CN115815821B

CN115815821B - Device and method for laser processing continuous pattern and etching device and method for electronic device

Info

Publication number: CN115815821B
Application number: CN202211573101.9A
Authority: CN
Inventors: 袁剑; 黎锦宁; 卢孙平; 朱建; 李善基
Original assignee: Shenzhen Mingchuang Intelligent Equipment Co ltd
Current assignee: Shenzhen Mingchuang Intelligent Equipment Co ltd
Priority date: 2022-12-08
Filing date: 2022-12-08
Publication date: 2023-08-11
Anticipated expiration: 2042-12-08
Also published as: CN115815821A

Abstract

The invention discloses a device and a method for processing continuous patterns by laser and an electronic device etching device and a method, and relates to the technical field of laser processing. The device comprises a control unit, a laser three-dimensional scanning unit and a reflecting unit, wherein the control unit controls laser to be emitted to a first area to be processed by the laser three-dimensional scanning unit according to preset track coordinates of the first area to be processed, emitted to a second area to be processed by the laser three-dimensional scanning unit according to preset track coordinates of the second area to be processed, and reflected to the second area to be processed by the reflecting unit; the preset track coordinates of the first to-be-processed area correspond to the space coordinates of the target graph of the first to-be-processed area, and the preset track coordinates of the second to-be-processed area correspond to the space coordinates of the target graph of the second to-be-processed area imaged by the reflecting unit. The machining process does not need to change the position of a workpiece, the laser scanning precision determines the machining precision, the precision is ensured, the cost is reduced, and the efficiency is improved.

Description

Device and method for laser processing continuous pattern and etching device and method for electronic device

Technical Field

The invention relates to the technical field of laser processing, in particular to a device and a method for processing continuous patterns by laser.

Background

In industrial applications, it is often desirable to achieve continuous patterning of different surfaces of a workpiece. The common practice is to first face one of the faces against the laser, process one section of the continuous pattern on that face, then turn the workpiece over a certain angle to make the second face against the laser, process the other section of the continuous pattern on the second face, and so on, and finally form the continuous pattern by stitching the patterns on the different faces.

However, the conventional splicing mode has high requirement on workpiece positioning accuracy, and the ideal splicing accuracy is difficult to realize by adopting a common mechanical structure to perform multiple-time moving positioning on the workpiece. In order to ensure the precision, the complexity of the mechanical structure is increased, so that the production cost is increased, and the complexity and the cost of the mechanical structure are more obvious especially for larger workpieces; meanwhile, in order to improve the accuracy, it is necessary to perform positional correction on each surface of the workpiece, and thus the production efficiency is affected.

Disclosure of Invention

Aiming at the defects existing in the prior art, the invention provides a device and a method for processing continuous patterns by laser, and an electronic device etching device and a method, which can reduce the complexity of a mechanical structure, reduce the production cost and improve the production efficiency while ensuring the processing precision.

In order to achieve the above purpose, the present invention adopts the following technical scheme:

the device for processing the continuous graph by the laser comprises a control unit, a laser three-dimensional scanning unit and a reflecting unit, wherein a workpiece is provided with a first area to be processed and a second area to be processed, the laser three-dimensional scanning unit and the first area to be processed are oppositely arranged, the first area to be processed is positioned in a laser focus range of the laser three-dimensional scanning unit, the reflecting unit is arranged beside the second area to be processed, and the second area to be processed is positioned in the focus range of the laser after being reflected by the reflecting unit;

the control unit controls laser to be emitted to the first region to be processed by the laser three-dimensional scanning unit according to preset track coordinates of the first region to be processed, and emitted to the second region to be processed by the laser three-dimensional scanning unit according to preset track coordinates of the second region to be processed, and then reflected to the second region to be processed by the reflecting unit;

the first to-be-processed area is adjacent to the second to-be-processed area, the preset track coordinate of the first to-be-processed area corresponds to the space coordinate of the target graph of the first to-be-processed area, the preset track coordinate of the second to-be-processed area corresponds to the space coordinate of the target graph of the second to-be-processed area imaged by the reflecting unit, and the target graph of the first to-be-processed area and the target graph of the second to-be-processed area are continuous at the adjacent positions of the two areas.

As a preferred scheme, the workpiece comprises at least two adjacent surfaces to be processed, wherein the surfaces to be processed comprise a main processing surface and at least one side processing surface, the first area to be processed is positioned on the main processing surface, and the second area to be processed is positioned on the side processing surface;

the reflecting unit comprises at least one reflecting mirror, each reflecting mirror is arranged corresponding to each side processing surface and is positioned beside each side processing surface, and the reflecting unit is used for reflecting laser to the corresponding side processing surface of each reflecting mirror.

As a preferred aspect, the reflection unit further includes a position adjustment mechanism including a translation assembly or a first rotation assembly;

the translation component is used for driving the reflector to translate relative to the corresponding side processing surface, and the first rotation component is used for driving the reflector to rotate relative to the corresponding side processing surface;

the mirror is fixed to either the translation assembly or the first rotation assembly.

As a preferable scheme, the device further comprises a workpiece positioning unit, wherein the workpiece positioning unit comprises a workpiece positioning mechanism, a workpiece posture adjusting mechanism and a driving mechanism;

The workpiece posture adjusting mechanism comprises a three-dimensional translation assembly and a second rotating assembly arranged on the three-dimensional translation assembly;

the workpiece is fixed on the second rotating assembly through a workpiece positioning mechanism;

the control unit is connected with the driving mechanism and controls the driving mechanism to drive the workpiece posture adjusting mechanism to act.

A method of laser processing a continuous pattern comprising the steps of:

determining preset positions of the workpiece and the reflecting unit in a laser processing coordinate system, and acquiring space coordinates of target patterns of a first region to be processed and a second region to be processed of the workpiece according to the preset positions of the workpiece in the laser processing coordinate system;

setting the space coordinates of a target graph of a first area to be processed of the workpiece as preset track coordinates of the first area to be processed; determining the space coordinates of the target pattern of the second region to be processed imaged by the reflecting unit according to the space coordinates of the target pattern of the second region to be processed of the workpiece and the preset position of the reflecting unit in the laser processing coordinate system, and setting the imaged space coordinates as the preset track coordinates of the second region to be processed;

controlling laser to emit to a first region to be processed according to preset track coordinates of the first region to be processed, emit to a reflecting unit according to preset track coordinates of a second region to be processed, and reflect to the second region to be processed through the reflecting unit;

The laser processing coordinate system is a processing coordinate system of a laser three-dimensional scanning unit, the first area to be processed is adjacent to the second area to be processed, and target patterns of the first area to be processed and the second area to be processed are continuous at the adjacent positions of the two areas.

As a preferable mode, before the step of controlling the laser emission, the method further comprises the steps of:

measuring the actual position of the workpiece in a laser processing coordinate system;

calculating the error between the actual position and the preset position of the workpiece in a laser processing coordinate system;

acquiring correction parameters according to the errors;

and adjusting the workpiece gesture according to the correction parameter, or adjusting preset track coordinates of the first to-be-processed area and the second to-be-processed area according to the correction parameter.

As a preferred solution, the step of determining the preset positions of the workpiece and the reflecting unit in the laser processing coordinate system is implemented through modeling, and includes:

respectively establishing a model of the workpiece and the reflecting unit in a laser processing coordinate system;

adjusting the position of the workpiece model to enable a first to-be-processed area of the workpiece model to face the laser emergent direction and be positioned in the laser focus range;

adjusting the position of the reflecting unit model to enable an image of a second to-be-processed area of the workpiece model in the reflecting unit model to be positioned in the laser focus range;

Translating or rotating the reflection unit model to enable the reflection unit model not to interfere with the workpiece model;

and acquiring the space coordinates of the workpiece model calibration point in the laser processing coordinate system at the moment to identify the preset position of the workpiece, and acquiring the space coordinates of the reflecting unit model calibration point in the laser processing coordinate system at the moment to identify the preset position of the reflecting unit.

As a preferable scheme, the graph comprises lines, the parts of the same line, which are respectively positioned in the first area to be processed and the second area to be processed, comprise two end points, and the end points of the lines, which are positioned at the adjacent positions of the areas, are coincident.

The electronic device etching device comprises a control unit, a laser three-dimensional scanning unit and a reflecting unit, wherein the electronic device is provided with a first area to be etched and a second area to be etched, the first area to be etched is arranged opposite to the first area to be etched, the first area to be etched is positioned in a laser focus range of the laser three-dimensional scanning unit, the reflecting unit is arranged beside the second area to be etched, and the second area to be etched is positioned in the focus range of the laser after being reflected by the reflecting unit;

the control unit controls laser to be emitted to the first region to be etched from the laser three-dimensional scanning unit according to preset track coordinates of the first region to be etched, and reflected to the second region to be etched by the reflecting unit after being emitted from the laser three-dimensional scanning unit according to preset track coordinates of the second region to be etched;

The first region to be etched is adjacent to the second region to be etched, the preset track coordinates of the first region to be etched correspond to the space coordinates of the target etching lines of the first region to be etched, the preset track coordinates of the second region to be etched correspond to the space coordinates of the target etching lines of the second region to be etched imaged by the reflecting unit, and the end points of the target etching lines of the first region to be etched and the target etching lines of the second region to be etched are overlapped at the adjacent positions of the two regions.

As a preferred scheme, the electronic device is provided with three adjacent surfaces to be etched, including a main etching surface, and a first side etching surface and a second side etching surface which are respectively adjacent to the main etching surface and are positioned at two sides of the main etching surface, wherein the first area to be etched is positioned on the main etching surface, and the second area to be etched is positioned on the first side etching surface and the second side etching surface;

the reflecting unit comprises a first reflecting mirror and a second reflecting mirror, wherein the first reflecting mirror is positioned beside the first side-etched facet and is used for reflecting laser to the first side-etched facet, and the second reflecting mirror is positioned beside the second side-etched facet and is used for reflecting laser to the second side-etched facet.

An electronic device etching method comprising the steps of:

determining preset positions of the electronic device and the reflecting unit in a laser processing coordinate system, and acquiring space coordinates of target etching lines of a first region to be etched and a second region to be etched of the electronic device according to the preset positions of the electronic device in the laser processing coordinate system;

setting the space coordinates of a target etching line of a first area to be etched of the electronic device as preset track coordinates of the first area to be etched; determining the space coordinates of the target etching line of the second area to be etched through imaging of the reflecting unit according to the space coordinates of the target etching line of the second area to be etched of the electronic device and the preset position of the reflecting unit in the laser processing coordinate system, and setting the imaged space coordinates as the preset track coordinates of the second area to be etched;

controlling laser to emit to the first region to be etched according to preset track coordinates of the first region to be etched, emit to the reflecting unit according to preset track coordinates of the second region to be etched, and reflect to the second region to be etched through the reflecting unit;

the laser processing coordinate system is a processing coordinate system of a laser three-dimensional scanning unit, the first area to be etched is adjacent to the second area to be etched, and end points of target etching lines of the first area to be etched and the second area to be etched are overlapped at the adjacent positions of the two areas.

measuring the actual position of the electronic device in a laser machining coordinate system;

calculating the error between the actual position and the preset position of the electronic device in the laser processing coordinate system;

acquiring correction parameters according to the errors;

and adjusting the gesture of the electronic device according to the correction parameter, or adjusting preset track coordinates of the first area to be etched and the second area to be etched according to the correction parameter.

Compared with the prior art, the invention has obvious advantages and beneficial effects, in particular, when each area to be processed of the workpiece cannot be simultaneously in the laser processing range, a certain area to be processed of the workpiece is positioned in the laser focus range of the laser three-dimensional scanning unit by arranging the laser three-dimensional scanning unit and the reflecting unit, and the laser of the laser three-dimensional scanning unit is emitted according to the preset track corresponding to the target pattern of the area to be processed, so that the laser can fall to the area to be processed to form the target pattern; the laser of the laser three-dimensional scanning unit is emitted according to a preset track corresponding to the imaging of the target pattern of the other area to be processed through the reflecting unit, and then the target pattern is reflected to the other area to be processed of the workpiece through the reflecting unit, and the target pattern and the image formed by the reflecting unit are symmetrical relative to the reflecting unit, wherein the laser emitting track corresponds to the imaging of the reflecting unit, but can not reach the position of the image actually, but can be reflected to the symmetrical position of the image relative to the reflecting unit through the reflecting unit, so that the position actually reached by the laser after being reflected by the reflecting unit is the target pattern position of the other area to be processed, and the target pattern of the other area to be processed can be processed and formed. When the areas to be processed are adjacent, and the target patterns corresponding to the preset tracks of the areas to be processed are overlapped at the corresponding points of the adjacent positions of the areas, the overlapping of the landing points of the laser at the adjacent positions of the two areas can be ensured, so that the patterns of the two areas are continuous.

By adopting the scheme, the continuous graph processing of different areas to be processed of the workpiece can be realized by additionally arranging the reflecting unit and combining with ingenious arrangement of laser preset tracks of different areas to be processed. The workpiece position does not need to be changed in the processing process, so that the processing precision is not dependent on a mechanical structure for assisting the workpiece to move and position, but only on the motion precision of the three-dimensional vibrating mirror in the laser three-dimensional scanning unit. The three-dimensional vibrating mirror has high accuracy, so that the machining accuracy is effectively ensured; meanwhile, the requirement on a mechanical structure is reduced, and the cost can be reduced; the processing process does not need to change the position of the workpiece, so that the time required by correcting the position for multiple times can be saved, and the production efficiency is improved.

Drawings

FIG. 1 is a schematic view of an apparatus for laser processing a continuous pattern according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a laser three-dimensional scanning unit according to an embodiment of the invention;

FIG. 3 is a schematic view of a focal range of a laser three-dimensional scanning unit according to an embodiment of the present invention;

FIG. 4 is a schematic view of a region to be processed of a workpiece according to an embodiment of the invention;

FIG. 5 is a schematic diagram of an electronic device according to an embodiment of the invention;

FIG. 6 is a schematic diagram illustrating an etching principle of a conductive layer of an electronic device according to an embodiment of the present invention;

Fig. 7 is an enlarged view at M in fig. 6.

Reference numerals illustrate:

10. the laser three-dimensional scanning device comprises a laser three-dimensional scanning unit, a laser, a 102 XY galvanometer, a 103 beam expander, a 104 focusing mirror and a 105 focal plane; 20. a reflecting unit 201, a first reflecting mirror 202, a second reflecting mirror 203, and a position adjusting mechanism; 30. a workpiece 301, a first region to be machined 302, a second region to be machined; 80. electronic device 81. Main etched facet, 82. First side etched facet, 83. Second side etched facet, 84. Conductive layer, 85. Etched line, 86. First area to be etched, 87. Second area to be etched.

Detailed Description

In order to more clearly illustrate the present invention, the following detailed description is made with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1, in an embodiment of the present invention, an apparatus for laser processing a continuous pattern includes a control unit, a laser three-dimensional scanning unit 10 and a reflection unit 20, wherein a workpiece 30 is provided with a first area to be processed 301 and a second area to be processed 302, the laser three-dimensional scanning unit 10 is disposed opposite to the first area to be processed 301, the first area to be processed 301 is located in a laser focal range of the laser three-dimensional scanning unit 10, the reflection unit 20 is disposed beside the second area to be processed 302, and the second area to be processed 302 is located in the focal range of the laser after being reflected by the reflection unit 20; the control unit controls the laser to be emitted to the first to-be-processed area 301 by the laser three-dimensional scanning unit 10 according to the preset track coordinates of the first to-be-processed area 301, and to be reflected to the second to-be-processed area 302 by the reflecting unit 20 after being emitted by the laser three-dimensional scanning unit 10 according to the preset track coordinates of the second to-be-processed area 302; the first to-be-processed area 301 and the second to-be-processed area 302 are adjacent, the preset track coordinates of the first to-be-processed area 301 correspond to the space coordinates of the target pattern of the first to-be-processed area 301, the preset track coordinates of the second to-be-processed area 302 correspond to the space coordinates of the target pattern of the second to-be-processed area 302 imaged by the reflecting unit 20, and the target pattern of the first to-be-processed area 301 and the target pattern of the second to-be-processed area 302 are continuous at the adjacent positions of the two areas.

The laser three-dimensional scanning unit 10 has a mature configuration, and referring to fig. 2, the laser three-dimensional scanning unit includes a laser 101, a three-dimensional galvanometer and a focusing mirror 104, wherein the laser generated by the laser 101 adjusts an emergent angle through the three-dimensional galvanometer, and is focused to a target position through the focusing mirror 104.

The control unit is usually an industrial computer, a preset track according to which laser scanning is performed is internally set, and different points on the preset track correspond to different target positions of laser focusing, so that the preset track actually corresponds to coordinates of different focus positions. The industrial computer is matched with the data conversion interface to control the three-dimensional vibrating mirror to act according to the preset track of the laser, so that the laser is controlled to emit according to angles corresponding to points with different coordinates on the preset track, and a processing track is formed.

The three-dimensional galvanometer comprises an XY galvanometer 102 and a beam expander 103, the XY galvanometer 102 can adjust the laser focus to fall at any position in the scope of the galvanometer travel on the XY plane, and the XY plane in the scope is generally called a laser focal plane 105; the position of the laser focus in the range of travel of the beam expander 103 in the Z direction, namely the position of the focal plane 105 in the Z direction, can be adjusted by moving the beam expander 103. The XY galvanometer 102 cooperates with the beam expander 103 to realize any coordinate position of the laser focus in a certain range of the XYZ three-dimensional space, and the specific range is determined by the strokes of the XY galvanometer 102 and the beam expander 103. As shown in fig. 3: L1D1 is the focal plane 105 of the laser at the upper limit of travel in the Z direction, L5D5 is the focal plane 105 of the laser at the lower limit of travel in the Z direction, and the laser focus may fall at any coordinate position within the spatial range contained in both the L1D1 and L5D5 planes.

Although the laser three-dimensional scanning unit 10 can realize any adjustment of the laser focal point in a three-dimensional space with a certain range, when each area to be processed of the workpiece 30 cannot be simultaneously located in a laser processable range, for example, each area to be processed is located on a different area to be processed of the workpiece 30, a certain area to be processed is blocked by another area to be processed or a certain area to be processed is parallel to the central beam of the laser so that the laser cannot directly emit to the area to be processed, or each area to be processed is located on the same area to be processed of the workpiece 30, but a certain area to be processed is blocked by another area to be processed so that the laser cannot directly emit to the area to be processed, which can be seen in fig. 4, at this time, the laser three-dimensional scanning unit 10 cannot simultaneously realize processing of each area to be processed.

In this embodiment, the reflection unit 20 is added to the laser three-dimensional scanning unit 10, so that each area to be processed of the workpiece 30 is divided into a first area to be processed 301 and a second area to be processed 302 according to whether the laser can be directly irradiated or not, as shown in fig. 4. Referring to fig. 1, the workpiece 30 is disposed such that the first to-be-processed area 301 is opposite to the laser three-dimensional scanning unit 10, that is, the first to-be-processed area 301 faces the laser emitting direction of the laser three-dimensional scanning unit 10, and the first to-be-processed area 301 is located in the laser focal range of the laser three-dimensional scanning unit 10, so that the laser of the laser three-dimensional scanning unit 10 can directly fall into the first to-be-processed area 301 after being emitted, and the laser is controlled to emit according to a preset track corresponding to the spatial coordinates of the target pattern of the first to-be-processed area 301, so that the laser focal point can fall into the target pattern position of the first to-be-processed area 301, thereby processing the target pattern of the area. The second area to be processed 302 of the workpiece 30 is located in the focal range of the laser light reflected by the reflecting unit 20, that is, the focal point formed by the laser light reflected by the reflecting unit 20 of the laser three-dimensional scanning unit 10 can fall to the second area to be processed 302, the laser light is controlled to be emitted according to the preset track corresponding to the space coordinates of the target pattern of the second area to be processed 302 imaged by the reflecting unit 20, and the target pattern of the second area to be processed 302 and the image formed by the reflecting unit 20 are symmetrical about the reflecting unit 20, and the laser light emitting track corresponds to the space coordinates imaged by the reflecting unit 20, but the laser light can not actually reach the position of the image, but can be reflected by the reflecting unit 20 to the symmetrical position of the image about the reflecting unit 20, namely the target pattern position of the second area to be processed 302, so that the focal point of the laser light reflected by the reflecting unit 20 actually falls to the target pattern position of the second area to be processed 302, and the corresponding target pattern can be processed in the second area to be processed 302.

When the first to-be-processed area 301 is adjacent to the second to-be-processed area 302, the continuity of the patterns of the two areas obtained by the laser processing can be ensured as long as the continuity of the target patterns corresponding to the preset tracks of the two to-be-processed areas is ensured at the adjacent positions of the areas. The laser is focused on the surface of the workpiece 30 to form a processing trace, the processing trace is actually a point set formed in space after the laser focus is scanned by the three-dimensional galvanometer, therefore, the minimum unit of the laser processing pattern is a point, the target patterns corresponding to the preset trace of the two areas to be processed are continuous at the adjacent positions of the areas, and the corresponding points of the target patterns at the adjacent positions of the areas are overlapped.

According to the embodiment, continuous graph processing of different areas to be processed of the workpiece 30 is realized, the position of the workpiece 30 does not need to be changed, so that a mechanical structure for assisting in moving and positioning of the workpiece 30 does not need to be introduced, errors of the mechanical structure are avoided, and once the device structure is set, the processing precision is only dependent on the precision of the three-dimensional vibrating mirror. The XY galvanometer 102 and the beam expander 103 of the three-dimensional galvanometer are driven by a precision servo motor, so that the precision is very high, the positioning precision error can reach below 5um, and the precision error of a mechanical structure used for assisting the movement and positioning of the workpiece 30 is usually more than 100 um. While the precision is ensured, the mechanical structure for assisting the movement and positioning of the workpiece 30 is not required to be introduced, so that the cost can be reduced; because the position of the workpiece 30 is not required to be changed in the processing process, the time required for correcting the position for a plurality of times can be saved, and the production efficiency can be improved.

In addition, the reflection unit 20 is arranged independently of the laser three-dimensional scanning unit 10, so that the whole device can be flexibly applicable to various different workpieces 30, and the compatibility is higher. The location of the distribution of the areas to be machined will also vary for different workpieces 30. Referring to fig. 4, the first area to be machined 301 and the second area to be machined 302 may be areas respectively located on different surfaces to be machined of the workpiece 30, or may be different areas located on the same surface to be machined of the workpiece 30. Regardless of the distribution of the positions of the areas to be processed, the reflecting unit 20 is provided at an appropriate position with respect to the laser three-dimensional scanning unit 10 and the workpiece 30, with reference to the following preferred embodiments.

In the preferred embodiment, the workpiece 30 includes at least two adjacent surfaces to be machined, the surfaces to be machined including a main machining surface and at least one side machining surface, the first region 301 to be machined being located on the main machining surface, the second region 302 to be machined being located on the side machining surface; correspondingly, the reflecting unit 20 includes at least one reflecting mirror, each reflecting mirror is disposed corresponding to each side processing surface, and is located beside each side processing surface, and is used for reflecting the laser light onto the corresponding side processing surface of each reflecting mirror.

Referring to fig. 1 and 4, the workpiece 30 includes two adjacent surfaces to be machined, a main machining surface and a side machining surface, a first area to be machined 301 is located on the main machining surface, and a second area to be machined 302 is located on the side machining surface; the reflecting unit 20 includes a reflecting mirror disposed corresponding to the side processing surface and located beside the side processing surface for reflecting the laser light onto the side processing surface.

Alternatively, the workpiece 30 includes three adjacent surfaces to be machined, a main machining surface and two side machining surfaces, which are a first side machining surface and a second side machining surface, respectively, the first side machining surface and the second side machining surface are located at two sides of the main machining surface, respectively, and are adjacent to the main machining surface, the first area to be machined 301 is located on the main machining surface, and the second area to be machined 302 is located on the two side machining surfaces, respectively; the reflecting unit 20 includes a first reflecting mirror 201 and a second reflecting mirror 202, where the first reflecting mirror 201 is disposed corresponding to the first side processing surface and is located beside the first side processing surface for reflecting the laser beam onto the first side processing surface, and the second reflecting mirror 202 is disposed corresponding to the second side processing surface and is located beside the second side processing surface for reflecting the laser beam onto the second side processing surface.

In a preferred embodiment, the reflection unit 20 further comprises a position adjustment mechanism 203, the position adjustment mechanism 203 comprising a translation assembly or a first rotation assembly; the translation component is used for driving the reflector to translate relative to the corresponding side processing surface, and the first rotation component is used for driving the reflector to rotate relative to the corresponding side processing surface; the mirror is fixed on the translation assembly or the first rotation assembly.

The translation assembly adopts a combined structure of a screw rod and a sliding block, can be manually adjusted or driven by a motor, and is used for adjusting the distance between the reflecting mirror and the corresponding side processing surface; the first rotating component adopts a turntable structure, can be manually adjusted or driven by a motor and is used for adjusting the included angle between the reflecting mirror and the corresponding side processing surface. By the arrangement of the structure, the position of the reflecting mirror is convenient to adjust before processing.

In another preferred embodiment, the device further comprises a workpiece 30 positioning unit, wherein the workpiece 30 positioning unit comprises a workpiece 30 positioning mechanism, a workpiece 30 posture adjustment mechanism and a driving mechanism; the workpiece 30 posture adjustment mechanism comprises a three-dimensional translation assembly and a second rotation assembly arranged on the three-dimensional translation assembly; the workpiece 30 is fixed on the second rotating assembly through a workpiece 30 positioning mechanism; the control unit is connected with the driving mechanism and controls the driving mechanism to drive the gesture adjusting mechanism of the workpiece 30 to act.

The workpiece 30 positioning mechanism is designed according to the specific workpiece 30 for positioning the workpiece 30 during processing to ensure stability of its spatial position. The workpiece 30 posture adjustment mechanism is used for adjusting the positions of the workpiece 30 in each dimension in the three-dimensional space to be located at an ideal machining position so as to compensate the machining errors of the workpiece 30 and the influence of the positioning errors of the workpiece 30 on the machining precision. The second rotating assembly may be configured to rotate on a single axis or two axes depending on the particular positioning requirements of the workpiece 30. The three-dimensional translation assembly adopts a superposed screw rod and sliding block combined structure, and the second rotation assembly adopts a rotary table or a combined structure thereof. The driving mechanism comprises a motor, the motor is driven by the motor, the motor is connected with the control unit, the control unit controls the motor to act, and the workpiece 30 posture adjusting mechanism is driven to adjust the posture of the workpiece 30.

The following examples are specific applications of the above-described apparatus in the field of electronic devices 80.

Referring to fig. 5, the electronic device 80 is often coated with a complete conductive layer 84 on the surface of the substrate prior to processing into a finished product, and certain portions of the conductive layer 84 are etched away by a laser according to its circuit design configuration, leaving the remaining portions that form the paths of the desired circuit. The conductive layer 84 may be applied to multiple sides of the substrate and continuous lines may need to be etched on the multiple sides to achieve the vias for the multiple sides. Errors in any of the lines may cause the whole circuit to fail to operate normally, so that the precision requirement for continuous etching is high. The conventional processing method has the defects, and particularly for larger devices such as display screens, in order to meet the precision requirements, a marble processing platform with high stability, a precise mechanical transmission structure and the like are required to be configured, so that the device has high complexity, large volume and high cost.

In order to solve the above-mentioned problems, the present embodiment provides an etching apparatus for an electronic device, including a control unit, a laser three-dimensional scanning unit 10 and a reflection unit 20, wherein the electronic device 80 is provided with a first area to be etched 86 and a second area to be etched 87 coated with a conductive layer 84, the laser three-dimensional scanning unit 10 is disposed opposite to the first area to be processed 301, the first area to be etched 86 is located in a laser focal range of the laser three-dimensional scanning unit 10, the reflection unit 20 is disposed beside the second area to be etched 87, and the second area to be etched 87 is located in the focal range of the laser after being reflected by the reflection unit 20; the control unit controls the laser to be emitted to the first area to be etched 86 from the laser three-dimensional scanning unit 10 according to the preset track coordinates of the first area to be etched 86, and to be reflected to the second area to be etched 87 from the reflecting unit 20 after being emitted from the laser three-dimensional scanning unit 10 according to the preset track coordinates of the second area to be etched 87; the first region to be etched 86 and the second region to be etched 87 are adjacent, the preset track coordinates of the first region to be etched 86 correspond to the space coordinates of the target etching line 85 of the first region to be etched 86, the preset track coordinates of the second region to be etched 87 correspond to the space coordinates of the target etching line 85 of the second region to be etched 87 imaged by the reflecting unit 20, and the end points of the target etching line 85 of the first region to be etched 86 and the target etching line 85 of the second region to be etched 87 at the adjacent positions of the two regions coincide.

Specifically, the electronic device 80 may have two adjacent facets to be etched, or three adjacent facets to be etched. Taking three adjacent etched facets as an example, the reflective unit 20 is provided as follows.

Referring to fig. 5-7, the electronic device 80 includes a main etched surface 81, and a first side etched facet 82 and a second side etched facet 83 located on both sides of the main etched surface 81 and respectively adjacent to the main etched surface 81, a first region 86 to be etched is located on the main etched surface 81, and a second region 87 to be etched is located on the first side etched surface 82 and the second side etched facet 83, respectively; the reflection unit 20 includes a first mirror 201 and a second mirror 202, the first mirror 201 is located beside the first side etching surface 82 for reflecting the laser light onto the first side etching surface 82, and the second mirror 202 is located beside the second side etching surface 83 for reflecting the laser light onto the second side etching surface 83.

Furthermore, the position adjusting structure can be arranged to adjust the position of the reflecting mirror before processing; the workpiece 30 positioning unit is provided and comprises a workpiece 30 positioning mechanism, a workpiece 30 posture adjusting mechanism and a driving mechanism, and is respectively used for positioning the electronic device 80 in the machining process so as to ensure the stability of the spatial position of the electronic device 80 and adjusting the spatial posture of the electronic device 80 to compensate the machining error of the electronic device and the influence of the positioning error on the machining precision.

The specific structure of the device and the principle of implementing continuous line etching can be understood by referring to the device for processing continuous patterns by laser, and will not be described herein.

In another embodiment of the present invention, based on the apparatus for laser processing a continuous pattern as described above, there is provided a method for laser processing a continuous pattern, the method comprising the steps of:

determining preset positions of the workpiece 30 and the reflecting unit 20 in a laser processing coordinate system, and acquiring space coordinates of target patterns of a first to-be-processed area 301 and a second to-be-processed area 302 of the workpiece 30 according to the preset positions of the workpiece 30 in the laser processing coordinate system;

setting the space coordinates of the target pattern of the first region 301 to be processed of the workpiece 30 as preset track coordinates of the first region 301 to be processed; determining the space coordinates of the target pattern of the second to-be-processed area 302 of the workpiece 30 imaged by the reflecting unit 20 according to the space coordinates of the target pattern of the second to-be-processed area 302 of the workpiece 30 and the preset position of the reflecting unit 20 in the laser processing coordinate system, and setting the imaged space coordinates as the preset track coordinates of the second to-be-processed area 302;

controlling laser to emit to the first to-be-processed area 301 according to preset track coordinates of the first to-be-processed area 301, emit to the reflecting unit 20 according to preset track coordinates of the second to-be-processed area 302, and reflect to the second to-be-processed area 302 through the reflecting unit 20;

The laser processing coordinate system is a processing coordinate system of the laser three-dimensional scanning unit 10, the first area to be processed 301 is adjacent to the second area to be processed 302, and the target patterns of the first area to be processed 301 and the second area to be processed 302 are continuous at the adjacent positions of the two areas.

The laser processing coordinate system is used to identify the position of the laser focus of the laser three-dimensional scanning unit 10 in three-dimensional space, and the position of the laser focus in three-dimensional space when the three-dimensional galvanometer is at the initial position is generally taken as the origin of coordinates. Presetting a coordinate of a certain point in a laser processing coordinate system in a laser three-dimensional scanning unit 10, controlling laser emission, and enabling a three-dimensional galvanometer to perform a cooperation action so as to enable laser to be projected to a position corresponding to the coordinate in a three-dimensional space to form a focus; if the track coordinates of a certain pattern are preset, laser is projected to the position corresponding to each point coordinate on the track of the pattern in the three-dimensional space to form a focus, and if the workpiece 30 is at the focus position, a corresponding target pattern is formed on the workpiece 30.

In the present embodiment, the preset positions of the workpiece 30 and the reflecting unit 20 in the laser processing coordinate system are determined, that is, the theoretical positions of the workpiece 30 and the reflecting unit 20 in the laser processing coordinate system are determined. The process of determining the theoretical position can unify the spatial processing position of the laser three-dimensional scanning unit 10 and the data of the workpiece 30 and the reflecting unit 20 to make the reference consistent so as to obtain various subsequent parameters; meanwhile, the relative positional relationship of the laser three-dimensional scanning unit 10, the workpiece 30 and the reflection unit 20 can be determined, so that the installation of hardware facilities is facilitated.

After the above-mentioned predetermined positions are determined, the spatial coordinates of the target patterns of the first to-be-processed area 301 and the second to-be-processed area 302 of the workpiece 30 in the laser processing coordinate system and the relative position parameters of the second to-be-processed area 302 of the workpiece 30 and the reflection unit 20 can be determined.

The workpiece 30 is generally provided with a calibration point for identifying the position of the workpiece 30, the position of the workpiece 30 in the laser processing coordinate system can be determined by determining the spatial coordinates of the calibration point of the workpiece 30 in the laser processing coordinate system, the positions of the target patterns of the regions to be processed of the workpiece 30 relative to the calibration point of the workpiece 30 are known, and the spatial coordinates of the target patterns of the first region to be processed 301 and the second region to be processed 302 of the workpiece 30 in the laser processing coordinate system can be obtained by combining the coordinates of the calibration point and the relative positions of the target patterns and the calibration point.

Similarly, the preset position of the reflecting unit 20 can be identified by the spatial coordinates of the calibration point on the reflecting mirror in the laser processing coordinate system, and after the preset position of the reflecting unit 20 in the laser processing coordinate system is determined, the spatial coordinates of the target pattern of the second region to be processed 302 of the workpiece 30 in the laser processing coordinate system can be combined with the spatial coordinates of the target pattern of the second region to be processed 302 in the laser processing coordinate system, so that the spatial coordinates of the target pattern of the second region to be processed 302 imaged by the reflecting unit 20 can be obtained. Specifically, the relative position parameters of the second region 302 to be processed of the workpiece 30 and the reflecting unit 20, including the included angle, the distance, etc., may be obtained by using a formula of point symmetry with respect to the plane, and then the coordinates of the image may be obtained according to the coordinates of the point and the relative position parameters.

In the control unit, the spatial coordinates of the target pattern of the first to-be-processed area 301 of the workpiece 30 are set as the preset track coordinates of the first to-be-processed area 301, and the laser is controlled to emit according to the preset track coordinates, so that the laser focal point falls to the first to-be-processed area 301 of the workpiece 30 to form the required target pattern.

In the control unit, the spatial coordinates of the target pattern of the second area to be processed 302 of the workpiece 30 imaged by the reflecting unit 20 are set as the preset track coordinates of the second area to be processed 302, and the laser is controlled to emit according to the preset track coordinates, theoretically, the laser focus should fall to the spatial coordinate position of the target pattern of the reflecting unit 20, but in reality, the laser is reflected by the reflecting unit 20, and the position of the laser focus formed after reflection should be symmetrical to the spatial coordinate position of the target pattern of the second area to be processed 302 of the workpiece 30 with respect to the reflecting unit 20. Therefore, by arranging the reflecting unit 20 and matching with the smart setting of the preset track coordinates of the second region to be processed 302 of the workpiece 30, the laser can be projected to the region which cannot be directly focused and processed originally, without turning over and repositioning the workpiece 30.

The target patterns for calculating the preset track coordinates of the two areas to be processed are continuous at the adjacent positions of the areas, namely, the corresponding points of the target patterns of the two areas to be processed at the adjacent positions of the areas coincide, namely, the corresponding points of the target patterns of the two areas to be processed at the adjacent positions of the areas have the same space coordinates. According to the above manner, the laser is controlled to emit according to the preset track point coordinates of the two areas to be processed, respectively, according to the preset track point coordinates of the points of the first area to be processed 301 and the second area to be processed at the adjacent positions, respectively, so that the laser focuses should fall onto the points of the target patterns of the corresponding areas to be processed at the adjacent positions, respectively, to realize the overlapping of the positions of the corresponding points of the laser focuses at the adjacent positions of the two areas, thereby forming the continuity of the target patterns of the two areas to be processed.

In actual processing, whether the laser focus can be overlapped at the position of the corresponding point at the adjacent part of the two areas depends on the precision of the three-dimensional galvanometer for controlling the position of the laser focus. The error requirement for continuous graph processing in industrial application is generally about 50um, and the precision error of the three-dimensional galvanometer is less than 5um, so that the precision of the continuous graph processing can be effectively ensured by utilizing the method of the embodiment.

In a preferred embodiment, the method further comprises the step of, prior to the step of controlling the laser emission:

measuring the actual position of the workpiece 30 in the laser machining coordinate system;

calculating an error between the actual position and a preset position of the workpiece 30 in a laser processing coordinate system;

acquiring correction parameters according to the errors;

the gesture of the workpiece 30 is adjusted according to the correction parameter, or the preset track coordinates of the first to-be-processed area 301 and the second to-be-processed area 302 are adjusted according to the correction parameter.

After the relative positions of the laser three-dimensional scanning unit 10, the reflecting unit 20 and the workpiece 30 have been determined, and the preset track coordinates of each region to be processed are set according to the relative positional relationship, batch processing can be performed on the same workpiece 30. However, in actual production, there may be a certain machining error in the workpiece 30 itself, and there may also be a positioning error when the workpiece 30 is positioned at its preset position, and the above error can be effectively reduced by the correction step, so as to ensure the machining precision.

When the workpiece 30 is replaced and processed, the error between the actual position and the preset position of the workpiece 30 is obtained, and then the correction parameter is obtained according to the error, and the position compensation is performed according to the correction parameter. The actual position of the workpiece 30 can be adjusted to reach the ideal position by adjusting the posture of the workpiece 30, and the preset track coordinates of each region to be processed can be adjusted to be matched with the actual position of the workpiece 30. After the correction of the position of the workpiece 30 is completed, the laser emission is controlled to process, so that the accuracy of actual processing is further ensured.

The actual position of the workpiece 30 in the laser processing coordinate system may be measured by using CCD imaging, and the error between the actual position of the workpiece 30 and the preset position may include a position error in each direction in the three-dimensional space and an inclination angle error of the workpiece 30.

In a preferred embodiment, the preset positions of the workpiece 30 and the reflection unit 20 in the laser processing coordinate system can be determined by modeling, and the step of modeling to determine the preset positions specifically includes:

respectively establishing models of the workpiece 30 and the reflecting unit 20 in a laser processing coordinate system;

adjusting the position of the workpiece 30 model to enable a first to-be-processed area 301 of the workpiece 30 model to face the laser emergent direction and be located in the laser focus range;

adjusting the position of the reflecting unit 20 model to enable the image of the second to-be-processed area 302 of the workpiece 30 model in the reflecting unit 20 model to be positioned in the laser focus range;

translating or rotating the reflective unit 20 model such that the reflective unit 20 model does not interfere with the workpiece 30 model;

the spatial coordinates of the model calibration point of the workpiece 30 in the laser machining coordinate system at this time are acquired to identify the preset position of the workpiece 30, and the spatial coordinates of the model calibration point of the reflecting unit 20 in the laser machining coordinate system at this time are acquired to identify the preset position of the reflecting unit 20.

The relative positions of the laser three-dimensional scanning unit 10, the reflecting unit 20 and the workpiece 30 can be manually adjusted to enable the laser three-dimensional scanning unit 10, the reflecting unit 20 and the workpiece 30 to meet the condition that laser is directly irradiated or reflected to different surfaces to be processed, and then the positions of the workpiece 30 and the reflecting unit 20 in a laser processing coordinate system can be obtained through CCD shooting, so that the acquisition of various subsequent parameters is facilitated.

Compared with the mode, the modeling mode is more visual, and the acquisition of the follow-up parameters can be more convenient. For example, the target pattern on each surface to be processed of the workpiece 30 may be embodied in a model of the workpiece 30, and the image formed by the reflection unit 20 may be simulated according to the target pattern of the second region to be processed 302, so as to directly capture the coordinates of the image.

In another preferred embodiment, each target pattern to be processed includes a line, i.e. the target pattern is a line such as a straight line or a curve, or the target pattern may be decomposed into multiple lines such as a straight line or a curve. The target patterns of the first to-be-processed area 301 and the second to-be-processed area 302 are to form continuous patterns, and each line respectively forming the two target patterns should be correspondingly formed into continuous lines. To form a continuous pattern, the corresponding points of the target patterns of the first to-be-processed region 301 and the second to-be-processed region 302 at the adjacent positions of the two regions should be overlapped, that is, the end points of the lines forming the target pattern of the first to-be-processed region 301 at the adjacent positions of the regions are overlapped with the end points of the lines forming the target pattern of the second to-be-processed region 302 at the adjacent positions of the regions.

Therefore, the processing of any continuous graph of each region to be processed can be realized only by processing the continuous lines of each region to be processed.

The following examples are specific applications of the above method in the field of electronic devices 80. Based on the etching apparatus for the conductive layer 84 of the electronic device 80 described above, the present embodiment provides an etching method for an electronic device. The method comprises the following steps:

determining preset positions of the electronic device 80 and the reflecting unit 20 in a laser processing coordinate system, and acquiring space coordinates of a first area 86 to be etched and a second area 87 to be etched of the electronic device 80 and a target etching line 85 according to the preset positions of the electronic device 80 in the laser processing coordinate system;

setting the space coordinates of the target etching line 85 of the first area 86 to be etched of the electronic device 80 as the preset track coordinates of the first area 86 to be etched; determining the space coordinates of the second region to be etched 87, which are imaged by the reflecting unit 20, of the target etching line 85 of the second region to be etched 87 according to the space coordinates of the target etching line 85 of the second region to be etched 87 of the electronic device 80 and the preset position of the reflecting unit 20 in the laser processing coordinate system, and setting the imaged space coordinates as preset track coordinates of the second region to be etched 87;

controlling laser to emit to the first region 86 to be etched according to preset track coordinates of the first region 86 to be etched, emit to the reflecting unit 20 according to preset track coordinates of the second region 87 to be etched, and reflect to the second region 87 to be etched through the reflecting unit 20;

The laser processing coordinate system is a processing coordinate system of the laser three-dimensional scanning unit 10, the first area to be etched 86 is adjacent to the second area to be etched 87, and the end points of the target etching lines 85 of the first area to be etched 86 and the second area to be etched 87 are coincident at the adjacent positions of the two areas.

Processing is typically accomplished by etching lines 85 into conductive layer 84 of electronic device 80, so that the target pattern of each area to be etched is target etch line 85.

Further, in order to ensure the machining precision, the influence of the machining error and the positioning error of the workpiece 30 itself can be avoided as much as possible, and the posture of the workpiece 30 or the preset track coordinate can be corrected before the laser is emitted for etching. The preset positions of the electronic device 80 and the reflecting unit 20 in the laser processing coordinate system can be determined in a modeling mode, so that all required parameters can be obtained more intuitively and conveniently through the model.

The specific etching method and principle can be understood by referring to the method for processing the continuous pattern by laser, and will not be described herein.

For a better understanding of the present invention, a process for etching conductive layer 84 of electronic device 80 will be described.

Referring to fig. 5-7, an electronic device 80 is provided with three adjacent surfaces to be etched, a main etched surface 81, a first undercut facet 82, and a second undercut facet 83. The main etching surface 81 is opposite to the laser three-dimensional scanning unit and is positioned in the laser focus range of the laser three-dimensional scanning unit, and can be directly irradiated to the surface by laser for processing; the first side etched surface 82 and the second side etched surface 83 are located on both sides of the main etched surface 81, respectively, and the laser beam cannot be directly incident on the surfaces thereof, so that the mirrors are respectively disposed on the sides of the two side etched surfaces, so that the laser beam is reflected by the first mirror 201 to the first side etched surface 82 and by the second mirror 202 to the second side etched surface 83.

Before processing, the track coordinates of the portion of the control unit corresponding to the lines to be etched on each facet to be etched are preset.

Referring to fig. 6 and 7, first, it is necessary to acquire the spatial coordinates of the lines to be etched continuously, including: the space coordinates of the start position a and the end position B of the line to be etched on the first side etching surface 82, the space coordinates of the start position C and the end position D of the line to be etched on the main etching surface 81, and the space coordinates of the start position E and the end position F of the line to be etched on the second side etching surface 83 are obtained.

Taking the first side etched surface 82 as an example, A, B points are the starting position point and the ending position point of the required processing position on the first side etched surface 82, the positions of the starting position A and the ending position B on the electronic device 80 are obtained by design requirements, when the placement positions of the electronic device 80 relative to the laser three-dimensional scanning unit and the reflecting mirror are determined, under a laser processing coordinate system, the mapping relation between the position on the electronic device 80 and the spatial coordinate of the laser processing coordinate system is realized by calibrating the laser origin and the calibration point of the electronic device 80, and the spatial coordinate of the A, B point in the laser processing coordinate system can be obtained according to the mapping relation and the position data of the A, B points on the electronic device 80. According to the position of the first mirror 201 in the laser processing coordinate system, the spatial coordinates of the two points A, B in the laser processing coordinate system about the image points A1 and B1 formed by the first mirror 201 can be obtained. When the three-dimensional galvanometer positions the focus to A1 and a B1 respectively, the laser is reflected after exiting to the first reflecting mirror 201 according to the angles corresponding to A1 and B1, and according to the reflection principle, the reflected focus should fall on the points of A1 and B1 symmetrical with respect to the first reflecting mirror 201 respectively, namely, the two points of a and B. Therefore, as long as the spatial coordinates of A1 and B1 are obtained, accurate positioning etching of two points of the starting position a and the ending position B can be achieved, the spatial coordinates of the etching position points and the spatial coordinates of the corresponding imaging points are in one-to-one correspondence, so that the spatial coordinates of A1 and B1 are respectively used as the starting point and the ending point coordinates of the preset track, and the accurate etching of the path between the starting position a and the ending position B of the first side etching surface 82 can be satisfied, that is, in the control unit, the laser can be controlled to emit according to the preset data by the preset spatial coordinates of A1 and B1, so as to obtain the path to be etched.

Based on the above principle, the trajectory coordinates of each line to be etched in the laser control unit can be preset according to the spatial coordinates. Taking the space coordinates of the to-be-etched line on the first side etching surface 82 imaged in the first reflecting mirror 201 as preset track coordinates corresponding to the to-be-etched line on the first side etching surface 82; similarly, the space coordinates of the line to be etched on the second side etched surface 83 imaged in the second mirror 202 are taken as preset track coordinates corresponding to the line to be etched on the second side etched surface 83. For the main etching surface 81, since the laser beam can be directly irradiated, the space coordinates of the starting position C and the space coordinates of the ending position D of the line to be etched on the main etching surface 81 can be directly used as the coordinates of the two end points of the corresponding preset track, and the laser beam is controlled to move and scan according to the preset track coordinates, so that the track from the starting position C to the ending position D can be etched.

And then, entering a batch processing link. For each electronic device 80, after ensuring that the positioning is accurate, the laser can be controlled to emit according to the preset track coordinates for etching processing.

Controlling the laser focus to move according to the coordinate scanning of the image points A1 to B1, and forming a to-be-etched line from the starting position A to the ending position B on the first side-etched surface 82; controlling the laser focus to move according to the coordinate scanning of the points C to D, and forming a line to be etched from a starting position C to an ending position D on the main etched surface 81; the laser focus is controlled to move according to the coordinate scanning of the image points E1 to F1, and a line to be etched from the start position E to the end position F is formed on the second side etched surface 83. The concepts of the start position and the end position are for the convenience of understanding, and the actual processing process is not limited to the above sequence.

Wherein the end position B of the first undercut surface 82 and the start position C of the main etched surface 81 are coincident in the design requirement of the electronic device, i.e. the two points B, C have the same spatial coordinates; the end position D of the main etched facet 81 and the start position E of the second side etched facet 83 are coincident in the design requirements of the electronic device, i.e. the two points D, E have the same spatial coordinates. By the method, the falling points of the laser focus at the adjacent positions of the surfaces to be etched can be overlapped, so that a continuous etching line is formed. Thus, continuous etching can be achieved on three adjacent etched facets of the electronic device 80 without flipping the mobile electronic device 80. The scanning movement of the laser is realized through the movement of the three-dimensional galvanometer, and the movement precision of the three-dimensional galvanometer is very high, so that the continuity of lines on different facets to be etched can be ensured.

If the conventional method is adopted, the first side-etched surface 82 is required to be etched against the laser, after the etching is completed, the electronic device 80 is turned over, the main etched surface 81 is adjusted to be etched against the laser, after the etching is completed, the electronic device 80 is turned over again, and the second side-etched surface 83 is adjusted to be etched against the laser. Because the mechanical structure precision is limited, in order to ensure that the processing position on the current facet to be etched and the processing position on the last facet to be etched can be accurately aligned, after each turn, the workbench is required to be adjusted, the positioning precision is difficult to ensure, and the production efficiency is also influenced.

The electronic device 80 is not required to be moved in the whole etching process, and the electronic device 80 only needs to be positioned at one time in the initial process, so that the positioning difficulty is greatly reduced, the problem that a complex structure is required to be added due to the positioning problem is solved, the precision is ensured by the three-dimensional galvanometer, and the precision is irrelevant to the mechanical structure for auxiliary positioning; the processing precision is improved.

The foregoing description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical principles of the present invention still fall within the scope of the technical solutions of the present invention.

Claims

1. The device for processing the continuous graph by the laser is characterized by comprising a control unit, a laser three-dimensional scanning unit and a reflecting unit, wherein a workpiece is provided with a first area to be processed and a second area to be processed, the first area to be processed and the second area to be processed are not on the same plane, the laser three-dimensional scanning unit and the first area to be processed are oppositely arranged, the first area to be processed is positioned in a laser focus range of the laser three-dimensional scanning unit, the reflecting unit is arranged beside the second area to be processed, and the second area to be processed is positioned in the focus range of the same laser reflected by the reflecting unit;

2. The apparatus for laser processing a continuous pattern according to claim 1, wherein the workpiece comprises at least two adjacent surfaces to be processed, the surfaces to be processed comprising a main processing surface and at least one side processing surface, the first region to be processed being located on the main processing surface and the second region to be processed being located on the side processing surface;

3. The apparatus for laser processing a continuous pattern according to claim 2, wherein the reflection unit further comprises a position adjustment mechanism including a translation assembly or a first rotation assembly;

4. A device for laser processing a continuous pattern according to any one of claims 1 to 3, further comprising a workpiece positioning unit including a workpiece positioning mechanism, a workpiece posture adjustment mechanism, and a driving mechanism;

5. A method of laser processing a continuous pattern, characterized in that the method is applied to an apparatus for laser processing a continuous pattern as claimed in any one of claims 1 to 4, comprising the steps of:

6. The method of laser processing a continuous pattern as recited in claim 5, further comprising, before said step of controlling laser emission, the step of:

acquiring correction parameters according to the errors;

7. The method of claim 6, wherein the step of determining the preset positions of the workpiece and the reflecting unit in the laser processing coordinate system is implemented by modeling, comprising:

8. The method of any one of claims 5-7, wherein the pattern comprises lines, and wherein portions of the same line that are located in the first region to be processed and the second region to be processed respectively each comprise two end points, and wherein the end points of the lines that are located in adjacent portions of the respective regions overlap.

9. An etching device for an electronic device, characterized in that the device comprises the device for processing continuous patterns by laser according to any one of claims 1-4, the electronic device is provided with a first area to be etched and a second area to be etched, which are coated with a conductive layer, a laser three-dimensional scanning unit is arranged opposite to the first area to be etched, the first area to be etched is positioned in a laser focal range of the laser three-dimensional scanning unit, a reflecting unit is arranged beside the second area to be etched, and the second area to be etched is positioned in the focal range of the laser after being reflected by the reflecting unit;

10. The electronic device etching apparatus according to claim 9, wherein the electronic device is provided with three adjacent surfaces to be etched, including a main etched surface, and a first side etched surface and a second side etched surface which are respectively adjacent to the main etched surface at both sides of the main etched surface, the first area to be etched being located on the main etched surface, the second area to be etched being located on the first side etched surface and the second side etched surface;

11. A method of etching an electronic device, characterized in that the method is a method of laser processing a continuous pattern according to any one of claims 5 to 8, for use in etching an electronic device, comprising the steps of:

12. The method of etching an electronic device according to claim 11, further comprising, before the step of controlling laser emission, the step of:

acquiring correction parameters according to the errors;