CN115804256A

CN115804256A - Component assembly line, inspection device, and inspection method

Info

Publication number: CN115804256A
Application number: CN202180038663.0A
Authority: CN
Inventors: 谷口昌弘; 木原正宏; 永冶利彦; 赤坂胜彦
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2020-06-05
Filing date: 2021-04-27
Publication date: 2023-03-14
Also published as: JPWO2021246092A1; WO2021246092A1

Abstract

The component assembly line is provided with: a component mounting device for mounting a component on a substrate; and an inspection device that receives the substrate carried out from the component mounting device, and inspects the component mounted on the substrate by the component mounting device, wherein the inspection device acquires an image of the component mounted on the substrate, measures the position of the component in the substrate based on the acquired image, and determines whether or not the measurement of the position is normally performed. Then, the 1 st part identification information is generated for a part determined to normally perform the position measurement, and the 2 nd part identification information is generated for a part determined to not normally perform the position measurement.

Description

Component assembly line, inspection device, and inspection method

Technical Field

The present disclosure relates to a component assembly line including a component assembly device for assembling components on a substrate and an inspection device for inspecting the components assembled on the substrate, an inspection device constituting the component assembly line, and an inspection method using the inspection device.

Background

Conventionally, a component assembly line is known, which includes: a component mounting device that picks up a component by a mounting head and mounts the component on a substrate; and an inspection device for receiving the substrate carried out from the component mounting device and inspecting the components mounted on the substrate. In this component mounting line, the component mounting apparatus measures the position of the component picked up by the mounting head, and mounts the component on the substrate based on the measured position of the component. Further, the inspection apparatus measures a position where the component is actually mounted as a mounting position based on an image (inspection image) obtained by photographing the component mounted on the substrate from above, and obtains a positional deviation or the like between the mounting position and a target mounting position on the substrate. Information on the mounting position measured by the inspection device is fed back to the component mounting device and used for correcting an operation parameter of the mounting head when the component mounting device mounts the component on the substrate (see, for example, patent document 1 below).

Prior art documents

Patent document

Patent document 1: japanese laid-open patent publication No. 2019-134051

Disclosure of Invention

The component assembly line of this disclosure includes: a component mounting device for mounting a component on a substrate; and an inspection device that receives the substrate carried out of the component mounting device and inspects each component mounted on the substrate by the component mounting device, the inspection device including: an image acquisition unit that acquires images of the components mounted on the substrate; a measurement unit configured to measure a position in the substrate of each component as an assembly position of the component based on the image of each component acquired by the image acquisition unit; a determination unit that determines, for each of the components, whether or not measurement based on the assembly position of the measurement unit is normally performed for the component; and a generation unit that generates component identification information, which is information indicating whether or not the measurement of the mounting position is normally performed by the measurement unit, for each of the components that have been determined by the determination unit, wherein the generation unit generates 1 st component identification information as the component identification information for the component that has been determined by the determination unit to normally perform the measurement of the mounting position, and generates 2 nd component identification information as the component identification information for the component that has been determined by the determination unit to not normally perform the measurement of the mounting position.

The inspection apparatus of the present disclosure inspects each component mounted on a substrate, and includes: an image acquisition unit that acquires images of the components mounted on the substrate; a measurement unit configured to measure a position in the substrate of each component as an assembly position of the component based on the image of each component acquired by the image acquisition unit; a determination unit that determines, for each of the components, whether or not measurement based on the assembly position of the measurement unit is normally performed for the component; and a generation unit that generates component identification information, which is information indicating whether or not the measurement of the mounting position is normally performed by the measurement unit, for each of the components that have been determined by the determination unit, wherein the generation unit generates 1 st component identification information as the component identification information for the component that has been determined by the determination unit to normally perform the measurement of the mounting position, and generates 2 nd component identification information as the component identification information for the component that has been determined by the determination unit to not normally perform the measurement of the mounting position.

The inspection method of the present disclosure inspects each component mounted on a substrate, the inspection method including: a measurement step of measuring a position in the substrate of each component mounted on the substrate as a mounting position of the component; a determination step of determining, for each of the components, whether or not the measurement of the assembly position is normally performed in the measurement step; and a generation step of generating component identification information, which is information indicating whether or not the measurement of the mounting position is normally performed in the measurement step, for the component that has been determined in the determination step, wherein the generation step generates 1 st component identification information as the component identification information for the component that is determined in the determination step to have normally performed the measurement of the mounting position, and generates 2 nd component identification information as the component identification information for the component that is determined in the determination step to have not normally performed the measurement of the mounting position.

By the present disclosure, reliability can be improved for correction of an operation parameter in a component mounting apparatus.

Drawings

Fig. 1 is a block diagram of a component assembly line in an embodiment of the present disclosure.

Fig. 2 is a perspective view of a component mounting apparatus provided in a component mounting line according to an embodiment of the present disclosure.

Fig. 3 is a block diagram showing a control system of a component assembly line in an embodiment of the present disclosure.

Fig. 4 is a perspective view of an inspection apparatus provided in a component mounting line according to an embodiment of the present disclosure.

Fig. 5 is a plan view of an example of a substrate inspected by an inspection apparatus provided in a component mounting line according to an embodiment of the present disclosure.

Fig. 6 is a diagram showing an example of an image obtained by one shot of an inspection camera provided in an inspection apparatus of a component assembly line according to an embodiment of the present disclosure.

Fig. 7 is a diagram illustrating a positional deviation of a component calculated by an inspection apparatus of a component assembly line according to an embodiment of the present disclosure.

Fig. 8 is a diagram illustrating a method 1 of determination by a determination unit of an inspection apparatus of a component assembly line according to an embodiment of the present disclosure.

Fig. 9A is a diagram illustrating a method 1 of determination by the determination unit of the inspection apparatus of the component assembly line according to the embodiment of the present disclosure.

Fig. 9B is a diagram illustrating the method 1 of the determination by the determination unit of the inspection apparatus of the component assembly line according to the embodiment of the present disclosure.

Fig. 10A is a diagram illustrating a method 2 of determination by the determination unit of the inspection apparatus of the component assembly line according to the embodiment of the present disclosure.

Fig. 10B-1 is a diagram illustrating a method 2 of determination by the determination unit of the inspection apparatus for a component assembly line according to the embodiment of the present disclosure.

Fig. 10B-2 is a diagram illustrating a method 2 of determination by the determination unit of the inspection apparatus for a component assembly line according to the embodiment of the present disclosure.

Fig. 10C-1 is a diagram illustrating a method 2 of determination by the determination unit of the inspection apparatus for a component assembly line according to the embodiment of the present disclosure.

Fig. 10C-2 is a diagram illustrating a method 2 of determination by the determination unit of the inspection apparatus for a component assembly line according to the embodiment of the present disclosure.

Fig. 11A is a diagram showing components in an inspection image for explaining the method 3 of determination by the determination unit of the inspection apparatus of the component assembly line according to the embodiment of the present disclosure.

Fig. 11B is a diagram showing components in an inspection image in a case where components are assembled without being tilted, which is described in method 3 for determination by the determination unit of the component assembly line inspection apparatus according to the embodiment of the present disclosure.

Fig. 11C is a diagram of a component corresponding to an inspection image for explaining the 3 rd method of determination by the determination unit of the inspection device of the component assembly line according to the embodiment of the present disclosure, as viewed from the side.

Fig. 12 is a flowchart showing a flow of an inspection operation performed by an inspection apparatus of a component assembly line according to an embodiment of the present disclosure.

Fig. 13 is a flowchart showing a flow of operation parameter correction processing work executed by a component mounting apparatus of a component mounting line according to an embodiment of the present disclosure.

Detailed Description

Prior to the description of the embodiments of the present disclosure, problems in the conventional apparatuses will be briefly described. There is a possibility that information with low reliability may be included in the information of the mounting position of the component obtained by the inspection apparatus, and if the operation parameter is corrected based on the information with low reliability, there is a problem that the mounting accuracy of the component may be deteriorated.

Therefore, an object of the present disclosure is to provide a component mounting line, an inspection apparatus, and an inspection method capable of improving reliability in correcting an operation parameter in a component mounting apparatus.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Fig. 1 shows a configuration diagram of a component assembly line 1 in an embodiment of the present disclosure. In fig. 1, a component mounting line 1 includes: a component mounting apparatus 11, an inspection apparatus 12, and a management apparatus 13.

The component mounting apparatus 11 receives a substrate KB from an upstream apparatus (for example, a solder printing apparatus) and mounts a component BH on the substrate KB. The inspection device 12 is disposed downstream of the component mounter 11, receives the substrate KB carried out from the component mounter 11, and inspects the component BH mounted on the substrate KB. The management device 13 is connected to the component mounting device 11 and the inspection device 12 in a communicable state, and manages the component mounting device 11 and the inspection device 12.

Fig. 2 is a perspective view of the component mounting apparatus 11 provided in the component mounting line 1. In fig. 1 and 2, the component mounting apparatus 11 includes: a substrate conveying path 21, a component supplying section 22, a mounting head 23, a head moving mechanism 24, a component camera 25, a mounting apparatus input/output section 26, and a mounting apparatus control section 27. The substrate transport path 21 carries in, positions, and carries out the substrates KB. The component supply unit 22 includes, for example, a tape feeder and supplies the component BH to a predetermined position. The mounting head 23 includes a nozzle 23N extending downward. The mounting head 23 can move the nozzle 23N up and down and rotate it around the vertical axis, and can make the component BH supplied from the component supply part 22 adhere to the lower end of the nozzle 23N.

The head moving mechanism 24 includes an XY table mechanism including a fixed beam 24a and a moving beam 24b that is movable with respect to the fixed beam 24 a. The head moving mechanism 24 moves the mounting head 23 in a horizontal plane by combining an operation of moving the moving beam 24b with respect to the fixed beam 24a and an operation of moving the mounting head 23 with respect to the moving beam 24 b. The mounting head 23 picks up the component BH supplied from the component supplying unit 22 and mounts the picked-up component BH on the substrate KB by performing the moving operation in the horizontal plane, the raising and lowering and rotating operation of the nozzle 23N, and the suction and release operation of the component BH by the nozzle 23N.

In fig. 1 and 2, the component camera 25 is disposed between the substrate conveying path 21 and the component supply unit 22 in a state where an imaging field of view is directed upward. The component camera 25 photographs the component BH from below when the assembly head 23 adsorbing the component BH to the lower end of the nozzle 23N is moved upward. An image (pre-assembly image) of the part BH obtained by the shooting by the part camera 25 is used for measurement of the position (pre-assembly position) of the part BH, recognition of the part BH, and the like.

The mounting device input/output unit 26 includes a touch panel, for example. The mounting device input/output unit 26 receives an input operation by an operator, and reports to the operator a work to be performed by the operator, various information, and the like through a screen, a sound, and the like.

Fig. 3 is a block diagram showing a control system of the component assembly line 1. As shown in fig. 3, the assembling device control unit 27 includes an assembling device storage unit 31, an assembling control unit 32, an assembling device communication unit 33, and a feedback control unit 34. The feedback control unit 34 includes an assembly position information acquisition unit 41, a component identification information acquisition unit 42, a confirmation unit 43, a correction unit 44, and an information statistic unit 45.

The mounting device storage unit 31 stores data (mounting data) and a mounting program necessary for mounting the component BH on the substrate KB. The assembly data includes: target coordinates, which are mounting target positions of the components BH to be mounted on the substrate KB, types of the components BH mounted on the target coordinates, and mounting directions. The mounting program is a control program for operating the respective parts (the component supply unit 22, the mounting head 23, the head moving mechanism 24, the component camera 25, and the like) of the component mounting apparatus 11 in order to mount the predetermined type of component BH at a predetermined position (target coordinates) in a predetermined mounting direction based on the mounting data.

The mounting control unit 32 operates the substrate transport path 21, the component supply unit 22, the mounting head 23, and the head moving mechanism 24 based on the mounting program. Thus, the substrate transport path 21 carries in and positions the substrate KB, the component supply section 22 supplies the component BH, and the head moving mechanism 24 and the assembly head 23 operate in conjunction with each other to repeatedly execute an assembly cycle. Whereby the parts BH are mounted one by one on the substrate KB.

In one assembling cycle, the assembling head 23 acts so that the action of the pickup part BH (pickup action), the action of the recognition part BH (recognition action), and the action of the assembling part BH (assembling action) are performed in order. In the pickup operation, the mounting head 23 moves above the component supply portion 22 to cause the component BH supplied from the component supply portion 22 to be adsorbed to the nozzle 23N. In the recognition operation, the mounting head 23 is moved upward of the component camera 25, and the component camera 25 photographs the component BH adsorbed to the nozzle 23N from below. In the mounting operation, the mounting head 23 moves upward of the substrate KB, and mounts the part BH imaged by the part camera 25 at target coordinates on the substrate KB.

In the recognition operation of the mounting head 23, the mounting control unit 32 causes the component camera 25 to capture an image of the component BH and acquires an image of the component BH (the pre-mounting image). The fitting control portion 32 measures the position of the component BH based on the acquired pre-fitting image. The measurement of the position of the element BH determines the position of the center of the element BH by a predetermined method, and the determined position of the center of the element BH is measured as the position of the element BH. The assembly control unit 32 moves the assembly head 23 so that the center position of the component BH that is assembled so that the component BH is obtained matches the target coordinates defined as the assembly data.

The mounting apparatus communication unit 33 is connected to be communicable with both the management apparatus 13 and the inspection apparatus 12. Therefore, the mounting apparatus communication unit 33 can receive the information detected by the inspection apparatus 12 as the feedback information via the management apparatus 13, or directly receive the information detected by the inspection apparatus 12 as the feedback information without via the management apparatus 13.

The feedback control unit 34 performs feedback processing based on the feedback information received from the inspection device 12. The main content of the feedback processing is correction of the operation parameters of the mounting head 23 when the component mounting device 11 mounts the component BH on the substrate KB. Here, the "operation parameter" refers to control data for operating the mounting head 23 so that the component BH is mounted on the target coordinates on the substrate KB. The feedback control unit 34 will be described later after the description of the inspection apparatus 12.

Fig. 4 is a perspective view of the inspection apparatus 12. In fig. 1 and 4, the inspection apparatus 12 includes a substrate transport unit 51, an inspection camera 52, a camera movement mechanism 53, an inspection apparatus input/output unit 54, and an inspection apparatus control unit 55. The substrate transport unit 51 carries in, positions, and carries out the substrates KB. The inspection camera 52 takes an image of the component BH mounted on the substrate KB by the component mounting device 11 from above by directing the imaging field downward and positioning the component above the substrate KB. That is, in the present embodiment, the inspection camera 52 is an image acquiring unit that acquires an image (inspection image) of each member BH mounted on the substrate KB.

An image (inspection image) of the component BH obtained by the imaging of the inspection camera 52 is used for measurement of a position (mounting position) in the substrate KB of the component BH, and the like. The camera moving mechanism 53 includes an XY table mechanism including a fixed side member 53a and a moving side member 53b movable relative to the fixed side member 53a, and moves the inspection camera 52 in the horizontal direction. The camera moving mechanism 53 moves the inspection camera 52 in the horizontal plane by combining the operation of moving the moving side member 53b with respect to the fixed side member 53a and the operation of moving the inspection camera 52 with respect to the moving side member 53 b.

The inspection device input/output unit 54 includes, for example, a touch panel. The inspection device input/output unit 54 receives an input operation by an operator, and reports a work to be performed by the operator and various information on a screen, a voice, and the like.

As shown in fig. 3, the inspection device control unit 55 includes an inspection device storage unit 61, an inspection image acquisition control unit 62, a measurement unit 63, a determination unit 64, a determination unit 65, a generation unit 66, and an inspection device communication unit 67. The inspection device storage unit 61 stores an inspection program in addition to the assembly data stored in the assembly device storage unit 31. The inspection program is a control program for operating each unit (the substrate conveying unit 51, the inspection camera 52, the camera moving mechanism 53, and the like) of the inspection apparatus 12 in order to inspect whether or not each component BH mounted on the substrate KB by the component mounting apparatus 11 is mounted in a predetermined direction at a target coordinate or the like defined in the mounting data.

The inspection image acquisition control unit 62 acquires an inspection image for each of the parts BH by causing all of the inspection cameras 52 to capture images of the parts BH mounted on the substrate KB. At this time, the inspection image acquisition control unit 62 moves the inspection camera 52 above the substrate KB positioned by the substrate transport unit 51 based on the inspection program stored in the inspection device storage unit 61, and causes the inspection camera 52 to repeat the imaging operation. Depending on the arrangement state of the parts BH on the substrate KB, the parts BH included in the inspection image acquired by one imaging operation by the inspection camera 52 may be one or a plurality of parts BH.

Fig. 5 is a plan view of an example of the substrate inspected by the inspection apparatus 12. Fig. 5 shows an example of the substrate KB inspected by the inspection apparatus 12, and a plurality of single-dot chain line regions AR shown in fig. 5 each show a region on the substrate KB obtained by one shot by the inspection camera 52. Fig. 6 is a diagram showing an example of an image (inspection image GZ) obtained by one shot by the inspection camera 52. In fig. 6, a plurality of parts BH are included in an inspection image GZ.

The measurement unit 63 measures the positions (the mounting positions) of 1 or more components BH included in each inspection image GZ on the substrate KB based on a plurality of images (inspection images GZ) obtained by imaging by the inspection camera 52. In the measurement of the mounting position of the component BH, the measurement section 63 measures the position of the center ZP (see fig. 6) of the component BH based on the inspection image GZ acquired by the inspection image acquisition control section 62.

The mounting position of the component BH is calculated from the position of the center ZP of the component BH within the inspection image GZ (the position with reference to the origin OR of the inspection image GZ), and the position of the substrate KB with respect to the origin OR of the inspection image GZ. The position of the origin OR of the inspection image GZ can be obtained from the position of the inspection camera 52 at the time of acquiring the inspection image GZ.

The measuring unit 63 compares the position of the center ZP of each component BH whose assembly position is to be measured with the target coordinates of the component BH stored in the inspection device storage unit 61, and thereby obtains the positional deviation of the component BH from the target coordinates. Fig. 7 is a diagram illustrating the positional displacement of the component calculated by the inspection device 12. Fig. 7 shows a state where the position of the center ZP of the target member BH is deviated from the target coordinate MZ. In fig. 7, when the target coordinates on the substrate KB are expressed by X-axis and Y-axis coordinates orthogonal to each other in the plane of the substrate KB, a Difference (DX) in the X-axis direction and a Difference (DY) in the Y-axis direction between the position of the center ZP of the component BH and the position of the target coordinate MZ are obtained as the positional deviation (DX, DY) of the component BH.

The determination unit 64 performs a quality determination for determining whether or not the mounting state of each member BH is good, for each member BH whose mounting position is obtained by the measurement unit 63. Specifically, the positional deviation of the element BH obtained by the measurement unit 63 is compared with an allowable value determined in accordance with the element BH, and it is determined whether or not the positional deviation is equal to or smaller than the allowable value. When the positional deviation of the component BH is equal to or less than the allowable value, the mounting state of the component BH is determined to be good, and when the positional deviation of the component BH exceeds the allowable value, the mounting state of the component BH is determined to be defective. Further, data of the allowable value for each component BH is stored in the inspection device storage unit 61.

In the example of fig. 7, when the allowable value of the positional deviation is RX in the X-axis direction and RY in the Y-axis direction, the mounting state of the component BH is determined to be good when DX is equal to RX and DY is equal to RY, and the mounting state of the component BH is determined to be defective when DX > RX or DY > RY. As shown in fig. 6, when a plurality of components BH are included in the inspection image GZ, the quality determination is performed for each of the plurality of components BH included in the inspection image GZ.

The determination unit 65 determines whether or not the measurement of the mounting position by the measurement unit 63 is normally performed for each member BH whose mounting position is measured by the measurement unit 63. In the present embodiment, this determination is performed by any of the methods 1, 2, and 3 described below.

Fig. 8 to 9B are diagrams for explaining the method 1 of the judgment by the judgment unit 65 of the inspection apparatus 12. In the method 1, as shown in fig. 8, the determination unit 65 determines whether or not the entire part BH in the inspection image GZ is located within the measurement area KA set for the part BH. The measurement area KA has a shape and a size corresponding to the member BH, and is set as target coordinates MZ of the member BH.

In the method 1, the determination unit 65 compares the component BH with the measurement region KA, and determines that the measurement of the mounting position of the component BH is normally performed when the entire component BH is located within the measurement region KA as shown in fig. 9A, and determines that the measurement of the mounting position of the component BH is not normally performed when at least a part of the component BH is located outside the measurement region KA as shown in fig. 9B.

Fig. 10A to 10C-2 are diagrams for explaining the 2 nd method of judgment by the judgment section 65 of the inspection apparatus 12. In the method 2, the determination unit 65 performs pattern matching processing between the inspection image GZ and the reference pattern of the part BH, and calculates a matching ratio between the region occupied by the part BH in the inspection image GZ and the reference pattern. The pattern matching process is performed by a known method. For example, when the region BR occupied by the component BH in the inspection image GZ is the region shown in fig. 10B-1 and 10B-2 with respect to the reference pattern KP shown in fig. 10A, the matching rate is calculated from the reference pattern KP shown in fig. 10C-1 and 10C-2 obtained by matching the reference pattern KP and the center ZP of the region BR with each other.

In the method 2, if the determination unit 65 calculates the matching rate, the calculated matching rate is compared with a predetermined reference matching rate. When the matching rate is equal to or higher than the reference matching rate, it is determined that the measurement of the mounting position of the component BH is normally performed. On the other hand, when the calculated matching rate is lower than the reference matching rate, it is determined that the measurement of the mounting position of the component has not been normally performed. The matching rate of the reference is, for example, 80%.

Fig. 11A to 11C are diagrams for explaining the method 3 for the judgment by the judgment unit 65 of the inspection apparatus 12. In the method 3, the determination unit 65 compares a dimension (measurement dimension) obtained by measuring the dimension of the component BH in the inspection image GZ with a reference dimension, and determines the difference between the measurement dimension and the reference dimension as a dimension difference. For example, in the example of fig. 11A, the measurement dimension of the member BH in the X-axis direction is X1, and the measurement dimension in the Y-axis direction is Y1.

On the other hand, the reference dimension is a dimension obtained from the design value of the component BH and corresponds to the dimension of the component (in the figure, the symbol is "BHa") in the inspection image GZ when mounted on the substrate KB without being tilted or the like as shown in fig. 11B. In the example of fig. 11B, the reference dimension in the X-axis direction is X0, and the reference dimension in the Y-axis direction is Y0. As shown in fig. 11C, for example, a dimensional difference occurs between the measurement dimension and the reference dimension for the same member BH, and a part of the member BH is attached to the substrate KB in a state of being lifted from the surface of the substrate KB.

In the method 3, the determination unit 65 determines a measurement dimension from the part BH in the inspection image GZ, compares the measurement dimension with a reference dimension, and calculates the dimension difference, and then compares the calculated dimension difference with the reference dimension difference determined in accordance with the part BH. When the calculated dimensional difference is equal to or smaller than the reference dimensional difference, it is determined that the measurement of the mounting position of the component BH is normally performed. On the other hand, when the calculated dimensional difference is higher than the reference dimensional difference, it is determined that the measurement of the mounting position of the component BH has not been normally performed.

In the example of fig. 11A and 11B, the dimensional difference Δ X in the X-axis direction is Δ X = X0-X1, and the dimensional difference Δ Y in the Y-axis direction is Δ Y = Y0-Y1. The determination unit 65 compares the dimensional differences (Δ X, Δ Y) with the reference dimensional differences (DX, DY), and determines that the measurement of the mounting position of the component BH is normally performed when both (Δ X, Δ Y) are equal to or less than the reference dimensional differences (Δ X ≦ DX and Δ Y ≦ DY). On the other hand, when at least one of (Δ X, Δ Y) exceeds the reference dimension difference (DX, DY) (when Δ X > DX or Δ Y > DY), it is determined that the measurement of the mounting position of the component BH has not been normally performed.

The generation unit 66 generates information (component identification information) indicating whether or not the measurement of the mounting position is normally performed by the measurement unit 63 for each component BH determined by the determination unit 65 as described above. Specifically, the generating unit 66 generates 1 st part identification information as the part identification information for the part BH for which the determination unit 65 determines that the measurement of the mounting position is normally performed, and generates 2 nd part identification information as the part identification information for the part BH for which the determination unit 65 determines that the measurement of the mounting position is not normally performed.

The inspection apparatus communication unit 67 is connected to both the management apparatus 13 and the component mounter 11 in a communicable state. The inspection apparatus communication part 67 transmits information (mounting position information) on the mounting position for each component BH measured by the measurement part 63 and component identification information (1 st component identification information or 2 nd component identification information) for each component BH on the board KB generated by the generation part 66 to the component mounting apparatus 11 via the management apparatus 13 or directly without via the management apparatus 13.

Next, the feedback control unit 34 included in the assembling apparatus control unit 27 will be described. As described above, the feedback control unit 34 includes the mounting position information acquisition unit 41, the component identification information acquisition unit 42, the confirmation unit 43, the correction unit 44, and the information statistic unit 45.

The mounting position information acquisition unit 41 acquires mounting position information for each component BH on the substrate KB from the inspection apparatus communication unit 67 of the inspection apparatus 12 via the management apparatus 13 or directly from the inspection apparatus 12 without via the management apparatus 13. The component identification information acquisition unit 42 acquires component identification information for each component BH on the substrate KB from the inspection apparatus 12 via the management apparatus 13 from the inspection apparatus communication unit 67 of the inspection apparatus 12 or directly from the inspection apparatus 12 without via the management apparatus 13.

The confirmation unit 43 confirms whether or not the measurement of the mounting position for each component BH is normally performed based on the component identification information for each component BH acquired by the component identification information acquisition unit 42. Thus, the components acquired by the component identification information acquisition unit 42 are sorted into components in which the 1 st component identification information is associated as component identification information and components in which the 2 nd component identification information is associated as component identification information.

The correction unit 44 corrects the operation parameters when the component mounter 11 mounts each component BH on the substrate KB, using the information (mounting position information) on the mounting position acquired by the mounting position information acquisition unit 41. Specifically, the correcting unit 44 corrects the operation parameters using the mounting position information acquired by the mounting position information acquiring unit 41 for the component BH for which the confirmation unit 43 has confirmed that the measurement of the mounting position has been normally performed. On the other hand, the correcting unit 44 corrects the operation parameters without using the mounting position information acquired by the mounting position information acquiring unit 41 for the component BH for which the confirming unit 43 has confirmed that the measurement of the mounting position has not been normally performed.

The information counting section 45 counts information on the assembly accuracy of the component BH using the assembly position information acquired by the assembly position information acquiring section 41. Specifically, the information counting section 45 counts the information on the mounting accuracy of the component BH using the mounting position information acquired by the mounting position information acquiring section 41 for the component BH for which the measurement of the mounting position is normally performed by the confirming section 43. On the other hand, the information counting section 45 counts information on the assembly accuracy of the component BH for which the measurement of the assembly position has not been normally performed by the confirmation section 43, without using the assembly position information acquired by the assembly position information acquisition section 41. This prevents the determination of the mounting accuracy of the component BH from being degraded (the mounting accuracy is evaluated low) due to an accidental mounting failure such as a simple component BH pickup error by the mounting head 23.

In the component mounting line 1 having such a configuration, when a component mounting operation for mounting the component BH on the substrate KB is performed, the component mounting device 11 receives the substrate KB from an upstream device (for example, a solder printing device) through the substrate transport path 21 and positions the substrate KB at a predetermined component mounting operation position. Then, an assembly cycle of picking up the component BH supplied by the component supply section 22 by the assembly head 23 and assembling to the substrate KB is repeatedly performed. Thus, when all the components BH to be mounted on the substrate KB are mounted, the component mounting apparatus 11 carries out the substrate KB to the inspection apparatus 12 on the downstream side.

The inspection device 12 receives the substrate KB carried out from the component mounter 11 by the substrate transfer unit 51, and positions the substrate KB at a predetermined inspection position. Then, an inspection work for each member BH mounted on the substrate KB is performed.

The flowchart shown in fig. 12 represents the execution steps of the inspection job (inspection method by the inspection apparatus 12). When performing the inspection operation, the inspection device 12 first carries in and positions the substrate KB carried out of the component mounter 11 (step ST1 shown in fig. 12). After the substrate KB is positioned, the inspection camera 52 is moved by the camera moving mechanism 53, thereby acquiring an image (inspection image GZ) for each component BH on the substrate KB (step st2. Image acquisition process). After acquiring the inspection images GZ for the respective members BH on the substrate KB, the inspection device 12 measures the mounting positions for the respective members BH based on these inspection images GZ (measurement step of step ST 3), and acquires mounting position information for the respective members BH (step ST 4).

After acquiring the mounting position information for each member BH, the inspection device 12 determines whether or not the mounting state for each member BH is good based on the mounting position information for each member BH (step ST 5). The inspection device input/output unit 54 reports the component BH determined to be defective in the mounted state on the substrate KB by the quality determination to the operator. Therefore, the operator can extract the substrate KB having the component BH whose mounting state is determined to be defective from the position where the substrate KB is carried out from the inspection apparatus 12, and can correct the mounting state of the component BH as necessary.

After the determination of the quality of each of the components BH mounted on the substrate KB, the inspection device 12 specifies one of the components BH whose mounting position information has been acquired in step ST4 (step ST 6). Then, it is determined whether or not the measurement of the mounting position is normally performed in the measurement step of step ST3 for the designated component BH (step ST7. Determination step). The inspection device 12 generates component identification information, which is information indicating whether or not the measurement of the mounting position is normally performed in the measurement step of step ST3, for each component BH for which the above determination is performed in the determination step (generation step). Specifically, the 1 ST component identification information is generated for the component BH for which it is determined that the measurement of the mounting position is normally performed (yes in step ST 7) (step ST 8), and the 2 nd component identification information is generated for the component BH for which it is determined that the measurement of the mounting position is not normally performed (no in step ST 7) (step ST 9).

After the component identification information (the 1 ST component information or the 2 nd component information) is generated in the generating step (step ST8 or step ST 9), the inspection device 12 determines whether or not there is a component BH that has not been specified (step ST 10). When there is an unspecified component BH, the process returns to step ST6 (Y in step ST 10), and the process proceeds to steps ST7 to ST9 after the unspecified component BH is newly specified. On the other hand, in step ST10, when there is no component BH that has not been specified yet (N in step ST 10), the mounting position information and the component identification information for each component BH thus determined are transmitted to the component mounting apparatus 11 via the management apparatus 13 or directly without via the management apparatus 13 (step ST 11). Then, the inspection device 12 sends the mounting position information and the component identification information for all the components BH to the component mounting device 11, and then carries out the substrate KB to a device (for example, a reflow device) on the downstream side (step ST 12), and ends the inspection work for the substrate KB.

As described above, the component mounter 11 mounts the component BH on the substrate KB loaded from the upstream side and carries it out to the inspection device 12, but when receiving information (mounting position information and component identification information) of the result of the inspection operation for the substrate KB on which the component BH has been mounted and carried out to the inspection device 12 before mounting the component BH on the substrate KB, performs the operation parameter correction processing operation based on the information.

The flowchart shown in fig. 13 represents the execution steps of the operation parameter correction processing job. When the component mounter 11 performs the operation parameter correction processing operation, one of the plurality of components BH mounted on the substrate KB is designated for the substrate KB which has received the result of the inspection operation from the inspection device 12 (step ST21 shown in fig. 13). Then, it is confirmed whether or not the measurement of the mounting position of the component BH is normally carried out based on the component identification information acquired for the specified component BH (step ST 22).

In step ST22, the component mounting apparatus 11 corrects the operation parameters using the mounting position information for the component BH (Y in step ST 22) for which it is confirmed that the measurement of the mounting position is normally performed (step ST 23), and counts the information on the mounting accuracy using the mounting position information (step ST 24). On the other hand, in step ST22, for the component BH (N in step ST 22) for which it is confirmed that the measurement of the mounting position is not normally performed, the operation parameter is not corrected (step ST 25), and the statistics of the information on the mounting accuracy using the mounting position information is not performed (step ST 26).

When step ST24 or step ST26 ends, the component mounter 11 determines whether or not there is a component that has not been designated (step ST 27). When there is an unspecified component BH (Y in step ST 27), the process returns to step ST21, and the process from step ST22 to step S26 is performed after the unspecified component BH is newly specified. On the other hand, in step ST27, if there is no member BH that has not been designated yet (N in step ST 27), the correction processing job of the operation parameters for the substrate KB is ended. When a new operation parameter is obtained by performing the operation parameter correction processing operation, the component mounter 11 updates the value of the operation parameter up to that point, and operates the mounting head 23 using the updated operation parameter to mount the component BH on the substrate KB.

In this way, in the component mounting line 1 of the present embodiment, the inspection device 12 acquires the inspection image GZ of each component BH mounted on the substrate KB, measures the position of each component BH in the substrate KB as the mounting position of the component BH based on the acquired inspection image GZ of each component BH (the measurement step of step ST 3), and determines whether or not the measurement of the mounting position is normally performed (the determination step of step ST 7). Then, the 1 ST component identification information is generated as the component identification information for the component BH for which the measurement at the mounting position is determined to be normally performed, and the 2 nd component identification information is generated as the component identification information for the component BH for which the measurement at the mounting position is determined not to be normally performed (the generating step of step ST8 or step ST 9).

In the component mounting line 1 of the present embodiment, the component mounting apparatus 11 acquires the generated component identification information (1 st component identification information or 2 nd component identification information) for each component BH, and confirms whether or not the measurement of the mounting position for each component BH is normally performed based on the acquired component identification information for each component BH. Then, the component BH for which the measurement of the mounting position is confirmed to be normally performed is subjected to the statistics of the mounting position information while correcting the operation parameters based on the mounting position information acquired by the inspection device 12, and the component BH for which the measurement of the mounting position is confirmed to be not normally performed is not subjected to the statistics of the operation parameters nor the mounting position information.

That is, in the component assembly line 1 according to the present embodiment, the operation parameter correction and the assembly position information statistics are performed using only data having high reliability of the inspection result of the component BH as the feedback information, without using data having low reliability of the inspection result of the component BH as the feedback information. Therefore, the component mounting line 1 according to the present embodiment can improve reliability with respect to the correction of the operation parameters and the statistical result of the mounting position information (information on the mounting accuracy of the component BH) in the component mounting device 11.

As described above, in the component mounting line 1 according to the present embodiment, when the inspection device 12 measures the mounting position of each component BH mounted on the substrate KB, it is determined whether or not the measurement is normally performed for each component BH, and the operation parameters in the component mounting device 11 for the component are corrected only for the component BH for which the measurement at the mounting position is determined to be normally performed (the operation parameters are not corrected for the component BH for which the measurement at the mounting position is determined to be not normally performed). Therefore, in the component mounting apparatus 11, the operation parameters can be corrected based only on the data with high reliability among the inspection results in the inspection apparatus 12. Therefore, according to the component assembly line 1 (or the inspection apparatus 12, or the inspection method by the inspection apparatus 12) in the present embodiment, it is possible to improve the reliability of the correction of the operation parameters in the component assembly apparatus 11, and it is possible to produce a high-quality substrate with high assembly accuracy of the components BH.

The embodiments of the present disclosure have been described above, but the present disclosure is not limited to the above, and various modifications and the like can be made. For example, in the above-described embodiment, the methods 1, 2, and 3 are shown as the method for determining whether or not the measurement of the mounting position by the measuring unit 63 is normally performed by the determining unit 65 of the inspection device 12, but the determining unit 65 may determine whether or not the measurement of the mounting position is normally performed by using other methods.

In the above-described embodiment, the inspection device 12 transmits the mounting position information and the component identification information for each component BH to the component mounting device 11 in step ST11 shown in fig. 12, but does not use the component BH for which the 2 nd component identification information is generated as feedback information in the component mounting device 11 thereafter. Therefore, the inspection device 12 may not transmit the mounting position information to the component mounting device 11 in step ST11 with respect to the mounting position information of the component BH for which the 2 nd component identification information is generated in step ST 9.

In the above-described embodiment, each component is configured by dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution Unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded in a recording medium such as a hard disk or a semiconductor memory.

Industrial applicability

Provided are a component assembly line, a detection device and a detection method, wherein the reliability of the component assembly line can be improved by correcting an operation parameter in the component assembly device.

-description of symbols-

1. Component assembly line

11. Component assembling device

12. Inspection apparatus

13. Management device

41. Assembling position information acquiring part

42. Part identification information acquisition unit

43. Confirmation section

44. Correction part

45. Information statistic unit

52. Inspection camera (image acquisition part)

63. Measuring part

65. Determination unit

66. Generating section

GZ examination image (image)

KA measurement area

KP reference pattern

BH component

KB substrate.

Claims

1. A component assembly line is provided with:

a component mounting device for mounting a component on a substrate; and an inspection device that receives the substrate carried out of the component mounting device and inspects components mounted on the substrate by the component mounting device,

the inspection device includes:

an image acquisition unit that acquires images of the components mounted on the substrate;

a measuring unit that measures a position in the substrate of each of the components as an assembly position of the component based on the image of each of the components acquired by the image acquiring unit;

a determination unit that determines, for each of the components, whether or not measurement based on the assembly position of the measurement unit has been normally performed for the component; and

a generation unit that generates component identification information indicating whether or not the measurement of the mounting position is normally performed by the measurement unit for each of the components determined by the determination unit,

the generation unit generates 1 st component identification information as the component identification information for the component determined by the determination unit to normally perform the measurement of the mounting position, and generates 2 nd component identification information as the component identification information for the component determined by the determination unit to not normally perform the measurement of the mounting position.

2. The component assembly line of claim 1,

the component mounting apparatus includes:

an assembly position information acquisition unit that acquires assembly position information that is information on the assembly position for each of the components measured by the measurement unit;

a component identification information acquisition unit that acquires the component identification information for each of the components generated by the generation unit; and

and a confirming unit that confirms whether or not the measurement of the assembly position is normally performed for each of the components based on the component identification information for each of the components acquired by the component identification information acquiring unit.

3. The component assembly line of claim 2,

the component mounting apparatus includes: a correction unit that corrects an operation parameter for each component when the component mounting apparatus mounts each component on a substrate, using the mounting position information acquired by the mounting position information acquisition unit,

the correcting unit corrects the operating parameter using the mounting position information acquired by the mounting position information acquiring unit for a component for which the confirmation unit confirms that the measurement of the mounting position is normally performed, and corrects the operating parameter without using the mounting position information acquired by the mounting position information acquiring unit for a component for which the confirmation unit confirms that the measurement of the mounting position is not normally performed.

4. The component assembly line of claim 2,

the component mounting apparatus includes: an information counting unit that counts the assembly position information acquired by the assembly position information acquiring unit,

the information counting unit counts the mounting position information using the mounting position information acquired by the mounting position information acquiring unit for the component for which the measurement of the mounting position is confirmed to be normally performed by the confirming unit, and counts the mounting position information without using the mounting position information acquired by the mounting position information acquiring unit for the component for which the measurement of the mounting position is not confirmed to be normally performed by the confirming unit.

5. The component assembly line of any of claims 1 to 4,

the determination unit determines whether or not the entire component in the image acquired by the image acquisition unit is located within a measurement region set for the component, and determines that the measurement of the mounting position of the component is not normally performed when at least a part of the component is located outside the measurement region.

6. The component assembly line of any one of claims 1 to 4,

the determination unit performs pattern matching between the image acquired by the image acquisition unit and a reference pattern of a component, calculates a matching ratio between an area occupied by the component in the image and the reference pattern, and determines that measurement of the mounting position of the component has not been normally performed when the calculated matching ratio is lower than a reference matching ratio.

7. The component assembly line of any of claims 1 to 4,

the determination unit determines that the measurement of the mounting position of the component is not normally performed when a dimensional difference, which is a difference between the dimension of the component in the image acquired by the image acquisition unit and a reference dimension, exceeds a reference dimensional difference.

8. The component assembly line of any of claims 1 to 7,

the inspection apparatus transmits the mounting position information and the component identification information for the components to the component mounting apparatus via a management apparatus that manages the component mounting apparatus and the inspection apparatus, or directly transmits the mounting position information and the component identification information for the components to the component mounting apparatus without via the management apparatus.

9. The component assembly line of any one of claims 1 to 7,

the inspection device does not transmit the mounting position information and the component identification information to the component mounting device for the component for which the 2 nd component identification information is generated by the generation unit.

10. The component assembly line of claim 9,

the inspection apparatus transmits the mounting position information and the component identification information for each component to the component mounting apparatus via a management apparatus that manages the component mounting apparatus and the inspection apparatus, or directly transmits the mounting position information and the component identification information for each component to the component mounting apparatus without via the management apparatus, for the component for which the 1 st component identification information is generated by the generation unit.

11. An inspection apparatus for inspecting each component mounted on a substrate,

the inspection device is provided with:

a determination unit that determines, for each of the components, whether or not measurement based on the assembly position of the measurement unit is normally performed for the component; and

12. The inspection apparatus according to claim 11,

13. The inspection apparatus according to claim 11,

the determination unit performs pattern matching processing between the image acquired by the image acquisition unit and a reference pattern of a component, calculates a matching ratio of an area occupied by the component in the image and the reference pattern, and determines that measurement of the mounting position of the component has not been normally performed when the calculated matching ratio is lower than a reference matching ratio.

14. The inspection apparatus according to claim 11,

the determination unit determines that the measurement of the mounting position of the component is not normally performed when a dimensional difference, which is a difference between a dimension of the component in the image acquired by the image acquisition unit and a reference dimension, exceeds a reference dimensional difference.

15. The inspection apparatus according to any one of claims 11 to 14,

the inspection apparatus transmits the mounting position information and the component identification information for each component to the component mounting apparatus via a management apparatus that manages the component mounting apparatus and the inspection apparatus, or directly transmits the mounting position information and the component identification information for each component to the component mounting apparatus without via the management apparatus.

16. The inspection apparatus according to any one of claims 11 to 15,

the component mounting apparatus does not transmit the mounting position information and the component identification information to the component for which the 2 nd component identification information is generated by the generation unit.

17. The inspection apparatus of claim 16,

the component mounting apparatus may be configured to transmit the mounting position information and the component identification information for the component to the component mounting apparatus via a management apparatus that manages the component mounting apparatus and the inspection apparatus, or to directly transmit the mounting position information and the component identification information for the component to the component mounting apparatus without via the management apparatus, for the component for which the 1 st component identification information is generated by the generation unit.

18. An inspection method for inspecting each component mounted on a substrate, the inspection method comprising:

a measurement step of measuring a position in the substrate of each component mounted on the substrate as a mounting position of the component;

a determination step of determining, for each of the members, whether or not the measurement of the mounting position is normally performed in the measurement step; and

a generating step of generating component identification information for each of the components determined in the determining step, the component identification information indicating whether or not the measurement of the mounting position is normally performed in the measuring step,

in the generating step, 1 st component identification information is generated as the component identification information for the component determined in the determining step that the measurement of the mounting position is normally performed, and 2 nd component identification information is generated as the component identification information for the component determined in the determining step that the measurement of the mounting position is not normally performed.

19. The inspection method according to claim 18,

the inspection method includes: an image acquisition step of acquiring images of the respective members mounted on the substrate,

in the measuring step, the assembly positions for the respective components are measured based on the images of the respective components acquired in the image acquiring step.