CN115793800A - Edge computing industrial personal computer - Google Patents
Edge computing industrial personal computer Download PDFInfo
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- CN115793800A CN115793800A CN202211564696.1A CN202211564696A CN115793800A CN 115793800 A CN115793800 A CN 115793800A CN 202211564696 A CN202211564696 A CN 202211564696A CN 115793800 A CN115793800 A CN 115793800A
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 62
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 56
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 49
- 239000013078 crystal Substances 0.000 claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 238000007599 discharging Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 11
- 239000000428 dust Substances 0.000 abstract description 10
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 8
- 230000005855 radiation Effects 0.000 abstract description 8
- 238000004364 calculation method Methods 0.000 description 21
- 238000010586 diagram Methods 0.000 description 10
- 230000006870 function Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 241000282376 Panthera tigris Species 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention provides an edge computing industrial personal computer, which comprises: the heat pipe comprises a shell, heat dissipation fins, a heat pipe, an aluminum profile fixing frame, a red copper heat conduction block and a core main board; the red copper heat-conducting block is connected and arranged on the heat pipe, the heat pipe is connected and arranged on the aluminum profile fixing frame, and the heat-radiating fins are arranged on the aluminum profile fixing frame; the red copper heat-conducting block is contacted with the CPU crystal on the core mainboard, the heat of the CPU crystal is transferred to the red copper heat-conducting block, the heat of the red copper heat-conducting block is transferred to the heat pipe, and the heat of the heat pipe is transferred to the aluminum profile fixing frame and the radiating fins; the shell is installed on the aluminium alloy mount, is provided with the louvre on the shell, and the louvre corresponds heat radiation fins and sets up. The invention adopts the fan-free and auxiliary air cooling design, and the fan-free design is adopted in the mainboard, thereby effectively solving the heat dissipation problem of the high-speed operation of the CPU and avoiding the fault caused by dust entering the interior.
Description
Technical Field
The invention relates to the technical field of industrial control, in particular to an edge calculation industrial personal computer, and particularly relates to a palm-size high-performance edge calculation industrial personal computer.
Background
The edge computing industrial personal computer is a special computer for industry, also called as special computer, and is mainly embedded in industrial automation equipment, industrial motion control and machine vision equipment, and is a computer which focuses on stable, reliable and long-term continuous work, has the capabilities of dust prevention, high and low temperature resistance, vibration resistance and electromagnetic interference resistance, and has strong computing performance and integrated communication function.
The traditional industrial personal computer is large and heavy, the occupied space for installation is large, the installation and application of embedded equipment are not facilitated, the heat dissipation of a case fan, a CPU fan and a power supply fan is relied on, if one fan is damaged when the fan is used in a severe industrial field environment, particularly in a dust and dust large environment, the heat dissipation of a host computer can break down, and the industrial personal computer is shut down and repaired on site.
The CPU processor heat dissipation mode of the traditional industrial personal computer is processed by two modes: the first way is to install a fan on the CPU for heat dissipation, because the fan is adopted for heat dissipation, the box body of the whole machine needs to be provided with a hole for heat dissipation and comprises an air inlet fan and an air exhaust fan, so that at least 2-3 fans are needed for heat dissipation to ensure that the heat of the internal CPU can be taken away by positive air pressure, but the defect of the heat dissipation mode is obvious, along with the increase of the operation time, dust can be brought into the interior of the fan and the interior of a mainboard along with the air, the host can be short-circuited or even damaged in a humid environment, if the dust is a dust conductive substance, the host can be short-circuited and shut down, the fan is a mechanical device, the service life is long, the normal service life is greatly shortened in a severe environment, the damage is easily caused, meanwhile, if one fan in the box body does not rotate or has too slow rotation speed, the heat dissipation is not good, the host can operate slowly or even shut down, the whole equipment is caused, in addition, the air inlet temperature is relatively high when the box body is used in a high-temperature environment higher than 40 ℃, the effective heat dissipation effect on the CPU is not good, the CPU temperature is easily too high, the operation, and the software operation and the real-time control are affected; the second mode is to make the heat radiation structure design through the aluminium alloy, the radiating effect and the heat radiating area of aluminium alloy are in direct proportion relation, the heat radiation conduction numerical value of pure aluminium is not very fast, the fever of CPU treater more than 15W and 28W needs to be through increaseing heat radiating area and volume, like this whole product is bulky product weight, it is not very suitable especially to the field that the volume requires smallness in many embedded applications, for example mobile robot, robot controller, machine vision controller etc. simultaneously more than 15W treater is at the time full load calculation high power operation because aluminium material heat radiation conduction is limited, CPU high temperature off-range warning in the twinkling of an eye leads to CPU operation card pause, thereby leads to equipment real-time control unusual, this is that the material characteristic decides.
The patent document with the publication number of CN114860039A discloses a modularized edge computing industrial personal computer, which comprises an I/O interface module, a core mainboard and a shell, wherein the I/O interface module and the core mainboard are arranged in the shell, the core mainboard comprises a plurality of core mainboards of different models, and the sizes of the core mainboards of the different models are matched with the I/O interface module; the I/O interface module comprises an I/O expansion sub-card and an I/O carrier plate, the I/O expansion sub-card and various core main boards of different models can be detachably connected with one surface of the I/O carrier plate, and the other surface of the I/O carrier plate is provided with a hard disk and faces the top of the shell. However, the patent document still has the defects of large volume, heavy weight and large occupied space for installation.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide an edge computing industrial personal computer.
The invention provides an edge computing industrial personal computer, which comprises: the heat pipe comprises a shell, heat dissipation fins, a heat pipe, an aluminum profile fixing frame, a red copper heat conduction block and a core main board;
the red copper heat-conducting block is connected and arranged on the heat pipe, the heat pipe is connected and arranged on the aluminum profile fixing frame, and the heat-radiating fins are arranged on the aluminum profile fixing frame;
the red copper heat-conducting block is in contact with a CPU crystal on the core mainboard, the heat of the CPU crystal is transferred to the red copper heat-conducting block, the heat of the red copper heat-conducting block is transferred to the heat pipe, and the heat of the heat pipe is transferred to the aluminum profile fixing frame and the heat-radiating fins;
the shell is installed on the aluminum profile fixing frame, heat dissipation holes are formed in the shell and correspond to the heat dissipation fins.
Preferably, the heat dissipation fins include high aluminum heat dissipation fins and low aluminum heat dissipation fins which are integrally formed, and the high aluminum heat dissipation fins and the low aluminum heat dissipation fins are arranged in a step shape.
Preferably, the shell is provided with an air inlet and an air outlet;
the air inlet hole and the air outlet hole form air circulation, the air inlet hole is used for entering cold air, and the air outlet hole is used for discharging hot air.
Preferably, the intelligent air conditioner further comprises an intelligent fan, wherein the intelligent fan is electrically connected with the CPU temperature sensor on the core mainboard;
the CPU temperature sensor is used for measuring the temperature of the CPU crystal, and the rotating speed and the air volume of the intelligent fan are adjusted according to the measurement data fed back by the CPU temperature sensor.
Preferably, an interface board is arranged on the housing, and the smart fan is arranged on the interface board;
the interface board the shell and form the wind pressure space between the heat dissipation fin, smart fan is located in the wind pressure space, the louvre with the wind pressure space intercommunication sets up.
Preferably, the smart fan is turned on or off according to the temperature of the CPU crystal measured by the CPU temperature sensor:
when the temperature of the CPU crystal reaches 70 ℃, the intelligent fan is started;
when the temperature of the CPU crystal is lower than 60 ℃, the intelligent fan is turned off.
Preferably, when the intelligent fan is started, the rotating speed of the intelligent fan becomes faster along with the rise of the temperature of the CPU crystal;
when the temperature of the CPU crystal rises to 80 ℃, the smart fan reaches the maximum rotational speed.
Preferably, the red copper heat conduction block and the heat pipe are welded on the aluminum profile fixing frame.
Preferably, the multifunctional I/O carrier board is further included, a 70 x 2PIN female head is arranged on the multifunctional I/O carrier board, a 70 x 2PIN male head is arranged on the core mainboard, and the 70 x 2PIN female head is connected with the 70 x 2PIN male head in a card-to-card mode;
the multifunctional I/O carrier plate is provided with an M2 hard disk, a 5G module and two M2 slots, wherein the M2 hard disk and the 5G module are respectively inserted into the different M2 slots and are locked into the M2 stud by an M2 screw to be fixed;
the core mainboard is provided with a memory bank and a memory slot with a buckle, and the memory bank is inserted into the memory slot.
Preferably, the antenna also comprises an I/O expansion board, a 4G antenna, a lower cover and a right side cover;
the lower cover and the right side cover are both arranged on the aluminum profile fixing frame; the I/O expansion board is fixed on the lower cover through screws, and the 4G antenna is fixed on the right side cover through screws;
and a connecting hole is formed in the right cover, and the connecting hole is used for arranging an expansion interface on the I/O expansion board.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention adopts the fan-free and auxiliary air cooling design, and the fan-free design is adopted in the mainboard, thereby effectively solving the heat dissipation problem of the high-speed operation of the CPU and avoiding the fault caused by dust entering the interior;
2. the edge calculation industrial personal computer has the advantages that the size is only the size of a palm, the size is small, the edge calculation industrial personal computer is easy to embed into various automatic and intelligent edge calculation devices, the edge calculation industrial personal computer is an ideal model selection product of compact type small intelligent calculation devices, and the edge calculation industrial personal computer is particularly suitable for application fields of mobile robot control, industrial internet of things terminals, AI calculation acceleration boxes and the like which have high requirements on calculation performance and have very compact requirements on size;
3. the intelligent fan is additionally arranged on the integrated fanless radiating substrate fin, the rotating speed and the air quantity are intelligently adjusted through the CPU temperature sensor, when the temperature of the CPU is lower than a certain value, the fan does not work, the fan has the functions of accelerating the air flow on the surface of the fin to take away heat, reducing the internal heat and prolonging the service life of main components, and the radiating mode can solve the problem that the CPU with the volume of more than 28W normally works under full load at the high temperature of more than 50 ℃;
4. the red copper heat conduction block and the heat pipe are adopted for heat conduction, the heat conduction coefficients of the red copper heat conduction block and the heat pipe are excellent and are higher than those of an independent aluminum profile, and the red copper heat conduction block and the heat pipe conduct instant high heat of a CPU to the aluminum profile through rapid heat conduction, so that the situation that the calculation performance is reduced due to instant overheating of the CPU is prevented, and real-time calculation and control of equipment cannot be met;
5. the invention has the effect of making large-area and dense radiating fins on the aluminum profile fixing frame to increase the radiating area, and realizes the radiating on ultra-small area and volume through the design of the fins, because the key of effective radiating is to increase the radiating area, the heat of the internal CPU flows on the surfaces of the fins, the heat generated in the internal CPU is continuously volatilized, the temperature of the internal CPU is reduced, and the performance of a processor is ensured not to be influenced.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic diagram of the overall structure of an edge computing industrial personal computer in one form;
FIG. 2 is an exploded view of one form of an edge computing IPC;
FIG. 3 is a schematic diagram of the overall structure of an edge computing industrial personal computer in another form;
FIG. 4 is an explosion diagram of another type of edge computing IPC;
FIG. 5 is an exploded view of an edge computing IPC of the present invention;
FIG. 6 is an assembly schematic diagram of an edge computing IPC of the present invention;
FIG. 7 is a schematic diagram of various core boards.
The figures show that:
multifunctional I/O carrier board 9 of shell 1
Heat dissipation hole 101 x 2PIN female head 10
Air inlet 102 x 2PIN male head 11
Radiating fin 2 5G module 13
High-aluminum heat dissipation fin 201 M2 slot 14
Short aluminum heat sink fin 202 M2 stud 15
Heat pipe 3I/O expansion plate 16
Aluminum profile fixing frame 4G antenna 17
Red copper heat conduction block 5 lower cover 18
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
Example 1:
as shown in fig. 1 to 7, the present embodiment provides an edge computing industrial personal computer, including: shell 1, heat radiation fins 2, heat pipe 3, aluminium alloy mount 4, red copper conducting strip 5 and core mainboard 6, red copper conducting strip 5 is connected and is set up on heat pipe 3, heat pipe 3 is connected and is set up on aluminium alloy mount 4, heat radiation fins 2 install on aluminium alloy mount 4, CPU crystal 601 on red copper conducting strip 5 and the core mainboard 6 contacts, CPU crystal 601's heat transfer is for red copper conducting strip 5, red copper conducting strip 5's heat transfer is for heat pipe 3, heat pipe 3's heat transfer is for aluminium alloy mount 4 and heat radiation fins 2, shell 1 installs on aluminium alloy mount 4, be provided with louvre 101 on shell 1, louvre 101 corresponds heat radiation fins 2 and sets up.
The heat dissipation fins 2, the red copper heat conduction block 3 and the aluminum profile fixing frame 4 are integrally arranged to form a heat dissipation structure body without a fan for heat dissipation, and the heat dissipation structure body is sealed and isolated from a CPU on the core mainboard 6.
The red copper heat-conducting block 5 and the heat pipe 3 are both welded on the aluminum profile fixing frame 4. The radiator fins 2 include integrally formed tall aluminum radiator fins 201 and short aluminum radiator fins 202, and the tall aluminum radiator fins 201 and the short aluminum radiator fins 202 are arranged in a step shape.
An air inlet hole 102 and an air outlet hole 103 are formed in the housing 1, air circulation is formed between the air inlet hole 102 and the air outlet hole 103, the air inlet hole 102 is used for allowing cold air to enter, and the air outlet hole 103 is used for discharging hot air.
The edge calculation industrial personal computer of the embodiment further comprises an I/O expansion board 16, a 4G antenna 17, a lower cover 18 and a right side cover 19, wherein the lower cover 18 and the right side cover 19 are both arranged on the aluminum profile fixing frame 4; the I/O expansion board 16 is fixed on the lower cover 18 through screws, the 4G antenna 17 is fixed on the right cover 19 through screws, and the right cover 19 is provided with connecting holes which are arranged for expansion interfaces on the I/O expansion board 16.
The edge computing industrial personal computer of the embodiment further comprises a multifunctional I/O carrier plate 9, a 70 x 2PIN female head 10 is arranged on the multifunctional I/O carrier plate 9, a 70 x 2PIN male head 11 is arranged on the core mainboard 6, the 70 x 2PIN female head 10 and the 70 x 2PIN male head 11 are connected with a card, an M2 hard disk 12, a 5G module 13 and two M2 slots 14 are arranged on the multifunctional I/O carrier plate 9, the M2 hard disk 12 and the 5G module 13 are respectively inserted into the different M2 slots 14 and are locked into the M2 studs 15 by M2 screws for fixing, a memory bar 20 and a memory slot 21 with a buckle are arranged on the core mainboard 6, and the memory bar 20 is inserted into the memory slot 21.
The edge computing industrial personal computer of the embodiment further comprises an intelligent fan 7, the intelligent fan 7 is electrically connected with a CPU temperature sensor on the core mainboard 6, the CPU temperature sensor is used for measuring the temperature of the CPU crystal 601, and the rotating speed and the air volume of the intelligent fan 7 are adjusted according to measurement data fed back by the CPU temperature sensor. The shell 1 is provided with an interface board 8, the intelligent fan 7 is arranged on the interface board 8, a wind pressure space is formed among the interface board 8, the shell 1 and the radiating fins 2, the intelligent fan 7 is located in the wind pressure space, and the radiating holes 101 are communicated with the wind pressure space.
The smart fan 7 is turned on or off according to the temperature of the CPU crystal 601 measured by the CPU temperature sensor: when the temperature of the CPU crystal 601 reaches 70 ℃, the intelligent fan 7 is started; when the temperature of the CPU crystal 601 is below 60 ℃, the smart fan 7 is turned off. When the intelligent fan 7 is started, the rotating speed of the intelligent fan 7 is increased along with the temperature rise of the CPU crystal 601, and when the temperature of the CPU crystal 601 rises to 80 ℃, the intelligent fan 7 reaches the highest rotating speed.
Example 2:
those skilled in the art will understand this embodiment as a more specific description of embodiment 1
The embodiment provides an edge computing industrial personal computer, which adopts an embedded design and has palm size, wherein two platforms of CPUs of Intel X86Whiskey LakeU and Tiger LakeU Core i7& i5 can be selected, the power consumption of the two CPUs above i5 is more than 15W, particularly the power consumption of the Tiger LakeU i7/i5 CPU is 28W to the maximum, and the higher the power consumption is, the stronger the CPU computing power and the GPU computing power are.
The AI algorithm, the real-time motion control software and the machine vision application software provide a powerful CPU computing platform and self-contained GPU computing power, and can meet the requirements of intelligent computing equipment at present and in a period in the future.
X86 core motherboard 1: intel WhiskeyLakeU X86 computing platform, CPU model list: intel Core i58265U & i7 8565U
X86 core motherboard 2: intel tiger lakeu X86 computing platform, CPU model list: intel Core i51135G7& i7 1165G7
The size of the edge calculation industrial personal computer is designed according to the size of a palm, the edge calculation industrial personal computer mainly meets the requirements of the existing and future intelligent equipment on high-performance calculation and small-size design, and is mainly used in the field with high calculation capacity on a CPU and a GPU (Central processing Unit) such as embedded compact intelligent equipment of mobile robot controllers, 3D machine vision controllers, multifunctional robot controllers and the like. However, how to consider the heat dissipation of the ultra-small volume and the 15W and 28W processors is a technical problem, and meanwhile, the influence of the use in the severe environment of an industrial field on the stability and long-term operation of the product is also considered, and the heat dissipation needs to be good and the sealing needs to be good to meet the conditions.
The heat dissipation structure and the internal CPU are sealed and isolated, so that the heat dissipation is effective, the sealing performance of core devices of the whole product is protected, the influence of moisture and dust on the work of the core devices can be prevented, the structure can work normally under the full load of a 15W processor at the high temperature of 50 ℃, and a 28W processor can work under the full load at the high temperature of 40 ℃.
The main materials of the structure without heat dissipation by fan are as follows:
1. the red copper and the heat pipe have excellent heat conduction coefficients which are higher than those of single aluminum, and have the functions of quickly conducting high heat of a CPU (central processing unit) to the aluminum profile, so that the reduction of the calculation performance caused by the instantaneous overheating of the CPU is prevented, and the real-time calculation and control of equipment cannot be met;
2. the large-area and dense radiating fins on the aluminum substrate have the advantages that the radiating area is increased, the problem of heat dissipation in an ultra-small area and a small size is solved through the design of the fins, the radiating area is increased as the key point of effective heat dissipation is that the air flow is carried out on the surface of the fins by the heat of the internal CPU, the heat generated in the internal CPU is continuously volatilized, the temperature of the internal CPU is reduced, and the performance of the processor is guaranteed not to be influenced.
Aiming at the heat dissipation of a 28W high-performance processor, partial optimization is carried out on the heat dissipation process, namely, an intelligent auxiliary air cooling technology is combined on the fanless heat dissipation technology, the specific implementation scheme is that an intelligent fan is additionally arranged on an integrated fanless heat dissipation substrate fin, the rotating speed and the air quantity are intelligently adjusted through a CPU temperature sensor, and when the temperature of a CPU is lower than a certain value, the fan does not work. The fan has the functions of accelerating the air flow on the surface of the fin to take away heat, reducing the internal heat and prolonging the service life of main components. This heat dissipation mode can solve the problem that the CPU with the power of more than 28W normally works under the full load at the high temperature of more than 50 ℃ and in the compact volume.
The combination of the heat dissipation modes better solves the heat dissipation problem of the 28W power consumption CPU in the operation at the high temperature of more than 50 ℃, and the CPU does not jam or reduce the frequency when operating at full load, thereby ensuring the real-time calculation and control of the CPU and further ensuring the operation stability of the whole equipment. The computing requirements of different application scenes in the field of embedded compact small-size edge computing are met.
1. Palm volume high power dissipation solution:
1. the combined heat dissipation mode:
1.1, as shown in figure 05 (heat dissipation type parts), for CPU heat consumption 28W high heat source; the method adopts the method of combining the passive heat dissipation of the aluminum profile and the heat dissipation fins and the auxiliary heat dissipation of the intelligent fan;
1.2, the intelligent fan is intelligently turned on and off according to the temperature condition of the CPU crystal, when the temperature of the CPU crystal reaches 70 ℃, the intelligent fan starts to rotate, the temperature of the CPU crystal rises, the rotating speed of the intelligent fan is increased, and when the temperature of the CPU crystal rises to 80 ℃, the intelligent fan reaches the highest rotating speed; when the temperature of the CPU crystal is lower than 60 ℃, the intelligent fan stops rotating;
1.3, when the environment temperature is low, the aluminum profile can fully release the heat released by the CPU crystal into the air, and an intelligent fan does not need to rotate to intervene in cooling; in winter, the service life of the intelligent fan can be shortened, and the service life of the intelligent fan is prolonged; in summer, the intelligent fan can effectively help the aluminum profile to dissipate heat;
2. and (3) heat transfer process:
2. 1 as shown in figure 05 (heat dissipation mode part), the heat on the surface of the CPU crystal is fully absorbed by the red copper heat conduction block;
2.2, transferring the heat on the red copper heat conducting block to 3 radiators of aluminum profiles, high-aluminum radiating fins and low-aluminum radiating fins with larger contact areas through a heat pipe;
2.3, the heat on the surface of the aluminum profile naturally convects with the air and is diffused into the air to be taken away;
2.4, taking away heat diffused from the surfaces of the high-aluminum radiating fins and the low-aluminum radiating fins in an accelerated manner by the intelligent fan;
2.5, cold air is passively fed into the air inlet holes, hot air is actively blown out of the air outlet holes, the heat on the radiating fins is naturally diffused into the air through the radiating holes, the high-aluminum radiating fins, the low-aluminum radiating fins and the intelligent fan are sealed into a wind pressure space through the interface board, and the heat is circulated out through the fan.
2. Cableless link solution:
1. as shown in the figure 04 (K30 USB part), the female 70X 2pin header and 2 rows of connectors on the multifunctional I/O carrier board and the male 70X 2pin header and 2 rows of connectors on the X86 core motherboard are clamped to the bottom;
2. as shown in fig. 04 (K30 USB part), the memory is inserted into the memory slot with the buckle for fixing;
3. as shown in figure 04 (K30 USB part), an M2 hard disk is inserted into an M2 slot and then locked into an M2 stud by an M2 screw to be fixed;
4. as shown in fig. 04 (K30 USB part) 5G, the module is inserted into the M2 slot and then fixed by being screwed into the M2 stud by the M2 screw.
3. The installation mode of the whole machine is as follows:
1. after the main parts are installed, the cable-free solution is assembled into an assembly C, as shown in the diagram 06 (the complete machine assembly diagram);
2. the I/O expansion board and the lower cover are fixed through screws to assemble a component D;
3. the 4G antenna and the right side cover are fixed through screws to form a component B;
4. the intelligent fan and the interface board are fixed through screws to be assembled into a component A;
5. fixing the component C on the high-cost heat dissipation section bar; then fixing the component B on the high-cost heat dissipation section bar, and connecting the wire of the 4G antenna; then fixing the component A on a high-cost heat dissipation section bar, and connecting the section bar of the intelligent fan; and finally, fixing the assembly D on the high-cost heat dissipation profile.
4. Various products of different configurations can be matched:
1. the multifunctional I/O carrier board and the I/O expansion board are combined into a diagram 01 (K30 USB complete machine) and a diagram 02 (K30 USB complete machine);
2. the diagram 07 (various X86 core main boards) has 2 forms and 8 specifications; 16 products can be matched with the I/O expansion board.
The invention adopts the fan-free and auxiliary air cooling design, and the fan-free design is adopted in the mainboard, thereby effectively solving the heat dissipation problem of the high-speed operation of the CPU and avoiding the fault caused by dust entering the interior.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (10)
1. An edge computing industrial personal computer, characterized by comprising: the heat pipe comprises a shell (1), heat dissipation fins (2), a heat pipe (3), an aluminum profile fixing frame (4), a red copper heat conduction block (5) and a core main board (6);
the red copper heat-conducting block (5) is connected and arranged on the heat pipe (3), the heat pipe (3) is connected and arranged on the aluminum profile fixing frame (4), and the heat-radiating fins (2) are arranged on the aluminum profile fixing frame (4);
the red copper heat-conducting block (5) is in contact with a CPU crystal (601) on the core main board (6), the heat of the CPU crystal (601) is transferred to the red copper heat-conducting block (5), the heat of the red copper heat-conducting block (5) is transferred to the heat pipe (3), and the heat of the heat pipe (3) is transferred to the aluminum profile fixing frame (4) and the heat-radiating fins (2);
the aluminum profile fixing frame is characterized in that the shell (1) is installed on the aluminum profile fixing frame (4), heat dissipation holes (101) are formed in the shell (1), and the heat dissipation holes (101) are arranged corresponding to the heat dissipation fins (2).
2. The edge computing industrial personal computer as claimed in claim 1, wherein the heat dissipation fins (2) comprise integrally formed tall aluminum heat dissipation fins (201) and short aluminum heat dissipation fins (202), and the tall aluminum heat dissipation fins (201) and the short aluminum heat dissipation fins (202) are arranged in a step shape.
3. The edge computing industrial personal computer according to claim 1, wherein an air inlet hole (102) and an air outlet hole (103) are formed in the housing (1);
the air inlet hole (102) and the air outlet hole (103) form air circulation, the air inlet hole (102) is used for entering cold air, and the air outlet hole (103) is used for discharging hot air.
4. The edge computing industrial personal computer according to claim 1, further comprising a smart fan (7), wherein the smart fan (7) is electrically connected with a CPU temperature sensor on the core mainboard (6);
the CPU temperature sensor is used for measuring the temperature of a CPU crystal (601), and the rotating speed and the air volume of the intelligent fan (7) are adjusted according to the measurement data fed back by the CPU temperature sensor.
5. The edge computing industrial personal computer of claim 4, wherein an interface board (8) is arranged on the housing (1), and the smart fan (7) is arranged on the interface board (8);
interface board (8) shell (1) and form the wind pressure space between cooling fin (2), smart fan (7) are located in the wind pressure space, louvre (101) with the wind pressure space intercommunication sets up.
6. The edge computing industrial personal computer of claim 4, wherein the smart fan (7) is turned on or off according to the temperature of the CPU crystal (601) measured by the CPU temperature sensor:
when the temperature of the CPU crystal (601) reaches 70 ℃, the intelligent fan (7) is started;
when the temperature of the CPU crystal (601) is lower than 60 ℃, the intelligent fan (7) is turned off.
7. The edge computing industrial personal computer of claim 6, wherein when the smart fan (7) is turned on, the rotation speed of the smart fan (7) becomes faster as the temperature of the CPU crystal (601) increases;
when the temperature of the CPU crystal (601) rises to 80 ℃, the intelligent fan (7) reaches the highest rotating speed.
8. The edge computing industrial personal computer according to claim 1, wherein the red copper heat conduction block (5) and the heat pipe (3) are welded on the aluminum profile fixing frame (4).
9. The edge computing industrial personal computer according to claim 1, further comprising a multifunctional I/O carrier board (9), wherein a 70 x 2PIN female head (10) is arranged on the multifunctional I/O carrier board (9), a 70 x 2PIN male head (11) is arranged on the core mainboard (6), and the 70 x 2PIN female head (10) and the 70 x 2PIN male head (11) are connected with each other in a card-to-card manner;
the multifunctional I/O carrier plate (9) is provided with an M2 hard disk (12), a 5G module (13) and two M2 slots (14), and the M2 hard disk (12) and the 5G module (13) are respectively inserted into the different M2 slots (14) and locked into an M2 stud (15) by an M2 screw for fixing;
the core mainboard (6) is provided with a memory bank (20) and a memory slot (21) with a buckle, and the memory bank (20) is inserted into the memory slot (21).
10. The edge computing industrial personal computer of claim 1, further comprising an I/O expansion board (16), a 4G antenna (17), a lower cover (18), and a right side cover (19);
the lower cover (18) and the right side cover (19) are both arranged on the aluminum profile fixing frame (4); the I/O expansion board (16) is fixed on the lower cover (18) through screws, and the 4G antenna (17) is fixed on the right side cover (19) through screws;
and a connecting hole is formed in the right side cover (19), and the connecting hole is used for arranging an expansion interface on the I/O expansion board (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211564696.1A CN115793800A (en) | 2022-12-07 | 2022-12-07 | Edge computing industrial personal computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211564696.1A CN115793800A (en) | 2022-12-07 | 2022-12-07 | Edge computing industrial personal computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115793800A true CN115793800A (en) | 2023-03-14 |
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ID=85417648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211564696.1A Pending CN115793800A (en) | 2022-12-07 | 2022-12-07 | Edge computing industrial personal computer |
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| Country | Link |
|---|---|
| CN (1) | CN115793800A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119045623A (en) * | 2024-10-30 | 2024-11-29 | 苏州海特自动化设备有限公司 | High-heat-dissipation modularized embedded industrial control machine |
-
2022
- 2022-12-07 CN CN202211564696.1A patent/CN115793800A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119045623A (en) * | 2024-10-30 | 2024-11-29 | 苏州海特自动化设备有限公司 | High-heat-dissipation modularized embedded industrial control machine |
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