CN115985839B

CN115985839B - Grabbing mechanism

Info

Publication number: CN115985839B
Application number: CN202310255523.XA
Authority: CN
Inventors: 周道; 张庆; 周磊; 梁烁; 叶莹
Original assignee: Shanghai Guona Semiconductor Technology Co ltd
Current assignee: Shanghai Guona Semiconductor Technology Co ltd
Priority date: 2023-03-16
Filing date: 2023-03-16
Publication date: 2023-06-20
Anticipated expiration: 2043-03-16
Also published as: CN115985839A

Abstract

The invention discloses a grabbing mechanism which is connected with a lifting belt and can be lifted under the driving of lifting. The clamping device is used for clamping the wafer box, the adjusting device is used for fixing the end part of the lifting belt, and the lifting belt can be wound and unwound, so that stepless micro-adjustment of the lifting belt is realized. When the grabbing mechanism is lifted in place, the centering device is used for fixing the lifting mechanism of the crown block and the grabbing mechanism, and the clamping device is prevented from shaking in the traveling process of the crown block. The centering device adopts a floating locating pin assembly structure, and the locating pin assembly of the centering device can float, so that the severe requirement on the precision of lifting to the position of the site when the rigid locating pin assembly is used is avoided.

Description

Grabbing mechanism

Technical Field

The invention relates to the field of automatic material conveying, in particular to a grabbing mechanism.

Background

The transfer of wafer cassettes (FOUPs) is a common step in the semiconductor processing industry and typically employs an automated material transfer system (AMHSAutomatic Material Handling System). The core part in the material automatic transmission system is a crown block (OHT, overheadHoist Transport), and the crown block automatically grabs and conveys the wafer box from one base station (Loadport) to the other base station. 25 wafers are usually placed in each wafer box, equipment is kept stable in the process of carrying, and damage to the wafers caused by shaking of the wafers in the wafer boxes is avoided. After the crown block grabs the wafer cassette, the wafer cassette needs to be lifted into the crown block and positioned and clamped. Crown blocks typically include a lifting mechanism for gripping the wafer cassette and a gripping mechanism that is lifted to drive the gripping mechanism to lift in its entirety.

At present, the grabbing action in the grabbing mechanism generally adopts a transmission mode of a double-rotation-direction screw rod, and a motor drives the screw rod to rotate, so that the clamping jaws at the left side and the right side are simultaneously opened or closed, the structure is complex, the requirement on the position accuracy of elements is high during assembly, and the assembly and the debugging are inconvenient. In addition, when the grabbing mechanism is lifted in place, the grabbing mechanism is positioned and prevented from shaking. The lifting stop position must be extremely accurate, otherwise, if the lifting is in place, the lifting belt for lifting can bear extra large tensile force, so that the lifting belt deforms, the repeated positioning precision and the stability of the system are affected, but if the lifting is not in place, the grabbing mechanism is not completely positioned, and is still in a free state, the wafer box can shake in the driving process of the crown block, and the wafer can be damaged. Therefore, a positioning device is needed between the grabbing mechanism and the lifting mechanism, and the existing positioning device is generally a rigid taper pin and cannot be adjusted, so that the position requirement on lifting of the lifting belt is high, and once the lifting precision is reduced, the operation of the whole crown block can be influenced. Furthermore, the grabbing mechanism drives the grabbing mechanism to lift through the lifting belt, and the grabbing mechanism needs to be kept horizontal, so that the lifting belt needs to be adjusted during installation, the lifting belt is pulled to be adjusted after the lifting belt clamping plate is loosened in the current mainstream method, the adjustment amount is difficult to accurately control, repeated disassembly and assembly are needed, time and labor are wasted, and the lifting belt is easy to damage.

Disclosure of Invention

In order to overcome the above-mentioned drawbacks, an object of the present invention is to provide a gripping mechanism capable of achieving stable gripping and transportation of a wafer cassette.

In order to achieve the above purpose, the invention adopts the following technical scheme: the utility model provides a snatch mechanism, can realize the snatch of wafer box and promote under the elevating system's of overhead traveling crane drive, includes the base plate, be provided with clamping device, adjusting device and centering device on the base plate, wherein clamping device is used for centre gripping wafer box, clamping device include two with base plate sliding connection's clamping component, two clamping component is relative or the back of the body removes under a clamping driving piece drive. The adjusting device is fixed on the base plate and used for fixing the end part of the lifting belt, and comprises a fixed shaft for winding and fixing the lifting belt, and the fixed shaft can realize stepless micro-adjustment of the lifting belt in the rotating process. The centering device comprises a fixed sleeve and a locating pin assembly corresponding to the fixed sleeve, the fixed sleeve is fixed on the lifting mechanism, a locating groove for the locating pin assembly to insert is formed in the lower end face of the fixed sleeve, the locating pin assembly can synchronously lift with the base plate and can float up and down along the base plate, the centering device further comprises a centering detection assembly for detecting the upward moving position of the grabbing mechanism, the centering detection assembly comprises a light shielding sheet III and a pair of opposite reflection sensors III, the light shielding sheet III is fixed on the base plate, and the opposite reflection sensors III are fixed on the lifting mechanism.

The invention has the beneficial effects that: on the one hand, the clamping device adopts a modularized design, so that the precision is high, and the installation is convenient. On the other hand, the adjusting device can realize stepless adjustment of the lifting belt by utilizing the rotation energy of the fixed shaft while fixing the lifting belt, so that the levelness of the substrate is ensured. Furthermore, the locating pin assembly of the centering device can float, so that the severe requirement on the precision of the position point which is lifted in place when the rigid locating pin assembly is used is avoided. Furthermore, the centering detection assembly improves the centering effect of the whole centering device, and after accurate centering, the whole grabbing mechanism is moved. The whole grabbing mechanism ensures grabbing precision, and is low in cost and compact in structure.

Further, the clamping driving piece comprises an electric claw, wherein the electric claw comprises two fingers which can move relatively or oppositely in a horizontal plane, and the two fingers are fixedly connected with one clamping assembly respectively. The electric claw is of an integrated structure, the direct-current motor and the gear rack are integrated inside, parallel opening or closing of fingers can be achieved, and meanwhile accuracy is high.

Every the centre gripping subassembly all includes tongs body, tongs link and finger connecting plate, wherein the tongs body is located the base plate below and can with wafer box butt, the finger connecting plate is located the base plate top and is connected with the finger, tongs link connects finger connecting plate and tongs body. The clamping assembly adopts a split structure, and is connected with the clamping driving piece above the substrate and the gripper body below the substrate through the clamping assembly, so that the clamping driving piece is convenient to replace and install.

Further, the tongs link includes the diaphragm and is located the riser at diaphragm both ends, the diaphragm level sets up in the base plate top and with finger connecting plate fixed connection, the up end of base plate still is provided with supplies diaphragm gliding slide rail. The vertical plate vertically passes through the base plate, a guide groove for the vertical plate to pass through and slide is formed in the base plate, and the gripper body is located between the two vertical plates. The handle connecting frame is in a door-shaped structure, so that the stability of connection with the handle body is improved. The base plate is provided with a guide groove for the vertical plate to pass through and slide. The guide groove provides a guide for the movement of the vertical plate, namely the movement of the gripper body. And the guide rail is matched, so that the moving stability of the gripper body is further improved, and the wafer box is stably clamped.

Furthermore, the clamping device further comprises at least one group of clamping detection assemblies, each group of clamping detection assemblies comprises a first shading sheet and two pairs of correlation sensors, the first shading sheet is fixed on one clamping assembly and moves synchronously with the clamping assembly, and the first correlation sensors are fixed on the substrate and are arranged at intervals along the moving direction of the clamping assembly. The clamping detection assembly limits the moving range of the clamping assembly, the first shading sheet moves back and forth between the two opposite-shooting sensors, and when the first shading sheet shields the opposite-shooting light rays of any opposite-shooting sensor, the clamping driving piece stops working.

Furthermore, the centering devices are provided with two centering devices and are arranged at intervals along the length direction of the substrate, each centering device further comprises a mounting seat and a first spring, the mounting seat is fixed on the substrate, the first spring is embedded in the mounting seat, the positioning pin assembly moves up and down along the mounting seat, and the positioning pin assembly moves down under the action of external force and can move up and reset under the action of the first spring. When the locating pin assembly moves downwards, the first spring is in a continuously compressed state.

After the grabbing mechanism is lifted in place, the locating pin assembly is inserted into the corresponding locating groove, and centering and locating of the grabbing mechanism and the lifting mechanism are completed. Because the locating pin subassembly can be with the lifter plate synchronous lift simultaneously, can also float from top to bottom relative the base plate, when the locating pin subassembly butt to the constant head tank bottom, can continue relative base plate downward movement, can set up the position that promotes to the position and just before the locating pin subassembly downward movement will contact extreme position any position, the motor of elevating system can not take place the overload like this, the lifting belt can not too tighten yet, simultaneously also reached the requirement to snatch the mechanism and fixed a position, when having avoided using the rigidity locating pin subassembly, the strict requirement to the precision of the position point that promotes to the position.

Furthermore, the locating pin assembly comprises a locating pin body and a limiting column which are detachably connected, the locating pin body is sleeved outside the mounting seat and can be inserted into the locating groove, a convex ring for limiting the upward moving distance of the limiting column is arranged on the part, located in the mounting seat, of the limiting column, and the upper end of the limiting column extends out of the mounting seat to be fixedly connected with the locating pin body. The locating pin assembly is designed into a split structure, so that replacement and later maintenance are facilitated.

Furthermore, the locating pin assembly further comprises a buffer piece fixed at the upper end of the locating pin body, and the buffer piece is detachably connected with the locating pin body. The buffer piece plays a role in buffering and is made of POM materials. And the upper end surface of the buffer piece is an arc-shaped surface. The arrangement of the arc-shaped surface reduces the area of the upper end surface, so that the buffer piece is convenient to insert into the positioning groove, and the guiding effect is achieved.

Furthermore, the centering device further comprises at least one sensing piece, the sensing piece is fixed on the positioning groove or the positioning pin assembly, the sensing piece is used for sensing whether the positioning pin body enters the positioning groove, and when the sensing piece generates a sensing signal and the correlation light rays of the correlation sensor III are shielded, the grabbing mechanism is lifted in place. The induction sheet is matched with the correlation sensor, so that the centering accuracy is improved.

Furthermore, the three adjusting devices are arranged and distributed on the upper end face of the base plate in a triangular shape, each adjusting device further comprises an adjusting seat and an adjusting element, one end of the fixed shaft is rotationally connected with the fixed seat, the other end of the fixed shaft is suspended, the adjusting element is sleeved on one end of the fixed shaft which is suspended and synchronously rotates with the fixed shaft, the adjusting element is in threaded connection with the adjusting seat, and the end part of the adjusting element penetrates through the adjusting seat. The adjusting element supports one end of the fixed shaft which is suspended in the air, and meanwhile, the adjusting element is rotated to drive the fixed shaft to rotate clockwise or anticlockwise along the axis R, so that the lifting belt can be retracted and released, and stepless micro-adjustment is realized.

Furthermore, each adjusting device further comprises a lock nut, the lock nuts are sleeved outside the adjusting element and are in threaded connection with the adjusting element, the outer ring of the adjusting element is provided with external threads, and the adjusting seat and the lock nuts are provided with internal threads matched with the external threads. When the adjusting element is adjusted in place, the adjusting element is locked through the locking nut, and the locking nut is tightly pressed on the adjusting seat.

Furthermore, the end part of the adjusting element extending out of the adjusting seat is provided with a hexagonal force application part, and the hexagonal force application part is convenient for adjusting a spanner.

Furthermore, the grabbing mechanism further comprises a guiding detection device, the guiding detection device comprises a detection rod, a guiding detection assembly and a second spring, the detection rod is arranged on the base plate in a penetrating mode and can move up and down along the base plate, the detection rod is pushed by the wafer box to move up and down and reset under the action of the second spring, and the guiding detection assembly is used for detecting the moving distance of the detection rod. The guide detection device informs the clamping driving piece to act when detecting that the whole grabbing mechanism descends to the position of the wafer box and corresponds to the position of the wafer box, and clamps the wafer box.

Further, the detection rod comprises a rod body and an abutting block fixed at the end part of the rod body, the abutting block is always positioned below the substrate and can be abutted against the wafer box, and the abutting block is of a round platform structure; the second spring is sleeved on the rod body positioned below the base plate, one end of the second spring is abutted with the abutting block, and the other end of the second spring is abutted with the base plate. When the abutting block moves upwards, the second spring is in a continuously compressed state. When the guide detection assembly detects that the detection rod rises to a certain position, the grabbing mechanism is stated to descend to the position, the clamping driving piece is controlled to act at the moment, and the clamping assembly moves relatively to clamp the wafer box.

Furthermore, the guiding detection assembly is located above the substrate and comprises a second light shielding sheet and a second pair of correlation sensors, the second light shielding sheet is fixed on a detection rod located above the substrate and is lifted synchronously with the detection rod, and the second pair of correlation sensors are fixed on the substrate and are arranged at an upper-lower interval. The three pairs of correlation sensors II can detect three different positions of the lifting rod, which are moved upwards.

Drawings

FIG. 1 is a schematic perspective view of an embodiment of the present invention;

FIG. 2 is a top view of an embodiment of the present invention;

FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2;

FIG. 4 is a cross-sectional view of a centering device in accordance with an embodiment of the present invention;

FIG. 5 is an exploded view of an adjustment device according to an embodiment of the present invention;

FIG. 6 is a cross-sectional view of an adjustment device according to an embodiment of the present invention;

FIG. 7 is an enlarged view of FIG. 1 at A;

fig. 8 is an enlarged view at B in fig. 1.

In the figure:

1. a substrate; 11. a guide groove; 2. a lifting belt; 3. clamping the driving member; 4. a clamping assembly; 41. a grip body; 42. a gripper connecting frame; 43. a finger connecting plate; 44. a slide rail; 45. clamping the detection assembly; 451. a first shading sheet; 452. correlation sensor I; 5. an adjusting device; 51. an adjusting seat; 52. a fixed shaft; 53. an adjusting element; 531. a force application part; 54. tabletting; 55. a lock nut; 6. a centering device; 61. a fixed sleeve; 62. a locating pin assembly; 621. a positioning pin body; 622. a limit column; 623. a buffer member; 63. a mounting base; 64. a first spring; 65. an induction piece; 661. a third shading sheet; 662. an correlation sensor III; 7. a guide detection device; 71. a detection rod; 711. a rod body; 712. an abutment block; 72. a guide detection assembly; 721. a second shading sheet; 722. correlation sensor II; 73. and a second spring.

Detailed Description

The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present invention.

Referring to fig. 1 and 2, a grabbing mechanism of the present invention is connected to a lifting belt 2 and can be lifted under the driving of the lifting belt 2, and the grabbing mechanism includes a substrate 1, and a clamping device, an adjusting device 5 and a centering device 6 are disposed on the substrate 1. The clamping device is used for clamping the wafer box, the adjusting device 5 is used for fixing the end part of the lifting belt 2, and can wind and unwind the lifting belt 2, so that stepless micro-adjustment of the lifting belt 2 is realized. When the gripping mechanism is lifted in place, the centering device 6 is used for fixing a lifting mechanism (not shown in the figure) of the crown block with the gripping mechanism, and preventing the clamping device from shaking during the traveling process of the crown block. The centering device 6 adopts a floating locating pin assembly 62 structure, the locating pin assembly 62 of the centering device 6 can float, and the severe requirement on the position accuracy of the lifting position when the rigid locating pin assembly 62 is used is avoided.

The lifting belt 2 is fixed on the adjusting device 5, and the position is adjusted by the adjusting device 5, so that the substrate 1 is ensured to be in a horizontal state. The lifting belt 2 drives the grabbing mechanism to descend, the grabbing mechanism grabs the wafer box after the grabbing mechanism reaches the position of the wafer box, and then the lifting belt 2 drives the grabbing mechanism to move upwards until the centering mechanism completes fixing of the lifting mechanism and the grabbing mechanism.

Referring to fig. 2, the clamping device comprises two clamping assemblies 4 which are arranged in a mirror image manner in a horizontal plane, wherein the two clamping assemblies 4 are slidably connected with the substrate 1 and can relatively or oppositely move under the driving of a clamping driving piece 3, and the wafer box can be clamped between the two clamping assemblies 4.

When the clamping device does not grasp the wafer cassette, the two clamping assemblies 4 are far away from each other and are in an open state. The lifting belt 2 descends the grabbing mechanism to the position of the wafer box in the vertical direction, the clamping driving piece 3 drives the two clamping assemblies 4 to move relatively, and the clamping part of the wafer box is clamped between the two clamping assemblies 4; when the wafer cassette needs to be placed, the clamping driving piece 3 drives the two clamping assemblies 4 to be away from each other, and the wafer cassette between the two clamping assemblies is loosened.

In one embodiment, the clamping drive 3 comprises an electric jaw comprising two fingers which can be moved relatively or in opposition in a horizontal plane, the two fingers being fixedly connected to one clamping assembly 4, respectively. In the embodiment, the electric claw is of an integrated structure, the direct current motor and the gear rack are integrated inside, parallel opening or closing of fingers can be achieved, and meanwhile accuracy is high. The integrated electric claw driving mode is adopted, the modularized design is adopted, the precision is high, and the installation is convenient.

Of course, in some embodiments, the clamping driving member 3 may also use a bi-directional cylinder, where the bi-directional cylinder includes two piston rods capable of moving relatively or reversely, and the two piston rods are respectively connected to the clamping assembly 4.

Referring to fig. 1, the wafer cassette needs to be clamped below the substrate 1, and in order not to interfere with the clamping of the wafer cassette, the wafer cassette is replaced, and the clamping driving member 3 is fixed above the substrate 1, so that the overall structure is more compact. Each clamping assembly 4 comprises a gripper body 41, a gripper connecting frame 42 and a finger connecting plate 43, wherein the gripper body 41 is located below the substrate 1 and can be abutted with the wafer cassette for directly clamping the wafer cassette. The finger connection plate 43 is located above the base plate 1 and is connected to the output of the clamping drive 3, in this embodiment to the fingers of the electric jaws. The gripper connecting frame 42 vertically penetrates the base plate 1, and is connected with the finger connecting plate 43 and the gripper body 41.

The clamping assembly 4 adopts a split structure, and the clamping driving piece 3 above the substrate 1 and the gripper body 41 below the substrate 1 are connected through the clamping assembly 4. The opposite surface of the gripper body 41 is provided with a step structure, which is matched with the side wall of the wafer cassette, thereby improving the clamping stability.

Referring to fig. 1, the gripper connecting frame 42 includes a horizontal plate horizontally disposed above the base plates 1 and fixedly connected with the finger connecting plates, and vertical plates vertically passing through the base plates 1, and vertical plates at both ends of the horizontal plate, and the gripper body 41 is located between the two base plates 1. The gripper connecting frame 42 is in a door-shaped structure, and the stability of connection with the gripper body 41 is improved. The base plate is provided with a guide groove 11 through which the riser passes and slides. The guide groove 11 provides for the yielding of the riser on the one hand and for the movement of the riser on the other hand, i.e. for the movement of the gripper body 41.

In one embodiment, referring to fig. 1, to improve the stability of the movement of the clamping assembly 4, the upper end surface of the base plate is further provided with a sliding rail 44 for sliding a transverse plate, and the transverse plate slides along the sliding rail 44. Each transverse plate corresponds to two sliding rails 44, and the two sliding rails 44 are respectively arranged at positions close to the two vertical plates.

Referring to fig. 1 and 7, the clamping device further comprises at least one set of clamping detection assemblies 45, the clamping detection assemblies 45 being used for detecting the moving position of the clamping assembly 4. Each group of clamping detection assemblies 45 comprises a first light shielding sheet 451 and two pairs of correlation sensors 452, wherein the first light shielding sheet 451 is fixed on one clamping assembly 4 and moves synchronously with the clamping assembly 4, and the two pairs of correlation sensors 452 are fixed on the substrate 1 and are arranged at intervals along the moving direction of the clamping assembly 4. The pair of opposite reflecting sensors includes a transmitting end and a receiving end, and the clamp driving member 3 stops when the first light shielding sheet 451 shields the opposite light of any one of the pair of opposite reflecting sensors 452.

In this embodiment, since the fingers of the grip driving member 3 are synchronously moved, only one set of grip detection assemblies 45 is provided corresponding to one grip assembly 4. Of course, for improving the safety, two sets of clamping detection assemblies 45 may be provided, corresponding to one clamping assembly 4 respectively.

The two pairs of correlation sensors 452 include a pair of correlation sensors a and a pair of correlation sensors B, the first light shielding sheet 451 being fixed to one of the holding members 4, the pair of correlation sensors a being disposed close to the other holding member 4, the first light shielding sheet 451 being moved back and forth between the pair of correlation sensors a and the pair of correlation sensors B. When the first light shielding sheet 451 shields the correlation light of the correlation sensor A, the clamping assembly 4 is stated to clamp the wafer box in place, the clamping driving piece 3 stops working, and the lifting mechanism can lift. When the first light shielding sheet 451 shields the correlation light of the correlation sensor first B, it indicates that the clamping assembly 4 is reset, and the clamping driving member 3 stops working. The two pairs of correlation sensors 452 limit the moving range of the clamping assembly 4, so that the excessive clamping force on the wafer box is avoided, and the linkage with the lifting mechanism is realized.

In one embodiment, the first light shielding plate 451 is fixed on the finger connecting plate 43 and located above the substrate 1, and the two pairs of correlation sensors 452 are also fixed above the substrate 1 by the fixing frame.

In the present embodiment, as shown in fig. 1 and 2, two centering devices 6 are provided and are spaced apart along the length of the base plate 1, the centering devices 6 are provided on a center line passing through the midpoint of the width, and the two centering devices 6 are located on both sides of the holding device. Of course the more centering devices 6 are provided, the more stable the connection of the lifting mechanism and the gripping mechanism will be when lifted into place. However, in the present embodiment, the two centering devices 6 provided along the center line in the width direction of the substrate 1 can satisfy the working requirements.

Each centering device 6 comprises a fixed sleeve 61 and a locating pin assembly 62 corresponding to the fixed sleeve 61, the fixed sleeve 61 is fixed on the lifting mechanism, and the fixed sleeve 61 is provided with a locating groove for inserting the locating pin assembly 62 from the lower end surface. The positioning pin assembly 62 can be lifted and lowered synchronously with the substrate 1 and can be floated up and down along the substrate 1. In order to improve the stability of positioning, the part of the positioning pin inserted into the positioning groove is matched with the shape of the positioning groove.

After the grabbing mechanism is lifted in place, the locating pin assembly 62 is inserted into the corresponding locating groove, and centering and locating of the grabbing mechanism and the lifting mechanism are completed. Because the locating pin assembly 62 can be lifted synchronously with the lifting plate and can float up and down relative to the base plate 1, when the locating pin assembly 62 is abutted to the bottom of the locating slot, the locating pin assembly 62 can move downwards relative to the base plate 1 continuously, and the lifting position can be set at any position before the locating pin assembly 62 moves downwards to be in contact with the limiting position, so that the motor of the lifting mechanism cannot be overloaded, the lifting belt 2 cannot be too tight, the requirement for positioning the grabbing mechanism is met, and the severe requirement for lifting the position precision of the lifting position when the rigid locating pin assembly 62 is used is avoided.

Referring to fig. 3 and 4, the centering device 6 further includes a mounting base 63 and a first spring 64, the mounting base 63 is fixed to the base plate 1, and the positioning pin assembly 62 moves up and down along the mounting base 63. The dowel assembly 62 moves downward under the force of an external force and can move upward for return under the force of the first spring 64. The first spring 64 is embedded in the mounting seat 63, and the first spring 64 is in a continuously compressed state when the positioning pin assembly 62 moves downwards. The mounting 63 provides guidance for the up and down floating of the dowel assembly 62 while facilitating placement of the first spring 64.

The positioning pin assembly 62 comprises a positioning pin body 621 and a limiting column 622 which are detachably connected, wherein the positioning pin body 621 is sleeved outside the mounting seat 63 and can be inserted into the positioning groove, and the limiting column 622 is inserted into the mounting seat 63 and limits the upward moving distance of the positioning pin body 621. The shape of the dowel body 621 matches the shape of the dowel groove. The tip of spacing post 622 passes mount pad 63 and locating pin body 621 fixed connection, and the part that spacing post 622 is located mount pad 63 is provided with the bulge loop along circumference, and the upper end opening part of mount pad 63 is provided with the boss that can with the bulge loop butt, and boss and bulge loop butt time, spacing post 622 can't continue to move up, and locating pin body 621 can't move up promptly, has limited the upward movement distance of first 64 promotion locating pin subassembly 62 of spring, prevents that locating pin subassembly 62 breaks away from mount pad 63.

The mounting seat 63 is provided with a channel with an upper opening and a lower opening, the spring is positioned in the channel, the lower end of the spring is abutted with the base plate 1, and the upper end of the spring is abutted with the limit column 622.

Because the positioning pin body 621 abuts against the bottom of the positioning groove and even impacts are generated when inserted into the positioning groove, in order to effectively protect the positioning pin body 621 and the fixing sleeve 61, in one embodiment, the positioning pin assembly 62 further includes a buffer member 623 fixed to the upper end of the positioning pin body 621, and the buffer member 623 is detachably connected to the positioning pin body 621. The buffer member 623 plays a role in buffering and is made of POM material.

In one implementation, the upper end surface of the buffer member 623 is an arcuate surface, and the arcuate surface reduces the area of the upper end surface, so that the buffer member 623 is conveniently inserted into the positioning groove, and plays a guiding role. When the axis of the fixing sleeve 61 and the axis of the locating pin assembly 62 deviate slightly, the deviation distance is L, as shown in fig. 4, and the fixing sleeve 61 and the locating pin assembly 62 are butted, and the locating pin assembly 62 can slide into a locating groove of the fixing sleeve 61 by virtue of the arc-shaped surface of the buffer member 623, so that the centering effect is realized.

In this embodiment, the locating pin assembly 62 is designed as a split structure to facilitate replacement and later maintenance. Of course, an integrated structure can be adopted, so long as the floating structure of the positioning pin assembly 62 is satisfied, the elastic contact between the positioning pin assembly 62 and the fixed sleeve 61 is realized, the precision requirement on the stop position of the lifting in place is greatly reduced, and the debugging and the system stability are facilitated.

Referring to the drawings, the centering device 6 further includes a centering detection assembly, the centering detection assembly is used for detecting whether the locating pin assembly 62 is centered in place and whether the grabbing mechanism is lifted in place, the centering detection assembly includes a third light shielding sheet 661 and a third pair of opposite shooting sensors 662, the third light shielding sheet 661 is fixed on the base plate 1, the third opposite shooting sensors 662 are fixed on the lifting mechanism, the locating pin body 621 continues to move relatively after entering the fixed sleeve 61, at the moment, the first spring 64 is compressed, but not compressed to the maximum extent, the third light shielding sheet 661 enters between the third opposite shooting sensors 662, light of the third opposite shooting sensors 662 is shielded, a shielding signal is generated to indicate lifting in place, and accordingly the lifting mechanism and the grabbing mechanism are controlled to stop moving relatively.

In one embodiment, at least one sensing piece 65 is further provided at the bottom surface of the positioning groove of the fixing sleeve 61 or the top end of the buffering member 623, and generates a sensing signal when the positioning pin body 621 enters the positioning groove of the fixing sleeve 61. Because the positioning pin body 621 may still move downward under the pushing of the external force when the substrate rises when the positioning pin body 621 does not enter the fixing sleeve 61, the signal generated when the light shielding sheet three 661 enters the space between the correlation sensor three 662 is an error signal. If the correlation sensor three receives a blocking signal and the sensing piece 65 does not sense a contact signal, this indicates that the alignment of the fixing sleeve 61 and the locating pin assembly 62 is not achieved. Therefore, the sensing piece has the functions of judging whether the fixing sleeve 61 is aligned with the locating pin assembly 62 or not and judging in advance that the fixing sleeve 61 is in contact with the locating pin assembly 62 to stop the operation of the upgrading mechanism.

Therefore, in this embodiment, a sensing piece 65 is added, and after the positioning pin body 621 enters the positioning groove of the fixing sleeve 61, the sensing piece generates a sensing signal, which indicates that the buffer member 623 contacts the bottom of the positioning groove, at this time, the first spring 64 is not compressed, the third light shielding piece 661 approaches the third correlation sensor 662, but the third light shielding piece 661 does not shield the light of the third correlation sensor 662. The positioning pin body 621 enters the fixed sleeve 61 to continue the relative movement, at the moment, the first spring 64 is compressed, but not compressed to the maximum, the third light shielding sheet 661 enters the space between the third correlation sensor 662, light rays of the third correlation sensor 662 are shielded, and a shielding signal is generated, so that the lifting mechanism and the grabbing mechanism are controlled to stop the relative movement. The centering detection assembly and the sensing tab 65 are double protected and the centering device achieves a centering effect only when both sensing tab 65 and the detection assembly detect a signal.

In this embodiment, two sensing pieces 65 are provided, one is embedded in the bottom of the positioning groove, and one is embedded in the top end of the buffer 623. Of course, in some embodiments, only one sensing piece can be provided, and the sensing piece can generate a signal when the top end of the buffer member 623 is abutted with the bottom of the positioning groove or the top end of the buffer member 623.

In one embodiment, more than two centering devices 6 can be provided, and the more the centering devices are provided, the better the centering effect and the precision are. In normal use, however, two centering devices 6 are sufficient for working purposes.

Referring to fig. 1, three adjusting devices 5 are provided and distributed on the upper end surface of the base plate 1 in a triangle shape, and the stability of lifting of the grabbing mechanism can be improved by utilizing the characteristic of stability of the triangle.

Referring to fig. 5 and 6, each of the adjusting devices 5 includes an adjusting seat 51, a fixed shaft 52, and an adjusting member 53. The adjusting seat 51 is fixed on the base plate 1, one end of the fixed shaft 52 is rotationally connected with the fixed seat, the other end of the fixed shaft 52 is suspended, the end part of the lifting belt 2 is fixed on the fixed shaft 52, and when the fixed shaft 52 rotates along the axis R, the length of the lifting belt 2 wound on the fixed shaft 52 can be adjusted. The adjusting element 53 is sleeved on one end of the fixed shaft 52 which is suspended and rotates synchronously with the fixed shaft 52, and the adjusting element 53 can also move along the axial direction of the fixed shaft 52. The adjusting element 53 is screwed with the adjusting seat 51 and the end passes through the adjusting seat 51.

The adjusting element 53 supports one end of the fixed shaft 52 which is suspended, and simultaneously, the adjusting element 53 is rotated to drive the fixed shaft 52 to rotate clockwise or anticlockwise along the axis R, so that the lifting belt 2 is retracted and released, and stepless micro-adjustment is realized.

Referring to fig. 5 and 6, the adjusting device 5 further includes a lock nut 55, where the lock nut 55 is sleeved outside the adjusting element 53 and is screwed with the adjusting element 53. When the adjusting element 53 is adjusted in place, the locking nut 55 is locked again, and the locking nut 55 is tightly pressed on the adjusting seat 51. The outer ring of the adjusting element 53 is designed with external threads, and the adjusting seat 51 and the locking nut 55 are provided with internal threads matched with the external threads.

In one embodiment, in order to facilitate rotation of the adjusting member 53, an end of the adjusting member 53 extending out of the adjusting seat 51 is provided with a hexagonal shaped force applying portion 531, and the hexagonal shaped force applying portion 531 facilitates adjustment of the wrench. When the lifting belt 2 is adjusted, the locking nut 55 is firstly loosened, and the force application part 531 of the adjusting element 53 is sleeved by an open spanner to rotate clockwise or anticlockwise, so that the lifting belt 2 is retracted and released.

The adjusting element 53 is in key joint with the fixed shaft 52, a flat key is fixed on the fixed shaft 52, a key groove is formed in the adjusting element 53, the key groove penetrates through the adjusting element 53 along the axial direction of the adjusting element 53, and the adjusting element 53 can move along the axial direction of the fixed shaft 52 while ensuring synchronous rotation of the fixed shaft 52 and the adjusting element 53.

The lifting belt 2 is wound around the fixed shaft 52, and the end of the lifting belt 2 is fixed to the fixed shaft 52 by the pressing piece 54. The adjusting seat 51 is in a door-shaped structure, and a yielding groove for the lifting belt 2 to vertically pass through is formed in the upper end face of the adjusting seat 51.

The grabbing mechanism further comprises a guiding detection device 7 for detecting the position of the wafer box, and when the guiding detection device 7 detects that the whole grabbing mechanism descends to the position of the wafer box and corresponds to the position of the wafer box, the clamping driving piece 3 is notified to act, and the wafer box is clamped.

Referring to fig. 3, the guide detecting device 7 includes a detecting rod 71, a guide detecting assembly 72, and a second spring 73, and the detecting rod 71 is provided to penetrate the base plate 1 and is movable up and down along the base plate 1. The detecting rod 71 moves up under the pushing of the wafer cassette and can move down to reset under the action of the second spring 73, and the guiding detecting assembly 72 is used for detecting the moving distance of the detecting rod 71.

The detecting rod 71 includes a rod body 711 and an abutting block 712 fixed to an end of the rod body 711, and the abutting block 712 is always located below the substrate 1 and can abut against a wafer cassette, and a hole into which the abutting block 712 is inserted is provided in the wafer cassette. The second spring 73 is sleeved on a rod body 711 positioned below the substrate 1, one end of the second spring 73 is abutted against the abutting block 712, and the other end is abutted against the substrate 1. When the abutment block 712 moves up, the second spring 73 is in a continuously compressed state. When the guide detection assembly 72 detects that the detection rod 71 is lifted to a certain position, the grabbing mechanism is lowered to a proper position, and the clamping driving piece 3 is controlled to act, so that the clamping assembly 4 clamps the wafer box relatively.

In one embodiment, in order to improve the stability of the movement of the rod 711, a linear bearing is further fixed on the base plate 1, and the rod 711 is inserted into and slides in the linear bearing.

In one embodiment, the abutment block 712 has a frustoconical configuration and a lower end surface has a small rounded surface to facilitate insertion of the abutment block 712 into a hole in a wafer cassette. The upper end of the abutting block 712 is fixed with a groove into which the end of the second spring 73 is inserted, thereby improving the stability of the second spring 73.

Referring to fig. 8, the guiding detection assemblies 72 are all located above the substrate 1, and include a second light shielding sheet 721 and a second three-pair correlation sensor 722, where the second light shielding sheet is fixed on a rod body 711 located above the substrate 1 and is lifted synchronously with the rod body 711, and the second three-pair correlation sensor 722 is fixed on the substrate 1 and is arranged at an upper-lower interval. Three pairs of correlation sensors two 722 can detect three different positions of the lifting rod that are moved up.

When the grabbing mechanism descends and the abutting block 712 is aligned with the hole at the upper end of the wafer box, the grabbing mechanism descends continuously, the abutting block 712 compresses the second spring 73, the rod body 711 drives the second light shielding sheet 721 to move upwards, and when the second light shielding sheet 721 moves to the position of the second opposite shooting sensor 722 at the lowest end, the opposite rays of the second opposite shooting sensor 722 at the lowest end are shielded, so that a shielding signal is generated. The grabbing mechanism continues to descend, in the descending process, the abutting block 712 finely adjusts the positions of the grabbing mechanism and the wafer box, so that the grabbing mechanism moves to a proper position, when the second shielding sheet shields the opposite rays of the second intermediate pair of opposite reflection sensors 722, the grabbing mechanism is stated to descend to the proper position, and at the moment, the clamping driving piece 3 is controlled to act, and the clamping assembly 4 relatively moves to clamp the wafer box. However, in this process, if the second light shielding sheet 721 shields the correlation light of the second pair of the uppermost pair of the sensors 722, the capturing mechanism is described to be moved down too much, and the controller automatically controls the capturing mechanism to move up.

Before lifting, the clamping device firstly adjusts the position of the lifting belt 2 through the adjusting device 5, so as to ensure the horizontal state of the substrate 1. The process shaft is adjusted, the adjusting element 53 is rotated, the fixed shaft 52 is driven to rotate, so that the length of the lifting belt 2 wound on the fixed shaft 52 is adjusted, and stepless fine adjustment of the length of the lifting belt 2 is realized. In the working process of the clamping device, the lifting mechanism drives the clamping device to move downwards, the abutting block 712 is aligned with the hole at the upper end of the wafer box, the grabbing mechanism continues to descend, the abutting block 712 compresses the second spring 73, when the guide detection assembly 72 detects that the rod body 711 moves upwards to the designated height, the clamping device is stated to reach the clamping position for clamping the wafer box, and the clamping driving piece 3 drives the clamping assembly 4 to clamp the wafer box. When the clamping detection assembly 45 detects that the clamping assembly 4 is clamped in place, the clamping driving piece 3 stops working, and the lifting mechanism drives the clamping device to move upwards. After the grabbing mechanism is lifted in place, the locating pin assembly 62 is inserted into the corresponding locating groove, and centering and locating of the grabbing mechanism and the lifting mechanism are completed. Because the locating pin assembly 62 can be lifted synchronously with the lifting plate and can also float up and down along the mounting seat 63, when the locating pin assembly 62 is abutted to the bottom of the locating groove, the locating pin assembly 62 can move downwards continuously relative to the base plate 1, and the lifting position can be set at any position before the locating pin assembly 62 moves downwards to be in contact with the limit position, so that the motor of the lifting mechanism cannot be overloaded, the lifting belt 2 cannot be too tight, the requirement for positioning the grabbing mechanism is met, and the severe requirement for lifting the position precision of the lifting position when the rigid locating pin assembly 62 is used is avoided.

The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and to implement the same, but are not intended to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.

Claims

1. The utility model provides a snatch mechanism, can realize the snatch promotion of wafer box under the elevating system's of crown block drive, its characterized in that: comprises a base plate, a clamping device, an adjusting device and a centering device are arranged on the base plate, wherein

The clamping device is used for clamping the wafer box and comprises two clamping assemblies which are in sliding connection with the substrate, and the two clamping assemblies are driven by a clamping driving piece to move relatively or oppositely;

the adjusting device is fixed on the base plate and is used for fixing the end part of the lifting belt, the adjusting device comprises a fixed shaft for winding and fixing the lifting belt, and the fixed shaft can realize stepless micro-adjustment of the lifting belt in the rotating process;

the centering device comprises a fixed sleeve and a locating pin assembly corresponding to the fixed sleeve, the fixed sleeve is fixed on the lifting mechanism, a locating groove for the locating pin assembly to insert is formed in the lower end face of the fixed sleeve, the locating pin assembly can synchronously lift with the base plate and can float up and down along the base plate, the centering device further comprises a centering detection assembly for detecting the upward moving position of the grabbing mechanism, the centering detection assembly comprises a light shielding sheet III and a pair of opposite reflection sensors III, the light shielding sheet III is fixed on the base plate, and the opposite reflection sensors III are fixed on the lifting mechanism.

2. The grasping mechanism according to claim 1, wherein: the clamping driving piece comprises an electric claw, wherein the electric claw comprises two fingers which can move relatively or oppositely in a horizontal plane, and the two fingers are fixedly connected with a clamping assembly respectively;

every the centre gripping subassembly all includes tongs body, tongs link and finger connecting plate, wherein the tongs body is located the base plate below and can with wafer box butt, the finger connecting plate is located the base plate top and is connected with the finger, tongs link connects finger connecting plate and tongs body.

3. The grasping mechanism according to claim 2, wherein: the gripper connecting frame comprises a transverse plate and vertical plates positioned at two ends of the transverse plate;

the transverse plate is horizontally arranged above the base plate and fixedly connected with the finger connecting plate, and a sliding rail for sliding the transverse plate is further arranged on the upper end surface of the base plate;

the vertical plate vertically passes through the base plate, a guide groove for the vertical plate to pass through and slide is formed in the base plate, and the gripper body is located between the two vertical plates.

4. The grasping mechanism according to claim 1, wherein: the clamping device further comprises at least one group of clamping detection assemblies, each group of clamping detection assemblies comprises a first shading sheet and two pairs of correlation sensors, the first shading sheet is fixed on one clamping assembly and moves synchronously with the clamping assembly, and the two pairs of correlation sensors are fixed on the substrate and are arranged at intervals along the moving direction of the clamping assembly.

5. The grasping mechanism according to claim 1, wherein: the centering device is provided with at least two centering devices and is arranged at intervals along the length direction of the substrate, each centering device further comprises a mounting seat and a first spring, the mounting seat is fixed on the substrate, the first spring is embedded in the mounting seat, the positioning pin assembly moves up and down along the mounting seat, and the positioning pin assembly moves down under the action of external force and can move up and reset under the action of the first spring.

6. The grasping mechanism according to claim 5, wherein: the locating pin assembly comprises a locating pin body and a limiting column which are detachably connected, the locating pin body is sleeved outside the mounting seat and can be inserted into the locating groove, a convex ring for limiting the upward moving distance of the limiting column is arranged on the part, located in the mounting seat, of the limiting column, and the upper end of the limiting column extends out of the mounting seat to be fixedly connected with the locating pin body.

7. The grasping mechanism according to claim 6, wherein: the locating pin assembly further comprises a buffer piece fixed at the upper end of the locating pin body, the buffer piece is detachably connected with the locating pin body, and the upper end face of the buffer piece is an arc-shaped face.

8. The grasping mechanism according to claim 1, wherein: the centering device further comprises at least one sensing piece, the sensing piece is fixed on the positioning groove or the positioning pin assembly, the sensing piece is used for sensing whether the positioning pin body enters the positioning groove or not, and when the sensing piece generates sensing signals and the correlation light rays of the correlation sensor III are shielded, the grabbing mechanism is lifted in place.

9. The grasping mechanism according to claim 1, wherein: the adjusting device is provided with three adjusting devices and is distributed on the upper end face of the base plate in a triangular shape, each adjusting device further comprises an adjusting seat and an adjusting element, one end of the fixed shaft is connected with the fixed seat in a rotating mode, the other end of the fixed shaft is arranged in a hanging mode, the adjusting element is sleeved on one end of the fixed shaft in a hanging mode and rotates synchronously with the fixed shaft, the adjusting element is in threaded connection with the adjusting seat, the end portion of the adjusting element penetrates through the adjusting seat, and a force application portion of a hexagonal shape is arranged at the end portion of the adjusting element extending out of the adjusting seat.

10. The grasping mechanism according to claim 9, wherein: each adjusting device further comprises a lock nut, the lock nuts are sleeved outside the adjusting element and are in threaded connection with the adjusting element, the outer ring of the adjusting element is provided with external threads, and the adjusting seat and the lock nuts are provided with internal threads matched with the external threads.

11. The grasping mechanism according to any one of claims 1-10, wherein: the grabbing mechanism further comprises a guiding detection device, the guiding detection device comprises a detection rod, a guiding detection assembly and a second spring, the detection rod is arranged on the base plate in a penetrating mode and can move up and down along the base plate, the detection rod is pushed by the wafer box to move up and down and can move down to reset under the action of the second spring, and the guiding detection assembly is used for detecting the moving distance of the detection rod.

12. The grasping mechanism according to claim 11, wherein: the detection rod comprises a rod body and an abutting block fixed at the end part of the rod body, the abutting block is always positioned below the substrate and can be abutted against the wafer box, and the abutting block is of a round platform structure; the second spring is sleeved on the rod body positioned below the base plate, one end of the second spring is abutted with the abutting block, and the other end of the second spring is abutted with the base plate.

13. The grasping mechanism according to claim 11, wherein: the guide detection assembly is located above the substrate and comprises a second shading sheet and a second pair of correlation sensors, the second shading sheet is fixed on a detection rod located above the substrate and is lifted synchronously with the detection rod, and the second pair of correlation sensors are fixed on the substrate and are arranged at intervals up and down.