CN210630125U - Electronic equipment - Google Patents
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- CN210630125U CN210630125U CN201921233920.2U CN201921233920U CN210630125U CN 210630125 U CN210630125 U CN 210630125U CN 201921233920 U CN201921233920 U CN 201921233920U CN 210630125 U CN210630125 U CN 210630125U
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Abstract
The embodiment of the utility model discloses electronic equipment, wherein, electronic equipment includes: the device comprises a heat dissipation structure and a first device structure, wherein the first device structure is positioned on a first side of the heat dissipation structure; the first device structure comprises a first main board, a first type of heating device and a second type of heating device; the first type of heating device arranged on the first main board is positioned on one surface close to the heat dissipation structure, and the heat dissipation structure is used for diffusing heat generated by the first type of heating device; the second-type heating device arranged on the first main board is positioned on one surface far away from the heat dissipation structure.
Description
Technical Field
The utility model relates to an electronic product technical field especially relates to an electronic equipment.
Background
With the rapid development of electronic technology, more and more components are integrated into electronic equipment, so that the heat dissipation of the electronic equipment becomes an important parameter affecting the performance. In the related art, a heat sink is usually disposed on a motherboard to dissipate heat of components soldered on the motherboard by using the heat sink, so as to avoid the performance of the electronic device from being affected by an excessively high temperature of the electronic device. However, the heat sink in the prior art needs a complex welding structure, for example, when the heat sink is a water-cooling heat dissipation structure, the refrigerant liquid pipeline in the water-cooling heat dissipation structure needs to surround and be welded around various devices on the motherboard, the welding structure is complex, and the cost is high.
Disclosure of Invention
In order to solve the above technical problem, embodiments of the present invention are directed to an electronic device.
The technical scheme of the utility model is realized like this:
there is provided an electronic device including: the device comprises a heat dissipation structure and a first device structure, wherein the first device structure is positioned on a first side of the heat dissipation structure; wherein the content of the first and second substances,
the first device structure comprises a first main board, a first type of heating device and a second type of heating device;
the first type of heating device arranged on the first main board is positioned on one surface close to the heat dissipation structure, and the heat dissipation structure is used for diffusing heat generated by the first type of heating device;
the second-type heating device arranged on the first main board is positioned on one surface far away from the heat dissipation structure.
Optionally, the first heat generating device includes a plurality of first heat generating devices, and at least one of the first heat generating devices is attached to the heat dissipation structure.
Optionally, the heat dissipation structure is a structure that dissipates heat through a refrigerant liquid.
Optionally, the heat dissipation structure includes a cavity, the cavity is tightly attached to one surface of at least one first heat generating device of the first type of heat generating devices, and the cavity is provided with a refrigerating liquid inlet and a refrigerating liquid outlet.
Optionally, the electronic device further comprises:
a housing; the heat dissipation structure and the first device structure are arranged inside the shell; the shell is provided with a first air outlet;
and the first fan is arranged at the position corresponding to the first air outlet and used for diffusing the heat generated by the second type of heating device.
Optionally, the electronic device further comprises: a second device structure; the second device structure is located on a second side of the heat dissipation structure; wherein the content of the first and second substances,
the second device structure comprises a second main board, a first type of heating device and a second type of heating device;
the first heating device arranged on the second main board is positioned on one surface close to the heat dissipation structure;
the second type heating device arranged on the second main board is positioned on one surface far away from the heat dissipation structure.
Optionally, a preset interval is provided between every two first heat-generating devices in the plurality of first heat-generating devices
Optionally, the electronic device further comprises: the first heat conduction layer is arranged between the first heating device and the heat dissipation structure and used for conducting heat generated by the first heating device to the heat dissipation structure.
The embodiment of the utility model provides an electronic equipment, include: the device comprises a heat dissipation structure and a first device structure, wherein the first device structure is positioned on a first side of the heat dissipation structure; the first device structure comprises a first main board, a first type of heating device and a second type of heating device; the first type of heating device arranged on the first main board is positioned on one surface close to the heat dissipation structure, and the heat dissipation structure is used for diffusing heat generated by the first type of heating device; the second-type heating device arranged on the first main board is positioned on one surface far away from the heat dissipation structure. Like this, separate the device that generates heat of different grade type, set up respectively on the two sides of mainboard to the device that will dispel the heat sets up in being close to heat radiation structure one side, has improved the radiating efficiency, has reduced welded complexity simultaneously, thereby has reduced the welding cost.
Drawings
Fig. 1 is a schematic structural diagram 1 of an electronic device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram 2 of an electronic device according to an embodiment of the present invention;
fig. 3(a) is a schematic structural composition diagram 3 of an electronic device according to an embodiment of the present invention;
fig. 3(b) is a schematic structural diagram 4 of an electronic device according to an embodiment of the present invention.
Detailed Description
In order to solve the technical problems existing in the prior art, the following embodiments and the accompanying drawings are combined to describe the technical solution of the present invention in more detail and clearly. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
The utility model provides an electronic equipment, figure 1 is the utility model discloses the embodiment electronic equipment's schematic structure diagram. As shown in fig. 1, the electronic device 10 includes:
a heat dissipating structure 11 and a first device structure 12, the first device structure being located on a first side of the heat dissipating structure; wherein the content of the first and second substances,
the first device structure 12 includes a first main board 121, a first type heat generating device 122 and a second type heat generating device 123;
the first type of heating device arranged on the first main board is positioned on one surface close to the heat dissipation structure, and the heat dissipation structure is used for diffusing heat generated by the first type of heating device;
the second-type heating device arranged on the first main board is positioned on one surface far away from the heat dissipation structure.
Here, the electronic device may be a notebook computer, an industrial computer, a server, or the like. The heat dissipation structure may be a structure that diffuses heat by contacting with a heat generating device, such as a water-cooled heat sink, a heat conductive metal sheet, or the like.
In practical applications, the electronic device has multiple heating devices therein, and each heating device has different power consumption, i.e., different heat dissipation amount per unit time. Therefore, different heat generating devices in the electronic apparatus can be divided according to the amount of heat dissipated per unit time.
In this embodiment, the heat generating devices in the electronic device are classified into two types according to the amount of heat dissipated per unit time: a first type heat generating device and a second type heat generating device; for example, the first type of heat generating device is a device with a higher heat generation amount, and the second type of heat generating device is a device with a lower heat generation amount; alternatively, the first type of heat generating device is a device having a lower heat generation amount, and the second type of heat generating device is a device having a higher heat generation amount.
In this embodiment, the first type of heating device and the second type of heating device with different heating values can be separated and respectively disposed on two sides of the first main board.
Specifically, a first type of heat generating device arranged on the first main board is located on one surface close to the heat dissipation structure, and the heat dissipation structure is used for diffusing heat generated by the first type of heat generating device; the second-type heating device arranged on the first main board is positioned on one surface far away from the heat dissipation structure.
Specifically, the first device structure comprises a first main board, a first type of heat generating device arranged on a first surface of the first main board, and a second type of heat generating device arranged on a second surface of the first main board. Here, the first main Board may be a Printed Circuit Board (PCB) main Board. The first surface and the second surface are two opposite surfaces on the first main board. The first surface of the first main board is a surface facing the heat dissipation structure, and the second surface of the first main board is a surface facing away from the heat dissipation structure. Therefore, the first heating device arranged on the first surface of the first mainboard can be close to the heat dissipation structure, and heat diffusion is carried out through the heat dissipation structure; the second type heating device arranged on the second surface of the first main board is far away from the heat dissipation structure.
It should be noted that the first type of heat generating device disposed on the first motherboard may include one or more first heat generating devices, and the second type of heat generating device disposed on the first motherboard may include one or more second heat generating devices.
The embodiment of the utility model provides an electronic equipment, include: the device comprises a heat dissipation structure and a first device structure, wherein the first device structure is positioned on a first side of the heat dissipation structure; the first device structure comprises a first main board, a first type of heating device and a second type of heating device; the heating value of the first type of heating device in unit time is larger than that of the second type of heating device; the first type of heating device arranged on the first main board is positioned on one surface close to the heat dissipation structure, and the heat dissipation structure is used for diffusing heat generated by the first type of heating device; the second-type heating device arranged on the first main board is positioned on one surface far away from the heat dissipation structure. Like this, separate the device that generates heat of different grade type, set up respectively on the two sides of mainboard to the device that will dispel the heat sets up in being close to heat radiation structure one side has improved the radiating efficiency, has reduced welded complexity simultaneously, thereby has reduced welding cost.
Based on the foregoing embodiment, the embodiment of the present invention provides an electronic device, the electronic device 20 includes: a heat dissipation structure 21 and a first device structure 22, the first device structure 22 being located on a first side of the heat dissipation structure 21; wherein the content of the first and second substances,
the first device structure 22 includes a first main board 221, a first type heat generating device 222 and a second type heat generating device 223;
the first type of heating device arranged on the first main board is positioned on one surface close to the heat dissipation structure, and the heat dissipation structure is used for diffusing heat generated by the first type of heating device;
the second-type heating device arranged on the first main board is positioned on one surface far away from the heat dissipation structure.
In the present embodiment, the electronic apparatus includes two types of heat generating devices, a first type of heat generating device and a second type of heat generating device.
Preferably, the first type heat generating device generates a larger amount of heat per unit time than the second type heat generating device. The first type of heating device may be a device with power consumption greater than or equal to 10W, such as a CPU, a GPU, a memory, and the like; and the second type of heating device can be a device with power consumption less than 10W, such as an intelligent network card, an FPGA chip and the like.
In this embodiment, the first type of heat generating device with high power consumption is close to the heat dissipation structure, and the heat generated by the first type of heat generating device is diffused through the heat dissipation structure. The second type of heating device with lower power consumption is far away from the heat dissipation structure, and can perform natural heat dissipation or other low-efficiency auxiliary heat dissipation modes (such as an air convection heat dissipation mode), so that heat dissipation through the heat dissipation structure is not needed.
In addition, the electronic device structure provided by the embodiment of the present invention is shown in fig. 2, the first heat generating device 222 may include a plurality of first heat generating devices, for example, the first heat generating devices may include devices with larger power consumption, such as a CPU, a GPU, and a memory.
Preferably, the plurality of first heat generating devices are similar in size in a first predetermined direction, and the first predetermined direction is a direction from the heat dissipation structure to the first main board. It can be understood that the thicknesses of the plurality of first heat generating devices in the first type of heat generating device between the heat dissipation structure and the first main board are the same or similar.
Further, at least one first heat generating device in the first heat generating devices is attached to the heat dissipation structure. Here, the heat dissipation structure and at least one of the first heat generating devices of the first kind are closely attached together by pressure. Preferably, the heat dissipation structure and at least one of the first heat generating devices are screwed together by screws.
In some embodiments, a predetermined interval is provided between every two of the plurality of first heat emitting devices. Here, in order to improve the heat dissipation efficiency of the first type heat generating device, a plurality of first heat generating devices among the first type heat generating devices may be disposed at intervals.
In some embodiments, the heat dissipation structure is a structure that dissipates heat through a refrigerant liquid. Specifically, the heat dissipation structure dissipates heat of a device close to the heat dissipation structure through flowing refrigerating liquid. Here, the heat dissipation structure that dissipates heat via the refrigerant liquid has high heat dissipation efficiency, and can be used to dissipate heat from components that generate a large amount of heat.
Preferably, as shown in fig. 2, the heat dissipating structure 21 comprises a cavity 211, a refrigerant liquid inlet 212 and a refrigerant liquid outlet 213; the cavity 211 is tightly attached to one surface of at least one first heating device in the first type of heating devices; the cavity is filled with refrigerating liquid, and the refrigerating liquid can be water.
In some embodiments, the electronic device further comprises a cooling component (not shown) in which a cooling fluid is pumped by a fluid pump into the heat sink cavity via a cooling fluid inlet 212 and returned to the cooling component via a cooling fluid outlet 213. The liquid pump can drive the refrigerating liquid to circulate in the cavity of the heat dissipation structure.
Further, the refrigerating liquid forms a plurality of heat exchange channels in the cavity, and the heat exchange channels are arranged in an S shape. In addition, the cavity can be a metal box body with better heat-conducting property, so that the heat can be quickly dissipated; the metal box body can be made of copper.
In some embodiments, as shown in fig. 2, the electronic device may further include: a housing 23; the heat dissipation structure and the first device structure are arranged inside the shell; a first air outlet 24 is arranged on the shell;
and the first fan 25 is arranged at the position corresponding to the first air outlet and used for diffusing the heat generated by the second type of heating device.
Here, the second type heat generating device disposed on the first main board may be located at a position adjacent to the first air outlet, and a first fan, which may be a low speed fan, is further disposed inside the housing at a position opposite to the first air outlet; in addition, a first air inlet is also arranged on the other side of the shell opposite to the first air outlet. Therefore, the second-type heating device arranged on the first main board is cooled in an air convection mode.
In some embodiments, the second type of heat generating device may include a plurality of second heat generating devices, and the plurality of second heat generating devices may be disposed at intervals on a side of the first main board away from the heat dissipation structure.
In some embodiments, the electronic device further comprises: the first heat conduction layer is arranged between the first heating device and the heat dissipation structure and used for conducting heat generated by the first heating device to the heat dissipation structure.
Here, a first heat conducting layer (not shown in the figure) is further disposed between the heat dissipation structure and the first heat generating device to accelerate the heat dissipation of the first heat generating device. Preferably, the first heat conducting layer is a silicone layer.
Therefore, the embodiment of the utility model provides an electronic equipment can separate the device that generates heat that calorific capacity is different through the mainboard, and the higher first type of device direct contact that generates heat that will give out calorific capacity has the heat radiation structure of refrigeration liquid to dispel the heat, and to the lower second type of device that generates heat that gives out calorific capacity, sets up on the mainboard with the first type of device opposite direction that generates heat, utilizes the fan to dispel the heat. The heat dissipation efficiency of the heat dissipation structure with the refrigerating liquid is higher than that of the fan, and heat generated by a device with higher heat productivity can be quickly diffused.
It should be noted that, for the descriptions of the same steps and the same contents in this embodiment as those in other embodiments, reference may be made to the descriptions in other embodiments, which are not described herein again.
The embodiment of the utility model provides an electronic equipment, include: the device comprises a heat dissipation structure and a first device structure, wherein the first device structure is positioned on a first side of the heat dissipation structure; the first device structure comprises a first main board, a first type of heating device and a second type of heating device; the heating value of the first type of heating device in unit time is larger than that of the second type of heating device; the first type of heating device arranged on the first main board is positioned on one surface close to the heat dissipation structure, and the heat dissipation structure is used for diffusing heat generated by the first type of heating device; the second-type heating device arranged on the first main board is positioned on one surface far away from the heat dissipation structure. Therefore, the device with high heat productivity and the device with low heat productivity are separated and respectively arranged on two sides of the mainboard, and the heat dissipation structure is arranged on one side close to the first type of heat production device with high heat productivity, so that the heat dissipation efficiency is improved, and meanwhile, the welding complexity is reduced, and the welding cost is reduced.
Based on the foregoing embodiments, an embodiment of the present invention provides an electronic device, as shown in fig. 3(a), where the electronic device 30 includes: a heat dissipation structure 31, a first device structure 32, and a second device structure 33, the first device structure 32 being located on a first side of the heat dissipation structure, the second device structure 33 being located on a second side of the heat dissipation structure; wherein the content of the first and second substances,
the first device structure 32 includes a first main board 321, a first type heat generating device 322, and a second type heat generating device 323;
the first type of heating device arranged on the first main board is positioned on one surface close to the heat dissipation structure, and the heat dissipation structure is used for diffusing heat generated by the first type of heating device;
the second-type heating device arranged on the first main board is positioned on one surface far away from the heat dissipation structure.
Further, the second device structure 33 includes a second main board 331, a first type heat generating device 332 and a second type heat generating device 333;
the first heating device arranged on the second main board is positioned on one surface close to the heat dissipation structure;
the second type heating device arranged on the second main board is positioned on one surface far away from the heat dissipation structure.
Here, the first device structure is disposed on a first side of the heat dissipation structure, and the second device structure is disposed on a second side of the heat dissipation structure. The first side and the second side of the heat dissipation structure may be the same side of the heat dissipation structure or different sides.
In this embodiment, the second device structure is similar to the first device structure, and has a second main board, and a first type heat generating device and a second type heat generating device separately provided on both surfaces of the second main board. Similarly, the first type of heat generating device arranged on the second main board is close to the heat dissipation structure, and the second type of heat generating device arranged on the second main board is far away from the heat dissipation structure.
In one embodiment, the first type of heat generating device generates a larger amount of heat per unit time than the second type of heat generating device, i.e., the first type of heat generating device is a device with larger power consumption, and the second type of heat generating device is a device with smaller power consumption. Here, the first type of heat generating device on the first motherboard and the second type of heat generating device on the second motherboard are both disposed on a side close to the heat dissipating structure, and the second type of heat generating device on the first motherboard and the second type of heat generating device on the second motherboard are both disposed on a side away from the heat dissipating structure. Therefore, the first device structure and the second device structure can share the heat dissipation structure, heat dissipation of devices with high power consumption in the electronic equipment is accelerated, and heat dissipation efficiency of the electronic equipment is improved.
In addition, in the electronic apparatus in some embodiments, as shown in fig. 3(b), the first type heat generating device includes a plurality of first heat generating devices; it is understood that the first heat generating device 322 disposed on the first main board and the first heat generating device 332 disposed on the second main board have a plurality of first heat generating devices. And at least one first heating device in the first type of heating devices arranged on the first main board clings to the first side surface of the heat dissipation structure, and at least one first heating device in the first type of heating devices arranged on the second main board clings to the second side surface of the heat dissipation structure.
Further, as shown in fig. 3(b), a preset interval is provided between every two first heat-generating devices in the plurality of first heat-generating devices; the same applies to the plurality of first heat generating devices disposed on the second main board.
In some embodiments, as shown in fig. 3(b), the electronic device may further include: a housing 33; the heat dissipation structure and the first device structure are arranged inside the shell; a first air outlet 34 is arranged on the shell;
and the first fan 35 is arranged at a position corresponding to the first air outlet and used for diffusing heat generated by the second type of heating device.
In some embodiments, a second air outlet 36 is also provided on the housing. The second type of heating device arranged on the second main board is positioned at a position close to the second air outlet, and a second fan 37 is also arranged at a position in the shell opposite to the second air outlet and can be a low-speed fan; in addition, a second air inlet is also arranged on the other side of the shell opposite to the second air outlet. Therefore, the second type heating device arranged on the second main board is cooled in an air convection mode.
Similarly, a first heat conduction layer is arranged at the position, in contact with the heat dissipation structure, of the first heat generation device arranged on the second main board, so that the heat dissipation of the first heat generation device is accelerated. Preferably, the first heat conducting layer is a silicone layer.
It should be noted that the electronic device may further include a third device structure, a fourth device structure and other device structures similar to the first device structure and the second device structure, and similarly, the third device structure and the fourth device structure include a main board, and a first type heat generating device and a second type heat generating device respectively disposed on two opposite surfaces of the main board; the first type of heating device in the third device structure, the fourth device structure and the like is close to the heat dissipation structure and dissipates heat through the heat dissipation structure, and the second type of heating device in the third device structure, the fourth device structure and the like is far away from the heat dissipation structure.
It should be noted that, for the descriptions of the same steps and the same contents in this embodiment as those in other embodiments, reference may be made to the descriptions in other embodiments, which are not described herein again.
The embodiment of the utility model provides an electronic equipment separates the device that will give out heat high with the device that gives out heat low, sets up two surfaces at the mainboard respectively to set up heat radiation structure in being close to the first type that gives out heat high device one side that generates heat, the high first type that generates heat of giving out heat in a plurality of device structures device sharing simultaneously heat radiation structure has improved the radiating efficiency, has reduced welded complexity simultaneously, thereby has reduced the welding cost.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
1. An electronic device, the electronic device comprising: the device comprises a heat dissipation structure and a first device structure, wherein the first device structure is positioned on a first side of the heat dissipation structure; wherein the content of the first and second substances,
the first device structure comprises a first main board, a first type of heating device and a second type of heating device;
the first type of heating device arranged on the first main board is positioned on one surface close to the heat dissipation structure, and the heat dissipation structure is used for diffusing heat generated by the first type of heating device;
the second-type heating device arranged on the first main board is positioned on one surface far away from the heat dissipation structure.
2. The electronic device of claim 1, wherein: the first type of heat generating device comprises a plurality of first heat generating devices, and at least one first heat generating device in the first type of heat generating devices is attached to the heat dissipation structure.
3. The electronic device of claim 1, wherein:
the heat dissipation structure is a structure for dissipating heat through refrigerating liquid.
4. The electronic device of claim 3, wherein:
the heat dissipation structure comprises a cavity, the cavity is tightly attached to one surface of at least one first heating device in the first type of heating devices, and the cavity is provided with a refrigerating liquid inlet and a refrigerating liquid outlet.
5. The electronic device of any of claims 1-4, further comprising:
a housing; the heat dissipation structure and the first device structure are arranged inside the shell; the shell is provided with a first air outlet;
and the first fan is arranged at the position corresponding to the first air outlet and used for diffusing the heat generated by the second type of heating device.
6. The electronic device of claim 1, wherein: the electronic device further includes: a second device structure; the second device structure is located on a second side of the heat dissipation structure; wherein the content of the first and second substances,
the second device structure comprises a second main board, a first type of heating device and a second type of heating device;
the first heating device arranged on the second main board is positioned on one surface close to the heat dissipation structure;
the second type heating device arranged on the second main board is positioned on one surface far away from the heat dissipation structure.
7. The electronic device of claim 2, wherein a predetermined interval is provided between every two of the plurality of first heat-generating devices.
8. The electronic device of claim 1, further comprising: the first heat conduction layer is arranged between the first heating device and the heat dissipation structure and used for conducting heat generated by the first heating device to the heat dissipation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921233920.2U CN210630125U (en) | 2019-07-31 | 2019-07-31 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921233920.2U CN210630125U (en) | 2019-07-31 | 2019-07-31 | Electronic equipment |
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| Publication Number | Publication Date |
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| CN210630125U true CN210630125U (en) | 2020-05-26 |
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| CN201921233920.2U Active CN210630125U (en) | 2019-07-31 | 2019-07-31 | Electronic equipment |
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| CN (1) | CN210630125U (en) |
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2019
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