CN115799433B - Red light packaging structure, red light LED light source and packaging method - Google Patents
Red light packaging structure, red light LED light source and packaging method Download PDFInfo
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000000843 powder Substances 0.000 claims abstract description 195
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 74
- 239000003292 glue Substances 0.000 claims description 10
- 238000000554 physical therapy Methods 0.000 abstract description 18
- 230000000694 effects Effects 0.000 abstract description 15
- 230000008569 process Effects 0.000 abstract description 13
- 238000013461 design Methods 0.000 abstract description 5
- 238000012858 packaging process Methods 0.000 abstract description 4
- 238000001228 spectrum Methods 0.000 description 22
- 230000003595 spectral effect Effects 0.000 description 11
- 102100032047 Alsin Human genes 0.000 description 9
- 101710187109 Alsin Proteins 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 238000009826 distribution Methods 0.000 description 4
- 238000011160 research Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 206010033675 panniculitis Diseases 0.000 description 2
- 231100000241 scar Toxicity 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 210000004304 subcutaneous tissue Anatomy 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 206010061218 Inflammation Diseases 0.000 description 1
- 206010062575 Muscle contracture Diseases 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000017531 blood circulation Effects 0.000 description 1
- 230000004663 cell proliferation Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 208000006111 contracture Diseases 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000004054 inflammatory process Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004060 metabolic process Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000004962 physiological condition Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001225 therapeutic effect Effects 0.000 description 1
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Abstract
The invention discloses a red light packaging structure, a red light LED light source and a packaging method, wherein a forward chip in the red light packaging structure is a forward chip, light is directly emitted upwards, the light parameter efficiency and the brightness of the LED light source can be increased without reflection, at least two fluorescent powder layers are formed by dispensing on the surface of the forward chip, the red light effective wave band generated by a light emitting unit is wider through the design of the at least two dispensing fluorescent powder layers, the light power of the red light wave band is more than or equal to 80% of the maximum light power, the significance is very high for effectively providing the red light physiotherapy effect, and meanwhile, the process can reduce the equipment requirement and the process difficulty while reaching the corresponding technical requirements compared with other packaging processes.
Description
Technical Field
The invention relates to the technical field of illumination, in particular to a red light packaging structure, a red light LED light source and a packaging method.
Background
The red light physiotherapy is a method for improving physiological conditions of human bodies by adopting red light to irradiate the human bodies. The red light has certain penetrating power to skin and subcutaneous tissue, and the red light has warm effect to muscle and subcutaneous tissue, and can accelerate blood circulation, promote metabolism and cell proliferation, and has effects of diminishing inflammation, relieving pain, massaging, promoting scar softening, relieving scar contracture, etc.
The traditional red light therapeutic apparatus mostly adopts a light filtering method to obtain red light, and has the defects of limited service life of the light filtering liquid, low luminous efficiency, small irradiation area, stroboscopic effect, complex structure, light intensity, unmodulable frequency and the like. The LED light source has the advantages of high efficiency, narrow band, direct current, energy conservation, environmental protection and the like, and is widely applied to the medical and cosmetic fields.
Fig. 1 is a spectrum diagram of a red light LED light source in the prior art, as shown in fig. 1, the spectrum diagram of the red light LED light source in the prior art has the technical problems that the peak shape is steep and too narrow, and the red light power before and after the peak is rapidly reduced along with the change of the wavelength, so that when the red light LED light source in the prior art is used for physiotherapy, only red light in a wave band which is narrower before and after the peak can generate physiotherapy effect, the effective wave band of physiotherapy is too narrow, and the physiotherapy effect of the red light cannot be further improved.
The LED chips in the LED light source device are mainly divided into a forward mounting mode and a reverse mounting mode. When the flip-chip type LED light source device is adopted, emitted light firstly emits downwards and then emits upwards after being reflected, a part of light can be lost, the light parameter efficiency of the LED light source device is low, and the brightness is low, so that the forward packaging of the LED chip is paid more attention to.
However, the front packaging of the LED chip requires spraying phosphor to the chip to form a phosphor film on the chip, but the spraying process has high equipment requirement and difficult process operation.
Therefore, the LED chip is packaged in a forward mode, equipment requirements can be reduced, process control difficulty can be reduced, and a red light source with a wider red light effective wave band can be formed.
Disclosure of Invention
The application aims at: aiming at the technical problems that in the prior art, the requirements of fluorescent powder layer preparation equipment for an LED light source positively arranged on a chip are high, the process difficulty is high, the peak shape in a spectrogram of a red light source is steep and too narrow, the red light power before and after the peak is rapidly reduced along with the change of wavelength, and then the effective wave band of physiotherapy is too narrow and the physiotherapy effect is poor. A red light packaging structure, a red light LED light source and a method for packaging LEDs are provided. The application relates to a forward chip in a forward-mounted type chip in a red light packaging structure, light is directly emitted upwards, the light parameter efficiency and brightness of an LED light source can be increased without reflection, at least two fluorescent powder layers are formed on the surface of the forward-mounted LED chip by dispensing, the application adopts the design of at least two dispensing fluorescent powder layers, the obtained light emitted by the light emitting unit has a wide red light effective wave band, the light power of the red light wave band is more than or equal to 80% of the maximum light power, and meanwhile, compared with other packaging processes, the process can reduce equipment requirements and process difficulty while achieving corresponding technical requirements.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
The red light packaging structure comprises at least one light emitting unit, wherein the light emitting unit comprises a forward chip and at least two layers of fluorescent powder layers formed by sequentially dispensing glue on the forward chip from bottom to top, the wavelength of an effective red light wave band generated by the light emitting unit is 600 nm-700 nm, and the light power of the red light wave band is greater than or equal to 80% of the maximum light power.
The application discloses a forward chip in a forward chip package structure, light is directly emitted upwards, the light parameter efficiency and brightness of an LED light source can be increased without reflection, at least two fluorescent powder layers are formed on the surface of the forward chip through dispensing, a layer of dispensing fluorescent powder layer is found to be incapable of emitting wider-band red light through research, according to the application, through the design of at least two dispensing fluorescent powder layers, the red light generated by the light-emitting unit has a wider effective wave band, the light power of the red light wave band is more than or equal to 80% of the maximum light power, and the application has very important significance for effectively providing a red light physiotherapy effect.
And further, sequentially dispensing 2-3 fluorescent powder layers on the forward chip from bottom to top. Through a great deal of experimental researches, one layer of fluorescent powder layer cannot form red light with a wider wave band, more than three layers excessively increase manufacturing cost, and the error rate is higher.
Further, the light-emitting wavelength of the forward chip is 440 nm-470 nm; the light-emitting unit comprises three fluorescent powder layers, namely a first fluorescent powder layer, a second fluorescent powder layer and a third fluorescent powder layer from bottom to top along the normal chip;
the first fluorescent powder layer comprises fluorescent powder A, fluorescent powder B and fluorescent powder D1;
The second fluorescent powder layer comprises fluorescent powder C, fluorescent powder D2 and fluorescent powder E1;
The third fluorescent powder layer comprises fluorescent powder D3, fluorescent powder E2 and fluorescent powder F;
The luminous wavelength of the fluorescent powder A is 600-640 nm;
The luminous wavelength of the fluorescent powder B is 650 nm-660 nm;
the luminous wavelength of the fluorescent powder C is 670 nm-700 nm;
The luminous wavelengths of the fluorescent powder D1, the fluorescent powder D2 and the fluorescent powder D3 are respectively 710 nm-730 nm;
the luminous wavelengths of the fluorescent powder E1, the fluorescent powder E2 and the fluorescent powder F are independently larger than 730nm and smaller than or equal to 800nm.
Further, in the first phosphor layer, the mass ratio of the phosphor a, the phosphor B, and the phosphor D1 is (5 to 25): (5-30): (8-45); and/or
In the second fluorescent powder layer, the mass ratio of the fluorescent powder C to the fluorescent powder D2 to the fluorescent powder E1 is (10-35): (10-35): (15-45); and/or
In the third phosphor layer, the mass ratio of the phosphor D3, the phosphor E2, and the phosphor F is (13-35): (12-35): (18-50).
Preferably, in the first fluorescent powder, the mass ratio of the fluorescent powder a, the fluorescent powder B and the fluorescent powder D1 is (10-25): (15-30): (20-35); and/or
In the second fluorescent powder, the mass ratio of the fluorescent powder C to the fluorescent powder D2 to the fluorescent powder E1 is (20-35): (20-35): (20-40); and/or
In the third fluorescent powder, the mass ratio of the fluorescent powder D3 to the fluorescent powder E2 to the fluorescent powder F is (20-30): (20-35): (35-50).
The application provides a fluorescence ratio of three fluorescent powder layers, and the quality ratio among the first fluorescent powder, the second fluorescent powder and the third fluorescent powder is controlled, so that the effective red light wave band generated by the light-emitting unit is wider, and the light power of the red light wave band is more than or equal to 80% of the maximum light power.
Further, the light-emitting wavelength of the forward chip is 440 nm-475 nm, the light-emitting unit comprises two layers of fluorescent powder layers, and a fourth fluorescent powder layer and a fifth fluorescent powder layer are sequentially arranged along the forward chip from bottom to top;
The fourth fluorescent powder layer comprises fluorescent powder G, fluorescent powder H and fluorescent powder I, wherein the luminous wavelength of the fluorescent powder G is 488-492 nm, the luminous wavelength of the fluorescent powder H is 533-537 nm, and the luminous wavelength of the fluorescent powder I is 658-662 nm;
The fifth fluorescent powder layer comprises fluorescent powder J, fluorescent powder K and fluorescent powder L, wherein the luminous wavelength of the fluorescent powder J is 718-722 nm, the luminous wavelength of the fluorescent powder K is 738-742 nm, and the luminous wavelength of the fluorescent powder L is 658-662 nm.
Further, in the fourth phosphor layer, the mass ratio of the phosphor G to the phosphor H to the phosphor I is 10-80:15-85:1-40; and/or, in the fifth fluorescent powder layer, the mass ratio of the fluorescent powder J to the fluorescent powder K to the fluorescent powder L is 20-120:10-90:1-100. Preferably, in the fourth phosphor layer, the mass ratio of the phosphor G, the phosphor H and the phosphor I is 10-70:15-75:1-35; and/or, in the fifth fluorescent powder layer, the mass ratio of the fluorescent powder J to the fluorescent powder K to the fluorescent powder L is 30-120:15-70:1-80.
Further, the thickness of each fluorescent powder layer is less than or equal to 0.25mm. The research shows that the fluorescent powder layer is too thick, and a wider-band red light spectrum is not easy to obtain. Preferably, the thickness of each phosphor layer is 0.1mm to 0.25mm. More preferably, the thickness of each phosphor layer is 0.15mm to 0.25mm.
Further, each phosphor layer comprises phosphor and glue.
Further, the total mass ratio of the fluorescent powder in each fluorescent powder layer is 50-80%.
Further, when the light emitting device comprises more than two light emitting units, the peak wavelengths of at least two of the front-mounted chips are different by more than 5 nm.
Further, the peak wavelengths of all the front-mounted chips are different, and the peak wavelength interval between any two front-mounted chips is more than 5 nm.
Another object of the present invention is to provide a red LED light source including the above red light package structure.
A red light LED light source comprises at least one red light packaging structure and an electric connecting piece electrically connected with the red light packaging structure.
The application discloses a red light LED light source which comprises at least one red light packaging structure and an electric connector electrically connected with the red light packaging structure. The generated red light has a wider effective wave band, and the light power of the red light wave band is more than or equal to 80 percent of the maximum light power, thus having very important significance for effectively providing the red light physiotherapy effect.
It is still another object of the present invention to provide a method for packaging the above red LED light source.
The packaging method of the red light LED light source is characterized by comprising the following steps of:
step 1, fixing the normal chips in all red light packaging structures on a bracket;
step 2, electrically connecting the front-mounted chips and the bracket by using an electric connector;
And 3, sequentially dispensing glue on the surface of the forward chip from bottom to top to form at least two fluorescent powder layers.
The invention discloses a packaging method of a red light source, which comprises the following steps: step 1, fixing the normal chips in all red light packaging structures on a bracket; step 2, electrically connecting the front-mounted chips and the bracket by using an electric connector; and 3, sequentially dispensing glue on the surface of the forward chip from bottom to top to form at least two fluorescent powder layers. The packaging method is simple to operate and convenient to control.
Further, the blue light chip is arranged on the support in a circumferential manner, and a dam is arranged on the outer side of the blue light chip.
Further, when two adjacent fluorescent powder layers are subjected to dispensing, a drying and curing process is carried out at intervals.
Explanation of technical terms:
Spectral power:
the spectrum emitted by a light source often is not a single wavelength, but rather consists of a mixture of radiation of many different wavelengths. The spectral radiation of a light source and the intensity distribution of the individual wavelengths in wavelength order is referred to as the spectral power distribution of the light source.
Parameters for characterizing the magnitude of the spectral power are divided into absolute spectral power and relative spectral power. And hence the absolute spectral power distribution curve: refers to a curve made with absolute values of the energy of various wavelengths of spectral radiation;
Relative spectral power distribution curve: the energy of various wavelengths of the light source radiation spectrum is compared with each other, and the radiation power is changed only within a prescribed range after normalization processing. The maximum relative spectral power of the radiation power is 1, and the relative spectral power of other wavelengths is less than 1.
In summary, due to the adoption of the technical scheme, the beneficial effects of the invention are as follows:
1. The forward chip in the red light packaging structure is a forward chip, light is directly emitted upwards, the light parameter efficiency and the brightness of the LED light source can be increased without reflection, the surface of the forward chip is glued to form at least two fluorescent powder layers, according to the application, through the design of at least two layers of dispensing fluorescent powder layers, the effective wave band of the red light generated by the light-emitting unit is wider, the wavelength is 600-700 nm, and the light power of the red light wave band is greater than or equal to 80% of the maximum light power. The method has very important significance for effectively providing the red light physiotherapy effect, and meanwhile, compared with other packaging processes, the process can meet the corresponding technical requirements, and meanwhile, the equipment requirements and the process difficulty can be reduced.
2. The application discloses a red light LED light source which comprises at least one red light packaging structure and an electric connector electrically connected with the red light packaging structure. The generated red light has a wider effective wave band, and the light power of the red light wave band is more than or equal to 80 percent of the maximum light power, thus having very important significance for effectively providing the red light physiotherapy effect.
3. The invention discloses a packaging method of a red light LED light source, which comprises the following steps: step 1, fixing the normal chips in all red light packaging structures on a bracket; step 2, electrically connecting the front-mounted chips and the bracket by using an electric connector; and 3, sequentially dispensing glue on the surface of the forward chip from bottom to top to form at least two fluorescent powder layers. The packaging method is simple to operate and convenient to control.
Drawings
FIG. 1 is a spectrum of a prior art red LED light source;
fig. 2 is a schematic top view of a red light package structure of embodiment 11.
Fig. 3 is a schematic cross-sectional view of fig. 2.
Fig. 4 is a schematic top view of a red light package structure of embodiment 12.
FIG. 5 is a spectrum chart of the red light package structure of example 21.
FIG. 6 is a spectrum chart of the red light package structure of example 22.
Fig. 7 is a schematic top view of a red light package structure of embodiment 23.
Fig. 8 is a schematic cross-sectional view of fig. 7.
FIG. 9 is a spectrum chart of the red light package structure of example 23.
FIG. 10 is a spectrum chart of the red light package structure of example 24.
FIG. 11 is a spectrum chart of the red light package structure of example 1.
Icon: 1-a bracket; 11-grooves; 2-positively mounting a chip; 21-gold wire; 3-a retaining dam; 4-a first phosphor layer; 5-a second phosphor layer; 6-a third phosphor layer; 7-a fourth phosphor layer; 8-fifth phosphor layer.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings.
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In the following examples, it is understood that the emission wavelength of the phosphor refers to the wavelength corresponding to the peak value of the main spectrum peak generated by photon excitation of the phosphor.
In the following examples, the phosphors involved may include nitrides, Y 3AL12: c and fluoride either a compound. The fluorescent powder can be directly purchased or blended according to the wavelength value.
Example 1
The red light packaging structure provided in embodiment 1 includes a light emitting unit, which may be one or more light emitting units, where the light emitting unit includes a front-mounted chip 2 and two phosphor layers formed by sequentially dispensing glue on the front-mounted chip 2 from bottom to top, the effective band of red light generated by the light emitting unit is wider, and the optical power of the red light band is greater than or equal to 80% of the maximum optical power.
Specifically, as shown in fig. 2 and fig. 3, embodiment 11 provides a red light packaging structure, which comprises a bracket 1, wherein a groove 11 is arranged in the middle of the bracket 1, the inner wall of the groove is inclined towards the middle, a light emitting unit is arranged in the groove 11, the front chip 2 is arranged at the bottom of the groove 11, and a gold wire 21 is connected between the front chip 2 and the bottom surface of the groove 11; and sequentially dispensing the fourth fluorescent powder layer 7 and the fifth fluorescent powder layer 8 from bottom to top along the forward chip 2, wherein the total mass ratio of the fluorescent powder in each fluorescent powder layer is 65%, and the thickness of each fluorescent powder layer is 0.25 mm.
Specifically, as shown in fig. 4, embodiment 12 provides a red light packaging structure, which comprises a bracket 1, wherein a groove 11 is arranged in the middle of the bracket 1, the inner wall of the groove is inclined towards the middle, three light-emitting units are arranged in the groove 11, and a dam 3 is arranged between the three light-emitting units; the three light emitting units have the same structure, and are sequentially dispensed from bottom to top along the forward chip 2 to form a fourth fluorescent powder layer 7 and a fifth fluorescent powder layer 8, wherein the total mass ratio of fluorescent powder in each fluorescent powder layer is 50%, and the thickness of each fluorescent powder layer is 0.2mm.
Specifically, the luminescence wavelength of the forward chip is 440 nm-475 nm, the luminescence unit comprises two layers of fluorescent powder layers, and a fourth fluorescent powder layer and a fifth fluorescent powder layer are sequentially arranged along the forward chip from bottom to top;
The fourth fluorescent powder layer comprises fluorescent powder G, fluorescent powder H and fluorescent powder I, wherein the luminous wavelength of the fluorescent powder G is 488-492 nm, the luminous wavelength of the fluorescent powder H is 533-537 nm, and the luminous wavelength of the fluorescent powder I is 658-662 nm;
The fifth fluorescent powder layer comprises fluorescent powder J, fluorescent powder K and fluorescent powder L, wherein the luminous wavelength of the fluorescent powder J is 718-722 nm, the luminous wavelength of the fluorescent powder K is 738-742 nm, and the luminous wavelength of the fluorescent powder L is 658-662 nm.
Specifically, in the fourth phosphor layer, the mass ratio of the phosphor G to the phosphor H to the phosphor I is 10-80:15-85:1-40; in the fifth fluorescent powder layer, the mass ratio of the fluorescent powder J to the fluorescent powder K to the fluorescent powder L is 20-120:10-90:1-100. The spectrum that can be formed is shown in fig. 11.
Example 2
The red light packaging structure provided in embodiment 2 includes a light emitting unit, which may be one or more light emitting units, where the light emitting unit includes a front-mounted chip 2 and three phosphor layers formed by sequentially dispensing glue on the front-mounted chip 2 from bottom to top, the effective band of red light generated by the light emitting unit is wider, and the optical power of the red light band is greater than or equal to 80% of the maximum optical power.
Specifically, the light-emitting wavelength of the forward chip is 440 nm-470 nm; the light-emitting unit comprises three fluorescent powder layers, namely a first fluorescent powder layer, a second fluorescent powder layer and a third fluorescent powder layer from bottom to top along the normal chip;
the first fluorescent powder layer comprises fluorescent powder A, fluorescent powder B and fluorescent powder D1;
The second fluorescent powder layer comprises fluorescent powder C, fluorescent powder D2 and fluorescent powder E1;
The third fluorescent powder layer comprises fluorescent powder D3, fluorescent powder E2 and fluorescent powder F;
The luminous wavelength of the fluorescent powder A is 600-640 nm;
The luminous wavelength of the fluorescent powder B is 650 nm-660 nm;
the luminous wavelength of the fluorescent powder C is 670 nm-700 nm;
The luminous wavelengths of the fluorescent powder D1, the fluorescent powder D2 and the fluorescent powder D3 are respectively 710 nm-730 nm;
the luminous wavelengths of the fluorescent powder E1, the fluorescent powder E2 and the fluorescent powder F are independently larger than 730nm and smaller than or equal to 800nm.
Specifically, in the group of embodiment 21 to embodiment 24, the first phosphor includes phosphor a, phosphor B, and phosphor D1. (Ca, sr) AlSiN 3 having an emission wavelength of 630nm for phosphor A, (Ca, sr) AlSiN 3 having an emission wavelength of 660nm for phosphor B, and (Ca, sr) AlSiN 3 having an emission wavelength of 720nm for phosphor D1.
The second phosphor includes phosphor C, phosphor D2, and phosphor E1. (Ca, sr) AlSiN 3 having an emission wavelength of 679nm, (Ca, sr) AlSiN 3 having an emission wavelength of 720nm, and (Ca, sr) AlSiN 3 having an emission wavelength of 740nm, respectively, for phosphor E1.
The third phosphor includes phosphor D3, phosphor E2, and phosphor F. (Ca, sr) AlSiN 3 with the light-emitting wavelength of 720nm for the phosphor D3, (Ca, sr) AlSiN 3 with the light-emitting wavelength of 740nm for the phosphor E2, and (Ca, sr) AlSiN 3 with the light-emitting wavelength of 795nm for the phosphor F.
The mass ratio of the first phosphor a, the phosphor B, and the phosphor D1 in the red phosphor compositions of examples 21 to 29, the mass ratio of the second phosphor C, the phosphor D2, and the phosphor E1, and the mass ratio of the third phosphor D3, the phosphor E2, and the phosphor F are described in table 1 below.
Specifically, embodiment 21 provides a red light packaging structure, which includes a light emitting unit, and a first phosphor layer 4, a second phosphor layer 5 and a third phosphor layer 6 are formed by sequentially dispensing from bottom to top along the front-mounted chip 2; the total mass ratio of the fluorescent powder in each fluorescent powder layer is 60%, and the thickness of each fluorescent powder layer is 0.15 nm. The spectrum formed is shown in fig. 5.
Specifically, embodiment 22 provides a red light packaging structure, which includes a light emitting unit, and a first phosphor layer 4, a second phosphor layer 5 and a third phosphor layer 6 are formed by sequentially dispensing from bottom to top along the front-mounted chip 2; the total mass ratio of the fluorescent powder in each fluorescent powder layer was 70%, and the thickness of each fluorescent powder layer was 0.15 nm. The spectrum formed is shown in fig. 6.
Specifically, as shown in fig. 7 and 8, embodiment 23 provides a red light packaging structure, which comprises a bracket 1, wherein a groove 11 is arranged in the middle of the bracket 1, the inner wall of the groove is inclined towards the middle direction, and four light emitting units are arranged in the groove 11. A dam 3 is arranged among the four light-emitting units; the structure of each light-emitting unit is the same, the upper two light-emitting units are arranged at intervals, the lower two light-emitting units are arranged at intervals, the front-mounted chip 2 is arranged at the bottom of the groove 11, and a gold thread 21 is connected between the front-mounted chip 2 and the bottom surface of the groove 11; the four light-emitting units are sequentially dispensing from bottom to top along the forward chip 2 to form a first fluorescent powder layer 4, a second fluorescent powder layer 5 and a third fluorescent powder layer 6; the total mass ratio of the fluorescent powder in each fluorescent powder layer was 55%, and the thickness of each fluorescent powder layer was 0.1 nm. The spectrum formed is shown in fig. 9.
Specifically, embodiment 24 provides a red light packaging structure, which includes a light emitting unit, and a first phosphor layer 4, a second phosphor layer 5 and a third phosphor layer 6 are formed by sequentially dispensing from bottom to top along the front-mounted chip 2; the total mass ratio of the fluorescent powder in each fluorescent powder layer was 70%, and the thickness of each fluorescent powder layer was 0.15 nm. The spectrum formed is shown in fig. 10.
TABLE 1
In the spectrum emitted by the red light packaging structure of embodiment 2, the peak shape is flat in a wide wave band before and after the peak, the absolute spectrum of the red light in the wave band is similar to the maximum absolute spectrum value of the red light (for example, the optical power or the absolute relative spectrum value of the wave band is greater than or equal to 80% of the maximum optical power or the maximum absolute relative spectrum value), when in physiotherapy, the red light in the wave band can generate physiotherapy effect, the wave band is an effective wave band, and the red light physiotherapy generated by the red light LED light source has wide effective wave band and good physiotherapy effect.
Example 3
Embodiment 3 provides a red LED light source comprising at least one red light package structure of embodiment 1 or/and embodiment 2 and an electrical connector electrically connected to the red light package structure. The effective wave band of the generated red light is wider, the light power of the red light wave band is more than or equal to 80 percent of the maximum light power, and the method has very important significance for effectively providing the red light physiotherapy effect.
The bracket 1 may be a hard substrate such as a printed circuit board or an aluminum substrate, or may be a flexible substrate, and specifically may be flexibly selected according to use requirements. The electrical connection may be an electrical circuit formed on the surface of the support 1 or may be an electrode mounted on the surface of the support 1. The connection mode of the electric connector and the bracket 1 can be determined according to the material of the electric connector and the mounting mode of the light emitting component, which is the prior art and will not be described herein. Each luminous component is electrically connected with an external power supply through the electric connecting piece. The number of the light emitting components is one group, two groups or more groups, and the structure and the function of each light emitting component are consistent.
Example 4
Embodiment 3 provides a packaging method of a red light LED light source, which specifically comprises the following steps:
step 1, fixing the normal chip 2 in all red light packaging structures on a bracket 1;
Step 2, electrically connecting the front-mounted chips 2 and the front-mounted chips 2 with the bracket 1 by using an electric connector;
and 3, sequentially dispensing glue on the surface of the forward chip 2 from bottom to top to form at least two fluorescent powder layers.
In some embodiments, the mounting device further comprises a dam 3 circumferentially arranged on the outer side of the front-mounted chip 2 on the bracket 1. The dam 3 may be installed in advance when the bracket 1 is manufactured, or may be installed after the chip 2 is mounted.
Further, when two adjacent fluorescent powder layers are subjected to dispensing, a drying and curing process is carried out at intervals.
The forward chip 2 in the red light packaging structure is a forward chip, light is directly emitted upwards, reflection is not needed, the light parameter efficiency and brightness of the LED light source can be increased, and at least two fluorescent powder layers are formed on the surface of the forward chip through dispensing, so that the equipment requirement can be reduced, and the process difficulty is reduced. The application adopts the design of at least two layers of dispensing fluorescent powder layers, the effective wave band of the red light generated by the light-emitting unit is wider, the light power of the red light wave band is more than or equal to 80 percent of the maximum light power, the application has very important significance for effectively providing the red light physiotherapy effect, and meanwhile, compared with other packaging processes, the process can reduce the equipment requirement and the process difficulty while reaching the corresponding technical requirement.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (7)
1. The red light packaging structure is characterized by comprising at least one light emitting unit, wherein the light emitting unit comprises a forward chip and two fluorescent powder layers formed by sequentially dispensing glue on the forward chip from bottom to top, and the thickness of each fluorescent powder layer is 0.1-0.25 mm; the wavelength of the red light effective wave band generated by the light emitting unit is 600 nm-700 nm, and the light power of the red light wave band is more than or equal to 80% of the maximum light power;
The light-emitting unit comprises two layers of fluorescent powder layers, the light-emitting wavelength of the forward chip is 440 nm-475 nm, and the forward chip is sequentially provided with a fourth fluorescent powder layer and a fifth fluorescent powder layer from bottom to top;
The fourth fluorescent powder layer comprises fluorescent powder G, fluorescent powder H and fluorescent powder I, wherein the luminous wavelength of the fluorescent powder G is 488-492 nm, the luminous wavelength of the fluorescent powder H is 533-537 nm, and the luminous wavelength of the fluorescent powder I is 658-662 nm;
The fifth fluorescent powder layer comprises fluorescent powder J, fluorescent powder K and fluorescent powder L, wherein the luminous wavelength of the fluorescent powder J is 718-722 nm, the luminous wavelength of the fluorescent powder K is 738-742 nm, and the luminous wavelength of the fluorescent powder L is 658-662 nm;
In the fourth fluorescent powder layer, the mass ratio of the fluorescent powder G to the fluorescent powder H to the fluorescent powder I is 10-80:15-85:1-40; and/or, in the fifth fluorescent powder layer, the mass ratio of the fluorescent powder J to the fluorescent powder K to the fluorescent powder L is 20-120:10-90:1-100.
2. The red light package structure of claim 1, wherein each phosphor layer has a thickness of 0.25mm or less.
3. The red light package structure according to claim 1, wherein peak wavelengths of at least two of the front-mounted chips differ by 5nm or more when the package structure includes two or more light emitting units.
4. The red light package structure of claim 2, wherein peak wavelengths of all the front-mounted chips are different from each other, and a peak wavelength interval between any two of the front-mounted chips is 5nm or more.
5. A red LED light source comprising at least one red light package structure according to any one of claims 1-4 and an electrical connector electrically connected to the red light package structure.
6. The method of packaging a red LED light source of claim 5, comprising the steps of:
step 1, fixing the normal chips in all red light packaging structures on a bracket;
step 2, electrically connecting the front-mounted chips and the bracket by using an electric connector;
And 3, sequentially dispensing glue on the surface of the forward chip from bottom to top to form at least two fluorescent powder layers.
7. The method of claim 6, further comprising mounting a dam on the frame around the outside of the front-mounted chip.
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| CN118016783A (en) * | 2024-02-07 | 2024-05-10 | 天津德高化成新材料股份有限公司 | Medical backlight source and preparation method and application thereof |
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