CN115931548B

CN115931548B - Young modulus determining method and device and electronic equipment

Info

Publication number: CN115931548B
Application number: CN202211252954.2A
Authority: CN
Inventors: 荣梓华
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-10-13
Filing date: 2022-10-13
Publication date: 2023-07-18
Anticipated expiration: 2042-10-13
Also published as: CN115931548A

Abstract

The disclosure relates to the technical field of measurement, in particular to a Young modulus determining method, a Young modulus determining device, electronic equipment and a storage medium. The Young modulus determining method comprises the following steps: controlling a Young modulus measuring device to measure the Young modulus of the pressed object to obtain an initial Young modulus corresponding to the pressed object; acquiring a radius of a pressure head corresponding to the pressure head in the Young modulus measuring device and a geometric dimension corresponding to a pressed object, and determining a target correction coefficient corresponding to the pressed object according to the radius and the geometric dimension of the pressure head, wherein the pressure head comprises a spherical part; and correcting the initial Young modulus according to the target correction coefficient to obtain the target Young modulus corresponding to the pressed object. The accuracy of Young's modulus determination can be improved without reducing the size of the indenter.

Description

Young modulus determining method and device and electronic equipment

Technical Field

The disclosure relates to the technical field of measurement, in particular to a Young modulus determining method, a Young modulus determining device and electronic equipment.

Background

Young's modulus is a physical quantity that characterizes the tensile or compressive strength of a material within elastic limits, and is the modulus of elasticity in the machine direction, also a term in the mechanics of materials. It is a physical quantity that characterizes the properties of a material, depending only on the physical properties of the material itself. The magnitude of the Young's modulus marks the rigidity of the material, and the larger the Young's modulus is, the less likely deformation occurs.

Hertz (Hertz) contact theory describes the relationship between depth of penetration and pressure when a spherical indenter is pressed into a semi-infinite elastomer. That is, when the spherical indenter is pressed into an infinitely large object to be pressed, the young's modulus of the object to be pressed can be measured according to the pressure levels corresponding to the different pressing depths.

However, the young's modulus measuring device has a difficulty in realizing the young's modulus measuring device by making the size of the pressed object infinitely large with respect to the size of the spherical indenter in the young's modulus measuring device, and the young's modulus measuring error can be reduced only by reducing the size of the spherical indenter. Therefore, how to improve the accuracy of young's modulus determination without reducing the size of the indenter has become an important concern.

Disclosure of Invention

The present disclosure provides a young's modulus determining method, apparatus and electronic device, and is mainly aimed at improving the accuracy of young's modulus determination without reducing the size of a indenter.

According to an aspect of the present disclosure, there is provided a young's modulus determining method including:

controlling a Young modulus measuring device to measure the Young modulus of a pressed object to obtain an initial Young modulus corresponding to the pressed object;

Acquiring a pressure head radius corresponding to a pressure head in the Young modulus measuring device and a geometric dimension corresponding to the pressed object, and determining a target correction coefficient corresponding to the pressed object according to the pressure head radius and the geometric dimension, wherein the pressure head comprises a spherical part;

and correcting the initial Young modulus according to the target correction coefficient to obtain the target Young modulus corresponding to the pressed object.

Optionally, the young modulus measuring device is configured to measure young modulus of the pressed object to obtain initial young modulus corresponding to the pressed object, and the young modulus measuring device includes:

controlling a Young modulus measuring device to press the spherical part into the pressed object to obtain the corresponding pressing depth and pressure of the pressed object;

based on the Hertz contact theory, according to the pressing depth and the pressure, determining the initial Young modulus corresponding to the pressed object.

Optionally, the obtaining the radius of the indenter corresponding to the indenter in the young modulus measuring device and the geometric dimension corresponding to the pressed object, and determining the target correction coefficient corresponding to the pressed object according to the radius of the indenter and the geometric dimension, includes:

Respectively determining a first coefficient and a second coefficient corresponding to the pressed object according to the radius of the pressure head and the geometric dimension;

substituting the first coefficient and the second coefficient into a target correction function to obtain the target correction coefficient.

Optionally, the pressed object is a regular prism, the geometric dimension includes a height and a side length, and the determining, according to the radius of the pressing head and the geometric dimension, a first coefficient and a second coefficient corresponding to the pressed object respectively includes:

determining the first coefficient according to the radius of the pressure head and the side length;

and determining the second coefficient according to the radius of the pressure head and the height.

Optionally, the pressed object is a cylinder, the geometric dimension includes a height and a radius, and the determining, according to the radius of the pressing head and the geometric dimension, a first coefficient and a second coefficient corresponding to the pressed object respectively includes:

determining the first coefficient according to the radius of the pressure head and the radius;

Optionally, before substituting the first coefficient and the second coefficient into a target correction function to obtain the target correction coefficient, the method further includes:

Using a finite element simulation technology to keep the radius of the pressure head corresponding to the pressure head unchanged, and simulating the process of respectively pressing the pressure head into at least one pressed object to obtain at least one pressure change curve corresponding to the at least one pressed object along with the pressing depth, wherein the pressed object and the pressure change curve along with the pressing depth are in one-to-one correspondence;

determining at least one correction coefficient corresponding to the at least one pressure change curve along with the pressing depth based on a Hertz contact theory, wherein the correction coefficient corresponds to the pressed object one by one;

and fitting the at least one correction coefficient based on the radius of the pressure head and the geometric dimension corresponding to the at least one pressed object to obtain the target correction function.

Optionally, the fitting the at least one correction coefficient based on the radius of the indenter and the geometric dimension corresponding to the at least one pressed object to obtain the target correction function includes:

determining a first correction function, and performing taylor expansion on the first correction function to obtain a second correction function, wherein the dependent variable of the first correction function is the correction coefficient, and the independent variable of the first correction function is the first coefficient and the second coefficient;

Determining a quadratic term coefficient set corresponding to the second correction function based on the radius of the pressure head and the geometric dimension corresponding to the at least one pressed object;

and determining the target correction function according to the quadratic term coefficient set and the second correction function.

According to another aspect of the present disclosure, there is provided a young's modulus determining device including:

the modulus measuring unit is used for controlling the Young modulus measuring device to measure the Young modulus of the pressed object to obtain the initial Young modulus corresponding to the pressed object;

the coefficient acquisition unit is used for acquiring a pressure head radius corresponding to a pressure head in the Young modulus measurement device and a geometric dimension corresponding to the pressed object, and determining a correction coefficient corresponding to the pressed object according to the pressure head radius and the geometric dimension, wherein the pressure head comprises a spherical part;

and the modulus correction unit is used for correcting the initial Young modulus according to the correction coefficient to obtain the target Young modulus corresponding to the pressed object.

Optionally, the modulus measurement unit is configured to control the young modulus measurement device to measure the young modulus of the pressed object, and when obtaining the initial young modulus corresponding to the pressed object, the modulus measurement unit is specifically configured to:

Optionally, the coefficient obtaining unit includes a coefficient determining subunit and a coefficient obtaining subunit, where the coefficient obtaining unit is configured to obtain a radius of a ram corresponding to the ram in the young modulus measuring device and a geometric dimension corresponding to the pressed object, and determine, according to the radius of the ram and the geometric dimension, a target correction coefficient corresponding to the pressed object when:

the coefficient determining subunit is used for respectively determining a first coefficient and a second coefficient corresponding to the pressed object according to the radius of the pressure head and the geometric dimension;

the coefficient obtaining subunit is configured to substitute the first coefficient and the second coefficient into a target correction function to obtain the target correction coefficient.

Optionally, the pressed object is a regular prism, the geometric dimension includes a height and a side length, and the coefficient determining subunit is configured to, when determining the first coefficient and the second coefficient corresponding to the pressed object according to the radius of the pressing head and the geometric dimension, respectively:

Optionally, the pressed object is a cylinder, the geometric dimension includes a height and a radius, and the coefficient determining subunit is configured to, when determining the first coefficient and the second coefficient corresponding to the pressed object according to the radius of the pressing head and the geometric dimension, respectively:

Optionally, the coefficient obtaining unit further includes a curve obtaining subunit, a correction coefficient determining subunit, and a function obtaining subunit, configured to, before substituting the first coefficient and the second coefficient into a target correction function to obtain the correction coefficient:

the curve acquisition subunit is configured to keep the radius of the pressure head corresponding to the pressure head unchanged by using a finite element simulation technology, and simulate a process of pressing the pressure head into at least one pressed object respectively to obtain at least one pressure change curve corresponding to the at least one pressed object along with the pressing depth, where the pressed object and the pressure change curve along with the pressing depth are in one-to-one correspondence;

The correction coefficient determining subunit is used for determining at least one correction coefficient corresponding to the at least one pressure along with the change curve of the pressing depth based on the Hertz contact theory, wherein the correction coefficient corresponds to the pressed object one by one;

and the function acquisition subunit is used for fitting the at least one correction coefficient based on the radius of the pressure head and the geometric dimension corresponding to the at least one pressed object to obtain the target correction function.

Optionally, the function obtaining subunit is configured to fit the at least one correction coefficient based on the radius of the indenter and a geometric dimension corresponding to the at least one pressed object, and when obtaining the target correction function, the function obtaining subunit is specifically configured to:

According to another aspect of the present disclosure, there is provided a young's modulus measuring device, including:

the screw rod linear module comprises a screw rod, a sliding table and a supporting piece with a groove structure, wherein the screw rod is rotatably arranged in the groove of the supporting piece, and the sliding table is arranged on the screw rod in a sliding manner;

the force sensor is fixedly arranged on the sliding table;

the hemispherical pressure head is provided with a spherical part, and one end of the hemispherical pressure head, which is far away from the spherical part, is fixedly connected with the bottom end of the force sensor;

the base, support piece passes through the support fixed setting is in on the base.

Optionally, the screw linear module further includes:

the rotary table is connected with the top of the screw rod, the rotary table rotates to drive the screw rod to rotate, and angle scale marks are carved on the upper surface of the rotary table along the circumferential direction;

the pointer structure is fixedly arranged on the supporting piece and comprises a pointer, and the pointer is used for indicating the angle scale on the turntable.

Optionally, a knob is arranged in the middle of the turntable.

Optionally, a connection structure is arranged between the force sensor and the sliding table, and the force sensor and the sliding table are both in bolted connection with the connection structure.

Optionally, a gasket is disposed between the connection structure and the sliding table.

Optionally, the hemispherical press head is fixedly connected with the force sensor through a screw.

Optionally, the hemispherical indenter has a nut structure inside that mates with the screw.

Optionally, during testing, the spherical portion of the hemispherical indenter is in contact with a pressed object.

Optionally, the pressed object is a cylinder, and the radius of the cylinder is greater than twice the radius of the hemispherical press head.

Optionally, the top of support with support piece bolted connection, the bottom of support with base bolted connection.

According to another aspect of the present disclosure, there is provided an electronic device including:

at least one processor; and

a memory communicatively coupled to the at least one processor; wherein,,

the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the method of any one of the preceding aspects.

According to another aspect of the present disclosure, there is provided a non-transitory computer-readable storage medium storing computer instructions for causing the computer to perform the method of any one of the preceding aspects.

According to another aspect of the present disclosure, there is provided a computer program product comprising a computer program which, when executed by a processor, implements the method of any one of the preceding aspects.

In one or more embodiments of the present disclosure, young's modulus of a pressed object is measured by controlling a young's modulus measuring device, so as to obtain an initial young's modulus corresponding to the pressed object; acquiring a radius of a pressure head corresponding to the pressure head in the Young modulus measuring device and a geometric dimension corresponding to a pressed object, and determining a target correction coefficient corresponding to the pressed object according to the radius and the geometric dimension of the pressure head, wherein the pressure head comprises a spherical part; and correcting the initial Young modulus according to the target correction coefficient to obtain the target Young modulus corresponding to the pressed object. Therefore, the initial Young modulus is corrected according to the radius of the pressing head corresponding to the pressing head and the target correction coefficient obtained according to the geometric dimension corresponding to the pressed object, the target Young modulus corresponding to the pressed object can be obtained, the measuring error of the Young modulus can be reduced without reducing the size of the pressing head, and the accuracy of Young modulus determination can be improved without reducing the size of the pressing head.

It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the disclosure, nor is it intended to be used to limit the scope of the disclosure. Other features of the present disclosure will become apparent from the following specification.

Drawings

The drawings are for a better understanding of the present solution and are not to be construed as limiting the present disclosure. Wherein:

fig. 1 shows a flowchart of a first young's modulus determining method provided by an embodiment of the present disclosure;

FIG. 2 is a flow chart of a second Young's modulus determination method according to an embodiment of the present disclosure;

fig. 3 illustrates a schematic diagram of a hertz contact theory provided by embodiments of the present disclosure;

fig. 4 is a schematic structural view of a first pressed object according to an embodiment of the present disclosure;

FIG. 5 is a schematic view showing the structure of a second pressed object according to an embodiment of the present disclosure;

FIG. 6 shows a simulation schematic of finite element simulation software provided by an embodiment of the present disclosure;

FIG. 7 is a graph showing a pressure versus depth of penetration provided by an embodiment of the present disclosure;

FIG. 8 illustrates a schematic diagram of the relationship between press-in depth and pressure provided by an embodiment of the present disclosure;

FIG. 9 is a schematic image of an objective correction function provided by an embodiment of the present disclosure;

Fig. 10 shows a schematic structural view of a first young's modulus determining device provided by an embodiment of the present disclosure;

fig. 11 is a schematic structural view showing a young's modulus determining device of a second type provided in an embodiment of the present disclosure;

fig. 12 is a schematic structural view showing a third young's modulus determining device provided in an embodiment of the present disclosure;

FIG. 13 is a schematic view showing the structure of a Young's modulus measuring device according to an embodiment of the present disclosure;

FIG. 14 shows a schematic structural view of a turntable provided by an embodiment of the present disclosure;

FIG. 15 illustrates a schematic diagram of a pointer structure provided by an embodiment of the present disclosure;

FIG. 16 illustrates a schematic structural view of a hemispherical indenter provided by an embodiment of the present disclosure;

fig. 17 is a block diagram of an electronic device used to implement the young's modulus determination method of an embodiment of the present disclosure.

Detailed Description

Exemplary embodiments of the present disclosure are described below in conjunction with the accompanying drawings, which include various details of the embodiments of the present disclosure to facilitate understanding, and should be considered as merely exemplary. Accordingly, one of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present disclosure. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

The present disclosure is described in detail below with reference to specific examples.

In a first embodiment, as shown in fig. 1, fig. 1 shows a schematic flow chart of a first young's modulus determining method according to an embodiment of the disclosure, which may be implemented by a computer program and may be executed on an apparatus for performing the young's modulus determining method. The computer program may be integrated in the application or may run as a stand-alone tool class application.

Wherein the electronic device includes, but is not limited to: wearable devices, handheld devices, personal computers, tablet computers, vehicle-mounted devices, smart phones, computing devices, or other processing devices connected to a wireless modem, etc. Electronic devices in different networks may be called different names, for example: a user equipment, an access terminal, a subscriber unit, a subscriber station, a mobile station, a remote terminal, a mobile device, a user terminal, a wireless communication device, a user agent or user equipment, a cellular telephone, a cordless telephone, a personal digital assistant (personal digital assistant, PDA), an electronic device in a fifth generation mobile communication technology (5th generation mobile networks,5G) network or a future evolution network, and the like. The electronic device can be provided with an operating system, the operating system is an operating system which can run in the electronic device, is a program for managing and controlling hardware of the electronic device and application of the electronic device, and is an indispensable system application in the electronic device. The operating system includes, but is not limited to, android system, IOS system, windows Phone (WP) system, ubuntu mobile version operating system, and the like.

Specifically, the Young's modulus determining method comprises the following steps:

s101, controlling a Young modulus measuring device to measure the Young modulus of a pressed object to obtain an initial Young modulus corresponding to the pressed object;

according to some embodiments, the young's modulus measuring device refers to a device for measuring the young's modulus of a pressed object. The young's modulus measuring device is not particularly limited to a certain fixing device. For example, the young's modulus measuring device may change when the radius of the indenter corresponding to the indenter in the young's modulus measuring device changes. The young's modulus measuring device may also change when the structure of the young's modulus measuring device changes.

In some embodiments, a pressed object refers to an object that requires a measurement of Young's modulus. The pressed object is not particularly limited to a certain fixed object. For example, the pressed object may change when the corresponding geometric dimensions of the pressed object change.

In some embodiments, the initial young's modulus refers to the young's modulus obtained when the young's modulus of the pressed object is measured by the electronic device controlling young's modulus measuring means. The initial young's modulus is not specific to a certain fixed young's modulus. For example, the initial young's modulus may change when the young's modulus measuring device changes. The initial young's modulus may also change when the pressed object changes.

It is easy to understand that when the electronic device determines the young modulus, the electronic device can control the young modulus measuring device to measure the young modulus of the pressed object, so as to obtain the initial young modulus corresponding to the pressed object.

S102, obtaining a radius of a pressure head corresponding to the pressure head in the Young modulus measuring device and a geometric dimension corresponding to the pressed object, and determining a target correction coefficient corresponding to the pressed object according to the radius of the pressure head and the geometric dimension;

according to some embodiments, the corresponding geometric dimensions of the pressed object refer to dimensions used to describe the shape and size of the pressed object. The geometric dimensions corresponding to the pressed object are not particularly specified as a certain fixed dimension. Including but not limited to height, side length, radius, etc.

In some embodiments, the ram refers to a ram that includes a spherical portion. The ram is not specifically limited to a fixed ram. For example, the ram may be a spherical ram or a hemispherical ram or other ram that includes a spherical portion.

In some embodiments, the target correction factor refers to a factor employed by the electronic device in correcting the initial Young's modulus. The target correction coefficient is not particularly limited to a certain fixed coefficient. For example, the target correction factor may be changed when the radius of the indenter corresponding to the indenter in the young's modulus measuring device is changed. When the geometric dimension corresponding to the pressed object changes, the target correction coefficient can also change.

It is easy to understand that when the electronic device determines the young modulus, the electronic device can obtain the radius of the indenter corresponding to the indenter in the young modulus measuring device and the geometric dimension corresponding to the pressed object, and determine the target correction coefficient corresponding to the pressed object according to the radius of the indenter and the geometric dimension.

And S103, correcting the initial Young modulus according to the target correction coefficient to obtain the target Young modulus corresponding to the pressed object.

According to some embodiments, the target young's modulus refers to young's modulus obtained by the electronic device after correcting the initial young's modulus according to the correction coefficient. The target Young's modulus is not specific to a certain fixed Young's modulus. For example, the Young's modulus of the target may change when the correction factor changes. The target Young's modulus may also change when the initial Young's modulus changes.

It is easy to understand that when the electronic device obtains the initial young modulus and the target correction coefficient corresponding to the pressed object, the electronic device can correct the initial young modulus according to the target correction coefficient to obtain the target young modulus corresponding to the pressed object.

In summary, according to the method provided by the embodiment of the present disclosure, the young modulus of the pressed object is measured by controlling the young modulus measuring device, so as to obtain the initial young modulus corresponding to the pressed object; acquiring a radius of a pressure head corresponding to the pressure head in the Young modulus measuring device and a geometric dimension corresponding to the pressed object, and determining a target correction coefficient corresponding to the pressed object according to the radius of the pressure head and the geometric dimension; and correcting the initial Young modulus according to the target correction coefficient to obtain the target Young modulus corresponding to the pressed object. Therefore, the initial Young modulus is corrected according to the radius of the pressing head corresponding to the pressing head and the target correction coefficient obtained according to the geometric dimension corresponding to the pressed object, the target Young modulus corresponding to the pressed object can be obtained, the measuring error of the Young modulus can be reduced without reducing the size of the pressing head, and the accuracy of Young modulus determination can be improved without reducing the size of the pressing head.

Referring to fig. 2, fig. 2 is a flowchart illustrating a second young's modulus determining method according to an embodiment of the disclosure.

s201, controlling the Young modulus measuring device to press the spherical part into the pressed object to obtain the corresponding pressing depth and pressure of the pressed object;

according to some embodiments, when the young modulus measuring device is controlled to press the spherical portion into the pressed object to obtain the pressing depth and the pressing force corresponding to the pressed object, multiple groups of data points corresponding to the pressed object can be obtained, wherein each group of data points comprises one pressing depth and the pressing force corresponding to the pressing depth.

In some embodiments, when the young modulus measuring device is controlled to press the spherical part into the pressed object to obtain the corresponding pressing depth and pressure of the pressed object, firstly, the spherical part is controlled to be just contacted with the pressed object, and the pressing depth of subsequent loading is recorded by taking the spherical part as a zero point of the pressing depth. When a very small acting force is generated between the spherical part and the pressed object during specific measurement, the position and the contact pressure are taken as references, the pressing depth and the correction pressure of subsequent loading are recorded, and the initial contact acting force is very small relative to the pressure value in the subsequent measurement, so that the error caused by the initial contact acting force is negligible, and the accuracy of the corresponding pressing depth and the pressure acquisition of the pressed object can be improved.

For example, when the radius of the pressing head corresponding to the spherical part in the pressing head in the young modulus measuring device is 15 mm, and the pressed object is a cylinder with the height of 60 mm and the radius of 45 mm, the spherical part is pressed into the pressed object, so that a plurality of groups of data points corresponding to the pressed object can be obtained.

It is easy to understand that when the electronic device determines the young modulus, the electronic device can control the young modulus measuring device to press the spherical part in the pressing head into the pressed object, so as to obtain the corresponding pressing depth and pressure of the pressed object.

S202, determining initial Young' S modulus corresponding to a pressed object according to the pressed depth and pressure based on the Hertz contact theory;

fig. 3 illustrates a schematic diagram of one theory of hertz contact theory provided by embodiments of the present disclosure, according to some embodiments. As shown in fig. 3, the theory of hertz contact describes the relationship between the depth of penetration and pressure when the indenter is pressed into a semi-infinite elastomer:

wherein F is pressure, E is Young's modulus of the pressed object, mu is Poisson's ratio of the pressed object, R is pressure head radius of the pressure head, and eta is pressing depth.

In some embodiments, because of the hertz contact theory, the pressed object can be considered as an infinite half-space (i.e., the dimension of the pressed object is much larger than the dimension of the pressing head) with respect to the pressing head, equation (1) can be satisfied. Therefore, when the size of the pressed object does not satisfy the assumption of infinity with respect to the indenter, the result obtained by the formula (1), that is, when the young's modulus measuring device is controlled to press the indenter into the pressed object to obtain the pressing depth and the pressing force corresponding to the pressed object, the initial young's modulus obtained by substituting the pressing depth and the pressing force into the formula (1) may deviate. Therefore, correction of the initial young's modulus is required.

In some embodiments, when the electronic device obtains the pressing depth and the pressing force corresponding to the pressed object, the electronic device may substitute the pressing depth and the pressing force into formula (1) to obtain the initial young's modulus. Specifically, when the electronic device obtains a plurality of groups of data points corresponding to the pressed object, the electronic device can respectively substitute the plurality of groups of data points into the formula (1), and fit the data points to obtain the initial Young modulus corresponding to the pressed object. Therefore, the accuracy of initial young's modulus acquisition can be improved.

It is easy to understand that when the electronic device obtains the pressing depth and the pressing force corresponding to the pressed object, the electronic device can determine the initial young modulus corresponding to the pressed object according to the pressing depth and the pressing force based on the hertz contact theory.

S203, respectively determining a first coefficient and a second coefficient corresponding to the pressed object according to the radius and the geometric dimension of the pressing head;

according to some embodiments, the correction method employed in correcting the initial young's modulus according to embodiments of the present disclosure may be based on a dimensional analysis of pi theorem.

In some embodiments, the pi theorem states that for the presence of n physical quantities (set to P ₁ 、P ₂ 、……、P _n ) And a physical problem of m basic quantities (n > m) in a unit system, can be composed of n-m independent dimensionless quantities pi ₁ 、π ₂ 、……、π _n-m 。

Thus, the physical law for existence can be expressed as f (P ₁ ,P ₂ ,...,P _n ) =0. And must exist in its corresponding dimensionless representation form pi ₁ ＝Φ(π ₂ ,...,π _n-m ). Wherein pi ₁ ＝Φ(π ₂ ,...,π _n-m ) The representation dependent variable is pi ₁ The independent variable is pi ₂ ,...,π _n-m Is a function of (2).

Fig. 4 illustrates a schematic structural diagram of a first pressed object provided by an embodiment of the present disclosure, according to some embodiments. As shown in fig. 4, the pressed object is a cylinder, and the geometry of the cylinder includes a height H and a radius r. At this time, the electronic device may determine the first coefficient according to the ram radius R and the radius R. The electronics can also determine a second coefficient based on the ram radius R and the height H.

In some embodiments, when the pressed object is a cylinder, the specific physical quantities of the physical problem are 6, which are respectively: the pressing depth eta of the pressing head, the radius R of the pressing head, the radius R of the pressed object, the high H of the pressed object, the pressure F and the Young's modulus E. The basic units in the unit system are two, namely: force (in newtons) and displacement (in meters). Therefore, four independent dimensionless numbers can be constructed according to pi theorem, and the relation is as follows:

where y is a first coefficient which is the quotient of the ram radius R of the ram divided by the radius R of the object being pressed. z is a second coefficient which is the quotient of the ram radius R of the ram divided by the height H of the object being pressed.

Fig. 5 illustrates a schematic structural diagram of a second pressed object provided by an embodiment of the present disclosure, according to some embodiments. As shown in fig. 5, the pressed object is a regular prism, and the geometric dimensions of the regular prism include a height H and a side length a. At this time, the electronic device may determine the first coefficient according to the indenter radius R and the side length a. The electronics can also determine a second coefficient based on the ram radius R and the height H.

In some embodiments, as in the case where the pressed object is a cylinder, when the pressed object is a regular prism, four independent dimensionless numbers can be constructed by applying pi theorem, and the relationship is as follows:

at this time, the first coefficient y is a quotient obtained by dividing the ram radius R of the ram by the side length a of the pressed object. The second coefficient z is the quotient of the ram radius R of the ram divided by the height H of the object being pressed.

It should be noted that, when the pressed object is a regular prism or a cylinder, the geometric dimension parameter is limited, and the boundary condition may be that the side surface is fixed (i.e. the side surface and the bottom surface are fixedly connected with the container wall in the boundary, cannot generate displacement, only the upper surface is exposed to the atmosphere, and can generate motion), or may be that the side surface is not fixed (i.e. only the bottom surface is fixedly connected with the container wall in the boundary, cannot generate displacement, and both the upper surface and the side surface are suspended, and can generate motion).

It is easy to understand that when the electronic device determines the young's modulus, the electronic device may determine the first coefficient and the second coefficient corresponding to the pressed object according to the radius and the geometric dimension of the pressing head, respectively.

S204, using a finite element simulation technology, keeping the radius of the pressure head corresponding to the pressure head unchanged, and simulating the process of respectively pressing the pressure head into at least one pressed object to obtain at least one pressure change curve corresponding to the at least one pressed object along with the pressing depth;

according to some embodiments, the pressed objects are in one-to-one correspondence with the pressure versus depth of press-in curves.

According to some embodiments, when the electronic device uses a finite element simulation technology to keep the radius of the ram corresponding to the ram unchanged and simulate the process of pressing the ram into at least one pressed object respectively, the electronic device may use finite element simulation software to simulate the process of pressing the ram into at least one pressed object respectively.

In some embodiments, the finite element simulation software is not specific to a particular fixed software. For example, the finite element simulation software may be Abaqus.

In some embodiments, when the electronic device simulates a process of pressing the pressing head into at least one pressed object by using finite element simulation software, first, the electronic device may respectively establish geometric models corresponding to the pressing head and the pressed object. And then, the electronic equipment can submit the geometric model corresponding to the pressure head and the geometric model corresponding to the pressed object to calculate by utilizing finite element simulation software, so as to obtain the pressing-in result corresponding to the pressed object. Meanwhile, the electronic equipment can also obtain a pressure change curve corresponding to the pressed object along with the pressing depth.

For example, the electronic device may use finite element simulation software to build a rigid hemisphere with a radius of 15 mm as a geometric model corresponding to the indenter, and build a cylinder with a radius of 45 mm and a height of 60 mm as a geometric model corresponding to the pressed object. Meanwhile, based on the fact that the biological soft material mostly has the property that the volume is unchanged when deformed, the poisson ratio of the geometric model corresponding to the pressed object can be set to 0.49, the young modulus of the geometric model corresponding to the pressed object can be set to 1MPa, and the young modulus of the geometric model corresponding to the pressure head can be set to be far greater than the young modulus (e.g. 20000 MPa) of the geometric model corresponding to the pressed object. The curved surface of the geometric model corresponding to the pressed object and the ground can be set to be completely fixed.

Then, the electronic device may submit the geometric model corresponding to the pressure head and the geometric model corresponding to the pressed object to calculate by using finite element simulation software, so as to obtain a pressing result corresponding to the pressed object, as shown in fig. 6. Wherein U represents the displacement of the geometric model corresponding to the pressure head, and U3 represents the displacement of the geometric model corresponding to the pressure head in the vertical direction.

Meanwhile, the electronic device can also obtain a pressure change curve corresponding to the pressed object along with the pressing depth, as shown in fig. 7.

Then, the electronic equipment can recalculate by modifying the geometric parameters corresponding to the geometric model corresponding to the pressed object, so as to obtain a pressure change curve corresponding to at least one pressed object along with the pressing depth.

For example, the electronic device may change the height H and the radius R of the geometric model corresponding to the pressed object while maintaining the radius R of the indenter corresponding to the indenter to be 15 millimeters. The press-in results and the pressure-in depth change curves corresponding to the geometric models corresponding to 64 pressed objects formed when the heights H are 30 mm, 35 mm, 40 mm, 45 mm, 60 mm, 75 mm, 90 mm and 120 mm and the radii r are 30 mm, 35 mm, 40 mm, 45 mm, 60 mm, 80 mm, 100 mm and 120 mm are calculated respectively.

It is easy to understand that when the electronic device determines the young modulus, the electronic device can utilize the finite element simulation technology to keep the radius of the pressure head corresponding to the pressure head unchanged, simulate the process of pressing the pressure head into at least one pressed object respectively, and obtain at least one pressure change curve corresponding to the at least one pressed object along with the pressing depth.

S205, determining at least one correction coefficient corresponding to a change curve of at least one pressure along with the pressing depth based on the Hertz contact theory;

According to some embodiments, the correction factors are in one-to-one correspondence with the pressed objects.

It should be noted that, when the geometric dimension of the pressed object is far greater than the dimension of the pressing head, the pressed object may be regarded as a semi-infinite space body, and at this time, there are:

meanwhile, fig. 8 shows a schematic diagram of the relationship between the pressing depth and the pressing force according to the embodiment of the present disclosure. As shown in fig. 8, the pressure F is proportional to the 3/2 th power of the pressing depth η. And, based on the at least one pressure-depth variation curve obtained in S204, it can be determined that the direct proportional relationship is always established regardless of changing the geometric parameter of the pressed object when the size of the pressed object is close to the size of the ram.

Therefore, it is possible to determine that only x among the four dimensionless numbers determined in S203 is related to the external force received. That is, the expression for x in the correction function is independent of the other two, namely:

Φ(x,y,z)＝f(x)g(y,z) (6)

next, based on the hertz contact theory, it can be determined that:

where k is a correction coefficient.

Next, by combining the formula (7) with the formula (2) and the formula (3), it is possible to obtain:

therefore, by comparing the formula (8) and the formula (1), it can be determined that the target Young's modulus can be obtained by correcting the initial Young's modulus only by the correction coefficient without performing additional calculation. Namely, the initial Young's modulus E ' and the target Young's modulus E satisfy:

E′＝k(y,z)·E (9)

Next, substituting g (y, z) as the slope of the proportional relationship shown in fig. 8 into formula (8) yields:

in some embodiments, the pressing results and the pressure-versus-pressing depth curves corresponding to the geometric models corresponding to the 64 pressed objects in S205 are processed by the formula (10), so as to obtain at least one correction coefficient corresponding to the at least one pressure-versus-pressing depth curve, as shown in table (1).

Watch (1)

Thus, it can be determined that as the size of the pressed object approaches the size of the indenter, the correction coefficient becomes larger, that is, the calculation result of the hertz contact theory, that is, the deviation of the initial young's modulus becomes larger. For example, when y=z=0.5, the correction coefficient reaches 1.41, that is, the initial young's modulus may deviate by 41%, and the deviation may continue to increase as y and z decrease.

It is easy to understand that when the electronic device obtains at least one pressure change curve corresponding to the at least one pressed object parameter model along with the pressing depth, the electronic device can determine at least one correction coefficient corresponding to the at least one pressure change curve along with the pressing depth based on the hertz contact theory.

S206, fitting at least one correction coefficient based on the radius of the pressure head and the corresponding geometric dimension of at least one pressed object to obtain a target correction function;

According to some embodiments, when the electronic device fits at least one correction coefficient based on the radius of the indenter and the geometric dimension corresponding to the at least one pressed object to obtain the target correction function, the electronic device may first determine the first correction function and perform taylor expansion on the first correction function to obtain the second correction function. The electronic device may then determine a set of quadratic coefficients corresponding to the second correction function based on the radius of the indenter and the geometry corresponding to the at least one compressed object. Finally, the electronic device may determine the target correction function based on the set of quadratic terms coefficients and the second correction function.

In some embodiments, the first correction function is a polynomial function k (y, z), wherein the dependent variable of the first correction function is a correction coefficient k and the independent variable of the first correction function is a first coefficient y and a second coefficient z.

In some embodiments, the second correction function does not refer specifically to a fixed function. For example, the second modified function may be a power function up to 2 nd. The second correction function may be a power function of the highest 3 rd order, a power function of the highest 4 th order, other higher power functions, a combined function of a plurality of trigonometric functions, an exponential function, or other functions with better fitting effects.

In some embodiments, when the electronic device performs taylor expansion on the first correction function to obtain the second correction function, since the values of the first coefficient y and the second coefficient z are smaller, only the expanded quadratic term may be obtained, that is, the first correction function is expanded at y=z=0, and the constant term is taken as 1, to obtain the second correction function:

k(y,z)＝1+p ₁₀ y+p ₀₁ z+p ₂₀ y ² +p ₀₂ z ² +p ₁₁ y·z (11)

specifically, the electronic device may fit the 64 correction coefficients obtained in table (1) to obtain p according to formula (11) using Matlab software ₀₁ ＝0.1039,p ₀₂ ＝0.4978,p ₁₀ ＝0.004819,p ₁₁ ＝-0.3805,p ₂₀ =1.352, resulting in a second correction function:

k＝1+0.004819y+0.1039z+1.352y ² +0.4978z ² -0.3805y·z (12)

meanwhile, the electronic device may also acquire images of the target correction functions corresponding to the 64 correction coefficients, as shown in fig. 9.

It should be noted that, the manner of obtaining the objective correction function according to the embodiments of the present disclosure includes, but is not limited to, using finite element simulation technology, for example, the objective correction function may also be determined according to the results of a large number of experiments.

It is easy to understand that when the electronic device obtains at least one correction coefficient corresponding to the curve of the change of the at least one pressure along with the pressing depth, the electronic device may fit the at least one correction coefficient based on the radius and the model size corresponding to the at least one parameter model of the pressed object, to obtain the target correction function.

S207, substituting the first coefficient and the second coefficient into a target correction function to obtain a target correction coefficient;

for example, when the electronic device obtains a first coefficient of 1/3 and a second coefficient of 1/4, the electronic device may substitute the first coefficient and the second coefficient into equation (12), resulting in a target correction coefficient of about 1.177.

It is easy to understand that when the electronic device obtains the first coefficient, the second coefficient and the target correction function, the electronic device may substitute the first coefficient and the second coefficient into the target correction function to obtain the target correction coefficient.

S208, correcting the initial Young modulus according to the target correction coefficient to obtain the target Young modulus corresponding to the pressed object.

According to some embodiments, when the electronic device corrects the initial young's modulus according to the target correction coefficient, the electronic device may divide the initial young's modulus by the target correction coefficient according to formula (9) to obtain the target young's modulus corresponding to the pressed object.

In some embodiments, the electronic device may further directly modify equation (8) based on equation (12), resulting in:

therefore, the electronic equipment can directly obtain the target Young's modulus corresponding to the pressed object according to the radius of the pressing head corresponding to the pressing head in the Young's modulus measuring device, the geometric dimension corresponding to the pressed object, the pressing depth and the pressing force corresponding to the pressed object based on the formula (13).

It is easy to understand that when the electronic device obtains the target correction coefficient and the initial young modulus, the electronic device can correct the initial young modulus according to the target correction coefficient to obtain the target young modulus corresponding to the pressed object.

In summary, according to the method provided by the embodiment of the disclosure, the spherical portion is pressed into the pressed object by controlling the young modulus measuring device to obtain the pressing depth and the pressure corresponding to the pressed object, the initial young modulus corresponding to the pressed object is determined based on the hertz contact theory according to the pressing depth and the pressure, the first coefficient and the second coefficient corresponding to the pressed object are respectively determined according to the radius and the geometric dimension of the pressing head, the radius of the pressing head corresponding to the pressing head is kept unchanged by using the finite element simulation technology, the process of pressing the pressing head into at least one pressed object is simulated to obtain at least one pressure change curve corresponding to the at least one pressed object along with the pressing depth, at least one correction coefficient corresponding to the at least one pressure change curve along with the pressing depth is determined based on the hertz contact theory, the at least one correction coefficient corresponding to the at least one pressed object is fitted based on the radius of the pressing head and the geometric dimension corresponding to the at least one pressed object, a target correction function is obtained, the first coefficient and the second coefficient are substituted into the target correction function to obtain the target correction coefficient, and the initial young modulus corresponding to the pressed object is corrected according to the target correction coefficient. Therefore, the initial Young modulus is corrected according to the radius of the pressing head corresponding to the pressing head and the target correction coefficient obtained according to the geometric dimension corresponding to the pressed object, the target Young modulus corresponding to the pressed object can be obtained, the measuring error of the Young modulus can be reduced without reducing the size of the pressing head, and the accuracy of Young modulus determination can be improved without reducing the size of the pressing head.

In the technical scheme of the disclosure, the related processes of collecting, storing, using, processing, transmitting, providing, disclosing and the like of the personal information of the user accord with the regulations of related laws and regulations, and the public order colloquial is not violated.

The following are device embodiments of the present disclosure that may be used to perform method embodiments of the present disclosure. For details not disclosed in the embodiments of the apparatus of the present disclosure, please refer to the embodiments of the method of the present disclosure.

Referring to fig. 10, a schematic structural diagram of a first young's modulus determining device according to an embodiment of the present disclosure is shown. The young's modulus determining means may be implemented as all or part of the device by software, hardware or a combination of both. The young's modulus determining device 100 includes a modulus measuring unit 110, a coefficient obtaining unit 120, and a modulus correcting unit 130, wherein:

a modulus measurement unit 110 for controlling the young modulus measurement device to measure the young modulus of the pressed object, so as to obtain an initial young modulus corresponding to the pressed object;

the coefficient obtaining unit 120 is configured to obtain a radius of a indenter corresponding to the indenter in the young modulus measuring device and a geometric dimension corresponding to the pressed object, and determine a target correction coefficient corresponding to the pressed object according to the radius of the indenter and the geometric dimension, where the indenter includes a spherical portion;

And the modulus correction unit 130 is used for correcting the initial Young modulus according to the target correction coefficient to obtain the target Young modulus corresponding to the pressed object.

Optionally, the modulus measurement unit 110 is configured to control the young modulus measurement device to measure the young modulus of the pressed object, and is specifically configured to:

controlling the Young modulus measuring device to press the spherical part into the pressed object to obtain the corresponding pressing depth and pressure of the pressed object;

based on the Hertz contact theory, according to the pressing depth and the pressure, determining the initial Young's modulus corresponding to the pressed object.

Alternatively, fig. 11 shows a schematic structural diagram of a young's modulus determining device of a second type provided in an embodiment of the present disclosure. As shown in fig. 11, the coefficient obtaining unit 120 includes a coefficient determining subunit 121 and a coefficient obtaining subunit 122, where the coefficient obtaining unit 120 is configured to obtain a radius of a ram corresponding to the ram in the young's modulus measuring device and a geometric dimension corresponding to the pressed object, and determine a target correction coefficient corresponding to the pressed object according to the radius of the ram and the geometric dimension:

a coefficient determination subunit 121, configured to determine a first coefficient and a second coefficient corresponding to the pressed object according to the radius and the geometric dimension of the pressing head, respectively;

The coefficient obtaining subunit 122 is configured to substitute the first coefficient and the second coefficient into the target correction function to obtain the target correction coefficient.

Optionally, the pressed object is a regular prism, the geometric dimensions include a height and a side length, and the coefficient determining subunit 121 is configured to, when determining the first coefficient and the second coefficient corresponding to the pressed object according to the radius and the geometric dimensions of the pressing head, respectively, specifically:

determining a first coefficient according to the radius and the side length of the pressure head;

a second coefficient is determined based on the ram radius and the height.

Optionally, the pressed object is a cylinder, the geometric dimension includes a height and a radius, and the coefficient determining subunit 121 is configured to, when determining the first coefficient and the second coefficient corresponding to the pressed object according to the radius and the geometric dimension of the pressing head, respectively, specifically be:

determining a first coefficient according to the radius of the pressure head and the radius;

a second coefficient is determined based on the ram radius and the height.

Optionally, fig. 12 shows a schematic structural diagram of a third young's modulus determining device provided in an embodiment of the present disclosure. As shown in fig. 12, the coefficient acquisition unit 120 further includes a curve acquisition subunit 123, a correction coefficient determination subunit 124, and a function acquisition subunit 125, configured to, before substituting the first coefficient and the second coefficient into the target correction function to obtain the target correction coefficient:

A curve obtaining subunit 123, configured to, by using a finite element simulation technique, keep a radius of the ram corresponding to the ram unchanged, simulate a process of pressing the ram into at least one pressed object respectively, and obtain at least one pressure change curve corresponding to the at least one pressed object along with a pressing depth, where the pressed object corresponds to the pressure change curve along with the pressing depth one by one;

a correction coefficient determining subunit 124, configured to determine at least one correction coefficient corresponding to the change curve of at least one pressure along with the pressing depth based on the hertz contact theory, where the correction coefficient corresponds to the pressed object one by one;

the function obtaining subunit 125 is configured to fit at least one correction coefficient based on the radius of the indenter and the geometric dimension corresponding to the at least one pressed object, so as to obtain the target correction function.

Optionally, the function obtaining subunit 125 is configured to fit at least one correction coefficient based on the radius of the indenter and the geometric dimension corresponding to the at least one pressed object, and is specifically configured to:

determining a first correction function, and performing taylor expansion on the first correction function to obtain a second correction function, wherein the dependent variable of the first correction function is a correction coefficient, and the independent variable of the first correction function is a first coefficient and a second coefficient;

Determining a quadratic term coefficient set corresponding to the second correction function based on the radius of the pressure head and the geometric dimension corresponding to at least one pressed object;

and determining an objective correction function according to the quadratic term coefficient set and the second correction function.

It should be noted that, in the young's modulus determining apparatus provided in the foregoing embodiment, when the young's modulus determining method is executed, only the division of the foregoing functional modules is used as an example, in practical application, the foregoing functional allocation may be performed by different functional modules, that is, the internal structure of the device is divided into different functional modules, so as to complete all or part of the functions described above. In addition, the young modulus determining device and the young modulus determining method provided in the above embodiments belong to the same concept, which embody the detailed implementation process in the method embodiments, and are not described herein again.

In summary, according to the device provided by the embodiment of the present disclosure, the young modulus measuring device is controlled by the modulus measuring unit to measure the young modulus of the pressed object, so as to obtain the initial young modulus corresponding to the pressed object; the coefficient acquisition unit acquires a pressure head radius corresponding to a pressure head in the Young modulus measuring device and a geometric dimension corresponding to a pressed object, and determines a target correction coefficient corresponding to the pressed object according to the pressure head radius and the geometric dimension, wherein the pressure head comprises a spherical part; and the modulus correction unit corrects the initial Young modulus according to the target correction coefficient to obtain the target Young modulus corresponding to the pressed object. Therefore, the initial Young modulus is corrected according to the radius of the pressing head corresponding to the pressing head and the target correction coefficient obtained according to the geometric dimension corresponding to the pressed object, the target Young modulus corresponding to the pressed object can be obtained, the measuring error of the Young modulus can be reduced without reducing the size of the pressing head, and the accuracy of Young modulus determination can be improved without reducing the size of the pressing head.

According to an embodiment of the present disclosure, the present disclosure further provides a young's modulus measurement device.

Fig. 13 shows a schematic structural diagram of a young's modulus measurement device provided in an embodiment of the present disclosure. As shown in fig. 13, the young's modulus measuring apparatus is applicable to the young's modulus determining method of the embodiment shown in fig. 1 to 9 described above, including:

the screw rod linear module comprises a screw rod 1, a sliding table 2 and a support piece 3 with a groove structure, wherein the screw rod 1 is rotatably arranged in a groove of the support piece 3, and the sliding table 2 is arranged on the screw rod 1 in a sliding manner;

the force sensor 6 is fixedly arranged on the sliding table 2;

the hemispherical pressing head 7 is provided with a spherical part, and one end of the hemispherical pressing head, which is far away from the spherical part, is fixedly connected with the bottom end of the force sensor 6;

the base 11, the support 3 is fixed on the base 11 through the support 12.

According to some embodiments, during the rotation of the screw 1, the rotation motion of the screw 1 is converted into the linear motion of the sliding table 2, and the displacement of the sliding table 2 can be precisely controlled by the rotation of the screw 1, so that the pressing depth of the hemispherical indenter 7 can be measured.

In some embodiments, the force sensor 6 is fixedly arranged on the sliding table 2, that is, the force sensor 6 is fixedly connected with the sliding table 2, so that the force sensor 6 is driven to move up and down when the sliding table 2 moves up and down.

According to some embodiments, the force sensor 6 is fixedly connected to the hemispherical indenter 7, specifically, the hemispherical indenter 7 has a spherical portion 15, and an end of the hemispherical indenter 7 away from the spherical portion 15 is fixedly connected to the bottom end of the force sensor 6.

In some embodiments, the spherical portion 15 of the hemispherical pressing head 7 is one end contacting with the pressed object 13, and one end of the hemispherical pressing head 7 not contacting with the pressed object 13 is fixedly connected with the force sensor 6, during the testing process, the rotation motion of the screw rod 1 is converted into the linear motion of the sliding table 2, and the sliding table 2 drives the force sensor 6 to move up and down when moving up and down, so as to drive the hemispherical pressing head 7 to move up and down.

In some embodiments, the force sensor 6 may be a digital display device, for example, the force sensor 6 may be a digital push-pull force meter, that is, when the hemispherical indenter 7 moves up and down, the depth of the hemispherical indenter 7 pressed into the pressed object 13 changes, at this time, the indication of the force sensor 6 changes correspondingly, and the pressure values at different pressing depths may be directly read through the indication of the force sensor 6.

According to some embodiments, a bracket 12 is arranged between the support 3 and the base 11, the upper end of the bracket 12 is fixedly connected with the support 3, and the lower end of the bracket 12 is fixedly connected with the base 11. In addition, it will be appreciated that the object 13 to be tested is placed on the base 11 during testing.

In an embodiment of the present disclosure, as shown in fig. 1, the screw linear module further includes:

the turntable 4 is connected with the top of the screw 1, the turntable 4 rotates to drive the screw 1 to rotate, and angle scale marks are carved on the upper surface of the turntable 4 along the circumferential direction;

the pointer structure 5 is fixedly arranged on the support 3, the pointer structure 5 comprises a pointer 14, and the pointer 14 is used for indicating angle scales on the turntable.

According to some embodiments, the turntable 4 is arranged at the top of the screw 1, the screw 1 is driven to rotate by rotating the turntable 4, and the sliding table 2 is driven to do linear motion on the screw 1 by the rotation of the screw 1, so that the hemispherical press head 7 ascends or descends. In addition, the method comprises the following steps.

In some embodiments, fig. 14 shows a schematic structural diagram of a turntable provided by an embodiment of the disclosure. As shown in fig. 14, the upper surface of the turntable 4 is engraved with angle scale marks along the circumferential direction of the turntable 4, and the displacement of the slide table 2 is obtained by rotating the angle, thereby obtaining the displacement of the hemispherical indenter 7.

In some embodiments, as shown in fig. 14, a knob is provided in the middle of the turntable 4, i.e., the turntable 4 can be rotated by rotating the knob.

In some embodiments, the screw linear module has a certain lead, the screw 1 rotates 360 degrees, the displacement of the sliding table 2 is one lead, the displacement of the sliding table 2 when the screw 1 rotates 1 degree can be obtained according to the lead, and then different displacements of the sliding table 2 can be calculated according to different rotation angles of the screw 1.

It is easy to understand that in the actual testing process, a lead screw linear module with proper lead and precision can be selected according to actual conditions.

Fig. 15 illustrates a schematic structural diagram of a pointer structure according to some embodiments of the present disclosure

In some embodiments, the angular value of rotation of the screw 11 is indicated by the pointer structure 5, the pointer structure 5 being fixedly arranged on the support 3. Specifically, the pointer structure 5 includes a pointer 14, the pointer 14 is used for indicating an angle scale on the turntable 4, the pointer 14 is located above the turntable 4, and the displacement of the sliding table 2 in the current rotation process is calculated according to an angle difference value from the beginning of rotation of the screw 1 to the end of rotation of the screw 1 indicated by the pointer 14. One end of the pointer structure 5, which is far away from the pointer 14, is fixedly connected with the supporting piece 3.

Fig. 15 illustrates a schematic structural diagram of a pointer structure according to some embodiments of the present disclosure. As shown in fig. 15, the lower end of the pointer structural member 5 is a connecting plate with a square open slot in the middle, and the connecting plate is connected with the supporting member 3 by bolts.

It is easy to understand that, since the middle part of the connecting plate is provided with a directional perforated slot, the height of the pointer 14, in particular the upper surface of the turntable 4, can be adjusted by adjusting the position of the bolt.

Fig. 16 is a schematic structural view of a hemispherical indenter according to an embodiment of the present disclosure. As shown in fig. 16, the inside of the hemispherical indenter 7 has a nut structure 10 that mates with the screw 9.

In some embodiments, the inside of the hemispherical ram 7 has a nut structure 10, the nut structure 10 being adapted to cooperate with a screw 9 provided between the hemispherical ram 7 and the force sensor 6, thereby securing the hemispherical ram 7 at the lower end of the screw 9.

In the embodiment of the disclosure, a connecting structure 8 is arranged between the force sensor 6 and the sliding table 2, and the force sensor 6 and the sliding table 2 are connected with the connecting structure 8 through bolts.

According to some embodiments, the connection structure 8 is arranged between the sliding table 2 and the force sensor 6, the connection structure 8 is a connection plate with bolt holes, the connection structure 8 is fixedly connected with the sliding table 2 through bolts, and the connection structure 8 is fixedly connected with the force sensor 6 through bolts, namely, the connection structure 8 is used for fixedly connecting the sliding table 2 with the force sensor 6.

In the embodiment of the present disclosure, a spacer is provided between the connection structure 8 and the slide table 2.

It is easy to understand, because slip table 2 and connection structure 8 are hard material, can cause the bolt to become flexible when passing through bolted connection between the two, the connection is insecure, can also cause the wearing and tearing of slip table 2 simultaneously, set up the gasket between connection structure 8 and slip table 2, can prevent the wearing and tearing of slip table 2 on the one hand, on the other hand can also increase the frictional force between connection structure 8 and the slip table 2 for it is more firm to connect, difficult not hard up.

In the embodiment of the disclosure, the hemispherical press head 7 is fixedly connected with the force sensor 6 through a screw.

According to some embodiments, a screw 9 for connecting the force sensor 6 and the hemispherical indenter 7 is arranged between the two, namely, the upper end of the screw 9 is fixedly connected with the force sensor 6, and the lower end of the screw 9 is fixedly connected with the hemispherical indenter 7.

It is easy to understand that the force sensor 6 and the hemispherical indenter 7 are connected by the screw 9, so that the force sensor 6 with different measuring ranges and the hemispherical indenter 7 with different sizes can be conveniently replaced according to actual requirements.

In the presently disclosed embodiment, the spherical portion 15 of the hemispherical indenter 7 is in contact with the pressed object 13 during testing.

According to some embodiments, the spherical portion 15 of the hemispherical indenter 7 is in contact with the circular end surface of the cylinder, so that corresponding pressure values at different indentation depths can be tested using the young's modulus measuring device provided by the embodiments of the present disclosure.

In some embodiments, the pressed object 13 is a cylinder with a radius greater than twice the radius of the hemispherical indenter 7. Therefore, the accuracy of the test can be improved.

In the embodiment of the present disclosure, the top end of the bracket 12 is bolted to the support 3, and the bottom end of the bracket 12 is bolted to the base 11. Namely, the bracket 12 is fixedly connected with the supporting piece 3 and the base 11 through bolts.

In summary, the young modulus measuring device provided in the embodiments of the present disclosure includes: the screw rod linear module comprises a screw rod, a sliding table and a supporting piece with a groove structure, wherein the screw rod is rotatably arranged in the groove of the supporting piece, and the sliding table is arranged on the screw rod in a sliding manner; the force sensor is fixedly arranged on the sliding table; the hemispherical pressure head is provided with a spherical part, and one end of the hemispherical pressure head, which is far away from the spherical part, is fixedly connected with the bottom end of the force sensor; the base, support piece passes through the support fixed setting on the base. Therefore, the device provided by the embodiment of the present disclosure obtains the initial young modulus of the pressed object, and corrects the initial young modulus by combining the method provided by the embodiment to obtain the target young modulus corresponding to the pressed object, so that the application range of the method for measuring the young modulus through the pressing experiment can be expanded, the accuracy of young modulus determination is improved, and the determination cost of the young modulus is reduced.

According to embodiments of the present disclosure, the present disclosure also provides an electronic device, a readable storage medium and a computer program product.

Fig. 14 shows a schematic block diagram of an example electronic device 1400 that may be used to implement embodiments of the present disclosure. The components shown herein, their connections and relationships, and their functions, are meant to be exemplary only, and are not meant to limit implementations of the disclosure described and/or claimed herein.

As shown in fig. 14, the electronic device 1400 includes a computing unit 1401 that can perform various appropriate actions and processes according to a computer program stored in a Read Only Memory (ROM) 1402 or a computer program loaded from a storage unit 1408 into a Random Access Memory (RAM) 1403. In the RAM 1403, various programs and data required for the operation of the electronic device 1400 can also be stored. The computing unit 1401, the ROM 1402, and the RAM 1403 are connected to each other through a bus 1404. An input/output (I/O) interface 1405 is also connected to the bus 1404.

A number of components in electronic device 1400 are connected to I/O interface 1405, including: an input unit 1406 such as a keyboard, a mouse, or the like; an output unit 1407 such as various types of displays, speakers, and the like; a storage unit 1408 such as a magnetic disk, an optical disk, or the like; and a communication unit 1409 such as a network card, a modem, a wireless communication transceiver, and the like. The communication unit 1409 allows the electronic device 1400 to exchange information/data with other devices through a computer network such as the internet and/or various telecommunications networks.

The computing unit 1401 may be a variety of general and/or special purpose processing components having processing and computing capabilities. Some examples of computing unit 1401 include, but are not limited to, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), various specialized Artificial Intelligence (AI) computing chips, various computing units running machine learning model algorithms, a Digital Signal Processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 1401 performs the respective methods and processes described above, for example, the young's modulus determination method. For example, in some embodiments, the Young's modulus determination method may be implemented as a computer software program tangibly embodied on a machine-readable medium, such as storage unit 1408. In some embodiments, part or all of the computer program may be loaded and/or installed onto the electronic device 1400 via the ROM 1402 and/or the communication unit 1409. When the computer program is loaded into the RAM 1403 and executed by the computing unit 1401, one or more steps of the young's modulus determination method described above may be performed. Alternatively, in other embodiments, the computing unit 1401 may be configured to perform the young's modulus determination method by any other suitable means (e.g. by means of firmware).

Various implementations of the systems and techniques described here above may be implemented in digital electronic circuitry, integrated circuit systems, field Programmable Gate Arrays (FPGAs), application Specific Integrated Circuits (ASICs), application Specific Standard Products (ASSPs), systems On Chip (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and/or combinations thereof. These various embodiments may include: implemented in one or more computer programs, the one or more computer programs may be executed and/or interpreted on a programmable system including at least one programmable processor, which may be a special purpose or general-purpose programmable processor, that may receive data and instructions from, and transmit data and instructions to, a storage system, at least one input device, and at least one output device.

Program code for carrying out methods of the present disclosure may be written in any combination of one or more programming languages. These program code may be provided to a processor or controller of a general purpose computer, special purpose computer, or other programmable data processing apparatus such that the program code, when executed by the processor or controller, causes the functions/operations specified in the flowchart and/or block diagram to be implemented. The program code may execute entirely on the machine, partly on the machine, as a stand-alone software package, partly on the machine and partly on a remote machine or entirely on the remote machine or server.

In the context of this disclosure, a machine-readable medium may be a tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. The machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. The machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples of a machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

To provide for interaction with a user, the systems and techniques described here can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to a user; and a keyboard and pointing device (e.g., a mouse or trackball) by which a user can provide input to the computer. Other kinds of devices may also be used to provide for interaction with a user; for example, feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form, including acoustic input, speech input, or tactile input.

The systems and techniques described here can be implemented in a computing system that includes a background component (e.g., as a data server), or that includes a middleware component (e.g., an application server), or that includes a front-end component (e.g., a user computer having a graphical user interface or a web browser through which a user can interact with an implementation of the systems and techniques described here), or any combination of such background, middleware, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: local Area Networks (LANs), wide Area Networks (WANs), the internet, and blockchain networks.

The computer system may include a client and a server. The client and server are typically remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other. The server can be a cloud server, also called a cloud computing server or a cloud host, and is a host product in a cloud computing service system, so that the defects of high management difficulty and weak service expansibility in the traditional physical hosts and VPS service ("Virtual Private Server" or simply "VPS") are overcome. The server may also be a server of a distributed system or a server that incorporates a blockchain.

It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. For example, the steps recited in the present disclosure may be performed in parallel or sequentially or in a different order, provided that the desired results of the technical solutions of the present disclosure are achieved, and are not limited herein.

The above detailed description should not be taken as limiting the scope of the present disclosure. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present disclosure are intended to be included within the scope of the present disclosure.

Claims

1. A young's modulus determining method, comprising:

acquiring a pressure head radius corresponding to a pressure head in the Young modulus measuring device and a geometric dimension corresponding to the pressed object, respectively determining a first coefficient and a second coefficient corresponding to the pressed object according to the pressure head radius and the geometric dimension, and determining a target correction coefficient corresponding to the pressed object according to the first coefficient and the second coefficient, wherein the pressure head comprises a spherical part;

Correcting the initial Young modulus according to the target correction coefficient to obtain a target Young modulus corresponding to the pressed object;

when the pressed object is a regular prism, the geometric dimension comprises a height and a side length, the first coefficient is determined according to the radius of the pressing head and the side length, and the second coefficient is determined according to the radius of the pressing head and the height.

2. The method according to claim 1, wherein the controlling young's modulus measuring device measures young's modulus of the pressed object to obtain initial young's modulus corresponding to the pressed object, comprising:

3. The method of claim 1, wherein determining a target correction coefficient for the pressed object based on the first coefficient and the second coefficient comprises:

4. A method according to claim 3, characterized in that the method further comprises: when the pressed object is a cylinder, the geometric dimension comprises a height and a radius, the first coefficient is determined according to the radius of the pressing head and the radius, and the second coefficient is determined according to the radius of the pressing head and the height.

5. A method according to claim 3, further comprising, prior to said substituting said first coefficient and said second coefficient into a target correction function to obtain said target correction coefficient:

6. The method of claim 5, wherein fitting the at least one correction factor based on the radius of the indenter and the corresponding geometry of the at least one compressed object to obtain the target correction function comprises:

7. A young's modulus determining device, comprising:

the coefficient acquisition unit is used for acquiring a pressure head radius corresponding to a pressure head in the Young modulus measurement device and a geometric dimension corresponding to the pressed object, respectively determining a first coefficient and a second coefficient corresponding to the pressed object according to the pressure head radius and the geometric dimension, and determining a target correction coefficient corresponding to the pressed object according to the first coefficient and the second coefficient, wherein the pressure head comprises a spherical part;

The modulus correction unit is used for correcting the initial Young modulus according to the target correction coefficient to obtain a target Young modulus corresponding to the pressed object;

8. An electronic device, comprising:

at least one processor; and

a memory communicatively coupled to the at least one processor; wherein,,

the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the method of any one of claims 1-6.