CN115808613B - Chip heat dissipation test seat with heat measurement function - Google Patents
Chip heat dissipation test seat with heat measurement function Download PDFInfo
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- CN115808613B CN115808613B CN202310057343.0A CN202310057343A CN115808613B CN 115808613 B CN115808613 B CN 115808613B CN 202310057343 A CN202310057343 A CN 202310057343A CN 115808613 B CN115808613 B CN 115808613B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention discloses a chip heat dissipation test seat with a heat measurement function, which relates to the technical field of chip test, wherein the coverage area of a sensor is relatively larger, the space in which an air channel can be formed is smaller, the heat dissipation effect of the test seat on a chip after the test is relatively poorer, if more air channels are formed in the test, the heat dissipation speed on the chip is fast, a certain deviation exists in the chip temperature collection, and a certain deviation exists in high-temperature strength test data.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a chip heat dissipation test seat with a heat measurement function.
Background
The chip test seat is also called IC socket, IC test seat and IC socket; the chip test seat mainly plays a role of connection and conduction; are commonly used for integrated circuit application function verification. It is by definition just a connector to meet certain test requirements of a certain chip. The static connector between the PCB and the IC can facilitate the replacement and test of the chip without repeated welding and taking down of the chip, thereby reducing the damage of the IC and the PCB and achieving the quick and efficient test effect.
For this, chinese application number: CN113740699a discloses a test seat and a control method, a test device and a storage medium thereof, where the test seat includes a base, a cover body and a temperature control component, where the base is provided with the test component and a spring needle, the cover body is connected with the base and can rotate relative to the base to form a covering state or a separating state, one side of the cover body facing the base is provided with a pressing block for pressing a piece to be tested placed on the base when the base and the cover body are in the covering state, so that the piece to be tested contacts with the test component, the temperature control component is arranged between the cover body and the pressing block and is used for conducting heat conduction through the pressing block, and contacting with the spring needle to connect with an external circuit board through the spring needle when the base and the cover body are in the covering state. Through the mode, the chip temperature can be adjusted and collected when the chip is tested, so that the temperature conditions of the chip test can be accurately controlled.
For this, chinese application number: CN115389037a discloses a temperature measuring device, including a sucking disc and a metal heat conducting strip, the sucking disc has opposite outer surface and inner surface, and includes a first opening arranged on the inner surface and a first cavity communicated with the first opening, the first cavity is located between the outer surface and the inner surface, the metal heat conducting strip is arranged in the first cavity and extends from the first end of the first opening to the second end of the first opening along the first direction.
For this, chinese application number: CN108507705a discloses a chip temperature measuring device, which comprises a test seat, a temperature measuring device, at least one first conducting piece and at least one second conducting piece, wherein the temperature measuring device is installed in the test seat, the temperature measuring device is used for being in contact with the lower surface of a chip to be tested, the first conducting piece is used for conducting the temperature measuring device with an external test circuit, and the second conducting piece is used for conducting the chip to be tested with the external test circuit. The temperature measuring device provided by the invention can test the temperature of the lower surface of the chip, so that the measured temperature is closer to the actual temperature of the chip, the measurement error is reduced, and the accuracy of the measurement result is improved.
At present, when the chip seat carries out intensity test on the chip, the high-temperature working condition of the chip also needs to be measured, the temperature of the chip is monitored in real time through the sensor, in order to improve the accuracy of real-time monitoring, the covering surface of the sensor is relatively large, the space in which an air channel can be formed is smaller, the heat dissipation effect of the test seat on the chip after the test is relatively poor, more air channels are formed in the test seat, the air circulation speed is high, the heat dissipation speed on the chip is high, the temperature of the chip is acquired to have certain deviation, and certain deviation exists in high-temperature intensity test data.
To solve the above problems, a heat dissipation test socket for chips is provided with a heat measurement function.
Disclosure of Invention
The invention aims to provide a chip heat dissipation test seat with a heat measurement function, which solves the problem that the chip seat in the background art has mutual interference between the temperature acquisition and heat dissipation.
In order to achieve the above purpose, the present invention provides the following technical solutions: the chip heat dissipation test seat with the heat measurement function comprises an upper sealing cover, wherein the bottom end of the upper sealing cover is connected with a test base, the upper end of the test base is connected with a lifting rod, the upper end of the test base is connected with a fixed block, the bottom end of the test base is connected with a heat dissipation waistcoat, one side of the test base is fixedly connected with a first heat dissipation fan, the upper end of the heat dissipation waistcoat is provided with heat dissipation fins, and the bottom end of the heat dissipation waistcoat is provided with a second heat dissipation fan;
the inner part of the test base is embedded and connected with a detection seat, the upper end of the detection seat is provided with a chip clamping plate, the inner side of the chip clamping plate is provided with a reserved groove, the upper end of the chip clamping plate is connected with a temperature measuring rack, the upper end of the temperature measuring rack is connected with a heat conduction wrapping sheet, the inner part of the heat conduction wrapping sheet is embedded with a temperature measuring sensor, and the top end of the heat conduction wrapping sheet is fixedly connected with a heat conducting sheet;
the inside embedding of test base is connected with the division board, the heat dissipation logical groove has been seted up to the upper end of division board, fixedly connected with location slide rail on the inner wall of test base, the inside embedding of location slide rail is connected with spacing slider, the one end fixedly connected with of spacing slider seals the cock plate, the bottom of sealing the cock plate is connected with the play and holds in the palm the strip, the bottom of play holds in the palm the strip sets up and is connected with hydraulic push rod.
Preferably, the upper sealing cover is connected with the test base through a lifting adjusting rod, the lifting adjusting rod penetrates through the upper end fixing block of the upper sealing cover, the fixing block is connected with the lifting adjusting rod in a sliding mode, and sealing gaskets are fixedly connected to the inner wall of the upper sealing cover and the top surface of the test base.
Preferably, a group of through holes are formed in the bottom end of the test base, the test base is communicated with the inside of the heat dissipation waistcoat, and the heat dissipation waistcoat is made of copper-nickel alloy.
Preferably, the both sides fixedly connected with of detecting the seat link up the strip, be connected with the link on the top surface of detecting the seat, the inside embedding of chip splint is connected with a set of axostylus axostyle, and the axostylus axostyle embedding is in the inside of link, swing joint between link and the chip splint, install the PIN needle on the inner wall of detecting the seat.
Preferably, the temperature measuring frames are uniformly and equidistantly arranged at the upper end of the chip clamping plate, a group of temperature measuring frames are embedded in a group of through grooves at the upper end of the chip clamping plate, the temperature measuring frames are arranged to be of frame structures, and the temperature measuring frames are made of copper metal.
Preferably, two ends of the inner wall of the temperature measuring sensor are attached to the inside of the heat conduction wrapping sheet, and the top end of the heat conduction sheet is also tightly attached to the inner wall of the temperature measuring frame.
Preferably, the sealing plug board is provided with two groups altogether, and two groups sealing plug board keeps same height, and two groups sealing plug board is respectively through spacing slider embedding in the inside of two sets of location slide rails, sealing plug board is made for the silica gel material, the protruding strip that sets up in the sealing plug board and the logical groove looks adaptation of heat dissipation, the sealing plug board sets up the position of protruding strip and all wraps up there is the rubber pad.
Preferably, the positioning slide rails are arranged in a curved shape, and the curved directions of the two groups of positioning slide rails on the same side are completely opposite.
Preferably, the limit sliding blocks are fixedly connected to two sides of the seal plug plate, the limit sliding blocks are embedded into the positioning sliding rail, and the limit sliding blocks are in sliding connection with the positioning sliding rail.
Preferably, the top fixedly connected with hydraulic push rod of heat dissipation vest, and hydraulic push rod's output fixedly connected with plays to hold in the palm the strip, it is L shape to play the longitudinal section of holding in the palm the strip, it holds in the palm sliding connection between strip and the sealing plug board to play.
Compared with the prior art, the invention has the following beneficial effects:
when the chip heat radiation test seat with the heat measurement function works, firstly, when heat is collected in real time, a closed space is formed inside, heat with smaller space is transmitted in a heat radiation mode, meanwhile, heat can be transmitted to the upper end of a sensor through medium heat conduction, the heat collection adopts multi-point joint temperature measurement, the temperature measurement precision is improved, in the aspect of heat radiation, the temperature measurement and the heat radiation are distinguished in a middle isolation mode, complementary interference between the two is caused, an internal air channel is smooth in heat radiation, and the heat radiation effect is excellent.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic view of the upper cover and test base of the present invention in an expanded configuration;
FIG. 3 is a schematic diagram of the upper cover and the first cooling fan according to the present invention;
FIG. 4 is a schematic diagram of the structure of the temperature measuring rack and the chip clamping plate of the invention;
FIG. 5 is a schematic diagram of a heat dissipating fin and a second heat dissipating fan according to the present invention;
FIG. 6 is a schematic diagram of the structure of the temperature measuring rack and the connecting rack of the invention;
FIG. 7 is a schematic view showing the structure of the chip clamping plate in the unfolded state of the invention;
FIG. 8 is a schematic view of the structure of the isolation plate and the heat dissipation through groove of the present invention;
FIG. 9 is a schematic view of the structure of the temperature sensor and the heat conductive sheet of the present invention;
FIG. 10 is a schematic view of a heat dissipating through-slot and a separator according to the present invention;
FIG. 11 is a schematic view of the positioning slide rail and limit slider of the present invention;
fig. 12 is a schematic structural view of a limit slider and a hydraulic push rod according to the present invention.
In the figure: 1. an upper cover; 2. a test base; 3. a fixed block; 4. radiating waistcoat; 5. adjusting a lifting rod; 6. a first heat radiation fan; 7. a heat radiation fin; 8. a second heat radiation fan; 9. a chip clamping plate; 10. a temperature measuring rack; 11. a connecting frame; 12. a detection seat; 13. a connecting strip; 14. a thermally conductive wrapper; 15. a reserved groove; 16. a PIN needle; 17. a partition plate; 18. a heat dissipation through groove; 19. a temperature sensor; 20. a heat conductive sheet; 21. sealing the plug plate; 22. positioning a sliding rail; 23. a limit sliding block; 24. a hydraulic push rod; 25. and (5) lifting the supporting strip.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
For a further understanding of the present invention, the present invention will be described in detail with reference to the drawings.
Referring to fig. 1-12, the chip heat dissipation test seat with heat measurement function of the invention comprises an upper sealing cover 1, wherein the bottom end of the upper sealing cover 1 is connected with a test base 2, the upper end of the test base 2 is connected with a lifting rod 5, the upper end of the test base 2 is connected with a fixed block 3, the upper sealing cover 1 and the test base 2 are connected through the lifting rod 5, the lifting rod 5 penetrates through the inside of the fixed block 3 at the upper end of the upper sealing cover 1, the fixed block 3 and the lifting rod 5 are in sliding connection, sealing gaskets are fixedly connected on the inner wall of the upper sealing cover 1 and the top surface of the test base 2, the upper sealing cover 1 and the test base 2 are more sealed through the connection of the sealing gaskets, and the internal hot air is not easy to emit under the condition of ensuring sealing, the temperature measuring device arranged inside can better measure the temperature inside, the measuring precision is also obviously improved, the bottom end of the test base 2 is connected with the heat dissipation waistcoat 4, the bottom end of the test base 2 is provided with a group of through holes, the test base 2 is communicated with the inside of the heat dissipation waistcoat 4, the heat dissipation waistcoat 4 is made of copper-nickel alloy, when the internal high-temperature gas is subjected to heat dissipation in the later stage, heat is transferred through a metal conductor, so that hot air flow and cold air flow can be exchanged, one side of the test base 2 is fixedly connected with the first heat dissipation fan 6, the upper end of the heat dissipation waistcoat 4 is provided with the heat dissipation fins 7, and the bottom end of the heat dissipation waistcoat 4 is provided with the second heat dissipation fan 8;
the inside embedding of test base 2 is connected with detection seat 12, chip splint 9 is installed to the upper end of detection seat 12, reservation groove 15 has been seted up to the inboard of chip splint 9, the upper end of chip splint 9 is connected with temperature measurement frame 10, the even equidistant installation of temperature measurement frame 10 is in the upper end of chip splint 9, a set of temperature measurement frame 10 has been inlayed to the inside of a set of logical groove in chip splint 9 upper end, temperature measurement frame 10 sets up to the framework structure, temperature measurement frame 10 is made for copper metal, copper metal has good heat conductivity, make the chip carry out pressure test, can transmit the upper end of temperature measurement frame 10 with the temperature, gather the temperature through temperature measurement frame 10, the upper end of temperature transfer after gathering to temperature sensor 19, the upper end of temperature measurement frame 10 is connected with heat conduction parcel piece 14, the inside embedding of heat conduction parcel piece 14 has temperature sensor 19, the top fixedly connected with heat conduction piece 20, the two ends of the inner wall of the temperature measuring sensor 19 are attached to the inner part of the heat conduction wrapping sheet 14, the top end of the heat conducting sheet 20 is also tightly attached to the inner wall of the temperature measuring frame 10, the two sides of the detecting seat 12 are fixedly connected with the connecting strips 13, the top surface of the detecting seat 12 is connected with the connecting frame 11, the inside of the chip clamping plate 9 is embedded and connected with a group of shaft rods, the shaft rods are embedded in the connecting frame 11, the connecting frame 11 and the chip clamping plate 9 are movably connected, the PIN needle 16 is arranged on the inner wall of the detecting seat 12, the chip pressure is tested, the temperature is raised, the temperature is transferred to the upper end of the temperature measuring frame 10, the heat is transferred to the upper end of the temperature measuring sensor 19 through the heat conducting sheet 20, then the temperature measuring sensor 19 collects the temperature, the temperature measuring sensor and the temperature measuring frame uses the difference of linear expansion coefficients of two metals to cause the temperature measuring sensor to generate mechanical bending motion when being heated, through crooked degree, calculate the temperature of test chip, detect the heat capacity of chip through the temperature of test chip and further, be convenient for later stage carries out further perfection to the chip, wherein temperature measurement sensor 19 imbeds in the inside of heat conduction parcel piece 14, and the contact surface is also richer, consequently also more sensitive to the response of heat.
The inside embedding of test base 2 is connected with division board 17, the upper end of division board 17 has offered the heat dissipation and has led to the groove 18, fixedly connected with location slide rail 22 on the inner wall of test base 2, location slide rail 22 sets up crookedly, the crooked direction of two sets of location slide rails 22 of same side is completely opposite, the location slide rail 22 of crooked state can be better restriction limit slider 23's motion track, can make limit slider 23 go on regular activity along the inside of location slide rail 22, the inside embedding of location slide rail 22 is connected with limit slider 23, limit slider 23's one end fixedly connected with sealing cock plate 21, sealing cock plate 21 both sides fixedly connected with limit slider 23, limit slider 23 imbeds in the inside of location slide rail 22, sliding connection between limit slider 23 and the location slide rail 22, sealing cock plate 21 is provided with two sets of sealing cock plate 21 keeps same height, two sets of sealing cock plate 21 imbeds in the inside of two sets of location slide rails 22 respectively through limit slider 23, sealing cock plate 21 is made for the silica gel material, sealing cock plate 21 sets up strip and leading to the groove 18 looks adaptation, sealing cock plate 21 sets up the position that the heat dissipation is wrapped up;
two sets of sealing cock plates 21 imbeds the inside of heat dissipation through groove 18 for the inside of heat dissipation through groove 18 is blocked completely, the heat of upper end then can't transmit the lower extreme, in addition sealing cock plate 21 has adopted the silica gel material to make, cross the heat transfer effect, the efficiency of heat transfer has been reduced, therefore when the chip carries out pressure test, the temperature is not too much gives off and lead to measuring result to appear the deviation, sealing cock plate 21's bottom is connected with plays and holds in palm strip 25, it is connected with hydraulic push rod 24 to play the bottom of holding in palm strip 25, the top fixedly connected with hydraulic push rod 24 of heat dissipation waistcoat 4, and hydraulic push rod 24's output fixedly connected with plays holds in palm strip 25, the longitudinal section of playing in holding in palm strip 25 is L shape, it is connected to play between strip 25 and the sealing cock plate 21, when hydraulic push rod 24 begins to work, the rising of hydraulic push rod 24 has promoted sealing cock plate 21 and has risen, wherein sealing cock plate 21 has been represented location slide rail 22 and spacing slider 23's influence when rising, specifically: the lifting movement of the limit sliding block 23 needs to move along the positioning sliding rail 22 as a track, the bottom end of the positioning sliding rail 22 is inclined upwards, the limit sliding block 23 also drives the sealing plug plate 21 to move upwards along the track and move to the tail end of the inclined surface, the limit sliding block 23 lifts up in a straight line in the positioning sliding rail 22, and the sealing plug plate 21 is pushed to be embedded into the heat dissipation through groove 18, so that the upper end and the lower end are isolated, and the hot air flow at the upper end cannot be transmitted to the lower end;
when the hydraulic push rod 24 descends, the lifting strip 25 is driven to descend, wherein the bottom ends of the lifting strip 25 and the sealing plug plate 21 are affected by the clamping piece, so that the lifting strip 25 is also driven to descend, the sealing plug plate 21 starts to descend obliquely after descending linearly, when the lifting strip descends to the lowest end, dislocation is carried out between the protruding strip at the upper end of the sealing plug plate 21 and the heat dissipation through groove 18, the heat dissipation through groove 18 corresponds to a notch at the upper end of the sealing plug plate 21, when heat dissipation is carried out, heat at the upper end of a chip is blown by the first heat dissipation fan 6, outside air is blown into the test base 2, air flow passes through the connecting strip 13 and is blown to the upper end of the temperature measuring frame 10, heat at the upper end is taken away, hot air flows through the heat dissipation through groove 18 until being transmitted to the bottom end of the heat dissipation waistcoat 4, the circulation of air is accelerated through the rotation of the second heat dissipation fan 8, the speed of the air circulation is faster, and a good heat dissipation air channel is formed under the cooperation of the first heat dissipation fan 6 and the second heat dissipation fan 8, and the heat dissipation effect is excellent.
The test seat can ensure the sealing of the inside during the working process, so that the inside space is also narrower, the heat in the inside is not easy to run off, the temperature born by the chip can be better controlled during the pressure test, the temperature measurement is also more accurate, the interference is also smaller, the air channel with good heat exchange is adopted for heat dissipation after the test, the air circulation speed is also fast, and the cooling effect is also more remarkable.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a chip heat dissipation test seat with heat measurement function, includes upper cover (1), its characterized in that: the bottom of the upper sealing cover (1) is connected with a test base (2), the upper end of the test base (2) is connected with an adjusting lifting rod (5), the upper end of the test base (2) is connected with a fixed block (3), the bottom of the test base (2) is connected with a heat dissipation waistcoat (4), one side of the test base (2) is fixedly connected with a first heat dissipation fan (6), the upper end of the heat dissipation waistcoat (4) is provided with a heat dissipation fin (7), and the bottom of the heat dissipation waistcoat (4) is provided with a second heat dissipation fan (8);
the inside embedding of test base (2) is connected with detection seat (12), chip splint (9) are installed to the upper end of detection seat (12), the upper end of chip splint (9) is connected with temperature measurement frame (10), reserve tank (15) have been seted up to the inboard of chip splint (9), the upper end of temperature measurement frame (10) is connected with heat conduction parcel piece (14), the inside embedding of heat conduction parcel piece (14) has temperature measurement sensor (19), the top fixedly connected with conducting strip (20) of heat conduction parcel piece (14);
the test base is characterized in that a separation plate (17) is embedded and connected in the test base (2), a heat dissipation through groove (18) is formed in the upper end of the separation plate (17), a positioning slide rail (22) is fixedly connected to the inner wall of the test base (2), a limit slide block (23) is embedded and connected in the positioning slide rail (22), a sealing plug plate (21) is fixedly connected to one end of the limit slide block (23), limit slide blocks (23) are fixedly connected to two sides of the sealing plug plate (21), the limit slide blocks (23) are embedded in the positioning slide rail (22), the limit slide blocks (23) are connected with the positioning slide rail (22) in a sliding mode, a lifting strip (25) is connected to the bottom end of the sealing plug plate (21), and a hydraulic push rod (24) is connected to the bottom end of the lifting strip (25);
the upper sealing cover (1) is connected with the test base (2) through a lifting adjusting rod (5), the lifting adjusting rod (5) penetrates through the upper end of the upper sealing cover (1) and is fixedly connected with a sealing gasket between the fixed block (3) and the lifting adjusting rod (5) in a sliding manner, and the inner wall of the upper sealing cover (1) and the top surface of the test base (2) are fixedly connected with the sealing gasket;
the sealing plug plate (21) is provided with two groups, the two groups of sealing plug plates (21) keep the same height, the two groups of sealing plug plates (21) are embedded into the two groups of positioning slide rails (22) through limiting sliding blocks (23) respectively, the sealing plug plates (21) are made of silica gel materials, protruding strips and radiating through grooves (18) arranged in the sealing plug plates (21) are matched with each other, and rubber pads are wrapped at the positions where the protruding strips are arranged on the sealing plug plates (21).
2. The heat dissipation testing stand with heat measurement function of claim 1, wherein: the bottom of test base (2) is provided with a set of through-hole, the inside of test base (2) and heat dissipation vest (4) is linked together, heat dissipation vest (4) are made by the copper-nickel alloy.
3. The heat dissipation testing stand with heat measurement function of claim 1, wherein: the detection device is characterized in that connecting strips (13) are fixedly connected to two sides of the detection seat (12), a connecting frame (11) is connected to the top surface of the detection seat (12), a group of shaft rods are embedded and connected in the chip clamping plate (9), the shaft rods are embedded in the connecting frame (11), the connecting frame (11) and the chip clamping plate (9) are movably connected, and PIN needles (16) are arranged on the inner wall of the detection seat (12).
4. The heat dissipation testing stand with heat measurement function of claim 1, wherein: the temperature measuring rack (10) is uniformly and equidistantly arranged at the upper end of the chip clamping plate (9), a group of temperature measuring racks (10) are embedded in a group of through grooves at the upper end of the chip clamping plate (9), the temperature measuring racks (10) are arranged to be of a frame body structure, and the temperature measuring racks (10) are made of copper metal.
5. The heat dissipation testing stand with heat measurement function of claim 1, wherein: the two ends of the inner wall of the temperature measuring sensor (19) are attached to the inside of the heat conduction wrapping sheet (14), and the top end of the heat conducting sheet (20) is also tightly attached to the inner wall of the temperature measuring frame (10).
6. The heat dissipation testing stand with heat measurement function of claim 1, wherein: the positioning slide rails (22) are arranged in a bent shape, and the bending directions of the two groups of positioning slide rails (22) on the same side are completely opposite.
7. The heat dissipation testing stand with heat measurement function of claim 1, wherein: the top fixedly connected with hydraulic push rod (24) of heat dissipation vest (4), and the output fixedly connected with of hydraulic push rod (24) plays holds in the palm strip (25), the longitudinal section that plays holds in the palm strip (25) is L shape, it holds in the palm sliding connection between strip (25) and sealed cock plate (21) to play.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310057343.0A CN115808613B (en) | 2023-01-17 | 2023-01-17 | Chip heat dissipation test seat with heat measurement function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310057343.0A CN115808613B (en) | 2023-01-17 | 2023-01-17 | Chip heat dissipation test seat with heat measurement function |
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| Publication Number | Publication Date |
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| CN115808613A CN115808613A (en) | 2023-03-17 |
| CN115808613B true CN115808613B (en) | 2023-05-09 |
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| CN202310057343.0A Active CN115808613B (en) | 2023-01-17 | 2023-01-17 | Chip heat dissipation test seat with heat measurement function |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116819289B (en) * | 2023-08-29 | 2023-11-14 | 法特迪精密科技（苏州）有限公司 | Chip aging testing device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08327693A (en) * | 1995-05-31 | 1996-12-13 | Nec Corp | Ic test head |
| JPH1031053A (en) * | 1996-07-12 | 1998-02-03 | Nippon Maikuronikusu:Kk | Auxiliary device for semiconductor device test |
| JP2003014812A (en) * | 2001-06-29 | 2003-01-15 | Matsushita Electric Ind Co Ltd | Burn-in board and heat dissipating socket |
| US7042240B2 (en) * | 2004-02-27 | 2006-05-09 | Wells-Cti, Llc | Burn-in testing apparatus and method |
| KR100899142B1 (en) * | 2007-07-05 | 2009-05-27 | 삼성전자주식회사 | Test socket |
| TWM480762U (en) * | 2014-03-12 | 2014-06-21 | Chroma Ate Inc | Stacked package structure testing device with heat dissipation module |
| CN108507705A (en) * | 2018-07-04 | 2018-09-07 | 上海捷策创电子科技有限公司 | A kind of chip temperature measuring equipment |
| TWM594691U (en) * | 2020-02-06 | 2020-05-01 | 鴻邦自動化有限公司 | Feedback pre-burning device of burn-in furnace |
| CN211831630U (en) * | 2020-03-21 | 2020-10-30 | 宁波吉品科技有限公司 | Heat dissipation type radio frequency test platform |
| CN212343002U (en) * | 2020-11-26 | 2021-01-12 | 江西联创光电科技股份有限公司 | Semiconductor laser packaging structure for improving heat dissipation |
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