CN100551213C

CN100551213C - Multilayer circuit board and manufacture method, electronic device and electronic installation

Info

Publication number: CN100551213C
Application number: CNB2006101432559A
Authority: CN
Inventors: 桜田和昭
Original assignee: Seiko Epson Corp
Current assignee: Seiko Epson Corp
Priority date: 2002-11-19
Filing date: 2003-11-13
Publication date: 2009-10-14
Anticipated expiration: 2023-11-13
Also published as: CN1937892A

Abstract

A kind of multilayer circuit board and adopt the droplet ejection method to make the manufacture method of described circuit board by the simpler production process can easily make inner layer insulating film smooth.Described multilayer circuit board comprises at least two wiring layers; Be located at the inner layer insulating film between every adjacent two wiring layers, in order to the conductive pole of conductivity to be provided between wiring layer.Described manufacture method comprises the step that forms described inner layer insulating film by the thickness that changes inner layer insulating film according to the concaveconvex shape that forms the primary insulation diaphragm area, so that the upper surface of this inner layer insulating film is smooth.Calculate described concaveconvex shape according to the design data of circuit pattern,, perhaps before inner layer insulating film forms, can measure described concaveconvex shape in order to form each wiring layer and conductive pole.

Description

Multilayer circuit board and manufacture method, electronic device and electronic installation

The application is that application number is CN 200310118114.8, and the applying date is 2003.11.13, and the application people is a Seiko Epson Corp, and is entitled as dividing an application of " multilayer circuit board and manufacture method, electronic device and electronic installation ".Above-mentioned in first to file requirement priority, one of described priority

Applicant country's applying date application number formerly formerly formerly

Japan 2002.11.19 JP 2002-334915

Japan 2003.08.25 JP 2003-300143

This paper draws the content of priority application and is reference.

Technical field

The present invention relates to multilayer circuit board and manufacture method, electronic device and electronic installation.

Background technology

Usually, used inner layer insulating film generally makes through whirl coating or roll-in coating process in the multilayer board.According to whirl coating, be after being dropped in fluent material on the substrate, make substrate rotation, thereby, form one deck dielectric film with the whole surface of described fluent material coated substrate.In the roll-in coating process, then solvent membrane is transferred on the pressure roller.But in whirl coating, the service efficiency of real material is near 10%, and need be such as additional processes such as the cleaning back sides.Roll-in coating process efficient aspect material use is higher, but problem is the contamination from the exterior material of transferring roller.

Recently develop a kind of ink-jet method, be used for making the inner layer insulating film that this multilayer board is used.This method adopts the known droplet ejection technology in ink jet printing field, and wherein with the droplet of prepared Chinese ink material, the fluent material that also promptly is used for forming described inner layer insulating film is ejected on the substrate, makes it fixing again.According to this ink ejecting method, each prepared Chinese ink droplet of prepared Chinese ink material is injected on the small zone exactly, make the prepared Chinese ink material can directly be fixed to required zone.Therefore, the prepared Chinese ink material is wasted, can also reduces cost of manufacture simultaneously.So this method is very rational.

Yet, in the prior art, use the material coated substrate of on average spraying from the material nozzle.So, in wiring layer, just consistently forming described inner layer insulating film with uneven circuit pattern, the smooth degree of inner layer insulating film is just not enough.Adopt this uneven inner layer insulating film, the inner layer insulating film top section is also just uneven, thereby can not form smooth wiring layer.In addition, more the section configuration of the inner layer insulating film on top or wiring layer also can be affected, thereby causes opening circuit between each wiring layer.If make the substrate rotation, the service efficiency of material will reduce, and need be such as the additional process at the cleaning back side.

Summary of the invention

In view of the foregoing, the object of the present invention is to provide a kind of comparatively simple manufacturing process of passing through, the manufacture method that adopts the droplet ejection method to produce slim multilayer circuit board wherein can be made the inner layer insulating film of circuit board smooth at an easy rate.The present invention also provides a kind of multilayer circuit board, electronic device and electronic installation.

So the invention provides a kind of manufacture method of multilayer circuit board, it comprises at least two wiring layers of formation, is located at inner layer insulating film between every adjacent two wiring layers and the step that a plurality of conductive poles of conductivity are provided between each wiring layer, wherein:

Described step comprises that the thickness by change inner layer insulating film according to the concaveconvex shape that forms the primary insulation diaphragm area forms described inner layer insulating film, so that the upper surface of this inner layer insulating film is smooth.

In this method, preferably adopt the droplet ejection method.

To adopt stacked substrates, first wiring layer in regular turn.The typical case of the multilayer circuit board explanation said method of a plurality of conductive poles, inner layer insulating film and second wiring layer for example.

At first, on substrate, form first wiring layer with particular electrical circuit pattern.Circuit pattern on the substrate partly comprises a plurality of recessed portions, and this is produced by each part and discrepancy in elevation between the remainder (step) that forms wiring.Can preferably form this first wiring layer by such as photoetching process by the droplet ejection method.

In subsequent step, on first wiring layer, form a plurality of conductive poles.The part of each conductive pole comprises a plurality of bossings on first wiring layer, they be by first wiring layer and on this layer each outstanding conductive pole form.Preferably form each conductive pole by the droplet ejection method.

Above-mentioned each recessed portion and bossing are known as the jog with the present invention's " concaveconvex shape " jointly, that is to say, jog means discrepancy in elevation part or the ledge for required flat surfaces.

Subsequent again step is, forms described inner layer insulating film according to the concaveconvex shape that forms the primary insulation diaphragm area, makes the upper face of this dielectric film smooth.Here, the zone that forms inner layer insulating film is centered on by substrate, first wiring layer and each conductive pole at least, and " forming inner layer insulating film according to concaveconvex shape " mean especially towards each recessed portion of described jog and spray volume (inner layer insulating film) prepared Chinese ink material, and spray a spot of prepared Chinese ink material towards each projection.

Subsequent again step is to form second wiring layer with particular electrical circuit pattern on described inner layer insulating film.Correspondingly, first wiring layer is connected with second wiring layer by conductive pole.Because the upper surface of inner layer insulating film is smooth, so the thickness of second wiring layer that forms on this inner layer insulating film surface is uniformly, and the upper surface of second wiring layer also is smooth.Best second wiring layer also makes by the droplet ejection method.

When making inner layer insulating film by the droplet ejection method, the manufacture method of multilayer circuit board comprises drying steps, to expel liquid component contained in the prepared Chinese ink material, these compositions can be evaporated or be volatilized.

According to the present invention, it is smooth that the upper surface of inner layer insulating film is made into, thereby make the uniform film thickness of second wiring layer, so that can provide good insulation property between first and second wiring layers, can avoid opening circuit between each wiring layer.In addition, even (promptly the 3rd, fourth class wiring layer or each inner layer insulating film) also can have smooth upper surface and thickness uniformly at an easy rate from the upper strata of second wiring layer on smooth inner layer insulating film upper surface.

According in order to form the data of each wiring layer and the required circuit pattern of conductive pole, calculate the concaveconvex shape that forms the primary insulation diaphragm area.Required data comprise: (i) form wiring layer and the used electronic data of conductive pole by the droplet ejection method according to specific circuit pattern; (ii) various set points in the droplet ejection method are such as the emitted dose of each droplet, the number of times of arranging, implement injecting step of each droplet etc.The form of described electronic data is the bit map pattern formation preferably, perhaps used DXF form or DWG form among the CAD (computer-aided design).

When forming described wiring layer and conductive pole, can adopt the electronic data that comprises used electronics mask pattern in the step of exposure by photoetching process.

According to the present invention, can calculate the shape that inner layer insulating film forms the district according to the design data of circuit pattern in advance, and form described inner layer insulating film, thereby can form described inner layer insulating film effectively by result calculated.

Can before forming, inner layer insulating film measure the concaveconvex shape that inner layer insulating film forms the district.

Usually, (promptly form before the inner layer insulating film) measurement of the whole zone (being that dielectric film forms the district) that forms inner layer insulating film being carried out described concavo-convex formation in advance, and use noncontact vertical survey device, measure the size of concaveconvex shape exactly as three-dimensional data (being measurement data).Carry out graphical analysis etc. according to this three-dimensional data, form the zone, thereby the number of times of spraying etc. is arranged, implemented to best emitted dose, the droplet of definite prepared Chinese ink material that sprays towards described dielectric film formation district so that calculate described dielectric film.Under various definite conditions, carry out droplet ejection.Specifically, darker recessed portion is sprayed the comparatively prepared Chinese ink material of volume, and more shallow recessed portion is sprayed comparatively a spot of prepared Chinese ink material.

As noncontact vertical survey device, preferably use vertical survey device (as laser vertical survey device) or the scanner that utilizes optical interference.

Can use gauge head in advance (head-preceding) transducer carry out described concaveconvex shape and measure.The first line sensor of described gauge head is positioned near the droplet ejection head of droplet ejection device.According to gauge head elder generation line sensor, carry out the vertical survey of described concaveconvex shape concurrently and, wherein carry out described droplet ejection according to the measurement data of described concaveconvex shape with droplet ejection head eject micro-droplets.Specifically, darker recessed portion is sprayed the comparatively prepared Chinese ink material of volume, and more shallow recessed portion is sprayed comparatively a spot of prepared Chinese ink material.

According to the present invention, under the situation that adopts noncontact vertical survey device, can in forming the zone, the dielectric film of calculating according to the actual three-dimensional data that records (being measurement data) form described inner layer insulating film.When adopting gauge head elder generation line sensor, the measurement in the whole zone of described formation inner layer insulating film is unnecessary, and can carry out vertical survey and droplet ejection to each recessed portion effectively.

According to above-mentioned any (the measurement concaveconvex shape) method, measure the true form that comprises described jog scale error (being the error between design data and the measurement data).Thereby, and compare according to the formed inner layer insulating film of design data, can make the inner layer insulating film that forms according to real data with more accurate level.

In the representative instance of described manufacture method, the step that forms inner layer insulating film comprises the stacked in regular turn inner layer insulating film of a plurality of quilts of formation, and these steps comprise:

Formation has first inner layer insulating film that forms the first predetermined thickness of the concaveconvex shape in zone according to first inner layer insulating film, wherein calculates described concaveconvex shape by the design data of the circuit pattern that forms each wiring layer and conductive pole; And

Each measuring process in the upper surface of first inner layer insulating film, and form second inner layer insulating film makes with second inner layer insulating film and fills recessed portion in each step.

Described first inner layer insulating film is that one deck at first is formed on the film in the dielectric film formation district, and described second inner layer insulating film is that one deck is formed at the film on first inner layer insulating film of making in advance.If form the 3rd, fourth class inner layer insulating film, then these also all are formed in the film on the inner layer insulating film of making in advance, therefore, these films are called second inner layer insulating film jointly.In addition, " measuring process on first inner layer insulating film in the surface " common meaning is to use the measurement of above-mentioned noncontact vertical survey device.

According to the present invention, calculate the shape that dielectric film forms the district according to the design data of circuit pattern in advance, and form described inner layer insulating film according to result calculated.Therefore, can make described first inner layer insulating film effectively.

In addition, measure each discrepancy in elevation in the first inner layer insulating film upper surface, make it possible to measure the thickness of consideration first inner layer insulating film and the actual discrepancy in elevation of flatness error.

Form second inner layer insulating film, in order to filling the recessed portion of described each discrepancy in elevation, thereby can make the upper surface of inner layer insulating film smooth.Therefore, compare, can comparatively coarse rough terrain become the upper surface of first inner layer insulating film with second inner layer insulating film; Thereby, by forming the first such inner layer insulating film, can reduce the required time of droplet ejection method.

In addition, first inner layer insulating film and second inner layer insulating film are formed separately, so, compare with the method that once forms required inner layer insulating film, can be easier to control the thickness of inner layer insulating film, thereby form the accurate smooth upper surface of inner layer insulating film.

According to the method described above, preferably use the droplet ejection method to form inner layer insulating film, the droplet of volume forms first inner layer insulating film by spraying comparatively from the droplet ejection head, and can be that less droplet forms second inner layer insulating film by spraying more described volume droplet from the droplet ejection head.

According to the method, form first dielectric film by certain accuracy of spray, and form second inner layer insulating film by higher accuracy of spray.Therefore, except that by the resulting above-mentioned effect of manufacture method of the present invention, described inner layer insulating film can have point-device flat surfaces.

When manufacture method of the present invention is used the droplet ejection method, by regulating the emitted dose of each prepared Chinese ink material droplet, can control the prepared Chinese ink quantity of material that per unit area sprays, wherein by the drive waveforms of control droplet ejection head, change the emitted dose of each droplet.

In general, the droplet ejection head has the pressure generating chamber that is communicated with a plurality of nozzle bores, also has components of stres, in order to the fluent material in the described pressure generating chamber of pressurizeing, so that spray prepared Chinese ink material by each nozzle bore.Drive waveforms is the voltage waveform that adds to components of stres.The amount meaning that per unit area sprays the prepared Chinese ink material is the amount that dielectric film forms the per unit area injection prepared Chinese ink material in district.The prepared Chinese ink material is corresponding to by being attached to the used material of inner layer insulating film resulting fluent material in the liquid that can evaporate or can volatilize.Described fluent material can be by the solution of the used material dissolves of inner layer insulating film gained in the solvent, or by making the solution of described diffuse gained in the liquid.Under latter event, the used material of described inner layer insulating film can be fine particle or the levigate particle of process.Also can adopt any other can be applied to the method for droplet ejection method, so that obtain fluent material.

According to the present invention, by the controlling and driving waveform, required voltage is added to components of stres, and give the pressurization of the prepared Chinese ink material in the pressure generating chamber by this components of stres, so that spray the prepared Chinese ink material of appropriate amount, thereby can regulate the per unit area prepared Chinese ink injection of material amount that dielectric film forms the district by each nozzle bore.

If set drive waveforms to such an extent that make the voltage that adds to components of stres higher, just can make the amount of spraying in each spraying bigger, if and set drive waveforms to such an extent that make the voltage that adds to components of stres lower, just can make the amount of spraying in each spraying less.

If set drive waveforms to such an extent that make the unit interval umber of pulse of the voltage that adds to components of stres bigger, just can make the amount of spraying in each spraying bigger, if and set drive waveforms to such an extent that make the unit interval umber of pulse of this voltage less, just can make the amount of spraying in each spraying less.

Can suitably determine voltage and umber of pulse, thereby carry out the droplet ejection under multiple condition about drive waveforms.

In addition, when manufacture method of the present invention adopts the droplet ejection method,, can control the amount that per unit area sprays the prepared Chinese ink material by regulating the distance interval between the prepared Chinese ink injection of material position.

Distance between each position of injection prepared Chinese ink material the meaning at interval is at least two range data between the prepared Chinese ink injection of material point, can be by the amount that relatively moves between control basal plate and the droplet ejection head, perhaps by each the spray regime of injection/not between a plurality of nozzles of control, and determine that these are apart from interval.In fact, carry out this droplet ejection in the described process that relatively moves, and translational speed is high more, this distance is big more at interval, thereby the arrangement of prepared Chinese ink injection of material point is sparse.On the contrary, translational speed is low more, and this distance is more little at interval, thus the dense arrangement of prepared Chinese ink injection of material point.For example, about first kind of situation of spraying the prepared Chinese ink material by 10 μ m at interval and second kind of situation of spraying the prepared Chinese ink material at interval by 20 μ m, the emitted dose of first kind of situation per unit area is 2 times of second kind of situation per unit area emitted dose.If carry out droplet ejection and do not have relatively moving in same point, just can carry out so-called dual coating.

When at the spray regime of the injection of certain regional each nozzle of inner control/not, compare with second kind of situation of carrying out spraying for 100 times, first kind of situation carried out 50 injections, have comparatively sparse arrangement, and the per unit area emitted dose of first kind of situation is second kind of situation half.

According to the present invention, the distance interval between the control prepared Chinese ink injection of material position, so that can regulate the situation of close/white-out row of prepared Chinese ink material, thereby the condition dielectric film forms the emitted dose of regional per unit area.

The present invention also provides a kind of multilayer circuit board, and it comprises:

At least two wiring layers;

Be located at the inner layer insulating film between every adjacent two wiring layers, the thickness that changes inner layer insulating film by the concaveconvex shape that forms the zone according to inner layer insulating film forms described inner layer insulating film, so that the upper surface of described inner layer insulating film is smooth; And

A plurality of conductive poles are in order to provide conductivity between wiring layer.

According to the present invention, can obtain and those effect similar effects that obtain by above-mentioned manufacture method, and can make and have superior isolation performance multi-layer circuit board between each wiring layer.

The present invention also provides a kind of electronic installation that comprises above-mentioned multilayer circuit board.In this case, can obtain and those effect similar effects that obtain by described multilayer circuit board, and can make the electronic installation that prevents dielectric breakdown.

The present invention also provides a kind of electronic device, and it comprises:

At least two wiring layers;

According to the present invention, the similar result of those results that can obtain being obtained with above-mentioned manufacture method, and can make the electronic device that has the superior isolation performance between each wiring layer.

The present invention also provides a kind of electronic installation that comprises above-mentioned electronic device.In this case, the similar result of those effects that can obtain being obtained with described electronic device, and can make the electronic installation that prevents dielectric breakdown.

Description of drawings

Figure 1A-1H is the schematic diagram of each process of expression first embodiment of the invention multilayer circuit board fabrication method;

Fig. 2 A-2H also is the schematic diagram of expression first each process of embodiment multilayer circuit board fabrication method;

Fig. 3 A-3C still represents the schematic diagram of first each process of embodiment multilayer circuit board fabrication method;

Fig. 4 A and 4B are the schematic diagrames of used droplet ejection device among expression first embodiment, wherein

Fig. 4 A is the perspective view of the general structure of expression droplet ejection device, and Fig. 4 B is the end view of this droplet ejection device major part of expression;

Fig. 5 is the drive signal waveform schematic diagram that adds to the piezoelectric element of droplet ejection device among expression first embodiment;

Fig. 6 is the schematic diagram of each process of expression second embodiment of the invention multilayer circuit board fabrication method;

Fig. 7 is the schematic diagram of expression according to each process of multilayer circuit board fabrication method of a kind of remodeling of second embodiment;

Fig. 8 A-8E is the schematic diagram of each process of expression third embodiment of the invention multilayer circuit board fabrication method;

Fig. 9 A and 9B are the schematic diagrames of each process of expression fourth embodiment of the invention multilayer circuit board fabrication method;

Figure 10 A-10D is the schematic diagram of each process of expression fifth embodiment of the invention multilayer circuit board fabrication method;

Figure 11 A-11F is the schematic diagram of each process of expression sixth embodiment of the invention multilayer circuit board fabrication method;

Figure 12 A and 12B are the TFT bases in the LCD device that illustrates in the seventh embodiment of the invention

The schematic diagram of plate, wherein, Figure 12 A represents equivalent electric circuit, and Figure 12 B is the partial enlarged view of the described TFT substrate major part of expression;

Figure 13 is the side cutaway view of expression OLED, and a part is wherein made by eighth embodiment of the invention multilayer circuit board fabrication method;

Figure 14 is that expression comprises the perspective view that the electronic installation of multilayer circuit board and LCD device is given an example in the ninth embodiment of the invention;

Figure 15 is another perspective view of giving an example of electronic installation that comprises multilayer circuit board and LCD device among expression the 9th embodiment;

Figure 16 is the electronic installation perspective view of giving an example again that expression comprises multilayer circuit board and LCD device among the 9th embodiment.

Embodiment

Each specific embodiment hereinafter with reference to description of drawings multilayer circuit board fabrication method of the present invention.

First embodiment

Figure 1A-3C is the schematic diagram of each process of expression first embodiment of the invention multilayer circuit board fabrication method.Figure 1A-1H represents from the ink-resistant coating process to each process that forms first circuit pattern (i.e. first wiring layer) and internal layer conductive pole process.Fig. 2 A-2H represents to form the process of first inner layer insulating film.Fig. 3 A-3C represents to form second circuit pattern (i.e. second wiring layer).Each process of second inner layer insulating film and tertiary circuit pattern (i.e. the 3rd wiring layer).In the present embodiment, on a surface of substrate 10, form multilayer printed circuit.

Fig. 4 A and 4B are the schematic diagrames that droplet ejection device used in the multilayer circuit board method is made in expression.Fig. 4 A is the perspective view of the general structure of the described droplet ejection device of expression, and Fig. 4 B is the side cutaway view of this droplet ejection device major part of expression.Fig. 5 is the schematic diagram of drive signal waveform that expression adds to the piezoelectric element of droplet ejection device.

Droplet ejection device

Droplet ejection device 101 shown in Fig. 4 A has ink gun 102 (being the droplet ejection head), be used for prepared Chinese ink material 122 is ejected into substrate 10, also has shift mechanism 104, in order to the relative position between mobile ink gun 102 and the substrate 10, and have controller " CONT ", in order to control ink gun 102 and shift mechanism 104.

Utilize ink gun 102 that prepared Chinese ink material 122 is ejected on the substrate 10.Shown in Fig. 4 B, this ink gun 102 has pressure generating chamber 115, it is communicated with (nozzle bore 118 only is shown among Fig. 4 B) with a plurality of nozzle bores 118, also has piezoelectric element 120 (being components of stres), in order to give the prepared Chinese ink material in the pressure generating chamber 115 122 pressurizations, so that prepared Chinese ink material 122 is by each nozzle bore 118 ejection.

Shift mechanism 104 comprises ink gun supporting part 107, in order to the ink gun 102 that supports downward location, makes it towards the substrate 10 that is placed on the substrate platform 106.Shift mechanism 104 also comprises substrate platform drive part 108, in order to along X and Y direction about (being positioned at substrate 10 tops) ink gun 102 substrate platform 106 (being moving substrate 10) that relatively moves.

In ink gun 102, piezoelectric element 120 is between pair of electrodes 121.When adding to electric energy, described piezoelectric element 120 is subjected to bending, makes this element to outer process.Dress is with above-mentioned piezoelectric element 120 on the vibrating reed 113, and this vibrating reed is also outwardly-bent with piezoelectric element 120, thereby has increased the volume of described pressure generating chamber 115.So just the inlet (not shown) from feed will be drawn into the pressure generating chamber 115 with the corresponding a certain amount of prepared Chinese ink material 122 of pressure generating chamber 115 volumes that are increased.When discharging the electric energy of piezoelectric element 120, just recover piezoelectric element 120 and vibrating reed 113 original patterns after this.Correspondingly, its original volume also recovers in pressure generating chamber 115, and the pressure of prepared Chinese ink material 122 increases in the pressure generating chamber 115, just makes the droplet of prepared Chinese ink material 122 spray to substrate from each nozzle bore 118.

The ink ejecting method of ink gun 102 is not limited to the piezo jet method of this use piezoelectric element 120.For example, also can adopt the method for using electrothermal conversioning element, wherein electrothermal conversioning element plays energy generating element.

Controller CONT comprises CPU, such as microprocessor, in order to control the whole system of this device, also comprises a calculator with the various semiotic functions of I/O.Shown in Fig. 4 A, each in the middle of controller CONT and ink gun 102 and the shift mechanism 104 is electrically connected, thereby controls one of the injection action of ink gun 102 and shift motion of shift mechanism 104 (both controls in the present embodiment) at least.According to said structure, the injection conditions in the native system is unfixing, and the thickness that will form can be controlled.

In other words, controller CONT has following controlled function, with control prepared Chinese ink material 122 emitted doses: change about at interval function of substrate 10 jet lengths, change the amount of each droplet ejection prepared Chinese ink material 122 function, change each nozzle bore 118 orientation with the function of utilizing angle θ between shift mechanism 104 direction of displacement, determine on the substrate 10 in the same position repetition injection action function of injection conditions each time and the function of each subregion on the substrate 10 being determined injection conditions.Here add to the drive waveforms of piezoelectric element 120 voltages by control, drive described injection conditions.

As changing jet length controlled function at interval on substrate 10, controller CONT has the function that changes relative moving speed between substrate 10 and the ink gun 102, the function that changes the time interval between each spraying in the process of relatively moving, and the function of selecting some nozzle bore that sprays prepared Chinese ink material 122 simultaneously 118.

Fig. 5 represents to add to the drive signal of piezoelectric element 120 and the example of the corresponding state (seeing the dash area each little figure relevant with reference symbol B1 to E5) of the prepared Chinese ink material 122 that sprays from nozzle bore 118.As three kinds of different points, the point of promptly less (or fine), medium point and bigger point illustrate the principle of injection prepared Chinese ink material 122 hereinafter with reference to Fig. 5.

Drive waveforms WA among Fig. 5 is the basic waveform that drive signal generation circuit produces.The waveform WB that forms during " Part1 " of basic waveform part is used to vibration " falcate " liquid level (promptly not being the plane), near so that diffusion prepared Chinese ink material 122 nozzle bore 118, its viscosity increases, also is simultaneously to spray for the trace that prevents not enough prepared Chinese ink material 122.The little figure relevant with reference symbol B1 represents the situation of static meniscus, and the little figure explanation relevant with reference symbol B2 is by charging prevailingly to piezoelectric element 120 and increasing the volume of pressure generating chamber 115, and meniscus slightly pulls to the operation of nozzle bore 118 inside.

The waveform WC that forms during " Part2 " of basic waveform part is used to spray the point of fine prepared Chinese ink material 122.From initial inactive state (seeing the little figure relevant), piezoelectric element 120 is charged suddenly, so that meniscus is drawn in the nozzle bore 118 (seeing the little figure relevant with reference symbol C2) apace with reference symbol C1.After this, begin the time synchronized that moves towards the outlet of nozzle once more with the meniscus that is subjected to drawing, the volume of pressure generating chamber 115 slightly reduces (seeing the little figure relevant with reference symbol C3), so that sprays the droplet of less prepared Chinese ink material 122.Secondary discharge (symbol C4 sees reference) after the disconnected in force discharge in order that suppress the vibration of meniscus and add to the remaining signal of piezoelectric element 120, and sprays prepared Chinese ink material 122 in order to control.

The waveform WD that forms during " Part3 " of basic waveform part is used to spray medium droplet.From initial inactive state (seeing little figure D1), meniscus is by progressively and be to pull to nozzle interior (seeing the little figure relevant with reference character D 2) significantly.After this, begin the time synchronized that moves towards the outlet of nozzle once more with meniscus, the volume of pressure generating chamber 115 reduces (seeing the little figure relevant with reference character D 3) suddenly, so that sprays the droplet of medium prepared Chinese ink material 122.After this, piezoelectric element 120 is carried out stable charge and discharge operation (symbol D4 sees reference), so that suppress the residual vibration of meniscus and piezoelectric element 120.

The waveform WE that forms during " Part2 " and " Part3 " of basic waveform part is used to spray the droplet of bigger prepared Chinese ink material 122.In the step of reference symbol E1 to E3 indication, spray the fine droplet of prepared Chinese ink material 122.After this, be filled the time synchronized of prepared Chinese ink material 122 once more, the waveform that sprays fine droplet is added to piezoelectric element 120 with make nozzle bore 118 by the small residual vibration of meniscus.The drop volumes of the prepared Chinese ink material 122 that sprays during each step shown in reference symbol E4 and the E5 is bigger than medium droplet, thereby forms the droplet of the prepared Chinese ink material 122 that more strengthens, and it comprises this bigger droplet and previous less droplet.According to above-mentioned control to drive signal, can be little, in, any injection prepared Chinese ink material 122 in big three kinds of different sizes (they being volume).

The droplet ejection method that the droplet ejection device 101 of present embodiment adopts can be carried out above-mentioned injection control to each nozzle bore 118 separately.Therefore, can determine the target area that to spray at an easy rate.In other words, can be effectively on the target coated film limited recessed portion atomizing of liquids material.

The prepared Chinese ink material

According to the characteristics of the wiring layer, internal layer conductive pole and the inner layer insulating film that constitute multilayer circuit board, determine the type of used prepared Chinese ink material 122 in the droplet ejection device 101.As the prepared Chinese ink material that forms the present embodiment wiring layer, adopt conductive ink with conductivity.Use a kind of solution (ProductName: Perfect Silver of silver-colored microparticulate in toluene that diameter is about 10nm, make by VacuumMetallurgical company) obtain this conductive ink, and with this solution of dilution with toluene, and diluted solution viscosity of putting is adjusted to 3mPas, thereby obtain described conductive ink.

The ink-resistant coating process

The ink-resistant coating process of upper surface of base plate experience below will be described.According to this process, can further control conductive ink or the ink jet position on substrate exactly.

Clean the substrate 10 that polyimides makes with IPA (isopropyl alcohol) after, be that the ultraviolet light (UV) of 254nm is at 10mW/cm with wavelength ²Intensity under make substrate 10 illuminated 10 minutes, the cleaning that adds (being the ultraviolet irradiation cleaning).For making this substrate 10 stand the ink-resistant coating process, 0.1g ten hexafluoros-1,1,2,2-tetrahydro decyl triethoxysilane and substrate 10 are put into airtight container, and keep 2 hours in container under 120 ℃.So, on substrate 10, form the ink-resistant monolayer.Be formed with the upper surface of substrate 10 of ink-resistant monolayer and the contact angle between the conductive ink of spraying towards this upper surface on it for example near 70 °.

For form multilayer printed circuit by the droplet ejection method for, above-mentioned too big through substrate surface and the contact angle between the conductive ink after the ink-resistant coating processing.Therefore, also must make this substrate 10 exposures 2 minutes, thereby the contact angle that obtains between conductive ink and the substrate surface is approximately 35 ° with the ultraviolet light of used same wavelength (being 254nm) in the above-mentioned cleaning step.

Replace carrying out the ink-resistant coating and handle, can form receiving layer.

The first circuit pattern forming process

Droplet ejection device 101 is used to spray conductive ink 122a (seeing Figure 1A) from ink gun 102a to the substrate of handling through above-mentioned ink-resistant coating 10, thereby forms the bit map pattern with specific droplet.After this, carry out heating steps, to make circuit pattern.

As ink gun 102, can use commercial ink gun (as the ink gun that uses in the commercial printer " Colorio " of Seiko Epson production).But, the used blotting unit of this commercial ink gun is made of plastics, thereby uses metallic unit to replace this plastic unit, so that the unlikely dissolving that is subjected to organic solvent.When the driving voltage of ink gun 102a is when spraying conductive ink under the 20V condition, to spray 5 skin liter (picoliter) conductive ink 122a.In this case, the diameter of the conductive ink 122a that is sprayed is near 27 μ m.Under 35 ° of contact angles after substrate 10 sprays conductive ink 122a, conductive ink 122a forms the spot that diameter is about 45 μ m on substrate 10.

Circuit pattern special case as drawing on substrate 10 designs a kind of binary (being black and white) bit map (bit map) that makes on the square structure aperture plate of the every length of side 50 μ m.Spray conductive ink 122a according to this bit map.That is to say that spray the conductive ink that contains silver-colored particulate from ink gun 102a to substrate 10, wherein the unit gap between each eject position is 50 μ m (seeing Figure 1A).

In these cases, the diameter that is injected in each droplet on the substrate 10 is about 45 μ m, thereby adjacent droplet 13 does not contact each other, and each droplet (being droplet 13) separates on substrate 10.After spraying a corresponding target pattern, make substrate 10 15 seconds of drying through heated air under 100 ℃, so that expel the solvent in the conductive ink.After this, make substrate 10 be got back to the temperature of room air up to the temperature of substrate 10, so that obtain by natural cooling a few minutes just like the state shown in Figure 1B.

After the above-mentioned steps, keep the ink-resistant characteristic of substrate 10.In addition, in drying etc., remove solvent composition, thereby form the prepared Chinese ink droplet 14 of thickness near 2 μ m from each droplet 13.The surface of prepared Chinese ink droplet 14 has the identical ink-resistant characteristic of part that does not almost form prepared Chinese ink droplet 14 with those.

Just like shown in Fig. 1 C, the droplet 15 of injection and droplet 13 same liquid is injected between two independently adjacent droplets (being prepared Chinese ink droplet 14) each droplet 15 after this.Fig. 1 C only illustrates sectional view, but when along also exist perpendicular to this figure inkjet direction less than shown in during the droplet of prepared Chinese ink droplet 14, also droplet 15 is ejected on the centre position between these droplets.

In this droplet ejection step, the ink-resistant characteristic of substrate 10 and prepared Chinese ink droplet 14 almost is identical; Thereby, can access the result much at one who sprays the gained result with the substrate 10 that on it, does not have prepared Chinese ink droplet 14 to form.

After this, make substrate 10 be subjected to the drying (being similar to above-mentioned hot-air drying) of hot-air, so that evaporate the solvent composition of conductive ink with droplet 15.Correspondingly just like shown in Fig. 1 D, form pattern 16, injected in this pattern have all prepared Chinese ink droplets that get in each adjacent aperture plate point place.

For the thickness that increases film and the shape that prevents droplet remain in the circuit pattern of described wiring layer, repeat the injecting step and the hot-air drying steps (comprising the above-mentioned first time) of 6 targets between each droplet middle (or recessed) position, thereby form first circuit pattern 17, its live width 50 μ m, thickness 10 μ m (participating in Fig. 1 E).In this stage, have only the solvent composition of conductive ink to be removed, substrate is not subjected to toast fully.Therefore, described circuit pattern does not conduct electricity effectively.

The internal layer conductive pole forms process

Form internal layer conductive pole 18 in the subsequent process, they pass one deck inner layer insulating film, in order to provide conductivity between first and second circuit patterns.Here, can live 18 by forming described internal layer conduction with the same process of above-mentioned formation first circuit pattern.In other words, only contain the conductive ink 122a of silver-colored particulate, and repeat this injecting step, after each injecting step, carry out the hot-air drying simultaneously to the area spray that needs the internal layer conduction.Repeat 6 times such injecting step, obtain internal layer and obtain post 18, measuring them from first circuit pattern highly is 10 μ m (seeing Fig. 1 F).

After this, under 300 ℃ of conditions, make substrate 10 in air, stand 30 minutes heat treatment, so that the physics contact each other of each silver-colored particulate.Correspondingly, first circuit pattern 17 physically combines mutually with each internal layer conductive pole 18.In addition, according to above-mentioned heat treatment, the total film thickness of first circuit pattern 17 and internal layer conductive pole 18 almost is half (the seeing Fig. 1 G) before the heat treatment.According to Sellotape (registered trade mark) test that is used for assessing adhesive strength between first circuit pattern 17 and the substrate 10, evaluated have enough adhesive strengths, because do not separate.

Dielectric film forms district's computational process

In subsequent process, calculate the formation zone of dielectric film.It is the zone that forms inner layer insulating film in process subsequently that dielectric film forms district 19a (seeing Fig. 1 H), according to design data zoning 19a, described data comprise (i) electronic data such as bit map pattern such as first circuit pattern 17 and internal layer conductive pole 18, and (ii) such as the emitted dose of each droplet, the arrangement of each droplet, the set points such as number of times of implementation injecting step etc.

According to calculating according to described design data, calculate dielectric film and form district 19a, the upper surface 17a of this upper surface 10a, first circuit pattern 17 and side 17b, and the concaveconvex shape that forms of the side 18b of internal layer conductive pole 18 by (i) substrate 10, and (ii) the design thickness of inner layer insulating film is determined.

Carry out the computational process that described dielectric film forms the district by CPU, described CPU perhaps has the computer to various signal I/O functions such as being the microcomputer that is used to control droplet ejection device 101 whole systems.Therefore, can carry out this computational process in any time before inner layer insulating film forms.

Ink-receptive processing

Form in the described inner layer insulating film preprocessing process in being used to dielectric film formation district 19a, the ultraviolet light that with the wavelength is 254nm is by 10mW/cm ²Intensity to substrate 10 irradiation that are formed with first circuit pattern 17 on it 5 minutes, thereby the upper surface 17a of the upper surface 10a of prepared Chinese ink to substrate 10, first circuit pattern 17 and side 17b, and the ink affinity (characteristic) of the side 18b of internal layer conductive pole 18 are provided.

The first inner layer insulating film forming process

In subsequent process, form inner layer insulating film, form district 19a so that cover described dielectric film with dielectric film.

By such as the commercial polyimides varnish of dilution (ProductName: Pimel, by Asahi Kasei company make), and be controlled at 8mPas, obtain present embodiment and form the used prepared Chinese ink material of inner layer insulating film by viscosity with diluted material.

Make droplet ejection device 101 work then,, only make that upper surface 10a and first circuit pattern, the 17 formed recessed portions by substrate 10 are filled described prepared Chinese ink material (Fig. 2 A) to spray above-mentioned prepared Chinese ink material 122b.

In the step of spraying prepared Chinese ink material 122b, control adds to the driven waveform of ink gun 102b, so that regulate the amount that per unit area sprays prepared Chinese ink material 122b.For example, when drive waveforms being defined as a higher voltage added to piezoelectric element 120, can increase the emitted dose of each droplet.On the contrary, when drive waveforms being defined as a lower voltage added to piezoelectric element 120, can reduce the emitted dose of each droplet.On the other hand, when drive waveforms being defined as increasing unit interval during umber of pulse that adds to piezoelectric element 120 voltages, can increase the emitted dose of per unit area; On the contrary, when drive waveforms being defined as reduce this umber of pulse of unit interval, can reduce the emitted dose of per unit area.

By using the relative moving speed between suitable setting substrate 10 of controller CONT and the ink gun 102b, spray prepared Chinese ink material 122b by required injection interval.Here, can change the time interval of spraying during described the relatively moving.For example, when setting higherly, obtain (between each eject position) bigger distance to described relative moving speed at interval, thereby make each spray site of prepared Chinese ink material 122b be able to sparsely be arranged.On the contrary, when described relative moving speed being set low, obtain less distance at interval, thereby make each spray site of prepared Chinese ink material 122b be able to closely be arranged.If carry out droplet ejection in same point, and do not relatively move, then can carry out the two coatings of what is called.In addition, the spray regime of the injection by controlling each nozzle/not can change the emitted dose of per unit area.

As mentioned above, in the first step that forms inner layer insulating film, the recessed portion that the side 17b of the upper surface 10a of substrate 10 and first circuit pattern 17 forms to formed district 19b by dielectric film in sprays prepared Chinese ink material 122b (seeing Fig. 2 A).Described upper surface 10a and side 17b have ink affinity; So shown in Fig. 2 B, the prepared Chinese ink material 122b of injection covers on the above-mentioned recessed portion, and all recessed portions are all filled out with prepared Chinese ink material 122b.Here, because the automatically levelling effect makes the upper surface of prepared Chinese ink material 122b smooth.

Make then substrate 10 under 400 ℃ through heat treatment in 30 minutes so that remove contained solvent composition among the prepared Chinese ink material 122b, thereby form first inner layer insulating film 22.So shown in Fig. 2 C, the thickness of described first inner layer insulating film 22 almost is half of prepared Chinese ink material 122b thickness before the heat treatment.Therefore, be similar to above-mentioned injecting step, on first inner layer insulating film 22, spray prepared Chinese ink material 122b again, and carry out same heat treatment (promptly under 400 ℃, 30 minutes) so that solidify the prepared Chinese ink material, thus such shown in Fig. 2 D, fill by the upper surface 10a of substrate 10 and the formed recessed portion of side 17b of first circuit pattern 17 with this first inner layer insulating film 22, and locate to form smooth surface at the horizontal plane of the upper surface 17a of first circuit pattern 17 (promptly highly face).Above-mentioned injection prepared Chinese ink material 122b and heat treated step can be repeated any suitable number of times.

The second inner layer insulating film forming process

In subsequent process, spray prepared Chinese ink material 122b, the recessed portion that side 18b by the upper surface 22a of the flat upper surfaces 17a of first circuit pattern 17, first dielectric film 22 and internal layer conductive pole 18 is formed is filled out with prepared Chinese ink material 122b, thereby forms second inner layer insulating film 23.

Described upper surface 17a and side 18b have ink affinity, and upper surface 22a has as the same composition of contained polyimides varnish among the prepared Chinese ink material 122b.Therefore, just like shown in Fig. 2 F like that, the prepared Chinese ink material 122b that is sprayed cover above-mentioned recessed portion above, and all recessed portions all are filled with prepared Chinese ink material 122b.Here, because the automatically levelling effect makes the upper surface of prepared Chinese ink material 122b smooth.

Make then substrate 10 under 400 ℃ through heat treatment in 30 minutes so that remove solvent composition among the prepared Chinese ink material 122b, thereby form second inner layer insulating film 23.So shown in Fig. 2 G, the thickness of described second inner layer insulating film 23 almost is half of prepared Chinese ink material 122b thickness before the heat treatment.Therefore, be similar to above-mentioned injecting step, on second inner layer insulating film 23, spray prepared Chinese ink material 122b again, and carry out same heat treatment (promptly under 400 ℃, 30 minutes) so that solidify the prepared Chinese ink material, thus such shown in Fig. 2 H, with this second inner layer insulating film 23 fill by first circuit pattern 17 upper surface 17a and the formed recessed portion of side 18b of internal layer conductive pole 18, and the upper surface 23a of second inner layer insulating film 23 is smooth.

As mentioned above, so that first inner layer insulating film 22 and second dielectric film, 23 stacked modes form these films, thereby form inner layer insulating film 24 with flat upper surfaces.

Above-mentioned injection prepared Chinese ink material 122b and heat treated step can be repeated any suitable number of times.

Preferably make the upper surface 23a (about 0.1 μ m) of the upper surface 18a of internal layer conductive pole 18 a little more than second inner layer insulating film 23.

Second circuit pattern forming process

In order on inner layer insulating film 24, to form second circuit pattern 31 (i.e. second wiring layers), carry out and the same process of formation first circuit pattern.Just, IPA cleans, UV irradiation cleaning, use the alkyl silane fluoride the ink-resistant coating process, form pattern by the prepared Chinese ink of carrying out UV irradiation control contact angle, containing silver-colored particulate by injection, and carry out the hot-air drying.Here, as required, repeatedly repeat " ink jet → hot-air drying " process.So, can make multilayer circuit board.

In order to make the multi-layer sheet that comprises more multi-layered structure, as shown in Figure 3A, on first circuit pattern 17, form internal layer conductive pole 32 similarly, and internal layer conductive pole 32 is also toasted with the second circuit pattern, so that conductivity to be provided.Shown in Fig. 3 B, also in same process, form inner layer insulating film 33, just as inner layer insulating film 24 shown in the formation.As required, repeatedly repeat this a series of processes, thereby make multilayer circuit board with required multilayer grade.Shown in Fig. 3 C for example in, on first and second wiring layers, form the 3rd wiring layer (being the tertiary circuit pattern).

As mentioned above, according to the data designed, can form the upper surface of smooth inner layer insulating film 24 to first circuit pattern 17 and internal layer conductive pole 18.

According to the flat upper surfaces of inner layer insulating film 24, can make the uniform film thickness of second circuit pattern 31, so that can between first circuit pattern 17 and second circuit pattern 31, provide good insulation property, and can avoid opening circuit between each wiring layer.

In addition, second circuit pattern 31 is formed on the upper surface of inner layer insulating film 24; So, form second circuit pattern 31 along the flat upper surfaces of inner layer insulating film 24.Therefore, if further form multilayer upper layer film (promptly the 3rd or more circuit pattern or inner layer insulating film), then also can make the upper surface of each film smooth at an easy rate, and can make the thickness of film even at an easy rate.

Form the shape of district 19a in advance according to the data computation dielectric film of first designed circuit pattern 17 and internal layer conductive pole 18; Therefore, need not to measure the process that dielectric film forms district 19a.

In addition, add to the driven waveform of ink gun 102, can spray an amount of prepared Chinese ink material 122 by control; So it is controlled that the per unit area that also can make dielectric film form district 19a sprays the amount of prepared Chinese ink.Can also control the distance interval between each spray site; Thereby, can control prepared Chinese ink material 122 pile up be how closely or away from, also be used to control the amount that per unit area that dielectric film forms district 19a sprays prepared Chinese ink.

Second embodiment

Fig. 6 is the schematic diagram of a step in the expression second embodiment of the invention multilayer circuit board fabrication method.In the present embodiment, replace the dielectric film among first embodiment to form district's computational process, carry out the measuring process that dielectric film forms the district.Other process all is basically the same as those in the first embodiment.

Below will describe the process different in detail with first embodiment.About other process, will the serial flow process that form each process of multilayer circuit board only be described.Among Fig. 6, provide same reference number with part same among Figure 1A to Fig. 4 B.

In the multilayer circuit board fabrication method of present embodiment, carry out (i) ink-resistant process to substrate 10 in regular turn, the (ii) first circuit pattern forming process, and (iii) the internal layer conductive pole forms process (seeing Figure 1A to 1G) afterwards, carries out dielectric film formation region measurement process shown in Figure 6.

Dielectric film forms region measurement process (1)

Utilize laser vertical survey device to carry out this process, described laser vertical survey device is a kind of non-contact type vertical survey device.Described laser vertical survey device has a gauge head, and it comprises light radiating portion and light receiving part, wants near the measured target object with the scanning of this gauge head, so that utilize distance between this gauge head of optical interferometry and the target object.

As shown in Figure 6, scan the whole surface that is formed with the substrate 10 of first circuit pattern 17 and internal layer conductive pole 18 on it with gauge head 201, thereby with this substrate 10 of laser beam irradiation from light radiating portion 201a, and detect the light beam that receives by light receiving part 201b.Correspondingly, make each jog be subjected to accurate measurement as three-dimensional data.

According to this three-dimensional data, carry out graphical analysis etc., so that calculate dielectric film formation district 19b, thereby determine to form the best emitted dose of the prepared Chinese ink material 122 of district 19b injection, the number of times of arranging, carry out spraying of droplet etc. to dielectric film

After dielectric film forms the region measurement process in the subsequent step, substrate 10 is through the ink affinity processing procedure, and then also through the first inner layer insulating film forming process and the second inner layer insulating film forming process, these processes form on the 19b basis, district at described dielectric film and carry out, thereby form the inner layer insulating film with flat upper surfaces.And then carry out second circuit pattern forming process, thereby make multilayer circuit board (referring to Fig. 2 A to Fig. 3 C).

As mentioned above, according to the three-dimensional data (being measurement data) that forms district 19b for dielectric film, can form among the district 19b at dielectric film and form inner layer insulating film, described three-dimensional data is obtained by laser vertical survey device.

Here, measure the true form that comprises each jog inside dimension error (being the error between design data and the measurement data), described true form is to obtain when forming first circuit pattern and internal layer conductive pole.Therefore, compare, can make inner layer insulating film more accurately smooth in the present embodiment with the inner layer insulating film that forms according to design data.

Noncontact vertical survey device is not limited to laser vertical survey device, can utilize scanner.

Fig. 7 represents the remodeling of present embodiment multilayer circuit board method of measurement.Among the present invention, replace laser vertical survey device, adopt gauge head elder generation's line sensor (in described ink gun front) to carry out described dielectric film and form the region measurement process.The first line sensor of described gauge head is positioned near the droplet ink gun, and measures each discrepancy in elevation of jog.Below, with the explanation of omitting to each process except that dielectric film of the present invention forms the region measurement process.

Dielectric film forms region measurement process (2)

In the present invention, utilize the gauge head elder generation line sensor implementation dielectric film that is positioned near the droplet ink gun to form the region measurement process.

As shown in Figure 7, gauge head elder generation line sensor 210 via controllers 220 link to each other with ink gun 230.By gauge head elder generation line sensor 210 scanning substrates 210, and before droplet ejection, measure the discrepancy in elevation in each jog of first circuit pattern 17 and internal layer conductive pole 18.

In other words, the gauge head elder generation line sensor 210 in ink gun 230 fronts scans on it and is formed with the substrate 10 of first circuit pattern 17 and internal layer conductive pole 18, thereby measures the discrepancy in elevation in described each jog.According to the measurement result of gauge head elder generation line sensor 210, controller 220 drives ink gun 230, to carry out droplet ejection.Here, carry out vertical survey and droplet ejection in parallel mode to each jog.

As mentioned above, carry out measurement and the droplet ejection that dielectric film forms district 19b, and can in dielectric film forms district 19b, form inner layer insulating film in parallel mode.In addition, according to this remodeling, the measurement on the whole surface that formation is distinguished for dielectric film need not to use laser vertical survey device, and can carry out the vertical survey and the droplet ejection operation of each recessed portion effectively.

In addition, measure the true form that comprises each jog scale error (being the error between design data and the measurement data), described true form is to obtain when forming first circuit pattern and internal layer conductive pole.Therefore, compare, can make inner layer insulating film more accurately smooth in the present embodiment with the inner layer insulating film that forms according to design data.

The 3rd embodiment

Fig. 8 A to 8E is the schematic diagram of each step in the expression third embodiment of the invention multilayer circuit board fabrication method.Form a plurality of inner layer insulating films in the present embodiment, after making first inner layer insulating film, measure each discrepancy in elevation in this first inner layer insulating film upper surface, and according to the data of measuring, form second inner layer insulating film, so that the upper surface of first inner layer insulating film is smooth.

Below will only describe the process different in detail with first and second embodiment.About other process, will the serial flow process that form each process of multilayer circuit board only be described.Among Fig. 8 A to 8E, provide same reference number with part same among Fig. 1 to Fig. 7.

In the multilayer circuit board fabrication method of present embodiment, carrying out (i) ink-resistant process to substrate 10, the (ii) first circuit pattern forming process, and (iii) after the internal layer conductive pole formation process, carry out dielectric film successively and form district's computational process and ink affinity processing procedure (seeing Figure 1A to 1H), and carry out the first inner layer insulating film forming process shown in Fig. 8 A.

In this first inner layer insulating film forming process, form first inner layer insulating film 26 by bigger droplet, with the minimizing required time of droplet ejection process, and have bigger distance between each spray site at interval.

Form in the process of first inner layer insulating film 26 at this, control adds to the driven waveform of the ink gun 102b of droplet ejection device 101, to regulate the amount that per unit area sprays prepared Chinese ink material 122b.In addition, can consequently can carry out droplet ejection at interval by the relative moving speed between controller CONT change substrate 10 and the ink gun 102b by the distance between the required spray site.Then, make this substrate 10 be subjected to heat treatment, removing contained solvent composition among the prepared Chinese ink material 122b, and first inner layer insulating film 26 is cured.

Correspondingly, be formed with first inner layer insulating film 26 shown in Fig. 8 B.In the superincumbent process, with the sparse big droplet ejection prepared Chinese ink material 122b that arranges; Thereby the upper surface 26a of described first inner layer insulating film 26 is not accurately smooth.

Subsequent, carry out dielectric film and form region measurement process (seeing Fig. 8 C), wherein measure the discrepancy in elevation on the upper surface of first inner layer insulating film 26.

Utilize laser vertical survey device to carry out this dielectric film and form the region measurement process, this is a kind of non-contacting vertical survey device.Specifically, scan the whole surface that is formed with the substrate 10 of first inner layer insulating film 26 on it by gauge head 201, so that by upper surface 26a, and detect the light beam that receives by light receiving part 201b from laser beam irradiation first inner layer insulating film 26 of light radiating portion 201a.Correspondingly, make each discrepancy in elevation on the described upper surface 26a be subjected to accurate measurement as three-dimensional data.

According to described three-dimensional data, carry out graphical analysis etc., form district 19c to calculate dielectric film, thereby determine to arrange, carry out the number of times etc. of spraying to best emitted dose, droplet that dielectric film forms the prepared Chinese ink material 122b of district 19c injection.

Subsequent shown in Fig. 8 D, carry out the forming process of second inner layer insulating film.

Form district 19c according to dielectric film, prepared Chinese ink material 122b is sprayed to be become than the above-mentioned big littler droplet of droplet, and closely sprays them, so that fill the recessed portion in the discrepancy in elevation of first inner layer insulating film.In droplet ejection process, control adds to the driven waveform of ink gun 102b of droplet ejection device 101, to regulate the amount of the prepared Chinese ink material 122b that per unit area sprays.In addition, can consequently can carry out droplet ejection at interval by the relative moving speed between controller CONT change substrate 10 and the ink gun 102b by the distance between the required spray site.Then, make this substrate 10 be subjected to heat treatment, expelling contained solvent composition among the prepared Chinese ink material 122b, and second inner layer insulating film 27 is cured, thereby make by the formed inner layer insulating film 28 of stacked multilayer (seeing Fig. 8 E), and its upper surface 28a is smooth.

Make substrate 10 pass through second circuit pattern forming process (seeing Fig. 3 A) more then, thereby make multilayer circuit board through the second dielectric film forming process.

As mentioned above, measure each discrepancy in elevation on the surperficial 26a on first inner layer insulating film 26; So, can measure the actual discrepancy in elevation of having considered thickness and first inner layer insulating film, 26 flatness error.

Form second inner layer insulating film 27,, thereby can make the upper surface 28a of inner layer insulating film 28 smooth so that fill the recessed portion in each discrepancy in elevation.Therefore, compare, can form the upper surface 26a of first inner layer insulating film 26 comparatively cursorily with second inner layer insulating film 27; So can form first inner layer insulating film 26, can reduce the required time of droplet ejection method.

In addition, separately form first inner layer insulating film 26 and second inner layer insulating film 27 in regular turn; Thereby the amount that is used for forming second inner layer insulating film, 27 eject micro-droplets is lacked than once forming required inner layer insulating film 28 required emitted doses.So, can carry out droplet ejection, control its key factor emitted dose, thereby form accurately smooth upper surface 28a.

In the present embodiment, first inner layer insulating film 26 is formed by the droplet ejection method, but this is not to be qualifications.That is to say, can form first inner layer insulating film 26,, and measure the discrepancy in elevation on this tunic, form second inner layer insulating film 27 then, to fill the recessed portion in the discrepancy in elevation such as, whirl coating etc. by other method.

The 4th embodiment

Fig. 9 A and 9B are the schematic diagrames of each step in the expression fourth embodiment of the invention multilayer circuit board fabrication method.Be that both sides (promptly two surface on) in central substrate 40 form multilayer printed circuit in the present embodiment.

When being similar to first to the 3rd embodiment, can only obtain the single face substrate like that with droplet ejection method formation circuit pattern and insulating film pattern.For the both sides at substrate form multilayer printed circuit, adopt common both sides circuit board as central substrate 40, and make each side experience of substrate be similar to practiced those processes among first to the 3rd embodiment.

Described central substrate 40 does not preferably have through hole; Thereby, preferably be full of metal paste 41 (this paste can be a wiring layer) to through hole.If use a side that the substrate of thin copper foil is arranged, have the hole of non-perforation, and be full of metal paste can for these holes.Can provide such hole by known photoetching or laser radiation.In addition, can provide the droplet ejection method, the conductive ink of filling for the hole of above-mentioned through hole or non-perforation to contain silver-colored particulate (promptly with first to the 3rd embodiment in used same conductive ink).

Therefore, at first all form circuit pattern in the both sides of central substrate 40, and carry out series of steps in regular turn: the process that (i) forms internal layer conductive pole 42, (ii) form the process of inner layer insulating film 43, and one deck circuit pattern 44 (being next wiring layer) under (iii) forming, and as required, stress multiple these processes at each, thereby make multilayer printed circuit in the both sides of central substrate 40.

The 5th embodiment

Figure 10 A to 10D is the schematic diagram of each process of expression fifth embodiment of the invention multilayer circuit board fabrication method.Present embodiment adopts CSP (chip scale package-wafer-level package) method, to form additional wiring, also promptly by directly form the circuit case on chip.

Shown in Figure 10 A, the IC chip 50 that at first uses monomolecular film to make to be formed with a plurality of electrode pads 51 on it is through the ink-resistant processing procedures.Except using decyl-triethoxysilane as the used material of monomolecular film, this process almost be identical described in first to the 3rd embodiment.

Then, shown in Figure 10 B, according to the process described in first to the 3rd embodiment, form internal layer conductive pole 52, each internal layer conductive pole 52 is positioned at the center of each electrode pad 51, highly is 5 μ m, and diameter is 50 μ m.In addition, form inner layer insulating film 53, almost the upper surface with internal layer conductive pole 52 is identical to make the height of this inner layer insulating film 53.Correspondingly, when exposing each internal layer conductive pole 52 reliably, can form described inner layer insulating film 53 with flat upper surfaces.

After this, identical with above-mentioned each process, carry out ink-resistant process, second circuit pattern forming process, internal layer conductive pole in regular turn and form process and inner layer insulating film forming process, thereby make the additional wiring 54 (being the additional wiring layer) that links to each other with electrode pad 51 on the described IC chip 50.Subsequent, by the Wiring method of carrying out among the same known etching method or first embodiment, at the flange 56 (also playing wiring layer) that forms a plurality of pads 55 (also playing wiring layer) and form on each pad 55 on the internal layer conductive pole 52, described each internal layer conductive pole 52 is exposed in the surface of substrate.

The 6th embodiment

Figure 11 A to 11F is the schematic diagram of each process of expression sixth embodiment of the invention multilayer circuit board fabrication method.In the present embodiment, with above-mentioned manufacture method formation dish line part, as the antenna terminal that does not have in the lead-in wire IC-card 60 (it is a multilayer circuit board).Figure 11 B, 11D and 11F are respectively the profiles of Figure 11 A, 11C and 11E, provide each profile along the line between two

pads

65,65.

Do not have lead-in wire IC-card 60 and have the IC chip 63 that is installed on the polyimide film 61, also have to be and coil nemaline antenna 62 (it is a wiring layer).IC chip 63 comprises nonvolatile memory, logical circuit, high-frequency circuit etc., and involves the electric energy that reception supplies with and work by receive the radio that sends from external emitters through antenna 62.IC chip 63 is also analyzed the signal of receiving through antenna 62, and the signal of transmission and the corresponding characteristic frequency of analysis result.

In order to make this IC-card, by the first circuit pattern forming process that is similar to first embodiment, linear antenna 62 (seeing Figure 11 A) is coiled in formation on polyimide film 61.In this course, form each pad 64 (as wiring layer) and terminals 63a simultaneously, described IC chip 63 is installed therebetween.After forming antenna 62, be similar to first embodiment, on each pad 64, form first conductive pole 65.Then,, form inner layer insulating film 66, make that the upper surface of internal layer conductive pole 65 is exposed (seeing Figure 11 C) by apply described pattern with polyimide material according to the method described in first to the 3rd embodiment.

After forming inner layer insulating film 66, with first embodiment similarly.By the droplet ejection method, be coated with pattern P A shown in Figure 11 E with the conductive ink that contains silver-colored particulate, and make coated partly solidified, thereby form wiring 67, two terminations will coiling wire antenna 62 thus connect together.In last step, utilize anisotropic conductive film that IC chip 63 is installed on the position shown in Figure 11 E, and make the stacked layer protecting film (not shown) of entire portion, there is not lead-in wire IC-card 60 thereby make.

This nothing lead-in wire IC-card 60 is such as getting in touch with the outside loader/register near IC-card (such as from the about 10 μ m or littler of IC-card).

If each pad 64 big (such as being of a size of several millimeters * several millimeters), then can form inner layer insulating film 66 and internal layer conductive pole 65 is not provided, make it possible to keep the required area (promptly not covering inner layer insulating film) of internal layer conduction, thereby form multilayer printed circuit.In this case, the tapered shape in edge of each pad 64 of primary insulation rete 66, so, by the droplet ejection method, on inner layer insulating film 66, form the wiring 67 of not opening circuit.

The 7th embodiment

In the 7th embodiment, explanation is had liquid crystal display (LCD) device of TFT substrate, TFT (thin-film transistor) substrate is corresponding to multilayer circuit board.

The manufacture method of above-mentioned multilayer circuit board is applicable to the manufacture method of TFT substrate in the present embodiment, therefore, and with the explanation of omitting to it.

Figure 12 A and 12B are the schematic diagrames in order to the TFT substrate in the explanation LCD device.Figure 12 A represents equivalent electric circuit, such as switching TFT element and wirings such as (hereinafter to be referred as TFT), provides this circuit diagram, corresponding to the image displaying area of LCD device in order to expression.Figure 12 B is the partial enlarged view of expression TFT substrate major part, with reference to this view, so that the structure of explanation TFT and the pixel capacitors of each pixel.

Shown in Figure 12 A, on TFT substrate 400, form the scan line 401 line up matrix form and data wire 402, pixel capacitors 430, and in order to control the TFT410 of each pixel capacitors 430.In this structure, will as sweep signal Q1, the Q2 of pulse signal ... and Qm adds to scan line 401, and with picture intelligence P1, P2 ... and Pn offers data wire 402.Introduce that described below like that described scan line 401 links to each other with source electrode 411S with the grid 410G of TFT410 respectively with data wire 402, and with sweep signal Q1, Q2 ... with Qm and picture intelligence P1, P2 ... with Pn drive TFT 410.In addition, holding capacitor 420 is set, in order to picture intelligence P1, the P2 that will have particular signal level ... and Pn specific cycle of storage.Electric capacity line 403 links to each other at the two ends with each holding capacitor 420 respectively with drain electrode 411D (below have state).According to this holding capacitor 420, can keep the current potential of each pixel capacitors 430.

Structure hereinafter with reference to Figure 12 B explanation TFT410.As shown in the figure, TFT410 is so-called bottom gate type (bottom gate type) (being paraphase type-inverted-stagger type).Specifically, stacked in regular turn insulated substrate 400a, be formed at the lip-deep ground protection film 4001 of described insulated substrate 400a, grid 410G, gate insulating film 410I, channel region 410C as TFT substrate 400, and the dielectric film 411I that uses of ditch pipe protection.Form source region 410S and drain region 410D in described dielectric film 411I both sides, they are highdensity n-type amorphous silicon films.On the surface of source region 410S and drain region 410D, form source electrode 411S and drain electrode 411D respectively.

And then inner layer insulating film 412I and pixel capacitors 430 are placed in a side on source electrode 411S and drain electrode 411D surface, and wherein pixel capacitors 430 is transparency electrodes that ITO (indium tin oxide) etc. makes.Pixel capacitors 430 is electrically connected with drain electrode 411D through the contact hole of break-through inner layer insulating film 412I.

Above-mentioned gate insulating film 410I and inner layer insulating film 412I are corresponding to inner layer insulating film of the present invention.That is to say, according to form concavo-convex (wherein being formed with relevant inner layer insulating film) adjusting thickness that the district forms by dielectric film, so that make the flat upper surfaces of described inner layer insulating film.

In having the TFT substrate of said structure, according to sweep signal Q1, Q2 ... and Qm, electric current is provided for grid 410G from scan line 401, thereby near grid 410G, produces electric field.Rely on this electric field, channel region 410C becomes conduction.Under such conduction state, according to picture intelligence P1, P2 ... and Pn, also make electric current be added to source electrode 411S, make pixel capacitors 430 become conduction, thereby add to voltage in each pixel capacitors 430 and in the face of between the electrode of this pixel capacitors 430 from data wire 402.That is to say, by gated sweep signal Q1, Q2 ... and Qm and picture intelligence P1, P2 ... and Pn can drive the LCD device suitably.

In having the LCD device of said structure,, can make gate insulating film 410I and inner layer insulating film 412I smooth according to the manufacture method of above-mentioned multilayer circuit board.Therefore, according to present embodiment, also can obtain above-mentioned each effect.

In addition, smooth along with gate insulating film 410I, the surface of TFT410, source electrode 411S and drain electrode 411D all can be smooth, and can be smooth.Therefore, (i) do not have because of in coating region, producing the problem due to the uneven surface, (ii), (iii) can prevent, thereby improve the productivity ratio of product such as problems such as generation leakage current, short circuits not such as undesirable residue film problem after dry etching.

On the other hand, smooth along with inner layer insulating film 412I, can make the upper surface of each pixel capacitors 430 smooth, so, the oriented film (alignment film) that forms on making each pixel capacitors 430 is when being subjected to milled processed, can obtain uniform finished product, thereby in liquid crystal material, obtain optimal orientation.In addition, can make the uniform film thickness that is arranged in the liquid crystal material on each pixel capacitors 430.

The manufacture method of above-mentioned multilayer circuit board is not limited to be used for gate insulating film 410I and inner layer insulating film 412I, and it can be used for other dielectric film.For example, if between scan line 401, data wire 402 and electric capacity line 403, inner layer insulating film is set, then this method can be used for those dielectric films.

In addition, the TFT in the present embodiment is a bottom gate type, but also this manufacture method can be used for the TFT of top grid type.

The 8th embodiment

In the eighth embodiment of the present invention, will illustrate just like the organic electroluminescenoe device that uses the TFT substrate described in the 7th embodiment like that (hereinafter to be referred as " OLED ").In other words, identical among the OLED among used TFT substrate and the 7th embodiment, thereby will omit explanation to it.

Figure 13 is the side cutaway view of expression OLED, and a part is wherein made by above-mentioned multi-layer circuit board fabrication process.The general structure of OLED at first is described.

As shown in figure 13, this organic field luminescence (EL) device 301 has substrate 311, circuit element part 321, pixel capacitors 331, organic electroluminescent device 302, and hermetic sealing substrate 371.Organic EL 302 comprises embankment wall (bank) part 341.Photocell 351 and negative electrode 361 (being counter electrode).The wiring of flexible substrate (not shown) links to each other with organic EL device 301, circuit element part 321 and pixel capacitors 331 aptly with drive IC.Described circuit element part 321 is formed on the substrate 311, and pixel capacitors 331 is disposed on the circuit element part 321.Each embankment wall partly is located between the neighboring pixels electrode 331, and each embankment wall partly is arranged to the grid form.Each photocell 351 is located in each recessed portion because of each embankment wall part gained.Negative electrode 361 covers the upper surface of each embankment wall part 341 and photocell 351, and hermetic sealing substrate 371 be located at negative electrode 361 above.

Circuit element part 321 comprises TFT 321a, the first inner layer insulating film 321b and the second inner layer insulating film 321c of bottom gate type.The general structure of described TFT 321a is omitted the explanation to it here with identical shown in Figure 12 B.Utilize manufacture method of the present invention to form the first inner layer insulating film 321b and the second inner layer insulating film 321c.In other words, according to the thickness of concavo-convex each inner layer insulating film of adjusting that forms in the corresponding inner layer insulating film formation district, so that the upper surface of each inner layer insulating film is smooth.

By the droplet ejection method, on a pair of first inner layer insulating film 321b and the second inner layer insulating film 321c, form described photocell 351.

OLED301 described above is called as (height) polymer El element with photocell 351 of being made by the droplet ejection method.

Manufacture method with OLED301 of organic EL device comprises: the embankment wall that forms each embankment wall part 341 partly forms step, be suitable for forming the plasma treatment step of photocell 351, the photocell that forms photocell 351 forms step, the opposite electrode that forms negative electrode 361 forms step, and on negative electrode 361 the sealing step of stacked hermetic sealing substrate 371, purpose is sealing.

In photocell forms step,, also promptly on each pixel capacitors 331, form hole injecting layer 352 and light-emitting layer 353 and make described smooth radiating portion 351 by in each recessed portion 344.So described photocell forms step and comprises that the hole injecting layer forms step and light-emitting layer forms step.And then described hole injecting layer forms step and comprises: spray first injecting step of first component (being liquid material) here, in order to form hole injecting layer 352 on each pixel capacitors 331; And first drying steps of dry first component of being sprayed, so that make hole injecting layer 352.And described light-emitting layer forms step and comprises: spray first injecting step of second component (being liquid material) here, in order to form light-emitting layer 353 on described hole injecting layer 352; And second drying steps of dry second component of being sprayed, so that make light-emitting layer 353.

In the OLED that as above makes, according to the manufacture method of above-mentioned multilayer circuit board, the described first inner layer insulating film 321b and the second inner layer insulating film 321c are smooth, thereby can obtain above-mentioned various effect.

In addition, adopt the droplet ejection method on the first smooth inner layer insulating film 321b and the second inner layer insulating film 321c, to form described hole injecting layer 352 and light-emitting layer 353.Therefore, with form described hole injecting layer 352 and compare by described layer 352 and 353 being sprayed liquid materials with the method for light-emitting layer 353 towards convex-concave surface, described liquid material does not concentrate in the recessed portion, and can see through liquid material on each pixel capacitors 331 equably.Therefore, it all is uniform can making the thickness of hole injecting layer 352 and the thickness of light-emitting layer 353.Correspondingly, can prevent fully that deficiency, the emission lifetime launched from reducing and each pixel capacitors 331 and the short circuit between the negative pole 361 accordingly, and this is can be caused by membrane thickness unevenness.

Above-mentioned organic EL device is not limited to the high polymer type, and can be the low-molecular-weight type.

Also manufacture method of the present invention can be applied to have other device of any wiring, such as the multilayer wiring pattern that can be used for making in the electrophoresis device.

The 9th embodiment

Below explanation is had several examples of the electronic installation of circuit board that the above-mentioned multilayer circuit board fabrication method of described employing makes or LCD device.

Figure 14 is the perspective view that expression portable phone (being electronic installation) is given an example.The main body of the reference number 1000 expression portable phones among Figure 14, it comprises the multilayer circuit board that is made by above-mentioned manufacture method, and reference number 1001 expressions have the LCD part of above-mentioned LCD device.

Figure 15 is the perspective view that expression watch kind electronic installation is given an example.The main body of the reference number 1100 expression wrist-watches among Figure 15, it comprises the multilayer circuit board that is made by above-mentioned manufacture method, and reference number 1101 expressions have the LCD part of above-mentioned LCD device.

Figure 16 is an expression portable data processing equipment (being electronic installation), the perspective view of giving an example as word processor, personal computer etc.Data processing unit of reference number 1200 expressions among Figure 16, reference number 1202 expressions are such as importations such as keyboards, the main body of reference number 1204 expression data processing equipments, it comprises the multilayer circuit board that is made by above-mentioned manufacture method, and reference number 1206 expressions have the LCD part of above-mentioned LCD device.

Each electronic installation shown in Figure 14 to 16 all has multilayer circuit board and LCD device, in the middle of them each all makes with the described manufacture method of the various embodiments described above, thereby, compare with existing various devices, can accurately make these electronic installations by simple process, and shorten the time of making.

Above-mentioned electronic installation has the LCD device, yet, replace described LCD device, can comprise other electro-optical device in the described electronic installation, as the organic field electroluminescence device.

Technical field of the present invention is not limited to the various embodiments described above, and various variations or remodeling can both be within scope of the present invention and marrow.In other words, specific material, layer structure, manufacture method etc. all are for example, can suitably change.

For example, method of the present invention is not limited to be used for making multilayer printed circuit, also can be used for the multilayer wiring of bigger display unit etc.

Claims

1. the manufacture method of a multilayer circuit board, be used to make comprise at least two wiring layers, be located between the described wiring layer inner layer insulating film and between each wiring layer in order to the multilayer circuit board of conductive pole that conductivity is provided, wherein, described method comprises:

Adopt the droplet ejection mode to form the step of described wiring layer; With

Employing droplet ejection mode forms the step of described inner layer insulating film,

Separate respectively with step that forms described wiring layer and the step that forms described inner layer insulating film and to carry out, make the step of the described inner layer insulating film of described formation also comprise first operation and second operation,

Described first operation is that the recess with respect to described wiring layer forms described inner layer insulating film, and described second operation is to form described inner layer insulating film according to the smooth mode of the upper surface that makes described inner layer insulating film.

2. multilayer circuit board fabrication method as claimed in claim 1 wherein, according to the design data of the circuit pattern that forms described wiring layer and described conductive pole, calculates the concaveconvex shape that the dielectric film that forms inner layer insulating film forms the zone.

3. multilayer circuit board fabrication method as claimed in claim 1 wherein, before forming described inner layer insulating film, is measured the concaveconvex shape that the layer dielectric film that forms described inner layer insulating film forms the zone.

4. multilayer circuit board fabrication method as claimed in claim 1, wherein, the step of described formation inner layer insulating film comprises and forms the first stacked inner layer insulating film and second inner layer insulating film at least, at first form the concaveconvex shape in zone, form described first inner layer insulating film of specific thickness according to the dielectric film that forms described inner layer insulating film; And, calculate described concaveconvex shape by the design data of the circuit pattern that forms described wiring layer and conductive pole;

Then, measure the discrepancy in elevation in the described first inner layer insulating film upper surface, and form described second inner layer insulating film, make and fill the described discrepancy in elevation by described second inner layer insulating film.

5. multilayer circuit board fabrication method as claimed in claim 4, wherein, described droplet ejection mode is:

By spraying bigger drop, to form described first inner layer insulating film from droplet discharging head; And, form described second inner layer insulating film by spraying from described droplet discharging head than the described big little drop of drop.

6. multilayer circuit board fabrication method as claimed in claim 1, wherein, described droplet ejection mode is, in the middle of a plurality of nozzle bores in the droplet discharging head each, sprays control independently.

7. multilayer circuit board fabrication method as claimed in claim 1 wherein, makes the ejection action residual signal oscillatory extinction of carrying out by the droplet ejection mode afterwards.

8. multilayer circuit board, it comprises at least two wiring layers, be located between the described wiring layer inner layer insulating film and between each wiring layer in order to the conductive pole of conductivity to be provided, described multilayer circuit board forms by the manufacture method manufacturing with following steps:

Separate respectively with operation that forms described wiring layer and the step that forms described inner layer insulating film and to carry out, the step that forms described inner layer insulating film also comprises first operation and second operation,

9. electronic device, it comprises at least two wiring layers, be located between the described wiring layer inner layer insulating film and between each wiring layer in order to the conductive pole of conductivity to be provided, this electronic device forms by the manufacture method manufacturing with following steps:

This first operation is that the recess with respect to described wiring layer forms described inner layer insulating film, and this second operation is to form described inner layer insulating film according to the smooth mode of the upper surface that makes described inner layer insulating film.

10. an electronic installation comprises the described multilayer circuit board of claim 8.

11. an electronic installation comprises the described electronic device of claim 9.