CN113405924B - Automatic device for temperature brittleness test of rubber support sample wafer - Google Patents
Automatic device for temperature brittleness test of rubber support sample wafer Download PDFInfo
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- CN113405924B CN113405924B CN202110661243.XA CN202110661243A CN113405924B CN 113405924 B CN113405924 B CN 113405924B CN 202110661243 A CN202110661243 A CN 202110661243A CN 113405924 B CN113405924 B CN 113405924B
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- temperature brittleness
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- 238000012360 testing method Methods 0.000 title claims abstract description 35
- 238000003860 storage Methods 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims abstract description 15
- 238000013016 damping Methods 0.000 claims abstract description 8
- 239000004065 semiconductor Substances 0.000 claims description 29
- 238000003466 welding Methods 0.000 claims description 7
- 229920002492 poly(sulfone) Polymers 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 230000007306 turnover Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 19
- 235000012431 wafers Nutrition 0.000 description 20
- 238000010438 heat treatment Methods 0.000 description 11
- 238000005057 refrigeration Methods 0.000 description 10
- 230000008859 change Effects 0.000 description 7
- 230000001276 controlling effect Effects 0.000 description 7
- 230000001105 regulatory effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 230000003139 buffering effect Effects 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000002354 daily effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/30—Investigating strength properties of solid materials by application of mechanical stress by applying a single impulsive force, e.g. by falling weight
- G01N3/303—Investigating strength properties of solid materials by application of mechanical stress by applying a single impulsive force, e.g. by falling weight generated only by free-falling weight
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
- G01N3/06—Special adaptations of indicating or recording means
- G01N3/068—Special adaptations of indicating or recording means with optical indicating or recording means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0001—Type of application of the stress
- G01N2203/001—Impulsive
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/0641—Indicating or recording means; Sensing means using optical, X-ray, ultraviolet, infrared or similar detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/067—Parameter measured for estimating the property
- G01N2203/0676—Force, weight, load, energy, speed or acceleration
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/067—Parameter measured for estimating the property
- G01N2203/0694—Temperature
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses an automatic device for a temperature brittleness test of a rubber support sample wafer, which comprises a zoom camera, a storage plate, a rack and a controller, wherein limit supports are arranged on two sides of the bottom of the rack, and a crawler-type conveyor belt is arranged in the rack. According to the invention, the impact head, the driving plate, the connecting cutting and the connecting slot are arranged, so that when the device is used, on one hand, a user can use the connecting effect of the first fixing frame and the screw to disassemble and maintain the zoom camera on the device, and on the other hand, the user can use the inserting connecting structure formed by the connecting cutting and the connecting slot to match with the locking and fixing effects of the locking piece and the screw to disassemble and assemble the impact head on the driving plate by arranging the damping rotating shafts between the two sides of the zoom camera and the first fixing frame.
Description
Technical Field
The invention relates to the technical field of temperature brittleness tests, in particular to an automatic device for a rubber support sample wafer temperature brittleness test.
Background
The rubber support is widely applied to various electrical equipment, has the advantages of skid resistance and buffering and shock absorption, and in order to ensure the performance of the rubber support, the rubber support needs to be detected by an automatic device for a temperature brittleness test of a sample wafer of the rubber support during processing and preparation, but the conventional automatic device for the temperature brittleness test of the sample wafer of the rubber support is not provided with an impact device and a sample wafer conveying device during actual use, is not easy to continuously test a plurality of sample wafers, is not easy to record the impact process of the sample wafer test by using a camera, is inconvenient to analyze the brittleness degree of the sample wafer, is not easy to operate and the like, and is unfavorable for long-term popularization of the device.
Disclosure of Invention
The invention aims to provide an automatic device for a temperature brittleness test of a rubber support sample wafer, which solves the problems that in the background technology, an impact device and a sample wafer conveying device are not arranged, a plurality of sample wafers are not easy to test continuously, a camera is not easy to record the impact process of the sample wafer test, and the brittleness degree and the operation of the sample wafers are not convenient to analyze and record.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides an automatic device for rubber support dailies temperature brittleness test, includes zoom camera, puts thing board, frame and controller, spacing support is all installed to the both sides of frame bottom, and the internally mounted of frame has the crawler-type conveyer belt, and servo motor is evenly installed to the one end of crawler-type conveyer belt, and the top of crawler-type conveyer belt evenly is fixed with puts the thing board, put the inside top of thing board and evenly install the semiconductor refrigeration piece, put the one end of thing board inside and install temperature sensor, and put the bottom of thing board and install the fan, install the zoom camera in the frame of thing board top, evenly be fixed with the guide rail in the frame of zoom camera one end, the drive plate is installed near the one end of zoom camera to the guide rail, and the impact head is installed to the bottom of drive plate, and the internally mounted of impact head has pressure sensor, the controller is installed to the lateral wall of frame.
Preferably, the first fixing frame is installed at the top of zooming camera, and the screw that is connected with the frame is evenly provided with at the top of first fixing frame, is convenient for record and show the dynamic change of brittleness in the rubber support testing process.
Preferably, a damping rotating shaft is arranged between the two sides of the zoom camera and the first fixing frame, a turnover structure is formed between the zoom camera and the first fixing frame, and a user can conveniently adjust the use angle of the zoom camera.
Preferably, the object placing plate and the crawler-type conveyor belt are bonded, the two ends of the top of the impact head are welded with connecting cutting bars, connecting slots matched with the connecting cutting bars are uniformly formed in the driving plate, locking pieces are welded on one sides of the connecting cutting bars, and screws connected with the driving plate are arranged on the locking pieces, so that the impact head is convenient for a user to disassemble and assemble the impact head on the driving plate.
Preferably, the limit support is provided with 2, and both ends of limit support all are provided with fixing bolt, make it convenient for the user with the device carry out fixed mounting at suitable operation mesa.
Preferably, the top of the limit support is fixed with a rubber buffer pad, and the rubber buffer pad and the frame are connected by hot melting, so that the damping buffer performance of the device is improved, and the stable effect of the device is enhanced.
Preferably, the frame is made of stainless steel, and the outer side wall of the frame is provided with a polysulfone rigid layer, so that the structure of the device is optimized, and the structural strength of the frame is enhanced.
Preferably, the number of the guide rails is 2, and an integrated welding structure is formed between the guide rails and the frame, so that the firmness of the whole structure of the device is improved through welding.
Preferably, the linear motor is installed on the top end of the guide rail, the output end of the linear motor is adhered with the sliding block, and the sliding block and the driving plate are adhered to each other, so that stability between the sliding block and the driving plate is improved through adhesion.
Preferably, the bottom of fan welding has the second mount, and the top of second mount evenly is provided with the screw of being connected with putting the thing board, makes it can promote the refrigeration effect of device.
Compared with the prior art, the invention has the beneficial effects that:
(1) According to the automatic device for the temperature brittleness test of the rubber support sample wafer, the impact head, the driving plate, the connecting cutting and the connecting slot are arranged, so that the structure of the automatic device is optimized, when the automatic device is used, on one hand, a user can utilize the connecting effect of the first fixing frame and the screw to disassemble, assemble and maintain the zoom camera on the device, and on the other hand, the user can utilize the inserting connecting structure formed by the connecting cutting and the connecting slot to assemble and disassemble the impact head on the driving plate by utilizing the locking and fixing effects of the locking piece and the screw due to the damping rotating shafts arranged between the two sides of the zoom camera and the first fixing frame, the impact head structure is convenient for a user to maintain, the linear motor is utilized to drive the sliding block and the impact head arranged on the sliding block to fall, the falling speed of the heavy object is higher, the impact force of the impact device is higher, the test effect is improved by arranging the impact device, and in the specific test, the rubber support to be tested is sequentially placed on the object placing plates, the servo motor is started to drive the crawler-type conveying belt to rotate, so that all the object placing plates adhered to the crawler of the crawler-type conveying belt are conveyed forwards, sample wafers placed on the object placing plates are sequentially conveyed forwards, the test is sequentially carried out, and then the working efficiency of the device is improved by arranging the sample wafer conveying device;
(2) The automatic device for the temperature brittleness test of the rubber support sample wafer optimizes the performance of the device by installing the semiconductor refrigerating sheets, the object placing plate, the zoom camera and the rack, when the automatic device is used, on one hand, two semiconductor refrigerating sheets are uniformly installed in the object placing plate, the refrigerating end of one semiconductor refrigerating sheet is aligned to the top of the object placing plate, the heating end of the other semiconductor refrigerating sheet is aligned to the top of the object placing plate, the controller is used for controlling the heating end to be electrified to the semiconductor refrigerating sheet aligned to the top of the object placing plate during specific operation, the rubber support placed at the top of the object placing plate can be heated, in addition, the controller is used for controlling the refrigerating end to be electrified to the semiconductor refrigerating sheet aligned to the top of the object placing plate, the rubber support placed at the top of the object placing plate can be refrigerated, and then the temperature monitoring function of the temperature sensor is matched, the device optimizes the temperature regulating function, is convenient for heating and refrigerating, is convenient for accurately regulating the temperature of the object placing plate, further improves the temperature regulating range and accuracy of the temperature brittleness test of the rubber support, on the other hand, the zoom camera matched with the object placing plate is arranged on the frame, the rubber support which is tested and detected on the object placing plate can be shot by utilizing the camera, the monitored data is sent to the controller and the industrial computer connected with the controller, the deformation condition of the rubber support is conveniently amplified and visually displayed on the screen of the industrial computer by utilizing the image amplifying function of the zoom camera, further, the dynamic change of brittleness in the detection process of the rubber support is conveniently recorded and displayed, and the temperature data and the pressure data which are applied to the rubber support and are monitored by the temperature sensor and the pressure sensor, the temperature and pressure change information can be sent to a controller and an industrial computer, so that a display screen on the industrial computer can record and intuitively display the temperature and pressure change conditions, and further, the observation and recording of experimental results are facilitated;
(3) This an automatic device for rubber support sample wafer temperature brittleness test is through installing the semiconductor refrigeration piece, put thing board, fan and rubber blotter for when the device in-service use, on the one hand through install the fan on putting the thing board of semiconductor refrigeration piece below, when the opposition thing board carries out refrigeration treatment, start the fan and dispel the heat, can promote the refrigeration effect of device, when avoiding the refrigeration end operation of semiconductor refrigeration piece, the end that generates heat that corresponds because the heat dissipation is bad influences refrigeration effect, on the other hand the user can utilize two spacing supports and the effect of fixing bolt who sets up on it, carry out fixed mounting with the device at suitable operation mesa, thereby the stability of device has been strengthened, and through being provided with the rubber blotter between spacing support and frame, utilize the elasticity buffering effect of rubber, the shock attenuation cushioning performance of device has been promoted, the steady effect of device has been strengthened.
Drawings
FIG. 1 is a schematic elevational view of the present invention;
FIG. 2 is a schematic view of a rear view of a storage plate according to the present invention;
FIG. 3 is a schematic cross-sectional elevation view of an impact head according to the present invention;
FIG. 4 is a schematic side view of a guide rail of the present invention;
fig. 5 is a block diagram of the system of the present invention.
In the figure: 1. a first fixing frame; 2. a zoom camera; 3. a storage plate; 4. a fixing bolt; 5. a rubber cushion pad; 6. a limit support; 7. a frame; 8. a controller; 9. a guide rail; 901. a linear motor; 10. a driving plate; 11. a connection slot; 12. an impact head; 13. a semiconductor refrigeration sheet; 14. a temperature sensor; 15. the second fixing frame; 16. a blower; 17. connecting the cutting; 18. a locking piece; 19. a pressure sensor; 20. a slide block; 21. a crawler belt; 22. a servo motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-5, an embodiment of the present invention is provided: an automatic device for a rubber support sample wafer temperature brittleness test comprises a zooming camera 2, a storage plate 3, a rack 7 and a controller 8, wherein limit supports 6 are arranged on two sides of the bottom of the rack 7, a crawler-type conveyor belt 21 is arranged in the rack 7, a servo motor 22 is uniformly arranged at one end of the crawler-type conveyor belt 21, the storage plate 3 is uniformly fixed at the top of the crawler-type conveyor belt 21, a semiconductor refrigerating plate 13 is uniformly arranged at the top of the inner part of the storage plate 3, a temperature sensor 14 is arranged at one end of the inner part of the storage plate 3, a fan 16 is arranged at the bottom of the storage plate 3, the zooming camera 2 is arranged on the rack 7 above the storage plate 3, a guide rail 9 is uniformly fixed on the rack 7 at one end of the zooming camera 2, a driving plate 10 is arranged at one end of the guide rail 9 close to the zooming camera 2, an impact head 12 is arranged at the bottom of the driving plate 10, a pressure sensor 19 is arranged in the impact head 12, and the controller 8 is arranged on the outer side wall of the rack 7;
the top of the zoom camera 2 is provided with a first fixing frame 1, and screws connected with a frame 7 are uniformly arranged on the top of the first fixing frame 1;
when the device is used, on one hand, the zoom camera 2 matched with the object placing plate 3 is arranged on the frame 7, the camera can be used for shooting a rubber support seat which is tested and detected on the object placing plate 3, monitored data are sent to the controller 8 and an industrial computer connected with the controller, the deformation condition of the rubber support seat is conveniently amplified and visually displayed on an industrial computer screen by utilizing the image amplifying function of the zoom camera 2, and further, the dynamic change of brittleness in the detection process of the rubber support seat is conveniently recorded and displayed, and on the other hand, a user can use the connection effect of the first fixing frame 1 and screws to disassemble, assemble and maintain the zoom camera 2 on the device;
damping rotating shafts are arranged between the two sides of the zoom camera 2 and the first fixing frame 1, and a turnover structure is formed between the zoom camera 2 and the first fixing frame 1;
when the device is used, the damping rotating shafts are arranged between the two sides of the zoom camera 2 and the first fixing frame 1, so that a user can conveniently adjust the use angle of the zoom camera 2, and the detection effect on deformation conditions is improved;
the object placing plate 3 and the crawler belt 21 are bonded, the two ends of the top of the impact head 12 are welded with connecting cutting bars 17, the driving plate 10 is uniformly provided with connecting slots 11 matched with the connecting cutting bars 17, one side of the connecting cutting bars 17 is welded with locking sheets 18, and the locking sheets 18 are provided with screws connected with the driving plate 10;
when in use, a user can use the insertion connection structure formed by the connection cutting 17 and the connection slot 11 to assemble and disassemble the impact head 12 on the driving plate 10 by matching the locking and fixing functions of the locking piece 18 and the screw, thereby being convenient for the user to maintain the structure of the impact head 12;
the number of the limiting supports 6 is 2, and fixing bolts 4 are arranged at two ends of the limiting supports 6;
when in use, a user can fixedly install the device on a proper operation table by utilizing the functions of the two limit supports 6 and the fixing bolts 4 arranged on the limit supports, so that the stability of the device is enhanced;
the top of the limit support 6 is fixed with a rubber cushion pad 5, and the rubber cushion pad 5 and the frame 7 form hot melt connection;
when the device is used, the rubber buffer cushion 5 is arranged between the limiting support 6 and the frame 7, so that the damping and buffering performance of the device is improved by utilizing the elastic buffering effect of rubber, and the stable effect of the device is enhanced;
the frame 7 is made of stainless steel, and the outer side wall of the frame 7 is provided with a polysulfone rigid layer;
the structure of the device is optimized, and the structural strength of the frame 7 is enhanced;
2 guide rails 9 are arranged, and an integrated welding structure is formed between the guide rails 9 and the frame 7;
the firmness of the whole structure of the device is improved by welding;
a linear motor 901 is arranged at the top end of the guide rail 9, a slide block 20 is adhered to the output end of the linear motor 901, and adhesion is formed between the slide block 20 and the driving plate 10;
when the device is used, on one hand, the stability between the sliding block 20 and the driving plate 10 is improved through bonding, and on the other hand, the linear motor 901 is used for driving the sliding block 20 and the impact head 12 arranged with the sliding block to fall, so that the falling speed of a heavy object is higher, the impact force of the impact device is higher, and the test effect is improved;
the bottom of the fan 16 is welded with a second fixing frame 15, and screws connected with the object placing plate 3 are uniformly arranged on the top of the second fixing frame 15;
when the refrigerator is used, on one hand, two semiconductor refrigerating sheets 13 are uniformly arranged in the article placing plate 3, the refrigerating end of one semiconductor refrigerating sheet 13 is aligned to the top of the article placing plate 3, and the heating end of the other semiconductor refrigerating sheet 13 is aligned to the top of the article placing plate 3, when the refrigerator is specifically operated, the controller 8 is used for controlling the heating end to be electrified to the semiconductor refrigerating sheet 13 aligned to the top of the article placing plate 3, the rubber support arranged at the top of the article placing plate 3 can be heated, in addition, the controller 8 is used for controlling the refrigerating end to be electrified to the semiconductor refrigerating sheet 13 aligned to the top of the article placing plate 3, the rubber support arranged at the top of the article placing plate 3 can be refrigerated, and then the temperature monitoring function of the temperature sensor 14 is matched, so that the refrigerator optimizes the temperature regulating function, is convenient for heating and refrigerating, and is convenient for accurately regulating and controlling the temperature of the article placing plate 3, and further improving the temperature regulating range and accuracy of the temperature brittleness test of the rubber support, meanwhile, the fan 16 is arranged on the article placing plate 3 below the semiconductor refrigerating sheet 3, when the article placing plate 3 is processed, the heat radiating end 16 is controlled to be electrified to be aligned to the semiconductor refrigerating sheet 13, and the fan 16 can be conveniently replaced by the fan 16 when the heat radiating end is started, and the fan 16 is not connected to the fan is connected to the second refrigerating end of the article placing plate 3, and the heat radiating device can be conveniently and the heat-cooled by the fan 16 when the fan is used for the refrigerating effect is not being connected to the refrigerating with the refrigerating end to the heat refrigerating end;
the output ends of the temperature sensor 14 and the pressure sensor 19 are respectively and electrically connected with the input end of the controller 8 through wires, the output end of the controller 8 is respectively and electrically connected with the linear motor 901, the servo motor 22, the semiconductor refrigerating sheet 13 and the input end of the fan 16 through wires, the zoom camera 2 is in bidirectional electrical connection with the controller 8 through wires, the model of the controller 8 can be FX1S-20MR-D, the model of the semiconductor refrigerating sheet 13 can be TEC1-12705, the model of the fan 16 can be DC6025, the model of the pressure sensor 19 can be WF5803F, the model of the temperature sensor 14 can be WRM-101, and the model of the servo motor 22 can be EDSMT-2T.
Working principle: when in use, a user can utilize the functions of the two limit supports 6 and the fixing bolts 4 arranged on the limit supports to fixedly mount the device on a proper operation table, so that the stability of the device is enhanced, then the rubber supports to be tested are sequentially placed on the object placing plate 3, the servo motor 22 is started to drive the crawler belt conveyor belt 21 to rotate, each object placing plate 3 adhered on the crawler belt of the crawler belt conveyor belt 21 is enabled to be conveyed forwards, sample wafers placed on the object placing plate 3 are sequentially conveyed forwards to sequentially perform the test, further, the working efficiency of the device is improved by arranging an automatic conveying structure, meanwhile, two semiconductor refrigerating sheets 13 are uniformly arranged in the object placing plate 3, the refrigerating end of one semiconductor refrigerating sheet 13 is aligned to the top of the object placing plate 3, and the heating end of the other semiconductor refrigerating sheet 13 is aligned to the top of the object placing plate 3, in the concrete operation, the controller 8 is used for controlling the heating end to electrify the semiconductor refrigerating piece 13 aligned with the top of the object placing plate 3, so that the rubber support arranged at the top of the object placing plate 3 can be heated, in addition, the controller 8 is used for controlling the refrigerating end to electrify the semiconductor refrigerating piece 13 aligned with the top of the object placing plate 3, so that the rubber support arranged at the top of the object placing plate 3 can be refrigerated, and then the temperature monitoring function of the temperature sensor 14 is matched, so that the device optimizes the temperature regulation function, is convenient for heating and refrigerating, is convenient for accurately regulating the heating and refrigerating temperature of the object placing plate 3, further improves the temperature regulation range and accuracy of the temperature brittleness test of the rubber support, simultaneously, the fan 16 is arranged on the object placing plate 3 below the semiconductor refrigerating piece 13, the fan 16 is started to radiate, the refrigerating effect of the device can be improved, the phenomenon that the refrigerating effect is affected by the heat radiation of the corresponding heating end when the refrigerating end of the semiconductor refrigerating sheet 13 runs is avoided, finally, the linear motor 901 on the guide rail 9 is started, the linear motor 901 is used for driving the sliding block 20 and the impact head 12 arranged on the sliding block to fall down, the falling speed of a heavy object can be higher, the impact force of the impact device is higher, the test effect is improved, meanwhile, the zooming camera 2 matched with the object placing plate 3 is arranged on the frame 7, the camera can be used for shooting the rubber support which is subjected to test detection on the object placing plate 3, monitored data can be sent to the controller 8 and an industrial computer connected with the controller, the deformation condition of the rubber support can be conveniently amplified and visually displayed on the screen of the industrial computer, and further the brittleness dynamic change in the rubber support detection process can be conveniently recorded and displayed, the temperature data and the pressure data applied to the rubber support and the pressure data monitored by the temperature sensor 14 and the pressure sensor 19 can be sent to the controller 8 and the industrial computer so that the temperature and the industrial computer can be conveniently recorded and the pressure change and the experimental result can be conveniently recorded and visually and displayed on the screen.
Claims (7)
1. An automatic device for a rubber support sample wafer temperature brittleness test is characterized by comprising a zooming camera (2), a storage plate (3), a frame (7) and a controller (8), wherein limit supports (6) are arranged on two sides of the bottom of the frame (7), a crawler belt type conveyor belt (21) is arranged in the frame (7), a servo motor (22) is uniformly arranged at one end of the crawler belt conveyor belt (21), the top of the crawler belt conveyor belt (21) is uniformly fixed with the storage plate (3), a semiconductor refrigerating plate (13) is uniformly arranged at the top of the interior of the storage plate (3), a temperature sensor (14) is arranged at one end of the interior of the storage plate (3), a fan (16) is arranged at the bottom of the storage plate (3), a zooming camera (2) is arranged on the frame (7) above the storage plate (3), a guide rail (9) is uniformly fixed on the frame (7) at one end of the zooming camera (2), a driving plate (10) is arranged at one end of the guide rail (9) close to the zooming camera (2), a driving plate (12) is arranged at the bottom of the driving plate (10), and a pressure sensor (19) is arranged at the bottom of the driving plate (12), and an impact sensor (19) is arranged at the outer side of the frame (8);
the top of the zoom camera (2) is provided with a first fixing frame (1), and screws connected with a frame (7) are uniformly arranged on the top of the first fixing frame (1);
a damping rotating shaft is arranged between the two sides of the zoom camera (2) and the first fixing frame (1), and a turnover structure is formed between the zoom camera (2) and the first fixing frame (1);
the device is characterized in that the storage plate (3) and the crawler-type conveyor belt (21) are bonded, connection cutting (17) are welded at two ends of the top of the impact head (12), connection slots (11) matched with the connection cutting (17) are uniformly formed in the driving plate (10), locking pieces (18) are welded on one side of the connection cutting (17), and screws connected with the driving plate (10) are arranged on the locking pieces (18).
2. An automated apparatus for temperature brittleness test of rubber support coupons as set forth in claim 1, wherein: the limiting supports (6) are 2, and fixing bolts (4) are arranged at two ends of the limiting supports (6).
3. An automated apparatus for temperature brittleness test of rubber support coupons as set forth in claim 1, wherein: the top of the limit support (6) is fixed with a rubber cushion pad (5), and the rubber cushion pad (5) and the frame (7) are connected in a hot melting way.
4. An automated apparatus for temperature brittleness test of rubber support coupons as set forth in claim 1, wherein: the frame (7) is made of stainless steel, and the outer side wall of the frame (7) is provided with a polysulfone rigid layer.
5. An automated apparatus for temperature brittleness test of rubber support coupons as set forth in claim 1, wherein: the number of the guide rails (9) is 2, and an integrated welding structure is formed between the guide rails (9) and the frame (7).
6. An automated apparatus for temperature brittleness test of rubber support coupons as set forth in claim 1, wherein: a linear motor (901) is mounted at the top end of the guide rail (9), a sliding block (20) is bonded at the output end of the linear motor (901), and bonding is formed between the sliding block (20) and the driving plate (10).
7. An automated apparatus for temperature brittleness test of rubber support coupons as set forth in claim 1, wherein: the bottom of fan (16) welding has second mount (15), and the top of second mount (15) evenly is provided with the screw of being connected with putting thing board (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110661243.XA CN113405924B (en) | 2021-06-15 | 2021-06-15 | Automatic device for temperature brittleness test of rubber support sample wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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