CN113436993A - Semiconductor chip template transfer device - Google Patents
Semiconductor chip template transfer device Download PDFInfo
- Publication number
- CN113436993A CN113436993A CN202110673674.8A CN202110673674A CN113436993A CN 113436993 A CN113436993 A CN 113436993A CN 202110673674 A CN202110673674 A CN 202110673674A CN 113436993 A CN113436993 A CN 113436993A
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- China
- Prior art keywords
- semiconductor chip
- chip template
- shaped
- rod
- shaped frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Abstract
The invention discloses a semiconductor chip template transfer device which comprises a direction detection mechanism, a transfer clamp and a bearing mechanism. The direction detection mechanism comprises two L-shaped frames, a blocking structure and an induction structure, the semiconductor chip template is in sliding fit with the L-shaped frames, the blocking structure is positioned at one end of each of the two L-shaped frames and comprises a turbine, a worm, a first rotating motor and a stop plate, the induction structure comprises a cross rod and a contact controlled by a first lifting device, a limiting block is arranged at the bottom of one end of the cross rod, an induction rod is arranged at the top of the other end of the cross rod, and the contact is arranged at the top of one of the L-shaped frames; the transfer fixture comprises a rotating motor, a second lifting device and a first telescopic device, wherein one end of the first telescopic device is provided with a clamping structure, and the clamping structure comprises two clamping plates and a second telescopic device; the bearing mechanism comprises two flat racks and two conveying belts, and the tops of the flat racks are provided with baffle plates. The moving distance of the semiconductor chip template is controlled, and the error of the semiconductor chip in the alignment process is reduced.
Description
Technical Field
The invention relates to the technical field of chip preparation, in particular to a semiconductor chip template transfer device.
Background
The bulk transfer of semiconductor chips is a difficult point in the chip manufacturing process, the semiconductor chips are firstly arrayed on an original substrate, then the original substrate of the semiconductor chips is attached to a target substrate, and then the original substrate is peeled off, so that the semiconductor chips are transferred to the target substrate.
Disclosure of Invention
In order to solve the defects of the prior art, the invention provides a semiconductor chip template transfer device, which controls the moving distance of a semiconductor chip template through the matching of a plurality of induction parts, reduces the error of a semiconductor chip in the alignment process and simultaneously picks out unqualified semiconductor chip templates.
In order to realize the purpose of the invention, the following scheme is adopted:
a semiconductor chip template transfer device is provided, wherein a limiting groove is arranged at the top of a semiconductor chip template, a T-shaped plate is arranged at the bottom of the semiconductor chip template, and the transfer device comprises a direction detection mechanism, a transfer clamp and a bearing mechanism.
The direction detection mechanism comprises two L-shaped frames, a blocking structure and an induction structure, the distance between the two L-shaped frames is set according to a semiconductor chip template, the semiconductor chip template is in sliding fit with the L-shaped frames, the blocking structure is positioned at one end of the two L-shaped frames, the blocking structure comprises a turbine, a worm, a first rotating motor and a stop plate which coaxially rotates with the turbine, the worm is arranged at the top of the first rotating motor, the stop plate is used for stopping the semiconductor chip template through the fit of the turbine and the worm, the induction structure comprises a transverse rod and a contact which are controlled by a first lifting device, the bottom of one end of the transverse rod is provided with a limiting block, the limiting block is matched with a limiting groove, the top of the other end of the transverse rod is provided with an induction rod, the contact is arranged at the top of one of the L-shaped frames, and the induction rod is positioned right above the contact;
the transfer fixture sequentially comprises a second rotating motor, a second lifting device and a first telescopic device from bottom to top, one end of the first telescopic device is provided with a clamping structure, the clamping structure comprises two clamping plates and a second telescopic device used for adjusting the distance between the clamping plates, and the clamping structure is used for clamping a T-shaped plate;
the bearing mechanism is perpendicular to the L-shaped frame in arrangement direction and comprises two flat racks and two conveyor belts, the flat racks and the conveyor belts are respectively located on two sides of the transfer fixture, the tops of the flat racks are provided with baffle plates, and the distance between the two baffle plates is arranged according to the semiconductor chip template.
Further, in first elevating gear located door-shaped frame, door-shaped frame includes horizon bar and two vertical poles, and two L type frame outsides are located respectively to vertical pole, and the hypomere of one of them vertical pole is equipped with the vertical bar and runs through the groove, and the upper segment is equipped with the through hole, and the horizontal pole is connected to response pole one end, and the other end is located the vertical bar and runs through the inslot, and response pole and vertical bar run through groove sliding fit, and in the through hole was located to the horizon bar, and horizon bar and through hole sliding fit.
Furthermore, a third telescopic device and a plurality of horizontal sliding rods are arranged on the outer side of one of the L-shaped frames, and the horizontal sliding rods are used for guiding the L-shaped frames to move horizontally.
Furthermore, a fourth telescopic device is arranged on the outer side of each baffle, lugs are arranged at the bottom of each baffle, a sliding groove is formed in the top of each flat plate frame, the lugs are arranged in the sliding grooves, and the lugs are in sliding fit with the sliding grooves.
Furthermore, the turbine is arranged on one of the L-shaped frames, one end of the stop baffle rotates coaxially with the turbine, the other end of the stop baffle is arranged to be a free end, one end of the other L-shaped frame is provided with a clamping groove, and the free end is arranged in the clamping groove.
Furthermore, the vertical distance between the induction rod and the cross rod is equal to the thickness of the limiting block.
Furthermore, the vertical section of the T-shaped plate is irregular, and the shape of the vertical section is matched with the clamping part of the clamping plate.
Furthermore, the distance between the two conveyor belts is larger than that of the T-shaped plate and smaller than that of the semiconductor chip template.
The invention has the beneficial effects that:
1. in order to ensure the accuracy of the semiconductor chip template during movement, the prior art is usually realized by a plurality of push rods, the semiconductor chip template is provided with a limiting groove, the error of the semiconductor chip in the alignment process is further reduced by the matching of the limiting block and the limiting groove, and the semiconductor chip template can be stopped at a preset position by a blocking structure.
2. The induction structure is arranged, and if the induction rod can touch the contact after the cross rod descends, the second rotating motor transfers the semiconductor chip template to the flat plate frame to carry out a normal flow; if the induction rod can not touch the contact, the second rotating motor transfers the semiconductor chip template to the conveyor belt, so that the semiconductor chip template with problems is picked out.
3. The invention can be matched with semiconductor chip templates with more specifications, has strong applicability, for example, a vertical strip-shaped through groove and a through hole are arranged on a door-shaped frame, when the distance between two L-shaped frames is adjusted through a third telescopic device, an induction rod is in sliding fit with the vertical strip-shaped through groove, a horizontal rod is in sliding fit with the through hole, and a flat plate frame can also adjust the distance through a fourth telescopic device.
Drawings
FIG. 1 is an overall structural view of the embodiment;
FIG. 2 is a top view of the transfer device of an embodiment;
FIG. 3 is a top view of an exemplary semiconductor die template;
FIG. 4 is a diagram of an embodiment of a semiconductor chip template underside structure;
FIG. 5 is a lower structural view of a direction detecting mechanism and a transfer jig of the embodiment;
FIG. 6 is a view showing the structure of a gate frame of the embodiment;
FIG. 7 is a structural view of a barrier structure of the embodiment;
FIG. 8 is an enlarged view of a portion of I in FIG. 7;
fig. 9 is a partial enlarged view of iii in fig. 7.
Detailed Description
As shown in fig. 1, in order to reduce errors of the semiconductor chip in the alignment process and improve the yield of the product, as shown in fig. 3 and 4, a limiting groove 41 is disposed at the top of the semiconductor chip template, and a T-shaped plate 42 is disposed at the bottom of the semiconductor chip template, and accordingly, a semiconductor chip template transfer device is provided, which includes a direction detection mechanism 1, a transfer fixture 2, and a bearing mechanism 3.
Specifically, direction detection mechanism 1 includes two L type framves 5, blocks structure 6 and response structure 7, and the semiconductor chip template is placed on L type frame 5, and the interval of two L type framves 5 still is equipped with the catch bar according to the setting of semiconductor chip template on L type frame 5, and the semiconductor chip template is at translation on L type frame 5 under the drive of catch bar, semiconductor chip template and the sliding fit of L type frame 5.
Specifically, as shown in fig. 7 and 8, the blocking structure 6 is located at one end of the two L-shaped frames 5, the vertical section of the T-shaped plate 42 is disposed toward the blocking structure 6, the blocking structure 6 includes a worm wheel 61, a worm 62, a first rotating motor 63, and a stop plate 64 that rotates coaxially with the worm wheel 61, the worm 62 is disposed on the top of the first rotating motor 63, and the stop plate 64 rotates from horizontal to vertical through the cooperation of the worm wheel 61 and the worm 62, so as to stop the semiconductor chip template.
Specifically, the sensing structure 7 includes a cross bar 72 and a contact 73 controlled by the first lifting device 71, the bottom of one end of the cross bar 72 is provided with a limit block 74, the limit block 74 is matched with the limit groove 41, the top of the other end of the cross bar is provided with a sensing rod 75, the contact 73 is arranged on the top of one of the L-shaped frames 5, the sensing rod 75 is located right above the contact 73, and the length of the cross bar 72 cannot be greater than the distance between the two L-shaped frames 5.
Through the above manner, when the first semiconductor chip template moves to the stop plate 64 and stops, the first lifting device 71 lowers the cross bar 72, and if the limit block 74 is completely matched with the limit groove 41, the displacement of the semiconductor chip template meets the requirement, because the vertical distance between the sensing rod 75 and the cross bar 72 is equal to the thickness of the limit block 74, the sensing rod 75 just touches the contact 73, then the first rotating motor 63 rotates, and the stop plate 64 rotates from the horizontal state to the vertical state along with the rotation, so that the semiconductor chip template is exposed.
More specifically, as shown in fig. 9, in order to improve the degree of fit of the worm wheel 61, the worm 62 and the stop plate 64, the worm wheel 61 is disposed on one of the L-shaped frames 5, one end of the stop plate 64 rotates coaxially with the worm wheel 61, the other end is a free end 641, one end of the other L-shaped frame 5 is disposed with the slot 53, the free end 641 is disposed in the slot 53, and when the stop plate 64 is engaged in the slot 53, the first rotating motor 63 stops rotating.
Concretely, it includes second rotating electrical machines 21 in proper order to shift anchor clamps 2 from the bottom up, second elevating gear 22 and first telescoping device 23, the one end of first telescoping device 23 is equipped with clamping structure 24, clamping structure 24 includes two splint 25 and is used for adjusting the second telescoping device 26 of splint 25 interval, splint 25 is used for centre gripping T shaped plate 42, in order to improve splint 25's stability, T shaped plate 42's vertical section sets up to irregularly shaped, correspondingly, splint 25's clamping part shape and T shaped plate 42 phase-match, adjust opening and shutting of two splint 25 through second telescoping device 26, first telescoping device 23 adjusts clamping structure 24's the flexible, second elevating gear 22 adjusts clamping structure 24's height.
During the use, open two splint 25 earlier, then extend clamping structure 24 to semiconductor chip template below, contact the horizontal section of T shaped plate 42 when the front end of splint 25, then first telescoping device 2 stops, and with splint 25 clip T shaped plate 42, later lift up the semiconductor chip template, take out the semiconductor chip template from L type frame 5.
Specifically, as shown in fig. 2, the loading mechanism 3 is arranged in a direction perpendicular to the L-shaped frame 5, the loading mechanism 3 includes two pallets 8 and two conveyor belts 9, the pallets 8 and the conveyor belts 9 are respectively located at two sides of the transfer jig 2, a baffle 81 is arranged at the top of the pallet 8, and the distance between the two baffles 81 is set according to the semiconductor chip template.
If the contact 73 can be touched by the sensing bar 75 before, the second rotary motor 21 transfers the semiconductor chip template to the pallet 8, and if the contact 73 cannot be touched by the sensing bar 75, the second rotary motor 21 transfers the semiconductor chip template to the conveyor 9.
More specifically, as shown in fig. 5, a third telescopic device 51 and a plurality of horizontal sliding rods 52 are arranged on the outer side of one of the L-shaped frames 5, the horizontal sliding rods 52 are used for guiding the L-shaped frames 5 to move horizontally, so that the stability of the L-shaped frames 5 is improved, the distance between the two L-shaped frames 5 can be adjusted through the third telescopic device 51, and thus, the applicability is stronger when the semiconductor chip templates of more specifications are matched.
More specifically, as shown in fig. 6, the first lifting device 71 is disposed in the door-shaped frame 11, the door-shaped frame 11 includes a horizontal rod 12 and two vertical rods 13, the vertical rods 13 are respectively disposed outside the two L-shaped frames 5, a vertical bar-shaped through slot 14 is disposed at a lower section of one of the vertical rods 13, a through hole 15 is disposed at an upper section of the one of the vertical rods 13, one end of the sensing rod 75 is connected to the horizontal rod 72, the other end of the sensing rod is disposed in the vertical bar-shaped through slot 14, the horizontal rod 12 is disposed in the through hole 15, when a distance between the two L-shaped frames 5 is changed, the sensing rod 75 is slidably engaged with the vertical bar-shaped through slot 14, and the horizontal rod 12 is slidably engaged with the through hole 15.
More specifically, a fourth expansion device 85 is arranged on the outer side of each baffle plate 81, the fourth expansion device 85 is also used for adjusting the distance between the two baffle plates 81 so as to match with semiconductor chip templates with more specifications, a lug 82 is arranged at the bottom of each baffle plate 81, a sliding groove 83 is arranged at the top of each flat plate 8, the lug 82 is arranged in the sliding groove 83, and the stability of the baffle plates 81 in the distance adjusting process can be improved through the sliding fit of the lug 82 and the sliding groove 83.
More specifically, in order to make the conveyor belts 9 match with semiconductor chip templates of more specifications, the distance between the two conveyor belts 9 is only required to be larger than the T-shaped plates 42 and smaller than the semiconductor chip templates, in this embodiment, the conveyor belts 9 are used for bearing non-compliant semiconductor chip templates, the pallet 8 is used for bearing qualified semiconductor chip templates, and the power sources of all the lifting devices and the stretching devices in this embodiment may be air cylinders, oil cylinders, and the like.
When in use: the semiconductor chip template moves to the stop plate 64 and stops; the first lifting device 71 lowers the cross bar 72; after several seconds, the cross bar 72 is lifted, the first rotating motor 63 rotates, and the stop plate 64 rotates from the horizontal state to the vertical upward state to expose the semiconductor chip template; the two clamping plates 25 are opened, the clamping structure 24 extends to the lower part of the semiconductor chip template, the front ends of the clamping plates 25 contact the transverse section of the T-shaped plate 42, and the first telescopic device 2 stops; the clamping plate 25 clamps the T-shaped plate 42, then lifts the semiconductor chip template, and pulls the semiconductor chip template away from the L-shaped frame 5; if the sensing bar 75 can touch the contact 73 after the front cross bar 72 is lowered, the second rotary motor 21 transfers the semiconductor chip template to the pallet 8; if the sensing bar 75 does not touch the contact 73, the second rotary motor 21 transfers the semiconductor chip template to the conveyor 9.
The above embodiments are only for illustrating the technical ideas and features of the present invention, and are not meant to be exclusive or limiting of the present invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.
Claims (8)
1. A semiconductor chip template transfer device is characterized in that a limiting groove (41) is formed in the top of a semiconductor chip template, a T-shaped plate (42) is arranged at the bottom of the semiconductor chip template, and the transfer device comprises a direction detection mechanism (1), a transfer clamp (2) and a bearing mechanism (3);
the direction detection mechanism (1) comprises two L-shaped frames (5), a blocking structure (6) and an induction structure (7), the distance between the two L-shaped frames (5) is set according to a semiconductor chip template, the semiconductor chip template is in sliding fit with the L-shaped frames (5), the blocking structure (6) is positioned at one end of the two L-shaped frames (5), the blocking structure (6) comprises a turbine (61), a worm (62), a first rotating motor (63) and a stopping plate (64) coaxially rotating with the turbine (61), the worm (62) is arranged at the top of the first rotating motor (63), the stopping plate (64) is used for stopping the semiconductor chip template through the matching of the turbine (61) and the worm (62), and the induction structure (7) comprises a cross rod (72) and a contact (73) controlled by a first lifting device (71), a limiting block (74) is arranged at the bottom of one end of the cross rod (72), the limiting block (74) is matched with the limiting groove (41), an induction rod (75) is arranged at the top of the other end of the cross rod, the contact (73) is arranged at the top of one of the L-shaped frames (5), and the induction rod (75) is positioned right above the contact (73);
the transfer fixture (2) sequentially comprises a second rotating motor (21), a second lifting device (22) and a first telescopic device (23) from bottom to top, one end of the first telescopic device (23) is provided with a clamping structure (24), the clamping structure (24) comprises two clamping plates (25) and a second telescopic device (26) used for adjusting the distance between the clamping plates (25), and the clamping structure (24) is used for clamping the T-shaped plate (42);
the bearing mechanism (3) is arranged in a direction perpendicular to the L-shaped frame (5), the bearing mechanism (3) comprises two flat racks (8) and two conveyor belts (9), the flat racks (8) and the conveyor belts (9) are respectively located on two sides of the transfer fixture (2), a baffle (81) is arranged at the top of each flat rack (8), and the distance between the two baffles (81) is set according to the semiconductor chip template.
2. The semiconductor chip template transfer device according to claim 1, wherein the first lifting device (71) is disposed in a portal frame (11), the portal frame (11) comprises a horizontal rod (12) and two vertical rods (13), the vertical rods (13) are respectively disposed outside the two L-shaped frames (5), a vertical strip-shaped through groove (14) is disposed on a lower section of one of the vertical rods (13), a through hole (15) is disposed on an upper section of the vertical rod, one end of the sensing rod (75) is connected to the horizontal rod (72), the other end of the sensing rod is disposed in the vertical strip-shaped through groove (14), the sensing rod (75) is slidably fitted in the vertical strip-shaped through groove (14), the horizontal rod (12) is disposed in the through hole (15), and the horizontal rod (12) is slidably fitted in the through hole (15).
3. The semiconductor chip template transfer device according to claim 2, wherein a third telescopic device (51) and a plurality of horizontal sliding rods (52) are arranged on the outer side of one of the L-shaped frames (5), and the horizontal sliding rods (52) are used for guiding the L-shaped frames (5) to move horizontally.
4. A semiconductor chip template transfer device according to claim 3, wherein a fourth expansion device (85) is arranged on the outer side of each baffle plate (81), a lug (82) is arranged on the bottom of the baffle plate, a sliding groove (83) is arranged on the top of each pallet (8), the lug (82) is arranged in the sliding groove (83), and the lug (82) is in sliding fit with the sliding groove (83).
5. The semiconductor chip template transfer device according to any one of claims 1 to 4, wherein the worm gear (61) is disposed on one of the L-shaped frames (5), one end of the stop plate (64) rotates coaxially with the worm gear (61), the other end is provided with a free end (641), one end of the other L-shaped frame (5) is provided with a slot (53), and the free end (641) is disposed in the slot (53).
6. The semiconductor chip template transfer device according to any one of claims 1 to 4, wherein a vertical distance between the sensing bar (75) and the cross bar (72) is equal to a thickness of the stopper (74).
7. The semiconductor chip template transfer device according to any one of claims 1 to 4, wherein vertical sections of the T-shaped plate (42) are provided in an irregular shape, the vertical sections being shaped to match with the clamping portions of the clamping plates (25).
8. The semiconductor chip template transfer device according to any one of claims 1 to 4, wherein the distance between the two conveyor belts (9) is larger than the T-shaped plate (42) and smaller than the semiconductor chip template.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110673674.8A CN113436993A (en) | 2021-06-17 | 2021-06-17 | Semiconductor chip template transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110673674.8A CN113436993A (en) | 2021-06-17 | 2021-06-17 | Semiconductor chip template transfer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113436993A true CN113436993A (en) | 2021-09-24 |
Family
ID=77756325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110673674.8A Withdrawn CN113436993A (en) | 2021-06-17 | 2021-06-17 | Semiconductor chip template transfer device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113436993A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113976460A (en) * | 2021-12-29 | 2022-01-28 | 天津金海通半导体设备股份有限公司 | Self-interacting shutoff door detects smooth device of chip |
-
2021
- 2021-06-17 CN CN202110673674.8A patent/CN113436993A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113976460A (en) * | 2021-12-29 | 2022-01-28 | 天津金海通半导体设备股份有限公司 | Self-interacting shutoff door detects smooth device of chip |
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Application publication date: 20210924 |