CN115802630A - Circuit board manufacturing process with electric gold finger and lead - Google Patents
Circuit board manufacturing process with electric gold finger and lead Download PDFInfo
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- CN115802630A CN115802630A CN202211683689.3A CN202211683689A CN115802630A CN 115802630 A CN115802630 A CN 115802630A CN 202211683689 A CN202211683689 A CN 202211683689A CN 115802630 A CN115802630 A CN 115802630A
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Abstract
The invention discloses a manufacturing process of a circuit board with an electric gold finger and a lead, which comprises the following steps: s1, manufacturing a gold finger and a lead on a copper-clad substrate, wherein the gold finger is provided with an insertion end connected with one end of a first lead, the other end of the first lead is connected with a main lead, and the main lead is connected with a copper sheet on the edge of the substrate; s2, printing solder mask photosensitive ink, exposing and developing to remove the unexposed ink, and baking and curing; s3, electroplating a nickel-gold surface on the gold finger and the first lead; s4, printing circuit ink at the first lead, and baking and curing; s5, cutting the copper-clad substrate according to a pre-designed reference line; s6, cutting the bevel edge at an angle; s7, removing residual circuit ink; and S8, completing electrical test and inspection. Therefore, the leads are completely coated with the line ink through the flows of setting the lead area printed line ink, exposing, curing and the like, so that the leads can be firmly fixed in the processes of forming, cutting and golden finger bevel edge processing, and the phenomena of lead tilting, tailing and falling off can not be generated.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a manufacturing process of a circuit board with an electric gold finger and a lead.
Background
In the manufacturing process of the circuit board, a gold-plated plug is usually designed on the edge of the circuit board, and then the edge of the gold finger board is horizontally cut off at a certain angle, so that the end face of the gold finger board forms an acute angle, and the hot plugging function of an electronic device is realized. At present, two treatment modes are provided for a gold finger lead, one is that a dry film or a wet film and other resistance plating layers are covered on the lead before an electrogilding process to prevent the lead from being coated with nickel and gold, and then the lead is etched; secondly, the gold finger lead is directly plated with nickel gold, the bevel edge of the gold finger of the circuit board is controlled through the depth of the bevel edge after forming and cutting, the method is simple, the cost is low, the method is mainly applied to low-frequency control products, in actual production, the lead is easy to tilt in the cutting process, the lead is trailing behind the bevel edge, short circuit occurs between adjacent gold fingers, and later repair is difficult. Therefore, the processing technology of the existing circuit board with the golden fingers and the leads is improved to solve the problems.
Disclosure of Invention
In view of the above, the present invention provides a circuit board manufacturing process with electrical gold fingers and leads, which is mainly aimed at solving the drawbacks of the prior art, and the main object of the present invention is to provide a circuit board manufacturing process with electrical gold fingers and leads, wherein the leads are completely covered with the circuit ink by setting the flows of printing the circuit ink in the lead area, exposure curing, etc. in the circuit board processing process, so that the leads can be firmly fixed in the processes of forming cutting and bevel edge processing of the gold fingers, and therefore, the phenomena of lead tilting, tailing and falling-off are not generated, and the problems of short circuit between adjacent gold fingers and difficulty in post-repair caused by lead tailing are avoided; and the circuit ink can be quickly dissolved in a sodium hydroxide solution after being used, and the copper-clad substrate or the gold surface cannot be adversely affected in the dissolving process.
In order to achieve the purpose, the invention adopts the following technical scheme:
a manufacturing process of a circuit board with electric gold fingers and leads comprises the following steps:
s1, manufacturing a gold finger and a lead on a board surface of a copper-clad substrate by adopting an additive process, wherein the lead comprises a main lead and a first lead, the gold finger is provided with an insertion end connected with one end of the first lead, the other end of the first lead is connected with the main lead, and the main lead is connected with a copper sheet on the edge of the copper-clad substrate;
s2, printing solder-resisting photosensitive ink on the copper-clad substrate, exposing according to a film pattern, developing to remove the unexposed ink, removing the ink at the golden finger and the first lead, completing character printing, and baking and curing in an oven;
s3, electroplating a nickel-gold surface on the gold finger and the first lead;
s4, further printing line ink at the first lead, wherein the ink is made of a strippable material; completely coating the first lead by the circuit ink, and baking and curing to fix the first lead on the copper-clad substrate;
s5, cutting the copper-clad substrate according to a pre-designed reference line, wherein the first lead is cut off in the cutting process and is fixed on the surface of the copper-clad substrate under the coating of the ink, and the first lead cannot tilt in the cutting process;
s6, further performing bevel edge treatment on the edge section of the gold finger of the copper-clad substrate, coating and fixing the first lead of the nickel-gold plated surface by printed circuit ink, and performing angle cutting on the first lead and the copper-clad substrate together by adopting a bevel edge cutter, wherein the first lead has no trailing after the bevel edge treatment;
s7, further removing the residual circuit ink on the copper-clad substrate, specifically, immersing the copper-clad substrate and the attached circuit ink into a sodium hydroxide solution, and drying after the circuit ink is fully dissolved and cleaned;
and S8, further completing the electrical test and inspection.
As a preferred embodiment: the gold finger is correspondingly connected with a first lead, and the first leads are connected to the same main lead.
As a preferred embodiment: in S1, the width of the first lead is 0.1mm, and the width of the main lead is 0.5mm.
As a preferred scheme: in S2, the baking curing temperature is 155 degrees.
As a preferred embodiment: in S4, the circuit ink is a printing fluid photosensitive ink.
As a preferred embodiment: and in S4, the distance from the circuit ink coating area to the edge of the golden finger insertion end is 0.5mm.
As a preferred embodiment: in S4, the coating thickness of the circuit ink is 10-15 μm.
As a preferred embodiment: in the S7, the content of the sodium hydroxide solution is 6%.
As a preferred scheme: in S7, the time for immersing the copper-clad substrate and the attached circuit ink into the sodium hydroxide solution is 1-2 minutes.
As a preferred scheme: in the S4, the baking curing temperature is 120 ℃.
Compared with the prior art, the method has obvious advantages and beneficial effects, and concretely, according to the technical scheme, the processing technological process of the circuit board is optimized, the flows of printed circuit ink in the lead area, exposure curing and the like are set, the lead is completely coated by the circuit ink, so that the lead can be firmly fixed in the processes of forming cutting and golden finger bevel edge processing, the phenomena of lead tilting, tailing and falling are avoided, and the problems of short circuit between adjacent golden fingers and difficulty in later repair caused by lead tailing are avoided; and the circuit ink can be quickly dissolved in a sodium hydroxide solution after being used, and the dissolving process can not generate adverse effect on the substrate or the gold surface.
To more clearly illustrate the structural features and effects of the present invention, the following detailed description is given with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a schematic diagram of a circuit board of the present invention;
FIG. 2 is a schematic diagram of the printed circuit ink for finger leads of circuit board and the structure thereof;
FIG. 3 is an enlarged view of the portion M of FIG. 2;
FIG. 4 is a schematic diagram illustrating the cutting of the circuit board according to the present invention;
FIG. 5 is a schematic cross-sectional view of the circuit board of FIG. 4 after cutting the N leads.
Description of the figures:
100. a copper-clad substrate; 101. a golden finger; 102. a gold finger insertion end; 103. a first lead; 104. a main lead; 105. a circuit ink coverage area; 106. and cutting the reference line.
Detailed Description
As shown in fig. 1 to 5, a manufacturing process of a circuit board with an electric gold finger and a lead wire of the invention comprises the following steps:
s1, manufacturing a gold finger and a lead pattern on the surface of a copper-clad substrate 100 by an additive process, wherein the lead comprises a first lead 103 and a main lead 104, one gold finger 101 is correspondingly connected with one first lead 103, and a plurality of first leads 103 are connected to the same main lead 104; one gold finger 101 has an insertion end connected to one end of the first lead 103; the width a of the first lead is 0.1mm, the other end of the first lead 103 needs to extend out of the circuit board unit to be connected with the main lead 104, the width b of the main lead is 0.5mm to be connected with a copper sheet at the edge of the substrate, so that a current conduction function channel of the nickel-gold electroplating process is realized, and the current conduction function channel is used as a current transmission medium during electroplating;
s2, printing solder resist photosensitive ink on the substrate 100, further exposing according to a film pattern, developing to remove the unexposed ink, removing the ink of the golden finger 101 and the lead area 103, then completing character printing, and baking and curing in an oven at 155 ℃;
s3, electroplating a nickel-gold surface on the golden finger 101, and electroplating gold on the golden finger 101 and the first lead 103 at the moment;
s4, further printing line ink in the area of the first lead 103, wherein the ink is made of a strippable material, and after the ink is dried, the ink layer can be stripped off as required, so that the operation is simple and rapid, and the circuit board cannot be damaged; the first lead is completely covered by the circuit printing ink 105 and is baked and cured at 120 ℃ so that the first lead 103 is fixed on the copper-clad substrate; the circuit ink is printing fluid photosensitive ink, the coating thickness is 10-15 mu m, the distance c from the coating area 104 to the edge of the golden finger insertion end 103 is 0.5mm, and the acid resistance of the cured fluid photosensitive ink is excellent;
s5, cutting the copper-clad substrate according to the designed shape reference line 106, wherein the first lead 103 is cut off in the cutting process, and the lead is firmly fixed on the surface of the substrate under the coating of the printing ink 105, so that the first lead 103 cannot be tilted in the cutting process, and the electric gold lead 103 can be effectively prevented from being pulled and falling off under the stress of a cutter;
s6, further performing bevel edge processing on the golden finger of the substrate along the edge section, designing the bevel edge angle and the depth according to the requirements of customers, coating and fixing the electric golden lead 103 by printed circuit ink 105, and finishing angle cutting of the electric golden lead and the base material by a bevel edge cutter; after the bevel edge treatment, the first lead has no tailing, so that short circuit between adjacent golden fingers can be effectively prevented, and the product quality is improved;
s7, further removing the residual circuit ink on the substrate, wherein the circuit ink is obtained by immersing the substrate and the attached circuit ink into a 6% sodium hydroxide solution (6% sodium hydroxide and 94% water) for 1-2 minutes, and drying after the circuit ink is fully dissolved and cleaned;
and S8, further completing the electrical test and inspection according to the conventional circuit board manufacturing process.
The design key point of the invention is that the circuit board processing process flow is optimized, the flows of printed circuit ink, exposure curing and the like in the lead area are set, and the lead is completely coated by the circuit ink, so that the lead can be firmly fixed in the processes of forming cutting and golden finger bevel edge processing, the phenomena of lead tilting, tailing and falling can not be generated, and the problems of short circuit and difficult post-repair between adjacent golden fingers caused by lead tailing are avoided; and the circuit ink can be quickly dissolved in a sodium hydroxide solution after being used, and the dissolving process can not generate adverse effect on the substrate or the gold surface.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention are within the technical scope of the present invention.
Claims (10)
1. A manufacturing process of a circuit board with electric golden fingers and leads is characterized by comprising the following steps:
s1, manufacturing a gold finger and a lead on a board surface of a copper-clad substrate by adopting an additive process, wherein the lead comprises a main lead and a first lead, the gold finger is provided with an insertion end connected with one end of the first lead, the other end of the first lead is connected with the main lead, and the main lead is connected with a copper sheet on the edge of the copper-clad substrate;
s2, printing solder-mask photosensitive ink on the copper-clad substrate, exposing according to a film pattern, developing to remove the unexposed ink, removing the ink at the golden finger and the first lead, finishing character printing, and baking and curing in an oven;
s3, electroplating a nickel-gold surface on the gold finger and the first lead;
s4, further printing line ink at the first lead, wherein the ink is made of a strippable material; completely coating the first lead by the circuit ink, and baking and curing to fix the first lead on the copper-clad substrate;
s5, cutting the copper-clad substrate according to a pre-designed reference line, wherein the first lead is cut off in the cutting process and is fixed on the surface of the copper-clad substrate under the coating of the ink, and the first lead cannot tilt in the cutting process;
s6, further performing bevel edge treatment on the golden finger of the copper-clad substrate along the edge section, coating and fixing the first lead of the nickel-gold plated surface by printed circuit ink, finishing angle cutting of the first lead and the copper-clad substrate by adopting a bevel edge cutter, and enabling the first lead not to be trailing after the bevel edge treatment;
s7, further removing the residual circuit ink on the copper-clad substrate, specifically, immersing the copper-clad substrate and the attached circuit ink into a sodium hydroxide solution, and drying after the circuit ink is fully dissolved and cleaned;
and S8, further completing the electrical test and the inspection.
2. The manufacturing process of a circuit board with electric gold fingers and leads according to claim 1, characterized in that: a gold finger is correspondingly connected with a first lead, and a plurality of first leads are connected to the same main lead.
3. The manufacturing process of a circuit board with electric gold fingers and leads according to claim 1, characterized in that: in S1, the width of the first lead is 0.1mm, and the width of the main lead is 0.5mm.
4. The manufacturing process of a circuit board with electric gold fingers and leads according to claim 1, characterized in that: in the S2, the baking curing temperature is 155 degrees.
5. The manufacturing process of a circuit board with electric gold fingers and leads according to claim 1, characterized in that: in S4, the circuit ink is a printing fluid photosensitive ink.
6. The manufacturing process of a circuit board with electric gold fingers and leads according to claim 5, wherein: and in S4, the distance from the circuit ink coating area to the edge of the golden finger insertion end is 0.5mm.
7. The process of claim 5, wherein the step of forming the circuit board with the electrical fingers and leads comprises: in S4, the coating thickness of the circuit ink is 10-15 μm.
8. The process for manufacturing a circuit board with electric gold fingers and leads according to claim 1, wherein: in the S7, the content of the sodium hydroxide solution is 6%.
9. The process of claim 8, wherein the step of forming the circuit board with the electrical fingers and leads comprises: in S7, the time for immersing the copper-clad substrate and the attached circuit ink into the sodium hydroxide solution is 1-2 minutes.
10. The manufacturing process of a circuit board with electric gold fingers and leads according to claim 1, characterized in that: in S4, the baking curing temperature is 120 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211683689.3A CN115802630A (en) | 2022-12-27 | 2022-12-27 | Circuit board manufacturing process with electric gold finger and lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211683689.3A CN115802630A (en) | 2022-12-27 | 2022-12-27 | Circuit board manufacturing process with electric gold finger and lead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115802630A true CN115802630A (en) | 2023-03-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211683689.3A Pending CN115802630A (en) | 2022-12-27 | 2022-12-27 | Circuit board manufacturing process with electric gold finger and lead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115802630A (en) |
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2022
- 2022-12-27 CN CN202211683689.3A patent/CN115802630A/en active Pending
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