CN116810181A - Water-guide laser cutting machining device and machining method - Google Patents

Abstract

The invention discloses a water-guide laser cutting processing device, which comprises a machine table, a machine head device and a workpiece carrying table device, wherein the machine head device is arranged on the machine table, the machine head device comprises a machine table body and a machine table door frame, the machine table comprises a machine table door frame, the machine table door frame is arranged above the machine table body, the machine table door frame is assembled on the top of the machine table door frame, the machine table body carries the workpiece carrying table device, the machine head device is provided with an A-axis translation mechanism to drive the machine head to vertically move along the A axis, the workpiece carrying table device is provided with an X-axis translation mechanism, a Y-axis translation mechanism, a B-axis swing mechanism and a C-axis rotation mechanism to drive the whole workpiece carrying table device to horizontally move along the X axis and the Y axis, and the workpiece carrying table device is driven to swing around the B axis and rotate around the C axis, and the middle cross section of a workpiece on the workpiece carrying table can be adjusted to be flush with the B-axis swing axis. The water-guided laser cutting processing method disclosed by the invention adopts the water-guided laser cutting processing device to cut the blank workpiece into thin slices, and the processed product has higher quality.

Description

Water-guide laser cutting machining device and machining method

Technical Field

The invention relates to application of a water-guided laser technology, in particular to a water-guided laser cutting processing device and a processing method.

Background

The water-guided laser is similar to laser propagating in an optical fiber, a stable water column is used as a medium for laser transmission, air is used as a low-refractive-index cladding, the laser is totally reflected on the surface of the water, and the laser is transmitted to the surface of a workpiece through a water beam.

The water-guided laser theory has been studied for a long time, but only the Switzerland Sinova company (SYNOVA) realizes industrialization at present, and the laser microjet (water-guided laser) technology processing process comprises the following steps: the water jet impacts the working surface; then laser pulses are emitted and via water jet, the material absorbs heat; the absorbed laser energy produces a plasma layer separating water and material; the laser pulse is completed, the plasma phenomenon is ended, and the water jet cools the material; the water jet completely removes heat by convection. The advantages of water-guided laser are obvious compared with the conventional laser processing: the micro water jet conducts, protects and maintains stable columnar laser like an optical fiber; the machining taper caused by the divergence angle of the laser is avoided, and parallel laser beams are machined; cooling the material to be processed 99% of the time per pulse cycle; the laser pulse is protected by the water jet, so that the laser pulse is not influenced by environmental factors and processing scraps; compared with the traditional laser processing technology, the method has higher processing efficiency.

The current laser micro-jet system adopts a traditional double-swing-head five-axis machine head device cutting processing device, wherein a machine head module of laser micro-jet is arranged on the machine head device, and besides the machine head device moves relative to a X, Y, Z axis of a workpiece coordinate system rapidly, the machine head device also comprises rotation of a C-axis (parallel to a Z axis) swing arm, swinging of a B-axis (parallel to a Y axis) swing head and normal direction (A axis, parallel to the Z axis) follow-up of the machine head device. For a laser micro-jet machine head device, the position of the machine head device needs to be continuously moved, and when the machine head device moves, particularly swings or rotates, the water jet position and the shape of the machine head module are also changed (besides the single A-axis follow-up of the machine head device, the path of a micro-water column beam is curved), and at the moment, the micro-water column beam can appear as discontinuous series of water drops, so that a laser beam coupled in the micro-water column beam is unstable, and the processing quality of a workpiece is finally influenced.

Disclosure of Invention

In view of the above, the present invention is directed to a water-guided laser cutting device and a method for cutting a workpiece to ensure the cutting quality of the workpiece.

In order to solve the problems, the invention provides a water-guided laser cutting processing device, which comprises a machine table, a machine head device and a workpiece carrying table device, wherein the machine head device is arranged on the machine table, the machine head device comprises a machine table body and a machine table door frame, the machine table body is arranged above the machine table body, the machine table door frame is provided with the machine head device at the top, the machine table body carries the workpiece carrying table device, the machine head device is provided with an A-axis translation mechanism to drive the machine head to vertically move along an A-axis, the workpiece carrying table device is provided with an X-axis translation mechanism, a Y-axis translation mechanism, a B-axis swing mechanism and a C-axis rotation mechanism to drive the whole workpiece carrying table device to horizontally move along the X-axis and the Y-axis, and the workpiece carrying head arranged on the workpiece carrying table device is driven to swing around the B-axis and rotate around the C-axis, wherein the middle cross section of a workpiece on the workpiece carrying head can be adjusted to be flush with the B-axis swing axis.

On the basis, the invention provides a water-guided laser cutting processing method, which adopts the water-guided laser cutting processing device to carry out cutting processing, and specifically comprises the following steps: adhering the blank workpiece to a workpiece loading head on a workpiece frame in a workpiece carrying table device, and adjusting the position of the workpiece loading head to enable the middle cross section of the workpiece to be level with the swing axis of the B shaft; starting an X-axis translation mechanism and a Y-axis translation mechanism, and moving the workpiece frame sliding table until the workpiece is positioned below the machine head device; starting an A-axis translation mechanism, and adjusting the machine head to be suitable for processing height; starting a C-axis rotating mechanism to enable the workpiece to rotate around the C-axis, and simultaneously starting a machine head module of the machine head laser microjet until the circumferential surface on the workpiece is cut; starting a B-axis swinging mechanism, and turning a workpiece loading head and a workpiece on a workpiece frame around the B-axis by 180 degrees; starting a C-axis rotating mechanism to enable the workpiece to rotate around the C-axis, and simultaneously starting a machine head module of the machine head laser microjet until the lower circumferential surface of the workpiece is cut; starting a B-axis swinging mechanism, and turning a workpiece loading head and a workpiece on a workpiece frame by 90 degrees around the B-axis; starting a Y-axis translation mechanism to translate the workpiece along the Y-axis by a distance of preset sheet thickness; starting an X-axis translation mechanism to translate a workpiece along an X-axis, and simultaneously starting a machine head module of the machine head laser microjet until a piece is cut; the last two steps are repeated until the workpiece is cut into thin slices.

Compared with the prior art, the invention changes the five-axis machine head in the existing water-guided laser cutting processing device into a one-axis machine head and four-axis workpiece carrier combined structure, wherein the water-guided laser machine head only moves in the vertical direction, so that the micro-water column beam path is prevented from presenting a curve, the stability of the micro-water column beam is convenient to keep, and the cutting quality of the workpiece is guaranteed. The processing method for processing the blank workpiece into the sheet by adopting the water-guided laser cutting processing device can ensure the quality of products and has high processing efficiency.

Drawings

Fig. 1 is a schematic diagram of a whole machine of a water-guided laser cutting device according to the present invention.

Fig. 2 is a schematic diagram of the whole machine of the water-guided laser cutting device of the invention.

Fig. 3 is a schematic diagram of the overall dust seal removal of the water-guided laser cutting device of the present invention.

Fig. 4 is a schematic diagram II of the overall dust seal removal of the water-guided laser cutting device of the present invention.

Fig. 5 is a schematic diagram of a machine table in the water-guided laser cutting device of the present invention.

Fig. 6 is a schematic diagram of a machine table in the water-guided laser cutting device of the present invention.

Fig. 7 is a schematic diagram of a machine adjusting device in the water-guided laser cutting device according to the present invention.

Fig. 8 is a schematic diagram II of a machine adjusting device in the water-guided laser cutting device of the invention.

Fig. 9 is a schematic view of a water-guided laser cutting device according to the present invention with an upper module removed from a machine adjusting device.

Fig. 10 is a schematic view of a head device and a workpiece stage device in the water-guided laser cutting processing device according to the first embodiment of the present invention.

Fig. 11 is a schematic diagram of a head device and a workpiece carrier device in the water-guided laser cutting processing device according to the second embodiment of the present invention.

Fig. 12 is a schematic view of a head unit in the water-guided laser cutting device of the present invention.

Fig. 13 is an exploded view of a head unit in the water-guided laser cutting device of the present invention.

Fig. 14 is a schematic view of an a-axis translation mechanism in the water-guided laser cutting device of the present invention.

Fig. 15 is a schematic view of the water-guided laser cutting device according to the present invention, wherein the connection plate of the head is removed by the a-axis translation mechanism.

Fig. 16 is an exploded view of a head assembly of the water-guided laser cutting apparatus of the present invention.

Fig. 17 is an exploded view of a head assembly of the water-guided laser cutting apparatus of the present invention.

Fig. 18 is a schematic view of a workpiece stage device in a water-guided laser cutting processing apparatus according to the present invention.

Fig. 19 is a second schematic view of a workpiece stage device in the water-guided laser cutting processing apparatus of the present invention.

FIG. 20 is a schematic view of a workpiece carrier device with drag chains and accessories removed in a water-guided laser cutting processing apparatus according to the present invention.

FIG. 21 is a second schematic view of a workpiece carrier device for removing drag chains and accessories in a water-guided laser cutting processing apparatus according to the present invention.

Fig. 22 is a schematic view of a workpiece holder in a workpiece stage device of a water-guided laser cutting processing apparatus according to the present invention.

Fig. 23 is a second schematic view of a workpiece holder in a workpiece stage device of a water-guided laser cutting machining apparatus of the present invention.

Fig. 24 is a schematic view of a workpiece holder in a workpiece stage device of a water-guided laser cutting processing apparatus according to the present invention.

Fig. 25 is a schematic view of a C-axis rotating mechanism for removing a work rest in a work rest apparatus of a water-guided laser cutting machine according to the present invention.

Fig. 26 is a second schematic view of a C-axis rotating mechanism for removing a work rest in a work rest apparatus of a water-guided laser cutting machining apparatus according to the present invention.

Fig. 27 is an exploded view of a workpiece holder removal C-axis rotation mechanism in a workpiece stage apparatus of a water-guided laser cutting machining apparatus of the present invention.

Fig. 28 is an exploded view of a workpiece holder in a workpiece stage apparatus of a water-guided laser cutting machining apparatus of the present invention.

Fig. 29 is an exploded view of a workpiece holder in a workpiece stage device of a water-guided laser cutting machining apparatus of the present invention.

Fig. 30 is a schematic view of a workpiece rest sliding table in a workpiece carrier device of a water-guided laser cutting processing device according to the first embodiment of the invention.

Fig. 31 is a schematic diagram of a workpiece rest sliding table in the workpiece carrier device of the water-guided laser cutting processing device of the invention.

FIG. 32 is a flow chart of a method of water-guided laser cutting processing of the present invention.

Description of the embodiments

Referring to fig. 1-4, the overall structure of the water-guided laser cutting device of the present invention is shown. The water-guided laser cutting processing device comprises a machine 100, a machine head device 200 and a workpiece carrying platform device 300, wherein the machine head device 200 and the workpiece carrying platform device 300 are installed on the machine 100, and a machine head in the machine head device 200 is provided with a machine head module (specifically, an LMJIP module of SYNOVA company, not specifically shown in the figure) of laser microjet. The water jet impacts the processing surface during processing; then laser pulses are emitted and via water jet, the material absorbs heat; the absorbed laser energy produces a plasma layer separating water and material; the laser pulse is completed, the plasma phenomenon is ended, and the water jet cools the material; the water jet completely takes away heat by convection; thereby realizing high-precision cutting processing of the workpiece.

In the present invention, the machine head device 200 and the workpiece stage device 300 can both move on the machine 100, wherein: the handpiece of the handpiece device 200 can perform one-degree-of-freedom motion, namely, can vertically move along the axis A; the workpiece stage device 300 can perform four degrees of freedom motion, i.e., the entirety of the workpiece stage device 300 can move horizontally along the X-axis and the Y-axis, and the workpiece loaded on the workpiece stage device 300 can swing around the B-axis and rotate around the C-axis. Here, the XYZ axis of the workpiece table coordinate system is used as a reference (the machine longitudinal direction is an X axis, the transverse direction is a Y axis, the normal direction of the plane in which the X axis and the Y axis are located is a Z axis), the a axis is parallel to the Z axis, the C axis is parallel to the Z axis, and the B axis is parallel to the Y axis. When the workpiece carrier device 300 is processed, the height of the machine head device 200 is adjusted, the workpiece carrier device 300 is horizontally moved below the machine head device 200, and then the workpiece is swung or rotated, so that the machine head 200 can cut the workpiece.

In the water-guided laser cutting device, a machine head in a machine head device 200 of the water-guided laser vertically moves along an A axis, a workpiece carrying table device 300 can horizontally move along an X axis and a Y axis, and a workpiece loading table in the workpiece carrying table device and a workpiece loaded on the workpiece carrying table device can swing around a B axis and rotate around a C axis. Therefore, a five-axis machine head in the traditional cutting and processing device is changed into a one-axis machine head and four-axis workpiece carrier combined structure, wherein the water guide laser machine head only moves in the vertical direction, so that the micro water column beam path is prevented from presenting a curve, the stability of the micro water column beam is conveniently kept, and the cutting quality of the workpiece is guaranteed.

Referring to fig. 5-6, the machine includes a machine body 102 and a machine door frame 101, and the machine door frame 101 is located above the machine body 102. The machine tool body 102 and the machine door frame 101 are integrally cast and formed by minerals, and a plurality of assembly holes are preset on the machine tool body 102 and the machine door frame 101 for assembling corresponding mechanisms, modules or parts, so that the machine has the advantages of high precision, shock absorption, thermal stability and corrosion resistance.

As shown in fig. 1 to 6, the machine gantry 101 has a door frame structure, and the upright posts on both sides of the machine gantry 101 are integrally cast with the machine bed 102 to form a door opening 110 into and out of the workpiece stage device 300. The head mount 105 is provided on the front face of the top beam of the gantry 101 to assemble the head apparatus 200. Specifically, the nose mounting portion 105 is specifically a protruding portion, and a plurality of mounting bars are provided on a side surface of the protruding portion, and mounting holes are reserved thereon for connecting the a-axis seat plate of the nose device 200, so that the nose device 200 can be mounted on the nose mounting portion side surface 106 by means of fasteners such as screws.

The machine tool body 102 is a horizontal platform structure and is used for carrying the workpiece carrying platform device 300 for translation, wherein the workpiece carrying platform device 300 can translate to the lower part of the machine head device 200. Specifically, a workpiece rack sliding table mounting portion is provided at the top of the machine body 102, and includes an X-axis sliding rail mounting portion 107 with a plurality of reserved assembly holes and an X-axis motor stator mounting portion 108, where the X-axis sliding rail mounting portion 107 and the X-axis motor stator mounting portion 108 extend to a door opening 110 below the machine body door frame 101. After the assembly of the X-axis sliding rail by the sliding rail mounting part 107 and the assembly of the X-axis linear motor stator by the X-axis motor stator mounting part 108 are completed, the workpiece frame sliding table can longitudinally slide along the X-axis by matching with the X-axis linear motor rotor on the workpiece frame sliding table. When the workpiece stage device 300 is assembled in place, the workpiece stage device 300 is longitudinally slid on the machine tool body 102 along the X axis by the X-axis linear motor drive, and the workpiece stage device 300 is transversely slid on the machine tool body 102 along the Y axis by the Y-axis linear motor drive, so that the workpiece moves to a processing station below the machine tool device 200. Here, the workpiece rack sliding table of the workpiece stage device 300 is configured with a folding dust seal 104 to maintain cleanliness, and the dust seal 104 is simultaneously connected to the dust seal baffle 1041 of the machine tool body 102, specifically, the dust seal baffle 1041 is mounted at the end of the X-axis sliding rail of the workpiece rack sliding table, so that the assembly is convenient.

In the invention, the bottom of the machine tool body 102 is provided with a plurality of machine adjusting positions 109 which are respectively and correspondingly provided with the machine adjusting devices 103, so that the machine tool body 102 can be conveniently and reliably adjusted to the corresponding height and kept in a horizontal state.

Referring to fig. 7 to 9, the structure of the machine adjusting device 103 of the water-guided laser cutting machine according to the present invention is shown. The machine adjusting device 103 includes an upper module 1031, a middle module 1033, and a lower module 1032, which are respectively wedge-shaped, wherein: the section of the middle module 1033 is isosceles trapezoid; the upper module 1031 and the lower module 1032 are symmetrical, and their cross sections are respectively approximately right trapezoid; when the upper module 1031, the middle module 1033 and the lower module 1032 are mated together, a square overall structure is formed.

Specifically, a notch 10332 is arranged in the middle of the middle module; the upper module has a pin hole 10313 and a screw hole 10312 corresponding to the opening portion of the notch 10332, and the lower module 1032 also has a pin hole (not shown) and a screw hole (not shown) corresponding to the opening portion. During assembly, the pin 1037 with holes is installed in the pin holes of the upper and lower modules 1031 and 1032, and then the bolt 1036 is inserted into the screw hole of the pin 1037 and the screw hole of the connecting portion 10331 of the middle module 1033 and screwed, thereby achieving the longitudinal positioning of the upper, middle and lower modules 1031 and 1033. In particular, the side of the upper module 1031 is provided with a rectangular locking groove 10311, the side of the lower module 1032 is provided with a rectangular locking groove 10321, the pair of locking grooves are arranged in an eight shape, the lock catch 1034 is fixed on the side of the middle module 1033 through lock catch screws 1035, and when the middle module 1033 is installed between the upper module 1031 and the lower module 1032, two side locking claws of the lock catch 1034 are respectively arranged in the locking groove 10311 and the locking groove 10321, so that the upper module 1031, the middle module 1033 and the lower module 1032 can be transversely locked. Here, the machine tool adjusting device 103 is disposed at each machine tool adjusting position 109 of the machine tool body 102, and the machine tool adjusting device 103 and the machine tool body 102 can be easily locked by inserting screws through screw holes of the machine tool adjusting portion 109 and screw holes of the upper module 1031 and the lower module 1032.

Referring to fig. 10-11, the structure of the head device and the workpiece stage device of the water-guided laser cutting processing device of the present invention is shown. The handpiece device comprises a handpiece 201 and an A-axis translation mechanism 202, and the handpiece installation part 105 is assembled on the front surface of the top cross beam of the gantry 101 and can vertically move along the A-axis. The workpiece stage device 300 includes a workpiece holder and a workpiece holder slide table, wherein: the workpiece frame is composed of a workpiece frame support 305, a workpiece swinging frame 302 and the like, the workpiece frame support 305 is fixed on a workpiece frame sliding table, the workpiece swinging frame 302 is arranged on the workpiece frame support 305 and can swing around a B axis under the drive of a B axis swinging mechanism 304, the workpiece 301 is rotatably arranged on the workpiece swinging frame 302 and can rotate around a C axis under the drive of a C axis rotating mechanism 303; the workpiece rest sliding table is provided with an X-axis translation mechanism 307 and a Y-axis translation mechanism 306, and the workpiece rest is driven by the X-axis translation mechanism and the Y-axis translation mechanism to horizontally slide along the X-axis or the Y-axis along with the workpiece rest sliding table. When the workpiece holder is positioned below the handpiece 201, the workpiece 301 is oscillated or rotated to perform a cutting process. In this way, the five-axis machine head in the traditional cutting processing device is changed into a combined structure of a one-axis machine head and a four-axis workpiece carrier, and the water guide laser machine head 201 can only move in the vertical direction, so that the stability of micro water column bundles is convenient to keep, the cutting quality of the workpiece is beneficial to ensuring, and the machine head device 200 and the workpiece carrier device 300 are further described in detail below.

Referring to fig. 12-17, the structure of the head device of the water-guided laser cutting processing device of the present invention is shown. The machine head device 200 comprises a machine head 201 and an A-axis translation mechanism 202, wherein the A-axis translation mechanism 202 is arranged on an A-axis seat plate 203, and the A-axis seat plate 203 can be fixedly assembled to a machine head installation part arranged on the front surface of a cross beam at the top of a machine table portal 101 through screws so as to vertically move along the A-axis; only a head module 2011 is schematically shown in the head 201, and is assembled on a head seat 2012, the head seat 2012 is fixed with a head coupling plate 2027, and the head module 2011 can move vertically along the a axis under the drive of the a axis translation mechanism 202, so that the height position of the head module 2011 can be adjusted. In particular, since the head module 2011 is only vertically movable, the stability of the micro water column beam is maintained, and the stable transmission of the laser beam coupled in the micro water column beam is facilitated, so that the high-precision cutting operation is ensured to be influenced.

The a-axis translation mechanism 202 of the present invention may take a variety of forms, and is described below as a compact, efficient, reliable, and economical mechanism.

As shown in fig. 12 to 17, the a-axis translation mechanism 202 is constituted by an a-axis motor 2021, an a-axis coupling 2022, an a-axis coupling box 2023, an a-axis driving lever 2024, an a-axis driving lever support 2025, an a-axis driving lever coupling block 2026, a head coupling plate 2027, an a-axis slide 2028, an a-axis slider 2029, a head travel switch 20210, a head detection block 20211, a head detection block 20212, and the like. Here, the a-axis motor 2021 is a stepper motor, so as to accurately control the rotation of the motor; the a-axis coupling 2022 is a diaphragm coupling, and the relative displacement of the coupled shafts can be compensated for by elastic deformation of the diaphragm. The assembly mode of the A-axis translation mechanism 202 is as follows: the A-axis driving rod support 2025, the A-axis sliding rail 2028 and the A-axis coupling box 2023 are fixedly assembled on the A-axis seat plate 203, two ends of the A-axis driving rod 2024 are supported on the A-axis driving rod support 2025, the A-axis coupling 2022 is assembled on the A-axis coupling box 2023, the A-axis driving rod 2024 is connected with the A-axis motor 2021 through the A-axis coupling 2022, the A-axis driving rod connecting block 2026 is fixedly assembled on the A-axis driving rod 2024, the machine head connecting plate 2027 is fixedly connected with the A-axis driving rod connecting block 2026 on the A-axis driving rod 202, the machine head seat plate 2012 is fixedly connected with the machine head connecting plate 2027, and the machine head module 2011 is fixedly assembled on the machine head seat plate 2012. When the a-axis motor 2021 rotates forward or backward, the a-axis coupler 2022 generates relative displacement by the deformation of the diaphragm, thereby driving the a-axis driving rod 2024 and the a-axis driving rod coupling block 2026 thereon to move up and down together, and further causing the head coupling plate 2027, the head seat 2012 and the head module 2011 to move up and down together. Thus, the head module 2011 moves up and down along with the a-axis driving rod 2024, and thus the head 201 can vertically move along the a-axis.

In order to keep stable movement of the handpiece 201, two parallel a-axis sliding rails 2028 are arranged on the a-axis seat 203, the two a-axis sliding rails 2028 are respectively provided with a plurality of a-axis sliding blocks 2029, the a-axis sliding blocks 2029 are slidably assembled on the a-axis sliding rails 2028, and the handpiece connecting plate 2027 is fixedly connected with the a-axis driving rod connecting block 2026 and the a-axis sliding blocks 2029 at the same time, so that stable sliding of the handpiece 201 is ensured. Here, the a-axis slider 2029 may be assembled by a split slider saddle 20291 and a slider pad 20292, where the slider saddle 20291 is sleeved on the a-axis slide 2028, and the slider pad 20292 is connected to the nose connecting plate 2027 simply by tightening screws, so that the assembly of the structure is quite convenient.

The present invention needs to detect the position of the head and limit the travel thereof, for which, a head travel switch 20210, a head detection block 20211 and a head detection block 20212 are installed at the upper and lower positions of the a-axis seat plate 203, and at the same time, a head coupling plate 2027. When the handpiece 201 moves vertically up and down along the a-axis together with the head coupling plate 2027, the height position of the handpiece can be detected; meanwhile, a head travel switch 20210 provided on the a-axis seat plate 203 can limit the travel of the head 201.

Referring to fig. 18-31, the construction of a workpiece stage device of a water-guided laser cutting machining apparatus of the present invention is shown. The workpiece carrier device 300 is composed of two main structures of a workpiece holder and a workpiece holder sliding table.

As shown in fig. 18 to 21, the work rest is constituted by a work rest support 305, a work rest swing frame 302, and the like, the work rest support 305 is fixed to the work rest slide table, and the work rest swing frame 302 is rotatably attached to the work rest support 305; the work rest is provided with a B-axis swinging mechanism 304 and a C-axis rotating mechanism 303: the workpiece swinging frame 302 can swing around the B axis under the drive of the B axis swinging mechanism 304; the workpiece 301 is rotatably mounted on a workpiece swing frame 302 and is rotatable about the C-axis by a C-axis rotation mechanism 303, wherein the workpiece 301 on the workpiece loading head 3037 has a middle cross section flush with the B-axis swing axis. Thus, when the workpiece swing frame 302 is turned 180 degrees, the front and back working surfaces of the workpiece are positioned at the same horizontal position.

As shown in fig. 18 to 21, the workpiece rest sliding table is provided with an X-axis translation mechanism 307 and a Y-axis translation mechanism 306, wherein the Y-axis translation mechanism 306 is composed of electrical devices such as a configuration Y-axis sliding plate 3061, a Y-axis sliding rail 3062, a Y-axis drag chain 3060, and the like, the X-axis translation mechanism 307 is composed of electrical devices such as a configuration X-axis sliding plate 3071, an X-axis sliding rail 3072, an X-axis drag chain 3070, and the like, and the workpiece rest can slide horizontally on the machine along the X-axis and the Y-axis along with the workpiece rest sliding table under the driving of the X-axis translation mechanism 307 and the Y-axis translation mechanism 306. When the work piece holder is positioned below the head 201, the head 201 is vertically moved to a certain height, and then the work piece 301 is swung or rotated, so that the work piece 301 can be cut.

As shown in fig. 22 to 29, the work rest includes a work rest support 305, a work rest 302, a B-axis swing mechanism 304, and a C-axis rotation mechanism, the work rest support 305 and the work rest 302 being respectively L-shaped; the bottom wall 3051 of the work rest support 305 is fixed with the work rest sliding table; the side wall 3022 of the workpiece swing frame 302 is rotatably mounted on the side wall 3052 of the workpiece frame support 305, and swings under the drive of the B-axis swing mechanism 304; the workpiece loading head 3037 rotatably mounts a top wall 3021 of the workpiece swing frame 302, the workpiece loading head 3037 being capable of loading the workpiece 301 by glue bonding or otherwise, the workpiece loading head 3037 and the workpiece 301 loaded thereby being capable of being rotated by the C-axis rotation mechanism 303. Here, the present invention is schematically distinguished by 301A (large workpiece) and 301B (small workpiece) for workpieces 301 of different specifications, respectively, and does not represent the actual structure of the workpieces.

The B-axis wobbler 304 is a motor direct drive mechanism, and includes a B-axis motor 3041 and a B-axis speed reducer 3042, the B-axis motor 3041 being a stepping motor, and the B-axis speed reducer 3042 being a turntable speed reducer. The B-axis oscillating machine 304 is assembled in the following manner: the side wall 3052 of the work support 305 is provided with a through hole 3054, the B-axis reducer 3041 is mounted through the through hole 3054, the housing of the B-axis motor 3041 is fixed to the housing of the B-axis reducer 3041 by bolts, the power shaft of the B-axis motor 3041 is coupled to the turntable of the B-axis reducer 3041, and the turntable of the B-axis reducer 3041 is fixed to the side wall 3022 of the work swinging frame 302 by bolts. Thus, when the B-axis motor 3041 rotates forward or backward, the work swinging frame 302 can be driven to swing around the B-axis. Here, the sensor 3053 is mounted on the side wall 3052 of the work piece holder 305, and the detection block 3027 is provided on the side wall 3022 of the work piece swing frame 302, so that the swing angle of the work piece swing frame 302 can be easily detected.

The C-axis rotation mechanism 303 is a motor drive+belt transmission mechanism, and includes a C-axis driving mechanism and a C-axis driven mechanism, the C-axis driving mechanism is mounted on a driving mechanism mounting position 3023 of a top wall 3021 of the workpiece swing frame 302, the C-axis driven mechanism is mounted on a driven mechanism mounting position 3026 of the top wall 3021 of the B-axis workpiece swing frame 302, and transmission is performed between the C-axis driving mechanism and the C-axis driven mechanism through a transmission belt, so as to drive the workpiece loading head 3037 and the workpiece to rotate around the C-axis. Here, the belt is preferably a timing belt 3038, which has no relative slip with the pulley, so that a strict transmission ratio can be ensured.

In the present invention, the C-axis driving mechanism is composed of a C-axis motor 30313, a C-axis coupling plate 30312, a C-axis speed reducer 30310, a driving shaft 30311, a C-axis seat plate 3039, etc., wherein: the C-axis motor 30313 is a stepping motor, which serves as a power source of the C-axis rotating mechanism 303; the C-axis speed reducer 30310 is a harmonic speed reducer, and a flexible bearing is assembled on the wave generator to enable the flexible gear to generate controllable elastic deformation, and the flexible gear is meshed with a rigid gear to transmit motion and power for gear transmission. The concrete assembly mode of the C-axis driving mechanism is as follows: the housing of the C-axis motor 30313, the C-axis coupling plate 30312, the housing of the C-axis reducer 30310, and the C-axis seat plate 3039 are integrally connected by bolts and fixedly assembled to the top wall 3021 of the workpiece swing frame 302 by the C-axis seat plate 3039; the C-axis motor 30313, the C-axis speed reducer 30310 and the driving shaft 30311 are sequentially coupled, and the specific assembly mode may be: the wave generator of the C-axis reducer 30310 is connected with a power shaft of the C-axis motor 30313, a rigid gear of the C-axis reducer 30310 is fixed with a housing of the C-axis reducer 30310, a flexible gear of the C-axis reducer 30310 is mounted on an output shaft of the C-axis reducer 30310, a chassis of the driving shaft 30311 is fixed with the flexible gear of the C-axis reducer 30310, and a driving belt pulley can be arranged at the top end of the driving shaft 30311 to wind the synchronous belt 3038.

In the present invention, the C-axis driven mechanism is composed of a driven shaft 3031, a driven seat plate one 3033, a driven bearing one 3032, a driven seat plate two 3036, a driven bearing two 3034, an adjusting nut 3035, a workpiece loading head 3037, and the like: the driven shaft 3031 is rotatably assembled above and below the top wall 3021 of the workpiece swing frame 302 by an upper support composed of a driven seat plate one 3033 and a driven bearing one 3032, and a lower support composed of a driven seat plate two 3036 and a driven bearing two 3034; a driven pulley can be arranged at the top end of the driving shaft 30311 to wind the synchronous belt 3038; a workpiece loading head 3037 is arranged at the bottom end of the driving shaft 30311, and the workpiece loading head 3037 is preferably of a hoop type mounting structure, so that the mounting, dismounting and position adjustment are convenient; the adjustment nut 3035 is an externally open nut that fits over the driven shaft and is positioned between the lower support and the workpiece loading head 3037 to facilitate adjustment of the position of the loading head 3037.

In the above-described C-axis rotating mechanism 303, the C-axis motor 30313 is connected to the driving shaft 30311 through the C-axis speed reducer 30310; the bottom end of a driven shaft 3031 of the C-axis driven mechanism is fixedly provided with a workpiece loading head 3037, and the workpiece loading head 3037 can load the workpiece 301 by adopting glue bonding and other modes; the timing belt 3038 is wound around a driving shaft 30311 (optionally, a driving pulley, not shown) and a driven shaft 3031 (optionally, a driven pulley, not shown) respectively, for transmitting power between the driving shaft 30311 and the driven shaft 3031. When the C-axis motor 30313 rotates, the driving shaft is driven to rotate by the C-axis speed reducer 30310, and then the driven shaft 3031 is driven to rotate by the synchronous belt 3038, so that the workpiece loading head 3037 on the driven shaft 3031 is driven to rotate, and finally the workpiece 301 is driven to rotate around the C-axis. In particular, the B-axis workpiece swing frame 302 is provided with a sensor 3024 for detecting the rotation angle of the workpiece 301, and the fixed mounting sensor 3024 may be fixed to the top wall 3021 of the B-axis workpiece swing frame 302 by a nut 3025, and may be specifically brought into proximity with and aligned with the edge portion of the workpiece 301.

The invention optimizes the installation positions of the B swinging mechanism and the C shaft rotating mechanism, wherein one of the installation positions is as follows: the intermediate cross section of the workpiece 301 is preferably aligned with the axis of the B-axis motor 3041 and the B-axis speed reducer 3042, i.e., the intermediate cross section of the workpiece 301 on the workpiece loading head 3037 is aligned with the B-axis swing axis, so that the intermediate cross section of the workpiece 301 is always on the B-axis swing axis when the B-axis swinging motor 304 drives the workpiece swing frame 302 and the workpiece 301 thereon to swing. Specifically, the mounting position of the workpiece loading head 3037 can be made to meet the assembly requirements by adjusting the adjustment nut 3035 as described above.

As shown in fig. 30 to 31, the workpiece rest sliding table includes an X-axis translation mechanism 307 and a Y-axis translation mechanism 306, wherein the X-axis translation mechanism 307 is carried on the machine bed 102 to move longitudinally, and the Y-axis translation mechanism 306 is carried on the X-axis translation mechanism 307 to move laterally. The X-axis translation mechanism 307 and the Y-axis translation mechanism 306 are driven by linear motors, so that the dynamic response is faster, as will be further described below.

The X-axis translation mechanism 307 is composed of an X-axis slide plate 3071, an X-axis slide rail 3072, an X-axis linear motor stator 3073, an X-axis linear motor rotor 3074, an X-axis motor stator base plate 3075, an X-axis saddle 3076, an X-axis stroke limiter 3077, and the like, and the specific assembly modes are as follows: the two X-axis slide rails 3072 are longitudinally mounted on an X-axis slide rail mounting portion 107 of the machine tool body 102 along the machine tool body 102, the X-axis motor stator seat plate 3075 is longitudinally mounted on an X-axis motor stator mounting portion 108 of the machine tool body 102 along the machine tool body 102, X-axis slide saddles 3076 are mounted on two sides of the X-axis slide plate 3071, the X-axis slide plate 3071 is slidably mounted on the X-axis slide rails 3072 through the X-axis slide saddles 3076, the X-axis linear motor stator 3073 is fixedly mounted on the top surface of the X-axis motor stator seat plate, and the X-axis linear motor rotor 3074 is mounted on the bottom surface of the X-axis slide plate 3071. Thus, the X-axis linear motor can drive the shaft slide 3071 to slide along the X-axis slide rail 3072. Here, an X-axis stroke limiter 3077 is further installed on the top surface of the X-axis motor stator plate 3075 so as to limit the stroke of the X-axis slide plate 3071.

The Y-axis translation mechanism 306 is composed of a Y-axis slide 3061, a Y-axis slide 3062, a Y-axis linear motor stator 3063, a Y-axis linear motor mover 3064, an X-axis slide 3071, a work rest assembly plate 3065, a Y-axis saddle 3066, a Y-axis travel limiter 3067, and the like, and the specific assembly modes are as follows: two Y-axis sliding rails 3062 are transversely assembled on the top of the X-axis sliding plate 3071 along the X-axis sliding plate 3071, Y-axis sliding seats 3066 are assembled on two sides of the Y-axis sliding plate 3061, the Y-axis sliding plate 3061 is slidably mounted on the Y-axis sliding rails 3062 through the Y-axis sliding seats 3066, a Y-axis linear motor stator 3063 is fixedly mounted on the top surface of the X-axis sliding plate 3071, a Y-axis linear motor rotor 3064 is mounted on the bottom surface of the Y-axis sliding plate 3061, and a workpiece frame base plate 3065 is arranged on the top of the Y-axis sliding plate 3061 to mount the workpiece frame support 305. Thus, the Y-axis linear motor can drive the Y-axis sliding plate 3061 to slide along the Y-axis sliding rail 3062. Here, the top surface of the X-axis slide 3071 also mounts a shaft travel limiter 3067 to limit the travel of the Y-axis slide 3061.

In the present embodiment, the Y-axis translation mechanism 306 is carried on the X-axis translation mechanism 307; it is obvious that the X-axis translating mechanism 307 may also be carried on the Y-axis translating mechanism 306, i.e., the Y-axis translating mechanism 306 and the X-axis translating mechanism 307 are upside down. The latter is an equivalent structure of the former, and will not be described in detail.

Thus, the workpiece stage device can be rapidly horizontally moved by the X-axis translation mechanism 307 and the Y-axis translation mechanism 306 of the workpiece stage slide. When the work rest is positioned below the head 201, the head 201 is moved to a certain height, and then the work 301 is swung or rotated, so that the work 301 can be cut with high precision.

The water-guide laser cutting processing device has good processing quality and high processing efficiency, and is very suitable for processing silicon carbide wafers:

referring to fig. 32, a flow of the water-guided laser cutting processing method of the present invention is shown, as described in detail below.

(1) And adhering the blank workpiece to a workpiece loading head on a workpiece frame in the workpiece carrying table device, and adjusting the position of the workpiece loading head to enable the middle cross section of the workpiece to be level with the swing axis of the B shaft.

(2) And starting the X-axis translation mechanism and the Y-axis translation mechanism, and moving the workpiece frame sliding table until the workpiece is positioned below the machine head device.

(3) And starting the A-axis translation mechanism, and adjusting the machine head to be suitable for processing height.

(4) And starting the C-axis rotating mechanism to enable the workpiece to rotate around the C-axis, and simultaneously starting a machine head module of the machine head laser microjet until the circumferential surface on the workpiece is cut.

(5) And starting the B-axis swinging mechanism, and turning the workpiece loading head and the workpiece on the workpiece frame by 180 degrees around the B-axis.

(6) And starting the C-axis rotating mechanism to enable the workpiece to rotate around the C-axis, and simultaneously starting the machine head module of the machine head laser microjet until the lower circumferential surface of the workpiece is cut.

(7) And starting the B-axis swinging mechanism, and turning the workpiece loading head and the workpiece on the workpiece frame by 90 degrees around the B-axis.

(8) And starting the Y-axis translation mechanism to translate the workpiece along the Y-axis by a distance of preset sheet thickness.

(9) And starting an X-axis translation mechanism to translate the workpiece along the X-axis, and starting a machine head module of the machine head laser microjet until the wafer is cut.

Repeating the steps (8) and (9) until the workpiece is completely cut into slices.

The blank is made of silicon carbide (SiC) material, and is particularly used for cutting out a wafer. The water channel laser cutting processing device and the processing method are adopted to process the wafer, so that the efficiency is high, and the product quality is ensured. Obviously, the processing method of the water channel laser cutting processing device can also be popularized to processing of other materials, and the description is omitted.

The foregoing is merely a preferred embodiment of the present invention, and it should be noted that the above-mentioned preferred embodiment should not be construed as limiting the invention, and the scope of the invention should be defined by the appended claims. It will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the spirit and scope of the invention, and such modifications and adaptations are intended to be comprehended within the scope of the invention.

Claims (10)

1. The water-guided laser cutting processing device comprises a machine table, a machine head device and a workpiece carrying table device, wherein the machine head device is arranged on the machine table, the machine head device comprises a machine table body and a machine table door frame, the machine head is provided with the machine head device, the machine table door frame is arranged above the machine table body, the machine table body is provided with the machine head device, the machine table body carries the workpiece carrying table device, the machine head device is provided with an A-axis translation mechanism to drive the machine head to vertically move along the A axis, the workpiece carrying table device is provided with an X-axis translation mechanism, a Y-axis translation mechanism, a B-axis swing mechanism and a C-axis rotation mechanism to drive the whole workpiece carrying table device to horizontally move along the X axis and the Y axis, and the workpiece carrying head arranged on the workpiece carrying table device is driven to swing around the B axis and rotate around the C axis, wherein the middle cross section of a workpiece on the workpiece carrying head can be adjusted to be flush with the B-axis swing axis.

2. The water-guided laser cutting machining apparatus of claim 1, wherein the head includes a head seat plate and a head module, the head module is fixedly assembled to the head seat plate to be driven by an a-axis translation mechanism, the a-axis translation mechanism includes an a-axis motor, an a-axis coupler box, an a-axis drive rod support, an a-axis drive rod coupling block, an a-axis slide rail, an a-axis slider and a head coupling plate, the a-axis motor is a stepper motor, the a-axis coupler is a diaphragm coupler, the a-axis drive rod support, the a-axis coupler box and the a-axis slide rail are fixedly assembled to the a-axis seat plate, both ends of the a-axis drive rod are supported to the a-axis drive rod support, the a-axis drive rod is coupled to the a-axis motor via the a-axis coupler, the a-axis drive rod coupling block is fixedly assembled to the a-axis drive rod, the a-axis slider is slidably assembled to the a-axis slide rail, and the head seat plate is fixedly connected to the a-axis slider.

3. The water-guided laser cutting machining apparatus of claim 1, wherein the workpiece carrier device comprises a workpiece carrier and a workpiece carrier sliding table, the workpiece carrier comprises an L-shaped workpiece carrier support and an L-shaped workpiece swinging frame, the bottom wall of the workpiece carrier support is fixed with the workpiece carrier sliding table, the side wall of the workpiece swinging frame is rotatably mounted on the side wall of the workpiece carrier support, the workpiece loading head is rotatably mounted on the top wall of the workpiece swinging frame, the workpiece swinging frame can swing around the B axis under the driving of the B axis swinging mechanism, the workpiece loading head can rotate around the C axis under the driving of the C axis rotating mechanism, and the workpiece carrier sliding table can drive the workpiece carrier to move horizontally on the machine table along the X axis and the Y axis under the driving of the X axis translating mechanism and the Y axis translating mechanism.

4. The water-guided laser cutting machining apparatus of claim 3, wherein the B-axis oscillating mechanism comprises a B-axis motor and a B-axis speed reducer, wherein the B-axis motor is a stepper motor, the B-axis speed reducer is a turntable speed reducer, the B-axis speed reducer is penetratingly mounted in a through hole formed in a side wall of the workpiece support, a housing of the B-axis motor is fixed with a housing of the B-axis speed reducer, a power shaft of the B-axis motor is coupled with a turntable of the B-axis speed reducer, and the turntable of the B-axis speed reducer is fixedly connected with a side wall of the workpiece oscillating frame.

5. The water-guided laser cutting machining apparatus of claim 3, wherein the C-axis rotating mechanism comprises a C-axis driving mechanism and a C-axis driven mechanism mounted on a top wall of the workpiece swing frame, and both ends of the synchronous belt are wound around the C-axis driving mechanism and between the C-axis driven mechanisms for transmission; the C-axis driving mechanism comprises a C-axis motor, a C-axis connecting disc, a C-axis speed reducer, a driving shaft and a C-axis seat plate, wherein the C-axis motor is a stepping motor, the C-axis speed reducer is a harmonic speed reducer, a shell of the C-axis motor, the C-axis connecting disc, a shell of the C-axis speed reducer and the C-axis seat plate are connected into a whole and are fixedly assembled on the top wall of the workpiece swinging frame through the C-axis seat plate, the C-axis motor, the C-axis speed reducer and the driving shaft are sequentially connected in an axis manner, a wave generator of the C-axis speed reducer is connected with a power shaft of the C-axis motor, a rigid wheel of the C-axis speed reducer is fixed with a shell of the C-axis speed reducer, a flexible wheel of the C-axis speed reducer is arranged on an output shaft of the C-axis speed reducer, and a chassis of the driving shaft is fixed with a flexible wheel of the C-axis speed reducer; the C-axis driven mechanism comprises a driven shaft, a driven seat plate I, a driven bearing I, a driven seat plate II, a driven bearing II, an adjusting nut and a workpiece loading head, wherein the driven shaft is rotatably assembled on the top wall of the workpiece swinging frame through an upper support formed by the driven seat plate I and the driven bearing I, a lower support formed by the driven seat plate II and the driven bearing II, the workpiece loading head is arranged at the bottom end of the driven shaft, and the adjusting nut is sleeved on the driven shaft and is positioned between the lower support and the workpiece loading head.

6. The water-guided laser cutting machine of claim 3, wherein the X-axis translation mechanism comprises an X-axis slide plate, an X-axis slide rail, an X-axis linear motor stator, an X-axis linear motor mover, an X-axis motor stator seat plate and an X-axis saddle, the X-axis slide rail is longitudinally mounted on the top surface of the X-axis slide rail mounting portion of the machine tool along the machine tool, the X-axis motor stator seat plate is longitudinally mounted on the top surface of the X-axis motor stator mounting portion of the machine tool along the machine tool, the X-axis slide plates are provided with X-axis saddle on both sides thereof, the X-axis slide plate is slidably mounted on the X-axis slide rail through the X-axis saddle, the X-axis linear motor stator is fixedly mounted on the top surface of the X-axis motor stator seat plate, and the X-axis linear motor mover is mounted on the bottom surface of the X-axis slide plate.

7. The water-guided laser cutting process apparatus of claim 6, wherein the Y-axis translation mechanism comprises a Y-axis slide, a Y-axis slide rail, a Y-axis linear motor stator, a Y-axis linear motor mover, an X-axis slide, a workpiece holder assembly plate, and a Y-axis saddle, the Y-axis slide rail is assembled on the top surface of the X-axis slide along the lateral direction of the X-axis slide, the Y-axis slide is assembled on both sides of the Y-axis slide, the Y-axis slide is slidably mounted on the Y-axis slide rail via the Y-axis saddle, the Y-axis linear motor stator is fixedly mounted on the top surface of the X-axis slide, the Y-axis linear motor mover is mounted on the bottom surface of the Y-axis slide, and the workpiece holder assembly plate is fixedly assembled on the top surface of the Y-axis slide to carry the workpiece holder support.

8. The water-guided laser cutting machining apparatus of claim 1, wherein a plurality of machine adjusting devices are arranged at the bottom of the machine tool body, and each machine adjusting device comprises a wedge-shaped upper module, a middle module and a lower module; the middle part of the middle module is provided with a notch, the upper module and the lower module are provided with pin holes corresponding to the opening parts of the notch, and the upper module, the middle module and the lower module are longitudinally positioned by installing bolts with holes in the pin holes of the upper module and the lower module and penetrating the bolts into the screw holes of the bolts and the screw holes of the connecting part of the middle module; the side surfaces of the upper module and the lower module are respectively provided with a rectangular locking groove in a splayed arrangement, the lock catch is fixed on the side surface of the middle module through lock catch screws, and when the middle module is arranged between the upper module and the lower module, the upper module, the middle module and the lower module are transversely locked through the corresponding locking grooves by the locking claws arranged on the two sides of the lock catch.

9. A water-guided laser cutting method, characterized in that a cutting process is performed by using the water-guided laser cutting device according to any one of claims 1 to 9, comprising the steps of: adhering the blank workpiece to a workpiece loading head on a workpiece frame in a workpiece carrying table device, and adjusting the position of the workpiece loading head to enable the middle cross section of the workpiece to be level with the swing axis of the B shaft; starting an X-axis translation mechanism and a Y-axis translation mechanism, and moving the workpiece frame sliding table until the workpiece is positioned below the machine head device; starting an A-axis translation mechanism, and adjusting the machine head to be suitable for processing height; starting a C-axis rotating mechanism to enable the workpiece to rotate around the C-axis, and simultaneously starting a machine head module of the machine head laser microjet until the circumferential surface on the workpiece is cut; starting a B-axis swinging mechanism, and turning a workpiece loading head and a workpiece on a workpiece frame around the B-axis by 180 degrees; starting a C-axis rotating mechanism to enable the workpiece to rotate around the C-axis, and simultaneously starting a machine head module of the machine head laser microjet until the lower circumferential surface of the workpiece is cut; starting a B-axis swinging mechanism, and turning a workpiece loading head and a workpiece on a workpiece frame by 90 degrees around the B-axis; starting a Y-axis translation mechanism to translate the workpiece along the Y-axis by a distance of preset sheet thickness; starting an X-axis translation mechanism to translate a workpiece along an X-axis, and simultaneously starting a machine head module of the machine head laser microjet until a piece is cut; the last two steps are repeated until the workpiece is cut into thin slices.

10. The method of claim 9, wherein the blank is a silicon carbide material for cutting wafers.