CN115900982A - Semiconductor detection temperature measuring instrument - Google Patents
Semiconductor detection temperature measuring instrument Download PDFInfo
- Publication number
- CN115900982A CN115900982A CN202310017203.0A CN202310017203A CN115900982A CN 115900982 A CN115900982 A CN 115900982A CN 202310017203 A CN202310017203 A CN 202310017203A CN 115900982 A CN115900982 A CN 115900982A
- Authority
- CN
- China
- Prior art keywords
- wall
- semiconductor
- plate
- disposed
- temperature measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention relates to the technical field of semiconductor temperature detection, in particular to a semiconductor detection temperature measuring instrument which comprises a seat body, wherein an expansion piece is arranged on the outer wall of the seat body, a fixing plate is arranged at the expansion end of the expansion piece, the outer wall of the fixing plate is connected with a lifting plate through a connecting rod, an installation hole is formed in the outer wall of the lifting plate, the expansion end of the expansion piece penetrates through the installation hole, a fixing rod is arranged on the outer wall of the lifting plate, an installation plate is arranged at the end part of the fixing rod, installation cylinders distributed in an array form penetrate through the outer wall of the installation plate, and a contact cylinder is movably arranged in the installation cylinder. The invention can realize multi-point detection on the surface temperature of the semiconductor, further achieve the purpose of detecting the specific abnormal position of the semiconductor, and simultaneously shield the semiconductor element through the wind shielding mechanism in the detection process to prevent external air flow from blowing to the surface of the semiconductor, thereby effectively improving the temperature detection accuracy and having better use effect.
Description
Technical Field
The invention relates to the technical field of semiconductor temperature detection, in particular to a semiconductor detection temperature measuring instrument.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, and most electronic products, such as computers, mobile phones or core units of digital recorders, are closely related to the semiconductor.
At present, the performance of a semiconductor element needs to be detected before the electronic board loaded with a semiconductor leaves a factory, wherein the temperature detection of the semiconductor is one of conventional detection links, but the conventional detection mode mainly adopts a temperature measuring instrument to searchly the surface of the semiconductor to achieve the detection purpose, and the detection mode can only detect the overall temperature of the semiconductor, which is very inaccurate, and meanwhile, the temperature difference at different positions on the surface of the semiconductor cannot be known, so that a semiconductor detection temperature measuring instrument needs to be designed to solve the problems.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a semiconductor detection temperature measuring instrument.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a semiconductor detects temperature measuring apparatu, includes the pedestal, the outer wall of pedestal is provided with the extensible member, and the flexible end of extensible member is provided with the fixed plate, the outer wall of fixed plate is connected with the lifter plate through the connecting rod, the mounting hole has been seted up to the outer wall of lifter plate, and the flexible end of extensible member runs through the mounting hole, the outer wall of lifter plate is provided with the dead lever, and the tip of dead lever is provided with the mounting panel, the outer wall of mounting panel runs through and is provided with the installation section of thick bamboo that is array distribution, and the activity is provided with a touch section of thick bamboo in the installation section of thick bamboo, and is provided with the survey buret in touching the section of thick bamboo, the tip of surveying buret is provided with the atmospheric pressure detector, and is connected through the heat conduction piece between survey buret and the inner wall of touching a section of thick bamboo, the tip of touching a section of thick bamboo is provided with the bracing piece, and the tip of bracing piece is provided with the movable plate that runs through installation section of thick bamboo tip, and the outer wall of thick bamboo cup joints elastic component three, the one end of elastic component is connected with the inner wall of the other end of an installation section of thick bamboo, and the outer wall of elastic component is connected, still includes:
the wind shielding mechanism is arranged on the outer wall of the lifting plate and used for blocking external airflow from blowing to the surface of the semiconductor during detection;
and the placing mechanism is arranged on the outer wall of the base body and used for placing the electronic board provided with the semiconductor.
As a still further scheme of the invention: the wind shielding mechanism comprises a fixing frame arranged on the outer wall of the lifting plate, the mounting plate is arranged in the fixing frame, a wind shielding cover is sleeved on the outer wall of the fixing frame, the end portion of the wind shielding cover is provided with a limiting rod penetrating through the lifting plate, the end portion of the limiting rod is provided with a separation blade, the outer wall of the limiting rod is sleeved with a first elastic piece, one end of the first elastic piece is connected with the outer wall of the lifting plate, and the other end of the first elastic piece is connected with the outer wall of the separation blade.
As a still further scheme of the invention: the wind shield is characterized in that a rubber ring is arranged at one end, away from the lifting plate, of the wind shield, an annular cavity is formed in the rubber ring, and elastic pieces II distributed at equal intervals are arranged in the annular cavity.
As a still further scheme of the invention: the extensible member and the air pressure detector are both connected with a switch through a wire, and the switch is electrically connected with a controller.
As a still further scheme of the invention: the placing mechanism comprises a fixed cylinder arranged on the outer wall of the seat body, a pressure sensor is arranged on the inner wall of the fixed cylinder, the pressure sensor is electrically connected with the controller, a movable column is movably arranged in the fixed cylinder, and a supporting plate is arranged at the end part of the movable column.
As a still further scheme of the invention: the outer wall of lifter plate still is provided with the display, and electric connection between display and the controller.
As a still further scheme of the invention: the outside of pedestal is provided with the safety cover, and the outer wall of safety cover is provided with the handle, the spacing groove has all been seted up to the outer wall all around of pedestal, the outer wall all around of safety cover runs through and is provided with spacing bolt, and the tip screw thread of spacing bolt sets up in the spacing groove.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a semiconductor detection temperature measuring instrument, wherein an electronic board loaded with a semiconductor element can be placed on a placing mechanism, the electronic board is connected with a power supply, then a lifting plate can be driven by a telescopic part to move downwards, a plurality of groups of contact cylinders are in contact with the surface of the semiconductor element, the contact cylinders move in an installation cylinder at the same time, three elastic parts outside a movable rod are compressed, the end parts of the contact cylinders can be supported on the surface of the semiconductor element, the heat on the surface of the semiconductor can be transferred to the contact cylinders, then the heat can be transferred to a measuring pipe through heat conducting blocks in the contact cylinders, the effect of heating air in the measuring pipe is achieved, the air pressure in the measuring pipe can be increased through the heated air, the air pressure value can be monitored through an air pressure detector, the temperature value of the contact part of the end parts of the contact cylinders can be indirectly obtained through the changed air pressure value, the multi-point detection on the surface temperature of the semiconductor can be achieved through the plurality of groups of contact cylinders, the purpose of detecting the specific abnormal positions of the semiconductor can be detected, meanwhile, the semiconductor element can be shielded through a wind shielding mechanism in the detection process, the detection, the external air flow can be effectively improved, and the detection effect is better.
Drawings
Fig. 1 is a schematic cross-sectional structural diagram of a semiconductor temperature measurement instrument according to an embodiment of the present invention;
FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1;
FIG. 3 is an enlarged view of the structure at B in FIG. 2;
fig. 4 is a schematic front view of a semiconductor temperature measuring instrument according to an embodiment of the present invention.
In the figure: 1-seat body, 2-telescopic piece, 3-mounting hole, 4-lifting plate, 5-connecting rod, 6-fixing plate, 7-handle, 8-protective cover, 9-supporting plate, 10-limiting bolt, 11-limiting groove, 12-placing mechanism, 13-fixing cylinder, 14-movable column, 15-pressure sensor, 16-display, 17-fixing rod, 18-mounting plate, 19-fixing frame, 20-windshield cover, 21-limiting rod, 22-blocking piece, 23-elastic piece I, 24-wind shielding mechanism, 25-rubber ring, 26-elastic piece II, 27-mounting cylinder, 28-touch cylinder, 29-supporting rod, 30-moving plate, 31-movable rod, 32-elastic piece III, 33-measuring tube, 34-heat conducting block and 35-air pressure detector.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments.
As shown in fig. 1, 2 and 3, a semiconductor temperature measuring instrument according to an embodiment of the present invention includes a base 1, an outer wall of the base 1 is provided with a telescopic member 2, the specific structure of the telescopic member 2 is not limited, in this embodiment, preferably, the telescopic member 2 is an electric telescopic rod, a fixing plate 6 is disposed at a telescopic end of the telescopic member 2, an outer wall of the fixing plate 6 is connected to a lifting plate 4 through a connecting rod 5, an outer wall of the lifting plate 4 is provided with a mounting hole 3, the telescopic end of the telescopic member 2 penetrates through the mounting hole 3, an outer wall of the lifting plate 4 is provided with a fixing rod 17, an end of the fixing rod 17 is provided with a mounting plate 18, an outer wall of the mounting plate 18 is provided with mounting tubes 27 distributed in an array, and the movable setting touches a section of thick bamboo 28 in the installation section of thick bamboo 27, and touch and be provided with survey buret 33 in the section of thick bamboo 28, the tip of survey buret 33 is provided with atmospheric pressure detector 35, and survey buret 33 and touch and be connected through heat conduction piece 34 between the inner wall of a section of thick bamboo 28, the tip of touching a section of thick bamboo 28 is provided with bracing piece 29, and the tip of bracing piece 29 is provided with movable plate 30, the outer wall of movable plate 30 is provided with movable rod 31 that runs through the end of installation section of thick bamboo 27, and the outer wall of movable rod 31 cup joints elastic component three 32, the concrete structure of three of elastic component does not put a limit on, in this embodiment, preferably, elastic component three 32 adopts the spring, the one end of elastic component three 32 is connected with the inner wall of installation section of thick bamboo 27, and the other end of elastic component three 32 is connected with the outer wall of movable plate 30, still include:
the wind shielding mechanism 24 is arranged on the outer wall of the lifting plate 4 and used for blocking external air flow from blowing to the surface of the semiconductor during detection;
the placing mechanism 12 is arranged on the outer wall of the base body 1, and the placing mechanism 12 is used for placing an electronic board provided with a semiconductor.
The electronic board that the loading has semiconductor element can place on placing mechanism 12, and with the electronic board switch on, then can drive lifter plate 4 through extensible member 2 and move down, make multiunit touch section of thick bamboo 28 and semiconductor element's surface contact, make touch section of thick bamboo 28 remove in installation section of thick bamboo 27 simultaneously, make the elastic component three 32 in the movable rod 31 outside compressed, guarantee that the tip of touch section of thick bamboo 28 can support and hold on semiconductor element's surface, semiconductor surface's heat can transmit to touch section of thick bamboo 28, then transmit to survey buret 33 through the inside heat conduction piece 34 of touch section of thick bamboo 28, play the effect of heating air in surveying buret 33, the air after the heating can make the atmospheric pressure in surveying buret 33 rise, and can monitor the atmospheric pressure value through atmospheric pressure detector 35, can reach the temperature value that touch section of touch section through the atmospheric pressure value of change alright-angle, and can realize carrying out the multiple spot detection to semiconductor surface temperature through the multiunit touch section of setting up, and then reach the purpose that can detect the specific abnormal position of semiconductor, can also carry out the shielding mechanism 24 to the semiconductor element in the detection in the testing process, it blows to block the air current to improve effectively, the detection effect, use is better.
As an embodiment of the present invention, please refer to fig. 2, the wind shielding mechanism 24 includes a fixing frame 19 disposed on the outer wall of the lifting plate 4, the mounting plate 18 is disposed in the fixing frame 19, a wind shielding cover 20 is sleeved on the outer wall of the fixing frame 19, an end of the wind shielding cover 20 is provided with a limiting rod 21 penetrating through the lifting plate 4, an end of the limiting rod 21 is provided with a blocking piece 22, an outer wall of the limiting rod 21 is sleeved with a first elastic piece 23, a specific structure of the first elastic piece 23 is not limited, in this embodiment, preferably, the first elastic piece 23 is a spring, one end of the first elastic piece 23 is connected with the outer wall of the lifting plate 4, and the other end of the first elastic piece 23 is connected with the outer wall of the blocking piece 22, when the lifting plate 4 moves down, the wind shielding cover 20 will contact the electronic plate first, and move down with the lifting plate 4 continuously, the first elastic piece 23 outside the limiting rod 21 is stretched, so that the wind shielding cover 20 can cover the semiconductor element to be detected, thereby avoiding the influence of the external air flow blowing to the surface on the detection of the semiconductor surface, and the semiconductor device, and the use effect is better.
As an embodiment of the present invention, please refer to fig. 2, one end of the wind shield 20 away from the lifting plate 4 is provided with a rubber ring 25, the rubber ring 25 is provided with an annular cavity, the annular cavity is provided with two elastic members 26 distributed at equal intervals, and the specific structure of the two elastic members 26 is not limited.
As an embodiment of the present invention, the telescopic member 2 and the air pressure detector 35 are both connected to a switch through a wire, and the switch is electrically connected to a controller, and the specific structure of the controller is not limited.
As an embodiment of the present invention, please refer to fig. 1, the placing mechanism 12 includes a fixed cylinder 13 disposed on the outer wall of the base 1, the inner wall of the fixed cylinder 13 is provided with a pressure sensor 15, the pressure sensor 15 is electrically connected to the controller, the fixed cylinder 13 is further movably provided with a movable column 14, the end of the movable column 14 is provided with a supporting plate 9, an electronic board to be detected can be placed on the surface of the supporting plate 9, the pressure sensor 15 can detect the downward pressure applied to the supporting plate 9, when the detected pressure reaches a predetermined value, the telescopic member 2 can be driven to stop telescopic movement, so as to prevent the electronic board from being crushed, and the using effect is better.
Referring to fig. 2, as an embodiment of the present invention, a display 16 is further disposed on an outer wall of the lifting plate 4, and the display 16 is electrically connected to the controller, and an air pressure value detected by the air pressure detector 35 can be transmitted to the display 16 through the controller, and is converted into a temperature value to be displayed on the display 16, so that a worker can know real-time temperatures of different positions on a surface of the semiconductor device in time, and the use is very convenient.
As an embodiment of the present invention, please refer to fig. 1 and 4, a protective cover 8 is disposed on an outer side of a base 1, a handle 7 is disposed on an outer wall of the protective cover 8, a limiting groove 11 is disposed on all peripheral outer walls of the base 1, a limiting bolt 10 is disposed through all peripheral outer walls of the protective cover 8, an end thread of the limiting bolt 10 is disposed in the limiting groove 11, and the base 1 and the protective cover 8 can be connected by the limiting bolt 10, so that the detector can play a certain protection role through the protective cover 8 when the detector is idle, and the detector is convenient to carry and has a better use effect through the handle 7 on the surface of the protective cover 8.
During the use, the electronic board loaded with the semiconductor element can be placed on the placing mechanism 12, the electronic board is powered on, then the lifting plate 4 can be driven to move downwards through the telescopic part 2, multiple groups of contact cylinders 28 are in surface contact with the semiconductor element, meanwhile, the contact cylinders 28 move in the mounting cylinder 27, the elastic parts three 32 outside the movable rods 31 are compressed, the end parts of the contact cylinders 28 can be guaranteed to be abutted to the surface of the semiconductor element, the heat of the semiconductor surface can be transferred to the contact cylinders 28, then the heat is transferred to the measuring pipe 33 through the heat conducting blocks 34 inside the contact cylinders 28, the effect of heating the air in the measuring pipe 33 is achieved, the heated air can enable the air pressure in the measuring pipe 33 to be increased, the air pressure value can be monitored through the air pressure detector 35, the temperature value of the contact part of the end parts of the contact cylinders 28 can be indirectly obtained through the changed air pressure value, the multiple groups of contact cylinders 28 can achieve the multipoint detection of the surface temperature of the semiconductor surface, the purpose of detecting the specific abnormal positions of the semiconductor can be detected, meanwhile, the surface of the semiconductor element can be shielded through the wind shielding mechanism 24 in the detecting process, the external air flow can be blocked, the temperature can be effectively improved, and the detection effect is better.
It should be noted that, although the present specification describes embodiments, not every embodiment includes only a single technical solution, and such description of the specification is only for clarity, and those skilled in the art should make the specification as a whole, and the technical solutions in the embodiments may be appropriately combined to form other embodiments understood by those skilled in the art.
Claims (7)
1. The utility model provides a semiconductor detects temperature measuring apparatu, includes the pedestal, its characterized in that, the outer wall of pedestal is provided with the extensible member, and the flexible end of extensible member is provided with the fixed plate, the outer wall of fixed plate is connected with the lifter plate through the connecting rod, the mounting hole has been seted up to the outer wall of lifter plate, and the flexible end of extensible member runs through the mounting hole, the outer wall of lifter plate is provided with the dead lever, and the tip of dead lever is provided with the mounting cylinder that is array distribution, and the activity is provided with in the mounting cylinder and touches a section of thick bamboo, and is provided with a survey buret in touching a section of thick bamboo, the tip of surveying buret is provided with the atmospheric pressure detector, and surveys buret and touch and be connected through the heat conduction piece between the inner wall of a section of thick bamboo, the tip of touching a section of thick bamboo is provided with the bracing piece, and the tip of bracing piece is provided with the movable plate, the outer wall of movable plate is provided with and runs through the movable rod of mounting cylinder tip, and the outer wall of movable rod cup joints elastic component three, the one end of elastic component is connected with the inner wall of mounting cylinder, and the other end of elastic component is connected, still includes:
the wind shielding mechanism is arranged on the outer wall of the lifting plate and used for blocking external airflow from blowing to the surface of the semiconductor during detection;
and the placing mechanism is arranged on the outer wall of the base body and used for placing the electronic board provided with the semiconductor.
2. The semiconductor detection temperature measuring instrument according to claim 1, wherein the wind shielding mechanism comprises a fixing frame arranged on the outer wall of the lifting plate, the mounting plate is arranged in the fixing frame, a wind shielding cover is sleeved on the outer wall of the fixing frame, a limiting rod penetrating through the lifting plate is arranged at the end of the wind shielding cover, a blocking piece is arranged at the end of the limiting rod, a first elastic piece is sleeved on the outer wall of the limiting rod, one end of the first elastic piece is connected with the outer wall of the lifting plate, and the other end of the first elastic piece is connected with the outer wall of the blocking piece.
3. The semiconductor temperature measuring instrument according to claim 2, wherein a rubber ring is disposed at an end of the windshield away from the lifting plate, and a ring cavity is disposed in the rubber ring, and a second elastic member is disposed in the ring cavity and distributed at equal intervals.
4. The semiconductor temperature measuring instrument according to claim 1, wherein the expansion member and the gas pressure detector are connected to a switch through wires, and the switch is electrically connected to the controller.
5. The semiconductor detection temperature measuring instrument according to claim 4, wherein the placing mechanism comprises a fixed cylinder disposed on an outer wall of the seat body, an inner wall of the fixed cylinder is provided with a pressure sensor, the pressure sensor is electrically connected to the controller, the fixed cylinder is further movably disposed therein with a movable post, and an end of the movable post is provided with a support plate.
6. The semiconductor detection temperature measuring instrument according to claim 5, wherein the outer wall of the lifting plate is further provided with a display, and the display is electrically connected with the controller.
7. The semiconductor temperature measuring instrument according to claim 1, wherein a protective cover is disposed on an outer side of the base, a handle is disposed on an outer wall of the protective cover, a limiting groove is disposed on an outer wall of the base, a limiting bolt is disposed through the outer wall of the protective cover, and an end thread of the limiting bolt is disposed in the limiting groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310017203.0A CN115900982B (en) | 2023-01-06 | 2023-01-06 | Semiconductor detection temperature measuring instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310017203.0A CN115900982B (en) | 2023-01-06 | 2023-01-06 | Semiconductor detection temperature measuring instrument |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115900982A true CN115900982A (en) | 2023-04-04 |
| CN115900982B CN115900982B (en) | 2023-06-20 |
Family
ID=86474761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310017203.0A Active CN115900982B (en) | 2023-01-06 | 2023-01-06 | Semiconductor detection temperature measuring instrument |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115900982B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005315602A (en) * | 2004-04-27 | 2005-11-10 | Nippon Seiki Co Ltd | Semiconductor sensor device |
| CN209728542U (en) * | 2019-06-13 | 2019-12-03 | 深圳市燕麦科技股份有限公司 | A kind of temperature equipment for circuit board testing |
| CN111077026A (en) * | 2019-12-30 | 2020-04-28 | 黄山学院 | Testing device for detecting bending performance of material and using method thereof |
| CN111982816A (en) * | 2020-09-30 | 2020-11-24 | 昆山晔芯电子科技有限公司 | Upper cover assembly, chip testing mechanism and chip testing all-in-one machine |
| CN112946010A (en) * | 2021-02-07 | 2021-06-11 | 宏茂科技(珠海)有限公司 | Device for testing thermal performance of semiconductor nano material |
| CN113030710A (en) * | 2021-04-16 | 2021-06-25 | 合肥君壹信息科技有限公司 | Temperature influence testing arrangement for computer motherboard |
-
2023
- 2023-01-06 CN CN202310017203.0A patent/CN115900982B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005315602A (en) * | 2004-04-27 | 2005-11-10 | Nippon Seiki Co Ltd | Semiconductor sensor device |
| CN209728542U (en) * | 2019-06-13 | 2019-12-03 | 深圳市燕麦科技股份有限公司 | A kind of temperature equipment for circuit board testing |
| CN111077026A (en) * | 2019-12-30 | 2020-04-28 | 黄山学院 | Testing device for detecting bending performance of material and using method thereof |
| CN111982816A (en) * | 2020-09-30 | 2020-11-24 | 昆山晔芯电子科技有限公司 | Upper cover assembly, chip testing mechanism and chip testing all-in-one machine |
| CN112946010A (en) * | 2021-02-07 | 2021-06-11 | 宏茂科技(珠海)有限公司 | Device for testing thermal performance of semiconductor nano material |
| CN113030710A (en) * | 2021-04-16 | 2021-06-25 | 合肥君壹信息科技有限公司 | Temperature influence testing arrangement for computer motherboard |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115900982B (en) | 2023-06-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210491228U (en) | Heating device for detecting temperature suitable for heat conducting sheet | |
| CN108896840B (en) | Device and method for in-situ real-time measurement of high-temperature piezoelectric strain constant of piezoelectric material | |
| CN111551836A (en) | IGBT test system with grid leakage current test circuit | |
| CN115900982A (en) | Semiconductor detection temperature measuring instrument | |
| CN210155234U (en) | Static testing device | |
| CN209513842U (en) | A kind of thermal resistance measurement fixes device with semiconductor devices | |
| CN109406120A (en) | A kind of breaker mechanic property examination device | |
| CN213239267U (en) | Temperature monitoring device | |
| CN105758557B (en) | A kind of calibrating installation for isolation switch contact temperature monitoring apparatus | |
| CN112946010B (en) | Device for testing thermal performance of semiconductor nano material | |
| CN216246513U (en) | Multi-dimensional signal integrated acquisition device for switch cabinet | |
| CN214252113U (en) | Thermal insulation material thermal conductivity testing device | |
| CN215066904U (en) | Insulation material electric conduction current alternating temperature testing arrangement | |
| CN210465578U (en) | Lower electrode simulation detection system | |
| CN210347466U (en) | Raman probe cold and hot table and gas environment testing cavity assembly thereof | |
| CN218822815U (en) | Temperature sensor with multi-contact mechanism | |
| CN109211543B (en) | Low-temperature test device for isolating switch and mounting assembly thereof | |
| CN207600651U (en) | A kind of multi-functional disconnecting switch temperature clamping force monitoring device of general-purpose type | |
| CN214584599U (en) | Isolator insulator bending resistance test device | |
| CN218066832U (en) | Isolator clamp force testing arrangement | |
| CN202256690U (en) | Detector supporting device | |
| CN106098425A (en) | A kind of accurate contact induction device of simple in construction | |
| CN213600826U (en) | Device for testing performance parameters of semiconductor material under vacuum condition | |
| CN220063197U (en) | Mining detection sensor | |
| CN219675319U (en) | Temperature sensor response time testing arrangement based on double flute |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |