CN115815792B - Visual laser processing system and method - Google Patents
Visual laser processing system and method Download PDFInfo
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- CN115815792B CN115815792B CN202310125439.6A CN202310125439A CN115815792B CN 115815792 B CN115815792 B CN 115815792B CN 202310125439 A CN202310125439 A CN 202310125439A CN 115815792 B CN115815792 B CN 115815792B
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Abstract
The application relates to a visual laser processing system and a visual laser processing method. Including OCT module configured to: emitting measurement light to the surface of the sample, emitting reference light to the reflecting mirror, receiving first reflected light formed by reflecting the measurement light by the surface of the sample, and receiving second reflected light formed by reflecting the reference light by the reflecting mirror, and forming coherent light signals by the first reflected light and the second reflected light; the signal processing module is configured to: receiving a coherent light signal, converting the coherent light signal into a digital signal, extracting an intensity signal for expressing the intensity of the coherent light signal from the digital signal, generating a visual three-dimensional image of the surface of the sample according to the intensity signal, and acquiring the roughness of the surface of the sample according to the visual three-dimensional image; the processing module is configured to: and responding to the processing instruction sent by the signal processing module according to the roughness of the surface of the sample, and adjusting the scanning speed of the laser and/or the moving speed of the sample.
Description
Technical Field
The application relates to the technical field of laser processing, in particular to a visual laser processing system and method.
Background
The roughness of the workpiece surface can affect the wear resistance, stability of the fit, fatigue strength, corrosion resistance, tightness, contact stiffness, measurement accuracy, coating of the part, thermal conductivity, contact resistance, reflectivity, radiation properties, resistance to liquid and gas flow, current flow through the conductor surface, etc. The roughness of the material surface in the laser processing process is easily influenced by the laser processing speed in the processing process.
The surface roughness measuring instrument is a measuring instrument for evaluating the surface quality of a workpiece, can measure the roughness of the surfaces of various parts, including planes, inclined planes, outer cylindrical surfaces, inner hole surfaces, deep groove surfaces, bearing raceways and the like, and realizes the multifunctional precise measurement of the surface roughness.
The traditional surface roughness measuring instrument can only measure the surface roughness of the workpiece after processing the surface of the workpiece, and can not measure the surface of the workpiece in real time by displaying the roughness value through a window. In this way, when a technician processes a workpiece, in order to obtain a desired workpiece surface roughness, it is necessary to set a processing parameter based on the measured workpiece surface roughness after each measurement, process the workpiece surface, and then measure the workpiece surface again, and if the desired workpiece surface roughness is not achieved, process the workpiece surface again, and therefore, in order to obtain the desired workpiece surface roughness, it is generally necessary to repeatedly measure and process.
Therefore, the real-time measurement of the surface roughness of the workpiece cannot be realized, so that the technician can process the workpiece for a long time, the processing efficiency is low, and the material waste is easily caused in the repeated measurement and processing processes. In addition, because the traditional measurement mode can only obtain the numerical value of the surface roughness of the workpiece, the morphology imaging of the surface of the workpiece material cannot be obtained, so that technicians cannot comprehensively know the condition of the surface roughness of the workpiece, and a richer processing detection method cannot be realized.
Disclosure of Invention
The application provides a visual laser processing system, can solve among the prior art work efficiency low, can't obtain the topography imaging on work piece material surface to and can't realize the problem of richer processing detection method.
A first aspect of the present application provides a visualized laser processing system comprising:
an OCT module configured to: emitting measurement light to the surface of a sample, emitting reference light to a reflecting mirror, receiving first reflected light formed by reflecting the measurement light by the surface of the sample, receiving second reflected light formed by reflecting the reference light by the reflecting mirror, and forming coherent light signals by the first reflected light and the second reflected light;
A signal processing module connected with the OCT module, the signal processing module configured to: receiving the coherent light signal, converting the coherent light signal into a digital signal, extracting an intensity signal for expressing the intensity of the coherent light signal from the digital signal, generating a visual three-dimensional image of the surface of the sample according to the intensity signal, and acquiring the roughness of the surface of the sample according to the visual three-dimensional image;
a processing module coupled to the signal processing module, the processing module configured to: and responding to the processing instruction sent by the signal processing module according to the roughness of the surface of the sample, and adjusting the scanning speed of the laser and/or the moving speed of the sample.
In one way that can be implemented, the OCT module includes: the device comprises a super-radiation light-emitting diode, an indication light source, a first beam combiner, a second beam combiner, a measuring arm and a reference arm;
the first beam combiner is disposed downstream of the superluminescent diode and the indication light source, the first beam combiner configured to: combining the super-radiation light-emitting diode and the light beam emitted by the indication light source to form a light beam;
The second beam combiner is disposed downstream of the first beam combiner, the second beam combiner configured to: splitting one light beam emitted by the first beam combiner into two light beams with the same power, taking one light beam as the measuring light, emitting the measuring light to a measuring arm, and taking the other light beam as the reference light, emitting the other light beam to a reference arm;
the measuring arm and the reference arm are arranged at the downstream of the second beam combiner; the measurement arm is configured to: directing the measurement light to a surface of a sample, receiving the first reflected light, and reflecting the first reflected light back to the second beam combiner; the reference arm is configured to: and reflecting the reference light to form second reflected light, and reflecting the second reflected light back to the second beam combiner.
In one manner of implementation, the measurement arm includes a first collimating lens and a first galvanometer;
the first collimating lens is arranged on an optical path between the second beam combiner and the galvanometer, and is configured to: receiving the measuring light, collimating the measuring light, and then radiating the measuring light to the first vibrating mirror;
the first galvanometer is configured to: directing the collimated measurement light to a surface of the sample, receiving the first reflected light, and directing the first reflected light to the first collimating lens;
The reference arm comprises a second collimating lens and the reflecting mirror;
the second collimating lens is arranged on an optical path between the second beam combiner and the reflecting mirror, and the second collimating lens is configured to: receiving the reference light, collimating the reference light, and directing the reference light to the reflecting mirror;
the mirror is configured to: and reflecting the collimated reference light to form second reflected light, and directing the second reflected light to the second beam combiner.
In one manner of implementation, the OCT module further includes a rangefinder;
the rangefinder is disposed on the measurement arm, the rangefinder configured to: and emitting measuring light to the surface of the sample, determining the distance between the surface of the sample and the measuring arm, and transmitting the measuring result to the signal processing module so that the signal processing module adjusts the distance between the measuring arm and the surface of the sample according to the measuring result.
In one manner of implementation, the signal processing module includes a detector, a lock-in amplifier, an analog-to-digital converter, and a processing unit;
the probe is connected with the OCT module, the probe configured to: converting the coherent optical signal into an electrical signal;
The lock-in amplifier is connected with the detector, and the lock-in amplifier is configured to: receiving the electric signal sent by the detector, filtering out non-working frequency band signals in the electric signal, amplifying other working frequency band signals, and transmitting the amplified signals to the analog-digital converter;
the analog-to-digital converter is coupled to the lock-in amplifier, the analog-to-digital converter configured to: converting the operating band signal to a digital signal;
the processing unit is connected with the analog-to-digital converter, and the processing unit is configured to: and selecting a maximum value signal of the analog-digital converter, sampling the maximum value signal at a preset frequency in a time domain to obtain the intensity signal, and converting the intensity signal into the visual three-dimensional image.
In one manner that may be implemented, the process module includes: a conveyor belt and a laser machining assembly;
the transmission belt is connected with the signal processing module, and the transmission belt is configured to: adjusting a transmission speed in response to the processing instruction;
the laser processing assembly is connected with the signal processing module, and the laser processing assembly is configured to: and responding to the processing instruction, and adjusting the scanning speed of the laser.
In one way that can be implemented, the conveyor belt includes a motor that controls its speed of conveyance;
the motor is configured to: and controlling the transmission speed of the transmission belt in response to the processing instruction of the signal processing module.
In one manner that may be implemented, the laser processing assembly includes: the laser, the laser processing head and the second vibrating mirror;
the laser is connected with the signal processing module, and the laser is configured to: emitting a laser beam in response to the processing instruction;
the laser processing head is disposed downstream of the laser, the laser processing head configured to: directing the laser beam to a designated area;
the second galvanometer is arranged on the laser processing head and connected with the signal processing module, and the second galvanometer is configured to: and responding to the processing instruction, and adjusting the scanning speed of the laser.
In a second aspect of the present application, a visual laser processing method is provided, and is applied to the visual laser processing system, where the method includes:
s100: emitting measurement light to the surface of the sample and emitting reference light to the reflecting mirror;
s200: receiving first reflected light formed by reflecting the measuring light by the surface of the sample, receiving second reflected light formed by reflecting the reference light by the reflecting mirror, and forming coherent light signals by the first reflected light and the second reflected light;
S300: converting the coherent light signal into a digital signal, and extracting an intensity signal for expressing the intensity of the coherent light signal from the digital signal;
s400: generating a visual three-dimensional image of the surface of the sample according to the intensity signal, and acquiring the roughness of the surface of the sample according to the visual three-dimensional image;
s500: and adjusting the scanning speed of the laser and/or the moving speed of the sample according to the roughness of the surface of the sample.
In one manner that may be implemented, after the step of S500, the method includes:
calculating Ra, rz and Ry roughness of the surface of the sample based on the signal intensity and depth relationship of the visual three-dimensional image, wherein,
ra represents the calculated average depth of a certain area after measurement processing, and takes the average depth as a datum line, and the arithmetic average value of the absolute value of the distance between the datum line and the surface profile of the sample is calculated;
rz represents the sum of the average of 5 maximum profile peak heights and the average of 5 maximum profile valley depths within a preset length;
ry represents the distance between the highest crest line and the lowest valley line of the profile within a preset length;
s602: determining whether the surface roughness of the sample reaches the target roughness according to the Ra, the Rz and the Ry roughness of the surface of the sample;
S603: if the target roughness is not reached, the steps of S100 to S500 are repeated.
The beneficial effects of this application:
the OCT module respectively emits a beam of light to the surface of the sample and the reflecting mirror, receives the corresponding returned beam, forms a coherent light signal from the returned beam, and transmits the coherent light signal to the signal processing module, and the signal processing module converts the coherent light signal into a digital signal to acquire an intensity signal in the digital signal. Next, a visual three-dimensional image of the surface of the sample is generated based on the plurality of intensity signals in the time domain, so that roughness of the surface of the sample is obtained by the visual three-dimensional image. Finally, according to the roughness of the surface of the sample, the scanning speed of the laser of the processing module and/or the moving speed of the sample are/is adjusted. By the method, the surface roughness of the sample is visualized, and the surface of the sample can be subjected to data analysis according to the visualized surface roughness of the sample, so that a richer processing detection method is realized. In addition, the visual three-dimensional image is utilized to intuitively know the roughness of the surface of the workpiece in real time, repeated measurement of the roughness of the surface of the workpiece is not needed, the working efficiency is improved, and the waste of materials caused in the repeated measurement and processing processes can be avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an OCT module, a signal processing module, and a processing module of a visual laser processing system of the present application;
FIG. 2 is a schematic diagram of a visual laser machining system of the present application;
FIG. 3 is a flow chart of a visual laser machining method of the present application;
fig. 4 is a flow chart of calculating the surface roughness of a sample in a visualized laser processing method of the present application.
Reference numerals:
1-OCT module; 11-superluminescent light emitting diode; 12-an indicator light source; 13-a first combiner; 14-a second beam combiner; 15-a measuring arm; 151-a first collimating lens; 152-a first galvanometer; 16-a reference arm; 161-a second collimating lens; 162-a mirror; 17-range finder;
2-a signal processing module; 21-a detector; a 22-lock-in amplifier; a 23-analog-to-digital converter; 24-a processing unit;
3-a processing module; 31-a conveyor belt; 311-motor; 32-a laser machining assembly; 321-a laser; 322-laser processing head; 323-a second galvanometer;
4-sample.
Detailed Description
The technical solutions of the present invention will be clearly and completely described in connection with the embodiments, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In order to facilitate the technical solution of the application, some concepts related to the present application will be described below first.
An optical coherence tomography (Optical Coherence Tomography, OCT) module, which is called OCT module for short, is a module for detecting the back reflection or several scattering signals of different depth layers of biological tissue facing the incident weak coherent light by using the basic principle of weak coherent light interferometer, and obtaining the two-dimensional or three-dimensional structural image of the biological tissue by scanning.
A visual three-dimensional image is displayed for a tool for describing and understanding the surface characteristics of an object.
Envelope, refers to the line of the amplitude maxima of the oscillations of the optical signal, wherein the line of maxima represents the profile of the optical signal.
As shown in fig. 1, a visual laser processing system of the present application includes an OCT module 1, a signal processing module 2, and a processing module 3.
Wherein the OCT module 1 is configured to: the method comprises the steps of emitting measuring light to the surface of a sample, emitting reference light to a reflecting mirror, receiving first reflected light formed by reflecting the measuring light by the surface of the sample, receiving second reflected light formed by reflecting the reference light by the reflecting mirror, and forming coherent light signals by the first reflected light and the second reflected light.
Specifically, the OCT module 1 may emit two light beams by a light source, and the two light beams may be emitted by one light source or may be emitted by more than two light sources. If the number of the light sources is two, the light beams emitted by the two light sources need to have the same wavelength. If the number of the light sources is more than two, such as three light sources, two of the light sources need to be combined to form one light source, and the combined light sources need to have the same wavelength as the light emitted by the other light source so as to form a coherent light signal.
Among the two light beams emitted by the OCT module 1, one light beam is taken as measuring light and irradiates the surface of the sample, after passing through the surface of the sample, the measuring light forms diffuse reflection on the surface of the sample, and as the surface of the sample has different fluctuation, the measuring light can form reflected light irradiating all directions through the surface of the sample, the reflected light of all directions can express the fluctuation shape of the surface of the sample, and the reflected light of all directions forms first reflected light, namely, the first reflected light is formed by the diffuse reflection light of the surface of the sample and carries the information of the surface of the sample; the other beam is taken as reference light and is emitted to the reflector, and is reflected by the reflector to form second reflected light. The first reflected light and the second reflected light are received by the OCT module 1, and a coherent light signal is formed at the OCT module 1, so that the coherent light signal formed at the OCT module 1 carries the surface information of the sample because the first reflected light carries the surface information of the sample.
In order to maximize the interference signal emitted from the OCT module 1, the initial position of the second reflected light needs to be adjusted so that the OCT module 1 receives the first reflected light and the second reflected light with the same phase difference, thereby maximizing the interference signal.
The signal processing module 2 is connected with the OCT module 1 through a line, so that signal transmission between the signal processing module 2 and the OCT module 1 is realized. The signal processing module 2 is configured to: receiving the coherent light signal, converting the coherent light signal into a digital signal, extracting an intensity signal for expressing the intensity of the coherent light signal from the digital signal, generating a visual three-dimensional image of the surface of the sample according to the intensity signal, and acquiring the roughness of the surface of the sample according to the visual three-dimensional image.
It should be noted that, since the intensity of the coherent optical signal outputted from the OCT module 1 is positively correlated with the undulation height of the material surface structure, that is, the weaker the optical signal is, the lower the relative height of the material surface structure is. Therefore, the signal processing module 2 extracts the intensity signal from the coherent light signal, and then performs corresponding processing on the intensity signal, thereby obtaining a visual three-dimensional image composed of the intensity signal.
The processing module 3 is connected with the signal processing module 2, the processing module 3 being configured to: the laser light is emitted to act on the surface of the sample, and the scanning speed of the laser light and/or the moving speed of the sample is adjusted in response to a processing instruction emitted by the signal processing module 2 according to the roughness of the surface of the sample.
Specifically, the laser emitted from the processing module 3 to the surface of the sample can cut the surface of the sample, and adjust the roughness of the surface of the sample, for example, the surface of the sample is smoother or rougher by the laser, and the working mode of the laser can be set according to the needs, which is not limited in this embodiment. The working mode of the laser is controlled by a processing instruction sent by the signal processing module 2, and after the processing module 3 receives the processing instruction, the scanning speed of the laser or the moving speed of the sample is adjusted, so that the effect of adjusting the surface roughness of the sample is achieved.
Illustratively, the time that the sample 4 is subjected to laser cutting per unit area may be increased by reducing the laser scanning speed to increase the irradiation density of the laser light per unit area, thereby reducing the roughness of the surface of the sample 4. In addition, the moving speed of the sample may be reduced to reduce the roughness of the surface of the sample 4, with the scanning speed of the laser being unchanged. In addition, the laser scanning speed and the moving speed of the sample 4 can be reduced simultaneously to reduce the roughness of the surface of the sample 4. Conversely, if the laser scanning speed is increased or the moving speed of the sample 4 is increased, the surface roughness of the sample 4 can be increased.
In this embodiment, the OCT module 1 is used to send out a beam of light to the surface of the sample and the mirror, and receive the corresponding returned beam, form a coherent light signal from the returned beam, and transmit the coherent light signal to the signal processing module 2, where the signal processing module 2 converts the coherent light signal into a digital signal, and obtains an intensity signal in the digital signal. Next, a visual three-dimensional image of the surface of the sample is generated based on the intensity signal, so that the roughness of the surface of the sample is obtained by the visual three-dimensional image. Finally, the scanning speed of the laser of the processing module 3 and/or the moving speed of the sample are adjusted according to the roughness of the surface of the sample. By the method, the surface roughness of the sample is visualized, the surface of the sample can be subjected to data analysis according to the surface roughness of the visualized sample, so that a richer processing detection method is realized, the roughness of the surface of the workpiece can be intuitively known in real time by utilizing the visual three-dimensional image, repeated measurement of the surface roughness of the workpiece is not needed, and the working efficiency is improved.
As shown in fig. 2, in one embodiment, the OCT module 1 includes: superluminescent diode 11, indication light source 12, first beam combiner 13, second beam combiner 14, measuring arm 15 and reference arm 16.
The superluminescent diode 11 is a photoelectric semiconductor device, and can radiate broadband light based on the superluminescent phenomenon. Superluminescent diode 11 comprises a current driven p-n junction and an optical waveguide, which emits a light beam in the vicinity of wavelengths 800 nm,1300 nm and 1550 nm. The light radiated by the superluminescent diode 11 is close to the diffraction limit in space, namely, the spatial coherence and the beam quality are high, which is beneficial to forming coherent beams. The superluminescent diode 11 may be replaced by a fiber-coupled light source, for example, but is not limited to this embodiment.
The indication light source 12 is used for emitting visible light, so that a user can know the beam position of the super-radiation light-emitting diode 11 through the beam emitted by the indication light source 12, and the convenience of work is improved. The indication light source 12 may be a fiber coupled red Laser Diode (LD) capable of emitting visible light.
The first beam combiner 13 is arranged downstream of the superluminescent diode 11 and the indicator light source 12. The visible light beam emitted by the indication light source 12 and the light beam emitted by the super-radiation light-emitting diode 11 are emitted to the first beam combiner 13, the two beams are combined into one beam by the first beam combiner 13, and the one beam is emitted to the second beam combiner 14. Thus, the user can determine the emission direction of the light beam emitted from the superluminescent diode 11 by observing the visible light beam of the indication light source 12.
The second beam combiner 14 is disposed downstream of the first beam combiner 13, and is capable of splitting the beam combined by the first beam combiner 13 into two beams, and directing one of the two beams as measurement light to the measurement arm 15, and the other beam as reference light to the reference arm 16.
For ease of understanding of the embodiments, the beam directed to the measuring arm 15 is designated herein as measuring light and the beam directed to the reference arm 16 is designated herein as reference light. Wherein the wavelengths of the measuring light and the reference light are the same.
In the embodiment of the present application, the measurement arm 15 refers to a generic term of one or more devices on the transmission channel of the measurement light, and the reference arm 16 refers to a generic term of one or more devices on the transmission channel of the reference light. The measuring arm 15 and the reference arm 16 are both arranged downstream of the second beam combiner 14.
Wherein the measuring arm 15 can direct measuring light towards the surface of the sample 4 and can also receive first reflected light formed by the measuring light irradiating the surface of the sample 4. The first reflected light carries information of the surface of the sample 4. The signal intensity of the first reflected light is different due to the difference in roughness of the surface of the sample 4, and in particular, the signal intensity of the first reflected light is positively correlated with the undulation height of the material surface structure.
In one implementation, the measurement arm 15 may include a first collimating lens 151 and a first galvanometer 152. The first collimating lens 151 is disposed on an optical path between the second beam combiner 14 and the first galvanometer 152, and the first collimating lens 151 is capable of receiving measurement light directed thereto such that the measurement light is collimated after passing through the first collimating lens 151. The first galvanometer 152 disposed downstream of the first collimating lens 151 is capable of directing the measurement light collimated by the first collimating lens 151 toward the surface of the sample 4 such that the measurement light forms diffusely reflected first reflected light at the surface of the sample 4, and the first galvanometer 152 receives the diffusely reflected first reflected light and reflects the first reflected light to the first collimating lens 151. The first collimating lens 151 is also capable of receiving the first reflected light reflected by the first galvanometer 152 and transmitting the first reflected light to the second beam combiner 14.
In this way, the first collimating lens 151 and the first galvanometer 152 can collimate the measurement light that is directed to the surface of the sample 4, so that the reflection efficiency of the first reflected light is improved, and more of the first reflected light is reflected by the first galvanometer 152 to the second beam combiner 14.
In addition, the reference arm 16 may reflect the reference light back to the second beam combiner 14 to form a second reflected light, and the second reflected light is used as the reference light of the first reflected light.
In one implementation, the reference arm 16 may include a second collimating lens 161 and a mirror 162. The second collimating lens 161 is disposed between the second beam combiner 14 and the reflecting mirror 162, and the second collimating lens 161 is capable of receiving the reference light directed thereto such that the reference light is collimated after passing through the second collimating lens 161. The reflecting mirror 162 disposed downstream of the second collimating lens 161 is capable of reflecting the reference light collimated by the second collimating lens 161 to form second reflected light, and directing the second reflected light toward the second collimating lens 161. The second collimator lens 161 is also capable of receiving the second reflected light reflected by the mirror 162 and transmitting the second reflected light to the second beam combiner 14.
In this way, the second reflected light as the reference data can be formed by the second collimator lens 161 and the mirror 162, and the second collimator lens 161 can return the second reflected light formed by the mirror 162 to the second collimator lens 161 in the original path.
It is necessary to acquire the focal length of the measuring light before the measuring light measures the surface of the sample 4, and adjust the optical path length of the reference light according to the focal length of the measuring light so that the first reflected light formed by the measuring light and the second reflected light formed by the reference light can have the same phase difference when received by the second beam combiner. Specifically, the distance between the second collimating lens 161 and the reflecting mirror 162 may be adjusted, and thus the optical path length of the second reflected light may be adjusted so that the adjusted second reflected light has the same phase difference as the first reflected light.
In this embodiment, the first reflected light carrying the surface roughness of the sample is formed by the measuring arm 15, the second reflected light having the reference data is formed by the reference arm 16, and the first reflected light and the second reflected light form a coherent light signal at the second beam combiner 14, so that the information such as the surface roughness of the sample can be determined later by using the coherent light signal.
As shown in fig. 2, in one embodiment, the first beam combiner 13 is a beam combiner having a 2X1 channel. The second beam combiner 14 is a 2X2 channel polarizing beam combiner with a 50:50 splitting ratio.
The first beam combiner 13 is a beam combiner having a channel of 2X1, wherein two channels on one side are respectively used for receiving the light beams emitted by the superluminescent diode 11 and the indication light source 12, and the other channel is used for transmitting a light beam formed by combining the light beams emitted by the superluminescent diode 11 and the light beams emitted by the indication light source 12 through the first beam combiner 13 to the second beam combiner 14.
In addition, of the channels of 2X2 of the second beam combiner 14, one channel is used for receiving one beam of light constituted by the first beam combiner 13, and the other channel is used for transmitting a coherent optical signal to the signal processing module 2; of the two channels on the other side, one channel is used to transmit the measurement light and the first reflected light, and the other channel is used to transmit the measurement light and the second reflected light.
The second beam combiner 14 has a split ratio of 50:50, namely splitting the light beam formed by the first beam combiner 13 into 50:50 measuring light and reference light with the same power.
As shown in fig. 2, in one embodiment, the signal processing module 2 may include a detector 21, a lock-in amplifier 22, an analog-to-digital converter 23, and a processing unit 24.
Wherein the detector 21 is connected to the second beam combiner 14 in the OCT module 1. The detector 21 may receive the coherent optical signal emitted by the second beam combiner 14 and convert the coherent optical signal into an electrical signal. Preferably, the detector 21 is a photodetector 21.
The lock-in amplifier 22 is connected to the detector 21. The lock-in amplifier 22 is used to receive the electrical signal emitted by the detector 21. The lock-in amplifier 22 is preset with an operating frequency band, and when the electric signal passes through the lock-in amplifier 22, the lock-in amplifier 22 can filter out the electric signal of the non-operating frequency band in the electric signal, and only allows the electric signal of the operating frequency band to pass through. The lock-in amplifier 22 is capable of filtering out high frequency signals in the electrical signal, allowing low frequency signals to pass through, and amplifying the low frequency signals. The electrical signal is filtered by a lock-in amplifier 22 to form an analog signal. Illustratively, the time domain of the coherent optical signal comprises a low frequency signal (envelope) and a high frequency signal (oscillating portion). The high frequency signal can be filtered by using a low pass filter in the lock-in amplifier 22, and only the low frequency signal is reserved; then, the low frequency signal is amplified again, and only the envelope is finally output.
The analog-to-digital converter 23 is connected to the lock-in amplifier 22. The analog-to-digital converter 23 may convert the electrical signal of the operating frequency band into a digital signal so that the signal can be recognized by the processing unit 24.
The processing unit 24 is connected to the analog-to-digital converter 23. The processing unit 24 firstly selects the maximum signal of the analog-digital converter 23, then samples the maximum signal at a preset frequency in the time domain to obtain an intensity signal, stores the intensity signal as intensity data in a two-dimensional array, and then utilizes the intensity data in the two-dimensional array to form a visual three-dimensional image, and then obtains the surface roughness of the sample 4 according to the visual three-dimensional image. In this way, the surface of the sample 4 is processed according to the obtained roughness, and the surface roughness of the sample 4 is adjusted.
Illustratively, the process of forming a visual three-dimensional image from a two-dimensional array may be: sampling is performed at a preset frequency of 10kHz to obtain data of an intensity signal of the coherent light, and the obtained data is quantized and encoded and input into a two-dimensional array in the processing unit 24.
Wherein, the rows of the two-dimensional array correspond to the x-axis of the visual three-dimensional image, and the columns of the two-dimensional array correspond to the y-axis of the visual three-dimensional image. Therefore, the quantized coded values at different positions in the two-dimensional array correspond to the z-axis coordinate values at different positions of the visual three-dimensional image, and are used for representing the depths of the visual three-dimensional image at different positions.
In particular implementations, the measuring light may scan the sample surface line by line, for example: the measuring light can be irradiated on the surface of the sample in a point light source mode and moved in a set direction so as to realize scanning. Every time one line of scanning is completed, the first reflected light corresponding to the line area of the sample can be obtained, the intensity data corresponding to the line area can be further obtained, and the intensity data corresponding to each line area is correspondingly stored into one line of the two-dimensional array. For example: the first line scanning of the surface of the sample is completed by utilizing the measuring light, so that first reflected light corresponding to the first line area can be obtained, the first reflected light corresponding to the first line area and second reflected light are interfered, a coherent light signal corresponding to the first line area can be obtained, and the coherent light signal corresponding to the first line area is further subjected to photoelectric conversion, amplification, sampling and the like, so that intensity data corresponding to the first line area can be obtained. Finally, the intensity signal corresponding to the first row region may be stored into the first row of the two-dimensional array. Correspondingly, if the measuring light finishes the second line scanning on the surface of the sample, the first reflected light corresponding to the second line area can be obtained, the intensity data corresponding to the second line area can be stored into the second line of the two-dimensional array, and the like.
It will be appreciated that each time the measuring light completes a line scan, it takes a certain amount of time. For example: if the laser light moves in the width direction of the sample 4 and the time required to move from one end to the other is 0.5 seconds, it can be considered that the time for the laser light to complete one line scan is 0.5 seconds. Then, for a certain workpiece surface, if the whole scanning needs to be scanned for 120 lines, a three-dimensional visual image of the workpiece surface can be constructed in about 1 minute, and if the whole scanning needs to be scanned for 600 lines, a three-dimensional visual image of the workpiece surface can be constructed in about 5 minutes.
In the embodiment of the present application, the time required to scan one line is merely taken as an example, and does not constitute a specific limitation of the embodiment of the present application.
The processing unit 24 may be one of a computer, an industrial personal computer, an MCU, an SOC, and a single chip microcomputer, and is preferably a computer.
The preset frequency in the time domain is proportional to the resolution, that is, the higher the frequency is, the higher the resolution is, and the lower the frequency is, the lower the resolution is. The preset frequency may be set according to the sample 4, i.e. different frequencies may be set for different samples 4.
In this embodiment, the detector 21 is used to receive the coherent optical signal and convert the coherent optical signal into an electrical signal, so that the lock-in amplifier 22 can filter the working frequency band in the electrical signal. The non-operating frequency band is filtered out by the lock-in amplifier 22, the operating frequency band is reserved, and the reserved operating frequency band is amplified. The remaining operating frequency band is then converted into a digital signal by means of an analog-to-digital converter 23 for recognition by the processing unit 24, wherein the digital signal represents a plurality of coherent light signals generated when the first galvanometer 152 scans the surface of the sample 4, and the signals are obtained after filtering, amplifying and analog-to-digital conversion, each of the coherent light signals having a corresponding waveform.
In this way, the processing unit 24 can sample the digital signals with the maximum value thereof at a preset frequency in the time domain to obtain the intensity data, store the intensity data in the two-dimensional data set, and form a visual three-dimensional image by using the two-dimensional array, so as to image the processing area in real time by using the visual three-dimensional image, thereby providing possibility for richer processing detection methods. In addition, the processing unit 24 can obtain the roughness of the surface of the sample 4 according to the obtained visual three-dimensional image and use the visual three-dimensional image, and send a processing instruction to the processing module 3 according to the roughness of the surface of the sample 4, so as to adjust the roughness of the surface of the sample 4 according to the visual three-dimensional image.
As shown in fig. 2, in one embodiment, the processing module 3 may include: a conveyor 31 and a laser machining assembly 32.
Wherein the transmission belt 31 is connected to the processing unit 24 of the signal processing module 2, the transmission belt 31 being configured to: in response to the processing instructions, the transport speed is adjusted.
Specifically, the conveyor belt 31 further includes a motor 311 for controlling the conveying speed thereof, and the motor 311 is electrically driven. The motor 311 is connected to the processing unit 24 of the signal processing module 2, and when the processing unit 24 issues a processing command, the motor 311 rotates according to the instruction in the processing command, thereby controlling the operation of the conveyor belt 31.
The top surface of the conveyor belt 31 is provided with the sample 4, and when the motor 311 drives the conveyor belt 31 to rotate, the sample 4 placed on the conveyor belt 31 moves with the rotation of the conveyor belt 31.
The laser processing component 32 is connected with the processing unit 24 of the signal processing module 2, the laser processing component 32 can receive a processing instruction sent by the processing unit 24, and the laser processing component 32 responds to the processing instruction to adjust the scanning speed of laser.
In this embodiment, when the processing unit 24 in the signal processing module 2 converts the intensity signal into the visual three-dimensional image, the surface roughness of the sample 4 is obtained, and the roughness can be compared with the preset roughness, and the preset roughness refers to the roughness that the surface of the sample 4 is expected to reach. The processing unit 24 issues processing instructions based on the comparison results so that the motor 311 and the laser processing assembly 32 perform corresponding actions in response to the processing signals, respectively.
As shown in fig. 2, in one embodiment, the laser processing assembly 32 includes a laser 321, a laser processing head 322, and a second galvanometer 323;
the laser 321 is connected to the processing unit 24 of the signal processing module 2, and the laser 321 responds to a processing instruction sent by the processing unit 24 and emits a laser beam to the surface of the sample 4 according to the instruction.
A laser processing head 322 is disposed downstream of the laser 321, and the laser processing head 322 directs a laser beam emitted by the laser 321 to a specified region.
The second galvanometer 323 is disposed on the laser processing head 322 and connected to the processing unit 24 of the signal processing module 2, and the second galvanometer 323 can adjust its swing angle in response to the processing command, so as to adjust the scanning speed of the laser.
The second galvanometer 323 is a scanning second galvanometer 323 applied to laser, in particular to a swinging motor with a galvanometer, when a position signal is input to the swinging motor, the swinging motor swings a certain angle according to a certain voltage and angle conversion ratio according to the position signal, and the galvanometer is driven by the swinging motor to rotate back and forth at a high speed, so that the laser beam emitted to the galvanometer continuously adjusts the emitting direction, thereby achieving the purpose of changing the laser beam path.
A field lens is provided downstream of the galvanometer lens, and the field lens and the galvanometer lens move simultaneously, and the field lens can focus the laser beam transmitted therethrough on the surface of the sample 4.
For example, if the surface roughness of the sample 4 is adjusted, it can be achieved by controlling the swing speed of the swing motor, specifically, when the swing speed of the swing motor becomes slow, the time for which the unit area of the surface of the sample 4 is subjected to laser cutting increases, that is, the irradiation density of the laser light on the unit area increases, so that the roughness of the surface of the sample 4 can be reduced. When the swing speed of the swing motor becomes high, the time for which the unit area of the surface of the sample 4 is subjected to laser cutting decreases, that is, the irradiation density of the laser light on the unit area decreases, so that the roughness of the surface of the sample 4 can be increased.
Thus, the laser processing component 32 can adjust the swing angle of the swing motor based on the processing instruction, and further adjust the scanning width of the laser, so as to process the surface of the sample 4, and make the roughness of the processed sample 4 meet the requirement.
As shown in fig. 2, in one embodiment, OCT module 1 further comprises a rangefinder 17.
Wherein the distance meter 17 can be arranged on the measuring arm 15. Before the OCT module 1 operates, the distance meter 17 may measure the distance H between the measuring arm 15 and the surface of the sample 4 and transmit the measured result to the processing unit 24 of the signal processing module 2, and the processing unit 24 compares the received measured result with a preset distance between the measuring arm 15 and the surface of the sample 4, and selects whether to adjust the distance between the measuring arm 15 and the surface of the sample 4 according to the compared result.
In order to focus the measurement light emitted from the measurement arm 15 on the surface of the sample 4, the distance between the measurement arm 15 and the surface of the sample 4 needs to be adjusted in advance before the operation. Since the focal point of the laser beam emitted by the measuring arm 15 is fixed, the distance between the focal point and the measuring arm 15 can be stored as a constant in the processing unit 24. When the distance H between the measuring arm 15 and the surface of the sample 4 measured by the distance meter 17 is not equal to the distance between the focal point stored in the processing unit 24 in advance and the measuring arm 15, the processing unit 24 controls the measuring arm 15 or the surface of the sample 4 to change positions so that the distance between the measuring arm 15 and the surface of the sample 4 is equal to the distance between the focal point and the measuring arm 15. Among them, since the difficulty of adjusting the surface of the sample 4 with respect to the measuring arm 15 is large, the processing unit can preferably adjust the position of the measuring arm 15.
The distance between the focal point and the measuring arm 15 may be a point value or a range value.
In this embodiment, the distance between the measuring arm 15 and the surface of the sample 4 can be measured by the distance meter 17, and when the distance cannot enable the measuring light emitted from the measuring arm 15 to form a focus on the surface of the sample 4, the position of the measuring arm 15 can be adjusted so that the measuring light emitted from the measuring arm 15 can be focused on the surface of the sample 4. The laser 321 of the laser processing unit 32 also needs to be focused on the surface of the sample 4 when adjusting the surface roughness of the sample 4 toward the surface of the sample 4. In this case, the focal points of the laser 321 and the measuring arm 15 may be positioned on the same plane in advance, and the laser 321 and the measuring arm 15 may be disposed on the same lifting mechanism, so that when the focal point cannot be focused on the surface of the sample 4 as a result of measurement by the rangefinder 17, the lifting of the laser 321 and the measuring arm 15 may be synchronously adjusted, so as to achieve that the focal points of the laser 321 and the measuring arm 15 can both be focused on the surface of the sample 4.
As shown in fig. 3, corresponding to the foregoing embodiment of the visual laser processing system, the present application further provides a visual laser processing method, where the visual laser processing method includes:
S100: emitting measurement light to the surface of the sample and emitting reference light to the reflecting mirror;
s200: receiving first reflected light formed by reflecting measuring light by the surface of the sample, receiving second reflected light formed by reflecting reference light by the reflecting mirror, and forming coherent light signals by the first reflected light and the second reflected light;
s300: converting the coherent light signal into a digital signal, and extracting an intensity signal for expressing the intensity of the coherent light signal from the digital signal;
s400: generating a visual three-dimensional image of the surface of the sample according to the intensity signal, and acquiring the roughness of the surface of the sample according to the visual three-dimensional image;
s500: and adjusting the scanning speed of the laser and/or the moving speed of the sample according to the roughness of the surface of the sample.
The above steps may refer to the aforementioned visualized laser processing system, and will not be described herein.
As shown in fig. 4, after the step of step S500, the method further includes:
s601: the Ra, rz, and Ry roughness of the surface of the sample is calculated based on the signal intensity versus depth relationship of the visual three-dimensional image.
Wherein Ra represents the calculated average depth of a certain area after measurement processing, and the arithmetic average value of the absolute value of the distance between the reference line and the surface profile of the sample is calculated by taking the average depth as the reference line.
Rz represents the sum of the average of 5 maximum profile peak heights and the average of 5 maximum profile valley depths over a predetermined length.
Ry represents the distance between the highest crest line and the lowest valley line of the profile within a predetermined length.
In this embodiment, according to the conversion of the intensity signal in the time domain into the microstructure image, three kinds of roughness Ra, rz and Ry can be calculated according to the relationship between the signal intensity and the depth.
Illustratively, the average depth of the sample surface is calculated with the sample surface as a measurement area, and Ra is obtained by dividing the sum of values above and below the reference line by the number of sampling points with the calculated average depth as the reference line and the arithmetic average of absolute values of distances between the reference line and the contours of the surface of the sample. Rz represents the microscopic unevenness, which is obtained by dividing the sum of the average of 5 maximum profile peak heights and the average of 5 maximum profile valley depths of the surface measurement region of the sample by 10. Ry represents the maximum height of the profile and represents the distance between the highest crest line and the lowest trough line of the profile at the surface of the sample.
S602: and determining whether the surface roughness of the sample reaches the target roughness according to the Ra, the Rz and the Ry roughness of the surface of the sample.
And comparing the measured surface roughness of the sample with the target roughness of the surface of the sample so as to determine whether to reprocess according to the comparison result.
S603: if the target roughness is not reached, the steps of S100 to S500 are repeated.
If the calculated Ra, rz and Ry values do not meet the target roughness, the surface of the sample needs to be processed again, and the steps from step S100 to step S500 are repeated until the adjusted surface roughness of the sample reaches the target roughness.
The foregoing examples merely illustrate specific embodiments of the invention, which are described in greater detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention.
Claims (5)
1. A visualized laser processing system, comprising:
an OCT module configured to: emitting measurement light to the surface of a sample, emitting reference light to a reflecting mirror, receiving first reflected light formed by reflecting the measurement light by the surface of the sample, receiving second reflected light formed by reflecting the reference light by the reflecting mirror, and forming coherent light signals by the first reflected light and the second reflected light;
A signal processing module connected with the OCT module, the signal processing module configured to: receiving the coherent light signal, converting the coherent light signal into a digital signal, extracting an intensity signal for expressing the intensity of the coherent light signal from the digital signal, generating a visual three-dimensional image of the surface of the sample according to the intensity signal, and acquiring the roughness of the surface of the sample according to the visual three-dimensional image;
a processing module coupled to the signal processing module, the processing module configured to: emitting laser acting on the surface of the sample, and responding to a processing instruction emitted by the signal processing module according to the roughness of the surface of the sample, and adjusting the scanning speed of the laser and/or the moving speed of the sample;
wherein the OCT module comprises: the device comprises a super-radiation light-emitting diode, an indication light source, a first beam combiner, a second beam combiner, a measuring arm and a reference arm;
the first beam combiner is disposed downstream of the superluminescent diode and the indication light source, the first beam combiner configured to: combining the super-radiation light-emitting diode and the light beam emitted by the indication light source to form a light beam; wherein the superluminescent light emitting diode emits light of a wavelength of 1.3 μm or 1.55 μm;
The second beam combiner is disposed downstream of the first beam combiner, the second beam combiner configured to: splitting one light beam emitted by the first beam combiner into two light beams with the same power, taking one light beam as the measuring light, emitting the measuring light to a measuring arm, and taking the other light beam as the reference light, emitting the other light beam to a reference arm;
the measuring arm and the reference arm are arranged at the downstream of the second beam combiner; the measurement arm is configured to: directing the measurement light to a surface of a sample, receiving the first reflected light, and reflecting the first reflected light back to the second beam combiner;
the reference arm is configured to: reflecting the reference light to form second reflected light, and reflecting the second reflected light back to the second beam combiner;
the OCT module further includes a rangefinder;
the rangefinder is disposed on the measurement arm, the rangefinder configured to: emitting measurement light to the surface of the sample, determining the distance between the surface of the sample and the measurement arm, and transmitting the measurement result to the signal processing module so that the signal processing module adjusts the distance between the measurement arm and the surface of the sample according to the measurement result;
The signal processing module comprises a detector, a lock-in amplifier, an analog-digital converter and a processing unit;
the probe is connected with the OCT module, the probe configured to: converting the coherent optical signal into an electrical signal; wherein the detector is a photoelectric detector;
the lock-in amplifier is connected with the detector, and the lock-in amplifier is configured to: receiving the electric signal sent by the detector, filtering out non-working frequency band signals in the electric signal, amplifying other working frequency band signals, and transmitting the amplified signals to the analog-digital converter;
the analog-to-digital converter is coupled to the lock-in amplifier, the analog-to-digital converter configured to: converting the operating band signal to a digital signal;
the processing unit is connected with the analog-to-digital converter, and the processing unit is configured to: selecting a maximum value signal of the analog-digital converter, sampling the maximum value signal at a preset frequency in a time domain to obtain the intensity signal, and converting the intensity signal into the visual three-dimensional image;
the processing module comprises: a conveyor belt and a laser machining assembly;
The transmission belt is connected with the signal processing module, and the transmission belt is configured to: adjusting a transmission speed in response to the processing instruction;
the laser processing assembly is connected with the signal processing module, and the laser processing assembly is configured to: responding to the processing instruction, and adjusting the scanning speed of the laser;
the laser processing assembly includes a laser coupled to the signal processing module, the laser configured to: emitting a laser beam in response to the processing instruction, wherein the laser and the focal point of the measuring arm are positioned on the same plane, and the laser and the measuring arm are arranged on the same lifting mechanism;
the measuring arm comprises a first collimating lens and a first galvanometer;
the first collimating lens is arranged on an optical path between the second beam combiner and the galvanometer, and is configured to: receiving the measuring light, collimating the measuring light, and then radiating the measuring light to the first vibrating mirror;
the first galvanometer is configured to: directing the collimated measurement light to a surface of the sample, receiving the first reflected light, and directing the first reflected light to the first collimating lens;
The reference arm comprises a second collimating lens and the reflecting mirror;
the second collimating lens is arranged on an optical path between the second beam combiner and the reflecting mirror, and the second collimating lens is configured to: receiving the reference light, collimating the reference light, and directing the reference light to the reflecting mirror;
the mirror is configured to: and reflecting the collimated reference light to form second reflected light, and directing the second reflected light to the second beam combiner.
2. The visual laser processing system of claim 1 wherein the conveyor belt includes a motor controlling its speed of conveyance;
the motor is configured to: and controlling the transmission speed of the transmission belt in response to the processing instruction of the signal processing module.
3. The visualized laser processing system of claim 1 wherein the laser processing assembly further comprises: a laser processing head and a second vibrating mirror;
the laser processing head is disposed downstream of the laser, the laser processing head configured to: directing the laser beam to a designated area;
the second galvanometer is arranged on the laser processing head and connected with the signal processing module, and the second galvanometer is configured to: and responding to the processing instruction, and adjusting the scanning speed of the laser.
4. A method of visual laser machining, applied to the visual laser machining system of any one of claims 1-3, the method comprising:
s100: combining light emitted by the super-radiation light-emitting diode and the indication light emitted by the indication light source to form a light beam;
s200: splitting one beam formed by beam combination into two beams with the same power, wherein one beam in the two beams with the same power is measuring light, and the other beam is reference light;
s300: emitting the measuring light to the surface of the sample, determining the distance between the surface of the sample and the measuring arm, and receiving first reflected light formed by the reflection of the measuring light by the surface of the sample;
s400: reflecting the reference light to a reflector to receive second reflected light formed by reflecting the reference light by the reflector;
s500: forming the first reflected light and the second reflected light into a coherent optical signal;
s600: converting a coherent optical signal into an electric signal, receiving the electric signal, filtering non-working frequency band signals in the electric signal, amplifying other working frequency band signals, and converting the amplified signals into digital signals;
s700: selecting a maximum value signal of the analog-digital converter, sampling the maximum value signal at a preset frequency in a time domain to obtain the intensity signal, converting the intensity signal into the visual three-dimensional image, and acquiring the roughness of the surface of the sample according to the visual three-dimensional image;
S800: and adjusting the scanning speed of the laser and/or the transmission speed of the sample in response to processing instructions sent out according to the roughness of the surface of the sample.
5. The visualized laser processing method of claim 4 wherein after the step of emitting laser light acting on the surface of the sample and adjusting the scanning speed of the laser light and/or the transport speed of the sample in response to processing instructions issued according to the roughness of the surface of the sample, it comprises:
s901: calculating Ra, rz and Ry roughness of the surface of the sample based on the signal intensity and depth relationship of the visual three-dimensional image, wherein,
ra represents the calculated average depth of a certain area after measurement processing, and takes the average depth as a datum line, and the arithmetic average value of the absolute value of the distance between the datum line and the surface profile of the sample is calculated;
rz represents the sum of the average of 5 maximum profile peak heights and the average of 5 maximum profile valley depths within a preset length;
ry represents the distance between the highest crest line and the lowest valley line of the profile within a preset length;
s902: determining whether the surface roughness of the sample reaches the target roughness according to the Ra, the Rz and the Ry roughness of the surface of the sample;
S903: if the target roughness is not reached, the steps of S100 to S800 are repeated.
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