CN217687601U

CN217687601U - MCU temperature sensor ATE equipment

Info

Publication number: CN217687601U
Application number: CN202221997137.5U
Authority: CN
Inventors: 王佐; 葛俊; 王炯; 曾豪
Original assignee: Chengdu Jihai Technology Co ltd
Current assignee: Chengdu Jihai Technology Co ltd
Priority date: 2022-07-29
Filing date: 2022-07-29
Publication date: 2022-10-28
Anticipated expiration: 2032-07-29

Abstract

The application discloses MCU temperature sensor ATE equipment includes: the test machine is connected with the chip test board through the communication module; the chip test board comprises: the test device comprises a chip mounting seat, a test circuit and an environment temperature detection circuit, wherein the chip mounting seat is used for mounting an MCU chip to be tested; the test circuit is respectively connected with the chip mounting seat and the environment temperature detection circuit, and the test circuit is connected with the test machine through the communication module. According to the technical scheme, the testing framework is improved, so that the testing machine can test based on the sampling value of the temperature sensor in the MCU chip to be tested and the actual environment temperature, and the testing accuracy is improved.

Description

MCU temperature sensor ATE equipment

Technical Field

The utility model relates to a MCU Test technical field especially relates to a MCU temperature sensor ATE (Auto Test Equipment) Equipment.

Background

In the existing MCU mass production test technology, a chip tester is usually used to receive a sampling signal from an MCU internal temperature sensor and analyze the signal, so as to test the detection accuracy and precision of the MCU internal temperature sensor.

However, the inventor of the present application found in research that the test architecture in the prior art only allows the tester to receive and process the detection signal of the temperature sensor inside the MCU, and does not consider the influence of the ambient temperature. In some production plants in environments with large temperature difference, the detection result of the temperature sensor is often inaccurate. Therefore, there is a need to improve the testing architecture of the temperature sensor inside the MCU and improve the accuracy of the detection.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides MCU temperature sensor ATE equipment improves the test framework for the test machine can test based on the sampling value and the actual environment temperature of the inside temperature sensor of the MCU chip of being tested, improves the degree of accuracy of test.

The application provides an MCU temperature sensor ATE equipment, includes: the test machine is connected with the chip test board through the communication module;

the chip test board includes: the test device comprises a chip mounting seat, a test circuit and an environment temperature detection circuit, wherein the chip mounting seat is used for mounting an MCU chip to be tested;

the test circuit is respectively connected with the chip mounting seat and the environment temperature detection circuit, and the test circuit is connected with the tester through the communication module.

In one possible implementation, the communication module includes a wired communication module or a wireless communication module.

In one possible implementation, the wired communication module includes a USB interface, a serial interface, a parallel interface, or a GPIO interface.

In one possible implementation, the ambient temperature detection circuit includes a reference chip.

In a feasible implementation manner, the testing machine is further connected with an upper computer.

In a feasible implementation manner, the upper computer and the testing machine are integrated in the same computer device, or the upper computer and the testing machine are two independent devices.

In a feasible implementation manner, the MCU chip to be tested is detachably mounted on the chip mounting seat.

In one possible implementation, the number of the chip mounting seats is not less than 2.

In one possible implementation, a probe for connecting the temperature sensor is mounted on each of the chip mounts.

In a feasible implementation manner, the test circuit receives the signal of the tester, and performs detection of the temperature sensor in a plurality of operating modes of the MCU chip to be tested, respectively.

The application provides an MCU temperature sensor ATE equipment, the test machine, chip test board and communication module, test machine and chip test board pass through communication module interconnect, the chip test board is including the chip mount pad that is used for installing the MCU chip that awaits measuring, test circuit and the ambient temperature detection circuitry who is used for detecting ambient temperature, test circuit is connected with chip mount pad and ambient temperature detection circuitry respectively, test circuit passes through communication module and is connected with the test machine, therefore, at the in-process of test, test circuit not only can transmit the sampled signal of the inside temperature sensor of MCU chip to the test machine, can also give the test machine with ambient temperature transmission, make the test machine fully consider the actual sampling value and the actual ambient temperature of MCU chip to handle, improve the accuracy of test.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive effort.

Fig. 1 is a schematic structural diagram of an MCU temperature sensor ATE device according to an embodiment of the present disclosure.

Detailed Description

For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.

It should be understood that the described embodiments are only some, and not all embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.

The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that the term "and/or" as used herein is merely a relationship that describes an associated object, meaning that three relationships may exist, e.g., a and/or B, may represent: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

In the current scene of mass production test of MCU chip, directly insert the MCU chip in the test machine to test the MCU chip. In the scenario of the embodiment of the application, the temperature sensor is arranged in the MCU chip, so that the temperature value of the internal electronic device can be sampled when the MCU chip is in different working modes, and the analog-to-digital converter is arranged in the MCU chip, so that the analog sampling value of the temperature sensor can be converted into a digital signal, and the digital signal is transmitted to the testing machine for processing. Therefore, the existing test framework does not fully consider the possible temperature difference change of a production workshop, and the detection is easy to cause inaccuracy.

In view of the above, in one embodiment of the present application, an MCU temperature sensor ATE device is provided, see fig. 1. MCU temperature sensor ATE equipment in the embodiment of this application improves the test framework for the test machine not only handles MCU chip temperature sensor's sampling data, can also receive the actual ambient temperature in workshop and handle, thereby can improve the degree of accuracy that detects.

As shown in fig. 1, the MCU temperature sensor ATE apparatus in this embodiment includes: a tester 100, a chip test board and 300 a communication module 200, wherein the tester 100 and the chip test board 300 are connected to each other through the communication module 200.

The chip test board 300 includes: a chip mount for mounting an MCU chip to be tested, a test circuit 310, and an ambient temperature detection circuit 320 for detecting an ambient temperature.

The test circuit 310 is connected to the chip mounting base and the ambient temperature detection circuit 320, respectively, and the test circuit 310 is connected to the testing machine 100 through the communication module 200.

Above-mentioned this application provides MCU temperature sensor ATE equipment, the test machine, chip test board and communication module, test machine and chip test board pass through communication module interconnect, the chip test board is including the chip mount pad that is used for installing the MCU chip that awaits measuring, test circuit and the ambient temperature detection circuitry that is used for detecting ambient temperature, test circuit is connected with chip mount pad and ambient temperature detection circuitry respectively, test circuit passes through communication module and is connected with the test machine, therefore, in the in-process of test, test circuit not only can transmit the sampled signal of the inside temperature sensor of MCU chip to the test machine, can also give the test machine with ambient temperature transmission, make the test machine fully consider the actual sampling value and the actual ambient temperature of MCU chip to handle, improve the accuracy of test.

The structure of the MCU temperature sensor ATE device and its working principle are explained in a more detailed embodiment of the present application.

In one embodiment of the present application, test machine 100 may include a master control module 110 and a power module 120. The power module 120 can supply power to the testing machine 100, and when the testing machine 100 is connected to the chip testing board 300 through the communication module 200, the power module 120 is further configured to supply power to the chip testing board 300. The main control module 110 is configured to implement overall control of a testing process of the MCU chip, for example, send test data to the test circuit 310 according to a communication protocol of the communication module 200, where the test circuit 310 further sends test data to the MCU chip installed in the chip mounting base, for example, the MCU chip is enabled to operate in various modes, and receive data fed back by the MCU chip, for example, data sampled by the temperature sensor and subjected to analog-to-digital conversion. In this embodiment, the test circuit 310 is connected to the ambient temperature detection circuit 320, and is configured to feed back the real-time ambient temperature to the test machine 100, so that the test machine 100 can process the sample values based on the ambient temperature and the temperature sensor.

In an existing data processing method for temperature detection, a fixed detection threshold [ Vtemp _ min, vtemp _ max ] is used as a detection standard, that is, when a detection temperature output by an MCU chip is within a detection threshold range, the MCU chip is considered to be qualified, however, when an environmental temperature difference in a production workshop has a large influence, a sampled value is more likely to exceed the detection threshold range, and thus a detection error is more likely to occur.

In an embodiment of the application, an average slope value Avg _ typ of the sampling voltage of the MCU chip built-in temperature sensor corresponding to the ambient temperature during sampling may be obtained in advance, for example, specifically, the average slope value Avg _ typ of the sampling voltage of the internal temperature sensor corresponding to the ambient temperature measured in an environment of 25 degrees in a laboratory may be selected to be uploaded to a tester, and the Avg _ typ is directly called during chip testing.

In one embodiment of the present application, the actual temperature of the test environment may be obtained as N ℃ through the ambient temperature detection temperature 320, and the detection threshold may be dynamically determined according to the ambient temperature in combination with the average slope value Avg typ, for example, the detection threshold may be set to [ Vtemp _ min + Avgtyp (N-25), vtemp _ max + Avg typ (N-25) ]. Further, if an error due to heat generation of the temperature sensor itself is taken into consideration, the error may be preset to N ± 6 ℃, and the threshold value of the final detection is [ Vtemp _ min + Avgtyp ((N ± 6) -25), vtemp _ max + Avg _ typ ((N ± 6)) -25) ]. Therefore, the temperature of the MCU chip can be tested according to the finally set detection threshold value.

In one embodiment of the present application, the communication module 200 may include a wired communication module or a wireless communication module. In this application, the wired communication module includes, but is not limited to, a USB interface, a serial interface, a parallel interface, or a GPIO interface, for example.

In one embodiment of the present application, the ambient temperature detection circuit 320 may include a reference chip, which can accurately measure the real-time ambient temperature.

In the embodiment of the present application, the testing machine 100 is further connected to an upper computer 400. The upper computer 400 and the testing machine 100 may be integrated in the same computer device, or the upper computer 400 and the testing machine 100 are two independent devices. Host computer 400 may receive the test results from testing machine 100 and perform further analysis and processing, such as graphical display.

In one embodiment of the application, the MCU chip to be tested is detachably installed on the chip installation seat. To implement batch testing, the chip mount may be multiple, for example, the number of chip mounts is not less than 2, and it is illustrated in fig. 1 that the chip mount includes a chip mount 330 and a chip mount 340. Be equipped with certain space between a plurality of chip mount pads to be favorable to the heat dissipation when chip test, in addition, in this embodiment, ambient temperature detection circuitry 320 sets up in a plurality of chip mount pad central authorities, and what in order to guarantee that the benchmark chip tests is the most balanced ambient temperature.

In one embodiment of the present application, a probe for connecting a temperature sensor is mounted on each chip mount. Therefore, the temperature of the MCU chip can be directly measured.

In the embodiment of the present application, the test circuit receives a signal of the tester, and performs detection of the temperature sensor in a plurality of working modes of the MCU chip to be tested, respectively, where the plurality of working modes may include a standby operand mode, a high operand mode, a normal operand mode, and the like.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An MCU temperature sensor (ATE) device, comprising: the test machine and the chip test board are mutually connected through the communication module;

the chip test board includes: the device comprises a chip mounting seat used for mounting an MCU chip to be tested, a test circuit and an environment temperature detection circuit used for detecting environment temperature;

the test circuit is respectively connected with the chip mounting seat and the environment temperature detection circuit, and the test circuit is connected with the test machine through the communication module.

2. The MCU temperature sensor ATE apparatus of claim 1, wherein the communication module comprises a wired communication module or a wireless communication module.

3. The MCU temperature sensor (ATE) device of claim 2, wherein the wired communication module comprises a USB interface, a serial interface, a parallel interface, or a GPIO interface.

4. The MCU temperature sensor ATE apparatus of claim 1, wherein the ambient temperature detection circuitry comprises a reference chip.

5. The MCU temperature sensor ATE apparatus of claim 1, wherein the tester is further connected to an upper computer.

6. The MCU temperature sensor ATE apparatus of claim 5, wherein the host computer and the tester are integrated in the same computer apparatus, or the host computer and the tester are two separate apparatuses.

7. The MCU temperature sensor ATE equipment of claim 1, characterized in that the MCU chip to be tested is detachably mounted on the chip mount.

8. The MCU temperature sensor ATE apparatus of claim 7, wherein the number of chip mounts is not less than 2.

9. The MCU temperature sensor ATE apparatus of claim 8, wherein a probe for connecting the temperature sensor is mounted on each of the chip mounts.

10. The MCU temperature sensor ATE apparatus of claim 1, wherein the test circuitry receives signals from the tester for temperature sensor detection in a plurality of operating modes of the MCU chip to be tested, respectively.