CN115781005A - High efficiency diamond laser cutting equipment - Google Patents
High efficiency diamond laser cutting equipment Download PDFInfo
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- CN115781005A CN115781005A CN202310085935.3A CN202310085935A CN115781005A CN 115781005 A CN115781005 A CN 115781005A CN 202310085935 A CN202310085935 A CN 202310085935A CN 115781005 A CN115781005 A CN 115781005A
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 27
- 239000010432 diamond Substances 0.000 title claims abstract description 27
- 238000003698 laser cutting Methods 0.000 title claims abstract description 9
- 238000005520 cutting process Methods 0.000 claims description 17
- 230000005540 biological transmission Effects 0.000 claims description 9
- 239000004579 marble Substances 0.000 claims description 9
- 238000007664 blowing Methods 0.000 claims description 7
- 238000005192 partition Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 7
- 238000003672 processing method Methods 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The invention discloses high-efficiency diamond laser cutting equipment which comprises a rack, an industrial personal computer, a control box, a two-dimensional workbench, a clamp, a Z-axis module, a reflector component, a beam combiner component, a galvanometer, a field lens, a CCD (charge coupled device) camera, a camera lens, a laser and an external light path. The invention can accelerate the processing speed and improve the working efficiency and the processing precision.
Description
Technical Field
The invention relates to the technical field of cutting equipment, in particular to high-efficiency diamond laser cutting equipment.
Background
Diamond is a natural mineral, is the raw stone of diamond, and is the hardest substance naturally occurring in nature. The crystal clear diamond jewelry is composed of a plurality of faces. In order to process diamond jewelry, the traditional processing method is to split, saw cut, roughly grind, cross cut and grind, multi-surface cut and grind and other procedures on a diamond blank. The traditional processing methods are all contact processing, the abrasion to a grinding wheel and a grinding wheel disc is large, the generated dust is large, and the dust is harmful to the bodies of processing personnel.
The laser processing is non-contact processing, and can well overcome the defects of the traditional processing method. The existing laser processing method comprises the following steps: laser beams emitted by the laser device reach the focusing mirror after being reflected by the reflecting mirror for multiple times, and the diamond is cut and processed after being focused by the focusing mirror. The processing method has the advantages of low processing speed and low processing efficiency, and is difficult to meet the actual production requirement.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide high-efficiency diamond laser cutting equipment which can accelerate the processing speed and improve the working efficiency and the processing precision.
The invention is realized by the following technical scheme: the utility model provides a high efficiency diamond laser cutting equipment, includes frame, industrial computer, control box, two-dimensional workstation, anchor clamps, Z axle module, reflector assembly, beam combiner subassembly, galvanometer, field lens, CCD camera, camera lens, laser instrument, outer light path, the frame divide into upper strata, middle level, lower floor, the industrial computer with the control box sets up the lower floor, the two-dimensional workstation sets up on the middle level, be provided with revolution mechanic on the two-dimensional workstation, anchor clamps set up revolution mechanic is last, revolution mechanic is used for the drive anchor clamps rotate along B axle direction and C axle direction, and the processing work piece is placed on the anchor clamps, beam combiner subassembly with the galvanometer sets up respectively on the Z axle module, just the galvanometer is located the left side of beam combiner subassembly, the reflector assembly sets up the right side of beam combiner subassembly, the camera lens sets up the front side of beam combiner subassembly, the CCD camera sets up the front side of camera lens, the field lens sets up the bottom side of galvanometer, the laser instrument with the light path sets up laser instrument goes up laser beam combiner subassembly, outer laser instrument loops through focus back laser instrument.
Further: the galvanometer comprises an X-axis lens, an X-axis motor, a Y-axis lens and a Y-axis motor, wherein an output shaft of the X-axis motor is connected with the X-axis lens, an output shaft of the Y-axis motor is connected with the Y-axis lens, the X-axis motor and the Y-axis motor are both high-speed motors, the rotating angle of the output shaft of the X-axis motor around the X1 axis is +/-15 degrees, and the rotating angle of the output shaft of the Y-axis motor around the Y1 axis is +/-15 degrees.
Further: the rotary structure comprises a bottom plate, a supporting plate, a swing table, a B-axis motor and a C-axis motor, wherein the supporting plate is arranged on the bottom plate, the bottom plate and the supporting plate form an L-shaped structure, the B-axis motor is arranged on the supporting plate, an output shaft of the B-axis motor is connected with the swing table, the C-axis motor is arranged on the swing table, the C-axis motor is connected with the clamp through a transmission structure, the B-axis motor drives the swing table to swing along the B-axis direction, and the C-axis motor drives the clamp to rotate along the C-axis direction through the transmission structure.
Further: the swing table comprises an object stage and a swing arm, the object stage is of a hollow structure, the swing arm and the object stage form an L-shaped structure, the transmission structure is arranged in the object stage, the C-axis motor and the clamp are arranged on the object stage, the swing arm is connected with the object stage, and the swing arm is connected with an output shaft of the B-axis motor.
Further, the method comprises the following steps: the swing angle of the swing table along the B-axis direction is +/-120 degrees, and the rotation angle of the clamp along the C-axis direction is 360 degrees.
Further, the method comprises the following steps: the Z-axis module is provided with a connecting plate, and the beam combining mirror assembly and the galvanometer are connected through the connecting plate and the Z-axis module.
Further, the method comprises the following steps: the middle layer is marble.
Further: the two-dimensional workbench comprises an X-axis module and a Y-axis module, the X-axis module is arranged on the middle layer, the Y-axis module is arranged on the X-axis module, and the bottom plate is arranged on the Y-axis module through a mounting seat.
Further, the method comprises the following steps: and the air blowing device is arranged on the connecting plate and is positioned at the rear side of the beam combining mirror assembly.
Further, the method comprises the following steps: and the bottom of the rack is provided with a travelling wheel.
Compared with the prior art, the invention has the following beneficial effects:
1. through setting up revolution mechanic at the two-dimensional workstation, anchor clamps set up on revolution mechanic, beam combiner subassembly and galvanometer set up respectively on Z axle module, and the galvanometer is located the left side of beam combiner subassembly, speculum subassembly sets up the right side at beam combiner subassembly, the camera lens sets up the front side at beam combiner subassembly, the CCD camera sets up the front side at the camera lens, the field lens sets up the bottom side at the galvanometer, the galvanometer includes X axle lens, X axle motor, Y axle lens, Y axle motor, the output shaft of X axle motor connects X axle lens, the output shaft of Y axle motor connects Y axle lens, X axle motor with Y axle motor is high-speed deflection direct current motor, can carry out the removal of laser beam according to the route that sets for fast, its moving speed can reach 6000mm/s, can improve processing speed, improve work efficiency.
2. The two-dimensional workbench comprises an X-axis module and a Y-axis module, the Y-axis module is arranged on the X-axis module, the rotating structure is arranged on the Y-axis module, a B-axis motor driving clamp of the rotating structure swings +/-120 degrees along the B-axis direction, a C-axis motor driving clamp swings 360 degrees along the C-axis direction, a reflector assembly, a beam combiner assembly, a galvanometer and a field lens are arranged on the Z-axis module, and the fact that the cutting equipment can be provided with a five-axis linkage control system and a controller is achieved, and diamond cutting processing of complex curved surface shapes is achieved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the rotary structure and the clamp connection of the present invention;
FIG. 3 is a schematic view of the structure of the mirror assembly, the beam combiner assembly, the galvanometer and the field lens according to the present invention;
FIG. 4 is a schematic view of the galvanometer principle of the present invention;
fig. 5 is a schematic diagram of the laser beam path of the present invention.
Description of reference numerals: 1-frame, 2-industrial personal computer, 3-control box, 4-two-dimensional workbench, 5-clamp, 6-Z axis module, 7-reflector module, 8-beam combiner module, 9-galvanometer, 10-field lens, 11-CCD camera, 12-camera lens, 13-laser, 14-outer optical path, 15-upper layer, 16-middle layer, 17-lower layer, 18-rotating structure, 19-X axis lens, 20-X axis motor, 21-Y axis lens, 22-Y axis motor, 23-bottom plate, 24-support plate, 25-swing table, 26-B axis motor, 27-C axis motor, 28-drive shaft, 29-objective table, 30-swing arm, 31-connecting plate, 32-X axis module, 33-Y axis module, 34-mounting seat, 35-air blowing device, 36-traveling wheel, 37-marble, 38-processing workpiece, 39-incident laser.
Detailed Description
Fig. 1 to 5 are schematic structural diagrams of an embodiment of a high-efficiency diamond laser cutting device provided by the invention, which include a rack 1, an industrial personal computer 2, a control box 3, a two-dimensional workbench 4, a fixture 5, a Z-axis module 6, a mirror assembly 7, a beam combiner assembly 8, a galvanometer 9, a field lens 10, a CCD camera 11, a camera lens 12, a laser 13, and an outer optical path 14, wherein the rack 1 is divided into an upper layer 15, a middle layer 16, and a lower layer 17, the industrial personal computer 2 and the control box 3 are arranged on the lower layer 17, the two-dimensional workbench 4 is arranged on the middle layer 16, the two-dimensional workbench 4 is provided with a rotating structure 18, the fixture 5 is arranged on the rotating structure 18, the rotating structure 18 is used for driving the fixture 5 to rotate along the B-axis direction and the C-axis direction, a processing workpiece 38 is placed on the fixture 5, the beam combiner assembly 8 and the galvanometer 9 are respectively arranged on the Z-axis module 6, the galvanometer 9 is positioned on the left side of the beam combiner assembly 8, the mirror assembly 7 is arranged on the right side of the beam combiner assembly 8, the camera lens assembly 12 is arranged on the front side of the beam combiner assembly 8, the laser beam combiner assembly 12, the laser path 13 and the laser 13 is arranged on the outer optical path 14, and the outer optical path 14, the laser 13 sequentially passes through the laser fixture 13.
The galvanometer 9 comprises an X-axis lens 19, an X-axis motor 20, a Y-axis lens 21, a Y-axis motor 22, an output shaft of the X-axis motor 20 is connected with the X-axis lens 19, an output shaft of the Y-axis motor 22 is connected with the Y-axis lens 21, the X-axis motor 20 and the Y-axis motor 22 are high-speed motors, the rotating angle of the output shaft of the X-axis motor 20 around the X1 axis is +/-15 degrees, and the rotating angle of the output shaft of the Y-axis motor 22 around the Y1 axis is +/-15 degrees.
Referring to 4,X, the shaft of the shaft motor 20 rotating around the X1 axis is the X1 axis shown in the figure, the shaft of the Y shaft motor 22 rotating around the Y1 axis is the Y1 axis shown in the figure, and the X shaft motor 20 and the Y shaft motor 22 are high-speed deflection direct current motors, so that the laser beam can be rapidly moved according to a set path, the moving speed can reach 6000mm/s, the processing speed can be increased, and the working efficiency can be improved.
The rotating structure 18 comprises a bottom plate 23, a supporting plate 24, a swing table 25, a B-axis motor 26, a C-axis motor 27 and a driving shaft 28, the supporting plate 24 is arranged on the bottom plate 23, the bottom plate 23 and the supporting plate 24 form an L-shaped structure, the B-axis motor 26 is arranged on the supporting plate 24, an output shaft of the B-axis motor 26 is connected with the swing table 25, the C-axis motor 27 and a clamp 5 are arranged on the swing table 25, the C-axis motor 27 is connected with the driving shaft 28 through a transmission structure, the clamp 5 is arranged on the driving shaft 28, the B-axis motor 26 drives the swing table 25 to swing along the B-axis direction, and the C-axis motor 27 drives the clamp 5 to rotate along the C-axis direction through the transmission structure.
The pendulum platform 25 comprises an object stage 29 and a swinging arm 30, wherein the object stage 29 is of a hollow structure, the swinging arm 30 and the object stage 29 form an L-shaped structure, a transmission structure is arranged inside the object stage 29, a C-axis motor 27 and a driving shaft 28 are arranged on the object stage 29, the swinging arm 30 is connected with the object stage 29, and the swinging arm 30 is connected with an output shaft of a B-axis motor 26.
The swing angle of the swing table 25 along the B-axis direction is +/-120 degrees, and the rotation angle of the clamp 5 along the C-axis direction is 360 degrees.
The Z-axis module 6 is provided with a connecting plate 31, and the beam combining mirror assembly 8 and the galvanometer 9 are connected with the Z-axis module 6 through the connecting plate 31.
The frame 1 is divided into an upper layer 15, a middle layer 16 and a lower layer 17 by a partition board, marble 37 with a gantry structure is arranged on the middle layer 16, and the two-dimensional workbench 4 is arranged on the marble 37.
The marble 37 with the gantry structure can play a role in damping and improve the cutting precision of the processed workpiece 38.
The two-dimensional worktable 4 comprises an X-axis module 32 and a Y-axis module 33, wherein the X-axis module 32 is arranged on a marble 37, the Y-axis module 33 is arranged on the X-axis module 32, and the bottom plate 23 is arranged on the Y-axis module 33 through a mounting seat 34.
The workpiece 38 is diamond and the mirror assembly 7 is a 45 ° total reflection mirror. During working, the processing workpiece 38 is clamped on the clamp 5, the operation software is opened, zero returning operation is executed, and all axes of the equipment return to the defined origin of the workpiece coordinate system. Selecting a well-defined diamond outline drawing, starting processing, enabling each motion axis to move correspondingly under the control of an industrial personal computer 2 and an electrical control cabinet, enabling a laser 13 to emit a laser beam under the control of a control box 3, enabling the laser beam to pass through an outer light path 14 to reach a reflecting mirror assembly 7, penetrate through a beam combining mirror assembly 8 after being reflected to reach a vibrating mirror 9, reach a field lens 10 after being reflected by the vibrating mirror 9, finally reach a processing part of a processing workpiece 38 after being focused by the field lens 10, and carrying out laser cutting processing on the processing part, wherein the path of the laser beam is as shown in figure 5.
According to the diamond cutting device, the rotating structure 18 is arranged on the Y-axis module 33, the Y-axis module 33 is arranged on the X-axis module 32, the B-axis motor 26 of the rotating structure 18 drives the clamp 5 to swing +/-120 degrees along the B-axis direction, the C-axis motor 27 drives the clamp 5 to swing 360 degrees along the C-axis direction, the reflector assembly 7, the beam combiner assembly 8, the vibrating mirror 9 and the field lens 10 are arranged on the Z-axis module 6, so that the cutting device can be configured with a five-axis linkage control system and a controller (aiming at the X-axis, the Y-axis, the Z-axis, the B-axis and the C-axis, wherein the X-axis refers to the left-right linear movement of the X-axis module, the Y-axis refers to the front-back linear movement of the Y-axis module, and the Z-axis refers to the up-down linear movement of the Z-axis module), and diamond cutting processing of complex curved surface shapes is realized.
An air blowing device 35 is arranged on the connecting plate 31, and the air blowing device 35 is positioned at the rear side of the beam combining mirror assembly 8.
When the air blowing device works, the air outlet of the air blowing device 35 is aligned to the processing position of the processing workpiece 38, and the processing workpiece 38 is cooled and the cutting dust is blown off.
The bottom of the frame 1 is provided with road wheels 36.
Through setting up walking wheel 36, be convenient for remove this cutting equipment.
The above detailed description is specific to possible embodiments of the present invention, and the embodiments are not intended to limit the scope of the present invention, and all equivalent implementations or modifications that do not depart from the scope of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. A high efficiency diamond laser cutting equipment which characterized in that: the laser beam combining device comprises a rack, an industrial personal computer, a control box, a two-dimensional workbench, a clamp, a Z-axis module, a reflector assembly, a beam combining mirror assembly, a vibrating mirror, a field lens, a CCD camera, a camera lens, a laser and an outer light path, wherein the rack is divided into an upper layer, a middle layer and a lower layer, the industrial personal computer and the control box are arranged on the lower layer, the two-dimensional workbench is arranged on the middle layer, a rotating structure is arranged on the two-dimensional workbench, the clamp is arranged on the rotating structure, the rotating structure is used for driving the clamp to rotate along the B-axis direction and the C-axis direction, a processing workpiece is placed on the clamp, the beam combining mirror assembly and the vibrating mirror are respectively arranged on the Z-axis module, the vibrating mirror is positioned on the left side of the beam combining mirror assembly, and the reflector assembly is arranged on the right side of the beam combining mirror assembly, the camera lens is arranged on the front side of the beam combining mirror assembly, the CCD camera is arranged on the front side of the camera lens, the field lens is arranged on the bottom side of the galvanometer, the laser and the outer light path are arranged on the upper layer, laser emitted by the laser sequentially passes through the outer light path, the reflector assembly, the beam combining mirror assembly and the galvanometer and then is focused on a processing workpiece on the clamp through the field lens, the rotating structure comprises a bottom plate, a supporting plate, a swing table, a B-axis motor, a C-axis motor and a driving shaft, the supporting plate is arranged on the bottom plate, the bottom plate and the supporting plate form an L-shaped structure, the B-axis motor is arranged on the supporting plate, an output shaft of the B-axis motor is connected with the swing table, the C-axis motor and the driving shaft are arranged on the swing table, and the C-axis motor is connected with the driving shaft through a transmission structure, the fixture is arranged on the driving shaft, the B-axis motor drives the swing table to swing along the B-axis direction, and the C-axis motor drives the fixture to rotate along the C-axis direction through the transmission structure.
2. A high efficiency laser diamond cutting apparatus as claimed in claim 1 wherein: the galvanometer comprises an X-axis lens, an X-axis motor, a Y-axis lens and a Y-axis motor, wherein an output shaft of the X-axis motor is connected with the X-axis lens, an output shaft of the Y-axis motor is connected with the Y-axis lens, the X-axis motor and the Y-axis motor are both high-speed motors, the rotating angle of the output shaft of the X-axis motor around the X1 axis is +/-15 degrees, and the rotating angle of the output shaft of the Y-axis motor around the Y1 axis is +/-15 degrees.
3. A high efficiency laser diamond cutting apparatus as claimed in claim 2 wherein: the swing table comprises an object stage and a swing arm, the object stage is of a hollow structure, the swing arm and the object stage form an L-shaped structure, the transmission structure is arranged in the object stage, the C-axis motor and the driving shaft are arranged on the object stage, the swing arm is connected with the object stage, and the swing arm is connected with an output shaft of the B-axis motor.
4. A high efficiency laser diamond cutting apparatus as claimed in claim 3 wherein: the swing angle of the swing table along the B-axis direction is +/-120 degrees, and the rotation angle of the clamp along the C-axis direction is 360 degrees.
5. A high efficiency laser diamond cutting apparatus as claimed in claim 4 wherein: the Z-axis module is provided with a connecting plate, and the beam combining mirror assembly and the galvanometer are connected through the connecting plate and the Z-axis module.
6. A high efficiency laser diamond cutting apparatus as claimed in claim 5 wherein: the frame is divided into an upper layer, a middle layer and a lower layer through partition plates, a marble in a gantry structure is arranged on the middle layer, and the two-dimensional workbench is arranged on the marble.
7. A high efficiency laser diamond cutting apparatus as claimed in claim 6 wherein: the two-dimensional workbench comprises an X-axis module and a Y-axis module, the X-axis module is arranged on the marble, the Y-axis module is arranged on the X-axis module, and the bottom plate is arranged on the Y-axis module through a mounting seat.
8. A high efficiency laser diamond cutting apparatus as claimed in claim 7 wherein: and the air blowing device is arranged on the connecting plate and is positioned at the rear side of the beam combining mirror assembly.
9. A high efficiency laser diamond cutting apparatus as claimed in claim 8 wherein: and the bottom of the rack is provided with a travelling wheel.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310085935.3A CN115781005A (en) | 2023-02-09 | 2023-02-09 | High efficiency diamond laser cutting equipment |
CN202322058172.1U CN220278566U (en) | 2023-02-09 | 2023-08-01 | High efficiency diamond laser cutting equipment |
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Application Number | Priority Date | Filing Date | Title |
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CN202310085935.3A CN115781005A (en) | 2023-02-09 | 2023-02-09 | High efficiency diamond laser cutting equipment |
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CN115781005A true CN115781005A (en) | 2023-03-14 |
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CN202310085935.3A Pending CN115781005A (en) | 2023-02-09 | 2023-02-09 | High efficiency diamond laser cutting equipment |
CN202322058172.1U Active CN220278566U (en) | 2023-02-09 | 2023-08-01 | High efficiency diamond laser cutting equipment |
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CN202322058172.1U Active CN220278566U (en) | 2023-02-09 | 2023-08-01 | High efficiency diamond laser cutting equipment |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107824958A (en) * | 2017-12-01 | 2018-03-23 | 暨南大学 | A kind of 355nm Ultra-Violet Lasers diamond cut equipment |
CN210817953U (en) * | 2019-09-25 | 2020-06-23 | 南京农业大学 | Five-axis laser micromachining device based on scanning galvanometer |
WO2021130571A1 (en) * | 2019-12-27 | 2021-07-01 | Bhogilal Patel Bharatkumar | Diamond cutting and marking device |
CN214054072U (en) * | 2020-12-09 | 2021-08-27 | 厦门柔性电子研究院有限公司 | Laser coding mechanism |
CN114211135A (en) * | 2021-12-28 | 2022-03-22 | 浙江明牌珠宝科技有限公司 | Line drawing device of diamond laser cutting machine and diamond laser cutting machine |
-
2023
- 2023-02-09 CN CN202310085935.3A patent/CN115781005A/en active Pending
- 2023-08-01 CN CN202322058172.1U patent/CN220278566U/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107824958A (en) * | 2017-12-01 | 2018-03-23 | 暨南大学 | A kind of 355nm Ultra-Violet Lasers diamond cut equipment |
CN210817953U (en) * | 2019-09-25 | 2020-06-23 | 南京农业大学 | Five-axis laser micromachining device based on scanning galvanometer |
WO2021130571A1 (en) * | 2019-12-27 | 2021-07-01 | Bhogilal Patel Bharatkumar | Diamond cutting and marking device |
CN214054072U (en) * | 2020-12-09 | 2021-08-27 | 厦门柔性电子研究院有限公司 | Laser coding mechanism |
CN114211135A (en) * | 2021-12-28 | 2022-03-22 | 浙江明牌珠宝科技有限公司 | Line drawing device of diamond laser cutting machine and diamond laser cutting machine |
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