CN115815821A

CN115815821A - Apparatus and method for laser processing continuous pattern and electronic device etching apparatus and method

Info

Publication number: CN115815821A
Application number: CN202211573101.9A
Authority: CN
Inventors: 袁剑; 黎锦宁; 卢孙平; 朱建; 李善基
Original assignee: Shenzhen Mingchuang Intelligent Equipment Co ltd
Current assignee: Shenzhen Mingchuang Intelligent Equipment Co ltd
Priority date: 2022-12-08
Filing date: 2022-12-08
Publication date: 2023-03-21
Anticipated expiration: 2042-12-08
Also published as: CN115815821B

Abstract

The invention discloses a device and a method for processing continuous graphs by laser and an electronic device etching device and a method, and relates to the technical field of laser processing. The device comprises a control unit, a laser three-dimensional scanning unit and a reflecting unit, wherein the control unit controls laser to be emitted to a first area to be processed by the laser three-dimensional scanning unit according to a preset track coordinate of the first area to be processed and to be reflected to a second area to be processed by the reflecting unit after being emitted by the laser three-dimensional scanning unit according to a preset track coordinate of the second area to be processed; the preset track coordinates of the first area to be processed correspond to the space coordinates of the target graph of the first area to be processed, and the preset track coordinates of the second area to be processed correspond to the space coordinates of the target graph of the second area to be processed imaged through the reflection unit. The position of a workpiece does not need to be changed in the machining process, the machining precision is determined by the laser scanning precision, the precision is ensured, the cost is reduced, and the efficiency is improved.

Description

Apparatus and method for laser processing continuous pattern and electronic device etching apparatus and method

Technical Field

The invention relates to the technical field of laser processing, in particular to a device and a method for processing continuous graphs by laser.

Background

In industrial applications, it is often necessary to perform continuous patterning of different surfaces of a workpiece. The common method is that one of the surfaces is opposite to the laser, a section of the continuous graph is processed on the surface, then the workpiece is turned over for a certain angle, the second surface is opposite to the laser, the other section of the continuous graph is processed on the second surface, and so on, and finally the continuous graph is formed by splicing the graphs on different surfaces.

However, the traditional splicing method has high requirement on the positioning accuracy of the workpiece, and the ideal splicing accuracy is often difficult to realize by adopting a general mechanical structure to move and position the workpiece for multiple times. In order to ensure the precision, the complexity of a mechanical structure is increased along with the increase of the precision, so that the production cost is increased, and particularly for larger workpieces, the increase of the complexity and the cost of the mechanical structure is more obvious; meanwhile, in order to improve the accuracy, the positions of the respective surfaces of the workpiece need to be corrected, and thus the production efficiency is affected.

Disclosure of Invention

Aiming at the defects in the prior art, the invention provides a device and a method for processing continuous graphs by laser, and an electronic device etching device and a method, which can reduce the complexity of a mechanical structure, reduce the production cost and improve the production efficiency while ensuring the processing precision.

In order to achieve the purpose, the invention adopts the following technical scheme:

a device for processing continuous graphs by laser comprises a control unit, a laser three-dimensional scanning unit and a reflecting unit, wherein a workpiece is provided with a first to-be-processed area and a second to-be-processed area, the laser three-dimensional scanning unit is arranged opposite to the first to-be-processed area, the first to-be-processed area is located in a laser focus range of the laser three-dimensional scanning unit, the reflecting unit is arranged beside the second to-be-processed area, and the second to-be-processed area is located in a focus range of the laser after being reflected by the reflecting unit;

the control unit controls laser to be emitted to the first area to be processed by the laser three-dimensional scanning unit according to the preset track coordinate of the first area to be processed, and the laser is emitted by the laser three-dimensional scanning unit according to the preset track coordinate of the second area to be processed and then reflected to the second area to be processed by the reflecting unit;

the first area to be processed is adjacent to the second area to be processed, the preset track coordinate of the first area to be processed corresponds to the space coordinate of the target graph of the first area to be processed, the preset track coordinate of the second area to be processed corresponds to the space coordinate of the target graph of the second area to be processed imaged through the reflecting unit, and the target graph of the first area to be processed and the target graph of the second area to be processed are continuous at the adjacent position of the two areas.

As a preferable scheme, the workpiece comprises at least two adjacent surfaces to be machined, the surfaces to be machined comprise a main machining surface and at least one side machining surface, the first area to be machined is located on the main machining surface, and the second area to be machined is located on the side machining surface;

the reflecting unit comprises at least one reflecting mirror, and each reflecting mirror is arranged corresponding to each side processing surface, is positioned beside each side processing surface, and is used for reflecting laser to the side processing surface corresponding to each reflecting mirror.

Preferably, the reflection unit further comprises a position adjustment mechanism, wherein the position adjustment mechanism comprises a translation assembly or a first rotation assembly;

the translation assembly is used for driving the reflecting mirror to translate relative to the side processing surface corresponding to the reflecting mirror, and the first rotating assembly is used for driving the reflecting mirror to rotate relative to the side processing surface corresponding to the reflecting mirror;

the reflector is fixed on the translation assembly or the first rotating assembly.

As a preferable scheme, the device further comprises a workpiece positioning unit, wherein the workpiece positioning unit comprises a workpiece positioning mechanism, a workpiece posture adjusting mechanism and a driving mechanism;

the workpiece attitude adjusting mechanism comprises a three-dimensional translation assembly and a second rotating assembly arranged on the three-dimensional translation assembly;

the workpiece is fixed on the second rotating assembly through a workpiece positioning mechanism;

the control unit is connected with the driving mechanism and controls the driving mechanism to drive the workpiece posture adjusting mechanism to act.

A method of laser machining a continuous pattern, comprising the steps of:

determining preset positions of the workpiece and the reflecting unit in a laser processing coordinate system, and acquiring space coordinates of target graphs of a first region to be processed and a second region to be processed of the workpiece according to the preset positions of the workpiece in the laser processing coordinate system;

setting the space coordinate of a target graph of a first area to be processed of the workpiece as a preset track coordinate of the first area to be processed; according to the spatial coordinates of the target graph of the second region to be processed of the workpiece and the preset position of the reflection unit in the laser processing coordinate system, determining the spatial coordinates of the target graph of the second region to be processed imaged through the reflection unit, and setting the imaged spatial coordinates as the preset track coordinates of the second region to be processed;

controlling laser to be emitted to the first area to be processed according to the preset track coordinate of the first area to be processed, emitting to the reflecting unit according to the preset track coordinate of the second area to be processed, and reflecting to the second area to be processed through the reflecting unit;

the laser processing coordinate system is a processing coordinate system of the laser three-dimensional scanning unit, the first area to be processed is adjacent to the second area to be processed, and the target patterns of the first area to be processed and the second area to be processed are continuous at the adjacent position of the two areas.

As a preferable scheme, before the step of controlling the laser emission, the method further comprises the steps of:

measuring the actual position of the workpiece in a laser processing coordinate system;

calculating the error between the actual position and the preset position of the workpiece in a laser processing coordinate system;

acquiring a correction parameter according to the error;

and adjusting the workpiece attitude according to the correction parameter, or adjusting the preset track coordinates of the first area to be processed and the second area to be processed according to the correction parameter.

As a preferred solution, the step of determining the preset position of the workpiece and the reflecting unit in the laser processing coordinate system is implemented by modeling, and includes:

respectively establishing models of a workpiece and a reflecting unit in a laser processing coordinate system;

adjusting the position of the workpiece model to enable a first area to be processed of the workpiece model to face the laser emergent direction and be located in the laser focus range;

adjusting the position of the reflection unit model to enable an image of a second region to be processed of the workpiece model in the reflection unit model to be located in the range of the laser focus;

translating or rotating the reflection unit model to enable the reflection unit model not to interfere with the workpiece model;

and acquiring the spatial coordinates of the model calibration point of the workpiece in the laser processing coordinate system to identify the preset position of the workpiece, and acquiring the spatial coordinates of the model calibration point of the reflecting unit in the laser processing coordinate system to identify the preset position of the reflecting unit.

As a preferable scheme, the pattern includes lines, portions of the same line respectively located in the first region to be processed and the second region to be processed include two end points, and end points of the lines located at adjacent positions of the regions are overlapped.

An electronic device etching device comprises a control unit, a laser three-dimensional scanning unit and a reflecting unit, wherein the electronic device is provided with a first area to be etched and a second area to be etched, which are coated with a conductive layer, the laser three-dimensional scanning unit is arranged opposite to the first area to be etched, the first area to be etched is positioned in a laser focus range of the laser three-dimensional scanning unit, the reflecting unit is arranged beside the second area to be etched, and the second area to be etched is positioned in a focus range of laser reflected by the reflecting unit;

the control unit controls the laser to be emitted to the first area to be etched by the laser three-dimensional scanning unit according to the preset track coordinate of the first area to be etched, and the laser to be emitted to the second area to be etched by the laser three-dimensional scanning unit according to the preset track coordinate of the second area to be etched and then reflected to the second area to be etched by the reflecting unit;

the first area to be etched and the second area to be etched are adjacent, the preset track coordinate of the first area to be etched corresponds to the space coordinate of the target etching line of the first area to be etched, the preset track coordinate of the second area to be etched corresponds to the space coordinate of the target etching line of the second area to be etched imaged through the reflecting unit, and the end points of the target etching line of the first area to be etched and the end point of the target etching line of the second area to be etched at the adjacent position of the two areas are superposed.

As a preferred scheme, the electronic device is provided with three adjacent surfaces to be etched, including a main etching surface, and a first side etching surface and a second side etching surface which are positioned at two sides of the main etching surface and are respectively adjacent to the main etching surface, wherein the first region to be etched is positioned on the main etching surface, and the second region to be etched is positioned on the first side etching surface and the second side etching surface;

the reflecting unit comprises a first reflecting mirror and a second reflecting mirror, the first reflecting mirror is positioned beside the first side etching surface and used for reflecting the laser to the first side etching surface, and the second reflecting mirror is positioned beside the second side etching surface and used for reflecting the laser to the second side etching surface.

An electronic device etching method, comprising the steps of:

determining the preset positions of the electronic device and the reflection unit in a laser processing coordinate system, and acquiring the space coordinates of target etching lines of a first area to be etched and a second area to be etched of the electronic device according to the preset positions of the electronic device in the laser processing coordinate system;

setting the space coordinate of a target etching line of a first area to be etched of the electronic device as a preset track coordinate of the first area to be etched; according to the space coordinate of a target etching line of a second region to be etched of the electronic device and the preset position of the reflection unit in the laser processing coordinate system, determining the space coordinate of the target etching line of the second region to be etched imaged through the reflection unit, and setting the imaged space coordinate as the preset track coordinate of the second region to be etched;

controlling laser to be emitted to the first area to be etched according to the preset track coordinate of the first area to be etched, emitting to the reflecting unit according to the preset track coordinate of the second area to be etched, and reflecting to the second area to be etched through the reflecting unit;

the laser processing coordinate system is a processing coordinate system of the laser three-dimensional scanning unit, the first area to be etched is adjacent to the second area to be etched, and end points of target etching lines of the first area to be etched and the second area to be etched at the adjacent positions of the two areas are overlapped.

measuring the actual position of the electronic device in a laser processing coordinate system;

calculating the error between the actual position and the preset position of the electronic device in the laser processing coordinate system;

acquiring a correction parameter according to the error;

and adjusting the posture of the electronic device according to the correction parameter, or adjusting the preset track coordinates of the first area to be etched and the second area to be etched according to the correction parameter.

Compared with the prior art, the method has obvious advantages and beneficial effects, and particularly, when each to-be-processed area of the workpiece cannot be in the laser processing range at the same time, a certain to-be-processed area of the workpiece is positioned in the laser focus range of the laser three-dimensional scanning unit by arranging the laser three-dimensional scanning unit and the reflecting unit, and the laser of the laser three-dimensional scanning unit is emitted according to a preset track corresponding to the target graph of the to-be-processed area, namely, the laser can fall to the to-be-processed area to form the target graph; the laser of the laser three-dimensional scanning unit is made to exit through a preset track corresponding to the imaging of the reflecting unit according to a target graph of another area to be processed, and then the laser is reflected to the other area to be processed of the workpiece through the reflecting unit, and because the target graph and an image formed by the target graph through the reflecting unit are symmetrical about the reflecting unit, the laser exit track corresponds to the imaging of the reflecting unit, but the laser exit track cannot actually reach the position of the image, but can be reflected to the symmetrical position of the image about the reflecting unit through the reflecting unit, therefore, the position actually reached after the laser is reflected by the reflecting unit is the position of the target graph of the other generation of processing area, and the target graph of the other area to be processed can be processed. When the areas to be processed are adjacent and the corresponding points of the target graph corresponding to the preset track of each area to be processed at the adjacent position of each area are superposed, the falling points of the laser at the adjacent position of the two areas can be ensured to be superposed, so that the graphs of the two areas are continuous.

By adopting the scheme of the invention, the processing of continuous graphs of different areas to be processed of the workpiece can be realized by additionally arranging the reflection unit and combining the ingenious arrangement of the laser preset tracks of the different areas to be processed. The position of the workpiece does not need to be changed in the processing process, so that the processing precision does not depend on a mechanical structure for assisting the movement and the positioning of the workpiece any longer, but only depends on the movement precision of a three-dimensional galvanometer in a laser three-dimensional scanning unit. The precision of the three-dimensional galvanometer is very high, so that the machining precision is effectively ensured; meanwhile, the requirement on a mechanical structure is reduced, and the cost can be reduced; the position of the workpiece does not need to be changed in the machining process, so that the time required by multiple times of position correction can be saved, and the production efficiency is improved.

Drawings

FIG. 1 is a schematic diagram of an apparatus for laser processing continuous patterns according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a laser three-dimensional scanning unit according to an embodiment of the present invention;

FIG. 3 is a schematic view of a focal range of a laser three-dimensional scanning unit according to an embodiment of the present invention;

FIG. 4 is a schematic view of a region of a workpiece to be machined according to one embodiment of the present invention;

FIG. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

FIG. 6 is a schematic diagram illustrating an etching principle of a conductive layer of an electronic device according to an embodiment of the present invention;

fig. 7 is an enlarged view at M in fig. 6.

Description of reference numerals:

10. the laser three-dimensional scanning device comprises a laser three-dimensional scanning unit, 101, a laser, 102.XY galvanometers, 103, beam expanders, 104, a focusing mirror and 105, a focal plane; 20. a reflection unit, 201, a first mirror, 202, a second mirror, 203, a position adjustment mechanism; 30. a workpiece, 301, a first region to be machined, 302, a second region to be machined; 80. an electronic device, 81, a main etched surface, 82, a first side etched surface, 83, a second side etched surface, 84, a conductive layer, 85, an etched line, 86, a first region to be etched, 87, a second region to be etched.

Detailed Description

In order to more clearly illustrate the invention, reference is made to the following detailed description of specific embodiments taken in conjunction with the accompanying drawings.

Referring to fig. 1, in an embodiment of the present invention, an apparatus for laser processing a continuous pattern includes a control unit, a laser three-dimensional scanning unit 10, and a reflection unit 20, a workpiece 30 includes a first region to be processed 301 and a second region to be processed 302, the laser three-dimensional scanning unit 10 is disposed opposite to the first region to be processed 301, the first region to be processed 301 is located in a focus range of laser of the laser three-dimensional scanning unit 10, the reflection unit 20 is disposed beside the second region to be processed 302, and the second region to be processed 302 is located in a focus range of laser reflected by the reflection unit 20; the control unit controls the laser to be emitted to the first area to be processed 301 from the laser three-dimensional scanning unit 10 according to the preset track coordinate of the first area to be processed 301, and to be reflected to the second area to be processed 302 through the reflection unit 20 after being emitted from the laser three-dimensional scanning unit 10 according to the preset track coordinate of the second area to be processed 302; the first area to be processed 301 and the second area to be processed 302 are adjacent, the preset track coordinate of the first area to be processed 301 corresponds to the space coordinate of the target pattern of the first area to be processed 301, the preset track coordinate of the second area to be processed 302 corresponds to the space coordinate of the target pattern of the second area to be processed 302 imaged by the reflection unit 20, and the target pattern of the first area to be processed 301 and the target pattern of the second area to be processed 302 are continuous at the adjacent position of the two areas.

The laser three-dimensional scanning unit 10 has a mature configuration, and referring to fig. 2, includes a laser 101, a three-dimensional galvanometer, and a focusing mirror 104, and laser generated by the laser 101 is adjusted by the three-dimensional galvanometer to emit an angle, and then is focused to a target position by the focusing mirror 104.

The control unit is usually an industrial computer, and a preset track according to which the laser scanning is performed is set inside the control unit, and different target positions where the stress light is focused are set at different points on the preset track, so that the preset track actually corresponds to coordinates of different focus positions. The industrial computer is matched with the data conversion interface and controls the three-dimensional galvanometer to act according to the preset track of the laser, so that the laser is controlled to emit according to the angles corresponding to the points with different coordinates on the preset track, and the processing track is formed.

The three-dimensional galvanometer comprises an XY galvanometer 102 and a beam expander 103, the XY galvanometer 102 can adjust the laser focus to fall on any position in the galvanometer stroke range on an XY plane, and the XY plane in the range is generally called a laser focus plane 105; the beam expander 103 moves to adjust the position of the laser focus within the stroke range of the beam expander 103 in the Z direction, i.e. the position of the focal plane 105 in the Z direction is adjustable. The XY galvanometer 102 and the beam expander 103 are matched to act, so that the laser focus can be located at any coordinate position in a certain range of an XYZ three-dimensional space, and the specific range is determined by the strokes of the XY galvanometer 102 and the beam expander 103. As shown in fig. 3: L1D1 is the focal plane 105 of the upper limit of the travel of the laser in the Z direction, L5D5 is the focal plane 105 of the lower limit of the travel of the laser in the Z direction, and the focal point of the laser can be in any coordinate position in a space range contained by the two planes of L1D1 and L5D 5.

Although the laser three-dimensional scanning unit 10 can achieve arbitrary adjustment of the laser focus in a three-dimensional space within a certain range, when each region to be processed of the workpiece 30 cannot be simultaneously located in a range capable of being processed by laser, for example, each region to be processed is respectively located on a different surface to be processed of the workpiece 30, a certain surface to be processed is blocked by another surface to be processed or a certain surface to be processed is parallel to the central beam of laser, so that laser cannot be directly emitted to the surface to be processed, or each region to be processed is located on the same surface to be processed of the workpiece 30, but a certain region to be processed is blocked by another region to be processed, so that laser cannot be directly emitted to the region to be processed, the different situation may refer to fig. 4, at this time, the laser three-dimensional scanning unit 10 cannot simultaneously achieve processing of each region to be processed.

In the present embodiment, a reflection unit 20 is additionally provided outside the laser three-dimensional scanning unit 10, and each region to be processed of the workpiece 30 is divided into a first region to be processed 301 and a second region to be processed 302 according to whether the laser beam can be directly emitted, as shown in fig. 4. With reference to fig. 1, the workpiece 30 is disposed, such that the first region to be processed 301 is opposite to the laser three-dimensional scanning unit 10, that is, the first region to be processed 301 faces a laser emission direction of the laser three-dimensional scanning unit 10, and the first region to be processed 301 is located within a laser focus range of the laser three-dimensional scanning unit 10, such that the laser emitted from the laser three-dimensional scanning unit 10 can directly fall on the first region to be processed 301, and the laser is controlled to emit according to a preset track corresponding to a spatial coordinate of a target pattern of the first region to be processed 301, such that the laser focus falls on a target pattern position of the first region to be processed 301, so as to process and form the target pattern of the region. The second region to be processed 302 of the workpiece 30 is located in the focus range of the laser reflected by the reflection unit 20, that is, the focus formed by the laser reflected by the reflection unit 20 of the laser three-dimensional scanning unit 10 can fall to the second region to be processed 302, and the laser is controlled to emit according to the preset track corresponding to the spatial coordinate of the target pattern of the second region to be processed 302 imaged by the reflection unit 20, because the target pattern of the second region to be processed 302 and the image formed by the second region to be processed 302 by the reflection unit 20 are symmetric with respect to the reflection unit 20, and the laser emission track corresponds to the spatial coordinate of the image formed by the reflection unit 20, but the laser cannot actually reach the position of the image, but is reflected to the symmetric position of the image with respect to the reflection unit 20 by the reflection unit 20, which is the target pattern position of the second region to be processed 302, so that the focus of the laser reflected by the reflection unit 20 actually falls to the target pattern position of the second region to be processed 302, and a corresponding target pattern can be processed in the second region to be processed 302.

When the first area to be processed 301 is adjacent to the second area to be processed 302, the graphs of the two areas obtained by laser processing can be ensured to be continuous as long as the target graphs corresponding to the preset tracks of the two areas to be processed are ensured to be continuous at the area adjacent position. The laser is focused on the surface of the workpiece 30 to form a processing trace, and the processing trace is actually a point set formed in space after the laser focus is scanned by the three-dimensional galvanometer, so that the minimum unit of the laser processing graph is a point, target graphs corresponding to preset traces of two regions to be processed are continuous at the region adjacent positions, and actually, corresponding points of the target graphs at the region adjacent positions are superposed.

The embodiment realizes the processing of the continuous graphs of different areas to be processed of the workpiece 30, and the position of the workpiece 30 does not need to be changed, so that a mechanical structure for assisting the moving and positioning of the workpiece 30 does not need to be introduced, the error of the mechanical structure does not need to be introduced, and once the structure of the device is set, the processing precision only depends on the precision of the three-dimensional galvanometer. And the XY galvanometer 102 and the beam expander 103 of three-dimensional galvanometer are driven by precise servo motors, so the precision is very high, the positioning precision error can reach below 5um, the mechanical structure precision error of the traditional auxiliary workpiece 30 for moving and positioning usually exceeds 100um, and compared with the prior art, the processing precision of the embodiment is obviously improved. While the precision is ensured, the cost can be reduced because a mechanical structure for assisting the moving and positioning of the workpiece 30 is not required to be introduced; since the position of the workpiece 30 does not need to be changed in the machining process, the time required by position correction for many times can be saved, and the production efficiency can be improved.

In addition, the reflecting unit 20 is arranged independently of the laser three-dimensional scanning unit 10, so that the whole device can be flexibly applied to various workpieces 30, and the compatibility is higher. The distribution of the regions to be machined may also vary from workpiece 30 to workpiece. Referring to fig. 4, the first region to be machined 301 and the second region to be machined 302 may be regions on different surfaces of the workpiece 30, or may be different regions on the same surface of the workpiece 30. Regardless of the distribution of the positions of the regions to be processed, it is sufficient to arrange the reflecting unit 20 at an appropriate position with respect to the laser three-dimensional scanning unit 10 and the workpiece 30, as follows in the preferred embodiment.

In the preferred embodiment, the workpiece 30 includes at least two adjacent surfaces to be machined, the surfaces to be machined include a main machining surface and at least one side machining surface, the first area to be machined 301 is located on the main machining surface, and the second area to be machined 302 is located on the side machining surface; accordingly, the reflection unit 20 includes at least one mirror, and each mirror is disposed corresponding to each side processing surface, is located beside each side processing surface, and is used for reflecting the laser light to the side processing surface corresponding to each mirror.

Referring to fig. 1 and 4, the workpiece 30 includes two adjacent to-be-machined surfaces, a main machining surface and a side machining surface, a first to-be-machined area 301 is located on the main machining surface, and a second to-be-machined area 302 is located on the side machining surface; the reflection unit 20 includes a mirror disposed corresponding to the side processing surface, beside the side processing surface, for reflecting the laser light onto the side processing surface.

Or, the workpiece 30 includes three adjacent to-be-machined surfaces, a main machined surface and two side machined surfaces, which are a first side machined surface and a second side machined surface respectively, the first side machined surface and the second side machined surface are located on two sides of the main machined surface respectively and are adjacent to the main machined surface, the first to-be-machined area 301 is located on the main machined surface, and the second to-be-machined area 302 is located on the two side machined surfaces respectively; the reflection unit 20 includes a first reflection mirror 201 and a second reflection mirror 202, the first reflection mirror 201 is disposed corresponding to the first side processing surface, is located beside the first side processing surface, and is used for reflecting the laser light onto the first side processing surface, and the second reflection mirror 202 is disposed corresponding to the second side processing surface, is located beside the second side processing surface, and is used for reflecting the laser light onto the second side processing surface.

In a preferred embodiment, the reflection unit 20 further includes a position adjustment mechanism 203, the position adjustment mechanism 203 including a translation component or a first rotation component; the translation assembly is used for driving the reflector to translate relative to the corresponding side processing surface, and the first rotating assembly is used for driving the reflector to rotate relative to the corresponding side processing surface; the reflector is fixed on the translation assembly or the first rotating assembly.

The translation assembly adopts a combined structure of a screw rod and a slide block, can be manually adjusted or driven by a motor and is used for adjusting the distance between the reflector and the corresponding side processing surface; the first rotating assembly adopts a turntable structure, can be manually adjusted or driven by a motor and is used for adjusting the included angle between the reflector and the corresponding side processing surface. Through setting up above-mentioned structure, be convenient for adjust the position of speculum before the processing.

In another preferred embodiment, the apparatus further comprises a workpiece 30 positioning unit, the workpiece 30 positioning unit comprising a workpiece 30 positioning mechanism, a workpiece 30 attitude adjusting mechanism, and a driving mechanism; the workpiece 30 posture adjusting mechanism comprises a three-dimensional translation component and a second rotating component arranged on the three-dimensional translation component; the workpiece 30 is fixed on the second rotating assembly through a workpiece 30 positioning mechanism; the control unit is connected with the driving mechanism and controls the driving mechanism to drive the workpiece 30 posture adjusting mechanism to act.

The workpiece 30 positioning mechanism is designed according to the specific workpiece 30 for positioning the workpiece 30 during machining to ensure stability of its spatial position. The workpiece 30 posture adjusting mechanism is used for adjusting the position of the workpiece 30 in each dimension in the three-dimensional space to be located at an ideal processing position so as to compensate the influence of the machining error of the workpiece 30 and the positioning error of the workpiece 30 on the processing precision. Wherein the second rotary assembly may be configured for single axis or two axis rotation depending on the particular positioning requirements of the workpiece 30. The three-dimensional translation assembly adopts a superposed screw rod and sliding block combined structure, and the second rotating assembly adopts a turntable or a combined structure thereof. The driving mechanism comprises a motor, the driving mechanism is driven by the motor, the motor is connected with the control unit, and the control unit controls the motor to act to drive the workpiece 30 posture adjusting mechanism to adjust the posture of the workpiece 30.

The following example is a specific application of the above-described apparatus in the field of electronic devices 80.

Referring to fig. 5, prior to processing the electronic device 80 into a finished product, the substrate surface is often coated with an integral conductive layer 84, and portions of the conductive layer 84 are etched away by a laser according to its circuit design, leaving portions that form the vias for the desired circuit. The conductive layer 84 may be applied to multiple sides of the substrate, requiring continuous lines to be etched on the multiple sides to allow for multi-sided vias. Errors in any one of the lines can cause the whole circuit to fail to operate normally, so that the requirement on the precision of continuous etching is high. The traditional processing method has various defects, and particularly for larger devices such as display screens, in order to meet the precision requirement, a marble processing platform with high stability, a precise mechanical transmission structure and the like need to be configured, so that the device is high in complexity, large in size and high in cost.

In order to solve the above problem, the embodiment provides an electronic device etching apparatus, including a control unit, a laser three-dimensional scanning unit 10, and a reflection unit 20, where the electronic device 80 includes a first region to be etched 86 and a second region to be etched 87, where the conductive layer 84 is coated on the first region to be etched 86, the laser three-dimensional scanning unit 10 is disposed opposite to the first region to be processed 301, the first region to be etched 86 is located in a laser focus range of the laser three-dimensional scanning unit 10, the reflection unit 20 is disposed beside the second region to be etched 87, and the second region to be etched 87 is located in a focus range where laser is reflected by the reflection unit 20; the control unit controls the laser to be emitted to the first area to be etched 86 from the laser three-dimensional scanning unit 10 according to the preset track coordinate of the first area to be etched 86, and to be reflected to the second area to be etched 87 through the reflection unit 20 after being emitted from the laser three-dimensional scanning unit 10 according to the preset track coordinate of the second area to be etched 87; the first region to be etched 86 is adjacent to the second region to be etched 87, the preset track coordinate of the first region to be etched 86 corresponds to the spatial coordinate of the target etching line 85 of the first region to be etched 86, the preset track coordinate of the second region to be etched 87 corresponds to the spatial coordinate of the target etching line 85 of the second region to be etched 87 imaged by the reflection unit 20, and the end points of the target etching line 85 of the first region to be etched 86 and the end points of the target etching line 85 of the second region to be etched 87 at the adjacent positions of the two regions coincide.

Specifically, the electronic device 80 may have two adjacent surfaces to be etched, or three adjacent surfaces to be etched. The example of the etching device having three adjacent surfaces to be etched is described below, and the reflection unit 20 is provided as follows.

Referring to fig. 5-7, the electronic device 80 includes a main etching surface 81, and a first side etching surface 82 and a second side etching surface 83 which are respectively adjacent to the main etching surface 81 and located on both sides of the main etching surface 81, wherein a first region to be etched 86 is located on the main etching surface 81, and a second region to be etched 87 is respectively located on the first side etching surface 82 and the second side etching surface 83; the reflection unit 20 includes a first mirror 201 located beside the first side etched surface 82 for reflecting the laser light onto the first side etched surface 82, and a second mirror 202 located beside the second side etched surface 83 for reflecting the laser light onto the second side etched surface 83.

Furthermore, a position adjusting structure can be arranged to adjust the position of the reflector before processing; and arranging a workpiece 30 positioning unit which comprises a workpiece 30 positioning mechanism, a workpiece 30 posture adjusting mechanism and a driving mechanism and is respectively used for positioning the electronic device 80 in the machining process to ensure the stability of the spatial position of the electronic device, adjusting the spatial posture of the electronic device 80 and compensating the influence of the machining error and the positioning error of the electronic device on the machining precision.

The specific structure of the device and the principle of implementing continuous line etching can be understood by referring to the device for processing continuous graphs by laser, and the detailed description is omitted here.

In another embodiment of the present invention, there is provided a method of laser processing a continuous pattern, based on the apparatus for laser processing a continuous pattern described above, the method including the steps of:

determining preset positions of the workpiece 30 and the reflection unit 20 in a laser processing coordinate system, and acquiring space coordinates of target patterns of a first region to be processed 301 and a second region to be processed 302 of the workpiece 30 according to the preset positions of the workpiece 30 in the laser processing coordinate system;

setting the space coordinates of the target graph of the first area to be processed 301 of the workpiece 30 as the preset track coordinates of the first area to be processed 301; according to the spatial coordinates of the target graph of the second region to be processed 302 of the workpiece 30 and the preset position of the reflection unit 20 in the laser processing coordinate system, determining the spatial coordinates of the target graph of the second region to be processed 302 imaged through the reflection unit 20, and setting the imaged spatial coordinates as the preset track coordinates of the second region to be processed 302;

controlling the laser to be emitted to the first area to be processed 301 according to the preset track coordinate of the first area to be processed 301, to be emitted to the reflection unit 20 according to the preset track coordinate of the second area to be processed 302, and to be reflected to the second area to be processed 302 through the reflection unit 20;

the laser processing coordinate system is the processing coordinate system of the laser three-dimensional scanning unit 10, the first region to be processed 301 is adjacent to the second region to be processed 302, and the target patterns of the first region to be processed 301 and the second region to be processed 302 are continuous at the adjacent position of the two regions.

The laser processing coordinate system is used for identifying the position of the laser focus of the laser three-dimensional scanning unit 10 in the three-dimensional space, and the position of the laser focus in the three-dimensional space when the three-dimensional galvanometer is at the initial position is usually taken as the origin of coordinates. Presetting the coordinate of a certain point in a laser processing coordinate system in a laser three-dimensional scanning unit 10, controlling the laser to emit, and enabling a three-dimensional galvanometer to act in a matching way, so that the laser is projected to a position corresponding to the coordinate in a three-dimensional space to form a focus; if the track coordinates of a certain figure are preset, laser is projected to the position corresponding to each point coordinate on the figure track in the three-dimensional space to form a focus, and if the workpiece 30 is at the focus position, a corresponding target figure is formed on the workpiece 30.

In this embodiment, the preset positions of the workpiece 30 and the reflection unit 20 in the laser processing coordinate system are determined, that is, the theoretical positions of the workpiece 30 and the reflection unit 20 in the laser processing coordinate system are determined. In the process of determining the theoretical position, the spatial processing position of the laser three-dimensional scanning unit 10 and the data of the workpiece 30 and the reflection unit 20 can be unified to make the reference of the spatial processing position consistent, so that each subsequent parameter can be obtained; meanwhile, the relative position relationship among the laser three-dimensional scanning unit 10, the workpiece 30 and the reflection unit 20 can be determined to facilitate the installation of hardware facilities.

After the predetermined positions are determined, the spatial coordinates of the target patterns of the first to-be-processed area 301 and the second to-be-processed area 302 of the workpiece 30 in the laser processing coordinate system and the relative position parameters of the second to-be-processed area 302 of the workpiece 30 and the reflection unit 20 can be determined.

The workpiece 30 is usually provided with a calibration point for identifying the position of the workpiece 30, the position of the workpiece 30 in the laser processing coordinate system can be determined by determining the spatial coordinates of the calibration point of the workpiece 30 in the laser processing coordinate system, and the spatial coordinates of the target patterns of the first to-be-processed area 301 and the second to-be-processed area 302 of the workpiece 30 in the laser processing coordinate system can be obtained by combining the coordinates of the calibration point and the relative positions of the target patterns and the calibration point, wherein the positions of the target patterns of each to-be-processed area of the workpiece 30 relative to the calibration point of the workpiece 30 are known.

Similarly, the reflection unit 20 may also identify the preset position by the spatial coordinate of the index point on the reflector in the laser processing coordinate system, and after the preset position of the reflection unit 20 in the laser processing coordinate system is determined, the spatial coordinate of the target pattern of the second to-be-processed area 302 of the workpiece 30 in the laser processing coordinate system is combined to obtain the spatial coordinate of the target pattern of the second to-be-processed area 302 imaged by the reflection unit 20. Specifically, the formula of point symmetry about a plane can be used for solving, or the relative position parameters, including the included angle, the distance, and the like, between the second region to be processed 302 of the workpiece 30 and the reflection unit 20 can be obtained first, and then the coordinates of the image can be obtained according to the coordinates of the point and the relative position parameters.

In the control unit, the space coordinates of the target pattern of the first region to be processed 301 of the workpiece 30 are set as the preset track coordinates of the first region to be processed 301, and the laser is controlled to emit according to the preset track coordinates, so that the laser focal point falls on the first region to be processed 301 of the workpiece 30 to form the required target pattern.

In the control unit, the spatial coordinates of the target pattern of the second region to be processed 302 of the workpiece 30 imaged by the reflection unit 20 are set as the preset track coordinates of the second region to be processed 302, and the laser is controlled to emit according to the preset track coordinates, theoretically, the laser focus should fall to the spatial coordinate position imaged by the reflection unit 20, but in practice, the laser will be reflected by the reflection unit 20, and the position of the laser focus formed after reflection should be symmetrical with the spatial coordinate position imaged by the reflection unit 20 about the reflection unit 20, and the symmetrical position is exactly the position of the target pattern of the second region to be processed 302 of the workpiece 30. Therefore, by arranging the reflection unit 20 and matching with the smart setting of the preset track coordinates of the second region to be processed 302 of the workpiece 30, the laser can be projected to the region which cannot be directly focused and processed without turning over and repositioning the workpiece 30.

The target graphs used for calculating the preset track coordinates of the two areas to be processed are continuous at the area adjacency positions, namely the corresponding points of the two areas to be processed, which are positioned at the area adjacency positions, coincide, namely the corresponding points of the two areas to be processed, which are positioned at the area adjacency positions, have the same space coordinates. According to the mode, the coordinates of the track points are preset according to the space coordinates of the points, located at the adjacent positions, of the first area to be processed 301 and the second generation processing area, the laser is controlled to emit according to the coordinates of the preset track points of the two areas to be processed, the laser focuses should fall on the points, located at the adjacent positions, of the corresponding target graphs of the corresponding areas to be processed respectively, the positions of the corresponding points of the laser focuses at the adjacent positions of the two areas are overlapped, and therefore the continuity of the target graphs of the two areas to be processed is formed.

In actual processing, whether the laser focal points can be overlapped at the positions of corresponding points at the adjacent positions of the two areas completely depends on the precision of the three-dimensional galvanometer for controlling the laser focal point positions. The error requirement for continuous graphic processing in industrial application is usually about 50um, and the precision error of the three-dimensional galvanometer is less than 5um, so that the precision of the continuous graphic processing by using the method of the embodiment can be effectively ensured.

In a preferred embodiment, the method further comprises, before the step of controlling the emission of the laser, the steps of:

measuring the actual position of the workpiece 30 in the laser machining coordinate system;

calculating an error between the actual position and a preset position of the workpiece 30 in a laser processing coordinate system;

acquiring a correction parameter according to the error;

adjusting the posture of the workpiece 30 according to the correction parameter, or adjusting the preset track coordinates of the first to-be-processed area 301 and the second to-be-processed area 302 according to the correction parameter.

After the relative positions of the laser three-dimensional scanning unit 10, the reflection unit 20 and the workpiece 30 are determined and the preset track coordinates of each region to be processed are set according to the relative position relationship, batch processing can be performed on the same workpiece 30. However, in actual production, the workpiece 30 itself may have a certain machining error, and a positioning error may also exist when the workpiece 30 is positioned at its preset position, and the error can be effectively reduced by the correction step, so as to ensure the machining precision.

When different workpieces 30 are replaced and machined each time, firstly, the error between the actual position and the preset position of the workpiece 30 is obtained, then, the correction parameter is obtained according to the error, and the position compensation is carried out according to the correction parameter. The actual position of the workpiece 30 can be adjusted to an ideal position by adjusting the posture thereof, and the preset track coordinates of each region to be processed can also be adjusted to be matched with the actual position of the workpiece 30. After the position of the workpiece 30 is corrected, the laser emission is controlled to process, so that the actual processing precision is further ensured.

The actual position of the workpiece 30 in the laser processing coordinate system may be measured by CCD imaging, and the error between the actual position of the workpiece 30 and the preset position may include a position error in each direction of the three-dimensional space and an inclination angle error of the workpiece 30.

In a preferred embodiment, the predetermined positions of the workpiece 30 and the reflection unit 20 in the laser processing coordinate system can be determined by modeling, and the step of modeling to determine the predetermined positions specifically includes:

respectively establishing models of the workpiece 30 and the reflecting unit 20 in a laser processing coordinate system;

adjusting the position of the workpiece 30 model to enable the first area to be processed 301 of the workpiece 30 model to face the laser emitting direction and be located in the laser focus range;

adjusting the model position of the reflection unit 20 to make the image of the second region to be processed 302 of the model of the workpiece 30 in the model of the reflection unit 20 be located in the focal range of the laser;

translating or rotating the model of the reflecting unit 20 so that the model of the reflecting unit 20 does not interfere with the model of the workpiece 30;

the spatial coordinates of the model calibration point of the workpiece 30 in the laser processing coordinate system at this time are obtained to identify the preset position of the workpiece 30, and the spatial coordinates of the model calibration point of the reflecting unit 20 in the laser processing coordinate system at this time are obtained to identify the preset position of the reflecting unit 20.

The relative positions of the laser three-dimensional scanning unit 10, the reflection unit 20 and the workpiece 30 can be adjusted manually to satisfy the condition that the laser is directly irradiated or reflected to different surfaces to be processed, and then the positions of the workpiece 30 and the reflection unit 20 in the laser processing coordinate system can be obtained in a CCD shooting manner, so that various subsequent parameters can be obtained conveniently.

Compared with the mode, the modeling mode is more visual, and the acquisition of subsequent parameters is more convenient. For example, the target pattern on each surface to be processed of the workpiece 30 may be represented in the workpiece 30 model, and an image formed by the reflection unit 20 may be simulated according to the target pattern of the second region to be processed 302, so as to directly capture the coordinates of the image.

In another preferred embodiment, each target pattern to be processed includes lines, i.e. the target pattern is lines such as straight lines and curved lines, or the target pattern can be decomposed into multiple lines such as straight lines and curved lines. If the target patterns of the first to-be-processed region 301 and the second to-be-processed region 302 are to form continuous patterns, the lines respectively forming the two target patterns should form continuous lines correspondingly. To form a continuous pattern, the corresponding points of the target patterns of the first to-be-processed region 301 and the second to-be-processed region 302 at the region adjacency thereof should coincide, i.e., the end points of the lines constituting the target pattern of the first to-be-processed region 301 at the region adjacency coincide with the end points of the lines constituting the target pattern of the second to-be-processed region 302 at the region adjacency thereof.

Therefore, the processing of any continuous graph of each to-be-processed area can be realized as long as the processing of the continuous lines of each to-be-processed area is realized.

The following example is a specific application of the above method in the field of electronic devices 80. Based on the aforementioned etching apparatus for the conductive layer 84 of the electronic device 80, the present embodiment provides an etching method for the electronic device. The method comprises the following steps:

determining preset positions of the electronic device 80 and the reflection unit 20 in a laser processing coordinate system, and acquiring space coordinates of target etching lines 85 of a first area to be etched 86 and a second area to be etched 87 of the electronic device 80 according to the preset positions of the electronic device 80 in the laser processing coordinate system;

setting the space coordinate of the target etching line 85 of the first area to be etched 86 of the electronic device 80 as the preset track coordinate of the first area to be etched 86; according to the space coordinate of the target etching line 85 of the second region to be etched 87 of the electronic device 80 and the preset position of the reflection unit 20 in the laser processing coordinate system, determining the space coordinate of the target etching line 85 of the second region to be etched 87 imaged through the reflection unit 20, and setting the imaged space coordinate as the preset track coordinate of the second region to be etched 87;

controlling the laser to be emitted to the first area to be etched 86 according to the preset track coordinate of the first area to be etched 86, to be emitted to the reflecting unit 20 according to the preset track coordinate of the second area to be etched 87, and to be reflected to the second area to be etched 87 by the reflecting unit 20;

the laser processing coordinate system is the processing coordinate system of the laser three-dimensional scanning unit 10, the first region to be etched 86 is adjacent to the second region to be etched 87, and the end points of the target etching line 85 of the first region to be etched 86 and the second region to be etched 87 at the adjacent positions of the two regions coincide.

Typically, a plurality of lines 85 are etched in the conductive layer 84 of the electronic device 80 for processing purposes, so that the target pattern of each region to be etched is the target etched line 85.

Further, in order to ensure the processing accuracy and avoid the influence of the machining error and the positioning error of the workpiece 30 itself as much as possible, the posture or the preset trajectory coordinate of the workpiece 30 may be corrected before the laser beam is emitted for etching. The preset positions of the electronic device 80 and the reflection unit 20 in the laser processing coordinate system can be determined in a modeling manner, so that required parameters can be obtained through the model more intuitively and conveniently.

The specific etching method and principle can be understood by referring to the method for processing continuous patterns by laser, and the detailed description is omitted here.

For a better understanding of the present invention, the following description will be made by taking the process of etching the conductive layer 84 of the electronic device 80 as an example.

Referring to fig. 5-7, the electronic device 80 has three adjacent surfaces to be etched, a main etched surface 81, a first side etched surface 82, and a second side etched surface 83. The main etching surface 81 is opposite to the laser three-dimensional scanning unit, is positioned in the laser focus range of the laser three-dimensional scanning unit, and can be directly irradiated to the surface of the main etching surface by laser to be processed; the first side etching surface 82 and the second side etching surface 83 are respectively located at two sides of the main etching surface 81, and the laser cannot be directly irradiated to the surface thereof, so that reflectors are respectively arranged at the sides of the two side etching surfaces, so that the laser is reflected to the first side etching surface 82 through the first reflector 201 and reflected to the second side etching surface 83 through the second reflector 202.

Before processing, the control unit needs to first set track coordinates corresponding to the part of the lines to be etched distributed on each surface to be etched.

Referring to fig. 6 and 7, first, it is necessary to acquire the spatial coordinates of the etching line to be continued, including: the spatial coordinates of the starting position a and the ending position B of the line to be etched on the first side etched surface 82, the spatial coordinates of the starting position C and the ending position D of the line to be etched on the main etched surface 81, and the spatial coordinates of the starting position E and the ending position F of the line to be etched on the second side etched surface 83 are obtained.

Taking the first side etched surface 82 as an example, A, B points are the starting position point and the ending position point of the position to be processed on the first side etched surface 82, the positions of the starting position a and the ending position B on the electronic device 80 are obtained by design requirements, when the placing position of the electronic device 80 relative to the laser three-dimensional scanning unit and the reflector is determined, the laser origin and the calibration point of the electronic device 80 are calibrated under a laser processing coordinate system to realize the mapping relation between the point position on the electronic device 80 and the space coordinate of the laser processing coordinate system, and the space coordinate of the A, B point in the laser processing coordinate system can be obtained according to the mapping relation and the position data of the A, B point on the electronic device 80. According to the position of the first reflector 201 in the laser processing coordinate system, the space coordinates of the image points A1 and B1 formed by the two points A, B respectively relative to the first reflector 201 in the laser processing coordinate system can be obtained. When the three-dimensional galvanometer positions the focal points to A1 and B1, respectively, the laser is emitted to the first reflecting mirror 201 according to the angles corresponding to A1 and B1 and then reflected, and according to the reflection principle, the reflected focal points should fall on the points where the points A1 and B1 are symmetrical with respect to the first reflecting mirror 201, namely, the points a and B. Therefore, as long as the spatial coordinates of the A1 and the B1 are obtained, the accurate positioning and etching of the two points of the starting position a and the ending position B can be realized, and the spatial coordinates of the etching position point and the spatial coordinates of the corresponding imaging point are in one-to-one correspondence, so that the spatial coordinates of the A1 and the B1 are respectively used as the starting point and the ending point coordinates of the preset track, and the accurate etching of the path between the starting position a and the ending position B of the first side etching surface 82 can be satisfied, that is, in the control unit, the spatial coordinates of the A1 and the B1 are preset, and the laser can be controlled to emit according to the preset data to obtain the path to be etched.

Based on the above principle, the track coordinates of each line to be etched in the laser control unit can be preset according to the space coordinates. Taking the space coordinate of the line to be etched on the first side etching surface 82 imaged in the first reflector 201 as the preset track coordinate corresponding to the line to be etched on the first side etching surface 82; similarly, the spatial coordinates of the line to be etched on the second side etched surface 83 imaged in the second reflector 202 are taken as the preset track coordinates corresponding to the line to be etched on the second side etched surface 83. Since the main etched surface 81 can be directly irradiated by the laser, the spatial coordinates of the starting position C and the ending position D of the line to be etched on the main etched surface 81 can be directly used as the coordinates of the two end points of the corresponding preset track, and the laser is controlled to move and scan according to the preset track coordinates, so that the track from the starting position C to the ending position D can be obtained by etching.

Then, the batch processing link can be entered. For each electronic device 80, after the positioning is accurate, the laser can be controlled to emit according to the preset track coordinate for etching processing.

Controlling the laser focus to scan and move according to the coordinates of the image points A1 to B1, and forming a line to be etched from the initial position A to the end position B on the first side etching surface 82; controlling the laser focus to move according to the coordinate scanning of the points C to D, and forming a line to be etched from the initial position C to the end position D on the main etching surface 81; and controlling the laser focus to move according to the coordinate scanning of the image points E1 to F1, and forming a line to be etched from the starting position E to the ending position F on the second side etching surface 83. The concept of the start position and the end position is for convenience of understanding, and the actual processing procedure is not limited to the above-described order.

Wherein, the ending position B of the first side etching surface 82 and the starting position C of the main etching surface 81 are coincident in the design requirement of the electronic device, i.e. B, C have the same space coordinate; the end position D of the main etched surface 81 and the start position E of the second side etched surface 83 are coincident in the design requirement of the electronic device, i.e. two points D, E have the same spatial coordinates. By the method, the falling points of the laser focus at the adjacent position of the surface to be etched are superposed, so that a continuous etching line is formed. Thus, continuous etching can be achieved on three adjacent surfaces of the electronic device 80 to be etched without turning the mobile electronic device 80 over. The scanning movement of the laser is realized through the movement of the three-dimensional galvanometer, and the movement precision of the three-dimensional galvanometer is very high, so that the continuity of lines on different surfaces to be etched can be ensured.

If the traditional method is adopted, the first side etching surface 82 is required to be directly opposite to the laser for etching, after the etching is finished, the electronic device 80 is turned over, the main etching surface 81 is adjusted to be directly opposite to the laser for etching, after the etching is finished, the electronic device 80 is turned over again, and the second side etching surface 83 is adjusted to be directly opposite to the laser for etching. Because the mechanical structure precision is limited, in order to guarantee that the machining position on the current surface to be etched and the machining position on the last surface to be etched can be accurately aligned, after overturning, the workbench needs to be adjusted every time, the positioning precision is difficult to guarantee, and the production efficiency is also influenced.

In the whole etching process, the electronic device 80 does not need to be moved, the electronic device 80 only needs to be initially positioned once, the positioning difficulty is greatly reduced, the problem that a complex structure needs to be added due to the positioning problem is solved, the precision is ensured by the three-dimensional galvanometer and is irrelevant to a mechanical structure for auxiliary positioning; the processing precision is improved.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention are within the technical scope of the present invention.

Claims

1. A device for processing continuous graphs by laser is characterized by comprising a control unit, a laser three-dimensional scanning unit and a reflecting unit, wherein a workpiece is provided with a first region to be processed and a second region to be processed;

2. The apparatus for laser processing continuous graphics according to claim 1, wherein said workpiece comprises at least two adjacent faces to be processed, said faces to be processed comprising a main processing face and at least one side processing face, said first area to be processed being located on the main processing face, said second area to be processed being located on the side processing face;

3. The apparatus for laser processing a continuous pattern according to claim 2, wherein the reflection unit further comprises a position adjustment mechanism including a translation assembly or a first rotation assembly;

4. The apparatus for laser processing a continuous graphic according to any one of claims 1 to 3, further comprising a workpiece positioning unit including a workpiece positioning mechanism, a workpiece attitude adjusting mechanism, and a driving mechanism;

the control unit is connected with the driving mechanism and controls the driving mechanism to drive the workpiece attitude adjusting mechanism to act.

5. A method of laser machining a continuous pattern, comprising the steps of:

6. The method of laser processing a continuous graphic according to claim 5, further comprising, before the step of controlling laser emission, the steps of:

calculating the error between the actual position and the preset position of the workpiece in the laser processing coordinate system;

acquiring a correction parameter according to the error;

7. The method of claim 6, wherein the step of determining the preset positions of the workpiece and the reflecting unit in the laser processing coordinate system is implemented by modeling, and comprises:

and acquiring the space coordinate of the model calibration point of the workpiece in the laser processing coordinate system to identify the preset position of the workpiece, and acquiring the space coordinate of the model calibration point of the reflecting unit in the laser processing coordinate system to identify the preset position of the reflecting unit.

8. The method of any one of claims 5 to 7, wherein the pattern comprises lines, and the portions of the same line in the first region to be processed and the second region to be processed respectively comprise two end points, and the end points of the lines in the adjacent regions coincide.

9. An electronic device etching device is characterized by comprising a control unit, a laser three-dimensional scanning unit and a reflecting unit, wherein the electronic device is provided with a first to-be-etched area and a second to-be-etched area coated with a conductive layer, the laser three-dimensional scanning unit is arranged opposite to the first to-be-etched area, the first to-be-etched area is located in a laser focus range of the laser three-dimensional scanning unit, the reflecting unit is arranged beside the second to-be-etched area, and the second to-be-etched area is located in a focus range of laser reflected by the reflecting unit;

the control unit controls laser to be emitted to the first area to be etched by the laser three-dimensional scanning unit according to the preset track coordinate of the first area to be etched, and the laser is emitted by the laser three-dimensional scanning unit according to the preset track coordinate of the second area to be etched and then reflected to the second area to be etched by the reflecting unit;

the first area to be etched and the second area to be etched are adjacent, the preset track coordinate of the first area to be etched corresponds to the space coordinate of the target etching line of the first area to be etched, the preset track coordinate of the second area to be etched corresponds to the space coordinate of the target etching line of the second area to be etched imaged through the reflecting unit, and the end points of the target etching line of the first area to be etched and the end points of the target etching line of the second area to be etched at the adjacent positions of the two areas are superposed.

10. The electronic device etching apparatus of claim 9, wherein the electronic device has three adjacent surfaces to be etched, including a main etching surface, and a first side etching surface and a second side etching surface located on both sides of the main etching surface and adjacent to the main etching surface, respectively, the first region to be etched is located on the main etching surface, and the second region to be etched is located on the first side etching surface and the second side etching surface;

11. An electronic device etching method, comprising the steps of:

12. The electronic device etching method of claim 11, further comprising, before the step of controlling laser emission, the steps of:

acquiring a correction parameter according to the error;