CN115824461A - Mass production calibration method and device for temperature sensing chips - Google Patents
Mass production calibration method and device for temperature sensing chips Download PDFInfo
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Abstract
The invention provides a mass production calibration method and a mass production calibration device for temperature sensing chips, wherein the method comprises the following steps: installing a test load plate corresponding to the equipment, fixing the temperature sensing module in the test docking tray, and connecting the temperature sensing module with the test load plate; obtaining the actual temperature of the current environment through the temperature sensing module; judging whether the temperature sensing module is abnormal or not according to the actual temperature of the current environment; reading a temperature sensing value and a self-compensation value of a chip to be detected; obtaining a temperature correction compensation value according to the actual temperature of the current environment and the temperature sensing value of the chip to be detected; and correcting the self-compensation value of the tested chip according to the temperature correction compensation value. According to the temperature sensing module, the environmental temperature of a production test area can be monitored, the temperature sensing module of the chip is subjected to self calibration, and the calibration accuracy is improved, so that the temperature sensing precision of the final chip in shipment is ensured, and the quality of the chip taken by a terminal customer is improved.
Description
Technical Field
The invention belongs to the technical field of semiconductor detection, and particularly relates to a mass production calibration method and device for temperature sensing chips.
Background
Many temperature sensing MCUs are not sensitive enough due to cost problems, and often need to be compensated during testing. In a measured area where the chip is located, the temperature monitored by a sorting machine (Handler) or a probe station (Wafer Prober) is often inaccurate, so that the temperature compensation of the chip has large errors, and the use of a terminal client with high-precision requirements is difficult to meet.
Disclosure of Invention
The embodiment of the application provides a temperature change control compensation scheme of a temperature sensing chip with higher reliability and higher precision.
In a first aspect, an embodiment of the present application provides a method for calibrating mass production of temperature sensing chips, including:
installing a test load plate corresponding to the equipment, fixing the temperature sensing module in the test docking tray, and connecting the temperature sensing module with the test load plate;
obtaining the actual temperature of the current environment through the temperature sensing module;
judging whether the temperature sensing module is abnormal or not according to the actual temperature of the current environment;
reading a temperature sensing value and a self-compensation value of a chip to be tested;
obtaining a temperature correction compensation value according to the actual temperature of the current environment and the temperature sensing value of the chip to be detected;
and correcting the self-compensation value of the tested chip according to the temperature correction compensation value.
Wherein, the temperature sensing module comprises two TMP275 chips.
Wherein, judge according to current environment actual temperature whether temperature sensing module is unusual, include:
and calculating the difference of the environmental temperatures obtained by the two TMP275 chips, wherein if the difference is not within the threshold interval, the TMP275 chips are abnormal, and if the difference is within the threshold interval, the TMP275 chips are normal.
Wherein, obtain the temperature correction offset value according to the temperature sensing value of present environment actual temperature, quilt survey chip, include:
T_DUT＝12.9852-0.002828*bintodec(tpsdata)；
TMP275 temperature = bintodec (TMP 275 DATA);
toff＝tpsdata-(AVG(TMP275_1+TMP275_2)-12.9852)/(-0.002828)；
wherein, T _ DUT is the temperature of the chip to be tested, bintodec is a binary decimal function, tpsdata is the sensing value of the temperature sensor in the chip to be tested, the temperature of TMP275 is the actual temperature of the current environment measured by TMP275, TMP275 DATA is the return value of the TMP275 temperature sensor, toff is the temperature correction compensation value, AVG is the averaging function, and TMP275_1 and TMP275_2 are the temperature sensing values of 2 TMPs 275, respectively.
Wherein, correcting the self-compensation value of the tested chip according to the temperature correction compensation value comprises the following steps: and writing the temperature correction compensation value into an info calibration value area of the tested chip.
In a second aspect, the application provides a mass production calibration device for temperature sensing chips, wherein a temperature sensing module is fixed in a test docking tray and is connected with a test load plate; volume production calibrating device of temperature sensing chip is used for:
obtaining the actual temperature of the current environment through the temperature sensing module;
judging whether the temperature sensing module is abnormal or not according to the actual temperature of the current environment;
reading a temperature sensing value and a self-compensation value of a chip to be detected;
obtaining a temperature correction compensation value according to the actual temperature of the current environment and the temperature sensing value of the chip to be detected;
and correcting the self-compensation value of the tested chip according to the temperature correction compensation value.
Wherein, the temperature sensing module comprises two TMP275 chips.
Wherein, volume production calibrating device of temperature sensing chip is used for:
and calculating the difference of the environmental temperatures obtained by the two TMP275 chips, wherein if the difference is not within the threshold interval, the TMP275 chips are abnormal, and if the difference is within the threshold interval, the TMP275 chips are normal.
Wherein, the volume production calibrating device of temperature sensing chip is used for: obtaining a temperature correction compensation value according to the actual temperature of the current environment and the temperature sensing value of the chip to be detected:
T_DUT＝12.9852-0.002828*bintodec(tpsdata)；
TMP275 temperature = bintodec (TMP 275 DATA);
toff＝tpsdata-(AVG(TMP275_1+TMP275_2)-12.9852)/(-0.002828)；
wherein, T _ DUT is the temperature of the chip to be tested, bintodec is a binary decimal function, tpsdata is the sensing value of the temperature sensor in the chip to be tested, the temperature of TMP275 is the actual temperature of the current environment measured by TMP275, TMP275 DATA is the return value of the TMP275 temperature sensor, toff is the temperature correction compensation value, AVG is the averaging function, and TMP275_1 and TMP275_2 are the temperature sensing values of 2 TMPs 275, respectively.
In a third aspect, the present application provides a chip testing system, which includes any one of the above mass production calibration apparatuses for temperature sensing chips.
The method and the device for calibrating the mass production of the temperature sensing chip have the following beneficial effects:
according to the temperature sensing module, the environmental temperature of a production test area can be monitored, the temperature sensing module of the chip is subjected to self calibration, and the calibration accuracy is improved, so that the temperature sensing precision of the final chip in shipment is ensured, and the quality of the chip taken by a terminal customer is improved.
Drawings
FIG. 1 is a schematic flow chart illustrating a mass production calibration method for temperature sensing chips according to an embodiment of the present disclosure;
fig. 2 is another schematic flow chart illustrating a mass production calibration method for temperature sensing chips according to an embodiment of the present disclosure.
Detailed Description
The present application is further described with reference to the following figures and examples.
The following description provides embodiments of the invention, which may be combined or substituted for various embodiments, and this application is therefore intended to cover all possible combinations of the same and/or different embodiments described. Thus, if one embodiment includes the feature A, B, C and another embodiment includes the feature B, D, then this application should also be considered to include embodiments that include all other possible combinations of one or more of A, B, C, D, although this embodiment may not be explicitly recited in text below.
Many temperature sensing MCUs are not sensitive enough due to cost problems, and often need to be compensated during testing. In a measured area where the chip is located, the temperature monitored by a sorting machine (Handler) or a probe station (Wafer Prober) is often inaccurate, so that the temperature compensation of the chip has large errors, and the use of a terminal client with high-precision requirements is difficult to meet.
In view of the above problems, as shown in fig. 1, the present application provides a mass production calibration method for temperature sensing chips, including: s101, mounting a test load plate of corresponding equipment, fixing a temperature sensing module in a test docking tray, and connecting the temperature sensing module with the test load plate; s102, obtaining the actual temperature of the current environment through a temperature sensing module; s103, judging whether the temperature sensing module is abnormal or not according to the actual temperature of the current environment; s104, reading a temperature sensing value and a self-compensation value of the chip to be detected; s105, obtaining a temperature correction compensation value according to the actual temperature of the current environment and the temperature sensing value of the chip to be detected; and S106, correcting the self-compensation value of the tested chip according to the temperature correction compensation value.
As shown in fig. 1-2, the present application provides an ambient temperature difference compensation scheme with high reliability and precision, comprising the following steps:
a test Load Board (LB) of a corresponding device (device) is installed, the TMP275 is fixed in a test docking pad (docking pad) and wired to the test load board, and then a corresponding test program is called. After the program download (load) is completed, the TMP275 test item is executed to obtain the current ambient temperature. And (4) running a TMP _ Delta test item to obtain Delta difference values of 2 TMPs, comparing and judging whether the TMP275 is abnormal. And operating the TPS TOFF test item, and reading the temperature sensing value and the self-calibration compensation value of the tested chip. Compensating the difference value between the actual environment temperature and the temperature sensing temperature of the chip through a TPS _ WR function, and rewriting the difference value into an info calibration value area of the tested chip; the temperature sensing of the chip to be tested is sometimes inaccurate, and toff (temperature correction compensation value) needs to be corrected according to the real-time environment temperature of the test area. The TPS test items are run, retrieving the toff self-calibration value, which should be close to the previously written toff offset value.
The application borrows 2 TMP275 high precisionAnd the temperature sensing chip is used for calibrating the temperature sensing precision of the chip to be tested, so that the temperature sensing precision of the chip to be tested in shipment is ensured finally. TMP275 is based on I 2 C communication and 12bit adc constitute high accuracy temperature sensing chip, can support the accurate measurement of-20 ℃ -100 ℃ temperature under the high accuracy (12 bit), and resolution (resolution) 0.0625 ℃, precision (accuracycacy) 0.5 ℃. According to the scheme, 2 TMP275 chips are fixed in a docking plate of a test area, and the real-time environment temperature during test is monitored to calibrate the temperature sensing self-compensation value of the chip to be tested. The application designs a temperature calibration formula designed according to MCU temperature sensing characteristics and TMP275 chip characteristics:
T_DUT＝12.9852-0.002828*bintodec(tpsdata)；
TMP275 temperature = bintodec (TMP 275 DATA);
toff＝tpsdata-(AVG(TMP275_1+TMP275_2)-12.9852)/(-0.002828)；
wherein, T _ DUT is the temperature of the chip to be tested, bintodec is a binary decimal function, tpsdata is the sensing value of the temperature sensor in the chip to be tested, the temperature of TMP275 is the actual temperature of the current environment measured by TMP275, TMP275 DATA is the return value of the TMP275 temperature sensor, toff is the temperature correction compensation value, AVG is the averaging function, and TMP275_1 and TMP275_2 are the temperature sensing values of 2 TMPs 275, respectively. 12.9852 is the fixed compensation value, 0.002828 is the digital-to-analog conversion coefficient of the chip under test.
The chip testing system realizes the following functions: 1. monitoring the environmental temperature value of the current chip to be tested, reading out and recording corresponding data; 2. and comparing the temperature value with the temperature value read out by the temperature sensing module of the chip to be detected, compensating the offset, and re-correcting the temperature sensing precision of the chip to be detected.
The temperature sensing module can monitor the environmental temperature of a production test area in real time and carry out self calibration on the temperature sensing module of the chip in real time. Therefore, the temperature sensing precision of the final chip in shipment is guaranteed, and the quality of the chip taken by the terminal customer is improved.
The application also provides a mass production calibration device of the temperature sensing chip, wherein a temperature sensing module is fixed in the test butt joint disc and is connected with the test load plate; volume production calibrating device of temperature sensing chip is used for: obtaining the actual temperature of the current environment through a temperature sensing module; judging whether the temperature sensing module is abnormal or not according to the actual temperature of the current environment; reading a temperature sensing value and a self-compensation value of a chip to be tested; obtaining a temperature correction compensation value according to the actual temperature of the current environment and the temperature sensing value of the chip to be detected; and correcting the self-compensation value of the tested chip according to the temperature correction compensation value.
Wherein, the temperature sensing module comprises two TMP275 chips.
Volume production calibrating device of temperature sensing chip is used for:
and calculating the difference of the environmental temperatures obtained by the two TMP275 chips, wherein if the difference is not within the threshold interval, the TMP275 chips are abnormal, and if the difference is within the threshold interval, the TMP275 chips are normal.
Obtaining a temperature correction compensation value according to the actual temperature of the current environment and the temperature sensing value of the chip to be detected:
T_DUT＝12.9852-0.002828*bintodec(tpsdata)；
TMP275 temperature = bintodec (TMP 275 DATA);
toff＝tpsdata-(AVG(TMP275_1+TMP275_2)-12.9852)/(-0.002828)；
wherein, T _ DUT is the temperature of the chip to be tested, bintodec is a binary decimal function, tpsdata is the sensing value of the temperature sensor in the chip to be tested, the temperature of TMP275 is the actual temperature of the current environment measured by TMP275, TMP275 DATA is the return value of the TMP275 temperature sensor, toff is the temperature correction compensation value, AVG is the averaging function, and TMP275_1 and TMP275_2 are the temperature sensing values of 2 TMPs 275, respectively.
In the present application, the embodiments of the mass production calibration apparatus for temperature sensing chips are basically similar to the embodiments of the mass production calibration method for temperature sensing chips, and reference is made to the description of the embodiments of the mass production calibration method for temperature sensing chips.
The application also provides a chip testing system which comprises the mass production calibrating device of any one temperature sensing chip.
All functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may be separately used as one unit, or two or more units may be integrated into one unit; the integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A mass production calibration method of temperature sensing chips is characterized by comprising the following steps:
installing a test load plate corresponding to the equipment, fixing the temperature sensing module in the test docking tray, and connecting the temperature sensing module with the test load plate;
obtaining the actual temperature of the current environment through the temperature sensing module;
judging whether the temperature sensing module is abnormal or not according to the actual temperature of the current environment;
reading a temperature sensing value and a self-compensation value of a chip to be detected;
obtaining a temperature correction compensation value according to the actual temperature of the current environment and the temperature sensing value of the chip to be detected;
and correcting the self-compensation value of the tested chip according to the temperature correction compensation value.
2. The mass production calibration method of the temperature-sensing chips according to claim 1, wherein the temperature-sensing module comprises two TMP275 chips.
3. The mass production calibration method of the temperature sensing chip according to claim 2, wherein the step of determining whether the temperature sensing module is abnormal or not according to the current environmental actual temperature comprises:
and calculating the difference of the environmental temperatures obtained by the two TMP275 chips, wherein if the difference is not within the threshold interval, the TMP275 chips are abnormal, and if the difference is within the threshold interval, the TMP275 chips are normal.
4. The mass production calibration method of the temperature sensing chip according to any one of claims 1 to 3, wherein obtaining the temperature correction compensation value according to the current environment actual temperature and the temperature sensing value of the chip to be tested comprises:
T_DUT＝12.9852-0.002828*bintodec(tpsdata)；
TMP275 temperature = bintodec (TMP 275 DATA);
toff＝tpsdata-(AVG(TMP275_1+TMP275_2)-12.9852)/(-0.002828)；
wherein, T _ DUT is the temperature of the chip to be tested, bintodec is a binary decimal function, tpsdata is the sensing value of the temperature sensor in the chip to be tested, the temperature of TMP275 is the actual temperature of the current environment measured by TMP275, TMP275 DATA is the return value of the TMP275 temperature sensor, toff is the temperature correction compensation value, AVG is the averaging function, and TMP275_1 and TMP275_2 are the temperature sensing values of 2 TMPs 275, respectively.
5. The method for calibrating mass production of temperature-sensitive chips according to any one of claims 1 to 3, wherein the step of correcting the self-compensation value of the chip under test based on the temperature-corrected compensation value comprises: and writing the temperature correction compensation value into an info calibration value area of the tested chip.
6. A mass production calibration device for temperature sensing chips is characterized in that a temperature sensing module is fixed in a test butt joint disc and is connected with a test load plate; volume production calibrating device of temperature sensing chip is used for:
obtaining the actual temperature of the current environment through the temperature sensing module;
judging whether the temperature sensing module is abnormal or not according to the actual temperature of the current environment;
reading a temperature sensing value and a self-compensation value of a chip to be detected;
obtaining a temperature correction compensation value according to the actual temperature of the current environment and the temperature sensing value of the chip to be detected;
and correcting the self-compensation value of the tested chip according to the temperature correction compensation value.
7. The mass production calibration device of the temperature-sensing chips of claim 6, wherein the temperature-sensing module comprises two TMP275 chips.
8. The mass production calibration device for temperature-sensing chips according to claim 7, wherein the mass production calibration device for temperature-sensing chips is configured to:
and calculating the difference of the environmental temperatures obtained by the two TMP275 chips, wherein if the difference is not within the threshold range, the TMP275 chips are abnormal, and if the difference is within the threshold range, the TMP275 chips are normal.
9. The mass production calibration device for temperature-sensing chips according to claim 7, wherein the mass production calibration device for temperature-sensing chips is configured to: obtaining a temperature correction compensation value according to the actual temperature of the current environment and the temperature sensing value of the chip to be detected:
T_DUT＝12.9852-0.002828*bintodec(tpsdata)；
TMP275 temperature = bintodec (TMP 275 DATA);
toff＝tpsdata-(AVG(TMP275_1+TMP275_2)-12.9852)/(-0.002828)；
wherein, T _ DUT is the temperature of the chip to be tested, bintodec is a binary decimal function, tpsdata is the sensing value of the temperature sensor in the chip to be tested, the temperature of TMP275 is the actual temperature of the current environment measured by TMP275, TMP275 DATA is the return value of the TMP275 temperature sensor, toff is the temperature correction compensation value, AVG is the averaging function, and TMP275_1 and TMP275_2 are the temperature sensing values of 2 TMPs 275, respectively.
10. A chip testing system, comprising a mass production calibration apparatus for the temperature sensing chip according to any one of claims 6 to 9.
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