WO2021130571A1

WO2021130571A1 - Diamond cutting and marking device

Info

Publication number: WO2021130571A1
Application number: PCT/IB2020/061120
Authority: WO
Inventors: Bharatkumar BHOGILAL PATEL
Original assignee: Bhogilal Patel Bharatkumar
Priority date: 2019-12-27
Filing date: 2020-11-25
Publication date: 2021-07-01

Abstract

A device 100 for diamond cutting and marking is provided herein. The device includes a movable fiber optic laser system 104 which generates a high power laser beam to cut the raw diamond and mark raw and polish diamond or like materials, a beam expander unit 106, a galvo unit 108 with a plurality of galvo sensors 108A, wherein the beam expander unit 106 is connected to the galvo unit which includes an optical sensors 108B for z axis movement, wherein the galvo unit is fitted on a z axis for manual movement with the galvo sensors, a display unit 110 to view complete process of diamond or like material 112 cutting, a fixed work table 114 on which the diamond or like materials to be cut or marked is placed in a fixture, and a control unit 102 configured to control the beam direction in the beam switcher, beam intensity and beam energy in the beam splitter, and to control the laser system 104.

Description

DIAMOND CUTTING AND MARKING DEVICE

This application is a continuation of application No.610/Mum/1998 & 611/Mum/1998, a granted patent no 188787 & 189027, now the terms of patents has expired, which is a continuation of application no. 2121/Mum/2009 filed on 16-09-2009.the Prior Art has application no 129/MUM/2002 and the patent no 207011 was granted on 16-05-2007 for LASER MACHINE FOR EXAMINATION, PLANNING AND MARKING RAW DIAMOND. Another Prior art has application no 628/DEL/2001AND THE PATENT NO 218301 WAS GRANTED ON 26-08-2008 FOR LASER MARKING ON DIAMONDS. The post grant opposition for patent number 218301 was filed and the opposition was dismissed by an Order dated 12-08-2014 by Asstt. Controller of Patents & design.

BACKGROUND Technical Field

This invention relates to a high power fiber laser source which can be used for multiple work like marking cutting, kerfing and sawing), bruiting, etc, and a laser system capable of time-sharing or power sharing (watt sharing) the output of a single high-power laser source with number of remote work stations.

The present invention relates to a field of cutting raw diamonds & marking raw and polished diamond or like materials. More particularly it relates to an apparatus for cutting and marking raw and polished diamond or like materials by using an efficient laser beam system which saves energy.

Description of the Related Art

As diamond is the hardest known material and has a high resistance to abrasion, machining, i.e., cutting and/or engraving, etc. Therefore, is very difficult to machine compared to gem-stones or hard metals. Diamond cutting is an art and skill, moreover a science of changing a diamond from rough stone into a faceted gem. Diamond cutting requires specialized knowledge, tools, equipment, and techniques because of its extreme hardness. Raw diamond has to be cut for getting maximum yield. Traditionally this was marking was done on raw diamond to be cut.

As an alternative to the cleaving process, diamond can be cut by a sawing process using a saw blade rotated at a high speed while being supplied with diamond powder onto the surface thereof, or by using a steel wire assisted by diamond powder (wire- cutting).

Nevertheless, it is extremely difficult to machine, in particular, a diamond plate, due to the brittleness and hardness of the diamond. The above conventional processes, however, have the following drawbacks:

The cleaving of a diamond block requires great skill and a very experienced operator. Nevertheless, a portion along which it is desired to split the diamond block is sometimes different from that which can be split, or it is difficult to accurately forecast which portion will be split. The sawing process using a saw blade or a steel wire is more likely to damage the diamond work piece, because of the hardness and the brittleness of the work piece, and requires a very long processing time. The creep-feed grinding processing of a diamond plate also requires a very long processing time, because the in- feed of the tool must be at a minimum rate. Further, the reliability of this process is not high.

Further, a diamond work piece, regardless of whether it is a block or a plate, is easily cracked and splintered during the machining process. It is widely known in this field that the diamond work piece rarely can be normally cut, and even when the diamond work piece can be cut, a large amount of waste occurs due to cracks and splinters generated during the process, which greatly increases the processing costs.

Another technique in the field of diamond cutting is the use of computer and Laser beam and there are number of patents granted in this technology. The prior art particularly teaches of examination of raw diamond which can also be terms as planning of raw diamonds to get maximum yield out of the raw diamond. Once the raw diamond is planned then it goes for cutting of raw diamond. The terms generally used in diamond industry for cutting is kerfing (making a grove on a diamond using laser beam) and sawing (cutting the diamond in two pieces). In this technique, the laser beam is stationary and the work table on which the diamond to be cut is placed is movable. But in such technique the main disadvantages are the weight loss of the diamond, possibility of breakages in the diamond and requirement of more energy to run the whole system of diamond cutting.

Accordingly, there remains a need to provide a diamond cutting tool for raw diamond and laser marking on raw diamond and polished diamond using fiber laser. Whereby a single power supply may be used to generate high power laser and then this laser machine works on time sharing mode, with multi-channel beam switch and can also work with energy-sharing mode with multi-channel beam splitting switch which will solve all aforementioned problems.

SUMMARY

The embodiments of the present invention discloses a device for diamond cutting and marking. The device includes a movable fiber optic laser system which generates a high power laser beam to cut the raw diamond and mark raw and polish diamond or like materials, a beam expander unit which includes a multi-channel beam switcher assembly consisting of a plurality of beam switching units having plurality of channels (1 to N), wherein the beam switching units directs the beam in each of these channels based on a time sharing mechanism and a multi-channel beam splitter assembly consisiting of plurality of beam splitters having a split ratio of 1:1, 1:2, 1:3, upto 1:N, wherein the beam splitters splits the beam in the plurality of channels 1 to N in a specific pre-determined split ratio based on energy sharing mechanism, a galvo unit with a plurality of galvo sensors, wherein the beam expander unit is connected to the galvo unit which includes an optical sensors for z axis movement, wherein the galvo unit is fitted on a z axis for manual movement with the galvo sensors, a display unit to view complete process of diamond or like material cutting, a fixed work table on which the diamond or like materials to be cut or marked is placed in a fixture, a control unit configured to control the beam direction in the beam switcher, beam intensity and beam energy in the beam splitter, and to control the laser system. In an embodiment, the galvo unit may include an object sensor to detect the diamond or like materials to be cut or marked on the fixed work table. In one embodiment, the control unit compares cutting and marking dimensions of the diamond or like material to be cut or marked with the position the diamond or like material on the fixed work table for deciding the movement of the laser beam for proper cutting or marking of the diamond or like material.

In an example embodiment, the source of laser beam is fiber laser. In an embodiment, the intensity of the laser beam may be controlled by the control unit. The diamond may be securely fixed on the work table by means of fixtures. In an embodiment, the diamond to be cut or marked may be of different shapes and sizes.

These and other aspects of the embodiments herein will be better appreciated and understood when considered in conjunction with the following description and the accompanying drawings. It should be understood, however, that the following descriptions, while indicating preferred embodiments and numerous specific details thereof, are given by way of illustration and not of limitation. Many changes and modifications may be made within the scope of the embodiments herein without departing from the spirit thereof, and the embodiments herein include all such modifications.

BRIEF DESCRIPTION OF THE DRAWINGS Reference will be made to embodiments of the invention, examples of which may be illustrated in the accompanying figures. These figures are intended to be illustrative, not limiting. Although the invention is generally described in the context of these embodiments, it should be understood that it is not intended to limit the scope of the invention to these particular embodiments:

The embodiments herein will be better understood from the following detailed description with reference to the drawings, in which: FIG. 1 illustrates a schematic block diagram of cutting a raw diamond or like materials and marking raw diamond and polish diamond by using a laser beam according to an embodiment mentioned herein.

Persons skilled in the art will appreciate that elements in the figures are illustrated for simplicity and clarity and may not have been drawn to scale. For example, the dimensions of some of the elements in the figure may be exaggerated relative to other elements to help to improve understanding of various exemplary embodiments of the present disclosure.

Throughout the drawings, it should be noted that like reference numbers are used to depict the same or similar elements, features, and structures.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Although specific terms are used in the following description for the sake of clarity, these terms are intended to refer only to the particular structure of the invention selected for illustration in the drawings, and are not intended to define or limit the scope of the invention.

References in the specification to “one embodiment” or “an embodiment” member that a particular feature, structure, characteristics, or function described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment.

In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular architectures, interfaces, techniques, etc. to provide a thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. That is, those skilled in the art will be able to devise various arrangements which, although not explicitly described or shown herein, embody the principles of the invention and are included within its spirit and scope. In some instances, detailed descriptions of well-known devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail. All statements herein reciting principles, aspects, and embodiments of the invention, as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof. Additionally, it is intended that such equivalents include both currently known equivalents as well as equivalents developed in the future, i.e., any elements developed that perform the same function, regardless of structure.

Thus, for example, it will be appreciated by those skilled in the art that block diagrams herein can represent conceptual views of illustrative circuitry embodying the principles of the technology. Similarly, it will be appreciated that any flow charts, state transition diagrams, pseudo code, and the like represent various processes which may be substantially represented in computer readable medium and so executed by a computer or processor, whether such computer or processor is explicitly shown.

Accordingly, there remains a need to provide a diamond cutting tool for raw diamond and laser marking on raw diamond and polished diamond using fiber laser. Whereby a single power supply may be used to generate high power laser and then this laser machine works on time sharing mode, with multi-channel beam switch and can also work with energy-sharing mode with multi-channel beam splitting switch which will solve all aforementioned problems. The device which solves the above problem is provided herein.

FIG. 1 illustrates a schematic block diagram of cutting a raw diamond or like materials and marking raw diamond and polish diamond by using a laser beam according to an embodiment mentioned herein. The device includes a movable fiber optic laser system 104, a beam expander unit 106, a galvo unit 108 with a plurality of galvo sensors 108 A, a display unit 110 to view complete process of diamond or like material 112 cutting, a fixed work table 114 on which the diamond or like materials to be cut or marked is placed in a fixture, and a control unit 102. In an embodiment, the control unit 102 may be configured to control the beam direction in the beam switcher, beam intensity and beam energy in the beam splitter, and to control the laser system 104.

In an embodiment, a beam expander unit 106 may include a multi-channel beam switcher assembly, which consists of plurality of beam switching units having plurality of channels (1 to N). In an embodiment, the beam switching units may direct the beam in each of these channels based on a time sharing mechanism.

In another embodiment, the beam expander unit 106 may also include a multi-channel beam splitter assembly consisiting of plurality of beam splitters having a split ratio of 1 : 1 , 1:2, 1:3, upto 1:N. Here, the beam splitters may split the beam in the plurality of channels 1 to N in a specific pre-determined split ratio based on energy sharing mechanism.

In one embodiment, the the beam expander unit 106 may be connected to the galvo unit which includes an optical sensors 108B for z axis movement. Here, the galvo unit may be fitted on a z axis for manual movement with the galvo sensors.

A moving source of laser beam provides the laser beam which is being used to cut and mark the diamond or the like material. The source of laser beam may be fiber laser. The advantages of the fiber laser are as follows:

1. Light is already coupled in to flexible fiber: The fact that the light is already in a fiber allows it to be easily delivered to a movable focusing element. This is important for laser cutting.

2. High output power: Fiber lasers can have active regions several kilometers long, and so can provide very high optical gain. They can support kilowatt levels of continuous output power because of the fiber's high surface area to volume ration, which allows efficient cooling. 3. High optical quality: The fiber's wave guiding properties reduce or eliminate thermal distortion of the optical path, typically producing a diffraction-limited, high quality optical beam.

4. Compact size: Fiber lasers are compact compared to rod or gas lasers of comparable power, because the fiber can be bent and coiled to save space.

5. Reliability: Fiber lasers exhibit high vibrational stability, extended lifetime maintenance free turnkey operation.

In an embodiment, the fiber lasers may be available at different wattages i.e. from 7 watt upward to 1000 watts and much more. Till 40 watt power, air cooled systems are much more efficient and at higher watt level, for increasing the efficiency and depending on application of cutting of materials water cooled systems may be used. Hence selection of the fiber laser is depending up on material to be cut. In an embodiment, the laser beam may be generated through a diode laser and fiber laser may be used to deliver the laser beam for marking and cutting.

In one embodiment, the laser beam source may be connected to the control unit. The intensity of the laser beam can be controlled by processing unit of the control unit. The laser beam source is movable. The movement of the laser source may also be controlled and decided by the processing unit.

In an embodiment, the work table may be provided on which a diamond or the material to be cut or marked is placed in a fixture. The diamond may be securely fixed on the table by means of the fixture. The work table here may be fixed and not movable.

The device of the present embodiment, further includes a storage unit inside the control unit 102 for storing a reference cutting dimensions and position data of the diamond to be cut. Here, the processing unit compares the cutting dimensions and position data of diamond to be cut for deciding the movement of the laser beam for proper cutting or marking of the diamond.

The source of laser beam, the storage unit and the work table may be connected to the processing unit. The processing unit may compare the cutting dimensions and position data of diamond to be cut and accordingly provides the signal to the source of laser beam for moving the laser beam to ensure the precise cutting of the diamond as per the cutting dimensions stored in the storage unit without changing the position of the diamond or the material to be cut.

The display unit 110 is provided to show the whole process of the cutting of the diamond or like material. Here, the object of the present invention is to provide a diamond cutting and marking apparatus which overcomes all the deficiencies associated with the prior art diamond cutting tools and diamond marking tool and methods as discussed above.

Another object of the present invention is to provide an apparatus for cutting raw diamond or like materials and marking raw diamond and polish diamond by using a laser beam which machines the diamond so as to obtain the diamond having good appearance without cracks and splinters.

Yet another object of present invention is to provide an apparatus for kerfing, sawing and shape cutting of diamond using movable laser beam.

Another object of the present invention is to provide to an apparatus for cutting diamond or like materials in different Shapes and sizes by using a laser beam which provides precise cutting and saves energy.

Yet another object of the present invention is to provide to an apparatus for cutting diamond or like materials by using a laser beam which ensures minimum weight loss of diamond or like material.

Still another object of the present invention is to provide to an apparatus for cutting diamond or like materials by using a laser beam which ensures less breakages in the diamond.

Yet another object of the present invention is multiple operation of cutting raw diamonds and marking of polish diamond of using power saving mode and time sharing mode in the device.

In the present embodiment, the laser moves and the object that is diamond and like material is stationary. The device of the present embodiment may work for cutting (kerfing), sawing , marking (on raw diamond with planning machine) and marking on polish diamond simumtanously using a single fiber source. The device of the present embodiment may also work as a stand alone machine for single operation and/or multiple source for multiple operation like cutting, marking, bruiting on raw diamond and marking on polish diamond.

The foregoing description of the specific embodiments will so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the spirit and scope.

Claims

I CLAIM:

1. A device (100) for diamond cutting and marking, said device comprising: a movable fiber optic laser system (104) which generates a high power laser beam to cut the raw diamond and mark raw and polish diamond or like materials; a beam expander unit (106) which includes a multi-channel beam switcher assembly consisting of a plurality of beam switching units having plurality of channels (1 to N), wherein the beam switching units directs the beam in each of these channels based on a time sharing mechanism and a multi-channel beam splitter assembly consisiting of plurality of beam splitters having a split ratio of 1:1, 1:2, 1:3, upto 1:N, wherein the beam splitters splits the beam in the plurality of channels 1 to N in a specific pre-determined split ratio based on energy sharing mechanism; a galvo unit (108) with a plurality of galvo sensors (108A), wherein the beam expander unit (106) is connected to the galvo unit which includes an optical sensors (108B) for z axis movement, wherein the galvo unit is fitted on a z axis for manual movement with the galvo sensors; a display unit (110) to view complete process of diamond or like material

(112) cutting; a fixed work table (114) on which the diamond or like materials to be cut or marked is placed in a fixture; a control unit (102) configured to control the beam direction in the beam switcher, beam intensity and beam energy in the beam splitter, and to control the laser system (104).

2. The device as claimed in claim 1, wherein the galvo unit which includes an object sensor (108 A) to detect the diamond or like materials to be cut or marked on the fixed work table.

3. The device as claimed in claim 1, wherein the control unit (102) compares cutting and marking dimensions of the diamond or like material to be cut or marked with the position the diamond or like material on the fixed work table for deciding the movement of the laser beam for proper cutting or marking of the diamond or like material.

4. The device as claimed in claim 1 , wherein the source of laser beam is fiber laser.

5. The device as claimed in claim 1, wherein the intensity of the laser beam is controlled by the control unit.

6. The device as claimed in claim 1, wherein the diamond is securely fixed on the work table by means of fixtures.

7. The device as claimed in claim 1 , wherein the diamond to be cut or marked is of different shapes and sizes. 8. The device as claimed in claim 1, wherein the laser beam is generated through a diode laser, wherein the fiber laser delivers the laser beam for marking and cutting.