CN111077026A - Testing device for detecting bending performance of material and using method thereof - Google Patents
Testing device for detecting bending performance of material and using method thereof Download PDFInfo
- Publication number
- CN111077026A CN111077026A CN201911392769.1A CN201911392769A CN111077026A CN 111077026 A CN111077026 A CN 111077026A CN 201911392769 A CN201911392769 A CN 201911392769A CN 111077026 A CN111077026 A CN 111077026A
- Authority
- CN
- China
- Prior art keywords
- shell
- mounting
- hole
- sample
- microprocessor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 80
- 238000005452 bending Methods 0.000 title claims abstract description 46
- 239000000463 material Substances 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims abstract description 32
- 238000001125 extrusion Methods 0.000 claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- 238000007789 sealing Methods 0.000 claims abstract description 17
- 239000007769 metal material Substances 0.000 claims abstract description 12
- 238000001514 detection method Methods 0.000 claims abstract description 10
- 238000009413 insulation Methods 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims abstract description 5
- 238000005192 partition Methods 0.000 claims abstract description 5
- 238000005057 refrigeration Methods 0.000 claims description 17
- 238000004891 communication Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000677 High-carbon steel Inorganic materials 0.000 description 1
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0001—Type of application of the stress
- G01N2203/0003—Steady
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0023—Bending
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/022—Environment of the test
- G01N2203/0222—Temperature
- G01N2203/0228—Low temperature; Cooling means
Abstract
A testing device for detecting bending performance of a material comprises a workbench, a mounting rack and a host; the shell on the workbench is internally divided into two heat dissipation bins and a test bin; mounting holes for mounting the semiconductor refrigerating pieces are uniformly formed in the partition plate; heat insulation glue is filled in the space between the inner wall of the mounting hole and the semiconductor refrigerating sheet; an air draft device is arranged in the heat dissipation bin; a sealing door is arranged at the opening of the test bin, a cover plate is arranged at a first through hole at the top of the shell of the test bin, and a temperature sensor and a clamp are arranged in the test bin; the mounting frame on the workbench is provided with a lifting extrusion device which is used for moving towards or away from the shell so as to extrude the sample in the shell; the host is provided with an alarm, a display screen and a key module, and a circuit board, a microprocessor and a timing module are arranged on the circuit board. The invention also provides a using method of the testing device for detecting the bending performance of the material. The bending detection device can meet the requirements of bending detection of metal materials in different low-temperature environments.
Description
Technical Field
The invention relates to the technical field of material performance detection, in particular to a testing device for detecting bending performance of a material and a using method thereof.
Background
The bending test is used for measuring the mechanical property of the material when the material bears the bending load, and is one of the basic methods for testing the mechanical property of the material; the bending test is mainly used for measuring the bending strength of brittle and low-plastic materials (such as cast iron, high-carbon steel, tool steel and the like) and can reflect the deflection of a plastic index, and the bending test can also be used for checking the surface quality of the materials; with the progress of technology and the expansion of human activity range, the detection of mechanical properties and structural safety of materials at low temperature are more and more emphasized, and it is necessary to research the bending properties of metal materials under different low-temperature environments, so that the application provides a test device for detecting the bending properties of materials and a use method thereof.
Disclosure of Invention
Objects of the invention
The testing device for detecting the bending property of the material can meet the requirement of bending detection of the metal material under different low-temperature environments, and is simple to operate and convenient to use.
(II) technical scheme
The invention provides a testing device for detecting bending performance of a material, which comprises a workbench, a shell, an air draft device, a cover plate, a mounting frame, a host and a semiconductor refrigerating piece, wherein the shell is arranged on the workbench;
the bottom surface of the workbench is provided with a plurality of supporting legs; the shell is arranged on the workbench, and two clapboards are arranged in the shell side by side; the two clapboards are used for dividing the interior of the shell into two heat dissipation bins and a test bin; the test bin is positioned between the two heat dissipation bins; wherein, two cold conducting plates are respectively arranged on the end surfaces of the two clapboards positioned in the test bin; a plurality of mounting holes are uniformly formed in the partition plate;
the two heat dissipation bins are respectively provided with two air inlets and a plurality of air outlets on the shell; the two air draft devices are respectively arranged in the two heat dissipation bins, wherein the air draft devices correspond to the heat dissipation bins one by one, and the air inlet end of each air draft device is connected with the air inlet hole;
the semiconductor refrigeration pieces are respectively positioned in the two heat dissipation bins, the semiconductor refrigeration pieces respectively extend into the mounting holes one by one, and the cold ends of the semiconductor refrigeration pieces respectively compress the two cold guide plates; the space between the inner wall of each mounting hole and each semiconductor refrigerating sheet is filled with heat insulation glue for isolating the hot end and the cold end of each semiconductor refrigerating sheet;
the end face of the shell of the test bin is provided with an opening, the opening of the test bin is provided with a sealing door, the top of the shell of the test bin is provided with a first through hole, a temperature sensor is arranged in the test bin, and the bottom of the test bin is provided with two groups of clamps for placing two ends of a metal material sample; the two groups of clamps are symmetrical by the central axis of the first through hole; the cover plate is placed at the first through hole at the top of the shell, the end face, facing the shell, of the cover plate tightly presses the shell, and the cover plate is provided with a handle;
the mounting frame is arranged on the workbench, and a lifting extrusion device which is used for moving towards or away from the shell to extrude the sample in the shell is arranged on the mounting frame; the lifting extrusion device is positioned right above the first through hole;
the host is provided with an alarm, a display screen and a key module, and a circuit board, a microprocessor and a timing module are arranged on the circuit board; the microprocessor is respectively in communication connection with the temperature sensor, the display screen and the key module, and the microprocessor is respectively in control connection with the two air draft devices, the plurality of semiconductor refrigeration pieces and the lifting extrusion device.
Preferably, each group of clamps comprises a placing block, a plurality of mounting plates and a plurality of fastening pieces; wherein, the bottom surface of the shell is provided with a plurality of threaded blind holes;
the mounting plates are respectively arranged on the side end faces of the placing blocks, and a plurality of threaded holes are respectively formed in the mounting plates; the plurality of fastening pieces respectively penetrate through the plurality of threaded holes in a threaded manner and are screwed into the plurality of threaded blind holes in a threaded manner; the end face of the placing block facing the bottom face of the shell is tightly pressed on the shell, and the upper end face of the placing block facing the direction of the two side end faces away from each other is respectively provided with a second placing groove for placing a square sample and a first placing groove for placing a round sample; wherein, the bottom surface of the first placing groove is set to be a curved surface; the cross section of the second placing groove is square.
Preferably, the end face of the placing block, which is tightly pressed against the shell, is provided with an elastic rubber pad.
Preferably, the lifting extrusion device comprises a pressure head, a lifting device, an end cover, an installation cylinder, a pressure sensor, a sliding piece and a connecting rod;
the control of the lifting device is connected with the microprocessor, the fixed end of the lifting device is connected with the mounting frame, and the telescopic end of the lifting device vertically faces the first through hole and is connected with the end cover; the end cover is in threaded connection with the upper end of the mounting cylinder; the lower end of the mounting cylinder is provided with a second through hole;
one end of the connecting rod is connected with the pressure head, the other end of the connecting rod penetrates through the second through hole and extends into the mounting cylinder, and the other end of the connecting rod is connected with the sliding piece; the sliding piece is connected with the inner wall of the mounting cylinder in a sliding mode so as to move towards or away from the end cover;
the pressure sensor is arranged on the end face, facing the sliding piece, of the end cover, and the pressure sensor is in communication connection with the microprocessor.
Preferably, a sliding sleeve is included; the sliding sleeve is arranged in the second through hole and sleeved outside the connecting rod.
Preferably, the air inlet and the air outlet are both provided with dustproof filter screens.
Preferably, it comprises a laminated board; wherein, the upper end surface of the shell is provided with a groove connected with the head along the circumferential direction of the first through hole;
the pressfitting board sets up on the apron, and in the pressfitting board cooperation inserted the recess, the pressfitting board was equipped with sealed the pad on the terminal surface towards recess inner wall.
Preferably, the projection of the pressboard is in a shape of Chinese character hui.
Preferably, the inner wall of the test bin is provided with a heat-insulating layer.
The invention also provides a using method of the testing device for detecting the bending property of the material, which comprises the following specific steps:
s1, controlling the plurality of semiconductor refrigerating pieces to run to refrigerate the cold guide plate by the microprocessor so as to enable the test chamber to be in a low-temperature environment;
s2, opening a sealing door to place the metal material sample to be detected on the two groups of clamps, setting the storage time of the sample in a low-temperature environment through a timing module, and controlling an alarm to give an alarm by a microprocessor after timing;
s3, separating the cover plate from the shell; the microprocessor sends a signal instruction to the lifting extrusion device;
s4, the lifting extrusion device stretches towards one side of the shell and stretches into the shell to extrude the sample, and the lifting extrusion device returns to the original position after extrusion;
and S5, viewing the bending detection data of the sample from the display screen.
The technical scheme of the invention has the following beneficial technical effects:
when the device is used, the microprocessor controls the plurality of semiconductor refrigerating sheets to operate, and the plurality of semiconductor refrigerating sheets respectively refrigerate the two cold conducting plates, so that the interior of the test bin is cooled to enable the interior of the test bin to be in a low-temperature environment; detecting the temperature in the test bin through a set temperature sensor; placing a sample to be bent on a clamp, timing the sample in a test bin through a timing module, and after timing is finished, receiving a timing end signal by a microprocessor and controlling an alarm to give an alarm; at the moment, the cover plate is opened from the first through hole, the lifting extrusion device is controlled to operate, and the lifting extrusion device extends towards one side of the shell and extends into the shell so as to extrude the sample to bend the sample; after the test of the bending property of the sample is finished, the lifting extrusion device resets; the bent sample is taken out of the shell, and the next sample to be detected is placed, so that the operation is simple, the use is convenient, the bending performance of the metal material can be detected in a low-temperature environment, and data in the bending performance detection of the sample can be visually checked through the display screen;
the invention can meet the requirement of carrying out complete performance detection on the metal material under different low-temperature environments, and has simple operation and convenient use.
Drawings
Fig. 1 is a schematic structural diagram of a testing apparatus for detecting bending property of a material according to the present invention.
Fig. 2 is a schematic structural diagram of a part a of a test apparatus for detecting bending property of a material according to the present invention.
Fig. 3 is a schematic structural diagram of a test apparatus for detecting bending property of a material according to the present invention, in which a part B is enlarged.
Fig. 4 is a schematic perspective view of a clamping block in a testing apparatus for detecting bending property of a material according to the present invention.
Fig. 5 is a schematic perspective view of a cover plate in a testing apparatus for detecting bending property of a material according to the present invention.
Fig. 6 is a front view of a testing apparatus for testing bending properties of a material according to the present invention.
Reference numerals: 1. supporting legs; 2. a work table; 3. a housing; 4. a heat dissipation bin; 5. an air inlet; 6. an air draft device; 7. an exhaust hole; 8. a test bin; 9. a clamp; 91. placing the blocks; 92. mounting a plate; 93. a threaded hole; 94. a first placing groove; 95. a second placing groove; 10. a partition plate; 11. a temperature sensor; 12. a first through hole; 13. a cover plate; 14. a handle; 15. a pressure head; 16. a lifting device; 17. a mounting frame; 18. a host; 19. a display screen; 20. a key module; 21. a cold conducting plate; 22. an end cap; 23. mounting the cylinder; 24. a pressure sensor; 25. a slider; 26. a connecting rod; 27. a sliding sleeve; 28. a sealing door; 29. pressing the plywood; 30. heat insulation glue; 31. a semiconductor refrigeration sheet; 32. and (7) installing holes.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1 to 6, the testing device for detecting bending property of material provided by the invention comprises a workbench 2, a shell 3, an air draft device 6, a cover plate 13, a mounting rack 17, a host 18 and a semiconductor chilling plate 31;
the bottom surface of the workbench 2 is provided with a plurality of supporting feet 1;
the shell 3 is arranged on the workbench 2, and two clapboards 10 are arranged in the shell 3 side by side; the two partition plates 10 are used for dividing the interior of the shell 3 into two heat dissipation chambers 4 and a test chamber 8; the test bin 8 is positioned between the two heat dissipation bins 4; wherein, a plurality of mounting holes 32 are uniformly arranged on the clapboard 10; two cold conducting plates 21 are respectively arranged on the end surfaces of the two clapboards 10 positioned in the test bin 8; the cold conducting plate 21 is made of a material with excellent heat conducting or cold conducting performance, such as copper or copper alloy;
the two heat dissipation bins 4 are respectively provided with two air inlets 5 and a plurality of air outlets 7 on the shell 3; the two air draft devices 6 are respectively arranged in the two heat dissipation bins 4, wherein the air draft devices 6 correspond to the heat dissipation bins 4 one by one, and the air inlet end of each air draft device 6 is connected with the air inlet hole 5; the air draft device 6 is operated to blow air to dissipate heat of the hot ends of the plurality of semiconductor refrigeration pieces 31;
the plurality of semiconductor refrigeration pieces 31 are respectively positioned in the two heat dissipation bins 4, the plurality of semiconductor refrigeration pieces 31 respectively extend into the plurality of mounting holes 32 one by one, and the cold ends of the plurality of semiconductor refrigeration pieces 31 respectively press the two cold guide plates 21; the space between the inner wall of each mounting hole 32 and each semiconductor refrigeration piece 31 is filled with heat insulation glue 30 for isolating the hot end and the cold end of each semiconductor refrigeration piece 31;
further, the end surfaces of the two clapboards 10 positioned on the two heat dissipation bins 4 are provided with heat insulation layers;
an opening is formed in the end face of the shell 3 of the test bin 8, and a sealing door 28 is arranged at the opening of the test bin 8; one end of the sealing door 28 is rotatably connected with the shell 3, the other end of the sealing door 28 is connected with the shell 3 through a lock catch, and a sealing layer is arranged on the end face, pressed by the sealing door 28 and the shell 3, of the sealing door 28 so as to ensure the sealing performance of the sealing door 28 and the shell 3;
further, the sealing door 28 is made of transparent material, so that the test sample can be conveniently observed by bending;
the top of the shell 3 of the test bin 8 is provided with a first through hole 12, a temperature sensor 11 is arranged in the test bin 8, and the bottom surface of the test bin 8 is provided with two groups of clamps 9 for placing two ends of a metal material sample; the two groups of clamps 9 are symmetrical with the central axis of the first through hole 12; the cover plate 13 is placed at the first through hole 12 at the top of the shell 3, the end face of the cover plate 13 facing the shell 3 presses the shell 3 tightly, and the cover plate 13 is provided with a handle 14;
the mounting frame 17 is arranged on the workbench 2, and the mounting frame 17 is provided with a lifting and squeezing device which is used for moving towards or away from the shell 3 so as to squeeze the sample in the shell 3; the lifting extrusion device is positioned right above the first through hole 12;
the host 18 is provided with an alarm, a display screen 19 and a key module 20, and the host 18 is internally provided with a circuit board, a microprocessor and a timing module which are arranged on the circuit board; the timing module is used for setting the time of the sample in the low-temperature environment, and when the timing is finished, the microprocessor receives a timing end signal and controls the alarm to give an alarm for reminding;
the microprocessor is respectively in communication connection with the temperature sensor 11, the display screen 19 and the key module 20, and the microprocessor is respectively in control connection with the two air draft devices 6, the plurality of semiconductor refrigeration sheets 31 and the lifting extrusion device.
In the invention, when the device is used, the microprocessor controls the plurality of semiconductor refrigerating sheets 31 to run, and the plurality of semiconductor refrigerating sheets 31 respectively refrigerate the two cold conducting plates 21, so that the interior of the test bin 8 is cooled to ensure that the interior of the test bin 8 is in a low-temperature environment; the temperature in the test chamber 8 is detected by a temperature sensor 11; placing a sample to be bent on a clamp, timing the sample in a test bin 8 through a timing module, and after the timing is finished, receiving a timing end signal by a microprocessor and controlling an alarm to give an alarm; at the moment, the cover plate 13 is opened from the first through hole 12, the operation of a lifting extrusion device is controlled, and the lifting extrusion device extends towards one side of the shell 3 and extends into the shell 3 so as to extrude and bend the sample; after the test of the bending property of the sample is finished, the lifting extrusion device resets; the shell 3 is taken out of the bent sample, and the next sample to be detected is placed, so that the operation is simple, the use is convenient, the bending property of the metal material can be detected in a low-temperature environment, and data in the test process of the bending property of the sample can be visually checked through the display screen 19.
In an alternative embodiment, each set of clamps includes a placement block 91, a plurality of mounting plates 92, and a plurality of fasteners; wherein, the bottom surface of the shell 3 is provided with a plurality of thread blind holes;
the mounting plates 92 are respectively arranged on the side end faces of the placing blocks 91, and a plurality of threaded holes are respectively formed in the mounting plates 92; the plurality of fastening pieces respectively penetrate through the plurality of threaded holes in a threaded manner and are screwed into the plurality of threaded blind holes in a threaded manner; the end face of the placing block 91 facing the bottom face of the housing 3 presses the housing 3, and the upper end face of the placing block 91 is provided with a second placing groove 95 for placing a square sample and a first placing groove 94 for placing a round sample in the directions of two side end faces away from each other; wherein the bottom surface of the first placement groove 94 is set to a curved surface; the cross section of the second placement groove 95 is square;
the placing block 91 is fixed on the bottom surface of the shell 3 through the arranged fastening piece, so that the placing block 91 is convenient to disassemble and assemble; the first placing groove 94 and the second placing groove 95 provided on the placing block 91 can satisfy the requirement for placing a cylindrical or rectangular sample.
In an alternative embodiment, the end face of the placing block 91 pressed against the housing 3 is provided with an elastic rubber pad.
In an alternative embodiment, the lifting and pressing device comprises a pressure head 15, a lifting device 16, an end cover 22, a mounting cylinder 23, a pressure sensor 24, a sliding piece 25 and a connecting rod 26;
the control of the lifting device 16 is connected with the microprocessor, the fixed end of the lifting device 16 is connected with the mounting frame 17, and the telescopic end of the lifting device 16 vertically faces the first through hole 12 and is connected with the end cover 22; the end cover 22 is in threaded connection with the upper end of the mounting cylinder 23; the lower end of the mounting cylinder 23 is provided with a second through hole;
one end of the connecting rod 26 is connected with the pressure head 15, the other end of the connecting rod 26 penetrates through the second through hole and extends into the mounting cylinder 23, and the other end of the connecting rod 26 is connected with the sliding part 25; the sliding piece 25 is slidably connected with the inner wall of the mounting cylinder 23 to move towards or away from the end cover 22, namely the sliding piece 25 moves up and down;
a pressure sensor 24 is arranged on the end face of the end cover 22 facing the sliding piece 25, and the pressure sensor 24 is in communication connection with the microprocessor;
lifting device 16 stretches out and draws back towards one side of shell 3 until pressure head 15 and sample contact, and lifting device 16 continues the operation, and pressure head 15 and connecting rod 26 drive slider 25 and move towards one side of end cover 22, until slider 25 compresses tightly with pressure sensor 24, detects the extrusion force of pressure head 15 to the sample through the pressure sensor 24 that sets up, and pressure sensor 24 sends the pressure signal that detects for microprocessor to can the audio-visual pressure information of observing on display screen 19.
In an alternative embodiment, a sliding sleeve 27 is included; the sliding sleeve 27 is arranged in the second through hole, and the sliding sleeve 27 is sleeved on the outer side of the connecting rod 26; the sliding sleeve 27 is made of rubber material to reduce the friction of the connecting rod 26 to the installation cylinder.
In an alternative embodiment, dust-proof filter screens are arranged in the air inlet hole 5 and the air outlet hole 7 to prevent impurities with the outer diameter from entering the heat dissipation bin 4.
In an alternative embodiment, a laminate panel 29 is included; wherein, the upper end surface of the shell 3 is provided with a groove connected with the head along the circumferential direction of the first through hole 12;
on the pressfitting board 29 set up apron 13, in the pressfitting board 29 cooperation inserted the recess, the pressfitting board 29 was equipped with sealed the pad on the terminal surface towards recess inner wall, pressfitting board 29 and the sealed pad that are equipped with in order to improve the leakproofness between apron 13 and the shell 3, and avoid apron 13 to break away from first through-hole 12 and play limiting displacement.
In an alternative embodiment, the projection of the platen 29 is in the shape of a letter.
In an alternative embodiment, the inner wall of the test chamber 8 is provided with an insulating layer.
The invention also provides a using method of the testing device for detecting the bending property of the material, which comprises the following specific steps:
s1, controlling the plurality of semiconductor refrigeration sheets 31 to operate to refrigerate the cold conducting plate 21 so that the test chamber 8 is in a low-temperature environment by the microprocessor;
s2, opening the sealing door 28, placing the metal material sample to be detected on the two groups of clamps 9, setting the storage time of the sample in a low-temperature environment through a timing module, and controlling an alarm to give an alarm by the microprocessor after timing;
s3, taking the handle 14 to separate the cover plate 13 from the shell 3; the microprocessor sends a signal instruction to the lifting extrusion device;
s4, the lifting extrusion device stretches towards one side of the shell 3 and stretches into the shell 3 to extrude the sample, and the lifting extrusion device returns to the original position after extrusion;
s5, the bending detection data of the test piece is viewed from the display screen 19.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (10)
1. The testing device for detecting the bending performance of the material is characterized by comprising a workbench (2), a shell (3), an air draft device (6), a cover plate (13), a mounting frame (17), a host (18) and a semiconductor refrigerating sheet (31);
the bottom surface of the workbench (2) is provided with a plurality of supporting feet (1); the shell (3) is arranged on the workbench (2), and two clapboards (10) are arranged in the shell (3) side by side; the two clapboards (10) are used for dividing the interior of the shell (3) into two heat dissipation bins (4) and a test bin (8); the test bin (8) is positioned between the two heat dissipation bins (4); wherein, two cold guide plates (21) are respectively arranged on the end surfaces of the two clapboards (10) positioned in the test bin (8); a plurality of mounting holes (32) are uniformly formed in the partition plate (10);
the two heat dissipation bins (4) are respectively provided with two air inlets (5) and a plurality of air outlets (7) on the shell (3); the two air draft devices (6) are respectively arranged in the two heat dissipation bins (4), wherein the air draft devices (6) correspond to the heat dissipation bins (4) one by one, and the air inlet end of each air draft device (6) is connected with the air inlet hole (5);
the semiconductor refrigeration pieces (31) are respectively positioned in the two heat dissipation bins (4), the semiconductor refrigeration pieces (31) respectively extend into the mounting holes (32) one by one, and the cold ends of the semiconductor refrigeration pieces (31) respectively press the two cold guide plates (21); wherein, the space between the inner wall of each mounting hole (32) and each semiconductor refrigerating sheet (31) is filled with heat insulation glue (30) for isolating the hot end and the cold end of the semiconductor refrigerating sheet (31);
an opening is formed in the end face of the shell (3) of the test bin (8), a sealing door (28) is arranged at the opening of the test bin (8), a first through hole (12) is formed in the top of the shell (3) of the test bin (8), a temperature sensor (11) is arranged in the test bin (8), and two groups of clamps (9) for placing two ends of a metal material sample are arranged on the bottom face of the test bin (8); the two groups of clamps (9) are symmetrical by the central axis of the first through hole (12); the cover plate (13) is placed at the first through hole (12) at the top of the shell (3), the end face, facing the shell (3), of the cover plate (13) presses the shell (3), and a handle (14) is arranged on the cover plate (13);
the mounting rack (17) is arranged on the workbench (2), and the mounting rack (17) is provided with a lifting extrusion device which is used for moving towards or away from the shell (3) so as to extrude the sample in the shell (3); the lifting extrusion device is positioned right above the first through hole (12);
the alarm, the display screen (19) and the key module (20) are arranged on the host (18), and the circuit board, the microprocessor and the timing module are arranged on the circuit board and are arranged in the host (18); the microprocessor is respectively in communication connection with the temperature sensor (11), the display screen (19) and the key module (20), and the microprocessor is respectively in control connection with the two air draft devices (6), the plurality of semiconductor refrigeration pieces (31) and the lifting extrusion device.
2. The material bending property testing device of claim 1, wherein each set of clamps comprises a placing block (91), a plurality of mounting plates (92) and a plurality of fastening pieces; wherein, the bottom surface of the shell (3) is provided with a plurality of threaded blind holes;
the mounting plates (92) are respectively arranged on the side end face of the placing block (91), and the mounting plates (92) are respectively provided with a plurality of threaded holes; the plurality of fastening pieces respectively penetrate through the plurality of threaded holes in a threaded manner and are screwed into the plurality of threaded blind holes in a threaded manner; the end face of the placing block (91) facing the bottom face of the shell (3) is pressed against the shell (3), and the upper end face of the placing block (91) is provided with a second placing groove (95) for placing a square sample and a first placing groove (94) for placing a circular sample in the directions of two side end faces which are far away from each other; wherein, the bottom surface of the first placing groove (94) is set to be a curved surface; the cross section of the second placing groove (95) is square.
3. The device for testing the bending property of a material as claimed in claim 2, wherein an elastic rubber pad is arranged on the end surface of the placing block (91) pressed against the shell (3).
4. The testing device for detecting the bending property of the material as claimed in claim 1, wherein the lifting and pressing device comprises a pressure head (15), a lifting device (16), an end cover (22), a mounting cylinder (23), a pressure sensor (24), a sliding part (25) and a connecting rod (26);
the control of the lifting device (16) is connected with the microprocessor, the fixed end of the lifting device (16) is connected with the mounting frame (17), and the telescopic end of the lifting device (16) vertically faces the first through hole (12) and is connected with the end cover (22); the end cover (22) is in threaded connection with the upper end of the mounting cylinder (23); the lower end of the mounting cylinder (23) is provided with a second through hole;
one end of the connecting rod (26) is connected with the pressure head (15), the other end of the connecting rod (26) penetrates through the second through hole and extends into the mounting cylinder (23), and the other end of the connecting rod (26) is connected with the sliding part (25); the sliding piece (25) is connected with the inner wall of the mounting cylinder (23) in a sliding mode to move towards or away from the end cover (22);
a pressure sensor (24) is arranged on the end face, facing the sliding piece (25), of the end cover (22), and the pressure sensor (24) is in communication connection with the microprocessor.
5. The device for testing the bending property of a material as claimed in claim 4, comprising a sliding sleeve (27); the sliding sleeve (27) is arranged in the second through hole, and the sliding sleeve (27) is sleeved on the outer side of the connecting rod (26).
6. The device for testing the bending property of a material as claimed in claim 1, wherein dust-proof filter screens are arranged in the air inlet (5) and the air outlet (7).
7. The device for testing bending property of material as claimed in claim 1, comprising a laminated plate (29); wherein, the upper end surface of the shell (3) is provided with a groove connected with the head along the circumferential direction of the first through hole (12);
the pressing plate (29) is arranged on the cover plate (13), the pressing plate (29) is inserted into the groove in a matching mode, and a sealing gasket is arranged on the end face, facing the inner wall of the groove, of the pressing plate (29).
8. The device for testing bending properties of materials as claimed in claim 7, wherein the projection of the laminated plate (29) is a zigzag shape.
9. The device for testing the bending property of a material as claimed in claim 1, wherein an insulating layer is arranged on the inner wall of the test chamber (8).
10. The invention also provides a use method of the test device for detecting the bending performance of the material according to any one of claims 1 to 9, which is characterized by comprising the following specific steps of:
s1, controlling the plurality of semiconductor refrigerating sheets (31) to operate to refrigerate the cold conducting plate (21) by the microprocessor so as to enable the test bin (8) to be in a low-temperature environment;
s2, opening a sealing door (28), placing the metal material sample to be detected on the two groups of clamps (9), setting the storage time of the sample in a low-temperature environment through a timing module, and controlling an alarm to give an alarm by a timing-ending microprocessor;
s3, separating the cover plate (13) from the shell (3); the microprocessor sends a signal instruction to the lifting extrusion device;
s4, the lifting extrusion device stretches towards one side of the shell (3) and stretches into the shell (3) to extrude the sample, and the lifting extrusion device returns to the original position after extrusion is finished;
and S5, viewing the bending detection data of the sample from the display screen (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911392769.1A CN111077026A (en) | 2019-12-30 | 2019-12-30 | Testing device for detecting bending performance of material and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911392769.1A CN111077026A (en) | 2019-12-30 | 2019-12-30 | Testing device for detecting bending performance of material and using method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111077026A true CN111077026A (en) | 2020-04-28 |
Family
ID=70319369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911392769.1A Pending CN111077026A (en) | 2019-12-30 | 2019-12-30 | Testing device for detecting bending performance of material and using method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111077026A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111479425A (en) * | 2020-05-12 | 2020-07-31 | 吉林建筑科技学院 | Big data computer network safety device |
| CN112113853A (en) * | 2020-09-11 | 2020-12-22 | 广东稳固检测鉴定有限公司 | Device and method for detecting durability of assembly type building sealant |
| CN112525689A (en) * | 2020-11-27 | 2021-03-19 | 益阳市明正宏电子有限公司 | Intensity detection device is used in circuit board production |
| CN113405924A (en) * | 2021-06-15 | 2021-09-17 | 上海大学 | Automatic device for temperature brittleness test of rubber support sample wafer |
| CN114034578A (en) * | 2021-11-11 | 2022-02-11 | 詹清 | Special circuit board bending resistance test machine |
| CN115900982A (en) * | 2023-01-06 | 2023-04-04 | 鲁欧智造(山东)高端装备科技有限公司 | Semiconductor detection temperature measuring instrument |
| WO2023014625A3 (en) * | 2021-08-03 | 2023-06-01 | Illinois Tool Works Inc. | Material testing systems including improved component cooling |
Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006078397A (en) * | 2004-09-10 | 2006-03-23 | Momose Kikai Sekkei Kk | Low/high temperature strength tester |
| CN102645377A (en) * | 2012-04-19 | 2012-08-22 | 中国科学院理化技术研究所 | Fatigue property test device of 4.2-300K temperature area |
| CN103487332A (en) * | 2013-09-26 | 2014-01-01 | 无锡俊达测试技术服务有限公司 | Device for testing bending resistance of objects |
| CN104406863A (en) * | 2014-12-03 | 2015-03-11 | 清华大学苏州汽车研究院（相城） | Three-point bending test device and test method for high-speed tensile test machine |
| CN204675108U (en) * | 2015-05-02 | 2015-09-30 | 大连华工创新科技股份有限公司 | Portable small-sized or micro constant-temperature case or electric refrigerator |
| CN204905382U (en) * | 2015-09-15 | 2015-12-23 | 惠州市亿鹏能源科技有限公司 | Power battery organizes temperature regulation apparatus |
| CN106016546A (en) * | 2016-07-11 | 2016-10-12 | 贵阳天启智能科技有限公司 | Semiconductor refrigeration and cold-accumulation air conditioner fan |
| CN106091522A (en) * | 2016-06-13 | 2016-11-09 | 山东大学 | Cold-storage delivery case based on semiconductor refrigerating |
| CN207163797U (en) * | 2017-09-05 | 2018-03-30 | 广州尚清环保科技有限公司 | A kind of water quality sample-taking box for possessing cold storage function |
| CN207455990U (en) * | 2017-10-30 | 2018-06-05 | 姜涛 | A kind of novel evacuated sampling pipe refrigerating box |
| CN207726003U (en) * | 2017-12-18 | 2018-08-14 | 蒋静 | A kind of detection water sample save set |
| CN207894722U (en) * | 2018-02-11 | 2018-09-21 | 中铁十五局集团城市建设工程有限公司 | Waw-1000 type pressure testing machines test the auxiliary stand of rod piece anti-bending strength |
| CN208060304U (en) * | 2018-04-25 | 2018-11-06 | 南京林业大学 | Orthogonal glued wood bending strength test device |
| CN109142041A (en) * | 2018-11-02 | 2019-01-04 | 中国人民解放军空军工程大学 | A method of detection sample sliding and bending deformation |
| CN208603028U (en) * | 2018-07-25 | 2019-03-15 | 成都品尚农电子商务有限公司 | A kind of agricultural products storage and preservation chamber |
| CN208636160U (en) * | 2018-04-26 | 2019-03-22 | 龙游县万基建设工程检测有限公司 | A kind of high-low temperature test chamber of the high reliablity for construction material detection |
| CN209014403U (en) * | 2018-11-13 | 2019-06-21 | 河南盛程实业有限公司 | A kind of PE pipe external pressure experiment device |
| CN209086063U (en) * | 2018-11-22 | 2019-07-09 | 广东泰升工程质量检测有限公司 | A kind of unconfined compressive strength instrument |
| CN209446406U (en) * | 2019-01-27 | 2019-09-27 | 何燕杰 | A kind of machinofacture buckle resistance detection device |
| CN110523152A (en) * | 2019-09-26 | 2019-12-03 | 上海跃笛环保科技有限公司 | A kind of explosion-proof controller of high degree of automation |
-
2019
- 2019-12-30 CN CN201911392769.1A patent/CN111077026A/en active Pending
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006078397A (en) * | 2004-09-10 | 2006-03-23 | Momose Kikai Sekkei Kk | Low/high temperature strength tester |
| CN102645377A (en) * | 2012-04-19 | 2012-08-22 | 中国科学院理化技术研究所 | Fatigue property test device of 4.2-300K temperature area |
| CN103487332A (en) * | 2013-09-26 | 2014-01-01 | 无锡俊达测试技术服务有限公司 | Device for testing bending resistance of objects |
| CN104406863A (en) * | 2014-12-03 | 2015-03-11 | 清华大学苏州汽车研究院（相城） | Three-point bending test device and test method for high-speed tensile test machine |
| CN204675108U (en) * | 2015-05-02 | 2015-09-30 | 大连华工创新科技股份有限公司 | Portable small-sized or micro constant-temperature case or electric refrigerator |
| CN204905382U (en) * | 2015-09-15 | 2015-12-23 | 惠州市亿鹏能源科技有限公司 | Power battery organizes temperature regulation apparatus |
| CN106091522A (en) * | 2016-06-13 | 2016-11-09 | 山东大学 | Cold-storage delivery case based on semiconductor refrigerating |
| CN106016546A (en) * | 2016-07-11 | 2016-10-12 | 贵阳天启智能科技有限公司 | Semiconductor refrigeration and cold-accumulation air conditioner fan |
| CN207163797U (en) * | 2017-09-05 | 2018-03-30 | 广州尚清环保科技有限公司 | A kind of water quality sample-taking box for possessing cold storage function |
| CN207455990U (en) * | 2017-10-30 | 2018-06-05 | 姜涛 | A kind of novel evacuated sampling pipe refrigerating box |
| CN207726003U (en) * | 2017-12-18 | 2018-08-14 | 蒋静 | A kind of detection water sample save set |
| CN207894722U (en) * | 2018-02-11 | 2018-09-21 | 中铁十五局集团城市建设工程有限公司 | Waw-1000 type pressure testing machines test the auxiliary stand of rod piece anti-bending strength |
| CN208060304U (en) * | 2018-04-25 | 2018-11-06 | 南京林业大学 | Orthogonal glued wood bending strength test device |
| CN208636160U (en) * | 2018-04-26 | 2019-03-22 | 龙游县万基建设工程检测有限公司 | A kind of high-low temperature test chamber of the high reliablity for construction material detection |
| CN208603028U (en) * | 2018-07-25 | 2019-03-15 | 成都品尚农电子商务有限公司 | A kind of agricultural products storage and preservation chamber |
| CN109142041A (en) * | 2018-11-02 | 2019-01-04 | 中国人民解放军空军工程大学 | A method of detection sample sliding and bending deformation |
| CN209014403U (en) * | 2018-11-13 | 2019-06-21 | 河南盛程实业有限公司 | A kind of PE pipe external pressure experiment device |
| CN209086063U (en) * | 2018-11-22 | 2019-07-09 | 广东泰升工程质量检测有限公司 | A kind of unconfined compressive strength instrument |
| CN209446406U (en) * | 2019-01-27 | 2019-09-27 | 何燕杰 | A kind of machinofacture buckle resistance detection device |
| CN110523152A (en) * | 2019-09-26 | 2019-12-03 | 上海跃笛环保科技有限公司 | A kind of explosion-proof controller of high degree of automation |
Non-Patent Citations (1)
| Title |
|---|
| 王金荣等: "用于材料试验机的断裂力学试验夹具及低温环境箱的设计", 《理化检验.物理分册》 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111479425A (en) * | 2020-05-12 | 2020-07-31 | 吉林建筑科技学院 | Big data computer network safety device |
| CN112113853A (en) * | 2020-09-11 | 2020-12-22 | 广东稳固检测鉴定有限公司 | Device and method for detecting durability of assembly type building sealant |
| CN112525689A (en) * | 2020-11-27 | 2021-03-19 | 益阳市明正宏电子有限公司 | Intensity detection device is used in circuit board production |
| CN112525689B (en) * | 2020-11-27 | 2023-08-25 | 益阳市明正宏电子有限公司 | Intensity detection device is used in circuit board production |
| CN113405924A (en) * | 2021-06-15 | 2021-09-17 | 上海大学 | Automatic device for temperature brittleness test of rubber support sample wafer |
| CN113405924B (en) * | 2021-06-15 | 2023-07-25 | 上海大学 | Automatic device for temperature brittleness test of rubber support sample wafer |
| WO2023014625A3 (en) * | 2021-08-03 | 2023-06-01 | Illinois Tool Works Inc. | Material testing systems including improved component cooling |
| CN114034578A (en) * | 2021-11-11 | 2022-02-11 | 詹清 | Special circuit board bending resistance test machine |
| CN115900982A (en) * | 2023-01-06 | 2023-04-04 | 鲁欧智造(山东)高端装备科技有限公司 | Semiconductor detection temperature measuring instrument |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111077026A (en) | Testing device for detecting bending performance of material and using method thereof | |
| CN210690256U (en) | Electronic product's resistance to compression and tensile properties detection device | |
| CN215065232U (en) | Film pasting device with rivet detection alarm mechanism | |
| CN216208148U (en) | Novel foam compression force and impedance test fixture | |
| CN206948436U (en) | A kind of mobile phone hardware detection means | |
| CN214429795U (en) | Multi-layer circuit board pressing device | |
| CN208039486U (en) | A kind of Snap fastener assembling building panel | |
| CN210154936U (en) | Alloy bearing performance detection equipment | |
| CN217688661U (en) | Building board thermal insulation performance detector | |
| CN207832367U (en) | A kind of friction force checking device of soft-package battery module | |
| CN216815855U (en) | Leak detector | |
| CN217503113U (en) | Computer display screen strutting arrangement | |
| CN220489223U (en) | Microwave assembly cavity convenient to install and prevent damage | |
| CN108344934A (en) | A kind of ceramic capacitor overpressure resistance detecting device | |
| CN219070425U (en) | Handle of tongue pressure sensor | |
| CN219434581U (en) | Multistation hardness detection device | |
| CN104880276A (en) | Vacuum insulation panel vacuum degree detection equipment | |
| CN204705430U (en) | A kind of equipment for vacuum heat-insulating plate vacuum degree measurement | |
| CN215810735U (en) | Quality detection device for power distribution cabinet shell production | |
| CN216443095U (en) | Device suitable for laminating shading adhesive tape of liquid crystal display product | |
| CN210293435U (en) | Material weighing controller for storage | |
| CN204330489U (en) | A kind of Novel fire-proof door bending compression test unit | |
| CN220730100U (en) | Building door and window wall body thermal insulation performance testing arrangement | |
| CN217846404U (en) | Detection jig and simple detection equipment | |
| CN203580330U (en) | Hot stamping tooling |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200428 |
|
| RJ01 | Rejection of invention patent application after publication |