CN115916863A - 酚醛树脂、环氧树脂、它们的制造方法、环氧树脂组合物及其固化物 - Google Patents
酚醛树脂、环氧树脂、它们的制造方法、环氧树脂组合物及其固化物 Download PDFInfo
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- CN115916863A CN115916863A CN202180039891.XA CN202180039891A CN115916863A CN 115916863 A CN115916863 A CN 115916863A CN 202180039891 A CN202180039891 A CN 202180039891A CN 115916863 A CN115916863 A CN 115916863A
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- epoxy resin
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- phenolic resin
- resin
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- C—CHEMISTRY; METALLURGY
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- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/20—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with polyhydric phenols
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C08G59/621—Phenols
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
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- C08G8/28—Chemically modified polycondensates
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-101469 | 2020-06-11 | ||
| JP2020101469 | 2020-06-11 | ||
| PCT/JP2021/021361 WO2021251289A1 (ja) | 2020-06-11 | 2021-06-04 | フェノール樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115916863A true CN115916863A (zh) | 2023-04-04 |
Family
ID=78846217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180039891.XA Pending CN115916863A (zh) | 2020-06-11 | 2021-06-04 | 酚醛树脂、环氧树脂、它们的制造方法、环氧树脂组合物及其固化物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230272155A1 (https=) |
| JP (1) | JPWO2021251289A1 (https=) |
| KR (1) | KR102862030B1 (https=) |
| CN (1) | CN115916863A (https=) |
| TW (1) | TWI879979B (https=) |
| WO (1) | WO2021251289A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230227601A1 (en) * | 2020-06-04 | 2023-07-20 | Nippon Steel Chemical & Material Co., Ltd. | Epoxy resin composition and cured product thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61123618A (ja) * | 1984-11-20 | 1986-06-11 | Sanyo Kokusaku Pulp Co Ltd | 新規エポキシ樹脂およびその製造法 |
| JPS6399224A (ja) * | 1986-10-16 | 1988-04-30 | Sanyo Kokusaku Pulp Co Ltd | フエノ−ル樹脂の製造法 |
| CN105121489A (zh) * | 2013-04-19 | 2015-12-02 | Dic株式会社 | 改性酚醛树脂、改性酚醛树脂的制造方法、改性环氧树脂、改性环氧树脂的制造方法、固化性树脂组合物、其固化物和印刷电路基板 |
| CN107400198A (zh) * | 2016-05-20 | 2017-11-28 | 新日铁住金化学株式会社 | 环氧树脂组合物及其硬化物 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1229757A (fr) * | 1959-02-02 | 1960-09-09 | Cfmc | Nouveaux antioxygènes et leur procédé de préparation |
| JPH04222819A (ja) * | 1990-12-26 | 1992-08-12 | Mitsui Toatsu Chem Inc | フェノール重合体の製造方法 |
| JP2769590B2 (ja) | 1992-06-11 | 1998-06-25 | 東都化成株式会社 | エポキシ樹脂組成物 |
| JP3820834B2 (ja) | 2000-02-28 | 2006-09-13 | 大日本インキ化学工業株式会社 | 格子状通電端子配設半導体装置に用いられる回路基板用樹脂組成物、格子状通電端子配設半導体装置用回路基板及び格子状通電端子配設半導体装置 |
| US20040242834A1 (en) * | 2001-09-28 | 2004-12-02 | Ryuichi Ueno | Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition |
| JP5337735B2 (ja) * | 2010-02-16 | 2013-11-06 | ナン ヤ プラスティクス コーポレーション | 積層板用の新規臭素化エポキシ樹脂及びその製造方法 |
| US8039560B1 (en) * | 2010-04-01 | 2011-10-18 | Nan Ya Plastics Corporation | Low dielectric brominated resin with a symmetric or saturated heterocyclic alphatic molecular structure and the preparation thereof |
| CN104193592A (zh) * | 2014-08-08 | 2014-12-10 | 济南圣泉集团股份有限公司 | 一种双环戊二烯酚型树脂、其制备方法、双环戊二烯酚型环氧树脂及其制备方法 |
| CN106893258B (zh) * | 2015-12-17 | 2019-03-19 | 广东生益科技股份有限公司 | 一种环氧树脂组合物以及含有它的预浸料、层压板和印制电路板 |
| WO2020053937A1 (ja) * | 2018-09-10 | 2020-03-19 | 日立化成株式会社 | エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料 |
| JP7054006B2 (ja) * | 2018-10-10 | 2022-04-13 | 株式会社ミクシィ | 情報処理装置、移動経路選択方法及び移動経路選択プログラム |
| US11884773B2 (en) * | 2018-12-19 | 2024-01-30 | Nippon Steel Chemical & Material Co., Ltd. | Phenolic resin, epoxy resin, epoxy resin composition and cured product of same |
| CN115135692B (zh) * | 2020-02-17 | 2025-02-18 | 日铁化学材料株式会社 | 活性酯树脂、环氧树脂组合物、其固化物、预浸料、层叠板和堆积膜 |
| CN115551918A (zh) * | 2020-05-11 | 2022-12-30 | 日铁化学材料株式会社 | 热固性树脂组合物及其固化物 |
| WO2021241255A1 (ja) * | 2020-05-28 | 2021-12-02 | 日鉄ケミカル&マテリアル株式会社 | 多官能ビニル樹脂及びその製造方法 |
| JPWO2021246341A1 (https=) * | 2020-06-04 | 2021-12-09 | ||
| US20230227601A1 (en) * | 2020-06-04 | 2023-07-20 | Nippon Steel Chemical & Material Co., Ltd. | Epoxy resin composition and cured product thereof |
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2021
- 2021-06-04 JP JP2022530532A patent/JPWO2021251289A1/ja active Pending
- 2021-06-04 CN CN202180039891.XA patent/CN115916863A/zh active Pending
- 2021-06-04 US US18/008,666 patent/US20230272155A1/en active Pending
- 2021-06-04 KR KR1020227040202A patent/KR102862030B1/ko active Active
- 2021-06-04 WO PCT/JP2021/021361 patent/WO2021251289A1/ja not_active Ceased
- 2021-06-09 TW TW110120916A patent/TWI879979B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61123618A (ja) * | 1984-11-20 | 1986-06-11 | Sanyo Kokusaku Pulp Co Ltd | 新規エポキシ樹脂およびその製造法 |
| JPS6399224A (ja) * | 1986-10-16 | 1988-04-30 | Sanyo Kokusaku Pulp Co Ltd | フエノ−ル樹脂の製造法 |
| CN105121489A (zh) * | 2013-04-19 | 2015-12-02 | Dic株式会社 | 改性酚醛树脂、改性酚醛树脂的制造方法、改性环氧树脂、改性环氧树脂的制造方法、固化性树脂组合物、其固化物和印刷电路基板 |
| CN107400198A (zh) * | 2016-05-20 | 2017-11-28 | 新日铁住金化学株式会社 | 环氧树脂组合物及其硬化物 |
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| TWI879979B (zh) | 2025-04-11 |
| KR102862030B1 (ko) | 2025-09-19 |
| JPWO2021251289A1 (https=) | 2021-12-16 |
| WO2021251289A1 (ja) | 2021-12-16 |
| TW202200662A (zh) | 2022-01-01 |
| US20230272155A1 (en) | 2023-08-31 |
| KR20230008113A (ko) | 2023-01-13 |
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