CN115968101A

CN115968101A - Substrate packaging method with low-height electronic component

Info

Publication number: CN115968101A
Application number: CN202211250141.XA
Authority: CN
Inventors: 朱建晓
Original assignee: Suzhou Konig Electronic Technology Co ltd
Current assignee: Suzhou Konig Electronic Technology Co ltd
Priority date: 2021-10-13
Filing date: 2022-10-12
Publication date: 2023-04-14

Abstract

The application discloses a substrate packaging method with a low-height electronic component, and relates to the technical field of circuit board packaging. The height of the electronic component relative to the substrate is lower than 5mm; the packaging method comprises the following steps: and controlling a glue spraying assembly with a plurality of independently controlled spray holes to linearly reciprocate along a horizontal direction and spraying packaging glue solution to the substrate in a manner that the spray holes vertically face the horizontally placed substrate until a packaging layer which covers the substrate and has a thickness of more than 0.05mm and covers the target electronic component is formed. The substrate packaging method with the low-height electronic component is suitable for reliable packaging of the substrate.

Description

Substrate packaging method with low-height electronic component

Technical Field

The specification relates to the technical field of circuit board packaging, in particular to a substrate packaging method with a low-height electronic component.

Background

The PCBA (Printed Circuit Board + Assembly) Board is packaged by a plurality of methods, such as coating three-proofing paint on the surface layer of the Circuit Board, potting, low-pressure injection molding and the like. Each of the above methods has its own advantages and disadvantages: the direct spraying of the three-proofing paint is simple, convenient and easy to realize, but cannot really protect the circuit board, cannot realize water resistance and shock resistance, and can cause packaging failure after a long time; the encapsulation is complex in operation, low in efficiency, high in cost and poor in reliability; and (2) low-pressure injection molding, namely, the circuit board is packaged by using low-pressure injection molding equipment and adjusting corresponding glue injection pressure and time through a special mold.

Disclosure of Invention

In view of the deficiencies of the prior art, it is an object of the present specification to provide a method for packaging a substrate with low height electronic components that is suitable for reliable packaging of the substrate.

In order to achieve the above object, embodiments of the present specification provide a substrate packaging method with a low-height electronic component, wherein the height of the electronic component relative to the substrate is less than 5mm; the packaging method comprises the following steps:

and controlling a glue spraying assembly with a plurality of independently controlled spray holes to linearly reciprocate along a horizontal direction and spraying packaging glue solution to the substrate in a manner that the spray holes vertically face the horizontally placed substrate until a packaging layer which covers the substrate and has a thickness of more than 0.05mm and covers the target electronic component is formed.

As a preferred embodiment, the substrate includes a display region and a peripheral region, the peripheral region is located at the periphery of the display region and connected to the display region; the electronic component is positioned in the display area; the encapsulation layer comprises an encapsulant; the packaging method comprises the following steps:

and forming the encapsulating body at the periphery of at least part of the display area, wherein at least part of the encapsulating body is formed by spraying a light-cured resin material layer by layer and curing.

As a preferred embodiment, the step of forming an encapsulating body at the periphery of at least a part of the display region includes:

forming a first frame portion at the periphery of the display area;

forming a second frame portion inside the first frame portion; the first frame portion and/or the second frame portion are formed by spraying light-cured resin materials layer by layer and curing.

In a preferred embodiment, the first frame portion is formed by spraying a photocurable resin material layer by layer and curing the resin material, and the step of forming the second frame portion on the inner side of the first frame portion includes:

forming a first fence on the surface of the display area, wherein the first fence is formed by spraying a light-cured resin material layer by layer and curing;

and spraying a light-cured resin material between the first rail and the first frame part layer by layer to be cured to form the second frame part.

In a preferred embodiment, the first frame portion is formed by spraying a photocurable resin material layer by layer and curing the photocurable resin material, and the step of forming the second frame portion on the inner side of the first frame portion includes:

and spraying a plurality of layers of light-cured resin materials between the first rail and the first frame part, and then curing to form the second frame part.

forming a second fence at the periphery of the display area, wherein the second fence is formed by spraying a light-cured resin material layer by layer and curing;

and spraying multiple layers of light-cured resin materials between the display area and the second fence, and curing to form a frame body.

As a preferred embodiment, the display area includes a bent electric element, and a gap is formed between an inner surface of the bent electric element and the display area; the step of forming an encapsulating body at the periphery of at least a part of the display region includes:

spraying a plurality of layers of light-cured resin material between the display area and the second fence, wherein at least part of the light-cured resin material flows into the gap to form a filling structure;

and curing the light-cured resin material between the display area and the second fence, wherein the outer side of the electric element forms a frame body.

As a preferred embodiment, the display area comprises a bent electric element, and a gap is formed between the inner surface of the bent electric element and the display area; the step of forming an encapsulating body at the periphery of at least a part of the display region includes:

spraying a light-cured resin material on the periphery of the display area layer by layer to be cured to form a first frame part;

spraying a plurality of layers of light-cured resin materials between the first rail and the first frame part, wherein at least part of the light-cured resin materials flow into the gap to form a filling structure;

and curing the light-curing resin material between the first frame part and the first rail, wherein the outer side of the electric element forms a second frame part.

As a preferred embodiment, the substrate includes a display region and a peripheral region, the peripheral region being located at the periphery of the display region and connected to the display region; the electronic component is positioned in the display area; the display area is of a multilayer structure, the multilayer structure comprises an FPC, and a bending part is formed at the edge of the multilayer structure after the FPC is bent; the encapsulation layer includes an encapsulant surrounding a periphery of at least a portion of the display area; the packaging method comprises the following steps:

and controlling a glue spraying assembly with a plurality of independently controlled spray holes to linearly reciprocate along a horizontal direction and spraying photocuring packaging glue solution towards the bent part by the spray holes vertically to form the packaging body for packaging at least part of the bent part inside.

In a preferred embodiment, the electronic component includes a plurality of light-emitting portions arranged in an array on the substrate; each of the light emitting parts includes at least one LED chip; the maximum height of the LED chip on the substrate is lower than 1mm; the packaging method comprises the following steps:

and controlling an array type spray head with a plurality of spray holes which can be independently controlled to spray light-curable packaging glue solution towards the light-emitting part on the substrate which is horizontally placed in a manner of horizontal linear reciprocating movement until a packaging body for coating the light-emitting part is formed.

The embodiment of the specification provides a display module, which comprises a display area, a peripheral area and an encapsulating body;

the peripheral region is positioned at the periphery of the display region and connected with the display region, the encapsulating body surrounds at least part of the periphery of the display region, and at least part of the encapsulating body is formed by spraying a light-cured resin material layer by layer and curing.

In a preferred embodiment, the enclosure includes a frame, and at least a portion of the frame surrounds a periphery of the display area.

In a preferred embodiment, the frame body is connected to both the display area and the peripheral area.

In a preferred embodiment, one surface of the frame body is attached to the peripheral region in a thickness direction of the display module, and the other surface of the frame body protrudes from the display region.

In a preferred embodiment, the projection of the frame covers the projection of the peripheral area in the thickness direction of the display module.

In a preferred embodiment, the frame body includes a first frame portion and a second frame portion connected to each other, and the first frame portion is located at the periphery of the second frame portion; in the thickness direction of the display module, one surface of the first frame portion is attached to the peripheral region, and one surface of the second frame portion is attached to the display region.

In a preferred embodiment, the other surface of the first frame portion and the other surface of the second frame portion are aligned and connected to each other in a thickness direction of the display module, and the frame body is stepped.

As a preferred embodiment, the enclosure includes a filling structure, the filling structure is located inside the frame, and the filling structure is connected to the display area.

As a preferred embodiment, the display area comprises a folded electrical element, the frame is located outside the electrical element, and the filling structure is located inside the electrical element.

In a preferred embodiment, the frame is attached to the peripheral region and to an outer surface of the electric element where the electric element is bent.

In a preferred embodiment, a gap is formed between the inner surface of the electric element where the electric element is bent and the display area, and the filling structure fills the gap.

As a preferred embodiment, the outermost layer of the display module is a glass cover plate, and the glass cover plate is used for providing the peripheral area; the display area is of a multi-layer structure and protrudes out of the glass cover plate, and the innermost layer of the display area is an electric element used for controlling the display module.

As a preferred embodiment, the envelope encloses the sides of the multilayer structure, the envelope being ring-shaped.

In a preferred embodiment, the envelope completely encloses the side of the multilayer structure and the side facing away from the glass cover plate, and covers the surface of the multilayer structure exposed to the glass cover plate.

To achieve the above object, an embodiment of the present specification further provides a novel electronic device, including:

a display module; the display module comprises a display area, a peripheral area and an encapsulating body; the peripheral area is positioned at the periphery of the display area and is connected with the display area, the encapsulating body surrounds at least part of the periphery of the display area, and at least part of the encapsulating body is formed by spraying a light-cured resin material layer by layer and curing;

a bonding body is arranged between the frame and at least part of the enclosing body at intervals; the bonding body is respectively bonded and fixed with the frame and the encapsulating body.

In a preferred embodiment, the enclosure includes a receptacle and a filling structure, the filling structure is located inside the receptacle, the receptacle is in contact with the frame, and the filling structure is isolated from the frame.

a frame;

and the bonding body is arranged between the frame and the packaging body of the display module and is used for fixedly connecting the display module with the frame.

In order to achieve the above object, an embodiment of the present specification further provides a method for packaging a display module, where the display module includes a display area and a peripheral area, and the peripheral area is located on the periphery of the display area and connected to the display area; the packaging method comprises the following steps:

and forming an encapsulating body on the periphery of at least part of the display area, wherein at least part of the encapsulating body is formed by spraying a light-cured resin material layer by layer and curing.

As a preferred embodiment, the step of forming an encapsulating body at the periphery of at least a part of the display area includes:

forming a first frame portion at the periphery of the display area;

and spraying multiple layers of light-cured resin materials between the first rail and the first frame part, and then curing to form the second frame part.

forming a second rail on the periphery of the display area, wherein the second rail is formed by spraying a light-cured resin material layer by layer and curing;

As a preferred embodiment, the display area comprises a bent electric element, and a gap is formed between the inner surface of the bent electric element and the display area; the step of forming an encapsulating body at the periphery of at least a part of the display area includes:

As a preferred embodiment, the display area includes a bent electric element, and a gap is formed between an inner surface of the bent electric element and the display area; the step of forming an encapsulating body at the periphery of at least a part of the display area includes:

spraying a plurality of layers of light-cured resin materials between the first rail and the first frame part, and enabling at least part of the light-cured resin materials to flow into the gap to form a filling structure;

and curing the light-curable resin material between the first frame portion and the first rail, and forming a second frame portion outside the electric element.

In order to achieve the above object, an embodiment of the present disclosure further provides a package structure for protecting a bending portion of an FPC, including a display area, a peripheral area, and an encapsulation body;

the display area is of a multilayer structure, the multilayer structure comprises an FPC, and a bending part is formed at the edge of the multilayer structure after the FPC is bent; the peripheral area is located at the periphery of the display area and connected with the display area, the encapsulating body surrounds at least part of the periphery of the display area, at least part of the encapsulating body is formed by spraying a light-cured resin material layer by layer for curing, and the encapsulating body encapsulates at least part of the bending part.

In order to achieve the above object, an embodiment of the present disclosure further provides a packaging method for protecting a bending portion of an FPC, where the packaging structure includes a display area, a peripheral area, and an encapsulation body; the display area is of a multilayer structure, the multilayer structure comprises an FPC, and a bending part is formed at the edge of the multilayer structure after the FPC is bent; the peripheral area is positioned at the periphery of the display area and is connected with the display area, and the enclosing body surrounds at least part of the periphery of the display area; the packaging method comprises the following steps:

and controlling an array type spray head with a plurality of spray holes which can be independently controlled to spray photocuring packaging glue solution towards the bent part in a horizontal linear reciprocating movement mode to form the packaging body which packages at least part of the bent part inside.

Has the advantages that:

the substrate packaging method with the low-height electronic component provided by the embodiment can control the glue spraying assembly to linearly reciprocate in the horizontal direction and spray the packaging glue solution to the substrate in a mode that the spray holes vertically face the horizontally placed substrate, can form the packaging layer which covers the packaging substrate and coats the electronic component inside, and is suitable for reliable packaging of the substrate with the low-height electronic component.

According to the substrate packaging method with the low-height electronic component, provided by the embodiment of the disclosure, the array type spray head can be controlled to spray the photocuring packaging glue solution towards the light emitting part on the horizontally placed substrate in a horizontal linear reciprocating movement mode until the packaging body for coating the light emitting part is formed, and the substrate packaging method is suitable for reliable packaging of the substrate with the low-height LED chip. The packaging method can greatly improve the packaging efficiency by adopting the array type spray heads, and the packaging efficiency can be improved by more than 2 times and even can be improved by more than 3 times through actual tests.

According to the substrate packaging method with the low-height electronic component, the actual position of the substrate in the packaging station can be obtained, the actual position is compared with the reference position to obtain the offset data of the actual position, the array type spray head is controlled to spray the glue solution to the target packaging area of the substrate according to the offset data, the actual position of the substrate is not required to be located at a certain specific position, the substrate packaging method is suitable for reliable packaging of the substrate, and the substrate can be efficiently and accurately packaged.

According to the substrate packaging method with the low-height electronic component, the packaging layer surrounding at least part of the periphery of the display area is arranged, and at least part of the packaging layer is formed by spraying the light-cured resin material layer by layer and curing, so that the packaging method of the display module can be simplified, and the working efficiency and the yield are high.

Specific embodiments of the present invention are disclosed in detail with reference to the following description and drawings, indicating the manner in which the principles of the invention may be employed. It should be understood that the embodiments of the invention are not so limited in scope.

Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.

It should be emphasized that the term "comprises/comprising" when used herein, is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic diagram of a substrate packaging apparatus provided by an embodiment of the present disclosure;

FIG. 2 is a schematic view of the internal glue-spraying assembly and the working table of FIG. 1;

FIG. 3 is a partial schematic view of FIG. 2;

FIG. 4 is a front view of FIG. 3;

FIG. 5 is a schematic structural view of the glue-spraying assembly of FIG. 2;

FIG. 6 is a schematic diagram illustrating an arrangement of orifices of a piezo array showerhead, according to an embodiment of the present disclosure;

FIG. 7 is a schematic view of an arrangement of orifices of a piezo array nozzle provided by another embodiment of the present disclosure;

FIG. 8 is a schematic view of the glue-spraying process of FIG. 1;

fig. 9 is a schematic diagram of a fence type packaged chip of a substrate packaging method according to an embodiment of the disclosure;

fig. 10 is a schematic diagram of a separately sprayed fence of a substrate encapsulation method according to an embodiment of the present disclosure;

fig. 11 is a glue-spraying information picture of a substrate packaging method according to an embodiment of the disclosure;

fig. 12 is a fence glue-spraying information picture of a substrate packaging method according to another embodiment of the disclosure;

fig. 13 is a drawing of a land fill paste information for a substrate packaging method according to another embodiment of the present disclosure;

fig. 14 is a schematic pitch diagram of a curing light source and an array head of a substrate packaging apparatus provided by an embodiment of the present disclosure;

fig. 15 is a flowchart of a substrate packaging method provided by an embodiment of the present disclosure;

fig. 16 is a flowchart of a substrate packaging method according to another embodiment of the disclosure;

fig. 17 is a flowchart of a substrate packaging method according to yet another embodiment of the disclosure;

FIG. 18 is a schematic view of the glue-spraying process of FIG. 1;

fig. 19 is a schematic diagram of a fence type packaging structure of a SiP module packaging method according to an embodiment of the disclosure;

fig. 20 is a schematic diagram of a fence printed separately by a method for packaging a SiP module according to an embodiment of the present disclosure;

fig. 21 is a glue-spraying information picture of a packaging method of the SiP module according to an embodiment of the present disclosure;

fig. 22 is a fence glue-spraying information picture of a packaging method of a SiP module according to another embodiment of the present disclosure;

fig. 23 is a filling and spraying information picture of a SiP module packaging method according to another embodiment of the disclosure;

fig. 24 is a schematic cross-sectional structure diagram of an encapsulated SiP module according to an embodiment of the present disclosure;

FIG. 25 is a schematic view of another glue-spraying process of FIG. 1;

FIG. 26 is a schematic view of yet another glue dispensing process of FIG. 1;

fig. 27 is a top view of a COB package module according to an embodiment of the present disclosure;

fig. 28 is a side view of a COB package module according to an embodiment of the present disclosure;

fig. 29 is a top view of a COB package module according to another embodiment of the present disclosure;

FIG. 30 is a schematic view of a connection of an adhesive supply assembly provided by one embodiment of the present disclosure;

fig. 31 is a schematic structural view of an intermediate flow mechanism provided in an embodiment of the present disclosure;

FIG. 32 is a schematic perspective view of a curing device according to an embodiment of the present disclosure;

FIG. 33 is a schematic view of the internal structure of a curing device according to an embodiment of the present disclosure;

FIG. 34 is a schematic structural view of an LED lamp and a first lifting assembly provided by one embodiment of the present disclosure;

fig. 35 is a schematic structural view of a mercury lamp and a second lift assembly provided in one embodiment of the present disclosure;

fig. 36-42 are photographs of the package of the packaging apparatus of fig. 1 for Mini LED packaging experiments;

fig. 43 is a schematic structural view of a first display module provided in this embodiment;

fig. 44 is a schematic structural view of a second display module provided in this embodiment;

fig. 45 is a schematic partial structure view of a third display module provided in this embodiment;

fig. 46 is a partial schematic structural view of a fourth display module provided in this embodiment, which does not include an encapsulating body;

FIG. 47 is a schematic view of the structure of FIG. 46 including an enclosure;

fig. 48 is a schematic structural view of a frame body provided in the present embodiment;

fig. 49 is a schematic structural view of a filling structure provided in this embodiment;

FIG. 50 is a partial schematic view of an enclosure according to the present embodiment;

fig. 51 is a schematic structural diagram of a novel electronic device provided in this embodiment.

Description of the reference numerals:

1. an apparatus housing; 2. an observation window; 3. an equipment door; 4. an equipment support; 5. mounting a platform; 6. a support frame; 7. a support plate; 10. spraying a glue component; 11. a spray head; 12. a glue solution input joint; 13. a glue solution output joint; 15. a first moving assembly; 16. a positioning part; 20. a curing light source; 21. a water-cooled input joint; 22. a water-cooled output joint; 23. a power supply connector; 25. mounting a plate; 30. a work table; 35. a second moving assembly; 36. a rotating assembly;

113. a group of spray holes; 114. spraying a hole row; 115. spraying a glue panel; 116. spraying a hole; 117. a spacer section; f1, a first direction; f2, a second direction; x, horizontal direction;

100. a substrate; 110. an electronic component; 111. a first device; 112. a second device; 120. a fence; 130. a leveling portion; 101. a ground color region; 102. a predetermined color region; 140. a packaging layer; 150. a conductive layer; 160. an LED chip; 170. a package body; 180. a light emitting section;

40. a glue supply assembly; 41. a first accommodating chamber; 42. a second accommodating chamber; 43. a first negative pressure source; 44. a second negative pressure source; 45. a first drive pump; 46. a second drive pump; 47. a glue solution container; 48. a filter;

50. a middle circulation mechanism; 51. a curing device; 52. a first case; 53. an LED lamp; 531. a first sensor; 532. a second sensor; 54. a first lifting assembly; 541. a first threaded lead screw; 542. a first connection block; 543. a first bracket; 55. a second case; 56. mercury lamps; 57. a second lifting assembly; 571. a second threaded screw; 572. a second connecting block; 573. a second bracket; 58. a heat sink; 59. a bearing part; 510. an opening;

300. a display module; 61. a display area; 62. a peripheral region; 63. an enclosure; 64. an electrical element; 65. a void; 66. a frame body; 661. a first frame portion; 662. a second frame portion; 67. filling the structure; 8. a first fence; 9. a second fence; 610. a multi-layer structure; 611. a glass cover plate; 612. an adhesive body; 613. a frame; 200. a novel electronic device; y, thickness direction; l3, a first straight line.

Detailed Description

In order to make those skilled in the art better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a single embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1 to 5, one embodiment of the present disclosure provides a substrate packaging apparatus. The substrate packaging apparatus is suitable for protection packaging of the electronic component 110 on the substrate 100. In particular, the substrate packaging device is suitable for electronic packaging of low-height thin or surface mounted PCBA boards. The substrate 100 may be a PCBA board, a substrate 100 of a SiP module, a substrate 100 of a COB package module, etc.

Specifically, the maximum height of the electronic component 110 with respect to the surface of the substrate 100 (PCB) is less than 1cm. Further, the maximum height of the electronic component 110 relative to the surface of the substrate 100 is less than 5mm. Further, the maximum height of the electronic component 110 relative to the surface of the substrate 100 is less than 0.5mm.

The electronic component 110 may be a plurality of light emitting sections 180 arranged in an array. Specifically, the maximum height of the electronic component 110 with respect to the surface of the substrate 100 (PCB) is less than 1cm. Further, the maximum height of the electronic component 110 relative to the surface of the substrate 100 is less than 0.5mm. Each light emitting part 180 includes at least one LED chip 160. The maximum height of the LED chip 160 in the substrate 100 is less than 1mm. Further, the maximum height of the LED chip 160 at the substrate 100 is less than 0.5mm. Further, the maximum height of the LED chip 160 at the substrate 100 is less than 0.3mm. The size of the LED chip 160 is less than 300 μm, and further less than 200 μm. Mini LED backlight board or Micro LED backlight board belongs to PCBA.

In this embodiment, the substrate packaging apparatus includes: the glue spraying assembly 10, the first moving assembly 15 and the workbench 30. The table 30 is provided on the equipment stand 4. The equipment rack 4 has a mounting platform 5 on which a table 30 is mounted. The mounting platform 5 is provided with a support frame 6 for supporting the first moving assembly 15. The support frame 6 supports the glue spraying assembly 10 and the first moving assembly 15 across the mounting platform 5, and forms a gantry-like mechanism. A supporting plate 7 is supported on the supporting frame 6, and a first moving assembly 15 is fixedly arranged on the front plate surface of the supporting plate 7.

Encapsulation equipment has equipment housing 1, spouts gluey subassembly 10, first removal subassembly 15, workstation 30 and is located equipment housing 1, avoids environmental impurity to enter into the glue solution in influence encapsulation quality. An observation window 2 is arranged above the equipment shell 1 to observe the packaging condition of the substrate 100, and after the substrate is packaged, the equipment door 3 where the observation window 2 is located can be opened through a handle, so that the substrate 100 is removed and a new substrate 100 is sent in. A storage door is arranged below the equipment shell 1, and a storage space is formed on the inner side of the storage door.

The glue-spraying assembly 10 has a plurality of spray holes 116 for independently controlling spraying. The first moving assembly 15 is connected with the glue spraying assembly 10. The first moving assembly 15 is used for driving the glue spraying assembly 10 to linearly reciprocate along a first horizontal direction. The table 30 is located below the nozzle hole 116. The table 30 is lower in height than the nozzle holes 116. The stage 30 has a placing surface for placing the substrate 100.

The glue spraying component 10 is fixedly provided with at least one array spray head 11. The array nozzle 11 is provided with a glue solution input joint 12 and a glue solution output joint 13 to be communicated with a glue solution storage box. Each array nozzle 11 is communicated with a glue solution storage box in a one-to-one correspondence way through a glue solution input joint 12 and a glue solution output joint 13. Each array head 11 is independently supplied with glue.

As shown in fig. 3, 4 and 5, the glue-spraying assembly 10 includes two

array heads

11a and 11b. The two

array heads

11a, 11b are arranged in a first horizontal direction. The height position of the glue spraying assembly 10 in the packaging equipment is unchanged. The array head 11 is a piezoelectric array head 11. The array nozzle 11 has a glue spraying panel 115, and a plurality of parallel nozzle holes 114 are distributed on the glue spraying panel 115, that is, a plurality of parallel nozzle holes 116 are distributed on the glue spraying panel 115. As shown in fig. 7, each orifice row 114 has a plurality of independently injection-controlled orifices 116 arranged in the first direction F1. The plurality of nozzle hole rows 114 are arranged in a second direction F2 perpendicular to the first direction F1.

As shown in fig. 6 and 7, in the nozzle hole row 114, a hole spacer 117 is provided between two adjacent nozzle holes 116. At least one orifice spacer 117 is at least partially aligned with at least one orifice 116 in another orifice row 114 along the second direction F2. Further, the hole spacer 117 is centrally aligned with a nozzle hole 116 along the second direction F2. The projection of the plurality of nozzle hole rows 114 on the glue-spraying panel 115 along the second direction F2 forms a complete straight line, so that the plurality of nozzle hole rows 114 can mutually supplement the non-glue-spraying point positions during glue spraying to form linear glue spraying.

In this way, the orifices 116 of one orifice row 114a and the orifice spacers 117 of the other orifice row 114b of the two adjacent orifice rows 114 are aligned in the second direction F2, and the orifices 116 are staggered from each other. Thus, the hole spacing portion 117 of the nozzle hole row 114a is compensated by the nozzle holes 116 of the adjacent nozzle hole row 114b in the second direction F2 (the traveling direction of the nozzle 11, i.e., the first horizontal direction), which not only reduces the size of the nozzle holes 116, increases the number of the nozzle holes 116, and increases the accuracy of the glue spraying position, but also avoids the occurrence of un-glue-spraying points, so that the glue spraying is more uniform, and the packaging quality is improved. Wherein the first direction F1 is perpendicular to the first horizontal direction. The second direction F2 is parallel to the first horizontal direction.

As shown in fig. 5 and 14, the glue spraying assembly 10 is further fixedly provided with a curing light source 20. The curing light source 20 is an LED lamp with the wavelength of 365-395 nm. UV energy of 8000mW/cm ³ . The curing light source 20 has a curing depth of 100 to 3000 μm. The curing light source 20 is located on at least one side of the glue-spraying assembly 10 in the first horizontal direction. The light emitting surface of the curing light source 20 is oriented perpendicular to the stage 30. The curing light source 20 is further provided with a water-cooling heat dissipation structure. The light emitting surface of the curing light source 20 is arranged vertically downward. The curing light source 20 is provided with a water-cooling input connector 21 and a water-cooling output connector 22. A power supply connector 23 (cable connector) is arranged between the water-cooling input connector 21 and the water-cooling output connector 22 to input electric energy.

As shown in fig. 4 and 5, the curing light sources 20 are respectively disposed on two sides of the glue spraying assembly 10 in the first horizontal direction. The lower end of the glue-spraying assembly 10 has a horizontal mounting plate 25. Two curing

light sources

20a, 20b (UV lamps) are respectively mounted on the mounting plate 25 at the same level (at the same height) as the array head 11. When moving along the first horizontal direction, the curing light source 20 at the rear side of the moving direction of the glue spraying assembly 10 can be started to realize the following curing after glue spraying, and the glue spraying and curing are simultaneously carried out.

As shown in fig. 14, in order to have a better curing effect and avoid the curing light source 20 from affecting the ejection of the glue solution (mainly avoid the liquid droplet being cured before contacting the substrate 100), the horizontal distance L5 between the curing light source 20 and the array head 11 is greater than 5cm. The horizontal spacing L5 between the curing light source 20 and the array head 11 is within 15 cm.

The glue-spraying assembly 10 is further provided with a positioning portion 16 for positioning the substrate 100. As shown in fig. 4, the positioning portion 16 is fixed to one side of the glue spraying assembly 10 in the first horizontal direction. Facing fig. 4, the positioning portion 16 is fixed to the right side of the glue-jet assembly 10, adjacent to the right-side curing light source 20. The curing light source 20 does not interfere with the positioning portion 16. Specifically, the positioning portion 16 includes a visual positioning component. For example, the positioning part 16 includes a CCD vision positioning system. The substrate 100 has a specific location point (Mark point) or a predetermined electronic component 110 that can be recognized by the visual positioning assembly. The positioning unit 16 positions a specific position point or a predetermined electronic component 110, and the stage 30 is adjusted according to the positioning conditions, thereby precisely adjusting the substrate 100 to a predetermined glue-spraying position. In other embodiments, the positioning portion 16 may also be an ultrasonic positioning device.

In the present embodiment, the first moving assembly 15 includes a lead screw module. The lead screw module is provided with a servo motor and a lead screw driven by the servo motor to rotate. The screw module is provided with a slide block sliding along the screw. The glue spraying assembly 10 comprises a glue spraying support fixedly connected with the sliding block, and the glue spraying assembly 10 moves linearly and reciprocally along with the sliding block. The glue spraying component 10 forms a glue spraying support of the glue spraying shell, the plurality of array spray heads 11 are fixed in the glue spraying shell, or the array spray heads 11 are fixedly arranged at the bottom of the glue spraying support facing downwards, a glue spraying panel 115 of the array spray heads 11 is a horizontal panel, and spray holes 116 are vertically downward and perpendicular to the workbench.

In other embodiments, the first movement assembly 15 comprises an electric cylinder, a linear guide. The glue spraying assembly 10 comprises a glue spraying bracket which is slidably arranged on the linear guide rail and is driven by the electric cylinder to do reciprocating linear motion along the linear guide rail; the array nozzle 11 is fixedly arranged on the glue spraying bracket.

The moving speed of the spray head 11 is too fast, the error after curing is larger, but the speed of the spray head 11 is too low, the curing effect of the glue solution and the packaging efficiency are not expected, and in order to avoid the problems, in the glue spraying process, the moving speed of the glue spraying assembly 10 is controlled to be lower than 50mm/s, further, the moving speed of the glue spraying assembly 10 is controlled to be lower than 30mm/s, and further, the moving speed of the glue spraying assembly 10 is controlled to be lower than 20mm/s.

In this embodiment, the packaging apparatus further includes: a rotating assembly 36 and a second moving assembly 35. Wherein the rotation assembly 36 is used to drive the table 30 to rotate about a vertical axis. The second moving assembly 35 is used for driving the worktable 30 to move in a second horizontal direction perpendicular to the first horizontal direction. The table 30 is operably rotatably supported on a rotating assembly 36. The rotating assembly 36 may be a rotary servomotor, to the output of which the table 30 is connected, or the table 30 may be connected through a speed reducing mechanism such as a reducer.

The second moving assembly 35 can refer to the first moving assembly 15, and the repetition is not repeated. The rotating assembly 36 is disposed on the second moving assembly 35 and driven to move along a second horizontal direction. The rotating assembly 36 is moved in the second horizontal direction together with the table 30 by the second moving assembly 35, and can be positioned at a predetermined position.

Through the in-plane rotation and the height adjustment of workstation 30 to carry out the fine positioning with placing the base plate 100 on workstation 30, spout gluey position with base plate 100 adjustment to the regulation, conveniently realize the accuracy in the follow-up gluey in-process of spouting and spout gluey encapsulation. The position of the glue spraying component 10 in the second horizontal direction is fixed, and the glue spraying component can only do linear motion in the first horizontal direction. When the width of the substrate 100 is too large, the workbench 30 moves in the second horizontal direction when the spraying head 11 cannot finish spraying once, so that the glue spraying assembly 10 sprays glue to different areas of the substrate 100 in sequence, thereby realizing glue spraying protection of the large-area substrate 100.

In order to realize the automatic packaging and improve the production efficiency, in an embodiment, the packaging equipment further includes a control device connected to the glue spraying assembly 10 and the first moving assembly 15, and the control device can control the glue spraying assembly 10 to spray the UV glue solution to the target glue spraying area of the substrate in a linear reciprocating manner along the first horizontal direction.

In another embodiment, the packaging device further comprises an acquisition module for acquiring the information of the glue spraying area, and a control device connected with the glue spraying assembly 10, the first moving assembly 15 and the acquisition module. The control device can control the glue spraying assembly 10 to linearly reciprocate in a horizontal direction to spray the UV glue solution to the target glue spraying area of the substrate.

The acquisition module comprises a network transmission module, drawing software, drawing guide software, or a data transmission interface such as a USB interface and a type-C interface, and is used for inputting or importing the glue spraying information picture. The acquisition module can also comprise information input equipment such as a touch screen or a keyboard, so that the number of target glue spraying layers is input. The controller runs upper computer software.

One embodiment of the present disclosure provides a piezoelectric array nozzle 11 for packaging a substrate 100, wherein the nozzle 11 has a glue spraying panel 115, and a plurality of parallel nozzle rows 114 are distributed on the glue spraying panel 115. Each orifice row 114 has a plurality of independently injection-controlled orifices 116 arranged in the first direction F1. The multi-orifice rows 114 are arranged in a second direction F2 perpendicular to the first direction F1. In the nozzle hole row 114, a hole interval portion 117 is provided between two adjacent nozzle holes 116. At least one orifice spacer 117 is at least partially aligned with at least one orifice 116 in another orifice row 114 along the second direction F2.

The piezoarray nozzle 11 can be referred to with the nozzles in the above embodiments, and repeated descriptions are omitted.

One orifice 116 in one orifice row 114a is at least partially offset from the most adjacent orifice 116 in the other orifice row 114b in the second direction F2. In two

adjacent nozzle rows

114a, 114b, each nozzle 116 is staggered along the second direction F2. The nozzle rows 114 on both sides of one nozzle row 114 are aligned one by one along the second direction F2. The glue spraying panel 115 is provided with more than 5 rows of spray holes 116. Each orifice row 114 includes at least 50 orifices 116. Further, each orifice row 114 includes at least 100 orifices 116. The spacing between two orifices 116 is less than the orifice 116 diameter. Of course, there are embodiments in which the spacing between the orifices 116 is greater than the diameter of the orifices 116.

For the glue-spraying packaging of the substrate 100, the volume of the single drop of the spray hole 116 is 50 picoliters to 100 picoliters. Alternatively, the single glue spraying of the spray hole 116 is 50 picoliters to 100 picoliters. The continuous output of the glue solution is realized by the spray holes 116 through high-frequency glue spraying. Each spray hole 116 of the spray head 11 can spray more than 10000 times per second at most. Further, each orifice 116 of the nozzle 11 can inject up to 20000 injections per second.

As shown in fig. 7, two adjacent staggered nozzle hole rows 114 constitute a nozzle hole group 113. The glue-spraying panel 115 is arranged with a plurality of parallel nozzle hole groups 113 in the second direction F2. The plurality of

nozzle hole groups

113a, 113b are symmetrically arranged on the glue-spraying panel 115. Alternatively, the plurality of nozzle groups 113 are in a translating configuration. In the second direction F2, a spacing distance L1 between two adjacent

nozzle hole groups

113a, 113b is greater than a spacing distance L2 between two

nozzle hole rows

114a, 114b within the nozzle hole group 113. The hole spacer 117 is centrally aligned with an orifice 116 along the second direction F2.

One embodiment of the present disclosure provides a method of packaging a substrate. The packaging method is suitable for, but not limited to, low-height substrates. The substrate 100 may be a printed circuit board, and the electronic component 110 is disposed on the printed circuit board. The maximum height of the electronic component 110 relative to the surface of the Printed Circuit Board (PCB) is less than 1cm. Further, the maximum height of the electronic component 110 relative to the surface of the printed circuit board is less than 0.5mm, which is also suitable for the packaging method and apparatus of the present disclosure. The encapsulation method can be implemented by adopting the encapsulation equipment in the above embodiment.

Referring to fig. 8, the packaging method includes: and controlling the glue spraying assembly 10 to spray the UV glue solution to the target glue spraying area of the substrate in a linear reciprocating manner in a horizontal direction. The height position of the glue-dispensing assembly 10 does not change during the movement. The glue-spraying component 10 moves linearly back and forth at a height position. In the glue spraying process, the glue spraying assembly 10 sprays the UV glue solution to the target glue spraying area of the substrate in a linear reciprocating motion in a horizontal direction.

In the packaging method, the glue spraying assembly 10 is positioned at a position higher than the highest electronic component 110, and the distance between the glue spraying assembly 10 and the highest electronic component 110 is controlled to be less than 2mm. Further, the distance between the glue spraying assembly 10 and the highest electronic component 110 is controlled to be smaller than 1mm.

In order to avoid the interference between the electronic component 110 on the substrate and the moving path of the glue spraying assembly 10, the glue (glue drops) is scattered, and the distance between the glue spraying assembly 10 and the substrate is not easy to be too large. This spout gluey subassembly 10 adopts array shower nozzle 11 such as piezoelectric array shower nozzle 11, and the orifice is little, and the glue that jets out drips at first fast, but the speed damages equally fast, easily produces the problem of wafing, for avoiding this problem, controls spout gluey subassembly 10 and the interval between the highest electronic components 110 is less than 2mm, even within 1mm.

In the glue spraying process, the relative height of the glue spraying assembly 10 and the substrate is unchanged. In the glue spraying process, the glue spraying assembly 10 is controlled to move back and forth along a horizontal straight line to spray UV glue liquid to a target glue spraying area of the substrate until glue spraying and packaging are completed. The substrate is horizontally placed on the worktable 30, and the glue spraying assembly 10 is controlled to spray glue to the substrate on the worktable 30 in a manner that the spray holes vertically face the worktable 30.

Referring to fig. 8, one glue-spraying layer is formed by one linear single-pass movement of the glue-spraying assembly 10 (e.g., the nozzle 11 in fig. 8), and two glue-spraying layers are formed by one linear reciprocating movement. One linear back and forth movement of the glue dispensing assembly 10 includes two single passes. In the packaging method, further comprising the steps of: acquiring the number of target glue spraying layers; and controlling the glue spraying assembly 10 to linearly reciprocate in a horizontal direction to spray the UV glue solution to the target glue spraying area of the substrate until the target glue spraying area reaches the target glue spraying layer number.

In the packaging method, the substrate is horizontally placed on the stage 30. The substrate is provided with positioning points; the glue-spraying assembly 10 is provided with a positioning portion 16 for positioning the positioning point. In the packaging method, the glue spraying assembly 10 is moved, and the workbench 30 is controlled to move until the positioning point is located at a specified position according to the positioning condition of the positioning part 16 on the positioning point. The controller of the encapsulation device may be pre-set with the two-dimensional position of the anchor points.

In the packaging method, the glue spraying assembly 10 is controlled to spray UV glue solution with the viscosity of 5-25cP to the substrate. Further, the glue spraying assembly 10 is controlled to spray UV glue solution with the viscosity of 8-20cP to the substrate. In the packaging method, glue on the substrate is cured while spraying the glue on the substrate. Of course, in other embodiments, a single pass of movement performs the glue spray and a single pass of movement performs the curing in a single round trip. At this time, curing is performed after the glue is sprayed.

In one embodiment, as shown in fig. 15, the packaging method includes the steps of: s1, obtaining a glue spraying information picture carrying glue spraying area information; s2, identifying glue spraying area information of the glue spraying information picture to obtain a target glue spraying area of the substrate; and S3, controlling the glue spraying assembly 10 to spray UV glue liquid to a target glue spraying area of the substrate. Further, in the packaging method, the glue-spraying component 10 is controlled to linearly reciprocate in a horizontal direction to spray UV glue solution with the viscosity range of 5-25cP at 40-50 ℃ to the target glue-spraying area of the substrate.

The packaging equipment is provided with a controller for identifying the glue spraying information picture. The glue-sprayed information pictures are shown in fig. 11, 12 and 13. It should be noted that the dotted lines in fig. 11 to 13 are used to identify the boundaries of the pictures to distinguish from the page colors, and the dotted lines are not present in the actual pictures. The controller of the packaging equipment is provided with an identification module for identifying the glue spraying area information of the glue spraying information picture, and the identification module can be an identification software module running on upper computer software.

The glue spraying information picture is a two-dimensional picture. The glue spraying information picture carries two-dimensional glue spraying information corresponding to a target glue spraying area of the substrate. The glue spraying information picture and the two-dimensional plane structure of the substrate are in a certain proportional relation, and correspondingly, the position and the shape size of the glue spraying area information on the glue spraying information picture are in a certain proportional relation with the actual target glue spraying area. And after the identification, the glue spraying information picture is a bitmap. And pixel points of the glue spraying information picture correspond to different position points of the substrate one by one. The ground color area 101 is identified as a non-glue-spraying area, the predetermined color area 102 is identified as a target glue-spraying area, and the distribution position of the predetermined color area 102 relative to the ground color area 101 corresponds to the distribution position of the target glue-spraying area on the substrate. The shape size of the bitmap is in a predetermined proportional relationship with the shape size of the substrate. The glue spraying information picture is in a glue spraying area through a preset color. And drawing the glue spraying information picture according to the gerber picture of the substrate.

As shown in fig. 11, 12 and 13, the ground color is white or transparent, and the ground color area indicates that the area does not need to be packaged by spraying glue. The black area shows the shape and position of the glue spraying area, the positions of the pixels in the black area correspond to the actual glue spraying areas one to one, and then the corresponding position points of the substrate corresponding to the black pixels are subjected to glue spraying through recognizing the positions of the black pixels, so that accurate packaging can be achieved.

In one embodiment, the encapsulation process may be performed as direct spray coating, with the same thickness around and over the electronic component 110, such as a chip component. And for the upper surfaces of some chips needing to be avoided, the sprayed patterns are subjected to editing processing, so that areas needing no spraying are not sprayed with colors and are still marked as ground colors such as white. The packaging method is generally suitable for thin-layer protection, and the height of the electronic component 110 is below 0.5mm. In this embodiment, a glue-sprayed information picture as shown in fig. 11 is introduced, and the black glue-sprayed area of the glue-sprayed information picture in fig. 11 can be regarded as the black glue-sprayed area in fig. 12 overlapping the black glue-sprayed area in fig. 13. Each pixel point in the black glue-spraying area in fig. 11 covers not only the periphery of the electronic component 110 but also the top of the electronic component 110.

In another embodiment, as shown in fig. 8, 9, and 10, in the encapsulation method, the step of performing glue-spraying encapsulation on the target electronic component 110 is: s100, controlling the glue spraying assembly 10 to linearly reciprocate in a horizontal direction and spraying a first target glue spraying layer of UV glue solution to the periphery of the target electronic component 110 to form a rail 120 surrounding the target electronic component 110; s200, controlling the glue spraying assembly 10 to linearly reciprocate in the horizontal direction and spraying a second target number of glue spraying layers of UV glue solution to the surrounding area of the fence 120 to level the fence 120.

In order to improve the curing efficiency, the filled glue solution can be cured once after the fence 120 is filled. Of course, the glue spraying and curing can be performed simultaneously when the fence 120 is filled and leveled, and the glue spraying and curing can be performed layer by layer while the fence is filled and leveled. In the printing of the fence 120, the glue spraying is performed simultaneously with the curing.

As shown in fig. 9 and 10, in order to achieve a better effect of filling the fence 120, the minimum value of the wall thickness K of the fence 120 is 0.5mm, the maximum value of the height H of the fence 120 is 3mm, and the minimum value of the gap L of the fence 120 between the fence 120 and the electronic component 110 is 1mm. The edge of the protective layer after being packaged is flat and neat, the device is fully wrapped, and no sharp protrusion is arranged at the top.

Specifically, in the packaging method, the glue spraying encapsulation of the target electronic component 110 is performed as the following steps: s100, obtaining a glue spraying information picture carrying glue spraying area information of the fence 120 and a first target glue spraying layer number; s200, controlling the glue spraying assembly 10 to linearly reciprocate and spray a first target glue spraying layer number of UV glue solution to the periphery of the target electronic component 110 according to the glue spraying area information of the rail 120 to form the rail 120 surrounding the target electronic component 110; s101, obtaining a glue spraying information picture carrying information of a filling glue spraying area and a second target glue spraying layer number; s201, according to the filling glue spraying area information, controlling the glue spraying assembly 10 to spray a second target number of UV glue solutions to the fence 120 in a linear reciprocating manner in the horizontal direction to fill the fence 120. In step S100, a glue-sprayed information picture for the fence 120 shown in fig. 12 is introduced; in step S101, a filling glue information picture shown in fig. 13 is introduced. Step S201 is executed and cured to form the packaging effect shown in fig. 9, and the filling part 130 is filled on the fence 120.

In the process of spraying glue once when the glue spraying assembly 10 starts to move to stop moving, the glue spraying information picture for correspondingly controlling the glue spraying assembly 10 is one. And then corresponding glue spraying information pictures are led in or loaded when glue spraying is carried out on different areas or different substrates next time. Each glue-sprayed information picture can correspond to 1 or more substrates. Fig. 11 corresponds to the glue-spraying area information of one substrate, and when fig. 11 is introduced, only 1 substrate can be subjected to glue-spraying packaging. Fig. 12 and 13 correspond to the two

substrates

100a and 100b, respectively, and when fig. 12 or 13 is introduced, the two

substrates

100a and 100b may be packaged at the same time.

This embodiment is done through the mode that rail 120 combines to fill, carries out the multilayer spraying earlier around the chip and forms rail 120, fills glue again to rail 120 the inside after rail 120 height and chip height parallel and level, once only solidifies after the glue levelling, provides the protection of preferred for the higher chip of height.

For the printing and packaging of a substrate such as a test board, when a packaging mode of combining the rail 120 and filling is adopted, the upper computer software is led into fig. 12, the printing is set to be 40 layers, the glue spraying component 10 is started, and the glue spraying component 10 linearly reciprocates to spray 40 layers around a target patch element to form the rail 120. Fig. 13 is then introduced, set to 30 layers, then refilled with 30 layers, and finally cured to form a wrap-around shield on the target patch element as shown in fig. 9.

Still another embodiment of the present disclosure provides a substrate packaging UV glue solution suitable for the piezoelectric array nozzle 11. The viscosity range of the UV glue solution is 5-25cP at 40-50 ℃, the surface tension range is 20-40mN/m, the density range is 0.8-1.2g/cm & lt 3 & gt, and the pH value range is 6-8 (test paper test). Further, the viscosity range of the UV glue solution is 10-15cP, the surface tension range is 25-35mN/m, and the density range is 0.9-1.0g/cm3. The UV glue solution is colorless transparent or light yellow transparent glue solution (under visual inspection conditions).

The UV glue solution comprises acrylate resin (oligomer) with the concentration range of 10% -30%, acrylate monomer (reactive diluent) with the concentration range of 60% -80%, photoinitiator with the concentration range of 2% -10% and auxiliary agent with the concentration range of 0.05% -2%. The UV glue solution has 100% of solid content, has no solvent volatilization in the curing process, and has the characteristics of safety, health, environmental protection, no toxicity, no harm, no flammability, no explosion and the like.

The UV glue solution is a single-component ultra-low viscosity ultraviolet curing electronic packaging solvent-free glue solution. The UV glue solution can be cured within 10s under the irradiation condition of ultraviolet rays (365-395 nm) with certain wavelength. The cured UV glue solution has excellent performances of water resistance, moisture resistance, cold and heat shock resistance, mould resistance and the like, and is suitable for protecting PCBA welding spots, pins or discrete components which are pasted on various surfaces.

The UV glue solution has an ultralow viscosity characteristic, is suitable for selectively spraying and covering the substrate 100 by adopting an ink-jet spraying mode of the piezoelectric array nozzle 11, can emit fluorescence under ultraviolet light after being cured, and is convenient for packaging effect inspection.

In this embodiment, the photoinitiator mainly includes a radical photoinitiator and a cationic photoinitiator. In the UV glue solution, an auxiliary agent (additive) is added to meet the use requirement, and the auxiliary agent can be pigment, wetting dispersant, polymerization inhibitor and the like. The effect of various auxiliary agents is obvious, which not only can obviously improve the UV performance, but also can enlarge the application range and reduce the cost.

Preferably, the auxiliary agent can be an inorganic nano material, so that the performance of the cured protective layer is improved, and the toughening performance is enhanced. The nano SiO2 is added into the UV glue solution, so that the bonding performance and the sealing effect are greatly improved. Specifically, the CYA-150 nano silicon dioxide is selected as an auxiliary agent, and when the mass fraction is 2%, the adhesive strength of the adhesive can be obviously improved.

The UV glue solution provided by the embodiment forms a UV curing protective layer after curing, and the UV curing protective layer has better mechanical and thermal properties. Specifically, the breaking strength of the UV-cured protective layer at 25 ℃ is 5.4Mpa, and the breaking elongation is 140%. The elastic modulus of the UV curing protective layer is 25.2Mpa. The glass transition temperature of the UV-cured protective layer is-15 ℃. The linear thermal expansion coefficient is 21.8 ppm/DEG C in the range of-15 ℃ to 0 ℃ and 240.9 ppm/DEG C in the range of 45 ℃ to 80 ℃.

Meanwhile, the UV curing protective layer also has excellent electrical properties, the dielectric constant of the UV curing protective layer is 5.47 (1 GHz), and the breakdown strength under the test condition of the thickness of 1.5mm is 15.8kV/mm. The volume resistivity of the UV-curable protective layer was 3.1X 1014. Omega. Cm without being soaked in water, and 1.7X 1014. Omega. Cm with being soaked in water at 23 ℃ for 168 hours. The UV-cured protective layer had a surface resistance of 4.21X 1010. Omega. At 250V.

The UV cured protective layer also has excellent environmentally reliable properties. The surface of the UV curing protective layer has no obvious change, no bubble, no rust, no crack and no peeling after being tested for 1000 hours in the environment of 85 ℃/85 and RH, and the UV curing protective layer has better high temperature and high humidity resistance. And performing a thermal shock resistance test at a switching temperature of-40 ℃/30min to 1min to 80 ℃/30min (wherein the switching temperature time of 1 minute, namely, heat preservation is performed for 30 minutes at-40 ℃, then the temperature is switched to 80 ℃ within 1 minute, heat preservation is performed for 30 minutes at 80 ℃, and the thermal shock resistance test is performed in sequence, wherein the surface of the UV curing protective layer has no obvious change, no crack and no peeling after 250 hours of circulation, the UV curing protective layer has no obvious change after 300 hours of testing under neutral smoke in a salt spray resistance test, and the UV curing protective layer also has the 0-grade mould resistance under a mould resistance test.

In conclusion, the test results show that the UV glue solution can be accurately controlled in the range of the packaging thickness of 100-3000 micrometers by matching with the piezoelectric array nozzle 11, the cured protective layer has excellent toughness, good resistance effects on mechanical impact, cold and hot impact, high temperature and high humidity, higher surface resistance and volume resistance, and good insulation protection can be provided for the substrate even under a humid condition.

The UV glue solution is cured by pure UV, compared with UV humidified gas curing, the curing and drying time of the UV glue solution is greatly shortened, and due to the ultralow viscosity and surface tension of the UV glue solution, the UV glue solution can be uniformly spread without bubbles, and a cured protective layer has a smooth surface and a straight and neat edge.

As shown in fig. 16, an embodiment of the present disclosure further provides a substrate packaging method, including the following steps:

s50: moving the substrate 100 to a packaging station;

s60: acquiring the actual position of the substrate 100 at the packaging station;

s70: comparing the actual position with a reference position to obtain offset data of the actual position;

s80: and controlling the array type spray head 11 to spray glue solution to the target packaging area of the substrate 100 according to the offset data.

The reference position is a position of the substrate 100 without any offset on the packaging station, and is a theoretically correct position, but the substrate 100 cannot be accurately located at the reference position in actual operation. The offset data may include an offset displacement and an offset angle. The substrate packaging method does not need the actual position of the substrate 100 to be located at a specific position, is suitable for reliable packaging of the substrate 100, and can efficiently and accurately package the substrate 100.

In one embodiment, as shown in fig. 17, step S60 includes: the actual position of the substrate 100 at the packaging station is indicated by positioning two or more positioning points on the substrate 100. Step S70 may include:

s701: mapping the positions of two or more positioning points in a real coordinate system to a packaging coordinate system to obtain the actual mapping positions of the positioning points in the packaging coordinate system;

s702: comparing the actual mapping position with the reference position of the positioning point in the packaging coordinate system to obtain the offset data of the actual position relative to the reference position.

In one embodiment, as shown in fig. 17, step S80 includes:

s801: adjusting the position of a packaged image in the packaging coordinate system according to the offset data;

s802: and controlling the array type spray head 11 to spray glue solution to the target packaging area of the substrate 100 according to the packaging image after the position adjustment.

Wherein, the package image is obtained by processing the acquired upper surface image of the horizontally placed substrate 100 according to a predetermined rule, and is suitable for a package coordinate system. In the embodiment, the position of the packaged image is adjusted according to the offset data, without adjusting the horizontal and vertical positions and the moving track of the array type spray head 11 or the horizontal and vertical positions of the substrate 100, so that the packaging process is more automatic, efficient and convenient.

In one embodiment, the planar position of the array type spray heads 11 is adjustable, so that the step S80 may further include:

s803: controlling the array type spray head 11 to perform plane position adjustment according to the offset data;

s804: and controlling the array type spray head 11 after the position adjustment to spray photocured packaging glue solution towards the target packaging area according to the packaging image after the position adjustment in a horizontal linear reciprocating movement mode to form a packaging body.

In a preferred embodiment, the position of the array-type nozzle 11 for spraying the glue according to the offset data is not changed compared to the position for spraying the glue according to the reference position, and only the selection of the spraying holes 116 for spraying the glue is changed, so that the packaging process is faster and the packaging accuracy can be improved. Wherein, step S80 includes: and controlling the array type spray head 11 to adjust the spray holes 116 for spraying the glue on the basis of not changing the glue spraying position of the array type spray head 11 and the position of the substrate 100 according to the offset data, and spraying the glue solution on the target packaging area of the substrate 100.

Preferably, the horizontal and vertical positions and the moving trajectory of the array type heads 11 are not adjusted according to the offset data, and the horizontal and vertical positions of the substrate 100 are not adjusted according to the offset data. That is, the actual position of the substrate 100 is obtained, and the actual position is compared with the reference position to generate offset data, so that the position of the substrate 100 or the array-type spray head 11 does not need to be adjusted according to the offset data, and only the position of the spray holes 116 of the array-type spray head 11 for spraying the glue solution needs to be changed according to the offset data. This is because the array-type nozzle 11 has a plurality of nozzles 116, and not all the nozzles 116 spray the glue at the same time, and the nozzles 116 at specific positions are set to spray the glue according to different target packaging areas.

When the substrate 100 is located at the reference position, that is, when the offset data is 0, the encapsulation image does not need to be adjusted, and the orifices 116 of the array type spray head 11, which need to spray the glue solution, form a first orifice group; when the offset data is not 0, the position of the packaging image in the packaging coordinate system is adjusted according to the offset data, the positions of the spray holes 116 of the array type spray head 11 for spraying the glue solution are changed according to the offset data, and the spray holes 116 of the array type spray head 11 for spraying the glue solution form a second spray hole group. The second and first groups of orifices include orifices 116 at different locations.

In one embodiment, step S80 includes: and adjusting the coordinate position of each pixel point corresponding to the target encapsulation area of the encapsulated image according to the offset data, and controlling the array type spray head 11 to spray glue solution to the substrate 100 according to the coordinate position of the pixel point after the position adjustment.

In one embodiment, a plurality of substrates 100 may be packaged simultaneously, and the corresponding packaging method includes the following steps:

s51: moving a plurality of substrates 100 on a carrier to a packaging station;

s61: acquiring the actual position of each substrate 100 at the packaging station;

s71: comparing the actual position with a reference position to obtain offset data of the actual position of each substrate;

s81: and controlling the array type spray head 11 to spray glue solution to the target packaging area of the corresponding substrate 100 according to the offset data.

In addition, in the above steps S51, S61, S71, and S81, reference may be made to the implementation manners of steps S50, S60, S70, and S80, which are not described herein again.

In one embodiment, the packaging method further comprises the steps of:

s10: acquiring an image of the upper surface of the substrate 100 placed horizontally;

s20: acquiring a target packaging area and a non-packaging area of the upper surface image;

s30: and processing according to the upper surface image and a preset rule to obtain a packaging image suitable for a packaging coordinate system.

The execution sequence of steps S20 and S30 is not fixed, and the target encapsulation area and the non-encapsulation area of the top surface image may be obtained after obtaining the encapsulation image, or the target encapsulation area and the non-encapsulation area of the top surface image may be obtained first and then processed to obtain the encapsulation image, which is not limited in the present disclosure.

The packaging method further comprises the following steps: and S15, processing the upper surface image to form a binary image with a first color area and a second color area. Wherein step S15 may be performed between step S10 and step S20. The acquisition mode of the binary image is implemented as follows: and forming the image into a binary image by an adaptive threshold segmentation algorithm or a gray level binary algorithm.

Correspondingly, the predetermined rule comprises: and carrying out DPI adaptation on the binary image to form a packaging image in a bitmap format suitable for packaging DPI. Further, the predetermined rule includes: and carrying out DPI reduction on the original DPI of the collected image to form a packaging image suitable for the spraying DPI of the array type spray head 11.

In step S10, the image acquired in the step of acquiring the top surface image is in a bitmap format. In step S30, the package image of the package image acquisition step is in a bitmap format.

The package image acquiring step includes:

s310, acquiring the reduction ratio of the original DPI to the spraying DPI;

and S320, combining the original pixel points of the images into spraying pixel points according to a reduced proportion. For example, the original DPI is 2400 and the spray DPI is 800, and at this time, three (small) pixels of the top surface image are combined into one (large) pixel to form a spray precision suitable for the array type spray head 11, and the formed package pattern is sprayed.

The step of obtaining the packaging area comprises the following steps: and taking the first color area as a primary packaging area, and executing a swelling algorithm or a corrosion algorithm on the first color area to obtain a target packaging area. The first color area is preferably a black area image, which has black pixel points, and then the spraying is performed based on the pixel point positions during the spraying.

Specifically, a corrosion algorithm is executed when the target packaging area is subjected to filling packaging, so that the target packaging area is completely covered, and the situation that the coverage is not in place is avoided. And an expansion algorithm is executed when a target packaging area is fenced or coated, so that the problem of wall hanging is avoided. For example, when filling the grid-type spacing grooves, the original binary image (black-and-white image) is directly used

In this embodiment, the step of acquiring the upper surface image includes: s1001, shooting the horizontally placed substrate 100 through a CCD visual acquisition system or a CMOS visual acquisition system to obtain an original acquisition bitmap image. The shooting resolution of a camera for acquiring images is over 800 DPI. Further, the step of acquiring the upper surface image further comprises: s1002, cutting the picture area outside the outline of the substrate 100 corresponding to the original acquired bitmap image, and extracting the upper surface image corresponding to the size of the substrate 100.

The light reflected by the inspected object (PCBA, siP substrate, mini LED substrate, etc.) is refracted by the industrial lens to generate an analog current signal on the photosensitive sensor (CCD or CMOS), the signal is converted into a digital signal through the analog-to-digital converter, then the digital signal is transmitted to the image processor to obtain an image, and then the image is transmitted into the processor through the communication interface so as to facilitate subsequent image processing and analysis.

The minimum interval of LED lamp pearl is 150um as an example, the pixel that different camera precision corresponds, and the less corresponding pixel that can cut that camera precision is more. After DPI conversion adaptation, certain precision loss (pixel combination) exists, the larger the conversion DPI value is, the smaller the precision loss is, and the larger the precision loss is in contrast. The array type spray head 11 of the packaging device of the present disclosure has the same spray DPIs of 400, 800, 1200 and 1600 in the X-axis and Y-axis.

The packaging method also comprises the following steps: and S5, emitting preset illumination to the substrate 100, and forming a first area corresponding to the target packaging area and a second area corresponding to the non-packaging area, which have different brightness, on the substrate 100. The step of acquiring an upper surface image is performed after the step of illuminating. When a gerber graph is not provided or when an electronic component mounting tolerance exists, the packaging area is drawn manually.

The packaging method further comprises the following steps: s11, obtaining the size of the substrate 100. Accordingly, after step S11, the upper surface image carrying the size information of the substrate 100 is converted into a package image suitable for the package coordinate system. The steps S11 and S10 can be performed simultaneously or after the step S10. The dimension information (usually a rectangular plate) of the substrate 100 is obtained through calibration, an image coordinate system where the upper surface image carrying the dimension information of the substrate 100 is converted into a packaging coordinate system after binarization processing and DPI adaptation, and the positions of the combined pixel points on the packaging image correspond to the position points on the actual substrate 100 one by one.

An embodiment of the present disclosure further provides a substrate packaging apparatus, which includes an array type spray head 11, a first moving assembly, a workbench, a moving module, an actual position obtaining module, an offset data obtaining module, and a control device.

The array-type head 11 has a plurality of nozzles 116 for independently controlling the ejection. The first moving assembly is connected to the array type spray head 11. The first moving assembly is used for driving the array type spray head 11 to linearly move back and forth along a first horizontal direction. A table is located below the orifice 116. The table has a packaging station for placing the substrate 100. The moving module can move the substrate 100 to the encapsulation station. The actual position acquiring module can acquire the actual position of the substrate 100 at the packaging station. The offset data obtaining module can compare the actual position with the reference position to obtain offset data of the actual position. The control device is connected with the array type spray head 11, the first moving assembly, the actual position obtaining module and the offset data obtaining module. The control device can control the array type spray head 11 to spray glue solution to the target packaging area of the substrate 100 according to the offset data.

The substrate packaging method and the substrate packaging equipment are not only suitable for packaging electronic components of a PCBA board, but also suitable for COB packaging of a mini LED or a micro LED. In addition, the packaging method can also be suitable for fence or interval spraying of electronic components. In addition, the packaging method and the packaging equipment are not only suitable for packaging electronic components on the front surface of the substrate 100, but also suitable for packaging soldering pins or other target areas on the back surface of the substrate 100.

Referring to fig. 18, one glue-spraying layer is formed by one linear single-pass movement of the glue-spraying assembly 10 (for example, the nozzle 11 in fig. 18), and two glue-spraying layers are formed by one linear reciprocating movement. One linear back and forth movement of the glue dispensing assembly 10 includes two single passes. In the packaging method, further comprising the steps of: acquiring the number of target glue spraying layers; the glue spraying assembly 10 is controlled to spray the first glue solution to the substrate 100 in a linear reciprocating manner in a horizontal direction X until the target glue spraying layer number is reached.

In one embodiment, the packaging method may further include: the glue-spraying component 10 with a plurality of independently controlled spray holes is controlled to move back and forth along a horizontal direction X, and a second glue solution with a material different from that of the first glue solution is sprayed to the substrate 100 in a manner that the spray holes 116 are perpendicular to the substrate 100 until a covering part covering at least part of the area of the packaging layer 140 is formed. The covering portion covers at least a part of the area of the encapsulation layer 140, and the strength of the encapsulation layer 140 in the part of the area can be further protected. After forming the covering part, the method may further include: and controlling the glue spraying assembly 10 to spray a third glue solution to the substrate 100 until an outer cladding layer is formed to cover the packaging layer 140 and the covering part inside. The third glue solution and the first glue solution can be made of the same material. The thickness of the encapsulation layer 140 is greater than 0.05mm.

In one embodiment, as shown in fig. 25, the packaging method may further include: and controlling the glue spraying component 10 to spray a second glue solution made of a conductive material to the packaging layer 140 until a conductive layer 150 is formed, wherein the packaging layer 140 is coated in the conductive layer. The conductive layer 150 has a magnetic shielding effect.

Specifically, relative to the substrate 100, the relative height of the glue spraying assembly 10 when spraying the first glue solution and the relative height of the glue spraying assembly when spraying the second glue solution are kept unchanged.

In one embodiment, the packaging method may further include: and controlling the glue spraying assembly 10 to linearly reciprocate along a horizontal direction X and spraying a fourth glue solution in a manner that the spray holes vertically face the top surface of the packaging layer 140 until a mark part on the top of the packaging layer 140 is formed. Wherein the fourth glue solution can be glue solutions with different colors, so as to form the identification part with different colors.

In one embodiment, the electronic component 110 includes a first device 111. The packaging method comprises the following steps: controlling the glue spraying assembly 10 to spray an area lower than the first device 111 until the glue spraying height is flush with the first device 111, and then continuing spraying in a manner of covering the first device 111 and the sprayed glue area; the glue spraying step for the first device 111 is performed on the electronic components 110 on the substrate 100 from low to high one by one until the packaging layer 140 is formed, which covers all the electronic components 110 inside.

As shown in fig. 18, 24, and 25, when the electronic component 110 on the substrate 100 has different heights, for example, the electronic component 110 includes a first device 111 and a second device 112 having different heights, and the second device 112 is higher than the first device 111, the packaging method includes: and controlling the glue spraying assembly 10 to spray an area lower than the first device 111 until the glue spraying height is flush with the first device 111, continuing to spray in a manner of covering the first device 111 and the glue sprayed area, and finally continuing to spray in a manner of covering the second device 112 and the glue sprayed area until an encapsulation layer 140 for wrapping the first device 111 and the second device 112 is formed.

In one embodiment, the packaging method comprises: spraying a first preset number of layers of glue solution to the substrate 100; and after the glue spraying is stopped for a preset time, the glue solution on the substrate 100 is cured, and then a second preset number of layers of glue solution is sprayed to the substrate 100. The glue solution can flow automatically by curing after the glue spraying is stopped for a preset time, so that a smoother packaging surface is formed. In the present application, the target glue spraying area for spraying glue to the substrate 100 is the entire packaging surface of the substrate 100.

In one embodiment, the packaging method comprises the steps of: acquiring a glue spraying information picture carrying glue spraying area information; recognizing the glue spraying area information of the glue spraying information picture to acquire a target glue spraying area of the substrate 100; and controlling the glue spraying assembly 10 to spray a first glue solution to the target glue spraying area of the substrate 100. Further, in the packaging method, the paste ejection module 10 is controlled to linearly reciprocate in a horizontal direction X to eject the UV paste having a viscosity range of 7.623cP to 21.432cP at 40 ℃ to 50 ℃ to the target paste ejection region of the substrate 100.

The packaging equipment is provided with a controller for identifying the glue spraying information picture. The glue-sprayed information pictures are shown in fig. 21, 22 and 23. It should be noted that the dotted lines in fig. 21 to 23 are used to identify the boundaries of the pictures to distinguish from the page colors, and the dotted lines are not present in the actual pictures. The controller of the packaging device is provided with an identification module for identifying the glue spraying area information of the glue spraying information picture, and the identification module can be an identification software module running on upper computer software.

The glue spraying information picture is a two-dimensional picture. The glue spraying information picture carries two-dimensional glue spraying information corresponding to a target glue spraying area of the substrate 100. The glue spraying information picture and the two-dimensional plane structure of the substrate 100 are in a certain proportional relationship, and correspondingly, the position and the shape size of the glue spraying area information on the glue spraying information picture are in a certain proportional relationship with the actual target glue spraying area. And after the identification, the glue spraying information picture is a bitmap. The pixel points of the glue-spraying information picture correspond to different position points of the substrate 100 one by one. The ground color area 101 is identified as a non-glue-spraying area, the predetermined color area 102 is identified as a target glue-spraying area, and the distribution position of the predetermined color area 102 relative to the ground color area 101 corresponds to the distribution position of the target glue-spraying area on the substrate 100. The bitmap has a shape size in a predetermined proportional relationship with the shape size of the substrate 100. The glue spraying information picture is in a glue spraying area through a preset color. The glue spraying information picture is drawn according to a gerber graph of the substrate 100.

As shown in fig. 21, 22 and 23, the background color is white or transparent, and the background color area 101 indicates that the area does not need to be packaged by spraying glue. The black region shows the shape and the position of the glue spraying region, the positions of the pixels in the black region correspond to the actual glue spraying regions one to one, and then the corresponding position points of the corresponding SiP module are subjected to glue spraying through recognizing the positions of the black pixels, so that accurate packaging can be achieved.

In one embodiment, the encapsulation process may be performed as direct spray coating, with the same thickness around and over the electronic component 110, such as a patch element. The packaging method is generally suitable for thin layer protection, and the height of the electronic component 110 is below 5mm. In this embodiment, a glue-sprayed information picture as shown in fig. 21 is introduced, and the black glue-sprayed area of the glue-sprayed information picture in fig. 21 can be regarded as the black glue-sprayed area in fig. 22 superimposed on the black glue-sprayed area in fig. 23. Each pixel point in the black glue-spraying area of fig. 21 covers not only the periphery of the electronic component 110 but also the top of the electronic component 110, and covers the substrate 100.

As shown in fig. 18, 19, and 20, in another embodiment, the packaging method includes: controlling the glue spraying assembly 10 to spray glue solution to the edge of the substrate 100 in a linear reciprocating manner in a horizontal direction X until a rail 120 with a predetermined height surrounding the electronic component 110 is formed; and controlling the glue spraying assembly 10 to linearly reciprocate in the horizontal direction X to spray glue into the rail 120 until the rail 120 is filled, and curing to form a packaging layer 140 for covering the electronic component 110 inside. Wherein, the height of the rail 120 is not lower than the tallest electronic component 110.

In order to improve the curing efficiency, the filled glue solution can be cured once after the rail 120 is filled, that is, the glue solution is sprayed into the rail 120 for filling and then is cured, so that the glue solution can automatically flow and fill in the rail 120, and a smoother packaging surface is formed. Of course, the glue spraying and curing can be performed simultaneously when the fence 120 is filled and leveled, and the glue spraying and curing are performed layer by layer while the fence is filled and leveled. In the process of printing the fence 120, the glue spraying is performed simultaneously with the curing.

As shown in fig. 19 and 20, for better enclosure filling, enclosure 120 has a minimum wall thickness K of 0.5mm and a maximum predetermined height H of 3mm. The edges of the encapsulated package layer 140 are flat and neat, the electronic component 110 is fully wrapped, and no sharp protrusion is formed on the top of the package layer.

Specifically, the glue spraying encapsulation of the SiP module in the packaging method is performed as the following steps: s100, obtaining a glue spraying information picture carrying glue spraying area information of the fence 120 and a first target glue spraying layer number; s200, controlling the glue spraying assembly 10 to linearly reciprocate and spray a first target glue spraying layer number of UV glue solution to the edge of the substrate 100 according to the glue spraying area information of the rail 120 to form the rail 120 surrounding the electronic component 110; s101, obtaining a glue spraying information picture carrying filling glue spraying area information and a second target glue spraying layer number; s201, according to the filling glue spraying area information, controlling the glue spraying assembly 10 to spray a second target number of glue spraying layers of UV glue solution into the fence 120 in a linear reciprocating manner in the horizontal direction X to fill the fence 120. In step S100, a glue-sprayed information picture for the fence 120 shown in fig. 22 is introduced; in step S101, a filling glue information picture shown in fig. 23 is introduced. Step S201 is executed and cured to form the packaging effect shown in fig. 19, and the filled flat part 130 is filled on the fence 120.

In the primary glue spraying process from the beginning to the end of the movement of the glue spraying assembly 10, the glue spraying information pictures of the glue spraying assembly 10 are correspondingly controlled to be one. And then, corresponding glue spraying information pictures are imported or loaded again when glue spraying is carried out on different areas or different SiP modules next time. Each glue spraying information picture can correspond to 1 or more SiP modules. Fig. 21 corresponds to the glue-spraying area information of one SiP module, and when fig. 21 is introduced, only 1 SiP module can be subjected to glue-spraying packaging. Fig. 22 and 23 correspond to the two

SiP modules

100a and 100b, respectively, and when fig. 22 or 23 is introduced, the two

SiP modules

100a and 100b can be packaged at the same time.

In this embodiment, the fence 120 is manufactured by combining a filling manner, the fence 120 is formed by performing multi-layer spraying on the edge of the substrate 100, when the height of the fence 120 is not lower than that of the highest electronic component 110, glue is filled into the fence 120, and the glue is cured once after being leveled, so as to provide better protection for the SiP module with a higher height.

When the packaging mode of combining the fence 120 with filling is adopted, the process is guided into fig. 22 in the upper computer software, the printing is set to be 40 layers, the glue spraying assembly 10 is started, and the glue spraying assembly 10 linearly reciprocates to spray 40 layers on the edge of the substrate 100 to form the fence 120. Then fig. 23 is introduced, which is set to 30 layers, then 30 layers are refilled, and finally cured to form an encapsulation layer 140 as shown in fig. 19 on the substrate 100.

In the packaging method, glue solution on the substrate 100 can be cured while spraying the glue on the substrate 100, and the position of the substrate 100 is fixed in the glue spraying and curing process. Of course, in other embodiments, a single pass of movement performs the glue spraying and a single pass of movement performs the curing in a single round trip. At this time, curing is performed after the glue is sprayed.

In the packaging method, the viscosity range of the first glue solution is 1 cP-500 cP at 40-50 ℃. Further, 3.124 cP-30.746 cP. Further, 7.623cP to 21.432cP. The working temperature of the first glue solution is 40-200 ℃.

In one embodiment, the packaging method may further include: and leveling the outer surface of the packaging layer 140 after the glue spraying is finished. The flattening process may include: whether the flatness of the outer surface of the packaging layer 140 meets the requirement or not is detected through the detection tool, and if the flatness does not meet the requirement, the uneven part can be leveled through a scraper or a specially-equipped cutting tool.

Preferably, a secondary curing process for curing the planarized encapsulation layer 140 is further provided after the planarization process, so as to ensure that the structural strength of the encapsulation layer 140 meets the requirement.

In this embodiment, in the glue spraying state, the moving speed of the glue spraying assembly 10 is adjustable. In the packaging method, the speed of the glue spraying component 10 passing through the point A at the later time point is higher than the speed of the glue spraying component 10 passing through the point A at the former time point at the front time point and the rear time point, so that the sprayed glue can form self-flowing at the former time point, and a good leveling effect is achieved.

In the packaging method, the injection rate of a single nozzle hole 116 is at least 2000 drops of glue per second, and the amount of single drop of glue is 1-200 picoliters. Further, the injection rate of the single nozzle hole 116 is at least 10000 rubber drops per second, and the single rubber drop amount is 5-100 picoliters.

Preferably, the glue spraying assembly is further provided with a first curing light source assembly, namely the curing light source 20, which moves together with the glue spraying assembly. In the packaging method, the curing light source assembly (curing light source 20) is controlled to irradiate the substrate 100 to cure the glue solution on the substrate 100.

In one embodiment, the encapsulation method may include a simultaneous curing process, in which the first curing light source assembly (curing light source 20) and the glue spraying assembly 10 are controlled to irradiate the substrate 100 in a synchronous linear reciprocating manner to cure the glue solution on the substrate 100 until the encapsulation layer 140 is formed.

In one embodiment, the encapsulation method may further include a separate curing process of controlling a second curing lamp assembly different from the first curing lamp assembly to irradiate the encapsulation layer 140 of the substrate 100 to secondarily cure the encapsulation layer 140. The light intensity of the second curing light source component is greater than that of the first curing light source component. The second curing light source assembly may include an LED lamp and a mercury lamp.

As shown in fig. 27 to 29, the present disclosure also provides a COB package module. For example, the COB package module may be a Mini LED backlight module or a Micro LED module. Specifically, the COB package module includes a substrate 100 and a plurality of light-emitting portions 180 arranged in an array on the substrate 100. Each light emitting part 180 includes at least one LED chip 160. The maximum height of the LED chip 160 in the substrate 100 is less than 1mm. Further, the maximum height of the LED chip 160 with respect to the surface of the substrate 100 is less than 0.5mm. Further, the maximum height of the LED chip 160 at the substrate 100 is less than 0.3mm. The size of the LED chip 160 is less than 300 μm, and further less than 200 μm. The substrate 100 is further provided with a package 170 made of a light-curable resin material for covering the light-emitting part 180. The thickness of the package 170 is greater than 0.05mm.

The COB package module that this disclosed embodiment provided, LED chip 160 is in the maximum height of base plate 100 is less than 1mm, still is equipped with the packaging body 170 with the photocuring resin material of luminous part 180 cladding on the base plate 100, and photocuring resin curing efficiency is fast, and then can realize reliably encapsulating the specific area of base plate 100 fast, and production efficiency is high.

In an embodiment, as shown in fig. 27, 28, and 36 to 41, the package body 170 is a bowl-shaped structure having a spherical structure, and the light emitting portions 180 are wrapped in the package body 170 in a one-to-one correspondence. Two adjacent packages 170 are spaced apart from each other, where C in fig. 36 to 41 denotes a circumferential length, S denotes an area, D denotes a diameter, R denotes a radius, and L denotes a length.

In another embodiment, as shown in fig. 26, the encapsulation 170 of each light emitting portion 180 is fused to form an integrally cured encapsulation layer covering the substrate 100. The encapsulation layer may be provided with a convex spherical structure corresponding to each of the light emitting parts 180 one by one.

In one embodiment, as shown in fig. 29 and 42, the package 170 has a fence 120 surrounding the light emitting part 180 and a transparent filling body (not shown) filled in the fence 120. The filling body and the fence 120 are made of different materials. The fence 120 is a rectangular frame, two adjacent fences 120 share a fence edge, and the fences 120 on the substrate 100 form a grid structure.

In the present embodiment, each light emitting part 180 includes 3 or 4 LED chips 160. Preferably, each light emitting part 180 includes 4 LED chips 160, which are an rgb LED chip and a white LED chip, respectively.

Yet another embodiment of the present disclosure provides a Mini LED display screen including a backlight panel. The backlight plate is the COB package module as described in any one of the above embodiments.

As shown in fig. 26, a still further embodiment of the present disclosure provides a method for packaging a COB package module, wherein the COB package module includes a substrate 100 and a plurality of light emitting parts 180 arranged on the substrate 100 in an array. Each light emitting part 180 includes at least one LED chip 160. The maximum height of the LED chip 160 in the substrate 100 is less than 1mm. Specifically, each light emitting part 180 includes 3 or more LED chips 160, and further, each light emitting part 180 includes 3 or 4 LED chips 160.

The packaging method comprises the following steps: the array type spray head with a plurality of spray holes 116 which can be independently controlled to spray is controlled to spray the light-curable packaging glue solution towards the light-emitting part 180 on the horizontally placed substrate 100 in a horizontally linear reciprocating manner until the packaging body 170 which covers the light-emitting part 180 is formed. The packaging glue solution is light-cured epoxy resin. The packaging method of the COB package module is suitable for reliable packaging of the substrate 100 with the low-height LED chip 160.

Specifically, the LED chip 160 is a Mini LED chip 160 or a Micro LED chip 160. The packaging method comprises the following steps: the method comprises the steps of controlling an array type spray head with a plurality of light emitting parts 180 with the maximum spray area capable of covering more than 10 light emitting parts 180 to perform horizontal linear reciprocating movement, and intermittently spraying packaging glue with a preset viscosity range capable of being cured by light towards the light emitting parts 180 on the substrate 100 horizontally placed according to a preset glue spraying rate in a mode that the distance between a spray hole 116 and the substrate 100 is less than 1.5cm until a packaging body 170 for coating the light emitting parts 180 is formed. The package body 170 has a flat surface or a convex smooth spherical surface. As shown in fig. 26, the package body 170 has a flat surface; as shown in fig. 27 and 28, the package body 170 has a smooth spherical surface protruding outward.

In one embodiment, the predetermined viscosity range is 7.623cP to 21.432cP at 40 ℃ to 50 ℃. The preset glue spraying rate is that at least 10000 glue drops per second are sprayed through a single spray hole 116, and the single glue drop amount is 5-100 picoliters.

In this embodiment, the array-type nozzle forms intermittent spraying glue on any light-emitting part 180 by moving horizontally and linearly in a reciprocating manner, and the glue is stacked layer by layer in the area where the light-emitting part 180 is located to form the package 170. The array type head may cover more than 20 light emitting parts 180 in a maximum ejection area. Further, the maximum ejection area of the array type head may cover more than 50 light emitting parts 180.

In one embodiment, the packaging method comprises a fence spraying process and a filling spraying process. As shown in fig. 29, the fence spraying process is to control the array type spray heads to spray the first encapsulant toward the spaced areas between the adjacent light emitting parts 180 in a manner of horizontally and linearly reciprocating until the fences 120 are formed to individually surround the respective light emitting parts 180. The filling and spraying process is to control the array type spray head to spray the second encapsulation glue solution to the surrounding area of the rail 120 in a manner of horizontal linear reciprocating movement until the encapsulation body 170 which covers the light emitting part 180 is formed. The package body 170 has a flat surface.

Further, the second packaging glue solution is transparent glue solution, and the viscosity of the second packaging glue solution is lower than that of the first packaging glue solution. The first packaging glue solution is non-transparent glue solution, so that the problem of whitening under light channeling and black light can be avoided, and the resolution can be improved. The first encapsulating glue may be a colored glue, such as black, so that the rail 120 is opaque to light, thereby forming a COB encapsulating module with regional backlight. Of course, the second encapsulating glue may be the same as the first encapsulating glue.

In the fence spraying process, the array type spray heads are controlled to spray the fences 120, which form a grid structure, onto the substrate 100, as shown in fig. 29. The light emitting portions 180 are located in the mesh holes in a one-to-one correspondence. The fence 120 is lower than the LED chip 160. Because the volume of the glue solution is reduced to a certain extent after the glue solution is cured, the second packaging glue solution is sprayed into the fence 120 in the filling and spraying process until the filled second packaging glue solution protrudes out of the fence 120, so that the second packaging glue solution can be leveled with the fence 120 after the second packaging glue solution is cured. In other embodiments, the pens 120 can be higher than the LED chips 160, or the pens 120 are flush with the LED chips 160.

The grid enclosed by the fence 120 may be rectangular or other shapes. Preferably, as shown in fig. 42, the fence 120 has a rectangular grid, and the grid has a length and a width of 2mm to 5mm. Further, the length and width of the grid are 3mm to 4mm. Preferably, pens 120 are 0.1mm to 0.5mm wide. More preferably, the width of the rail 120 is 0.2mm to 0.3mm.

In an embodiment, the encapsulation method includes a first curing process of controlling a first curing light source moving together with the array type nozzle to irradiate the substrate 100 while the array type nozzle sprays the glue solution to cure the sprayed encapsulation glue solution.

Further, the packaging method further comprises the following steps: and a second curing step of controlling a second curing light source to perform secondary curing on the package 170 after the glue spraying is finished. It should be noted that the curing operation is not limited to curing while spraying glue, that is, only the second curing step may be provided instead of the first curing step, and the curing operation may be performed after spraying glue is completed. In particular, in the filling and spraying process, glue can be sprayed first, and then curing can be carried out when the last 1-3 layers of glue solution are sprayed.

In one embodiment, the packaging method comprises: the array type spray head is controlled to spray the encapsulation glue solution to the substrate 100 until an encapsulation layer of an integrated curing and molding structure is formed, which covers the surface of the substrate 100 and covers all the light emitting parts 180, as shown in fig. 26. The package body 170 has a flat surface.

In a preferred embodiment, the packaging method comprises: a region acquisition step of acquiring a target encapsulation region including sub-encapsulation regions arranged in an array; the light emitting parts 180 are located in the sub-package regions in a one-to-one correspondence; and a glue spraying and packaging process, wherein the array type spray heads are controlled to spray glue to the sub-packaging areas until bowl-shaped packaging bodies 170 which correspondingly coat the light emitting parts 180 one by one are formed. Two adjacent sub-packaging regions are arranged at intervals.

In the packaging method, one adhesive spraying layer is formed by one-time linear one-way movement, and two adhesive spraying layers are formed by one-time linear reciprocating movement. In the packaging method of the COB packaging module, the spraying areas of at least two single-pass movements are different.

In the encapsulating method, the number of sprayed glue layers is not more than 30, further not more than 20, further not more than 15, and particularly not more than 10. Such as the embodiment shown in fig. 26-28, each package 170 is sprayed with 10 layers of glue. And curing each glue spraying layer while spraying the glue spraying layers to the sub-packaging area, and performing secondary curing after curing the last glue spraying layer. The secondary curing time is much longer than the primary curing time, and the packaging body 170 is transparent and has a bowl-shaped structure.

In one embodiment, in the glue-spraying packaging process, after spraying a first number of first glue-spraying layers to the sub-packaging region, spraying a second number of second glue-spraying layers with a reduced spraying area to the first glue-spraying layer, and repeating the steps until spraying an nth glue-spraying layer with a reduced spraying area to the nth-1 glue-spraying layer to form the bowl-shaped package 170. Wherein n is a positive integer greater than 2, and the reduced spray area is that the spray area of the nth adhesive spray layer is smaller than that of the (n-1) th adhesive spray layer.

In a preferred embodiment, in the glue-spraying packaging process, a predetermined number of glue-spraying layers are sprayed to the sub-packaging area and cured to form a bowl-shaped packaging body. Wherein, the spraying area of each spraying glue layer is the same. And (3) starting a first curing light source which moves along with the array type spray head to cure while spraying the glue spraying layer on the sub-packaging area, and curing the glue spraying layer once (namely primary curing) through illumination. That is, at least one cure is performed between every two layers of the spray. After the glue solution is sprayed, the spray head walks for a preset distance and then carries out illumination curing, or after the spray head sprays the glue solution towards a position point (such as a sub-packaging area), the spray head carries out illumination curing at intervals of a preset time length; alternatively, the nozzle may irradiate light to cure the glue after spraying the glue toward a location point (e.g., a sub-package area) and before spraying the glue next time. The predetermined period is less than 30s, further less than 20s, further less than 15s, in particular less than 10s. Since the curing light source 20 moves together with the nozzle, the glue solution is cured while the glue is sprayed.

When spraying the glue, the glue spraying surface (i.e. the glue spraying panel 115) of the array type spray head has a plurality of sub glue spraying areas arranged in an array type. Each sub-glue-spraying area basically corresponds to one sub-packaging area. The spray holes 116 for spraying the glue solution are changed continuously during the movement of the spray head, but sub-glue-spraying areas arranged in an array form are formed on the glue-spraying surface of the spray head.

Compared with the existing COB packaging, the packaging method has the advantages that the array type spray heads are adopted, the packaging efficiency can be greatly improved, and through actual testing, the packaging efficiency can be improved by more than 2 times, even more than 3 times.

Specifically, the sub-package region is a circular region, or other desired shape. The encapsulation 170 can be sprayed with any desired bottom shape by the array spray heads, for example, the bottom surface is polygonal, elliptical, or even irregular.

The area of the sub-package region is 1 square millimeter or less, further 0.785 square millimeter or less, further 0.631 square millimeter or less, particularly 0.5 square millimeter or less. The height of the sub-package region (i.e., the distance from the highest point of the sub-package region to the substrate 100) is less than 1mm, further less than 0.75 mm, further less than 0.5mm, and particularly less than 0.3mm. The distance between two adjacent sub-packaging areas is 0.5 mm-2 mm.

Through long-term research, even if the glue solution is sprayed to the sub-packaging area with a tiny area, and one layer is solidified per sprayed layer, the low viscosity characteristic of the glue solution still forms self-flowing, and further forms a smooth coating outer surface, and as the number of the sprayed glue layers increases, although the glue spraying area is not changed, a theoretical "cylindrical" packaging body 170 is not formed, but a bowl-shaped packaging body 170 with a smooth surface, such as those shown in fig. 27 and 28, and fig. 36 to 41, is formed, and is particularly suitable for packaging Mini LEDs and Micro LEDs.

In one embodiment, the substrate 100 is provided with a mounting groove to receive the LED chip 160. The packaging method comprises the following steps: filling, namely controlling the array type spray head to intermittently spray glue solution into the mounting groove in a horizontal linear reciprocating movement mode until the mounting groove is filled to be flush with the surface of the substrate 100; and a packaging process of controlling the array type spray head to intermittently spray glue solution to the position of the filled mounting groove in a mode of horizontal linear reciprocating movement until the packaging body 170 is formed. The package body 170 is a stacked and cured structure. The injection area in at least the previous n times of single-pass movement in the packaging process is larger than the area of the mounting groove, and n is a positive integer less than or equal to 5.

In the packaging method, the array type nozzle intermittently sprays glue solution towards the substrate 100 in a manner of horizontal linear reciprocating movement, and further, in the moving process of the array type nozzle, glue solution of a second moving distance is sprayed every time the array type nozzle moves a first preset distance, or glue solution of a second preset time is sprayed every first preset time interval. Furthermore, one linear single-pass movement of the array type spray head forms one glue spraying layer, and one linear reciprocating movement forms two glue spraying layers. The array type nozzle sprays a predetermined number of adhesive layers to the area where each LED chip 160 is located. Further, the sprayed glue-sprayed layer is subjected to light curing before the next glue-sprayed layer is sprayed. Further, the substrate 100 is irradiated with the curing light moving together with the array type head to be cured.

As shown in fig. 30, the PCBA board packaging apparatus of the present embodiment further includes a glue supply assembly 40. The glue spraying assembly 10 has an input interface and an output interface. The glue supply assembly 40 is communicated with the glue spraying assembly 10. The glue supply assembly 40 has a first receiving chamber 41 and a second receiving chamber 42. An output interface of the first accommodating cavity 41 is communicated with an input interface of the glue spraying assembly 10, and an output interface of the glue spraying assembly 10 is communicated with an input interface of the second accommodating cavity 42. The first accommodating chamber 41 is communicated with a first negative pressure source 43, and the second accommodating chamber 42 is communicated with a second negative pressure source 44. The negative pressure that second negative pressure source 44 provided is greater than the negative pressure that first negative pressure source 43 provided to the glue solution can get into smoothly from first chamber 41 and spout gluey subassembly 10, and reentrant second holds the chamber 42, and spout the PCBA board through spouting gluey subassembly 10, realizes reliable encapsulation, and production efficiency is high.

In one embodiment, the glue spraying assembly 10 includes an array nozzle 11, that is, the array nozzle 11 is connected to the first accommodating chamber 41 and the second accommodating chamber 42, an output interface of the first accommodating chamber 41 is connected to the glue solution input connector 12 of the array nozzle 11, and the glue solution output connector 13 of the array nozzle 11 is connected to an input interface of the second accommodating chamber 42.

As shown in fig. 30, in the present embodiment, the glue supply assembly 40 may further include a glue solution container 47. The glue solution container 47 is communicated between the input interface of the first accommodating cavity 41 and the output interface of the second accommodating cavity 42. An output interface of the glue solution container 47 is communicated with an input interface of the first accommodating cavity 41 through a pipeline, and a first driving pump 45 is arranged between the output interface of the glue solution container and the input interface of the first accommodating cavity. An input interface of the glue solution container 47 is communicated with an output interface of the second accommodating cavity 42 through a pipeline, and a second driving pump 46 is arranged between the input interface of the glue solution container and the output interface of the second accommodating cavity. The arrows in fig. 30 indicate the flow direction of the glue.

In this case, the first drive pump 45 and the second drive pump 46 are both intermittently started, and are not always in a started state. Specifically, a first liquid level sensor for detecting the liquid level of the first accommodating cavity 41 is arranged in the first accommodating cavity 41. When the first liquid level sensor detects that the liquid level is lower than a first preset liquid level, the first driving pump 45 is started; when the first level sensor detects that the liquid level is equal to or higher than a first predetermined level, the first drive pump 45 is turned off. A second liquid level sensor for detecting the liquid level of the second accommodating cavity 42 is arranged in the second accommodating cavity 42. When the second level sensor detects that the liquid level is below a second predetermined level, the second drive pump 46 is turned off; when the second liquid level sensor detects that the liquid level is equal to or higher than the second predetermined liquid level, the second drive pump 46 is started.

The flow rate of the glue solution from the glue solution container 47 to the first containing cavity 41 is greater than the flow rate of the glue solution from the first containing cavity 41 to the second containing cavity 42, and the flow rate of the glue solution from the second containing cavity 42 to the glue solution container 47 is greater than the flow rate of the glue solution from the first containing cavity 41 to the second containing cavity 42. The glue solution slowly flows into the second accommodating cavity 42 from the first accommodating cavity 41 through the nozzle 11, the flow rate of the glue solution between the first accommodating cavity 41 and the second accommodating cavity 42 is slow, the flow rate from the glue solution container 47 to the first accommodating cavity 41 and the flow rate from the second accommodating cavity 42 to the glue solution container 47 are fast, and therefore the first driving pump 45 and the second driving pump 46 are arranged to be intermittently started, overflow of the glue solution in the first accommodating cavity 41 and the second accommodating cavity 42 is avoided, and smooth proceeding of packaging is guaranteed.

Specifically, the flow rate of the glue solution from the first accommodating cavity 41 to the second accommodating cavity 42 is 12ml/min to 29ml/min. Further, the flow rate of the glue solution from the first accommodating cavity 41 to the second accommodating cavity 42 is 17.5ml/min to 24.3ml/min. Further, the flow rate of the glue solution from the first accommodating cavity 41 to the second accommodating cavity 42 is 19.5ml/min to 21.5ml/min.

As shown in fig. 30, the glue supply assembly 40 may further include a filter 48 for filtering impurities in the glue solution to prevent contaminated glue solution from entering the nozzle 11 during the circulation process. The filter 48 is arranged on a pipeline between the glue solution container 47 and the first accommodating chamber 41 and/or a pipeline between the glue solution container 47 and the second accommodating chamber 42. The filter 48 cannot be disposed between the first accommodating chamber 41 and the second accommodating chamber 42, the flow rate of the glue solution is slow, and the filter 48 may cause the glue discharging of the nozzle 11 to be unsmooth.

In this embodiment, the first negative pressure source 43 and the second negative pressure source 44 may be vacuum pumps. The negative pressure range provided by the first negative pressure source 43 and/or the negative pressure range provided by the second negative pressure source 44 is 0.01 kPa-15 kPa. Further, the negative pressure is provided at two positions in the range of 1kPa to 20kPa. Further, the negative pressure is provided at two locations in the range of 1kPa to 10kPa. Still further, the negative pressure is provided at two locations in the range of 2kPa to 5kPa. The negative pressure provided by the second negative pressure source 44 is greater than the negative pressure provided by the first negative pressure source 43, and the difference between the negative pressure and the negative pressure is preferably 1kPa, so that the glue solution can smoothly enter the second accommodating cavity 42 to realize circulation, and the smooth glue discharge of the spray head 11 can also be ensured. Preferably, the first negative pressure source 43 provides a negative pressure of 3.4kPa and the second negative pressure source 44 provides a negative pressure of 4.4kPa.

In order to make the glue discharging from the nozzle 11 smoother, the glue supply assembly 40 further includes a heating element for heating the glue solution in the first accommodating chamber 41 at a constant temperature. The heating element heats the glue solution in the first accommodating cavity 41 to 20-200 ℃ at a constant temperature. Further, the heating element heats the glue solution in the first accommodating cavity 41 to 30-100 ℃ at a constant temperature. Furthermore, the heating element heats the glue solution in the first accommodating cavity 41 to 40-50 ℃ at constant temperature, and the glue solution in the temperature range is more suitable for packaging the PCBA.

Please refer to fig. 32 to 35. One embodiment of the present disclosure provides a curing device 51 including a first case 52, a second case 55, a carrier 59, a first sensor 531 and a second sensor 532.

Wherein, an LED lamp 53 for curing a product is provided in the first box 52. The second tank 55 is disposed downstream of the first tank 52. A mercury lamp 56 for curing the product is provided in the second tank 55. The carrying portion 59 is used for carrying and transferring the products from the first casing 52 to the second casing 55. A bearing portion 59 may be provided in the first case 52 and the second case 55. The first sensor 531 is disposed in the first case 52 and electrically connected to the LED lamp 53, and is used for sensing the product. The second sensor 532 is disposed in the first casing 52 and electrically connected to the LED lamp 53, and is used for sensing the product. The distance from the first sensor 531 to the second case 55 is greater than the distance from the second sensor 532 to the second case 55, i.e., the second sensor 532 is located downstream of the first sensor 531.

In the curing device 51 provided by this embodiment, by providing the first box 52, the second box 55 and the carrying part 59, the product placed on the carrying part 59 can sequentially pass through the first box 52 and the second box 55, the LED lamp 53 in the first box 52 can perform internal curing (i.e., deep curing) on the glue solution on the product, and the mercury lamp 56 in the second box 55 can perform surface curing on the glue solution on the product, so that the curing effect of the curing device 51 is good. A first sensor 531 and a second sensor 532 electrically connected with the LED lamp 53 are arranged in the first box 52, and after the first sensor 531 senses that the product enters the first box 52, the LED lamp 53 is turned on; after the second sensor 532 senses that the product leaves the first box 52, the LED lamp 53 is turned off, so that energy can be saved and cost can be reduced. The curing device 51 provided by the embodiment has a simple structure and low production cost, and is beneficial to production and manufacturing.

The curing device 51 may be located downstream of the apparatus housing 1. As shown in fig. 31, an intermediate circulation mechanism 50 may be disposed between the equipment housing 1 and the curing device 51, and the product is transported to the curing device 51 through the intermediate circulation mechanism 50 after being encapsulated by the glue in the equipment housing 1. Of course, after the product is encapsulated by the spraying glue in the device housing 1, the product may also directly enter the curing device 51 for further curing.

As shown in fig. 32 and 33, the side walls of the first box 52 and the second box 55 are each provided with an opening 510 for the passage of the product, so that the product to be solidified can enter the first box 52 from the opening 510 and be placed on the carrier 59. The carrier 59 may convey products from upstream of the first bin 52 to downstream of the second bin 55, and the carrier 59 may include a conveyor belt, a slide-rail slide arrangement, or other arrangements. The extending direction of the bearing portion 59 may be kept in agreement with the first horizontal direction.

In a preferred embodiment, the curing device 51 may include two or more parallel bearing portions 59, so that the products on the two bearing portions 59 can be cured at the same time, thereby improving the work efficiency. The carrier 59 and the products placed thereon are located below the LED lamp 53 and the mercury lamp 56.

In this embodiment, in order to achieve a better curing effect, a first lifting assembly 54 is connected to the LED lamp 53, and the first lifting assembly 54 can adjust the height of the LED lamp 53.

As shown in fig. 34, the first elevating assembly 54 includes a first screw 541 extending in a vertical direction, and a first connecting block 542 connected to the first screw 541 and the LED lamp 53, respectively. The first threaded screw 541 can drive the first connecting block 542 to drive the LED lamp 53 to ascend and descend, so that the distance from the LED lamp 53 to a product can be adjusted, and the curing effect of the LED lamp 53 is optimized. In addition, can be equipped with a plurality of first supports 543 that link to each other with first connecting block 542 in the first box 52, avoid first connecting block 542 and LED lamp 53 to produce the lateral deviation, guarantee that first connecting block 542 and LED lamp 53 are parallel with the horizontal plane all the time promptly to guarantee can evenly adjust the distance of LED lamp 53 to the product.

In this embodiment, in order to achieve a better curing effect, a second lifting assembly 57 is connected to the mercury lamp 56, and the second lifting assembly 57 can adjust the height of the mercury lamp 56.

As shown in fig. 35, the second lifting assembly 57 includes a second screw 571 extending in the vertical direction, and a second connecting block 572 connected to the second screw 571 and the mercury lamp 56, respectively. The second threaded screw 571 can drive the second connecting block 572 to drive the mercury lamp 56 to ascend and descend, so that the distance from the mercury lamp 56 to a product can be adjusted, and the curing effect of the mercury lamp 56 is optimized. In addition, a plurality of second brackets 573 connected to second connecting block 572 may be disposed in second housing 55, so as to avoid lateral deviation of second connecting block 572 and mercury lamp 56, i.e. to ensure that second connecting block 572 and mercury lamp 56 are always parallel to the horizontal plane, thereby ensuring that the distance from mercury lamp 56 to product can be uniformly adjusted.

Preferably, as shown in fig. 34 and 35, a plurality of LED lamps 53 are disposed in the first casing 52 and a plurality of mercury lamps 56 are disposed in the second casing 55, the LED lamps being distributed along the extending direction of the supporting portion 59, so as to ensure a good curing effect.

As shown in fig. 34, in the extending direction of the carrying portion 59, the first sensor 531 is mounted on the side surface of the most upstream LED lamp 53, and the second sensor 532 is mounted on the side surface of the most downstream LED lamp 53. The first sensor 531 and/or the second sensor 532 are photoelectric switches. First sensor 531 is used for the supplied materials response, and second sensor 532 is used for the ejection of compact response for LED lamp 53 can be opened after the supplied materials, closes after the ejection of compact, thereby the energy saving. The first casing 52 may be provided with a control unit, the control unit is electrically connected to the first sensor 531, the second sensor 532 and the LED lamp 53, and the control unit may receive signals from the first sensor 531 and the second sensor 532 and control the LED lamp 53 to be turned on or off according to the signals from the first sensor 531 and the second sensor 532.

Because the mercury lamp 56 needs to consume a certain amount of time and energy for starting and closing, the mercury lamp 56 in this embodiment needs to be kept in a normally open state, and the heat generation amount of the mercury lamp 56 is very large, so that the heat in the second box 55 is relatively large, the second box 55 needs to be cooled, and potential safety hazards such as explosion are avoided. As shown in fig. 32 and 33, a radiator 58 is provided above the second casing 55, and the radiator 58 communicates with the inside of the second casing 55. The LED lamp 53 and the mercury lamp 56 in the present embodiment each emit ultraviolet light. Wherein the LED lamp 53 emits single-band ultraviolet light and the mercury lamp 56 emits full-band ultraviolet light.

Please refer to fig. 43 to 50. The embodiment of the application provides a display module 300, which comprises a display area 61, a peripheral area 62 and an enclosure 63.

Wherein the peripheral region 62 is located at the periphery of the display region 61 and is connected to the display region 61. The enclosure 63 surrounds at least a portion of the periphery of the display area 61. At least part of the encapsulating body 63 is formed by spraying a light-cured resin material layer by layer and curing. The thickness of the envelope 63 is greater than 0.05mm.

In the display module 300 of the present embodiment, the encapsulant 63 surrounding at least a portion of the display region 61 is disposed, and at least a portion of the encapsulant 63 is formed by spraying a light-curable resin material layer by layer and curing, so that the packaging method of the display module 300 can be simplified, and the working efficiency and the yield are high.

Specifically, as shown in fig. 45 and 47, the two sides of the first straight line L3 are a display area 61 and a peripheral area 62, respectively. The display area 61 is used for displaying an image, and the peripheral area 62 is provided on the periphery of the display area 61, and can protect the display area 61 and connect the display area 61 with other components.

In this embodiment, as shown in fig. 43 and 44, the enclosing body 63 may include a frame 66, at least a portion of the frame 66 surrounds the periphery of the display area 61, and the frame 66 may protect the display area 61. Preferably, the frame 66 is formed by spraying a light-curable resin material layer by layer and curing the resin material.

As shown in fig. 45, the frame 66 is connected to both the display area 61 and the peripheral area 62. In another embodiment, the frame 66 may be connected to one of the display area 61 and the peripheral area 62, that is, the frame 66 is connected to the display area 61 and separated from the peripheral area 62, or the frame 66 is separated from the display area 61 and connected to the peripheral area 62.

Preferably, in the thickness direction Y of the display module 300, one surface of the frame 66 is attached to the peripheral region 62, and the other surface of the frame 66 protrudes from the display region 61. The frame 66 protruding from the display region 61 may protect the display region 61 by separating the display region 61 from other portions in the thickness direction Y.

In order to protect the display area 61 and reduce the volume of the display module 300, the projection of the frame 66 covers the projection of the peripheral area 62 in the thickness direction Y of the display module 300. Of course, in other embodiments, the projection of the peripheral region 62 in the thickness direction Y of the display module 300 may have a portion that is not covered by the projection of the frame 66.

Preferably, as shown in fig. 45, the frame body 66 includes a first frame portion 661 and a second frame portion 662 connected, and the first frame portion 661 is located at an outer periphery of the second frame portion 662. In the thickness direction Y of the display module 300, one surface of the first frame portion 661 is attached to the peripheral region 62, and one surface of the second frame portion 662 is attached to the display region 61. The first frame portion 661 and/or the second frame portion 662 are formed by spraying a photo-curable resin material layer by layer and curing.

In this embodiment, the other surface of the first frame portion 661 and the other surface of the second frame portion 662 are aligned and connected in the thickness direction Y of the display module 300, and the frame body 66 has a step shape. That is, the upper surface of the first frame portion 661 and the upper surface of the second frame portion 662 are flat, and the lower surface of the first frame portion 661 and the lower surface of the second frame portion 662 are at different heights and are attached to the peripheral area 62 and the display area 61, respectively, thereby better protecting the display area 61.

In one embodiment, the width of the first frame portion 661 may be 0.8mm or less, and the width of the second frame portion 662 may be 0.7mm or less. The total width of the frame 66 may be 1.5mm or less.

As shown in fig. 47 and fig. 49, the enclosure 63 may include a filling structure 67, the filling structure 67 is located inside the frame 66, and the filling structure 67 is connected to the display area 61 to further protect the display area 61. The filling structure 67 may be formed by filling a plurality of layers of light-curable resin material in a flowing manner, and curing the light-curable resin material after filling the light-curable resin material in the flowing manner to form the filling structure 67.

Specifically, as shown in fig. 46, the display area 61 may include a bent electric element 64, the frame 66 is located outside the electric element 64, and the filling structure 67 is located inside the electric element 64, so as to protect the bent electric element 64. The bent electric element 64 may be a flexible circuit board, which may electrically connect the different layers of the display area 61. The bending portion of the electric element 64 is generally located on the peripheral side of the display region 61 and does not exceed the peripheral region 62.

Preferably, the frame 66 is attached to the peripheral region 62 and to the outer surface of the electrical component 64 at the bend. A gap 65 is formed between the inner surface of the bending part of the electric element 64 and the display area 61, and the filling structure 67 fills the gap 65, so that sufficient protection can be provided for the display module provided with the bending electric element 64.

In one embodiment, the overall width of the frame 66 may be 2mm or less and the width of the fill structure 67 may be 0.45mm or less. The width of the frame 66 at the side connected to the peripheral structure may be 1.15mm or less.

In the present embodiment, the material of the frame 66 and/or the filling structure 67 may be epoxy resin. Both the frame 66 and the filling structure 67 can be manufactured by low-temperature injection molding. The processing temperature of the frame 66 and the filling structure 67 may be 65 ℃ or lower, and the molding of the package 63 may be completed within about 30 seconds. The yield of the display module 300 provided by the embodiment is more than 90%.

In this embodiment, a protective layer may be formed in the display region 61 inside the frame 66 by spraying a photocurable resin material layer by layer and curing the resin material. The position of the protective layer may be specifically set according to the needs, and the application is not limited thereto.

In this embodiment, the outermost layer of the display module 300 may be a glass cover 611. The glass cover 611 may provide the peripheral region 62 and may also provide an outer edge for the display module 300. The display region 61 is a multi-layer structure 610 and protrudes from the glass cover 611. The innermost layer of the display area 61 is an electrical element 64 for controlling the display module. The electric element 64 may be a display module control board, and preferably, the electric element 64 may be an FPC (flexible circuit board).

In one embodiment, the encapsulant 63 encapsulates the side (i.e., outer edge) of the multi-layer structure 610, and has a sealing function, in which case the encapsulant 63 may be a ring-shaped structure, i.e., the encapsulant 63 surrounds the display region 61 and is encapsulated in a ring shape. As shown in fig. 48, the ring-shaped structure may be a rectangular ring or other structure. To further avoid the bump, each corner point of the frame 66 is arc-shaped. As shown in fig. 50, the frame 66 and the filling structure 67 may be connected at two ends of the filling structure 67 in the longitudinal direction.

In another embodiment, the encapsulant 63 completely encapsulates the side of the multilayer structure 610 and the side facing away from the glass cover plate 611, and the encapsulant 63 covers the surface of the multilayer structure 610 exposed to the glass cover plate 611. The enveloping body 63 now envelops the entire surface in the form of a covering layer, as shown in fig. 51.

The present embodiment further provides a novel electronic device 200, where the novel electronic device 200 includes a display module 300 and a frame 613.

The display module 300 includes a display area 61, a peripheral area 62, and an enclosure 63. The peripheral region 62 is located at the periphery of the display region 61 and is connected to the display region 61. The enclosure 63 surrounds at least a portion of the periphery of the display area 61. At least part of the encapsulating body 63 is formed by spraying a light-cured resin material layer by layer and curing. An adhesive 612 is disposed between the frame 613 and at least a portion of the enclosure 63. The bonding body 612 is bonded and fixed to the frame 613 and the enclosure 63, respectively.

In the novel electronic device 200 provided by the embodiment, the encapsulating body 63 surrounding at least part of the periphery of the display area 61 is arranged, and at least part of the encapsulating body 63 is formed by spraying the light-cured resin material layer by layer for curing, so that the packaging method of the display module 300 of the novel electronic device 200 can be simplified, and the working efficiency and the yield are high.

In this embodiment, the frame 613 may be in contact with a portion of the enclosure 63. The enclosure 63 may include a frame 66 and a filling structure 67, the filling structure 67 is located inside the frame 66, a portion of the frame 66 may contact the frame 613, and the filling structure 67 is isolated from the frame 613. That is, a portion of the enclosure 63 may be in contact with the frame 613, and a portion of the enclosure 63 is not in contact with the frame 613. By adopting the structure, the novel electronic equipment 200 can be more effectively protected and sealed, and the novel electronic equipment 200 is prevented from being subjected to unfavorable conditions such as physical pollution, pollution of corrosive chemicals, water inflow problem and the like.

Preferably, the frame 613 is not in contact with the enclosure 63. An adhesive body 612 is interposed between the frame body 66 and the frame 613, and the adhesive body 612 is bonded and fixed to the frame 613 and the frame body 66, respectively. The frame body 66 is not contacted with the frame 613, but connected through the bonding body 612, so that each part is conveniently produced in a modularized manner, and finally, each part is connected through the bonding body 612, so that the yield of products and the working efficiency can be improved.

As shown in fig. 51, the present embodiment further provides a novel electronic device 200, which includes a frame 613, a display module 300, and an adhesive 612. The display module 300 includes a display area 61, a peripheral area 62 and an enclosure 63. The peripheral area 62 is located at the periphery of the display area 61 and is connected to the display area 61. The enclosure 63 surrounds at least a portion of the periphery of the display area 61. At least part of the encapsulating body 63 is formed by spraying a light-cured resin material layer by layer and curing. The bonding body 612 is disposed between the frame 613 and the enclosure 63 of the display module 300, and is used for fixedly connecting the display module 300 and the frame 613.

In this embodiment, the frame 613 may be a middle frame or other housing. The encapsulating body 63 is assembled with the frame 613 after being cured, and the bonding body 612 can form a waterproof and airtight structure.

In this embodiment, the enclosure 63 and the frame 613 are not in contact with each other, but are connected by the adhesive 612, so that each part can be conveniently produced in a modular manner, and finally, each part is connected by the adhesive 612, thereby improving the yield and the working efficiency of the product.

The novel electronic device 200 described herein may be a mobile wireless communications device, such as a smartphone; may be any form of wearable electronic device, portable media player, media storage device, portable digital assistant ("PDA"), tablet, computer, mobile communication device, GPS unit, remote control device, or other electronic device.

The embodiment also provides a substrate packaging method with a low-height electronic component, wherein the height of the electronic component relative to the substrate is lower than 5mm. The packaging method comprises the following steps: and controlling a glue spraying assembly with a plurality of independently controlled spray holes to linearly reciprocate along a horizontal direction and spraying packaging glue solution to the substrate in a manner that the spray holes vertically face the horizontally placed substrate until a packaging layer which covers the substrate and has a thickness larger than 0.05mm and coats the target electronic component is formed.

The present embodiment further provides a method for packaging the display module 300. The display module 300 may include a substrate 100. The substrate 100 includes a display region 61 and a peripheral region 62. The peripheral region 62 is located at the periphery of the display region 61 and is connected to the display region 61. The packaging method comprises the following steps:

s300: at least a portion of the encapsulant 63 is formed on at least a portion of the periphery of the display region 61 by spraying a light-curable resin material layer by layer for curing.

In the method for encapsulating the display module 300 according to the embodiment, the encapsulant 63 is formed on the periphery of at least a portion of the display area 61, and at least a portion of the encapsulant 63 is formed by spraying the light-curing resin material layer by layer and curing, so that the method for encapsulating the display module 300 of the novel electronic device 200 can be simplified, and the working efficiency and the yield are high.

In one embodiment, the step of forming the encapsulating body 63 at the periphery of at least a portion of the display region 61 (step S300) may include:

step S301: forming a first frame portion 661 on the periphery of the display area 61;

step S302: a second frame portion 662 is formed inside the first frame portion 661; the first frame portion 661 and/or the second frame portion 662 are formed by spraying a photo-curable resin material layer by layer and curing.

For step S301, in an embodiment, the first frame portion 661 is formed by spraying a photo-curable resin material layer by layer for curing, and the operation is simple, convenient and efficient.

In another embodiment, a second rail 9 may be formed on the periphery of the display area 61, and then a plurality of layers of light-cured resin material are sprayed between the display area 61 and the second rail 9, and after the plurality of layers of light-cured resin material flow and flatten, the light-cured resin material is cured to form the first frame portion 661. The second fence 9 may be formed by spraying a light-curable resin material layer by layer and curing. This packaging method can obtain a more flat first frame portion 661.

As for step S302, in an embodiment, the step of forming the second frame portion 662 inside the first frame portion 661 (step S302) may specifically include:

step S3021: forming a first rail 8 on the surface of the display area 61, wherein the first rail 8 is formed by spraying a light-cured resin material layer by layer and curing;

step S3022: a light-curable resin material is sprayed between the first rail 8 and the first frame portion 661 layer by layer to be cured to form the second frame portion 662. The second frame portion 662 formed by the method is simple, convenient and efficient.

In another embodiment, the forming of the second frame portion 662 inside the first frame portion 661 (step S302) includes:

step S3023: forming a first rail 8 on the surface of the display area 61, wherein the first rail 8 is formed by spraying a light-cured resin material layer by layer and curing;

step S3024: the second frame portion 662 is formed by spraying a plurality of layers of a light curable resin material between the first rail 8 and the first frame portion 661 and then curing the resin material. This packaging method can obtain the second frame portion 662 which is more flat, and can make the upper surface of the first frame portion 661 and the second frame portion 662 which are flush with each other more flat.

In this embodiment, the step of forming the envelope 63 at the periphery of at least a portion of the display region 61 (step S300) may include:

step S303: forming a second rail 9 on the periphery of the display area 61, wherein the second rail 9 is formed by spraying a light-cured resin material layer by layer and curing;

step S304: a frame 66 is formed by spraying a plurality of layers of light-curable resin material between the display area 61 and the second rail 9 and then curing the resin material. The packaging method can obtain a more flat frame 66, and multiple layers of light-cured resin material can flow between the display area 61 and the second rail 9 before curing, so as to fill the gap between the display area 61 and the second rail 9, so that the display module 300 can be effectively protected and sealed.

In the present embodiment, a part of the frame 66 may be formed by spraying a light-curable resin material layer by layer and curing the light-curable resin material, and another part may be formed by spraying a plurality of layers of light-curable resin materials and then curing the plurality of layers of light-curable resin materials at the same time. Can be adjusted according to the needs, and the application is not limited uniquely.

Specifically, the display area 61 includes a bent electric element 64, and a gap 65 is formed between an inner surface of the bent electric element 64 and the display area 61. In one embodiment, the step of forming the envelope 63 at the periphery of at least a portion of the display region 61 (step S300) may include:

step S401: forming a second rail 9 on the periphery of the display area 61, wherein the second rail 9 is formed by spraying a light-cured resin material layer by layer and curing;

step S402: spraying a plurality of layers of light-cured resin material between the display area 61 and the second rail 9, wherein at least part of the light-cured resin material flows into the gap 65 to form a filling structure 67;

step S403: the light-curable resin material between the display region 61 and the second rail 9 is cured, and a frame 66 is formed outside the electric element 64. The multiple layers of light-cured resin material of the encapsulation method can flow into the gap 65 to form the filling structure 67 before curing, so as to better protect the display module 300 with the bending electric element 64.

In another embodiment, the step of forming the encapsulant 63 at the periphery of at least a portion of the display region 61 (step S300) may include:

step S501: spraying a light-cured resin material on the periphery of the display area 61 layer by layer to be cured to form a first frame part 661;

step S502: forming a first rail 8 on the surface of the display area 61, wherein the first rail 8 is formed by spraying a light-cured resin material layer by layer and curing;

step S503: spraying a plurality of layers of light-cured resin material between the first rail 8 and the first frame portion 661, wherein at least a part of the light-cured resin material flows into the gap 65 to form a filling structure 67;

step S504: the light curable resin material between the first frame portion 661 and the first rail 8 is cured, and the outer side of the electric element 64 forms a second frame portion 662.

The present embodiment further provides a package structure for protecting a bending portion of an FPC, including a display area 61, a peripheral area 62, and an encapsulant 63.

The display area 61 is a multi-layer structure 610, the multi-layer structure 610 includes an FPC, and a bending portion is formed at an edge of the multi-layer structure 610 after the FPC is bent; the peripheral region 62 is located at the periphery of the display region 61 and connected to the display region 61, the encapsulant 63 surrounds at least a portion of the periphery of the display region 61, at least a portion of the encapsulant 63 is formed by spraying a photo-curable resin material layer by layer and curing, and the encapsulant 63 encapsulates at least a portion of the bending portion.

The present embodiment also provides a packaging method for protecting a bending portion of an FPC, including:

step S600: and controlling an array type spray head with a plurality of spray holes which can be independently controlled to spray light-cured packaging glue solution towards the bent part in a horizontal linear reciprocating mode to form the packaging body 63 for packaging at least part of the bent part inside.

The wrapping body 63 may partially wrap or fully wrap the bent portion. The action of controlling the array type spray head with a plurality of spray holes which can be independently controlled to spray the photocured packaging glue solution in a horizontal linear reciprocating motion mode can be completed by COB packaging module packaging equipment.

Wherein, COB encapsulation module can be including spouting gluey subassembly, first removal subassembly, workstation. The workbench is arranged on the equipment bracket. The equipment support is provided with a mounting platform for mounting the workbench. The mounting platform is provided with a support frame for supporting the first moving assembly. The support frame crosses the mounting platform and supports the glue spraying assembly and the first moving assembly to form a gantry-like mechanism. A supporting plate is supported on the supporting frame, and the first moving assembly is fixedly installed on the front plate surface of the supporting plate. The glue spraying assembly is provided with a plurality of spray holes for independently controlling spraying. The first moving assembly is connected with the glue spraying assembly. The first moving assembly is used for driving the glue spraying assembly to linearly reciprocate along a first horizontal direction, so that the action of spraying the light-cured resin material layer by layer can be completed. The glue spraying assembly can also be fixedly provided with a curing light source, so that the light-curing resin material can be sprayed and cured at the same time.

It should be noted that, in the description of the present specification, the terms "first", "second", and the like are used for descriptive purposes only and for distinguishing similar objects, and no order is present therebetween, and no indication or suggestion of relative importance is to be made. Further, in the description of the present specification, "a plurality" means two or more unless otherwise specified.

Any numerical value recited herein includes all values from the lower value to the upper value, in increments of one unit, provided that there is a separation of at least two units between any lower value and any higher value. For example, if it is stated that the number of a component or a value of a process variable (e.g., temperature, pressure, time, etc.) is from 1 to 90, preferably from 20 to 80, and more preferably from 30 to 70, it is intended that equivalents such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also expressly enumerated in this specification. For values less than 1, one unit is suitably considered to be 0.0001, 0.001, 0.01, 0.1. These are only examples of what is intended to be explicitly recited, and all possible combinations of numerical values between the lowest value and the highest value that are explicitly recited in the specification in a similar manner are to be considered.

Unless otherwise indicated, all ranges are inclusive of the endpoints and all numbers between the endpoints. The use of "about" or "approximately" with a range applies to both endpoints of the range. Thus, "about 20 to about 30" is intended to cover "about 20 to about 30", including at least the endpoints specified.

All articles and references disclosed, including patent applications and publications, are hereby incorporated by reference for all purposes. The term "consisting essentially of …" describing a combination shall include the identified elements, components, parts or steps as well as other elements, components, parts or steps that do not materially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe combinations of elements, components, or steps herein also contemplates embodiments that consist essentially of such elements, components, or steps. By using the term "may" herein, it is intended to indicate that any of the attributes described that "may" include are optional.

A plurality of elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, ingredient, component or step is not intended to foreclose other elements, ingredients, components or steps.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of subject matter that is disclosed herein is not a disclaimer of such subject matter, nor is it to be construed that the inventors do not consider such subject matter to be part of the disclosed inventive subject matter.

Claims

1. A substrate packaging method with low-height electronic components is disclosed, wherein the height of the electronic components relative to the substrate is lower than 5mm; the packaging method comprises the following steps:

and controlling a glue spraying assembly with a plurality of independently controlled spray holes to linearly reciprocate along a horizontal direction and spraying packaging glue solution to the substrate in a manner that the spray holes vertically face the horizontally placed substrate until a packaging layer which covers the substrate and has a thickness larger than 0.05mm and coats the target electronic component is formed.

2. The method for packaging a substrate with a low-profile electronic component as claimed in claim 1, wherein the substrate comprises a display area and a peripheral area, the peripheral area being located at the periphery of the display area and connected to the display area; the electronic component is positioned in the display area; the encapsulation layer comprises an encapsulant; the packaging method comprises the following steps:

and forming the encapsulating body on the periphery of at least part of the display area, wherein at least part of the encapsulating body is formed by spraying a light-cured resin material layer by layer and curing.

3. The method for packaging a substrate with low-profile electronic components as claimed in claim 2, wherein the step of forming an encapsulant around at least a portion of the display area comprises:

forming a first frame portion at the periphery of the display area;

4. The substrate packaging method with the low-height electronic component as claimed in claim 3, wherein the first frame portion is formed by spraying a photo-curable resin material layer by layer and curing, and the step of forming the second frame portion on the inner side of the first frame portion comprises:

5. The substrate packaging method with the low-height electronic component as claimed in claim 3, wherein the first frame portion is formed by spraying a photo-curable resin material layer by layer and curing, and the step of forming the second frame portion on the inner side of the first frame portion comprises:

6. The method for packaging a substrate with low-profile electronic components as claimed in claim 2, wherein the step of forming an encapsulant around at least a portion of the display area comprises:

7. The method for packaging a substrate with low-profile electronic components as claimed in claim 2, wherein the display area comprises a bent electrical element, and a gap is formed between an inner surface of the bent electrical element and the display area; the step of forming an encapsulating body at the periphery of at least a part of the display region includes:

8. The method for packaging a substrate with low-profile electronic components as claimed in claim 2, wherein the display area comprises a bent electrical element, and a gap is formed between an inner surface of the bent electrical element and the display area; the step of forming an encapsulating body at the periphery of at least a part of the display region includes:

9. The method for packaging a substrate with a low-profile electronic component as claimed in claim 1, wherein the substrate comprises a display area and a peripheral area, the peripheral area being located at the periphery of the display area and connected to the display area; the electronic component is positioned in the display area; the display area is of a multilayer structure, the multilayer structure comprises an FPC, and a bending part is formed at the edge of the multilayer structure after the FPC is bent; the encapsulation layer includes an encapsulant surrounding a periphery of at least a portion of the display area; the packaging method comprises the following steps:

and controlling a glue spraying component with a plurality of independently controlled spray holes to linearly reciprocate along a horizontal direction and spraying photocuring packaging glue solution towards the bent part vertically through the spray holes to form the packaging body for packaging at least part of the bent part inside.

10. The method for packaging a substrate with a low-profile electronic component as claimed in claim 1, wherein the electronic component comprises a plurality of light emitting sections arranged in an array on the substrate; each of the light emitting parts includes at least one LED chip; the maximum height of the LED chip on the substrate is lower than 1mm; the packaging method comprises the following steps:

and controlling an array type spray head with a plurality of spray holes which can be independently controlled to spray photocuring packaging glue solution towards the light-emitting part on the horizontally placed substrate in a horizontal linear reciprocating motion mode until a packaging body for coating the light-emitting part is formed.