CN115815792A - Visual laser processing system and method - Google Patents
Visual laser processing system and method Download PDFInfo
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- CN115815792A CN115815792A CN202310125439.6A CN202310125439A CN115815792A CN 115815792 A CN115815792 A CN 115815792A CN 202310125439 A CN202310125439 A CN 202310125439A CN 115815792 A CN115815792 A CN 115815792A
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Abstract
The application relates to a visual laser processing system and method. Comprises an OCT module configured to: emitting measurement light to the surface of a sample, emitting reference light to a reflector, receiving first reflected light formed by the reflection of the surface of the sample on the measurement light, receiving second reflected light formed by the reflection of the reflector on the reference light, and forming coherent light signals by the first reflected light and the second reflected light; the signal processing module is configured to: receiving a coherent light signal, converting the coherent light signal into a digital signal, extracting an intensity signal for expressing the intensity of the coherent light signal from the digital signal, generating a visible three-dimensional image of the surface of the sample according to the intensity signal, and acquiring the roughness of the surface of the sample according to the visible three-dimensional image; the processing module is configured to: emitting laser acting on the surface of the sample, and adjusting the scanning speed of the laser and/or the moving speed of the sample in response to a processing instruction sent by the signal processing module according to the roughness of the surface of the sample.
Description
Technical Field
The application relates to the technical field of laser processing, in particular to a visual laser processing system and method.
Background
The roughness of the surface of the workpiece can affect the wear resistance, stability of fit, fatigue strength, corrosion resistance, sealability, contact stiffness, measurement accuracy, plating of the part, thermal conductivity, contact resistance, reflectivity, radiation performance, resistance to liquid and gas flow, current flow through the surface of the conductor, etc. The roughness of the material surface during the laser processing is easily affected by the laser processing speed during the processing.
The surface roughness measuring instrument is a testing instrument for evaluating the surface quality of workpieces, can measure the roughness of the surfaces of various parts, including planes, inclined planes, outer cylindrical surfaces, inner hole surfaces, deep groove surfaces, bearing raceways and the like, and realizes multifunctional precision measurement of the surface roughness.
The traditional surface roughness measuring instrument can only measure the surface roughness of a workpiece after the surface of the workpiece is machined, and can not measure the surface of the workpiece in real time by displaying the roughness value through a window. In this way, when a technician processes a workpiece, in order to obtain a required workpiece surface roughness, it is necessary to set processing parameters based on the measured workpiece surface roughness after each measurement, process the workpiece surface, and then measure the workpiece surface again.
Therefore, the real-time measurement of the surface roughness of the workpiece cannot be realized, so that the technical personnel not only have long processing time and low processing efficiency when processing the workpiece, but also easily cause material waste in the repeated measurement and processing processes. In addition, because the traditional measurement mode can only obtain the numerical value of the surface roughness of the workpiece and cannot obtain the appearance imaging of the surface of the workpiece material, technicians cannot comprehensively know the condition of the surface roughness of the workpiece, and thus a richer processing detection method cannot be realized.
Disclosure of Invention
The application provides a visual laser processing system, which can solve the problems that in the prior art, the working efficiency is low, the appearance imaging of the surface of a workpiece material cannot be obtained, and a richer processing detection method cannot be realized.
This application first aspect provides a visual laser processing system, includes:
an OCT module configured to: emitting measurement light to the surface of a sample, emitting reference light to a reflector, receiving first reflected light formed by the reflection of the surface of the sample on the measurement light, receiving second reflected light formed by the reflection of the reflector on the reference light, and forming coherent light signals by the first reflected light and the second reflected light;
a signal processing module connected with the OCT module, the signal processing module configured to: receiving the coherent light signal, converting the coherent light signal into a digital signal, extracting an intensity signal for expressing the intensity of the coherent light signal from the digital signal, generating a visible three-dimensional image of the surface of the sample according to the intensity signal, and acquiring the roughness of the surface of the sample according to the visible three-dimensional image;
a processing module coupled to the signal processing module, the processing module configured to: emitting laser acting on the surface of the sample, and adjusting the scanning speed of the laser and/or the moving speed of the sample in response to a processing instruction sent by the signal processing module according to the roughness of the surface of the sample.
In one manner that may be implemented, the OCT module includes: the device comprises a superluminescent light emitting diode, an indicating light source, a first beam combiner, a second beam combiner, a measuring arm and a reference arm;
the first combiner is disposed downstream of the superluminescent light emitting diode and the indicator light source, the first combiner configured to: combining the light emitted by the superluminescent light-emitting diode and the light emitted by the indicating light source to form a light beam;
the second combiner disposed downstream of the first combiner, the second combiner configured to: splitting one light beam emitted by the first beam combiner into two light beams with the same power, taking one light beam as the measuring light and emitting the light beam to a measuring arm, and taking the other light beam as the reference light and emitting the light beam to a reference arm;
the measuring arm and the reference arm are both arranged at the downstream of the second beam combiner; the measurement arm is configured to: directing the measurement light toward a surface of a sample, receiving the first reflected light, and reflecting the first reflected light back to the second beam combiner; the reference arm is configured to: and reflecting the reference light to form second reflected light, and reflecting the second reflected light to the second beam combiner.
In one manner that may be implemented, the measurement arm includes a first collimating lens and a first galvanometer;
the first collimating lens is disposed on an optical path between the second beam combiner and the galvanometer, and configured to: receiving the measuring light, collimating the measuring light and then transmitting the collimated measuring light to the first galvanometer;
the first galvanometer configured to: directing the collimated measuring light to a surface of the sample, receiving the first reflected light, and directing the first reflected light to the first collimating lens;
the reference arm comprises a second collimating lens and the mirror;
the second collimating lens disposed on an optical path between the second beam combiner and the mirror, the second collimating lens configured to: receiving the reference light, collimating the reference light and then emitting the collimated reference light to the reflector;
the mirror configured to: and reflecting the collimated reference light to form second reflected light, and transmitting the second reflected light to the second beam combiner.
In one manner that may be implemented, the OCT module further comprises a range finder;
the rangefinder disposed on the measurement arm, the rangefinder configured to: emitting measuring light to the surface of the sample, determining the distance between the surface of the sample and the measuring arm, and transmitting the measuring result to the signal processing module, so that the signal processing module adjusts the distance between the measuring arm and the surface of the sample according to the measuring result.
In one manner that may be implemented, the signal processing module includes a detector, a lock-in amplifier, an analog-to-digital converter, and a processing unit;
the probe is connected with the OCT module, and the probe is configured to: converting the coherent optical signal into an electrical signal;
the lock-in amplifier is connected with the detector, and is configured to: receiving the electric signal sent by the detector, filtering out non-working frequency band signals in the electric signal, amplifying the rest working wave band signals and transmitting the amplified signals to the analog-digital converter;
the analog-to-digital converter is connected with the lock-in amplifier, and the analog-to-digital converter is configured to: converting the operating band signal into a digital signal;
the processing unit is connected with the analog-to-digital converter, the processing unit being configured to: and selecting a maximum value signal of the analog-digital converter, sampling the maximum value signal at a preset frequency in a time domain to obtain an intensity signal, and converting the intensity signal into the visible three-dimensional image.
In one manner that may be implemented, the processing module includes: a conveyor belt and a laser processing assembly;
the transmission band is connected with the signal processing module, and the transmission band is configured to: adjusting the transmission speed in response to the machining instruction;
the laser processing assembly is connected with the signal processing module, and is configured to: and adjusting the scanning speed of the laser in response to the processing instruction.
In one manner that may be implemented, the conveyor belt includes a motor that controls its conveying speed;
the motor is configured to: and responding to the processing instruction of the signal processing module, and controlling the transmission speed of the transmission belt.
In one manner that may be implemented, the laser machining assembly includes: the laser device, the laser processing head and the second galvanometer;
the laser is connected with the signal processing module, and the laser is configured to: emitting a laser beam in response to the processing instruction;
the laser processing head is disposed downstream of the laser, the laser processing head configured to: emitting the laser beam to a designated area;
the second galvanometer is arranged on the laser processing head and connected with the signal processing module, and is configured to: and adjusting the scanning speed of the laser in response to the processing instruction.
In a second aspect of the present application, a visual laser processing method is provided, which is applied to the visual laser processing system, and the method includes:
s100: emitting measurement light to the surface of the sample, and emitting reference light to the reflector;
s200: receiving first reflected light formed by the reflection of the surface of the sample on the measuring light and second reflected light formed by the reflection of the reference light by the reflecting mirror, and forming a coherent light signal by the first reflected light and the second reflected light;
s300: converting the coherent optical signal into a digital signal, and extracting an intensity signal expressing the intensity of the coherent optical signal from the digital signal;
s400: generating a visual three-dimensional image of the surface of the sample according to the intensity signal, and acquiring the roughness of the surface of the sample according to the visual three-dimensional image;
s500: emitting laser light acting on the surface of a sample, and adjusting the scanning speed of the laser light and/or the moving speed of the sample according to the roughness of the surface of the sample.
In one manner that can be implemented, the step of S500 is followed by:
calculating Ra, rz, and Ry roughness of the surface of the sample based on the signal intensity versus depth relationship of the visible three-dimensional image, wherein,
ra represents the arithmetic mean of the absolute values of the distances between the datum line and the surface profile of the sample by taking the calculated average depth of a certain area after measurement processing as the datum line;
rz represents the sum of the average of 5 maximum profile peak heights and the average of 5 maximum profile valley depths over a preset length;
ry represents the distance between the highest crest line and the lowest valley bottom line of the profile within a preset length;
s602: determining whether the surface roughness of the sample reaches the target roughness or not according to the roughness of Ra, rz and Ry of the surface of the sample;
s603: if the target roughness is not reached, repeating the steps from S100 to S500.
The beneficial effect of this application:
the OCT module respectively sends out a beam of light to the surface of the sample and the reflector, receives the corresponding returned beam, forms the returned beam into a coherent light signal, transmits the coherent light signal to the signal processing module, and the signal processing module converts the coherent light signal into a digital signal to obtain an intensity signal in the digital signal. Next, a visible three-dimensional image of the surface of the sample is generated based on the plurality of intensity signals over the time domain, so as to acquire the roughness of the surface of the sample through the visible three-dimensional image. Finally, the scanning speed of the laser of the processing module and/or the moving speed of the sample are adjusted according to the roughness of the surface of the sample. By means of the method, visualization of the surface roughness of the sample is achieved, and data analysis can be performed on the surface of the sample according to the visualized surface roughness of the sample, so that a richer processing detection method is achieved. In addition, the roughness of the surface of the workpiece can be intuitively known in real time by utilizing the visible three-dimensional image, the roughness of the surface of the workpiece is not required to be repeatedly measured, the working efficiency is improved, and the waste of materials caused in the repeated measurement and processing process can be avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic diagram of an OCT module, a signal processing module, and a processing module of a visual laser processing system according to the present application;
FIG. 2 is a schematic diagram of a visual laser processing system of the present application;
FIG. 3 is a flow chart of a visual laser processing method according to the present application;
fig. 4 is a flow chart of calculating the surface roughness of a sample in a visual laser processing method according to the present application.
Reference numerals:
1-an OCT module; 11-superluminescent light emitting diodes; 12-an indicator light source; 13-a first combiner; 14-a second combiner; 15-a measuring arm; 151-a first collimating lens; 152-a first galvanometer; 16-a reference arm; 161-a second collimating lens; 162-a mirror; 17-a range finder;
2-a signal processing module; 21-a detector; 22-a lock-in amplifier; 23-an analog-to-digital converter; 24-a processing unit;
3-processing the module; 31-a conveying belt; 311-a motor; 32-a laser machining assembly; 321-a laser; 322-a laser machining head; 323-second galvanometer;
4-sample.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be apparent that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to facilitate the technical solution of the present application, some concepts related to the present application will be described below.
An Optical Coherence Tomography (OCT) module, abbreviated as an OCT module, is a module that detects back-reflected or several-time scattered signals of incident weak coherent light at different depth levels of a biological tissue by using the basic principle of a weak coherent Optical interferometer, and obtains a two-dimensional or three-dimensional structural image of the biological tissue through scanning.
A visual three-dimensional image for displaying a tool for describing and understanding the surface features of an object.
The envelope refers to a line of amplitude maxima of oscillations of the optical signal, wherein the line of maxima represents the appearance of the optical signal.
As shown in fig. 1, the present application provides a visual laser processing system, which includes an OCT module 1, a signal processing module 2, and a processing module 3.
Wherein the OCT module 1 is configured to: the method comprises the steps of emitting measuring light to the surface of a sample, emitting reference light to a reflector, receiving first reflected light formed by reflection of the surface of the sample on the measuring light, receiving second reflected light formed by reflection of the reflector on the reference light, and forming coherent light signals by the first reflected light and the second reflected light.
Specifically, the OCT module 1 may emit two beams of light by the light source, and the two beams of light may be emitted by one light source or may be emitted by more than two light sources. If the number of the light sources is two, the light beams emitted by the two light sources have the same wavelength. If the number of the light sources is more than two, for example, three light sources, two of the light sources need to be combined to form one light source, and the combined light source needs to have the same wavelength as the light emitted by the other light source so as to form a coherent light signal.
Two beams emitted by the OCT module 1, wherein one beam is taken as measuring light and is emitted to the surface of a sample, the measuring light forms diffuse reflection on the surface of the sample after passing through the surface of the sample, the measuring light can form reflected light emitted to each direction through the surface of the sample due to different surface relief heights of the sample, the reflected light in each direction can express the relief shape of the surface of the sample, and the reflected light in each direction forms first reflected light, namely the first reflected light is formed by the diffuse reflected light on the surface of the sample and carries information of the surface of the sample; the other light beam is used as reference light, is emitted to the reflecting mirror and is reflected by the reflecting mirror to form second reflected light. The first reflected light and the second reflected light are received by the OCT module 1, and a coherent light signal is formed at the OCT module 1, and the first reflected light carries surface information of the sample, so that the coherent light signal formed at the OCT module 1 carries the surface information of the sample.
To maximize the interference signal emitted from the OCT module 1, the initial position of the second reflected light needs to be adjusted so that the OCT module 1 receives the first reflected light and the second reflected light with the same phase difference, thereby maximizing the interference signal.
The signal processing module 2 is connected with the OCT module 1 through a line, and signal transmission between the signal processing module 2 and the OCT module 1 is realized. The signal processing module 2 is configured to: the method includes receiving a coherent light signal, converting the coherent light signal into a digital signal, extracting an intensity signal expressing intensity of the coherent light signal from the digital signal, generating a visible three-dimensional image of a surface of a sample according to the intensity signal, and acquiring roughness of the surface of the sample according to the visible three-dimensional image.
It should be noted that, since the intensity of the coherent light signal output from the OCT module 1 is positively correlated with the undulation height of the material surface structure, that is, the weaker the light signal is, the lower the relative height of the material surface structure is. Therefore, the signal processing module 2 extracts the intensity signal in the coherent light signal, and then performs corresponding processing on the intensity signal, so as to obtain a visible three-dimensional image formed by the intensity of the intensity signal.
The processing module 3 is connected with the signal processing module 2, and the processing module 3 is configured to: emitting laser light acting on the surface of the sample, and adjusting the scanning speed of the laser light and/or the moving speed of the sample in response to a processing instruction issued by the signal processing module 2 according to the roughness of the surface of the sample.
Specifically, the laser emitted by the processing module 3 to the surface of the sample can cut the surface of the sample, and adjust the roughness of the surface of the sample, for example, the surface of the sample is made smoother or rougher by the laser, the working mode of the laser can be set as required, and the embodiment is not limited. The working mode of the laser is controlled by the processing instruction sent by the signal processing module 2, and after the processing module 3 receives the processing instruction, the scanning speed of the laser or the moving speed of the sample is adjusted, so that the effect of adjusting the surface roughness of the sample is achieved.
Illustratively, the laser cutting time per unit area of the sample 4 may be increased by reducing the laser scanning speed to increase the irradiation density of the laser light per unit area, thereby reducing the roughness of the surface of the sample 4. In addition, the moving speed of the sample may be reduced to reduce the roughness of the surface of the sample 4 without changing the scanning speed of the laser. In addition, it is also possible to reduce both the laser scanning speed and the moving speed of the sample 4 to reduce the roughness of the surface of the sample 4. On the contrary, if the laser scanning speed is increased or the moving speed of the sample 4 is increased, the surface roughness of the sample 4 can be increased.
In this embodiment, the OCT module 1 is used to send a beam of light to the surface of the sample and the reflecting mirror, receive a corresponding returned beam of light, form a coherent light signal from the returned beam of light, transmit the coherent light signal to the signal processing module 2, and the signal processing module 2 converts the coherent light signal into a digital signal to obtain an intensity signal in the digital signal. Next, a visible three-dimensional image of the surface of the sample is generated based on the intensity signal, so that the roughness of the surface of the sample is acquired by the visible three-dimensional image. Finally, the scanning speed of the laser of the processing module 3 and/or the moving speed of the sample are adjusted according to the roughness of the surface of the sample. By means of the method, visualization of the surface roughness of the sample is achieved, data analysis can be conducted on the surface of the sample according to the visualized surface roughness of the sample, a richer processing detection method is achieved, the roughness of the surface of the workpiece can be visually known in real time by means of the visual three-dimensional image, repeated measurement of the surface roughness of the workpiece is not needed, and working efficiency is improved.
As shown in fig. 2, in one embodiment, the OCT module 1 comprises: superluminescent light emitting diode 11, indicating light source 12, first beam combiner 13, second beam combiner 14, measuring arm 15 and reference arm 16.
Here, the superluminescent light emitting diode 11 is an optoelectronic semiconductor device that can radiate broadband light based on the superluminescent phenomenon. The superluminescent light emitting diode 11 includes a current-driven p-n junction and an optical waveguide for emitting a light beam in the vicinity of wavelengths of 800 nm,1300 nm and 1550 nm. The superluminescent light emitting diode 11 radiates light close to the diffraction limit in space, i.e. the spatial coherence and the beam quality are high, which facilitates the formation of a coherent beam. Illustratively, the superluminescent light emitting diode 11 may be replaced by a fiber-coupled light source, which is not limited in this embodiment.
The indication light source 12 is used for emitting visible light, so that a user can know the position of the light beam of the superluminescent light emitting diode 11 through the light beam emitted by the indication light source 12, and the working convenience is improved. The indicator light source 12 may be a fiber coupled red Laser Diode (LD) capable of emitting visible light.
A first beam combiner 13 is arranged downstream of the superluminescent light emitting diode 11 and the indicator light source 12. The visible light beam emitted from the indication light source 12 and the light beam emitted from the superluminescent light emitting diode 11 are both emitted to the first beam combiner 13, and the two light beams are combined into one light beam by the first beam combiner 13 and emitted to the second beam combiner 14. Thus, the user can determine the emitting direction of the light beam emitted from the superluminescent light emitting diode 11 by observing the visible light beam from the indicating light source 12.
The second beam combiner 14 is disposed downstream of the first beam combiner 13, and is configured to split the beam combined by the first beam combiner 13 into two beams, and emit one of the two beams as a measurement light to the measurement arm 15, and emit the other beam as a reference light to the reference arm 16.
To facilitate understanding of the embodiment, the beam directed to the measuring arm 15 is here denominated measuring light and the beam directed to the reference arm 16 is denominated reference light. Wherein, the wavelengths of the measuring light and the reference light are the same.
In the embodiment of the present application, the measurement arm 15 refers to a generic name of one or more devices on the transmission channel of the measurement light, and the reference arm 16 refers to a generic name of one or more devices on the transmission channel of the reference light. Both the measurement arm 15 and the reference arm 16 are arranged downstream of the second combiner 14.
The measurement arm 15 may direct the measurement light to the surface of the sample 4, and may also receive the first reflected light formed by the measurement light irradiation on the surface of the sample 4. The first reflected light carries information of the surface of the sample 4. The signal intensity of the first reflected light differs due to the difference in roughness of the surface of the sample 4, and specifically, the signal intensity of the first reflected light is positively correlated with the undulation height of the material surface structure.
In one implementation, the measurement arm 15 may include a first collimating lens 151 and a first galvanometer 152. The first collimating lens 151 is disposed on an optical path between the second beam combiner 14 and the first galvanometer 152, and the first collimating lens 151 can receive the measurement light directed thereto so that the measurement light is collimated after passing through the first collimating lens 151. The first galvanometer 152 disposed downstream of the first collimating lens 151 is capable of directing the measurement light collimated by the first collimating lens 151 toward the surface of the sample 4 such that the measurement light forms diffusely reflected first reflected light at the surface of the sample 4, and the first galvanometer 152 receives the diffusely reflected first reflected light and reflects the first reflected light to the first collimating lens 151. The first collimating lens 151 can also receive the first reflected light reflected by the first vibrating mirror 152 and transmit the first reflected light to the second beam combiner 14.
In this way, the measurement light collimated by the first collimating lens 151 and the first galvanometer 152 toward the surface of the sample 4 can be formed, so as to improve the reflection efficiency of the first reflected light, and more of the first reflected light is reflected by the first galvanometer 152 to the second beam combiner 14.
In addition, the reference arm 16 may reflect the reference light back to the second beam combiner 14 to form a second reflected light, and the second reflected light may be used as the reference light of the first reflected light.
In one implementation, the reference arm 16 may include a second collimating lens 161 and a mirror 162. The second collimating lens 161 is disposed between the second beam combiner 14 and the reflecting mirror 162, and the second collimating lens 161 can receive the reference light directed thereto, so that the reference light is collimated after passing through the second collimating lens 161. The mirror 162 disposed downstream of the second collimating lens 161 can reflect the reference light collimated by the second collimating lens 161 to form second reflected light, and can direct the second reflected light to the second collimating lens 161. The second collimating lens 161 can also receive the second reflected light reflected by the mirror 162 and transmit the second reflected light to the second beam combiner 14.
In this way, the second collimating lens 161 and the reflecting mirror 162 can form the second reflected light as the reference data, and the second collimating lens 161 can return the second reflected light formed by the reflecting mirror 162 to the second collimating lens 161 as it is.
Before measuring the surface of the light measurement sample 4, it is necessary to obtain the focal length of the measurement light and adjust the optical path length of the reference light according to the focal length of the measurement light, so that the first reflected light formed by the measurement light and the second reflected light formed by the reference light can have the same phase difference when received by the second beam combiner. Specifically, the distance between the second collimating lens 161 and the reflecting mirror 162 may be adjusted, and thus the optical path of the second reflected light may be adjusted, so that the adjusted second reflected light has the same phase difference as the first reflected light.
In this embodiment, a first reflected light carrying the surface roughness of the sample is formed by using the measuring arm 15, a second reflected light having reference data is formed by using the reference arm 16, and the first reflected light and the second reflected light form a coherent light signal in the second beam combiner 14, so that information such as the surface roughness of the sample can be determined by using the coherent light signal in the following.
As shown in fig. 2, in one embodiment, the first combiner 13 is a combiner having 2X1 channels. The second beam combiner 14 is a 2X 2-channel polarization beam combiner with a beam splitting ratio of 50.
The first beam combiner 13 is a beam combiner having 2X1 channels, wherein two channels on one side are respectively used for receiving light beams emitted by the superluminescent light emitting diode 11 and the indication light source 12, and the other channel is used for transmitting a light beam formed by combining the light beam emitted by the superluminescent light emitting diode 11 and the light beam emitted by the indication light source 12 to the second beam combiner 14 through the first beam combiner 13.
In addition, of the 2X2 channels of the second beam combiner 14, one of the two channels on one side is used for receiving one light beam formed by the first beam combiner 13, and the other channel is used for transmitting the coherent light signal to the signal processing module 2; of the two channels on the other side, one channel is used for transmitting the measurement light and the first reflected light, and the other channel is used for transmitting the measurement light and the second reflected light.
The beam splitting ratio of the second beam combiner 14 is 50:50, namely splitting the light beam formed by the first beam combiner 13 into 50.
As shown in fig. 2, in one embodiment, the signal processing module 2 may include a detector 21, a lock-in amplifier 22, an analog-to-digital converter 23, and a processing unit 24.
Wherein the detector 21 is connected with the second beam combiner 14 in the OCT module 1. The detector 21 may receive the coherent optical signal emitted by the second beam combiner 14 and convert the coherent optical signal into an electrical signal. Preferably, the detector 21 is a photodetector 21.
The lock-in amplifier 22 is connected to the detector 21. The lock-in amplifier 22 is used to receive the electrical signal emitted by the detector 21. The lock-in amplifier 22 is preset with an operating frequency band, and when the electrical signal passes through the lock-in amplifier 22, the lock-in amplifier 22 can filter out the electrical signal in the non-operating frequency band from the electrical signal, and only allow the electrical signal in the operating frequency band to pass through. The lock-in amplifier 22 is capable of filtering out high frequency signals from the electrical signal, allowing low frequency signals to pass through, and amplifying the low frequency signals. The electrical signal is filtered by the lock-in amplifier 22 to form an analog signal. Illustratively, the time domain of the coherent optical signal contains a low frequency signal (envelope) and a high frequency signal (oscillating part). The low-pass filter in the lock-in amplifier 22 can filter out the high-frequency signal and only keep the low-frequency signal; then, the low frequency signal is amplified again, and finally only the envelope is output.
The analog-to-digital converter 23 is connected to the lock-in amplifier 22. The analog-to-digital converter 23 may convert the electrical signal of the operating frequency band into a digital signal so that the signal can be recognized by the processing unit 24.
The processing unit 24 is connected to the analog-to-digital converter 23. The processing unit 24 first selects the maximum signal of the adc 23, then samples the maximum signal at a preset frequency in the time domain to obtain an intensity signal, stores the intensity signal as intensity data in the two-dimensional array, forms a visible three-dimensional image by using the intensity data in the two-dimensional array, and obtains the surface roughness of the sample 4 according to the visible three-dimensional image. The surface of the sample 4 is processed in this way in accordance with the obtained roughness, and the surface roughness of the sample 4 is adjusted.
Illustratively, the process of forming the visible three-dimensional image by the two-dimensional array may be: sampling is performed at a preset frequency of 10kHz to obtain data of an intensity signal of coherent light, and then quantization coding is performed on the obtained data, and the data is input to a two-dimensional array in the processing unit 24.
The rows of the two-dimensional array correspond to the x axis of the visible three-dimensional image, and the columns of the two-dimensional array correspond to the y axis of the visible three-dimensional image. Therefore, the values of the quantization codes at different positions in the two-dimensional array correspond to the z-axis coordinate values at different positions of the visual three-dimensional image, and are used for representing the depth of the visual three-dimensional image at different positions.
In a specific implementation, the measuring light can scan the surface of the sample line by line, for example: the measuring light can be irradiated on the surface of the sample in a point light source manner and moved in a set direction to realize scanning. And after one line of scanning is finished, the first reflected light corresponding to the one line of area of the sample can be obtained, the intensity data corresponding to the one line of area can be further obtained, and the intensity data corresponding to each line of area is correspondingly stored in one line of the two-dimensional array. For example: the method comprises the steps of completing first-line scanning on the surface of a sample by using measuring light, obtaining first reflected light corresponding to a first-line area, interfering the first reflected light corresponding to the first-line area with second reflected light to obtain a coherent light signal corresponding to the first-line area, further performing photoelectric conversion, amplification, sampling and other processing on the coherent light signal corresponding to the first-line area, and obtaining intensity data corresponding to the first-line area. Finally, the intensity signal corresponding to the first row region may be stored into the first row of the two-dimensional array. Correspondingly, if the measuring light finishes scanning the second line of the surface of the sample, the first reflected light corresponding to the second line of the area can be obtained, the intensity data corresponding to the second line of the area can be stored in the second line of the two-dimensional array, and the like.
It will be appreciated that measuring light takes a certain amount of time for each complete line scan. For example: if the laser is moved in the width direction of the sample 4 and the time required for the laser to move from one end to the other end is 0.5 seconds, the time for the laser to complete one line scan can be considered to be 0.5 seconds. Then, for a certain workpiece surface, if 120 lines are required to be scanned to complete the whole scanning, a three-dimensional visible image of the workpiece surface can be constructed in about 1 minute, and if 600 lines are required to be scanned to complete the whole scanning, a three-dimensional visible image of the workpiece surface can be constructed in about 5 minutes.
In the embodiment of the present application, the time required for scanning one line is merely an example, and does not specifically limit the embodiment of the present application.
The processing unit 24 may be one of a computer, an industrial personal computer, an MCU, an SOC, and a single chip microcomputer, and is preferably a computer.
It should be noted that the preset frequency in the time domain is proportional to the resolution, i.e. the higher the frequency, the higher the resolution, and the lower the frequency, the lower the resolution. The predetermined frequency may be set in dependence on the sample 4, i.e. different frequencies may be set for different samples 4.
In this embodiment, the detector 21 is used to receive the coherent optical signal and convert the coherent optical signal into an electrical signal, so that the lock-in amplifier 22 can filter the operating frequency band in the electrical signal. Then, the lock-in amplifier 22 is used to filter out the non-working frequency band, reserve the working frequency band, and amplify the reserved working frequency band. Next, the reserved operating frequency band is converted into a digital signal by the analog-to-digital converter 23 so as to be identified by the processing unit 24, wherein the digital signal represents that a plurality of coherent optical signals are generated when the first galvanometer 152 scans the surface of the sample 4, and after filtering, amplification and analog-to-digital conversion, signals are obtained, and each coherent optical signal has a corresponding waveform.
In this way, the processing unit 24 can sample the maximum value of the digital signal with the preset frequency in the time domain to obtain the intensity data, and then store the intensity data in the two-dimensional data set, and form the visible three-dimensional image by using the two-dimensional data set, so as to image the processing area in real time through the visible three-dimensional image, thereby providing possibility for a richer processing detection method. In addition, the processing unit 24 can obtain the roughness of the surface of the sample 4 according to the obtained visible three-dimensional image and by using the visible three-dimensional image, and send a processing instruction to the processing module 3 according to the roughness of the surface of the sample 4, so as to adjust the roughness of the surface of the sample 4 according to the visible three-dimensional image.
As shown in fig. 2, in one embodiment, the processing module 3 may include: a conveyor belt 31 and a laser machining assembly 32.
Wherein the transmission band 31 is connected with the processing unit 24 of the signal processing module 2, the transmission band 31 being configured to: the transfer speed is adjusted in response to the machining instruction.
Specifically, the conveying belt 31 further includes a motor 311 controlling its conveying speed, and the motor 311 is electrically driven. The motor 311 is connected to the processing unit 24 of the signal processing module 2, and when the signal processing unit 24 sends out a processing instruction, the motor 311 rotates according to the instruction in the processing instruction, thereby controlling the operation of the conveyor belt 31.
The sample 4 can be placed on the top surface of the conveyor belt 31, and when the motor 311 drives the conveyor belt 31 to rotate, the sample 4 placed on the conveyor belt 31 moves along with the rotation of the conveyor belt 31.
The laser processing assembly 32 is connected to the processing unit 24 of the signal processing module 2, the laser processing assembly 32 can receive a processing instruction sent by the processing unit 24, and the laser processing assembly 32 adjusts the scanning speed of the laser in response to the processing instruction.
In this embodiment, when the processing unit 24 in the signal processing module 2 converts the intensity signal into the visible three-dimensional image, the surface roughness of the sample 4 is obtained, and the roughness is compared with a preset roughness, where the preset roughness refers to a roughness that the surface of the sample 4 is expected to reach. Based on the comparison result, the processing unit 24 issues a processing command so that the motor 311 and the laser processing assembly 32 perform corresponding actions in response to the processing signal, respectively.
As shown in fig. 2, in one embodiment, the laser machining assembly 32 includes a laser 321, a laser machining head 322, and a second galvanometer 323;
the laser 321 is connected to the processing unit 24 of the signal processing module 2, and the laser 321 responds to the processing instruction sent by the processing unit 24 and emits a laser beam to the surface of the sample 4 according to the instruction.
A laser processing head 322 is provided downstream of the laser 321, and the laser processing head 322 directs a laser beam emitted by the laser 321 to a specified area.
The second galvanometer 323 is arranged on the laser processing head 322 and connected with the processing unit 24 of the signal processing module 2, and the second galvanometer 323 can adjust the swing angle thereof in response to the processing instruction, thereby realizing the adjustment of the scanning speed of the laser.
It should be noted that the second galvanometer 323 is a scanning second galvanometer 323 applied to laser, and is specifically a swing motor with a galvanometer piece, when a position signal is input to the swing motor, the swing motor swings by a certain angle according to the position signal and a certain voltage-to-angle conversion ratio, and the galvanometer piece rotates back and forth at a high speed under the driving of the swing motor, so that the laser beam emitted to the galvanometer piece is continuously adjusted in the emitting direction, thereby achieving the purpose of changing the laser beam path.
Further, a field lens is provided downstream of the galvanometer lens, and the field lens and the galvanometer lens move simultaneously, and the field lens can focus the laser beam transmitted therethrough on the surface of the sample 4.
For example, if the surface roughness of the sample 4 is adjusted, it is possible to control the swing speed of the swing motor, and specifically, when the swing speed of the swing motor becomes slow, the time for which the unit area of the surface of the sample 4 is subjected to laser cutting increases, that is, the irradiation density of the laser light on the unit area increases, so that the roughness of the surface of the sample 4 can be reduced. When the swing speed of the swing motor becomes fast, the time for which the unit area of the surface of the sample 4 is subjected to laser cutting is reduced, that is, the irradiation density of the laser light per unit area is reduced, so that the roughness of the surface of the sample 4 can be increased.
In this way, the laser processing assembly 32 can adjust the swing angle of the swing motor based on the processing instruction, and further adjust the scanning width of the laser, so as to implement the processing of the surface of the sample 4, and make the roughness of the processed sample 4 meet the requirement.
As shown in fig. 2, in one embodiment, the OCT module 1 further comprises a range finder 17.
Wherein the distance meter 17 may be arranged on the measuring arm 15. Before the OCT module 1 is operated, the distance meter 17 may measure the distance H between the measuring arm 15 and the surface of the sample 4 and transmit the measured result to the processing unit 24 of the signal processing module 2, and the processing unit 24 compares the received measurement result with a preset distance between the measuring arm 15 and the surface of the sample 4, and selects whether to adjust the distance between the measuring arm 15 and the surface of the sample 4 according to the comparison result.
In order to focus the measurement light emitted from the measurement arm 15 on the surface of the sample 4, the distance between the measurement arm 15 and the surface of the sample 4 needs to be adjusted in advance before the operation. Since the focal point of the laser beam emitted by the measuring arm 15 is fixed, the distance between the focal point and the measuring arm 15 can be stored as a constant in the processing unit 24. When the distance H between the measuring arm 15 and the surface of the sample 4 measured by the distance meter 17 is not equal to the distance between the focal point previously stored in the processing unit 24 and the measuring arm 15, the processing unit 24 controls the measuring arm 15 or the surface of the sample 4 to change positions so that the distance between the measuring arm 15 and the surface of the sample 4 is equal to the distance between the focal point and the measuring arm 15. Wherein the processing unit may preferably adjust the position of the measuring arm 15, since the difficulty of adjusting the surface of the sample 4 is large relative to the adjusting of the measuring arm 15.
It should be noted that the distance between the focal point and the measuring arm 15 may be a point value or a range value.
In this embodiment, the distance between the measuring arm 15 and the surface of the sample 4 can be measured by the distance meter 17, and when the distance is not enough to make the measuring light emitted from the measuring arm 15 form a focus on the surface of the sample 4, the position of the measuring arm 15 can be adjusted to make the measuring light emitted from the measuring arm 15 focus on the surface of the sample 4. The laser 321 of the laser processing unit 32 is also required to be focused on the surface of the sample 4 when adjusting the surface roughness of the sample 4 by being directed to the surface of the sample 4. In this case, the focal points of the laser 321 and the measuring arm 15 can be located on the same plane in advance, and the laser 321 and the measuring arm 15 are disposed on the same lifting mechanism, and when the focal point cannot be focused on the surface of the sample 4 as a result of the measurement performed by the range finder 17, the laser 321 and the measuring arm 15 can be synchronously adjusted to lift and lower, so that the focal points of the laser 321 and the measuring arm 15 can be focused on the surface of the sample 4.
As shown in fig. 3, corresponding to the foregoing embodiment of the visual laser processing system, the present application further provides a visual laser processing method, where the visual laser processing method includes:
s100: emitting measurement light to the surface of the sample, and emitting reference light to the reflector;
s200: receiving first reflected light formed by the reflection of the surface of the sample on the measuring light and second reflected light formed by the reflection of the reference light by the receiving reflector, and forming a coherent light signal by the first reflected light and the second reflected light;
s300: converting the coherent optical signal into a digital signal, and extracting an intensity signal expressing the intensity of the coherent optical signal from the digital signal;
s400: generating a visible three-dimensional image of the surface of the sample according to the intensity signal, and acquiring the roughness of the surface of the sample according to the visible three-dimensional image;
s500: emitting laser light acting on the surface of the sample, and adjusting the scanning speed of the laser light and/or the moving speed of the sample according to the roughness of the surface of the sample.
The above steps can refer to the aforementioned visual laser processing system, and are not described herein again.
As shown in fig. 4, the method further includes, after the step S500:
s601: based on the signal intensity versus depth of the visible three-dimensional image, the Ra, rz, and Ry roughness of the surface of the sample were calculated.
Where Ra represents an arithmetic average of absolute values of distances between a reference line and a surface profile of a sample, which is calculated from a predetermined area after measurement processing, as the reference line.
Rz represents the sum of the average of 5 maximum profile peak heights and the average of 5 maximum profile valley depths over a preset length.
Ry represents the distance between the highest crest line and the lowest valley line of the profile within a preset length.
In this embodiment, the intensity signal in the time domain is converted into the microstructure image, and three kinds of roughness of Ra, rz, and Ry can be calculated according to the relationship between the signal intensity and the depth.
For example, ra can be obtained by taking the surface of the sample as a measurement region, calculating the average depth of the surface of the sample, and taking the calculated average depth as a reference line, taking the arithmetic average of the absolute values of the distances between the reference line and the profile of the surface of the sample, and dividing the sum of the values higher and lower than the reference line by the number of sampling points. Rz represents the micro unevenness, and the micro unevenness can be obtained by the sum of the average value of 5 maximum profile peak heights and the average value of 5 maximum profile valley depths of the surface measurement area of the sample and dividing by 10. Ry represents the maximum height of the profile and the distance between the highest peak line and the lowest valley line of the profile at the surface of the sample.
S602: and determining whether the surface roughness of the sample reaches the target roughness or not according to the Ra, rz and Ry roughness of the surface of the sample.
And comparing the measured surface roughness of the sample with the target roughness of the surface of the sample so as to determine whether to reprocess according to a comparison result.
S603: if the target roughness is not reached, repeating the steps from S100 to S500.
If the calculated values of Ra, rz and Ry do not meet the target roughness, the surface of the sample needs to be machined again, and the steps from S100 to S500 are repeated until the adjusted surface roughness of the sample reaches the target roughness.
The above examples only express the specific embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (10)
1. A visual laser processing system, comprising:
an OCT module configured to: emitting measurement light to the surface of a sample, emitting reference light to a reflector, receiving first reflected light formed by the reflection of the surface of the sample on the measurement light, receiving second reflected light formed by the reflection of the reflector on the reference light, and forming coherent light signals by the first reflected light and the second reflected light;
a signal processing module connected with the OCT module, the signal processing module configured to: receiving the coherent light signal, converting the coherent light signal into a digital signal, extracting an intensity signal for expressing the intensity of the coherent light signal from the digital signal, generating a visible three-dimensional image of the surface of the sample according to the intensity signal, and acquiring the roughness of the surface of the sample according to the visible three-dimensional image;
a processing module coupled to the signal processing module, the processing module configured to: emitting laser acting on the surface of the sample, and adjusting the scanning speed of the laser and/or the moving speed of the sample in response to a processing instruction sent by the signal processing module according to the roughness of the surface of the sample.
2. The visualized laser processing system of claim 1, wherein the OCT module comprises: the device comprises a superluminescent light emitting diode, an indicating light source, a first beam combiner, a second beam combiner, a measuring arm and a reference arm;
the first combiner is disposed downstream of the superluminescent light emitting diode and the indication light source, the first combiner configured to: combining the light emitted by the superluminescent light emitting diode and the indicating light source into a light beam;
the second combiner disposed downstream of the first combiner, the second combiner configured to: splitting one light beam emitted by the first beam combiner into two light beams with the same power, taking one light beam as the measuring light and emitting the light beam to a measuring arm, and taking the other light beam as the reference light and emitting the light beam to a reference arm;
the measuring arm and the reference arm are both arranged at the downstream of the second beam combiner; the measurement arm is configured to: directing the measurement light toward a surface of a sample, receiving the first reflected light, and reflecting the first reflected light back to the second beam combiner; the reference arm is configured to: and reflecting the reference light to form second reflected light, and reflecting the second reflected light to the second beam combiner.
3. The visual laser processing system of claim 2,
the measuring arm comprises a first collimating lens and a first galvanometer;
the first collimating lens disposed on an optical path between the second beam combiner and the galvanometer, the first collimating lens configured to: receiving the measuring light, collimating the measuring light and then transmitting the collimated measuring light to the first galvanometer;
the first galvanometer configured to: directing the collimated measuring light to a surface of the sample, receiving the first reflected light, and directing the first reflected light to the first collimating lens;
the reference arm comprises a second collimating lens and the mirror;
the second collimating lens disposed on an optical path between the second beam combiner and the mirror, the second collimating lens configured to: receiving the reference light, collimating the reference light and then emitting the collimated reference light to the reflector;
the mirror configured to: and reflecting the collimated reference light to form second reflected light, and transmitting the second reflected light to the second beam combiner.
4. The visualized laser processing system of claim 3, wherein the OCT module further comprises a range finder;
the rangefinder disposed on the measurement arm, the rangefinder configured to: emitting measuring light to the surface of the sample, determining the distance between the surface of the sample and the measuring arm, and transmitting the measuring result to the signal processing module, so that the signal processing module can adjust the distance between the measuring arm and the surface of the sample according to the measuring result.
5. The visual laser processing system of claim 1, wherein the signal processing module comprises a detector, a lock-in amplifier, an analog-to-digital converter, and a processing unit;
the probe is connected with the OCT module, and the probe is configured to: converting the coherent optical signal into an electrical signal;
the lock-in amplifier is connected with the detector, and is configured to: receiving the electric signal sent by the detector, filtering out non-working frequency band signals in the electric signal, and amplifying and transmitting the rest working waveband signals to the analog-digital converter;
the analog-to-digital converter is connected with the lock-in amplifier, and the analog-to-digital converter is configured to: converting the operating band signal into a digital signal;
the processing unit is connected with the analog-to-digital converter, and is configured to: and selecting a maximum value signal of the analog-digital converter, sampling the maximum value signal at a preset frequency in a time domain to obtain an intensity signal, and converting the intensity signal into the visible three-dimensional image.
6. The visual laser processing system of claim 1, wherein the processing module comprises: a conveyor belt and a laser processing assembly;
the transmission band is connected with the signal processing module, and the transmission band is configured to: adjusting the transmission speed in response to the machining instruction;
the laser processing assembly is connected with the signal processing module, and is configured to: and adjusting the scanning speed of the laser in response to the processing instruction.
7. The visual laser machining system of claim 6, wherein the conveyor includes a motor to control the speed of the conveyor;
the motor is configured to: and responding to the processing instruction of the signal processing module, and controlling the transmission speed of the transmission belt.
8. The visualization laser machining system of claim 7, wherein the laser machining assembly comprises: the laser device, the laser processing head and the second galvanometer;
the laser is connected with the signal processing module, and the laser is configured to: emitting a laser beam in response to the processing instruction;
the laser processing head is disposed downstream of the laser, the laser processing head configured to: emitting the laser beam to a designated area;
the second galvanometer is arranged on the laser processing head and connected with the signal processing module, and is configured to: and adjusting the scanning speed of the laser in response to the processing instruction.
9. A visualized laser processing method, which is applied to the visualized laser processing system of any one of claims 1-8, the method comprising:
s100: emitting measurement light to the surface of the sample, and emitting reference light to the reflector;
s200: receiving first reflected light formed by the reflection of the surface of the sample on the measuring light and second reflected light formed by the reflection of the reference light by the reflecting mirror, and forming a coherent light signal by the first reflected light and the second reflected light;
s300: converting the coherent optical signal into a digital signal, and extracting an intensity signal expressing the intensity of the coherent optical signal from the digital signal;
s400: generating a visible three-dimensional image of the surface of the sample according to the intensity signal, and acquiring the roughness of the surface of the sample according to the visible three-dimensional image;
s500: emitting laser light acting on the surface of a sample, and adjusting the scanning speed of the laser light and/or the moving speed of the sample according to the roughness of the surface of the sample.
10. The visual laser processing method of claim 9, wherein the step S500 is followed by:
s601: calculating Ra, rz, and Ry roughness of the surface of the sample based on the signal intensity versus depth relationship of the visible three-dimensional image, wherein,
ra represents the arithmetic mean of the absolute values of the distances between the datum line and the surface profile of the sample by taking the calculated average depth of a certain area after measurement processing as the datum line;
rz represents the sum of the average of 5 maximum profile peak heights and the average of 5 maximum profile valley depths over a preset length;
ry represents the distance between the highest crest line and the lowest valley bottom line of the profile within a preset length;
s602: determining whether the surface roughness of the sample reaches the target roughness or not according to the roughness of Ra, rz and Ry of the surface of the sample;
s603: if the target roughness is not reached, repeating the steps from S100 to S500.
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| CN108406141A (en) * | 2018-04-18 | 2018-08-17 | 中国科学院西安光学精密机械研究所 | Ultrafast laser capillary processing method and device based on optical coherence tomography scanning |
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| JPS63274807A (en) * | 1987-05-01 | 1988-11-11 | Koyo Seiko Co Ltd | Surface roughness measuring instrument |
| JP2009115503A (en) * | 2007-11-02 | 2009-05-28 | Lasertec Corp | Method and device for measuring roughness |
| CN103048271A (en) * | 2012-12-21 | 2013-04-17 | 江西科技师范大学 | Portable type bi-modal imaging method employing combined photoacoustic imaging and optical coherence tomography and system of method |
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