecting rod (21).
7. The test socket for semiconductor devices according to claim 1, wherein the number of the fixing grooves (41) is four, the four fixing grooves (41) are uniformly arranged on the outer side of the turntable (4), and the fixing grooves (41) are matched with the size of the test board (22).
8. The test socket for semiconductor devices according to claim 1, wherein the middle part of the front side of the test socket body (1) is detachably provided with a storage box (6), and the middle part of the inner wall of the bottom end of the storage box (6) is vertically and fixedly provided with a partition plate (61).
9. The test socket for semiconductor devices according to claim 1, wherein the first spring (24) is sleeved outside the connecting rod (21), guide grooves (47) are horizontally and penetratingly formed in the front side and the rear side of the slider (43), guide rods (48) are horizontally and fixedly mounted in the front side and the rear side of the inside of the sliding groove (42), and the guide grooves (47) are slidably connected with the guide rods (48), and the second spring (46) is sleeved outside the guide rods (48).
10. The test socket for semiconductor devices according to claim 1, wherein one side of the upper surface of the test socket body (1) is fixedly connected with an industrial personal computer (55) through a screw, a data output end of the infrared receiver (54) is connected with a data input end of the industrial personal computer (55), and a signal output end of the industrial personal computer (55) is connected with signal input ends of an inflator pump (13), an electromagnetic valve (27) and a driving motor (51).
CN202211610157.7A 2022-12-14 2022-12-14 Test seat for semiconductor device Pending CN116008763A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211610157.7A CN116008763A (en) 2022-12-14 2022-12-14 Test seat for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211610157.7A CN116008763A (en) 2022-12-14 2022-12-14 Test seat for semiconductor device

Publications (1)

Publication Number Publication Date
CN116008763A true CN116008763A (en) 2023-04-25

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ID=86020156

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211610157.7A Pending CN116008763A (en) 2022-12-14 2022-12-14 Test seat for semiconductor device

Country Status (1)

Country Link
CN (1) CN116008763A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116727259A (en) * 2023-08-15 2023-09-12 弘润半导体(苏州)有限公司 Integrated circuit test equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116727259A (en) * 2023-08-15 2023-09-12 弘润半导体(苏州)有限公司 Integrated circuit test equipment
CN116727259B (en) * 2023-08-15 2023-10-24 弘润半导体(苏州)有限公司 Integrated circuit test equipment

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