CN115895483A

CN115895483A - Production process of high-temperature adhesive tape for solid capacitor

Info

Publication number: CN115895483A
Application number: CN202211357547.8A
Authority: CN
Inventors: 占重光
Original assignee: Nanjing Jiantaipu New Material Co ltd
Current assignee: Nanjing Jiantaipu New Material Co ltd
Priority date: 2022-11-01
Filing date: 2022-11-01
Publication date: 2023-04-04

Abstract

The invention discloses a production process of a high-temperature adhesive tape for a solid capacitor, which comprises the following operation steps: the method comprises the steps of PI film manufacturing, glue manufacturing and aerogel felt manufacturing, wherein the aerogel felt is adhered to the top of the PI film to form a heat insulation material layer, an antistatic agent is coated on the bottom surface of the PI film to form an antistatic layer, the glue manufactured in S2 is coated on the bottom of the antistatic layer to form a glue layer, after the glue coating is finished, a rolling machine is used for rolling operation, and cutting is carried out after the rolling operation is finished. According to the production process of the high-temperature adhesive tape for the solid capacitor, the polyimide material and the flexible reinforced thermoplastic composite material are subjected to line co-extrusion blow molding, so that the shrinkage resistance is high, the temperature resistance of the adhesive tape is good, the temperature expansion coefficient is small, the tensile strength of the adhesive tape is improved, the phenomena of loosening and over-loosening after core cladding treatment are ensured, and the consistency of products is ensured.

Description

Production process of high-temperature adhesive tape for solid capacitor

Technical Field

The invention relates to the technical field of high-temperature adhesive tapes, in particular to a production process of a high-temperature adhesive tape for a solid capacitor.

Background

With the development of electronic products towards thinness and miniaturization, electronic circuits are developed towards multilayer boards, and electronic components are also rapidly developed towards miniaturization and surface mounting modes, so that chip components including chip aluminum electrolysis are still further developed.

Traditional subsides dress type aluminum electrolytic capacitor who is fit for reflow soldering has the lead-out wire, and inside aluminium foil and electrolytic paper are convoluteed for cylindric structure and use the sticky tape bonding as an organic whole, use plug and shell to encapsulate after soaking high temperature resistant electrolyte, and this type of aluminum electrolytic capacitor passes through higher lead-free reflow soldering furnace temperature, because the sticky tape melting fracture that can lead to coiling core package is appeared in the high temperature effect, and inside core package is loose, the sticky tape drops the circumstances such as, leads to electrical property degradation, and product reliability reduces.

Traditional condenser, its sticky tape mainly use single material such as polypropylene (PP) or polyphenylene sulfide (PPS) to make, like 3703F and 320A products of this day east company, PP material temperature resistant is very poor, mainly uses and has lead welding and plug-in components product, PPS can appear obviously shrink and substrate softening more than 200 degrees, so use on the product, when through the lead-free reflow soldering of high temperature, can take place that the core package is loose, the product reliability reduces, the sticky tape drops the condition such as.

Disclosure of Invention

Aiming at the defects in the prior art, the invention provides a production process of a high-temperature adhesive tape for a solid capacitor, which has high tensile strength, looseness prevention and shrinkage resistance.

In order to achieve the purpose of the invention, the invention adopts the technical scheme that:

a production process of a high-temperature adhesive tape for a solid capacitor is characterized by comprising the following steps: the method comprises the following operation steps:

s1: preparing a PI film, namely preparing the PI film;

s2: manufacturing glue;

s3: manufacturing an aerogel felt;

s4: adhering the aerogel felt to the top of the PI film layer to form a heat insulation material layer;

s5: coating an antistatic agent on the bottom surface of the PI film layer to form an antistatic layer;

s6: coating the glue prepared in the step S2 on the bottom of the antistatic layer to form a glue layer;

s7: after the gluing is finished, a rolling machine is used for rolling;

s8: and cutting after the rolling operation is finished.

Further, in the step S1, the PI film is made by fully mixing the polyamide acid obtained by reacting the required filler with diamine and dianhydride by a solution mixing method, then uniformly coating the mixed polyamide acid on the planar plate by using a film coating machine, and then putting the planar plate into a high-temperature oven for imidization to generate the required polyimide, and co-extruding and blow-molding the polyimide material and the reinforced thermoplastic composite material wire, so that the reinforced thermoplastic composite material wire and the PI film layer form an integrated structure.

Further, glue in S2 is prepared by mixing and reacting 0.01-60 parts of acrylate alkyl monomer, 0.01-50 parts of acrylate monomer, 0.01-10 parts of functional acrylic monomer and 0.01-1 part of photoinitiator according to parts by weight to obtain an oligomer; and adding 0.01-1 part of photoinitiator, 0.01-2 parts of cross-linking agent and 0.01-5 parts of antistatic agent into the obtained oligomer according to the parts by weight, and uniformly stirring to obtain the glue.

Further, the aerogel felt is manufactured in the S3, air pressure difference is formed in the upper space and the lower space of the felt, the aerogel is injected into the felt through the air pressure difference, circulating air flow is formed in the working environment and passes through the felt body, and the felt with the aerogel is dried.

The invention has the beneficial effects that:

according to the production process of the high-temperature adhesive tape for the solid capacitor, the polyimide material (PI) and the flexible reinforced thermoplastic composite material are subjected to line co-extrusion blow molding, so that the high-temperature adhesive tape is high in shrinkage resistance, good in temperature resistance and small in temperature expansion coefficient, the tensile strength of the adhesive tape is improved, the phenomena of loosening and over-loosening after core cladding treatment are ensured, and the consistency of products is ensured.

Drawings

Fig. 1 is a schematic structural view of a high-temperature adhesive tape for a solid capacitor according to the present invention.

Reference symbol comparison table:

1. a PI film layer; 2. a layer of thermal insulation material; 3. an antistatic layer; 4. and (6) a glue layer.

Detailed Description

The following further describes embodiments of the present invention with reference to the accompanying drawings. In which like parts are designated by like reference numerals.

It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.

In order to make the content of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention.

As shown in fig. 1, a production process of a high-temperature adhesive tape for a solid capacitor is characterized in that: the method comprises the following operation steps:

s1: the preparation of the PI film, the method that adopts solution to mix fully mixes polyamide acid that the required filler reacts with diamine, dianhydride, then utilize the coating machine to coat polyamide acid on the flat panel evenly after mixing, it is put into high-temperature oven to imidize and produce the required polyimide, polyimide material and thermoplastic composite material line of enhancement are co-extruded and blow molded, thus make thermoplastic composite material line of enhancement and PI membranous layer become the integral structure, the adhesion among them gets the qualitative improvement, has improved its anti-shrinkage performance, the thermoplastic composite material line of enhancement has many, take the form of the undulate structure of the height, weave in PI membranous layer 1 in the form of the twist each other, make it keep elasticity at all times, have coil ability to fix capacitor element;

s2: preparing glue, namely mixing 0.01-60 parts of acrylate alkyl monomer, 0.01-50 parts of acrylate monomer, 0.01-10 parts of functional acrylic monomer and 0.01-1 part of photoinitiator according to parts by mass to react to obtain oligomer; adding 0.01-1 part of photoinitiator, 0.01-2 parts of cross-linking agent and 0.01-5 parts of antistatic agent into the obtained oligomer according to the parts by mass, and uniformly stirring to obtain glue;

s3: manufacturing an aerogel felt, forming air pressure difference in the upper space and the lower space of the felt, injecting aerogel into the felt by utilizing the air pressure difference, forming circulating airflow in a working environment, and drying the felt with the aerogel after the circulating airflow passes through a felt body;

s4: adhering the aerogel felt on the top of the PI film layer 1 to form a heat insulation material layer 2, wherein the heat insulation material layer 2 mainly bears external high temperature, effectively isolates the high temperature from transferring heat to the PI film layer 1 and the inside, and slows down the aging of the adhesive tape;

s5: coating an antistatic agent on the bottom surface of the PI film layer 1, wherein the antistatic agent is anionic imine salt and can be one or a mixture of more of lithium trifluoromethanesulfonylimide, lithium trifluoromethanesulfonate, lithium tetrafluoroborate and sodium tetrafluoroborate to form an antistatic layer 3;

s6: coating the glue prepared in the step S2 on the bottom of the antistatic layer to form a glue layer 4;

s7: after the gluing is finished, a rolling machine is used for rolling;

s8: and cutting after the rolling operation is finished.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. A production process of a high-temperature adhesive tape for a solid capacitor is characterized by comprising the following steps: the method comprises the following operation steps:

s1: preparing a PI film, namely preparing a PI film layer (1);

s2: manufacturing glue;

s3: manufacturing an aerogel felt;

s4: adhering an aerogel felt to the top of the PI film layer (1) to form a heat insulation material layer (2);

s5: coating an antistatic agent on the bottom surface of the PI film layer (1) to form an antistatic layer (3);

s6: coating the glue prepared in the step S2 on the bottom of the antistatic layer to form a glue layer (4);

s7: after the gluing is finished, the rolling machine is used for rolling operation;

s8: and cutting after the rolling operation is finished.

2. The production process of the high-temperature adhesive tape for the solid capacitor as claimed in claim 1, wherein the production process comprises the following steps: and in the step S1, the PI film is prepared by fully mixing the needed filler with polyamic acid obtained by reacting diamine and dianhydride by a solution mixing method, uniformly coating the mixed polyamic acid on a planar plate by using a film coating machine, putting the planar plate into a high-temperature oven for imidization to generate the needed polyimide, and performing co-extrusion blow molding on the polyimide material and the reinforced thermoplastic composite material line so as to enable the reinforced thermoplastic composite material line and the PI film layer to form an integral structure.

3. The production process of the high-temperature adhesive tape for the solid capacitor, according to claim 1, is characterized in that: s2, preparing glue, namely mixing 0.01-60 parts of acrylate alkyl monomer, 0.01-50 parts of acrylate monomer, 0.01-10 parts of functional acrylic monomer and 0.01-1 part of photoinitiator for reaction according to parts by weight to obtain oligomer; and adding 0.01-1 part of photoinitiator, 0.01-2 parts of cross-linking agent and 0.01-5 parts of antistatic agent into the obtained oligomer according to the parts by weight, and uniformly stirring to obtain the glue.

4. The production process of the high-temperature adhesive tape for the solid capacitor, according to claim 1, is characterized in that: and S3, manufacturing the aerogel felt, forming air pressure difference in the upper space and the lower space of the felt, injecting the aerogel into the felt by utilizing the air pressure difference, forming circulating air flow in a working environment, and drying the felt with the aerogel after the circulating air flow passes through the felt body.