CN115781894A - Preparation method of low-temperature co-fired ceramic - Google Patents
Preparation method of low-temperature co-fired ceramic Download PDFInfo
- Publication number
- CN115781894A CN115781894A CN202111666869.6A CN202111666869A CN115781894A CN 115781894 A CN115781894 A CN 115781894A CN 202111666869 A CN202111666869 A CN 202111666869A CN 115781894 A CN115781894 A CN 115781894A
- Authority
- CN
- China
- Prior art keywords
- green
- temperature
- ball milling
- sintering
- discharging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 41
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 238000007599 discharging Methods 0.000 claims abstract description 35
- 239000003292 glue Substances 0.000 claims abstract description 34
- 238000000227 grinding Methods 0.000 claims abstract description 29
- 238000005245 sintering Methods 0.000 claims abstract description 25
- 238000000498 ball milling Methods 0.000 claims abstract description 21
- 238000005520 cutting process Methods 0.000 claims abstract description 13
- 238000003475 lamination Methods 0.000 claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 10
- 238000007650 screen-printing Methods 0.000 claims abstract description 9
- 238000004080 punching Methods 0.000 claims abstract description 7
- 239000011230 binding agent Substances 0.000 claims abstract description 4
- 238000011049 filling Methods 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000000354 decomposition reaction Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 14
- 229910052573 porcelain Inorganic materials 0.000 claims description 11
- 238000007639 printing Methods 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 4
- 240000007594 Oryza sativa Species 0.000 claims description 3
- 235000007164 Oryza sativa Nutrition 0.000 claims description 3
- 244000046052 Phaseolus vulgaris Species 0.000 claims description 3
- 235000010627 Phaseolus vulgaris Nutrition 0.000 claims description 3
- 240000006394 Sorghum bicolor Species 0.000 claims description 3
- 235000011684 Sorghum saccharatum Nutrition 0.000 claims description 3
- 244000062793 Sorghum vulgare Species 0.000 claims description 3
- 238000010304 firing Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 235000019713 millet Nutrition 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 235000009566 rice Nutrition 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- 239000005416 organic matter Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 235000013339 cereals Nutrition 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 244000068988 Glycine max Species 0.000 description 1
- 235000010469 Glycine max Nutrition 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/60—Production of ceramic materials or ceramic elements, e.g. substitution of clay or shale by alternative raw materials, e.g. ashes
Landscapes
- Ceramic Capacitors (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The invention provides a preparation method of low-temperature co-fired ceramic, which shortens chamfering time and improves the preparation efficiency of the low-temperature co-fired ceramic. Which comprises the following steps: piece, punching, screen printing, lamination, cutting, binder removal, its characterized in that: taking out the green body device from the glue discharging furnace before complete glue discharging, placing the green body device into a ball milling tank containing grinding media, wherein the volume of the green body device accounts for 25% -35% of the volume of the ball milling tank, and the added grinding media are as follows: and removing seeds with water, wherein the filling amount of the grinding medium is 35-55% of the volume of the ball milling tank, then starting the ball milling machine to chamfer the green ware, placing the green ware into the glue removing furnace again after chamfering till complete glue removing, placing the green ware into the sintering furnace for sintering after complete glue removing, and burning out the grinding medium powder stained on the ware after grinding through complete glue removing and sintering decomposition.
Description
Technical Field
The invention relates to the technical field of low-temperature co-fired ceramic preparation, in particular to a preparation method of low-temperature co-fired ceramic.
Background
In the manufacturing process of the low-temperature co-fired ceramic element and the functional device, in order to meet the installation requirement, chamfering treatment needs to be carried out on corners of the low-temperature co-fired ceramic element and the functional device, so that the corners of the low-temperature co-fired ceramic element are smooth and avoid corner collapse, and if chamfering treatment is not carried out, the end silver cannot completely coat the end when the external electrode is prepared, so that a ceramic body is partially exposed, electroplating solution permeates during electroplating, and the use reliability of the low-temperature co-fired ceramic device is influenced. Meanwhile, in order to ensure that the outer electrode can be fully contacted with the inner electrode after the outer electrode is prepared, and good electrical performance is generated, the inner electrode needs to be fully exposed.
In the preparation process of the existing low-temperature co-fired ceramic, a ball milling tank is used for chamfering after sintering is finished, for example, zirconia, silicon carbide and other very hard materials are used as grinding materials, and edges and corners of a low-temperature co-fired ceramic device are ground through collision between the low-temperature co-fired ceramic device and a grinding medium, so that the device with a round edge and no sharp corner is obtained. However, the chamfering of the fired product by the above process often takes a long time, generally 8 to 24 hours. And ultrasonic cleaning and drying are needed after chamfering to remove the grinding medium and the ground powder which are stained on the surface, the whole chamfering process is longer, and the efficiency is lower.
Disclosure of Invention
Aiming at the problems of longer chamfering process and lower efficiency of low-temperature co-fired ceramics by adopting grinding materials such as zirconia, silicon carbide and the like, the invention provides a preparation method of the low-temperature co-fired ceramics, which shortens the chamfering time and improves the preparation efficiency of the low-temperature co-fired ceramics.
The technical scheme is as follows:
a preparation method of low-temperature co-fired ceramic comprises the following steps: piece, punching, screen printing, lamination, cutting, binder removal, its characterized in that: the method comprises the following steps of taking out a green body device from a glue discharging furnace before complete glue discharging of the green body device, putting the green body device into a ball milling tank containing a grinding medium, wherein the volume of the green body device accounts for 25% -35% of the volume of the ball milling tank, and the added grinding medium is as follows: and removing seeds with water, wherein the filling amount of the grinding medium is 35-55% of the volume of the ball milling tank, then starting the ball milling machine to chamfer the green ware, placing the green ware into the glue removing furnace again after chamfering till complete glue removing, placing the green ware into the sintering furnace for sintering after complete glue removing, and burning out the grinding medium powder stained on the ware after grinding through complete glue removing and sintering decomposition.
It is further characterized in that:
the rubber discharging step comprises a rubber pre-discharging step and a complete rubber discharging step, wherein the rubber pre-discharging step comprises the following steps: placing the green body device into a glue discharging furnace, wherein the temperature peak value of pre-glue discharging is 1/3 to 1/2 of the normal glue discharging temperature peak value, the time of pre-glue discharging is 15 to 60 minutes, and then taking out the green body device to chamfer; the temperature peak value of the complete rubber discharge is the normal rubber discharge temperature peak value.
The step of falling the slice is: cutting a coil material belt formed by mixing ceramic/glass powder and organic matters into square green ceramic chips according to the processing requirement;
the punching step comprises: opening a functional hole cavity on the prepared green ceramic chip as required;
the screen printing step comprises: printing metal slurry on the surface of the green ceramic chip in a screen printing mode to form a designed circuit and fill the connecting through holes;
the lamination step is as follows: aligning and printing each layer of green porcelain with different design patterns by using a lamination tool or an automatic lamination machine, and forming a three-dimensional structure among layers;
the laminating step is as follows: stacking and heating the laminated green porcelain and applying pressure to bond the green porcelain into a whole;
the cutting step is as follows: cutting the green ceramic body into independent devices by using a cutting machine;
the rubber discharging step comprises: heating the green device to remove organic matter from the green device;
the sintering step is as follows: and putting the device into a sintering furnace to be sintered into porcelain.
It also includes a post-firing step after the sintering step: and printing conductor paste on the plane or the side surface of the device, and metalizing the conductor on the surface of the device by using the sintering furnace again.
The water-removed seeds are one or more of millet, sorghum, chaff, rice and beans.
The rotating speed of the ball milling tank ranges from 30rpm to 80rpm, and the chamfering time ranges from 0.5h to 2h.
After the method is adopted, the binder part in the green body device subjected to pre-degumming is carbonized and decomposed, the toughness of the green body device is basically lost, the hardness is greatly increased and is similar to a sintering state, but the structure is relatively loose, the hardness is still obviously lower than that after the green body device is sintered, chamfering is carried out on the green body device at the moment, chamfering is easier, meanwhile, the grinding medium only needs hard grains with hardness far lower than that of zirconium oxide and silicon carbide, then complete degumming and sintering are carried out, residual grain powder can be easily decomposed and burned out at the temperature in the process, and therefore the residual grinding medium powder does not need to be cleaned and dried additionally, chamfering time can be shortened, and the LTCC preparation efficiency is improved.
Detailed Description
A preparation method of low-temperature co-fired ceramic comprises the following steps: sheet falling: and cutting a coil material belt formed by mixing ceramic/glass powder and organic matters into square green ceramic chips according to the processing requirement.
Punching: the green ceramic chip is cut, printed and aligned with the alignment holes, interlayer connecting holes and functional hole cavities with different purposes by means of mechanical punching pins or laser and the like.
Screen printing: and printing metal slurry such as silver paste, copper paste and the like on the surface of the green porcelain in a screen printing mode to form a designed circuit and fill the connecting through hole.
Laminating: and aligning and printing each layer of green porcelain with different design patterns by using a lamination tool or an automatic lamination machine, and forming a three-dimensional structure among layers.
Laminating: and heating the laminated green ceramic stack by using a hot press or a water isostatic pressing mode and applying pressure to bond the green ceramics into a whole.
Cutting: the green body is divided into individual devices using a cutter.
Pre-rubber discharging: and placing the green ware into a glue discharging furnace, wherein the temperature peak value of pre-glue discharging is 1/3 to 1/2 of the temperature peak value of normal glue discharging, and the time of pre-glue discharging is 15 to 60 minutes.
Chamfering: putting a grinding medium and a green body device which is not completely degummed into a ball milling tank of a ball mill, wherein the green body device which is not completely degummed is a green body device which is subjected to pre-degummed, the temperature peak value of the pre-degummed is 1/3 to 1/2 of the temperature peak value of normal degummed, the time of the pre-degummed is 15 to 60 minutes, the temperature peak value of the normal degummed is the highest value of the degummed temperature adopted for removing the adhesive in the green body at one time, taking the green body device which adopts the raw material of the adhesive as PVB (polyvinyl butyral resin) as an example, when the adhesive is pre-degummed, putting the device into an adhesive removing furnace, heating to 200 ℃, and keeping the temperature for 30 minutes. After the green ware is placed into a ball milling tank, the volume of the green ware accounts for 25% -35% of the volume of the ball milling tank, and the added grinding medium is as follows: the filling amount of grinding media of beans (dry hard grains) such as millet, sorghum, chaff, rice, soybeans and the like is 35-55% of the volume of a ball milling tank, then the ball milling tank is started to chamfer green ware, the rotating speed of the ball milling tank is 30rpm to 80rpm, the chamfering time is 0.5h to 2h, and the required ware can be obtained, and the chamfering time is far shorter than the traditional chamfering time by 8-24 h.
And (3) complete glue discharging: and placing the chamfered green body device into a glue discharging furnace again for glue discharging until organic matters in the green body device are discharged, and taking out the green body device.
And (3) sintering: the device is placed into a sintering furnace to be sintered into porcelain, and meanwhile, the grinding medium powder which is stained on the device after grinding can be decomposed and burnt out through the complete glue discharging step and the sintering step, so that the cleaning procedure after chamfering can be omitted.
Post-firing: and printing conductor paste on the plane or the side surface of the device, and metalizing the conductor on the surface of the device by using the sintering furnace again.
The semi-degumming device can be used for grinding chamfers conveniently, the chamfering time can be shortened to 0.5-2 hours from 8-24 hours, grains are used as grinding media, the semi-degumming device can be used for grinding the semi-degumming device, and meanwhile, the semi-degumming device is low in thermal decomposition temperature and can be decomposed and volatilized at the ceramic sintering temperature, so that cleaning and drying are not needed, and the processing time is shortened.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (6)
1. A preparation method of low-temperature co-fired ceramic comprises the following steps: piece, punching, screen printing, lamination, cutting, binder removal, its characterized in that: the method comprises the following steps of taking out a green body device from a glue discharging furnace before complete glue discharging of the green body device, putting the green body device into a ball milling tank containing a grinding medium, wherein the volume of the green body device accounts for 25% -35% of the volume of the ball milling tank, and the added grinding medium is as follows: removing the seeds with water, wherein the filling amount of the grinding medium is 35-55% of the volume of the ball milling tank, starting the ball milling machine to chamfer the green ware, placing the green ware into the glue discharging furnace again after chamfering is finished until glue is completely discharged, placing the green ware into the sintering furnace for sintering after the glue is completely discharged, and burning out the grinding medium powder which is stained on the green ware after grinding through complete glue discharging and sintering decomposition.
2. The method for preparing low-temperature co-fired ceramic according to claim 1, wherein the method comprises the following steps: the rubber discharging step comprises a rubber pre-discharging step and a complete rubber discharging step, wherein the rubber pre-discharging step comprises the following steps: placing the green body device into a glue discharging furnace, wherein the temperature peak value of pre-glue discharging is 1/3 to 1/2 of the normal glue discharging temperature peak value, the time of pre-glue discharging is 15 to 60 minutes, and then taking out the green body device for chamfering; the temperature peak value of the complete rubber discharge is the normal rubber discharge temperature peak value.
3. The method for preparing low-temperature co-fired ceramic according to claim 2, characterized in that: the step of falling the slice is: cutting a coil belt formed by mixing ceramic/glass powder and organic matters into square green ceramic chips according to the processing requirement;
the punching step is as follows: opening a functional hole cavity on the prepared green ceramic chip as required;
the screen printing step comprises: printing metal slurry on the surface of the green ceramic chip in a screen printing mode to form a designed circuit and fill the connecting through holes;
the lamination step is as follows: aligning each layer of the green porcelain printed with different design patterns by using a lamination tool or an automatic lamination machine, and forming a three-dimensional structure between each layer;
the laminating step is as follows: stacking and heating the laminated green porcelain and applying pressure to bond the green porcelain into a whole;
the cutting step is as follows: cutting the green ceramic blank into independent devices by using a cutting machine;
the rubber discharging step comprises: heating the green device to remove organic matter from the green device;
the sintering step is as follows: and placing the device into a sintering furnace to be sintered into porcelain.
4. The method for preparing low-temperature co-fired ceramic according to claim 3, characterized in that: it also includes a post-firing step after the sintering step: and printing conductor paste on the plane or the side surface of the device, and metalizing the conductor on the surface of the device by using the sintering furnace again.
5. The method for preparing a low-temperature co-fired ceramic according to any one of claims 1 to 4, wherein: the water-removed seeds are one or more of millet, sorghum, chaff, rice and beans.
6. The method for preparing low-temperature co-fired ceramic according to claim 5, wherein the method comprises the following steps: the rotation speed of the ball milling tank is 30rpm to 80rpm, and the chamfering time is 0.5h to 2h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111666869.6A CN115781894B (en) | 2021-12-31 | 2021-12-31 | Preparation method of low-temperature co-fired ceramic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111666869.6A CN115781894B (en) | 2021-12-31 | 2021-12-31 | Preparation method of low-temperature co-fired ceramic |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115781894A true CN115781894A (en) | 2023-03-14 |
| CN115781894B CN115781894B (en) | 2024-06-07 |
Family
ID=85417328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111666869.6A Active CN115781894B (en) | 2021-12-31 | 2021-12-31 | Preparation method of low-temperature co-fired ceramic |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115781894B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH579435A5 (en) * | 1974-03-25 | 1976-09-15 | Heraeus Gmbh W C | Roller ball blank grinding appts - grinding medium and balls rotated between hard, grooved plate and rubber covered plate |
| CN102173781A (en) * | 2011-02-24 | 2011-09-07 | 西北工业大学 | Preparation method of CaCu3Ti4O12 ceramic |
| CN102315018A (en) * | 2010-07-08 | 2012-01-11 | 福建火炬电子科技股份有限公司 | Method for chamfering chip type ceramic capacitor |
| CN102336571A (en) * | 2010-07-28 | 2012-02-01 | 深圳振华富电子有限公司 | Manufacture method for chip ceramic element |
| CN102355798A (en) * | 2011-10-25 | 2012-02-15 | 中国兵器工业集团第二一四研究所苏州研发中心 | Manufacturing method of cylindrical module circuit board and sintering bracket |
| CN103500737A (en) * | 2013-10-24 | 2014-01-08 | 中国兵器工业集团第二一四研究所苏州研发中心 | Overload-resistant integral LCC (Leadless Chip Carrier) package based on LTCC (Low Temperature Co-Fired Ceramic) substrate |
| CN113579861A (en) * | 2021-07-05 | 2021-11-02 | 广东风华高新科技股份有限公司 | Chamfering method of LTCC chip type ceramic filter |
-
2021
- 2021-12-31 CN CN202111666869.6A patent/CN115781894B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH579435A5 (en) * | 1974-03-25 | 1976-09-15 | Heraeus Gmbh W C | Roller ball blank grinding appts - grinding medium and balls rotated between hard, grooved plate and rubber covered plate |
| CN102315018A (en) * | 2010-07-08 | 2012-01-11 | 福建火炬电子科技股份有限公司 | Method for chamfering chip type ceramic capacitor |
| CN102336571A (en) * | 2010-07-28 | 2012-02-01 | 深圳振华富电子有限公司 | Manufacture method for chip ceramic element |
| CN102173781A (en) * | 2011-02-24 | 2011-09-07 | 西北工业大学 | Preparation method of CaCu3Ti4O12 ceramic |
| CN102355798A (en) * | 2011-10-25 | 2012-02-15 | 中国兵器工业集团第二一四研究所苏州研发中心 | Manufacturing method of cylindrical module circuit board and sintering bracket |
| CN103500737A (en) * | 2013-10-24 | 2014-01-08 | 中国兵器工业集团第二一四研究所苏州研发中心 | Overload-resistant integral LCC (Leadless Chip Carrier) package based on LTCC (Low Temperature Co-Fired Ceramic) substrate |
| CN113579861A (en) * | 2021-07-05 | 2021-11-02 | 广东风华高新科技股份有限公司 | Chamfering method of LTCC chip type ceramic filter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115781894B (en) | 2024-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3716783B2 (en) | Method for manufacturing ceramic multilayer substrate and semiconductor device | |
| KR100887488B1 (en) | Production method of multilayer ceramic electronic device | |
| JP2008071909A (en) | Method of manufacturing laminated ceramic electronic component | |
| CN101604636B (en) | Method for manufacturng multi-layer ceramic substrate and electronic device using the same | |
| CN115781894A (en) | Preparation method of low-temperature co-fired ceramic | |
| JPH08236393A (en) | Manufacture of laminated ceramic capacitor | |
| JP4962496B2 (en) | Manufacturing method of ceramic substrate | |
| JP4606115B2 (en) | Multilayer substrate and manufacturing method thereof | |
| JP3956148B2 (en) | Method for manufacturing ceramic multilayer substrate and semiconductor device | |
| CN102753502A (en) | Ceramic sintered body and method for producing same | |
| JP4110536B2 (en) | Multilayer ceramic aggregate substrate and method for producing multilayer ceramic aggregate substrate | |
| JP4120270B2 (en) | Manufacturing method of ceramic multilayer substrate | |
| JP4431895B2 (en) | Manufacturing method of laminated electronic component | |
| JP4449344B2 (en) | Oxide porcelain composition and ceramic multilayer substrate | |
| JP2004256346A (en) | Glass-ceramic composition, glass-ceramic sintered compact, its producing method, wiring board using the sintered compact body, and its mounting structure | |
| JP4978822B2 (en) | Multilayer ceramic substrate manufacturing method and multilayer ceramic substrate | |
| JP4645962B2 (en) | Multilayer ceramic substrate | |
| JP2006173240A (en) | Method for manufacturing ceramic substrate | |
| JP2021190636A (en) | Substrate for electric inspection | |
| JP4475076B2 (en) | Manufacturing method of multilayer ceramic substrate | |
| JP4552367B2 (en) | Low temperature fired ceramic substrate manufacturing method | |
| JP3905856B2 (en) | Green sheet for manufacturing laminated parts, method for producing the same, and method for producing laminated parts | |
| JPH0746540B2 (en) | Method for manufacturing glass-ceramic substrate | |
| JP3006208B2 (en) | Manufacturing method of chip type varistor | |
| JPH0964230A (en) | Manufacture of ceramic substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |