CN115976619A - Electroplating device and method for adjusting distribution of electroplating cathodes and anodes - Google Patents
Electroplating device and method for adjusting distribution of electroplating cathodes and anodes Download PDFInfo
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- CN115976619A CN115976619A CN202211698456.0A CN202211698456A CN115976619A CN 115976619 A CN115976619 A CN 115976619A CN 202211698456 A CN202211698456 A CN 202211698456A CN 115976619 A CN115976619 A CN 115976619A
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Abstract
The application is suitable for the technical field of electroplating, and provides an electroplating device and a method for adjusting the distribution of electroplating cathodes and anodes, wherein the electroplating device comprises: a plurality of anodes, cathodes, a plurality of sleeves, a hanger and a power supply; the anodes are in a long strip shape, and a plurality of anodes are hung on the hanger; the length of the anode in the vertical direction is greater than that in the horizontal direction when the anode is hung on the hanger; the length of the plurality of anodes in the vertical direction is different; the sleeve box is in the same shape as the anode, is in contact connection with the anode and is used for being sleeved outside the specific anode; the specific anode is an anode corresponding to the target area of the cathode; the target area is an area where the thickness of the nickel layer of the cathode exceeds a preset threshold; the surface of the sleeve box is provided with a through hole which is used for adjusting the exposed area of the anode; the power supply is used for providing electric energy for the electroplating process. The method of the present application can improve the uniformity of electroplated nickel.
Description
Technical Field
The application belongs to the technical field of electroplating, and particularly relates to an electroplating device and method for adjusting distribution of electroplating cathodes and anodes.
Background
In the electroplating industry, the electroplating uniformity is an important index for inspecting the quality of a plating layer and the capacity of a plating tank, a nickel layer in nickel-gold electroplating of a precise electronic component has the effect of improving the protective performance, the requirement on the thickness has a direct effect on improving the antirust capacity, and the phenomenon that the product size exceeds the standard when the thickness is excessively thick can be caused. The antirust function is required to meet the minimum requirement of the thickness of the plating layer, and the size requirement and other problems cannot be exceeded. Therefore, the uniformity of the electroplated nickel has a special practical significance.
The uniformity of electroplated nickel is related to the current distribution, and the distance, size and shape of the cathode and anode affect the current distribution. The current distribution is dense, so the coating is thick and other parts are thin, if the method for improving the phenomenon generally adjusts the distribution of the power lines by adjusting the design of the anode baffle, the structure of the anode baffle is generally a fixed anode with large area at present, the baffle is added between the anode and the cathode, but the thickness of the nickel layer cannot reach 1-4 microns, and the problem that the coating thickness is unqualified for the product with clear requirement of the coating in the range of 1-4 microns is the main problem.
Disclosure of Invention
In order to overcome the problems in the related art, the embodiment of the application provides an electroplating device and an electroplating method for adjusting the distribution of electroplating cathodes and anodes, which can improve the uniformity of electroplating nickel and solve the problem that the thickness of a nickel layer cannot reach 1-4 microns.
The application is realized by the following technical scheme:
in a first aspect, an embodiment of the present application provides an electroplating apparatus for adjusting distribution of electroplating cathodes and anodes, including: a plurality of anodes, cathodes, a plurality of sleeves, a hanger and a power supply;
the anodes are in a strip shape, and a plurality of anodes are hung on the hanger; the length of the anode in the vertical direction is greater than that in the horizontal direction when the anode is hung on the hanger; the length of the plurality of anodes in the vertical direction is different;
the sleeve box is in the same shape as the anode, is in contact connection with the anode and is used for being sleeved on the outer side of the anode opposite to the region of the cathode, the thickness of the nickel layer of which exceeds a preset threshold value; the surface of the sleeve box is provided with a through hole which is used for adjusting the exposed area of the anode;
the power supply is used for providing electric energy for the electroplating process.
In one possible implementation, the through-hole is located on the first surface of the sleeve; the first surface is opposite to the cathode during electroplating.
In one possible implementation, the sum of the open areas of the through holes of the plurality of sleeves is n times the area of the cathode; wherein n is more than or equal to 2.
In one possible implementation, the sleeve is a material that is resistant to acid and alkali corrosion.
In a possible implementation, the same product of the cathode is located at the same distance from the anode.
In one possible implementation, the anode comprises a nickel cake and a strip-shaped titanium basket; each titanium basket is filled with a preset number of nickel cakes.
In a possible implementation mode, the hanging tool is an adjustable structure and is used for adjusting the position of the lower end of the sleeve box at the anode.
In a second aspect, the present application provides a method for adjusting a distribution of an electroplating cathode and anode, comprising:
preparing a plurality of strip-shaped anodes, and hanging the anodes on a hanger; the length of the anode in the vertical direction is greater than that in the horizontal direction when the anode is hung on the hanger; the anode comprises a strip-shaped nickel cake and a strip-shaped titanium basket;
a sleeve box which is the same as the anode in shape is sleeved outside the titanium basket of the anode; the surface of the sleeve box is provided with a through hole;
and a power supply is utilized to provide electric energy for the electroplating process to carry out electroplating.
In a possible implementation mode, a sleeve box which is the same as the anode in shape is sleeved outside a titanium basket of the anode, and the sleeve box comprises: a sleeve box which is the same as the anode in shape is sleeved on the outer side of the titanium basket of the anode, and an adjusting sleeve box is sleeved in a preset area; the preset area is the area of the cathode where the thickness of the nickel layer exceeds the preset threshold value and is opposite to the shielding anode.
In one possible embodiment, the length of the nickel cake which is to be shielded from the anode is in the range of the length of the cathode
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It is understood that the beneficial effects of the second aspect can be referred to the related description of the first aspect, and are not described herein again.
Compared with the prior art, the embodiment of the application has the advantages that:
in the embodiment of the application, in the distribution of the anodes, the anodes are designed into a plurality of long anodes, the length of the anodes is inconsistent, and the anodes correspond to cathodes with different plating thicknesses, so that more dense electric lines are distributed to a region with a thinner plating thickness to achieve the purpose of increasing the thickness; sleeving a sleeve on the surface of the anode, covering the anode opposite to the cathode region with thicker thickness, and reducing the thickness of a plating layer to enable the thickness of a nickel layer to reach 1-4 microns; the thickness of the region with the thicker plating layer is reduced by increasing the thickness of the region with the thinner plating layer, and the uniformity of the electroplated nickel is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the specification.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic structural diagram of an electroplating apparatus for adjusting electroplating cathode and anode distribution according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of the distribution of electric field lines after anode length adjustment according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram of the distance from the anode to the same location of the same product of the cathode provided by an embodiment of the present application;
FIG. 4 is a graph showing the thickness distribution of nickel layer of a product electroplated by a conventional apparatus according to an embodiment of the present application;
FIG. 5 is a graph illustrating a nickel layer thickness distribution of a product electroplated by an electroplating apparatus for adjusting a cathode and anode profile of electroplating according to an embodiment of the present application.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It should also be understood that the term "and/or" as used in this specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items and includes such combinations.
As used in this specification and the appended claims, the term "if" may be interpreted contextually as "when", "upon" or "in response to a determination" or "in response to a detection". Similarly, the phrase "if it is determined" or "if a [ described condition or event ] is detected" may be interpreted contextually to mean "upon determining" or "in response to determining" or "upon detecting [ described condition or event ]" or "in response to detecting [ described condition or event ]".
Furthermore, in the description of the present application and the appended claims, the terms "first," "second," "third," and the like are used for distinguishing between descriptions and not necessarily for describing or implying relative importance.
Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather mean "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless otherwise specifically stated.
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Fig. 1 is a schematic structural diagram of an electroplating apparatus for adjusting electroplating cathode and anode distribution according to an embodiment of the present application, and referring to fig. 1, the electroplating apparatus for adjusting electroplating cathode and anode distribution may include: a plurality of anodes 100, cathodes 200, a plurality of cartridges 300, a hanger 400, and a power source 500.
The anodes 100 are elongated, the plurality of anodes 100 are hung on the hanger 400, and the length of the anodes 100 in the vertical direction when hung on the hanger 400 is greater than the length of the anodes in the horizontal direction, and the plurality of anodes 100 have different lengths in the vertical direction. The cartridge 300 has the same shape as the anode 100 and is connected in contact with the anode 100 for being inserted outside a specific anode 100, which is an anode corresponding to a target region of the cathode 200, which is a region where the thickness of the nickel layer of the cathode 200 exceeds a preset threshold value. The cartridge 300 has a through hole 301 formed on a surface thereof, and the through hole 301 is used to adjust an exposed area of the anode 100. The power supply 500 is used to provide power for the electroplating process.
And (3) connecting a power supply 500 with the anode 100 and the cathode 200, carrying out an electroplating process, wherein when the thickness of a part of nickel layer of a product suspended on the cathode 200 exceeds a preset threshold value during electroplating, sleeving the anode opposite to the region with the thickness of the nickel layer exceeding the preset threshold value with a sleeve box, and realizing the purpose of adjusting the thickness of the nickel layer. The anode opposite to the area where the thickness of the nickel layer exceeds the preset threshold value is the specific anode.
Wherein, the anode 100 comprises a nickel cake and a strip-shaped titanium basket; each titanium basket is filled with a preset number of nickel cakes.
For example, the typical anode 100 shielding plate is a fixed large-area structure, which is placed between the anode 100 and the cathode 200, and the thickness of the coating of the product is too different in practical production, and the coating thickness is not qualified. The present invention splits the entire large area anode 100 into several elongated anodes 100 in terms of distribution. The length of each anode 100 may be different, that is, the density of the nickel cakes filled in the anode 100 may be different, and more nickel cakes are filled in the region where the cathode 200 is thinner, so that the denser electric field lines are distributed to the region where the cathode is thinner for the purpose of increasing the thickness, as shown in fig. 2.
For example, in the embodiment of the present application, an anode 100 shielding plate is not additionally installed between the anode 100 and the cathode 200, but the surface of the anode 100 is covered with a sleeve 300 that is resistant to acid and alkali corrosion, so as to shield the anode 100 opposite to the region with the thicker thickness, and the exposed length of the anode 100 can be adjusted to 1/3 to 1/2 of the height of the cathode 200, so that the denser electric lines of force are distributed to the region with the thinner thickness, and the purpose of increasing the thickness is achieved.
Specifically, the hanger 400 is an adjustable structure for adjusting the position of the lower end of the sleeve 300 at the anode 100.
Illustratively, the hanger 400 includes a portion that is stationary relative to the ground and a portion that can move up and down. The cartridge 300 is fixed to a portion that is stationary with respect to the ground, and the anode 100 is fixed to a portion that can move up and down. The relative position of the anode 100 and the sleeve 300 is realized by adjusting the part of the hanger 400 which can move up and down, so that the lower end of the sleeve 300 is positioned at any position of the anode 100, and the purpose of adjusting the exposed length of the anode 100 is further achieved.
The sleeve 300 and the anode 100 may have the same shape and the same length.
For example, the lower end of the sleeve 300 may be located at any position of the anode 100 by adjusting the lifting of the structure of the hanger 400 connected to the anode 100, so as to adjust the exposed length of the anode 100.
Specifically, through holes 301 may be formed in the surface of the cartridge 300, and the open area of the through holes 301 may be designed through calculation and experimental data. The through-hole 301 is located at a first surface of the cartridge 300; the first surface is opposite to the cathode 200 when electroplating. Thereby adjusting the exposed area of the anode 100 to be adapted to the area of the cathode 200, which is beneficial to improving the uniformity of the plating layer.
Specifically, the sum of the open areas of the through holes 301 of the cartridges 300 may be n times the area of the cathode 200; wherein n is more than or equal to 2. The open area is determined by calculating the proportion of the exposed area of the anode, so that the thickness of the plating layer is in a required range.
Illustratively, the shape of the through-hole 301 is not limited to a circle, and may be determined according to the shape of an actual plated product.
Specifically, the sleeve 300 may be a material resistant to acid and alkali corrosion.
Illustratively, the same product of the cathode 200 is located at the same distance from the anode 100. For example, for a product with an irregular shape, the same position of the same product is ensured to be equidistant from the anode 100, i.e., H1, H2 and H3 are equal, and L1, L2 and L3 are equal, as shown in fig. 3, so that the plating difference of the same product is within a required range.
For example, the electroplating device for adjusting the distribution of the electroplating cathode and the electroplating anode can be applied to the process of electroplating nickel or electroplating gold.
Illustratively, the nickel electroplating experiment is respectively carried out on the same product by using a common device and the electroplating device of the invention, so that the actual nickel cake consumption is the same, when the electroplating device of the invention is used for electroplating, the height of the nickel cake is adjusted in the debugging process, the curve of the nickel layer is adjusted to be stable, the experimental results of the coating thickness of 16 products are shown in fig. 4 and fig. 5, and the nickel thickness of the product electroplated by the invention is more uniform. Wherein, FIG. 4 is a diagram of the thickness distribution of the nickel layer of the product electroplated by the conventional device, and FIG. 5 is a diagram of the thickness distribution of the nickel layer of the product electroplated by the electroplating device for adjusting the distribution of the electroplating cathode and anode of the present invention.
Therefore, in the electroplating device for adjusting the distribution of the electroplating cathodes and the anodes, the anodes 100 are distributed on the anode 100, and the anodes 100 are designed into a plurality of long anodes 100, so that the lengths of the anodes 100 are inconsistent and correspond to the cathodes 200 with different plating thicknesses, and more dense electric lines are distributed to the region with thinner plating thickness to achieve the purpose of increasing the thickness; the sleeve 300 is sleeved on the surface of the anode 100, the anode 100 opposite to the cathode 200 with thicker thickness is shielded, and the thickness of the plating layer is reduced, so that the thickness of the nickel layer reaches 1-4 microns; the thickness of the region with the thicker plating layer is reduced by increasing the thickness of the region with the thinner plating layer, and the uniformity of the electroplated nickel is improved.
The embodiment of the application provides a method for adjusting distribution of electroplating cathodes and anodes, which comprises the following steps: preparing a plurality of elongated anodes 100 to be hung on a hanger 400; the length of the anode 100 in the vertical direction when it is hung on the hanger 400 is greater than the length in the horizontal direction; the anode 100 includes a strip-shaped nickel cake and a strip-shaped titanium basket. A sleeve box 300 which is the same as the anode 100 in shape is sleeved on the outer side of the titanium basket of the specific anode 100, and the sleeve box 300 is in contact connection with the anode 100; the specific anode 100 is an anode corresponding to a target region of the cathode 200; the target area is the area where the thickness of the nickel layer of the cathode 200 exceeds a preset threshold; the sleeve 300 has a through hole 301 formed on the surface thereof. The power supply 500 is used to provide power for the electroplating process to perform electroplating.
Specifically, a sleeve 300 having the same shape as the anode 100 is sleeved outside the titanium basket of the specific anode 100, and the sleeve comprises: a sleeve 300 which is the same as the anode 100 in shape is sleeved outside the titanium basket of the specific anode 100, and the lower end of the sleeve 300 is adjusted to be positioned at the position of the specific anode 100.
Specifically, the length of the nickel cake exposed at a particular anode 100 ranges from the length of the cathode 200
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It can be understood that, the beneficial effects of the method for adjusting the distribution of the electroplating cathode and anode can be referred to the related description of the embodiment of the apparatus for adjusting the distribution of the electroplating cathode and anode, and will not be described herein again.
It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.
The above-mentioned embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the embodiments of the present application, and they should be construed as being included in the present application.
Claims (10)
1. An electroplating apparatus for adjusting distribution of an electroplating cathode and an electroplating anode, comprising: a plurality of anodes, cathodes, a plurality of sleeves, a hanger and a power supply;
the anodes are in a strip shape, and the anodes are hung on the hanger; the length of the anode in the vertical direction is greater than that in the horizontal direction when the anode is hung on the hanger; the plurality of anodes have different lengths in the vertical direction;
the sleeve is in the same shape as the anode, is in contact connection with the anode and is used for being sleeved outside the specific anode; the specific anode is an anode corresponding to a target region of the cathode; the target region is a region where the thickness of the nickel layer of the cathode exceeds a preset threshold value; the surface of the sleeve box is provided with a through hole, and the through hole is used for adjusting the exposed area of the anode;
the power supply is used for providing electric energy for the electroplating process.
2. The electroplating apparatus for adjusting electroplating cathode and anode profiles as recited in claim 1 wherein said through-holes are located on a first surface of said cartridge; the first surface is opposite to the cathode when electroplating.
3. The electroplating apparatus for adjusting electroplating cathode and anode distribution as recited in claim 1, wherein the sum of the open areas of the through holes of said plurality of sleeves is n times the area of said cathode; wherein n is more than or equal to 2.
4. The electroplating apparatus for adjusting the distribution of the electroplating cathode and anode according to claim 1, wherein the sleeve is made of a material resistant to acid and alkali corrosion.
5. The electroplating apparatus for modifying the distribution of electroplating cathodes and anodes as recited in claim 1 wherein the same product of said cathode is located equidistant from said anodes.
6. The electroplating apparatus for adjusting the distribution of the electroplating cathodes and anodes as recited in claim 1, wherein the anodes comprise a nickel cake and a strip-shaped titanium basket;
and a preset number of nickel cakes are filled in each titanium basket.
7. The electroplating apparatus for adjusting the distribution of anodes and cathodes in accordance with claim 1, wherein the hanger is an adjustable structure for adjusting the position of the lower end of the sleeve at the anode.
8. A method of adjusting the distribution of an electroplating cathode and anode, comprising:
preparing a plurality of strip-shaped anodes, and hanging the anodes on a hanger; the length of the anode in the vertical direction is greater than that in the horizontal direction when the anode is hung on the hanger; the anode comprises a strip-shaped nickel cake and a strip-shaped titanium basket;
sleeving a sleeve box which is the same as the anode in shape on the outer side of the titanium basket of the specific anode; the specific anode is an anode corresponding to a target region of the cathode; the target area is an area where the thickness of the nickel layer of the cathode exceeds a preset threshold value; the surface of the sleeve box is provided with a through hole;
and a power supply is utilized to provide electric energy for the electroplating process to carry out electroplating.
9. The method for adjusting distribution of electroplating cathodes and anodes as claimed in claim 8, wherein the step of sleeving a sleeve box with the same shape as the anode on the outer side of the titanium basket of a specific anode comprises the following steps:
and sleeving a sleeve box which is the same as the anode in shape on the outer side of the titanium basket of the specific anode, and adjusting the lower end of the sleeve box to be positioned at the position of the specific anode.
10. The method for adjusting electroplating cathode and anode profile as recited in claim 9 in which the specific anode is exposed to a nickel cake length in the range of cathode length
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211698456.0A CN115976619A (en) | 2022-12-28 | 2022-12-28 | Electroplating device and method for adjusting distribution of electroplating cathodes and anodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211698456.0A CN115976619A (en) | 2022-12-28 | 2022-12-28 | Electroplating device and method for adjusting distribution of electroplating cathodes and anodes |
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| Publication Number | Publication Date |
|---|---|
| CN115976619A true CN115976619A (en) | 2023-04-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211698456.0A Pending CN115976619A (en) | 2022-12-28 | 2022-12-28 | Electroplating device and method for adjusting distribution of electroplating cathodes and anodes |
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| CN (1) | CN115976619A (en) |
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