CN115792288A - Circuit board high-low temperature electrifying testing device - Google Patents
Circuit board high-low temperature electrifying testing device Download PDFInfo
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- CN115792288A CN115792288A CN202211334778.7A CN202211334778A CN115792288A CN 115792288 A CN115792288 A CN 115792288A CN 202211334778 A CN202211334778 A CN 202211334778A CN 115792288 A CN115792288 A CN 115792288A
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- circuit board
- low temperature
- slide rail
- placing
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- 238000012360 testing method Methods 0.000 title claims abstract description 65
- 238000004891 communication Methods 0.000 claims abstract description 16
- 238000007664 blowing Methods 0.000 claims description 11
- 230000035939 shock Effects 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims 2
- 238000007599 discharging Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 230000002349 favourable effect Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000013522 software testing Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The invention relates to the technical field of circuit board testing, in particular to a high-low temperature power-on testing device for a circuit board, which comprises a box body and a frame body, wherein the frame body is connected with placing plates in a sliding mode through a sliding rail, a placing area, a communication connector and a power connector are arranged above the front end of each placing plate, a positioning column is arranged in the placing area, a positioning block and a pressing device are arranged at the edge of the placing area, a wire harness is arranged at the rear end of each placing plate, one end of the wire harness is connected with the communication connector and the power connector, and the other end of the wire harness is connected with a wiring socket at the rear end of the frame body. The testing device is applied to high and low temperature performance testing under the power-on state of the circuit board, and not only can guarantee the stability of the circuit board during testing by arranging the frame body structure and the board placing structure in the box body, so that the accuracy of a measuring result is guaranteed, but also the wiring harness inside the box body can be clean and tidy, the circuit board connected by corresponding wiring harnesses is clear and clear, and the circuit board with faults can be conveniently and quickly identified and detected.
Description
Technical Field
The invention relates to the technical field of circuit board testing, in particular to a high-low temperature electrifying testing device for a circuit board.
Background
The circuit board is a support body of the electronic component, is a carrier for electrical connection of the electronic component, and needs to be tested before delivery, wherein the high and low temperature tests are used for simulating the running condition of the circuit board at a certain temperature to detect the adaptability and characteristics of the product. The high-low temperature test is to heat or cool the product through a high-low temperature box with a heating or refrigerating function, so that the product performance is tested after the product reaches a certain temperature. One of the high and low temperature test modes is to heat or cool the product, then take the product out of the high and low temperature box and place the product on the detection equipment for detection, and the other is to electrify the product in the high and low temperature test box, connect the product with the controller, and then set the high and low temperature values of the temperature box and the respective keeping time and temperature changing time and periodicity, so as to realize the test of the product performance. The circuit board of the automatic gearbox controller needs to be tested in the latter mode before leaving factory, for the test mode, a plurality of connectors are usually connected into a test box at present, during testing, products are connected into the connectors, then the products are placed in a high-low temperature test box for measurement, however, the existing high-low temperature test box has many defects when in use, firstly, the number of products which can be measured by the test box each time is small, and because the high-low temperature test of each batch of products needs 3-4 hours, the existing test box is not beneficial to improving the working efficiency; secondly, because the product is directly placed in the test box, slight shaking or uneven placement of the product can affect the stability of the test, thereby affecting the test effect; third, current test box is in the test process, and the product is put in disorder, when testing, if discovery product detection has a problem, is difficult to the product of accurately finding out the problem fast, and the circuit board be heated or receive cold also inhomogeneous moreover, influence efficiency of software testing and accuracy of software testing. Therefore, it is important to design a testing device capable of testing the high and low temperature performance of the circuit board in the power-on state.
Disclosure of Invention
The invention aims to provide a high-low temperature power-on test device for a circuit board, aiming at the defects of the prior art, which can simultaneously measure a plurality of circuit boards, improves the test efficiency of the circuit boards, and is beneficial to ensuring the uniform heating of the circuit boards and the stability of the circuit boards in the measurement process, thereby ensuring the test accuracy.
The technical scheme adopted by the invention for solving the technical problems is as follows: the utility model provides a high low temperature circular telegram testing arrangement of circuit board, the power distribution box comprises a box body, the inside support body that is provided with of box, the support body has a plurality of through slide rail sliding connection place the board, every place the board front end top of placing the board be provided with the blowing district that is used for placing the circuit board and mobilizable communication joint, power connection, the blowing district is provided with the reference column, blowing district edge is provided with locating piece and closing device, and the reference column passes the hole of circuit board, and the locating piece is injectd four angles of circuit board, and closing device can compress tightly the lateral part of circuit board, realizes the fixed of circuit board, and this closing device can be for manual clamp, it is provided with the pencil to place the board rear end, and the pencil includes a plurality of high temperature resistant electric wires, pencil one end with the communication joint with power connection, the other end with the wiring socket of support body rear end is connected, the below in blowing district is provided with the thimble, the top of thimble passes place the board can with the circuit board contact in blowing district, the thimble with the wiring socket is connected.
Specifically, the placing plate is provided with a plurality of through holes, the placing area is provided with the through holes, and preferably, the placing area is provided with at least two through holes.
Specifically, the support body below is provided with the base of frame type, the base with bottom half fixed connection, the base with be provided with the shock pad between the support body.
Specifically, the slide rail include with the support body is fixed decide the slide rail, move slide rail and connecting plate, place the board through the connecting plate with move slide rail fixed connection, move the slide rail with decide slide rail sliding connection, the connecting plate rear end is provided with the blotter.
Specifically, along the length direction of the slide rail, the length of the connecting plate is greater than that of the placing plate.
Specifically, place the board rear end and be provided with and be used for fixing the pencil splint, pencil splint one end with place the board and connect, the other end with the support body is connected, pencil splint easily buckle, pencil splint with place the board perpendicular.
Specifically, place the board be a plurality of rows of arranging in the support body, the box top is provided with the fan, the fan is located every row place the board directly over.
Specifically, still include stop device, stop device include first stopper and with first stopper complex second stopper, first stopper is located decide the slide rail front end, the second stopper is located place the top of board rear end.
Specifically, a cover body is arranged above the front end of the placing plate, and a second through hole is formed in the side part of the cover body.
Specifically, the testing device is applied to high and low temperature performance testing of a circuit board in a power-on state.
The invention has the beneficial effects that: this application testing arrangement is applied to high low temperature capability test under the circuit board circular telegram state, through set up the support body structure in the box and place the board structure, not only can guarantee the steady when the circuit board is tested, guarantees measuring result's accuracy, can make box internal connection pencil clean and tidy moreover, and each pencil corresponds the circuit board of connecting clearly and definitely, the circuit board of convenient quick discernment, detection trouble.
Drawings
FIG. 1 is a schematic diagram of the present invention.
Fig. 2 is a schematic view of the frame structure of the present invention.
Fig. 3 is a top view of the inventive frame.
Fig. 4 is an enlarged view of a partial structure a in fig. 1.
Fig. 5 is an enlarged view of a partial structure B in fig. 3.
Fig. 6 is a side view of the inventive frame.
Description of reference numerals:
1-box body, 2-frame body, 21-wiring socket, 3-slide rail, 31-fixed slide rail, 32-movable slide rail, 33-connecting plate, 4-placing plate, 41-through hole, 5-placing area, 6-positioning column, 7-positioning block, 8-pressing device, 9-wire harness, 10-thimble, 11-base, 12-wire harness clamping plate, 13-fan, 14-limiting device, 141-first limiting block, 142-second limiting block, 15-circuit board, 16-buffer pad.
Detailed Description
The present invention will be described in further detail with reference to the following drawings and specific examples, which are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may be present, and when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present, as the terms "vertical", "horizontal", "left", "right" and the like are used herein for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, and the use of such term knowledge in the specification of the invention is for the purpose of describing particular embodiments and is not intended to be limiting, and the use of the term "and/or" herein includes any and all combinations of one or more of the associated listed items
As shown in fig. 1 to 6, the high and low temperature energization testing apparatus for circuit boards of this embodiment includes a box body 1, a frame body 2 and a placing plate 4, the box body 1 is provided with a box door, the frame body 2 is arranged inside the box body 1, the frame body 2 is connected with a plurality of the placing plate 4 through a sliding rail 3, the side portion, the top portion and the bottom portion of the frame body 2 are all provided with first through holes, or the frame is composed of a plurality of cross bars and vertical bars, which is beneficial for the circulation of air in the frame, so that the circuit board 15 placed in the frame is uniformly heated or cooled, the top portion and the front side of the frame body 2 are open, the placing plate 4 is horizontally arranged, the placing plate 4 is provided with a plurality of through holes 41, which is beneficial for the air flow up and down of the placing plate 4, a placing area 5 for placing the circuit board 15 and a movable communication joint and a power joint (not shown in the figure) are arranged above the front end of each placing plate 4, the through holes 41 are arranged in the material placing area 5, the positioning columns 6 are arranged in the material placing area 5, the positioning blocks 7 and the pressing devices 8 are arranged at the edges of the material placing area 5, the four corners of the circuit board 15 are limited by the positioning blocks 7, the positioning columns 6 penetrate through the holes of the circuit board 15, the pressing devices 8 can press the side portions of the circuit board 15 to realize the pressing and fixing of the circuit board 15, the pressing devices 8 can be manual pressing clamps, the rear end of each placing plate 4 is provided with a wiring harness 9, the wiring harness 9 comprises a plurality of high-temperature-resistant electric wires, one end of the wiring harness 9 is connected with the communication connector and the power connector, the other end of the wiring harness is connected with a wiring socket at the rear end of the frame body 2, namely, the rear end of each placing plate 4 is provided with a wiring socket 21, the ejector pins 10 are arranged below the material placing plates, the tops of the ejector pins 10 penetrate through the placing plates 4 and can be contacted with the circuit board 15 in the material placing area 5, the thimble 10 is electrically connected to the connection jack 21. The testing device is characterized by further comprising a plurality of strands of electric wires, wherein one ends of the electric wires are connected with the wiring sockets 21, the other ends of the electric wires are connected with a power supply, a host and a controller outside the box body 1, and communication between the communication connector and the testing system and communication between the power supply connector and the testing system are achieved. The back of a circuit board 15 of the automatic gearbox controller is provided with an aluminum reinforcing sheet, the circuit board 15 is placed in the material placing area 5, the ejector pin 10 is in contact with the aluminum reinforcing sheet, the grounding effect can be achieved, and meanwhile the ejector pin 10 can also be used for detecting whether a product is placed above the material placing area 5.
This application testing arrangement is applied to high low temperature capability test under the 15 circular telegram states of circuit board, during the test, will place board 4 and take out from support body 2, place circuit board 15 in blowing district 5, through reference column 6, locating piece 7 and closing device 8 realize compressing tightly fixedly to circuit board 15, with communication joint and power connection insert wiring socket 21 and power wiring socket 21 on circuit board 15 respectively, will place board 4 and pass through slide rail 3 and return to the normal position, can realize circuit board 15 fixed and with the power, the controller be connected. In the test, each circuit board 15 needs to be connected with a communication connector and a power connector, a wiring harness 9 connected with each communication connector comprises 40-50 high-temperature-resistant electric wires, each power connector also needs to be connected with a plurality of high-temperature-resistant electric wires, and the communication connector and the power connector are not fixedly connected with the placing plate 4, so that the circuit boards 15 can be conveniently plugged, and the wiring harnesses 9 are connected into the wiring sockets 21, so that the wiring harnesses are connected into the test system. Through setting up 2 structures of support body and placing 4 structures of board in box 1 in this application, not only can guarantee the steady when circuit board 15 tests, guarantee measuring result's accuracy, can make 1 internal connection pencil 9 of box clean and tidy moreover, each pencil 9 corresponds circuit board 15 of connecting clearly and definitely, convenient quick discernment, circuit board 15 of detection trouble.
2 belows of support body are provided with the base 11 of frame type, base 11 with 1 bottom fixed connection of box, base 11 with be provided with the shock pad between the support body 2. Because the compressor operation of test equipment, produce vibrations, vibrations can influence the stability of product test, can slow down vibrations to the influence of product test through setting up base 11 and shock pad in 2 bottoms of support body, base 11 is the frame type simultaneously, and base 11 has a plurality of horizontal poles and montant to constitute promptly, is favorable to the circulation of air in base 11 and the support body 2 to can make circuit board 15 thermally equivalent or receive cold when the test.
Along 3 length direction of slide rail, the length of connecting plate 33 is greater than place the length of board 4, move slide rail 32 promptly and slide to deciding in the slide rail 31 back, the rear end of connecting plate 33 is contradicted with support body 2 after, place and remain certain clearance between the rear end of board 4 and the support body 2, can be favorable to the upper and lower flow of air for the product thermally equivalent or receive cold.
Preferably, the material placing region 5 is provided with at least two through holes 41, so that the exposed area of the bottom of the circuit board 15 can be increased, and the connecting parts between the through holes 41 and the through holes 41 can support the circuit board 15, thereby preventing the circuit board 15 from bending, reducing the quality of the circuit board 15 and influencing the accuracy of the measurement result.
Place 4 rear ends of board and be provided with and be used for fixing the pencil splint 12 of pencil 9, pencil splint 12 one end pass through the mounting panel with place board 4 and connect, the other end with support body 2 is connected, pencil 9 splint are easily buckled, pencil splint 12 with place board 4 perpendicularly. Fix pencil 9 through 9 splint of pencil to keep pencil 9 clean and tidy, be convenient for extend along with the removal of placing board 4 or buckle the shrink, pencil splint 12 sets up with placing board 4 is perpendicular simultaneously, can prevent that pencil 9 from flagging, produces to wiring socket 21 and pulls, influences the stability that wiring socket 21 connects.
Place board 4 and be a plurality of rows of arranging in the support body 2, be favorable to dwindling the volume of support body 2, 1 top of box is provided with fan 13, fan 13 is located every row place board 4 directly over. The rear side wall of the box body 1 is provided with an air circulation inlet and an air circulation outlet, the air circulation inlet is positioned at the upper part of the side wall, and the air circulation outlet is positioned at the lower part of the side wall, so that the air circulation in the box body 1 is facilitated, the circuit board 15 is uniformly heated or accepted, and the temperature difference between the circuit board 15 at the upper layer and the circuit board 15 at the bottom layer is only 3-5 ℃.
The positioning device 14 further comprises a limiting device 14, the limiting device 14 comprises a first limiting block 141 and a second limiting block 142 matched with the first limiting block 141, the first limiting block 141 is located at the front end of the fixed sliding rail 31, the second limiting block 142 is located above the rear end of the placing plate 4, the movable sliding rail 32 can be prevented from being drawn out of the fixed sliding rail 31 and derailed, meanwhile, the second limiting block 142 is matched with the first limiting block 141, and the placing plate 4 can be prevented from being drawn out and fixed. As shown in fig. 3 and 5, the first limiting block 141 is provided with a connecting rod, a ball is connected to a free end of the connecting rod in a rolling manner, and a groove capable of being matched with the ball is formed in a side portion of the second limiting block 142 close to the first limiting block 141, so that the placing plate 4 can be fixed conveniently and prevented from sliding.
A cover body is arranged above the front end of the placing plate 4, a second through hole is formed in the side portion of the cover body, the cover body can cover the circuit board 15, and frost accumulation on the circuit board 15 can be prevented.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. The utility model provides a high low temperature circular telegram testing arrangement of circuit board which characterized in that: including box (1), box (1) inside is provided with support body (2), support body (2) have a plurality of through slide rail (3) sliding connection and place board (4), every place board (4) front end top be provided with be used for placing blowing district (5) and mobilizable communication joint, the power connection of circuit board, blowing district (5) are provided with reference column (6), blowing district (5) edge is provided with locating piece (7) and closing device (8), it is provided with pencil (9) to place board (4) rear end, pencil (9) one end with the communication connect with power connection connects, the other end with wiring socket (21) of support body (2) rear end are connected, the below of blowing district (5) is provided with thimble (10), thimble (10) top is passed place board (4) can with the circuit board contact in blowing district (5), thimble (10) with wiring socket (21) are connected.
2. The high and low temperature electrifying test device for the circuit board according to claim 1, wherein: the placing plate (4) is provided with a plurality of through holes (41), and the discharging area (5) is provided with the through holes (41).
3. The high and low temperature electrifying test device for the circuit board according to claim 1, wherein: the shock absorption frame is characterized in that a frame-shaped base (11) is arranged below the frame body (2), the base (11) is fixedly connected with the bottom of the box body (1), and a shock absorption pad is arranged between the base (11) and the frame body (2).
4. The high and low temperature electrifying test device for the circuit board according to claim 1, wherein: slide rail (3) include with support body (2) fixed decide slide rail (31), move slide rail (32) and connecting plate (33), place board (4) and pass through connecting plate (33) with move slide rail (32) fixed connection, move slide rail (32) with decide slide rail (31) sliding connection, connecting plate (33) rear end is provided with blotter (16).
5. The high and low temperature electrifying test device for the circuit board according to claim 4, wherein: along slide rail (3) length direction, the length of connecting plate (33) is greater than place the length of board (4).
6. The high and low temperature electrifying test device for the circuit board according to claim 1, wherein: the rear end of the placing plate (4) is provided with a wire harness clamping plate (12) used for fixing a wire harness (9), one end of the wire harness clamping plate (12) is connected with the placing plate (4), the other end of the wire harness clamping plate is connected with the frame body (2), the wire harness clamping plate (12) is easy to bend, and the wire harness clamping plate (12) is perpendicular to the placing plate (4).
7. The high and low temperature electrifying test device for the circuit board according to claim 1, wherein: the placing plates (4) are arranged in the frame body (2) in a plurality of rows, a fan (13) is arranged at the top of the box body (1), and the fan (13) is positioned right above the placing plates (4) in each row.
8. The high and low temperature electrifying test device for the circuit board according to claim 1, wherein: the positioning device is characterized by further comprising a limiting device (14), wherein the limiting device (14) comprises a first limiting block (141) and a second limiting block (142) matched with the first limiting block (141), the first limiting block (141) is located at the front end of the positioning slide rail (3), and the second limiting block (142) is located above the rear end of the placing plate (4).
9. The high and low temperature electrifying test device for the circuit board according to claim 1, wherein: a cover body (15) is arranged above the front end of the placing plate (4), and a second through hole is formed in the side portion of the cover body (15).
10. The high and low temperature electrifying test device for the circuit board according to claim 1, wherein: the testing device is applied to high and low temperature performance testing of the circuit board in the power-on state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211334778.7A CN115792288A (en) | 2022-10-28 | 2022-10-28 | Circuit board high-low temperature electrifying testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211334778.7A CN115792288A (en) | 2022-10-28 | 2022-10-28 | Circuit board high-low temperature electrifying testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115792288A true CN115792288A (en) | 2023-03-14 |
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ID=85434257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211334778.7A Pending CN115792288A (en) | 2022-10-28 | 2022-10-28 | Circuit board high-low temperature electrifying testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115792288A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4636726A (en) * | 1982-01-04 | 1987-01-13 | Artronics Corporation | Electronic burn-in system |
| US5268637A (en) * | 1991-12-16 | 1993-12-07 | Venturedyne, Ltd. | Carrier for testing circuit boards |
| US20080272792A1 (en) * | 2006-02-08 | 2008-11-06 | Atg Luther & Maelzer Gmbh | Method and Device for Testing of Non-Componented Circuit Boards |
| CN209486208U (en) * | 2018-12-29 | 2019-10-11 | 苏州工业园区宜爱微测试科技有限公司 | A kind of PCB circuit board high/low temperature ageing tester |
| CN210294468U (en) * | 2019-06-25 | 2020-04-10 | 苏州茹声电子有限公司 | Printed circuit board aging testing cabinet |
| US20210211095A1 (en) * | 2017-11-01 | 2021-07-08 | Miasole Equipment Integration (Fujian) Co., Ltd. | Reliability Test Device for Flexible Photovoltaic Module |
| CN215180665U (en) * | 2021-02-08 | 2021-12-14 | 杭州东松电源电器有限公司 | Circuit board aging testing device |
| CN217198022U (en) * | 2022-02-28 | 2022-08-16 | 重庆长秦汽车配件有限公司 | Bending guide pipe for front cabin engine wire harness |
-
2022
- 2022-10-28 CN CN202211334778.7A patent/CN115792288A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4636726A (en) * | 1982-01-04 | 1987-01-13 | Artronics Corporation | Electronic burn-in system |
| US5268637A (en) * | 1991-12-16 | 1993-12-07 | Venturedyne, Ltd. | Carrier for testing circuit boards |
| US20080272792A1 (en) * | 2006-02-08 | 2008-11-06 | Atg Luther & Maelzer Gmbh | Method and Device for Testing of Non-Componented Circuit Boards |
| US20210211095A1 (en) * | 2017-11-01 | 2021-07-08 | Miasole Equipment Integration (Fujian) Co., Ltd. | Reliability Test Device for Flexible Photovoltaic Module |
| CN209486208U (en) * | 2018-12-29 | 2019-10-11 | 苏州工业园区宜爱微测试科技有限公司 | A kind of PCB circuit board high/low temperature ageing tester |
| CN210294468U (en) * | 2019-06-25 | 2020-04-10 | 苏州茹声电子有限公司 | Printed circuit board aging testing cabinet |
| CN215180665U (en) * | 2021-02-08 | 2021-12-14 | 杭州东松电源电器有限公司 | Circuit board aging testing device |
| CN217198022U (en) * | 2022-02-28 | 2022-08-16 | 重庆长秦汽车配件有限公司 | Bending guide pipe for front cabin engine wire harness |
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Country or region after: China Address after: 441000 No.85 Airport Road, high tech Zone, Xiangyang City, Hubei Province Applicant after: Xiangyang Donghe Electronic Technology Co.,Ltd. Address before: 441000 No.85 Airport Road, high tech Zone, Xiangyang City, Hubei Province Applicant before: XIANGYANG DONGHE ELECTRONIC TECHNOLOGY Co.,Ltd. Country or region before: China |
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