CN111730214A

CN111730214A - Special device for laser cutting of diamond material

Info

Publication number: CN111730214A
Application number: CN202010681057.8A
Authority: CN
Inventors: 陈聪; 李国栋; 廖世明
Original assignee: Guangzhou Sanyi Laser Technology Co ltd
Current assignee: Guangzhou Sanyi Laser Technology Co ltd
Priority date: 2020-07-15
Filing date: 2020-07-15
Publication date: 2020-10-02

Abstract

The invention discloses a special device for cutting diamond materials by laser, which relates to diamond cutting and mainly solves the technical problem of poor quality of the existing laser diamond cutting, the device comprises a laser, an outer light path module, a motion control system, an XYZ motor module, a coaxial imaging processing head module and a polarization adjusting module, wherein the coaxial imaging processing head module comprises a rack, a visual detection mechanism is arranged on the rack, the polarization adjusting module comprises a wave plate and a rotating motor, the motion control system is connected with the laser, the XYZ motor module, the visual detection mechanism and the rotating motor, laser emitted by the laser irradiates a workpiece through the outer light path module and the wave plate, the motion control system controls the rotating motor to adjust the rotating angle of the wave plate or the workpiece in real time according to the cutting track of the workpiece, so that the polarization direction of the laser is tangent to the cutting track, and the cutting quality and efficiency can be improved.

Description

Special device for laser cutting of diamond material

Technical Field

The invention relates to diamond cutting, in particular to a special device for cutting diamond materials by laser.

Background

With the continuous development of laser technology, laser processing is increasingly widely applied in industry. The laser cutting material is the most common application in laser processing, the laser cutting is a non-contact cutting method, and compared with the traditional cutting method, the laser cutting method has the advantages of good cutting quality, high production efficiency, wide application range, low production cost and the like. In the laser cutting, high-energy laser is focused on the surface of a material by using a focusing lens to generate high temperature enough for melting and even gasifying the material, and then the material is separated by injecting and blowing auxiliary gas, so that the aim of cutting is fulfilled. In the practice of laser cutting, many factors affect the quality and efficiency of the cut, and besides the process parameters such as gas and nozzle, gas flow and cutting speed, the energy distribution of the beam, the polarization state of the beam and the like are also crucial to the quality and efficiency of the cut.

The diamond is one of the hardest substances in the world and is the most precious and popular product, and the diamond stone can be changed into bright diamond only after being strictly cut, ground and processed. The traditional diamond cutting method is disc cutting, where the diamond is machined from other diamonds or diamond powders that adhere to the disc. Laser cutting is a novel technology of diamond processing, and has the advantages of good processing quality, high efficiency, less secondary investment and the like, and is widely applied to the field of diamond processing due to the non-contact processing of the laser cutting. The quality factors influencing laser diamond cutting mainly include two factors: firstly, the weight loss of the diamond is large and high in value, and the tiny weight loss is considerable economic value loss; second, microcracks and surface finish produced during cutting can affect the subsequent processing and service life of the diamond. Practical test application shows that diamonds have the problem that different cutting directions can cause inconsistent cutting quality and efficiency in the process of irregular cutting.

Disclosure of Invention

The invention aims to solve the technical problem of the prior art, and aims to provide a special device for laser cutting of diamond materials, which can improve the cutting quality and efficiency.

The technical scheme of the invention is as follows: the special device for cutting diamond materials by laser comprises a laser, an outer light path module, a motion control system, an XYZ motor module, a coaxial imaging processing head module and a polarization adjusting module, wherein the coaxial imaging processing head module comprises a rack, a visual detection mechanism is arranged on the rack, the polarization adjusting module comprises a wave plate and a rotating motor, the motion control system is connected with the laser, the XYZ motor module, the visual detection mechanism and the rotating motor, laser emitted by the laser irradiates a workpiece through the outer light path module and the wave plate, and the motion control system controls the rotating motor to adjust the rotating angle of the wave plate or the workpiece in real time according to a cutting track of the workpiece so that the polarization direction of the laser is tangent to the cutting track.

As a further improvement, the wave plate is a half wave plate.

Further, the visual inspection mechanism comprises a camera, a camera lens connected with the camera, an achromatic objective lens positioned below the camera lens, and a light source positioned below the achromatic objective lens, and the motion control system is connected with the camera and the light source.

Furthermore, the achromatic objective lens corresponds to the wavelength of the laser, the focal length of the achromatic objective lens is 20-200mm, and the focal length of the camera objective lens is 20-250 mm.

Further, outer light path module is including the first speculum, the second speculum, the beam expanding mirror, the glan prism, the third speculum that arrange in proper order, first speculum is the incident end of laser, the third speculum is the exit end of laser.

Further, the XYZ motor module comprises a Z-axis linear motor for driving the rack to move up and down and an XY linear motor platform for mounting the workpiece, and the motion control system is connected with the Z-axis linear motor and the XY linear motor platform.

Furthermore, the rotating motor is a hollow shaft motor, the wave plate is connected with a rotating shaft of the rotating motor, a coaxial arrangement structure is arranged between the rotating motor and the wave plate, and the rotating motor is installed on the rack.

Further, the rotating electrical machines is a hollow shaft motor, the wave plate is connected with a rotating shaft of the rotating electrical machines, a structure which is coaxially arranged is arranged between the rotating electrical machines and the wave plate, and the rotating electrical machines are installed at laser emergent ends of the lasers.

Furthermore, the rotating motor is a hollow shaft motor, the wave plate is connected with a rotating shaft of the rotating motor, a coaxial arrangement structure is arranged between the rotating motor and the wave plate, and the rotating motor is installed at the incident end or the emergent end of the outer light path module.

Further, the wave plate is installed at any one of a laser emitting end of the laser, an incident end of the outer light path module, an emergent end of the outer light path module, and the frame, and the rotating motor is connected with the XYZ motor module.

Advantageous effects

Compared with the prior art, the invention has the advantages that: according to the invention, the motion control system controls the rotating motor to adjust the angle of the wave plate or the workpiece in real time according to the cutting track of the workpiece, so that the polarization direction of the laser is tangent to the cutting track, the cutting quality and efficiency can be improved, and meanwhile, the visual detection mechanism detects the machining process in real time, so that the cutting and detection are integrated, and the machining quality is effectively ensured.

Drawings

FIG. 1 is a schematic structural view of example 1 of the present invention;

fig. 2 is a schematic structural view of a coaxial imaging processing head module according to embodiment 1 of the present invention;

FIG. 3 is a schematic structural view of example 2 of the present invention;

FIG. 4 is a schematic structural diagram of embodiment 3 of the present invention;

FIG. 5 is a schematic structural diagram of embodiment 4 of the present invention

FIG. 6 is a diagram of 1/2 waveplates for changing the polarization direction of laser beam;

FIG. 7 is a schematic diagram of a laser with a fixed polarization direction and a rectangular cutting track;

FIG. 8 is a schematic diagram of laser polarization direction fixation and circular cutting trajectory;

FIG. 9 is a schematic diagram of the direction of the laser polarization state being consistent with the rectangular cutting track;

FIG. 10 is a schematic diagram of the laser polarization direction being consistent with the circular cutting trajectory;

fig. 11 is a diagram of the cutting effect of the laser with the polarization direction consistent with the cutting track.

Wherein: 1-laser, 2-external light path module, 3-motion control system, 4-workpiece, 5-XYZ motor module, 6-coaxial imaging processing head module, 7-frame, 8-visual detection mechanism, 9-wave plate, 10-rotating motor, 11-laser, 12-cutting track, 13-camera, 14-camera objective, 15-achromatic objective, 16-light source, 17-first reflector, 18-second reflector, 19-beam expander, 20-Glan prism, 21-third reflector, 22-Z axis linear motor, 23-high pressure air blowing nozzle, 24-X axis linear motor, 25-Y axis linear motor, D-laser polarization state direction, D1-incident laser polarization state direction, D2-laser polarization state direction.

Detailed Description

The invention will be further described with reference to specific embodiments shown in the drawings.

A special device for cutting diamond materials by laser comprises a laser 1, an outer light path module 2, a motion control system 3 and an XYZ motor module 5, wherein the wavelength of the laser 1 is 1064nm and 532nm, and the pulse width is 100ns-100 fs. This device still includes coaxial formation of image processing head module 6, polarization adjustment module, coaxial formation of image processing head module 6 includes frame 7, be equipped with visual detection mechanism 8 on the frame 7, polarization adjustment module includes wave plate 9, rotating electrical machines 10, motion control system 3 connects laser 1, XYZ motor module 5, visual detection mechanism 8, rotating electrical machines 10, laser 11 that laser 1 sent passes through outer light path module 2, the wave plate 9 shines work piece 4, motion control system 3 controls rotating electrical machines 10 according to the cutting orbit 12 of work piece 4 and adjusts the rotation angle of wave plate 9 or work piece 4 in real time, so that the polarization state direction D of laser 11 is tangent with cutting orbit 12, cutting quality and efficiency are optimal.

Preferably, the wave plate 9 is a half-wave plate, as shown in fig. 6, when the incident polarization direction D1 of the laser 11 coincides with the fast axis or the slow axis, the emergent polarization direction D2 remains unchanged, and the included angle B between the emergent polarization direction and the incident polarization direction is twice the included angle a between the incident polarization direction and the wave plate main axis when the incident polarization direction and the incident polarization direction are not coincident, that is, B is 2A, and by using this principle, the change of the polarization state required for processing the laser is realized by rotating the wave plate 9 or the workpiece 4, and the polarization direction D of the laser 11 is tangent to the cutting trajectory 12.

The visual inspection mechanism 8 includes a camera 13, an image pickup objective lens 14 connected to the camera 13, an achromatic objective lens 15 positioned below the image pickup objective lens 14, and a light source 16 positioned below the achromatic objective lens 15, and the motion control system 3 is connected to the camera 13 and the light source 16. The camera 13 is a CCD high-definition industrial camera, the light source 16 is an annular adjustable light source, and the camera 13, the camera objective lens 14, the achromatic objective lens 15 and the light source 16 are coaxially arranged. The achromatic objective lens 15 corresponds to the wavelength of the laser 11, the achromatic objective lens 15 adopts an achromatic design for the wavelength of 1064-532nm, the focal length of the achromatic objective lens 15 is 20-200mm, the focal length of the camera objective lens 14 is 20-250mm, and the field of view can reach 15 x 20 mm. Before machining, the machining track can be quickly positioned by the visual detection mechanism 8, and the positioning precision and the speed are high; in the course of working, utilize visual detection mechanism 8 can real-time detection the orbit of cutting, send out early warning or report to the police when the orbit is unsatisfied the precision to remind the user in time to take counter-measure, guarantee processingquality, reduce the loss.

The outer light path module 2 includes the first speculum 17, the second speculum 18, the beam expander 19, glan prism 20, the third speculum 21 that arrange in proper order, first speculum 17, the second speculum 18, the third speculum 21 is 45 holophotes, first speculum 17, the second speculum 18 is used for the beam collimation, beam expander 19 is used for the beam shaping, glan prism 20 is used for producing higher purity line polarization light, the third speculum 21 is used for leading the light beam to wave plate 9, promptly, first speculum 17 is the incident end of laser 11, the third speculum 21 is the exit end of laser 11.

The XYZ motor module 5 comprises a Z-axis linear motor 22 for driving the frame 7 to move up and down, and an XY linear motor platform for mounting the workpiece 4, wherein the Z-axis linear motor 22 is used for adjusting a processing focus according to different thicknesses of cut diamonds, and the XY linear motor platform is used for providing various cutting tracks required by a sample and finally cutting the diamonds into various shapes. The XY linear motor platform is composed of an X-axis linear motor 24 and a Y-axis linear motor 25, the Y-axis linear motor 25 is located above the X-axis linear motor 24, the Y-axis linear motor 25 is perpendicular to the X-axis linear motor 24, the Z-axis linear motor 22 is perpendicular to the Y-axis linear motor 25 and the X-axis linear motor 24, the Z-axis linear motor 22, the Y-axis linear motor 25 and the X-axis linear motor 24 are all high-precision full closed-loop linear motors with grating scales, the positioning precision is 0.001mm, and the motion control system 3 is connected with the Z-axis linear motor 22, the X-axis linear motor 24 of the XY linear motor platform and the Y-axis linear motor 25.

The motion control system 3 synchronously controls laser parameters such as light, energy and frequency of the laser 1, the running track and speed of the XYZ motor module 5 and the rotation angle of the rotating motor 10, and high-efficiency and high-quality cutting of diamonds is realized.

The frame 7 is provided with a high pressure blowing nozzle 23 for separating the material by jet blowing, thereby achieving the purpose of cutting.

Example 1

Referring to fig. 1-2, the rotating motor 10 is a hollow shaft motor, the wave plate 9 is connected to a rotating shaft of the rotating motor 10, the rotating motor 10 and the wave plate 9 are coaxially arranged, the rotating motor 10 is mounted on the frame 7, and the laser 11 sequentially passes through the outer light path module 2 and the wave plate 9 and irradiates the workpiece 4.

Example 2

Referring to fig. 3, the rotating motor 10 is a hollow shaft motor, the wave plate 9 is connected to a rotating shaft of the rotating motor 10, a coaxial arrangement structure is adopted between the rotating motor 10 and the wave plate 9, the wave plate 9 is installed at a laser emitting end of the laser 1, and the laser 11 sequentially passes through the wave plate 9 and the outer light path module 2 to irradiate the workpiece 4.

Example 3

Referring to fig. 4, the rotating motor 10 is a hollow shaft motor, the wave plate 9 is connected to a rotating shaft of the rotating motor 10, a coaxial arrangement structure is adopted between the rotating motor 10 and the wave plate 9, the wave plate 9 is installed at an incident end or an emergent end of the outer light path module 2, and the laser 11 sequentially passes through the wave plate 9 and the outer light path module 2 to irradiate the workpiece 4, or sequentially passes through the outer light path module 2 and the wave plate 9 to irradiate the workpiece 4.

Example 4

Referring to fig. 5, the wave plate 9 is installed at any one of the laser emitting end of the laser 1, the incident end of the outer light path module 2, the exit end of the outer light path module 2, and the frame 7, and the rotating motor 10 is connected to the XYZ motor module 5. Specifically, the rotating motor 10 is connected to the bottom or the top of the XY linear motor platform, and the rotating motor 10 drives the XY linear motor platform to rotate or directly drives the workpiece 4 to rotate.

The coaxial imaging processing head module 6 of the invention adopts a large-view-field coaxial positioning optical system design, integrates an achromatic objective lens 15, a camera objective lens 14 and a light source 16, realizes the synchronous function of cutting, observation and positioning at the same time, and has a view field of 15 multiplied by 20 mm. The laser 1, the outer light path module 2, the wave plate and the rotating motor 10 are integrally designed, and the structure is small in size, simple, stable and reliable. In the conventional cutting, the polarization state of the laser is fixed (as shown in fig. 7 and 8), and when the linear polarization direction is not consistent with the cutting track, the problems of non-penetration, low cutting efficiency, wide cutting seam and the like exist. The laser linear polarization direction changes the polarization state direction along with the XY motion track through the wave plate arranged on the hollow shaft motor in the cutting process and is consistent with the cutting direction (as shown in figures 9 and 10), when the linear polarization direction is consistent (tangent) with the cutting track in the cutting process, the cutting effect is good, the efficiency is high, and the high-quality and high-efficiency opposite-type cutting of diamond by the laser is realized (as shown in figure 11).

It should be noted that the above is only a preferred embodiment of the present invention, and it should be understood that a person skilled in the art can make several modifications and improvements without departing from the structure of the present invention, wherein the laser diamond cutting involves changing the polarization state of the laser by a wave plate to improve the processing quality efficiency, whether the wave plate is on the processing head or in the whole external optical path (somewhere in the middle of the external optical path module 2 in fig. 1) or even inside the laser (laser 1 in fig. 1), and the processing quality efficiency is improved by rotating the laser, rotating the workpiece to be processed to change the polarization state direction of the laser relative to the workpiece to be processed, and any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention are included in the scope of protection of the present invention.

Claims

1. The special device for cutting diamond materials by laser comprises a laser (1), an outer light path module (2), a motion control system (3), an XYZ motor module (5), and is characterized by further comprising a coaxial imaging processing head module (6) and a polarization adjusting module, wherein the coaxial imaging processing head module (6) comprises a rack (7), a visual detection mechanism (8) is arranged on the rack (7), the polarization adjusting module comprises a wave plate (9) and a rotating motor (10), the motion control system (3) is connected with the laser (1), the XYZ motor module (5), the visual detection mechanism (8) and the rotating motor (10), laser (11) emitted by the laser (1) irradiates a workpiece (4) through the outer light path module (2) and the wave plate (9), and the motion control system (3) controls the rotating motor (10) to adjust the wave plate (4) in real time according to a cutting track (12) of the workpiece (4) (9) Or the rotation angle of the workpiece (4) such that the polarization direction (D) of the laser light (11) is tangential to the cutting trajectory (12).

2. The apparatus as claimed in claim 1, wherein the wave plate (9) is a half wave plate.

3. The special device for cutting diamond material by laser as claimed in claim 1, wherein said vision inspection mechanism (8) comprises a camera (13), a camera lens (14) connected to said camera (13), an achromatic lens (15) located under said camera lens (14), and a light source (16) located under said achromatic lens (15), and said motion control system (3) is connected to said camera (13) and said light source (16).

4. A special device for laser cutting of diamond material as claimed in claim 3, wherein said achromatic objective lens (15) corresponds to the wavelength of said laser light (11), said achromatic objective lens (15) has a focal length of 20-200mm, and said camera objective lens (14) has a focal length of 20-250 mm.

5. The special device for cutting diamond material by laser according to claim 1, wherein said external optical path module (2) comprises a first reflector (17), a second reflector (18), a beam expander (19), a Glan prism (20), and a third reflector (21) arranged in sequence, said first reflector (17) is an incident end of said laser (11), and said third reflector (21) is an exit end of said laser (11).

6. The special apparatus for laser cutting diamond material as claimed in claim 1, wherein said XYZ motor module (5) comprises a Z-axis linear motor (22) for driving said frame (7) to move up and down, an XY linear motor platform for mounting said workpiece (4), said motion control system (3) is connected to said Z-axis linear motor (22) and XY linear motor platform.

7. The special device for laser cutting of diamond material as claimed in any one of claims 1-6, wherein said rotating motor (10) is a hollow shaft motor, said wave plate (9) is connected to the rotating shaft of the rotating motor (10), said rotating motor (10) and the wave plate (9) are coaxially arranged, and said rotating motor (10) is installed on said frame (7).

8. The special device for laser cutting of diamond material as claimed in any one of claims 1-6, wherein said rotating motor (10) is a hollow shaft motor, said wave plate (9) is connected to the rotating shaft of the rotating motor (10), said rotating motor (10) and wave plate (9) are coaxially arranged, and said rotating motor (10) is installed at the laser emitting end of said laser (1).

9. The special device for laser cutting of diamond material as claimed in any one of claims 1-6, wherein said rotating motor (10) is a hollow shaft motor, said wave plate (9) is connected to the rotating shaft of the rotating motor (10), said rotating motor (10) and wave plate (9) are coaxially arranged, and said rotating motor (10) is installed at the incident end or the emergent end of said external light path module (2).

10. The special apparatus for laser cutting diamond material as claimed in any one of claims 1-6, wherein said wave plate (9) is installed at any one of the laser emitting end of said laser (1), the incident end of said outer light path module (2), the exit end of said outer light path module (2) and the frame (7), and said rotating motor (10) is connected to said XYZ motor module (5).