CN115854892B - Zero plane correction method for PCB detection - Google Patents
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- 238000004364 calculation method Methods 0.000 abstract description 8
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Abstract
A zero plane correction method for PCB detection relates to the technical field of circuit board detection, and comprises the steps of densely setting sampling points in a three-dimensional top view of a circuit board to be detected, removing invalid sampling points according to a two-dimensional top view of a position, calculating zero plane heights of the sampling points according to effective pixel points in an adjacent area of the effective sampling points, fitting a zero plane of the circuit board to be detected according to a calculation result, correcting the heights of the pixel points in the three-dimensional top view of the circuit board to be detected by fitting the zero plane of the circuit board to be detected, avoiding the influence of points on the surface of the non-circuit board on a measurement height result, and reducing the height calculation error of the surface points of the circuit board to be detected.
Description
Technical Field
The invention relates to a circuit board detection technology, in particular to a technology of a zero plane correction method for PCB detection.
Background
The 3D inspection of PCBs (printed circuit boards) is an important process in the production process of circuit boards, and inspection items include: after the solder paste is printed, the thickness, the area, the presence or absence of the connecting tin and the like of the solder paste are detected, and after the electronic components are laid on the circuit board and soldered, the soldering state of each component is detected.
The 3D detection method of the PCB is to measure the height of solder paste or components on the surface of the circuit board by using a 3D structured light source and a camera. As shown in fig. 1, when implementing 3D detection of a PCB, a structured light source 101 and a structured light camera 102 are respectively disposed above a circuit board 104 to be tested, and a light emitting end of the structured light source 101 and a lens end of the structured light camera 102 are located on an equivalent plane 105; the height of the upper surface of the circuit board 104 to be measured (here, the height refers to the distance between the upper surface of the circuit board 104 to be measured and the equivalent plane 105) is defined as H0, the height of the upper surface of the device 103 to be measured on the circuit board 104 to be measured (here, the height refers to the distance between the upper surface of the device 103 to be measured and the equivalent plane 105) is defined as H1, the height of the device 103 to be measured (here, the height refers to the distance between the upper surface of the device 103 to be measured and the upper surface of the circuit board 104 to be measured) is defined as H, and there are: h=h0-H1.
Ideally, the value of the distance H0 between all points on the upper surface of the circuit board 104 to be tested and the equivalent plane 105 is the same, and the plane formed by all points on the upper surface of the circuit board 104 to be tested is referred to as a zero plane in this ideal case.
However, when the circuit board to be tested is a flexible circuit board or the area of the circuit board to be tested is large, a local sagging is easily caused in the middle portion of the circuit board due to its own weight, and at this time, the upper surface of the circuit board to be tested 104 is not a flat surface but a curved surface, so that in this case, the value of the height H0 of each point on the upper surface of the circuit board to be tested 104 is not a fixed value.
In addition, the structured light source 101 and the structured light camera 102 are mounted on a set of horizontal rails and can move along the horizontal rails, and since the structured light source 101 and the structured light camera 102 are heavy and the horizontal rails are long, the structured light source 101 and the structured light camera 102 have small dropping when moving on the horizontal rails, and the dropping degree at different positions on the horizontal rails also have small differences, the equivalent plane 105 is not a plane any more in the actual operation process, but is a curved surface, and therefore, even if the upper surface of the circuit board 104 to be tested is a plane, the value of the height H0 of each point on the upper surface of the circuit board 104 to be tested is not a fixed value.
In order to overcome the above-mentioned drawbacks, the conventional inspection method uses the average height H0 of each point on the circuit board to be inspected, which is located in the vicinity of the device to be inspected, as a reference, or uses the average height H0 of each point on the circuit board to be inspected, which is located in the photographing visual field range, as a reference.
When the average height H0 of each point on the circuit board to be tested, which is positioned in the area near the device to be tested, is used as a reference, the error of H0 is larger because the number of sampling points in the area is smaller and the points at the upper surface positions of some non-circuit boards are easily acquired by mistake; in addition, when the devices near the device to be tested are densely arranged, the sampling points for collection may be far away from the position of the device to be tested, and the error of H0 may be larger.
When the average height H0 of each point in the photographing visual field is used as a reference, the photographing visual field is relatively large, so that the deviation between the average height H0 and the actual surface height of certain specific positions is relatively large, the average heights H0 in two adjacent photographing fields are relatively large in difference, and obvious height step-like change shapes can occur when images of the two adjacent photographing fields are spliced together, so that a large calculation error is caused.
Disclosure of Invention
Aiming at the defects in the prior art, the technical problem to be solved by the invention is to provide a zero plane correction method for PCB detection, which can avoid the influence of points on the surface of a non-circuit board on the measurement height result, reduce the height calculation error of the points on the surface of the circuit board to be detected, and avoid the height step change when 3D image stitching is carried out on a plurality of shooting positions.
In order to solve the technical problems, the zero plane correction method for PCB detection provided by the invention is characterized by comprising the following specific steps:
1) Setting a plurality of shooting positions, and shooting a two-dimensional top view and a three-dimensional top view of the circuit board to be tested by using a camera at each shooting position;
2) Taking a sampling point every 5-10 mm for a three-dimensional top view of the circuit board to be tested shot at each shooting position;
for each sampling point, if the number of effective pixel points in the adjacent area of the sampling point is smaller than N, the sampling point is judged to be an ineffective sampling point, otherwise, the sampling point is judged to be an effective sampling point, the adjacent area of the sampling point is a rectangular area which takes the sampling point as the center and contains M pixel points, M, N is a preset constant value, and M is greater than N;
the judging method of the effective pixel points comprises the following steps: presetting a circuit board surface point color value range, for each pixel point, if the color value of the pixel point at the position in the two-dimensional top view of the circuit board to be tested, which is shot at the same shooting position, falls within the preset circuit board surface point color value range, judging the pixel point as an effective pixel point, otherwise, judging the pixel point as an ineffective pixel point;
3) For each effective sampling point, firstly forming a pixel point set by all effective pixel points in the adjacent area of the sampling point, and then calculating the average value and standard deviation of the heights of the pixel points in the pixel point set, wherein the heights of the pixel points refer to the distance between the pixel points and a camera lens;
then, removing the pixel points with the absolute value of the difference value of the height value and the height average value being more than 2 times of the height standard deviation from the pixel point set to obtain a new target pixel point set;
then calculating the average height value of the pixel points in the target pixel point set, and setting the average height value as the zero plane height of the sampling point;
4) According to the zero plane height of each effective sampling point obtained in the step 3) and the coordinates of each effective sampling point on the X axis and the Y axis of a camera coordinate system, carrying out surface fitting, and taking a fitting surface obtained after fitting as a zero plane of a circuit board to be tested, thereby obtaining a zero plane height value of the circuit board to be tested;
the X axis and the Y axis are two mutually perpendicular horizontal coordinate axes in a camera coordinate system;
5) Correcting the height of each pixel point in each three-dimensional top view of the photographed circuit board to be tested relative to the zero plane of the circuit board to be tested as follows: hij=hn-dij+d;
wherein Hij is the height of the pixel point relative to the zero plane of the circuit board to be tested, hn is the zero plane height of the pixel point in the three-dimensional plan view of the circuit board to be tested, dij is the actual height of the pixel point, and d is a preset correction reference value d.
Further, 3 times of surface fitting is adopted when the surface fitting is implemented in the step 4), and a specific 3 times of surface fitting formula is as follows:
H 0 ij＝a 0 +a 1 x i +a 2 y j +a 3 x i 2 +a 4 x i y j +a 5 y j 2 +a 6 x i 3 +a 7 x i 2 y j +a 8 x i y j 2 +a 9 y j 3
wherein H is 0 ij is zero plane height of pixel point in three-dimensional top view of circuit board to be tested, x i Is the coordinate of the pixel point on the X axis of the camera coordinate system in the three-dimensional top view of the circuit board to be tested, y j The method comprises the steps that coordinates of pixel points in a three-dimensional top view of a circuit board to be tested on a Y-axis of a camera coordinate system are obtained;
substituting the X-axis coordinate, Y-axis coordinate and zero plane height of each sampling point in the camera coordinate system into 3 times of surface fitting formulas respectively, and calculating a by using a least square method 0 、a 1 、a 2 、a 3 、a 4 、a 5 、a 6 、a 7 、a 8 、a 9 And obtaining a fitting surface according to the 3-time curved surface fitting formula.
Specifically, a 0 、a 1 、a 2 、a 3 、a 4 、a 5 、a 6 、a 7 、a 8 、a 9 Fitting parameters for curve fitting.
Further, 2 times of surface fitting may be adopted when the surface fitting is performed in step 4), and the specific 2 times of surface fitting formula is:
H 0 ij＝a 0 +a 1 x i +a 2 y j +a 3 x i 2 +a 4 x i y j +a 5 y j 2
wherein H is 0 ij is zero plane height of pixel point in three-dimensional top view of circuit board to be tested, x i Is the coordinate of the pixel point on the X axis of the camera coordinate system in the three-dimensional top view of the circuit board to be tested, y j The method comprises the steps that coordinates of pixel points in a three-dimensional top view of a circuit board to be tested on a Y-axis of a camera coordinate system are obtained;
substituting the X-axis coordinate, Y-axis coordinate and zero plane height of each sampling point in the camera coordinate system into 2 times of surface fitting formulas respectively, andcalculating a by least square method 0 、a 1 、a 2 、a 3 、a 4 、a 5 And obtaining a fitting surface according to the 2-time curved surface fitting formula.
According to the zero plane correction method for PCB detection, sampling points are densely arranged in the three-dimensional top view of the circuit board to be detected, invalid sampling points are removed according to the two-dimensional top view of the same position, then the zero plane height of the sampling points is calculated according to effective pixel points in the adjacent area of the effective sampling points, then the zero plane of the circuit board to be detected is fitted according to the calculation result, the height of the pixel points in the three-dimensional top view of the circuit board to be detected is corrected through fitting the zero plane of the circuit board to be detected, the influence of the points on the surface of the non-circuit board on the measurement height result can be avoided, the curved surface shape formed by the falling of the center of the circuit board and the falling of the center of the equivalent plane of a camera is also met during curved surface fitting, fitting accuracy is guaranteed, the height calculation error of the surface points of the circuit board to be detected is reduced, and the problem of step-shaped change of height possibly occurring when 3D images are spliced at a plurality of shooting positions is well solved.
Drawings
Fig. 1 is a schematic diagram of a zero-plane calibration method for PCB inspection according to an embodiment of the present invention.
Detailed Description
The following description is made in detail with reference to the drawings, but the embodiments are not intended to limit the invention, and all the similar structures and similar variations of the invention are included in the scope of the invention, and the numbers in the invention represent the relationships between the letters and the letters.
As shown in fig. 1, the zero plane correction method for PCB detection provided by the embodiment of the present invention is characterized by comprising the following specific steps:
1) Setting a plurality of shooting positions, and shooting a two-dimensional top view and a three-dimensional top view of the circuit board to be tested by using a camera at each shooting position;
2) Taking a sampling point (the sampling point is a pixel point in the figure) at intervals of 5-10 mm for a three-dimensional top view of the circuit board to be tested shot at each shooting position;
for each sampling point, if the number of effective pixels in the neighboring area of the sampling point is smaller than N, the sampling point is determined to be an ineffective sampling point, otherwise, the sampling point is determined to be an effective sampling point, the neighboring area of the sampling point is a rectangular area with M pixels as the center, M, N is a preset constant value, M is greater than N, in this embodiment, the value of M is 21×21, the value of N is 100, in other embodiments, the value of M, N can be changed to other values according to actual needs, for example, the value of M is 19×19, 18×18, etc., and the value of N is 90, 95, etc.;
the judging method of the effective pixel points comprises the following steps: presetting a circuit board surface point color value range, for each pixel point, if the color value of the pixel point at the position in the two-dimensional top view of the circuit board to be tested, which is shot at the same shooting position, falls within the preset circuit board surface point color value range, judging the pixel point as an effective pixel point (indicating that the pixel point belongs to an image of the upper surface of the circuit board), otherwise judging the pixel point as an ineffective pixel point;
3) For each effective sampling point, firstly forming a pixel point set by all effective pixel points in the adjacent area of the sampling point, and then calculating the average value and standard deviation of the heights of the pixel points in the pixel point set, wherein the heights of the pixel points refer to the distance between the pixel points and a camera lens;
then, removing the pixel points with the absolute value of the difference value of the height value and the height average value being more than 2 times of the height standard deviation from the pixel point set to obtain a new target pixel point set;
then calculating the average height value of the pixel points in the target pixel point set, and setting the average height value as the zero plane height of the sampling point;
4) According to the zero plane height of each effective sampling point obtained in the step 3) and the coordinates of each effective sampling point on the X axis and the Y axis of a camera coordinate system, carrying out surface fitting, and taking a fitting surface obtained after fitting as a zero plane of a circuit board to be tested, thereby obtaining a zero plane height value of the circuit board to be tested (the height refers to the interval between the zero plane of the circuit board to be tested and the camera lens end);
the X axis and the Y axis are two mutually perpendicular horizontal coordinate axes in a camera coordinate system;
5) Correcting the height of each pixel point in each three-dimensional top view of the photographed circuit board to be tested relative to the zero plane of the circuit board to be tested as follows: hij=hn-dij+d;
wherein Hij is the height of the pixel point relative to the zero plane of the circuit board to be tested, hn is the zero plane height of the pixel point in the three-dimensional plan view of the circuit board to be tested, dij is the actual height of the pixel point (the height is the distance between the pixel point and the lens end of the camera), d is a preset correction reference value d, the value range of d is 50±5um, and the purpose of setting the correction reference value d is to avoid negative numbers of Hij.
In the embodiment of the invention, in order to improve the calculation accuracy, 3 times of surface fitting is adopted in the step 4) of performing surface fitting, and a specific 3 times of surface fitting formula is as follows:
H 0 ij＝a 0 +a 1 x i +a 2 y j +a 3 x i 2 +a 4 x i y j +a 5 y j 2 +a 6 x i 3 +a 7 x i 2 y j +a 8 x i y j 2 +a 9 y j 3
wherein H is 0 ij is zero plane height of pixel point in three-dimensional top view of circuit board to be tested, x i Is the coordinate of the pixel point on the X axis of the camera coordinate system in the three-dimensional top view of the circuit board to be tested, y j The method comprises the steps that coordinates of pixel points in a three-dimensional top view of a circuit board to be tested on a Y-axis of a camera coordinate system are obtained;
substituting the X-axis coordinate, Y-axis coordinate and zero plane height of each sampling point in the camera coordinate system3-order surface fitting formula, and calculating a by least square method 0 、a 1 、a 2 、a 3 、a 4 、a 5 、a 6 、a 7 、a 8 、a 9 And obtaining a fitting surface according to the 3-time curved surface fitting formula.
In the embodiment of the present invention, in order to increase the calculation speed, 2 times of surface fitting may be adopted in the step 4) of performing surface fitting, and a specific 2 times of surface fitting formula is as follows:
H 0 ij＝a 0 +a 1 x i +a 2 y j +a 3 x i 2 +a 4 x i y j +a 5 y j 2
wherein H is 0 ij is zero plane height of pixel point in three-dimensional top view of circuit board to be tested, x i Is the coordinate of the pixel point on the X axis of the camera coordinate system in the three-dimensional top view of the circuit board to be tested, y j The method comprises the steps that coordinates of pixel points in a three-dimensional top view of a circuit board to be tested on a Y-axis of a camera coordinate system are obtained;
substituting the X-axis coordinate, Y-axis coordinate and zero plane height of each sampling point in the camera coordinate system into 2 times of surface fitting formulas respectively, and calculating a by using a least square method 0 、a 1 、a 2 、a 3 、a 4 、a 5 And obtaining a fitting surface according to the 2-time curved surface fitting formula.
Claims (3)
1. A zero plane correction method for PCB detection is characterized by comprising the following specific steps:
1) Setting a plurality of shooting positions, and shooting a two-dimensional top view and a three-dimensional top view of the circuit board to be tested by using a camera at each shooting position;
2) Taking a sampling point every 5-10 mm for a three-dimensional top view of the circuit board to be tested shot at each shooting position;
for each sampling point, if the number of effective pixel points in the adjacent area of the sampling point is smaller than N, the sampling point is judged to be an ineffective sampling point, otherwise, the sampling point is judged to be an effective sampling point, the adjacent area of the sampling point is a rectangular area which takes the sampling point as the center and contains M pixel points, M, N is a preset constant value, and M is greater than N;
the judging method of the effective pixel points comprises the following steps: presetting a circuit board surface point color value range, for each pixel point, if the color value of the pixel point at the position in the two-dimensional top view of the circuit board to be tested, which is shot at the same shooting position, falls within the preset circuit board surface point color value range, judging the pixel point as an effective pixel point, otherwise, judging the pixel point as an ineffective pixel point;
3) For each effective sampling point, firstly forming a pixel point set by all effective pixel points in the adjacent area of the sampling point, and then calculating the average value and standard deviation of the heights of the pixel points in the pixel point set, wherein the heights of the pixel points refer to the distance between the pixel points and a camera lens;
then, removing the pixel points with the absolute value of the difference value of the height value and the height average value being more than 2 times of the height standard deviation from the pixel point set to obtain a new target pixel point set;
then calculating the average height value of the pixel points in the target pixel point set, and setting the average height value as the zero plane height of the sampling point;
4) According to the zero plane height of each effective sampling point obtained in the step 3) and the coordinates of each effective sampling point on the X axis and the Y axis of a camera coordinate system, carrying out surface fitting, and taking a fitting surface obtained after fitting as a zero plane of a circuit board to be tested, thereby obtaining a zero plane height value of the circuit board to be tested;
the X axis and the Y axis are two mutually perpendicular horizontal coordinate axes in a camera coordinate system;
5) Correcting the height of each pixel point in each three-dimensional top view of the photographed circuit board to be tested relative to the zero plane of the circuit board to be tested as follows: hij=hn-dij+d;
wherein Hij is the height of the pixel point relative to the zero plane of the circuit board to be tested, hn is the zero plane height of the pixel point in the three-dimensional plan view of the circuit board to be tested, dij is the actual height of the pixel point, and d is a preset correction reference value d.
2. The zero-plane correction method for PCB inspection of claim 1, wherein: in the step 4), 3 times of surface fitting is adopted when the surface fitting is implemented, and a specific 3 times of surface fitting formula is as follows:
H 0 ij＝a 0 +a 1 x i +a 2 y j +a 3 x i 2 +a 4 x i y j +a 5 y j 2 +a 6 x i 3 +a 7 x i 2 y j +a 8 x i y j 2 +a 9 y j 3
wherein H is 0 ij is zero plane height of pixel point in three-dimensional top view of circuit board to be tested, x i Is the coordinate of the pixel point on the X axis of the camera coordinate system in the three-dimensional top view of the circuit board to be tested, y j The method comprises the steps that coordinates of pixel points in a three-dimensional top view of a circuit board to be tested on a Y-axis of a camera coordinate system are obtained;
substituting the X-axis coordinate, Y-axis coordinate and zero plane height of each sampling point in the camera coordinate system into 3 times of surface fitting formulas respectively, and calculating a by using a least square method 0 、a 1 、a 2 、a 3 、a 4 、a 5 、a 6 、a 7 、a 8 、a 9 And obtaining a fitting surface according to the 3-time curved surface fitting formula.
3. The zero-plane correction method for PCB inspection of claim 1, wherein: in the step 4), 2 times of surface fitting can be adopted when the surface fitting is implemented, and a specific 2 times of surface fitting formula is as follows:
H 0 ij＝a 0 +a 1 x i +a 2 y j +a 3 x i 2 +a 4 x i y j +a 5 y j 2
wherein H is 0 ij is zero plane height of pixel point in three-dimensional top view of circuit board to be tested, x i Is the coordinate of the pixel point on the X axis of the camera coordinate system in the three-dimensional top view of the circuit board to be tested, y j The method comprises the steps that coordinates of pixel points in a three-dimensional top view of a circuit board to be tested on a Y-axis of a camera coordinate system are obtained;
substituting the X-axis coordinate, Y-axis coordinate and zero plane height of each sampling point in the camera coordinate system into 2 times of surface fitting formulas respectively, and calculating a by using a least square method 0 、a 1 、a 2 、a 3 、a 4 、a 5 And obtaining a fitting surface according to the 2-time curved surface fitting formula.
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