CN114406497B

CN114406497B - Laser processing system

Info

Publication number: CN114406497B
Application number: CN202210161481.9A
Authority: CN
Inventors: 孙盛芝; 程忠辉; 许贝贝; 郑烨; 邱建荣
Original assignee: Ningbo Feina Laser Technology Co ltd
Current assignee: Ningbo Feina Laser Technology Co ltd
Priority date: 2022-02-22
Filing date: 2022-02-22
Publication date: 2023-12-19
Anticipated expiration: 2042-02-22
Also published as: CN114406497A

Abstract

The utility model relates to a laser processing system, which comprises a laser and a laser beam output device, wherein the laser beam output device is used for outputting a laser beam; the processing platform is used for bearing a sample to be processed; the focusing lens is arranged between the laser and the processing platform and focuses the light beam so as to process the sample to be processed; the method is characterized in that: the focusing lens comprises a long-focus focusing lens and a short-focus focusing lens which are sequentially distributed along the direction of the light path, so that the power density of the laser spots is higher, and the processing precision and the processing efficiency are higher.

Description

Laser processing system

Technical Field

The utility model relates to the technical field of laser processing, in particular to a laser processing system.

Background

Photovoltaic silicon materials, semiconductor silicon materials, sapphire materials, magnetic materials, optical glass, ceramic materials and the like have common characteristics of abrasion resistance, high hardness, large brittleness and the like, are collectively called hard and brittle materials, and have wide application in industry. It is also because of the high hardness and brittle nature that fracture easily occurs, making processing of these hard and brittle materials and brittle composite materials difficult.

The traditional cutting process of the hard and brittle material is to grind the material with lower hardness by using the material with higher hardness, and the ground part is worn and the unground part is separated, thereby achieving the cutting effect. Since diamond is the highest hardness of the materials naturally occurring today, early brittle composite materials were typically cut using an internal circular saw coated with diamond dust. The material processed by the method has large kerf and high material loss, and the cutting size of the brittle composite material is limited.

Two main cutting modes, free abrasive and fixed abrasive, were developed later. The mechanical processing mode has great abrasion to the cutter, the cutter needs to be replaced frequently, the processing cost is increased sharply, and the cutter is easy to damage the material due to the complex property of the brittle composite material, the processing quality is poor and the defective rate is high.

Laser processing is the processing of materials with a laser beam of high power density. Laser processing does not require tools, has high processing speed and small surface deformation, can process various materials, particularly materials with high hardness, high brittleness and high melting point, and therefore, the laser processing has been widely applied to modern manufacturing, particularly in the fields of precision processing and micromachining, including cutting, marking, jet printing, drilling, engraving, scanning and the like.

The Chinese patent with patent number ZL201320507612.0 (issued to the public number CN 203509353U) discloses a laser cutting equipment, including cooling water device, laser gas cylinder, auxiliary gas cylinder, air dryer, numerical control device, operating panel, servo motor, cutting workstation, cutting torch, focus lens, lead screw, speculum a, speculum b, laser oscillator, laser power, cutting torch drive arrangement, main power supply, speculum c, its characterized in that: the cooling water device lower extreme is provided with laser gas cylinder, auxiliary gas bottle, laser gas cylinder lower extreme is provided with the air dryer, the air dryer left end is provided with numerical control device, the numerical control device lower extreme is provided with the operation panel, the numerical control device upper end is provided with laser power supply, laser power supply left end is provided with laser oscillator, and the upper end is provided with the main power supply. The cutting torch is fixedly connected with the screw rod, the top end of the cutting torch is connected with a cutting torch driving device, and the cutting torch is provided with a focusing lens.

Above-mentioned laser cutting equipment focuses through focusing lens to improve the energy density of laser facula, however, the power density of laser facula is still lower, leads to laser machining precision and machining efficiency not enough, and moreover, the long-time processing of laser can lead to ambient temperature to rise, causes laser facula focus to change, thereby leads to the quality change of laser facula, also can influence the machining precision of laser.

Disclosure of Invention

The first technical problem to be solved by the present utility model is to provide a laser processing system with higher power density of laser spot, so as to improve processing precision and processing efficiency.

A second technical problem to be solved by the present utility model is to provide a laser processing system capable of monitoring a laser beam.

The technical scheme adopted by the utility model for solving the first technical problem is as follows: a laser processing system includes a laser that outputs a beam;

the processing platform is used for bearing a sample to be processed;

the focusing lens is arranged between the laser and the processing platform and focuses the light beam so as to process the sample to be processed;

the method is characterized in that: the focusing lens comprises a long-focus focusing lens and a short-focus focusing lens which are sequentially distributed along the light path direction.

In order to enable the laser spot to meet the cutting requirements of most of hard and brittle materials, the focal length of the long-focus focusing lens is 780-890 mm, and the focal length of the short-focus focusing lens is 70-110 mm.

In order to facilitate the movement of materials and ensure the quality of laser spots, the device also comprises a mounting platform and a driving mechanism, wherein the mounting platform is fixedly arranged above the processing platform, and the short-focus focusing lens is arranged on the mounting platform; the driving mechanism comprises a first driving mechanism, a second driving mechanism and a third driving mechanism, wherein the first driving mechanism can drive the processing platform to move up and down, the second driving mechanism can drive the processing platform to move left and right, and the third driving mechanism can drive the processing platform to move in the front-back direction. The first driving mechanism, the second driving mechanism and the third driving mechanism are matched structures of a motor, a screw rod and a nut, and the first driving mechanism, the second driving mechanism and the third driving mechanism are controlled by a control system.

The utility model solves the second technical problem as follows: the optical path direction of the optical path is followed by a monitoring device

A dichroic mirror arranged between the long-focus focusing lens and the short-focus focusing lens, wherein the light beam from the long-focus focusing lens passes through the dichroic mirror to form a first light beam and a second light beam, and the first light beam is incident to the short-focus focusing lens;

a first reflecting mirror that reflects the second light beam to an imaging lens;

the imaging lens is used for imaging the second light beam;

and the camera is used for shooting the imaging on the imaging lens and uploading the imaging signal to the terminal equipment.

The terminal equipment can be a computer, a mobile phone, a tablet personal computer, a projector, a television and the like, is in electrical signal connection with the control system, can transmit imaging information to the control system, enables the control system to perform data processing on the imaging information, and controls the driving mechanism to act correspondingly according to a processing result. The monitoring device can monitor the light spot in real time in the focusing and processing processes and observe through the terminal equipment, so that the position of a sample to be processed can be adjusted according to imaging signals to be matched with the focus of the laser spot, and the processing precision is improved.

In order to facilitate the selection of a suitable laser according to the processing material, the laser comprises at least two sub-lasers, and a beam shaper is further arranged between the lasers and the long-focus focusing lens. The multiple lasers can be combined and overlapped by a beam shaper to adjust the spot shape and energy distribution, and then the laser beams with the required wavelengths are selected according to the properties of materials and processing requirements: the single laser or the laser beams after the combination and the overlapping can achieve the best cutting effect, and the laser spots are more suitable for cutting the composite brittle materials.

The beam shaper and the sub lasers can be reasonably distributed according to the actual sizes of the beam shaper and the sub lasers, for example, all the sub lasers are opposite to the beam shaper, or part of the sub lasers are opposite to the beam shaper, part of the sub lasers are deviated from the beam shaper, or all the sub lasers are deviated from the beam shaper, and a second reflecting mirror for making the light beams output by the corresponding sub lasers enter the beam shaper is arranged between the deviated sub lasers and the beam shaper. More preferably, the light emitting direction of one of the sub-lasers is opposite to the beam shaper, the other sub-lasers are deviated from the beam shaper, and a second reflector for making the light beams output by the corresponding sub-lasers incident into the beam shaper is arranged between the deviated sub-lasers and the beam shaper.

In order to facilitate adjustment of the divergence angle and diameter of the light beam, a beam expander is further arranged between the beam shaper and the long-focus focusing lens. The beam expander can calibrate the collimation of the light beam, so that the size of the light spot can be more uniform, and the obtained laser light spot is more excellent by shaping the laser first, expanding the beam and focusing the laser last.

Compared with the prior art, the utility model has the advantages that: the long-focus focusing lens is used for adjusting the beam distribution of the laser so as to realize longer focal depth distribution, which is more beneficial to cutting of brittle materials, and the short-focus focusing lens is used for focusing the laser again, so that the Rayleigh length of the light spot obtained after focusing for two times is longer, the size is smaller, the energy is more concentrated, the power density is higher, the laser processing depth can be improved, and the processing efficiency and the processing precision can be improved; the short-focus focusing lens is fixedly arranged, and the processing platform is driven to move in a three-dimensional plane by the driving mechanism so as to accurately process the material, and the distribution and the size of laser spots can be prevented from being influenced by moving the spots in the processing process, so that the quality of the laser spots is more stable, the plane of laser cutting is smoother, and the damage to the processed material is smaller; the monitoring device is used for monitoring the laser beam, and the position of the sample to be processed can be adjusted according to the monitoring condition so as to be matched with the focus of the laser spot, so that the processing precision is further improved.

Drawings

FIG. 1 is a schematic diagram of a structure in an embodiment of the present utility model;

fig. 2 is a front view of an embodiment of the present utility model.

Detailed Description

Embodiments of the present utility model are described in further detail below.

As shown in fig. 1 and 2, a preferred embodiment of the present utility model is shown.

As shown in fig. 1 and 2, the laser processing system in the present embodiment includes main components such as a laser 1, a second reflecting mirror 2, a beam shaper 3, a beam expander 4, a tele focusing lens 51, a short-focus focusing lens 52, and a processing stage 9 in this order along the optical path direction.

As shown in fig. 1 and 2, the laser 1 is used for outputting a light beam. The laser 1 comprises two sub-lasers 10, wherein the light emitting direction of one sub-laser 10 faces the beam shaper 3, the light emitting direction of the other sub-laser 10 deviates from the beam shaper 3 and two second reflectors 2 are arranged between the other sub-laser and the beam shaper 3 so as to make the light beams output by the other sub-laser 10 enter the beam shaper 3. The multiple lasers can be combined and overlapped by a beam shaper 3 to adjust the spot shape and energy distribution, and then the laser beams with the required wavelengths are selected according to the properties of materials and processing requirements: the single laser or the laser beams after the combination and the overlapping can achieve the best cutting effect, and the laser spots are more suitable for cutting the composite brittle materials. The beam expander 4 can adjust the divergence angle and diameter of the beam, so as to calibrate the collimation of the beam, and make the size of the light spot more uniform.

As shown in fig. 1, in this embodiment, the long-focus focusing lens 51 can adjust the beam distribution of the laser to achieve longer focal depth distribution, which is more beneficial to cutting of brittle materials, and the short-focus focusing lens 52 focuses the laser again, so that the rayleigh length of the light spot obtained after focusing twice is longer, the size is smaller, the energy is more concentrated, the power density is larger, the processing depth of the laser can be improved, and thus the processing efficiency and the processing precision can be improved. The focal length of the long-focus focusing lens 51 is 780-890 mm, and the focal length of the short-focus focusing lens 52 is 70-110 mm, so that the laser spot can meet the cutting requirement of most of hard and brittle materials. In addition, the laser is shaped, expanded and focused, so that the obtained laser spot is more excellent.

As shown in fig. 1 and 2, the laser processing device further comprises a mounting platform 7 and a driving mechanism, wherein the mounting platform 7 is fixedly arranged above the processing platform 9, and a short-focus focusing lens 52 is fixed on the mounting platform 7 to fix the laser spot. The mounting platform 7 may be part of a frame or may be mounted on a post. The driving mechanism comprises a first driving mechanism 81, a second driving mechanism 82 and a third driving mechanism 83, wherein the first driving mechanism 81 can drive the processing platform 91 to move up and down, the second driving mechanism 82 can drive the processing platform 9 to move left and right, and the third driving mechanism 83 can drive the processing platform 9 to move in the front-back direction, so that a sample 91 to be processed placed on the processing platform 9 can be driven to move in a three-dimensional space. Wherein, the first driving mechanism 81, the second driving mechanism 82 and the third driving mechanism 83 are all matched structures of a motor, a screw rod and a nut, and reference is made to the prior art. The first driving mechanism 81, the second driving mechanism 82, and the third driving mechanism 83 are each controlled by a control system to operate, such as how many turns each motor rotates in a certain direction. The laser processing system in this embodiment is through fixed laser facula to remove the processing material in the course of working, in order to the accurate processing of material, and can avoid removing the facula and influence distribution and the size of laser facula in the course of working, can make laser facula quality more stable, thereby make the plane of laser cutting more level, the processing material damage is littleer.

As shown in fig. 1 and 2, the monitoring device further includes a dichroic mirror 61, a first reflecting mirror 62, an imaging lens 63, and a camera 64 in this order in the optical path direction. The dichroic mirror 61 is disposed between the long-focus focusing lens 51 and the short-focus focusing lens 52, and the light beam from the long-focus focusing lens 51 passes through the dichroic mirror 61 to form a first light beam and a second light beam, the first light beam is incident on the short-focus focusing lens 52, and the second light beam is reflected by the first reflecting mirror 62 to the imaging lens 63 and imaged on the imaging lens 63. The camera 64 photographs the image on the imaging lens 63 and can upload the imaging signal to the terminal device. The terminal equipment can be a computer, a mobile phone, a tablet personal computer, a projector, a television and the like, is in electrical signal connection with the control system, can transmit imaging information to the control system, enables the control system to perform data processing on the imaging information, and controls the driving mechanism to act correspondingly according to a processing result. The monitoring device can monitor the light spot in real time in the focusing and processing processes, and observe through the terminal equipment, so that the position of a sample to be processed can be adjusted according to imaging signals to be matched with the focus of the laser spot, and the processing precision is improved.

Claims

1. A laser processing system, comprising

A laser (1) for outputting a light beam;

a processing platform (9) for carrying a sample (91) to be processed;

the focusing lens is arranged between the laser and the processing platform (9) and focuses the light beam so as to process the sample (91) to be processed;

the method is characterized in that: the focusing lens comprises a long-focus focusing lens (51) and a short-focus focusing lens (52) which are sequentially distributed along the light path direction, the focal length of the long-focus focusing lens (51) is 780-890 mm, and the focal length of the short-focus focusing lens (52) is 70-110 mm;

the device also comprises a mounting platform (7) and a driving mechanism, wherein the mounting platform (7) is fixedly arranged above the processing platform (9), and the short-focus focusing lens (52) is arranged on the mounting platform (7); the driving mechanism comprises a first driving mechanism (81), a second driving mechanism (82) and a third driving mechanism (83), wherein the first driving mechanism (81) can drive the processing platform (9) to move up and down, the second driving mechanism (82) can drive the processing platform (9) to move left and right, and the third driving mechanism (83) can drive the processing platform (9) to move in the front-back direction;

the laser (1) comprises at least two sub lasers (10), and a beam shaper (3) is arranged between the laser (1) and the tele focusing lens (51);

a beam expander (4) is arranged between the beam shaper (3) and the long-focus focusing lens (51);

the optical path direction of the optical path is followed by a monitoring device

A dichroic mirror (61) provided between the long-focus focusing lens (51) and the short-focus focusing lens (52), wherein a first light beam and a second light beam are formed by the light beam from the long-focus focusing lens (51) after passing through the dichroic mirror (61), and the first light beam is incident on the short-focus focusing lens (52);

a first reflecting mirror (62) that reflects the second light beam to an imaging lens (63);

-the imaging lens (63) imaging the second light beam;

a camera (64) for photographing the imaging on the imaging lens (63) and uploading an imaging signal to a terminal device;

the light emitting direction of one sub-laser (10) is opposite to the beam shaper (3), the rest of the sub-lasers (10) deviate from the beam shaper (3), and a second reflecting mirror (2) for making the light beams output by the corresponding sub-lasers (10) incident into the beam shaper (3) is arranged between the deviated sub-lasers (10) and the beam shaper (3).