CN115753176A - VPX equipment liquid cooling parameter testing method and system - Google Patents
VPX equipment liquid cooling parameter testing method and system Download PDFInfo
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- CN115753176A CN115753176A CN202310023677.6A CN202310023677A CN115753176A CN 115753176 A CN115753176 A CN 115753176A CN 202310023677 A CN202310023677 A CN 202310023677A CN 115753176 A CN115753176 A CN 115753176A
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- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention discloses a method and a system for testing liquid cooling parameters of VPX equipment, wherein the method for testing the liquid cooling parameters of the VPX equipment is more perfect and can detect the temperature change state of a VPX board card in the actual operation process in real time and reliably; when the VPX board is tested, the VPX board runs a self-solidified application program, the utilization rate of a central processing unit is enabled to reach a preset high utilization rate in the running process, and the duration of the test is the preset short use time, so that a high-strength and high-load VPX board test task can be realized, the temperature change condition in the VPX board running process is more truly and effectively recorded and fed back, the test result of the VPX board is more accurate, true and practical in fitting, the improvement of liquid cooling is realized through the test, and the working stability of VPX equipment is further ensured through the test.
Description
Technical Field
The invention relates to the technical field of VPX equipment, in particular to a method and a system for testing liquid cooling parameters of VPX equipment.
Background
VPX devices typically include a chassis and a VPX board card; the VPX board cards are arranged in the chassis, and the number of the VPX board cards is usually a plurality of; the types of the VPX board are various, such as a power supply board, a computing board, a switch board, a control management board, an information processing board, and the like.
A large amount of heat is generated when the VPX equipment works, and in order to ensure the working stability of the VPX equipment, a VPX board card needs to be subjected to heat dissipation treatment; at present, the VPX board card is mainly subjected to heat dissipation treatment in a liquid cooling and cold guiding mode, and the heat dissipation effect is greatly influenced by factors such as the heat conduction performance of a heat conduction structure, the path, the flow speed and the flow of fluid, the temperature of the fluid and the like.
Because the power consumption of a single VPX board card is high, in order to prevent the VPX board card from generating temperature silting due to poor heat dissipation and further prevent the adverse effect of performance reduction of VPX equipment, the liquid cooling performance test of the VPX equipment is required; however, the existing solution for testing the cooling performance of the liquid cooling of the VPX device is simple, the temperature change state of the VPX board in the actual operation process is not detected reliably in real time, and the cooling performance of the liquid cooling needs to be analyzed by a tester according to experience, so that the cooling improvement information of the liquid cooling cannot be obtained directly according to the test result.
Disclosure of Invention
The invention mainly aims to provide a method and a system for testing liquid cooling parameters of VPX equipment, and aims to solve the problems that the existing heat dissipation performance test scheme of the VPX equipment is simple, the temperature change state of a VPX board card in the actual operation process is not detected in real time and reliably, test personnel are required to analyze the heat dissipation performance of liquid cooling according to experience, and the cooling improvement information of the liquid cooling cannot be obtained directly according to the test result.
The technical scheme provided by the invention is as follows:
a VPX equipment liquid cooling parameter test method is applied to a VPX equipment liquid cooling parameter test system; the system comprises VPX equipment, a control module and a parameter acquisition assembly; the VPX equipment comprises a VPX board card; the VPX board card is provided with a liquid cooling pipeline; the liquid cooling pipeline is used for circulating liquid cooling fluid; the VPX board card and the parameter acquisition assembly are in communication connection with the control module; the parameter acquisition assembly comprises a temperature sensor and a flow velocity sensor arranged on the liquid cooling pipeline; an application program is solidified in a storage module of the VPX board card; the method comprises the following steps:
the control module generates first test information and sends the first test information to the VPX board card, wherein the first test information comprises a preset high utilization rate and a preset short service duration;
the VPX board card executes a first test task based on the first test information, wherein the first test task is as follows: the VPX board card runs the application program, so that the utilization rate of a central processing unit of the VPX board card reaches the preset high utilization rate, and the test duration is the preset short utilization duration;
the temperature sensor acquires real-time temperature values of monitoring points of the VPX board card during execution of a first test task and sends the real-time temperature values to the control module;
the control module marks the monitoring points of which the real-time temperature values are greater than the temperature threshold as abnormal points;
the control module generates pipeline improvement information corresponding to the abnormal point based on the real-time flow rate value acquired by the flow rate sensor to serve as liquid cooling improvement information, wherein the pipeline improvement information comprises pipeline inner diameter expansion information and/or pipeline path adjustment information.
Preferably, the monitoring point of the VPX board card comprises a central processing unit, an image processor, a bridge chip, a memory module and a storage module; the control module marks the monitoring points with the real-time temperature values larger than the temperature threshold as abnormal points, and the method comprises the following steps:
the control module acquires a temperature threshold corresponding to each monitoring point;
the control module judges whether the following conditions are met: the duration that the real-time temperature value of any monitoring point is greater than the corresponding temperature threshold value is greater than a first preset duration, wherein the first preset duration is less than the preset short service duration;
if so, the control module marks the monitoring points with the duration time of the real-time temperature value being greater than the temperature threshold value and being greater than the first preset time as abnormal points;
if not, the control module generates normal test result information.
Preferably, the method further comprises the following steps:
the control module generates second test information and sends the second test information to the VPX board card, wherein the second test information comprises a preset low utilization rate and a preset long service life, the preset low utilization rate is smaller than the preset high utilization rate, and the preset long service life is longer than the preset short service life;
the VPX board card executes a second test task based on the second test information, wherein the second test task is as follows: the VPX board card runs the application program to enable the utilization rate of a central processing unit of the VPX board card to reach the preset low utilization rate, and the test duration is the preset long use duration;
the temperature sensor acquires real-time temperature values of monitoring points of the VPX board card during execution of a second test task and sends the real-time temperature values to the control module;
the control module judges whether the following conditions are met: the duration that the real-time temperature value of any monitoring point is greater than the temperature threshold value is greater than the first preset duration;
if yes, marking the monitoring points of which the duration time of the real-time temperature value greater than the temperature threshold value is greater than the first preset time as abnormal points.
Preferably, the method further comprises the following steps:
the control module generates third test information and sends the third test information to the VPX board card, wherein the third test information comprises the preset low utilization rate, the preset interval duration, the preset duration and the preset times;
the VPX board card executes a third test task based on the third test information, wherein the third test task is as follows: the VPX board card runs the application program once every the preset interval duration, the running duration of the application program is the preset duration, the running times of the application program are the preset times, and the utilization rate of a central processing unit of the VPX board card reaches the preset low utilization rate;
the temperature sensor acquires real-time temperature values of monitoring points of the VPX board card during execution of a third test task and sends the real-time temperature values to the control module;
the control module judges whether the following conditions are met: the duration that the real-time temperature value of any monitoring point is greater than the temperature threshold value is greater than the first preset duration;
if yes, the control module marks the monitoring points with the duration time of the real-time temperature value being greater than the temperature threshold value and being greater than the first preset time as abnormal points.
Preferably, a plurality of VPX board cards are arranged on the VPX equipment; the application type corresponding to each VPX board card is a calculation type or a read-write type; the control module obtains the temperature threshold corresponding to each monitoring point, and then further comprises:
the control module acquires an application type of an application program of a VPX board card executing a first test task;
when the application type of the application program of the VPX board card executing the first test task is a calculation type, the control module judges whether the following conditions are met: the duration of the real-time temperature value of the monitoring point corresponding to any one of the central processor, the image processor and the bridge piece being greater than the temperature threshold value is greater than the first preset duration;
if so, marking the monitoring points of which the duration time of the real-time temperature values which are greater than the temperature threshold value is greater than the first preset duration as abnormal points;
when the application type of the application program of the VPX board card executing the first test task is read-write type, the control module judges whether the following conditions are met: the duration that the real-time temperature value of the monitoring point corresponding to any one of the memory module and the storage module is greater than the temperature threshold value is greater than the first preset duration;
if so, marking the monitoring points with the duration time of the real-time temperature value being greater than the temperature threshold value and being greater than the first preset duration as abnormal points.
Preferably, the system further comprises a liquid pump in communication with the liquid cooling conduit; the liquid pump is used for pumping the liquid cooling fluid into the liquid cooling pipeline and enabling the liquid cooling fluid to circularly flow in the liquid cooling pipeline; the collecting assembly further comprises a flow sensor and a pressure sensor which are arranged on the liquid cooling pipeline; the VPX board card executes a first test task based on the first test information, and then the VPX board card further comprises:
the control module acquires a normal flow speed interval, a normal flow interval and a normal pressure interval;
the flow velocity sensor acquires a real-time flow velocity value of the liquid cooling fluid in the liquid cooling pipeline and sends the real-time flow velocity value to the control module;
the flow sensor acquires a real-time flow value of the liquid cooling fluid in the liquid cooling pipeline and sends the real-time flow value to the control module;
the pressure sensor acquires a real-time pressure value of the liquid cooling pipeline and sends the real-time pressure value to the control module;
the control module judges whether the following conditions are met: the real-time flow rate value falls into the normal flow rate interval, and the real-time pressure value falls into the normal pressure interval;
if not, the control module generates liquid cooling abnormal information.
Preferably, the control module is electrically connected with the liquid pump; the control module generates pipeline improvement information corresponding to the abnormal point based on the real-time flow rate value acquired by the flow rate sensor, and comprises:
the control module acquires a first flow rate value and a second flow rate value, wherein the first flow rate value is smaller than the real-time flow rate value, and the second flow rate value is larger than the real-time flow rate value;
the control module adjusts the rotating speed of the liquid pump to control the real-time flow rate value of the liquid cooling fluid to be reduced to the first flow rate value;
when the real-time flow rate value of the liquid cooling fluid is reduced to a first flow rate value and maintained for a second preset time, the control module judges whether the real-time temperature value corresponding to the abnormal point is reduced or increased;
if the temperature of the liquid pump is reduced, the control module adjusts the rotating speed of the liquid pump to control the real-time flow rate value of the liquid cooling fluid to reduce preset flow rate values every second preset time period until the real-time temperature value corresponding to the abnormal point is reduced to a first preset minimum temperature value, and marks the corresponding real-time flow rate value when the real-time temperature value is reduced to the first preset minimum temperature value as a target flow rate value;
if the liquid pump rises, the control module adjusts the rotating speed of the liquid pump to control the real-time flow rate value of the liquid cooling fluid to rise to the second flow rate value;
when the real-time flow rate value of the liquid cooling fluid is increased to a second flow rate value and is maintained for a second preset time, the control module judges whether the real-time temperature value corresponding to the abnormal point is reduced or not;
if the real-time temperature value corresponding to the abnormal point is decreased, the control module adjusts the rotating speed of the liquid pump to control the real-time flow rate value of the liquid cooling fluid to be increased by a preset flow rate value every second preset time period until the real-time temperature value is decreased to a second preset minimum temperature value, and marks the real-time flow rate value corresponding to the time when the real-time temperature value is decreased to the second preset minimum temperature value as a target flow rate value.
Preferably, if the liquid pump rises, the control module adjusts the rotating speed of the liquid pump to control the real-time flow rate value of the liquid cooling fluid to rise to the second flow rate value, and then the method further comprises:
when the real-time flow rate value of the liquid cooling fluid is increased to a second flow rate value and maintained for a second preset time, the control module judges whether the real-time temperature value corresponding to the abnormal point is increased or not;
and if so, the control module generates the pipeline inner diameter expansion information.
Preferably, after the real-time flow rate value of the liquid-cooled fluid is increased to the second flow rate value and maintained for a second preset time period, the control module determines whether the real-time temperature value corresponding to the abnormal point rises, and then further includes:
if so, the control module acquires a pipeline path walking graph of the VPX board card, wherein the pipeline path walking graph of the VPX board card is also marked with the position of the abnormal point;
the control module judges whether the closest distance between the abnormal point and the pipeline is greater than a preset distance value or not based on a pipeline path walking graph of the VPX board card;
and if the closest distance between the abnormal point and the pipeline is greater than a preset distance value, the control module generates pipeline path adjustment information.
The invention also provides a VPX equipment liquid cooling parameter testing system, which is applied to the VPX equipment liquid cooling parameter testing method, and comprises the VPX equipment, a control module and a parameter acquisition assembly; the VPX equipment comprises a VPX board card; the VPX board card is provided with a liquid cooling pipeline; the liquid cooling pipeline is used for circulating liquid cooling fluid; the VPX board card and the parameter acquisition assembly are in communication connection with the control module; the parameter acquisition assembly comprises a temperature sensor and a flow velocity sensor arranged on the liquid cooling pipeline; and an application program is solidified in the storage module of the VPX board card.
Through above-mentioned technical scheme, can realize following beneficial effect:
the liquid cooling parameter testing method of the VPX equipment is more perfect, and can detect the temperature change state of the actual operation process of the VPX board card in real time and reliably; when this scheme is tested the VPX integrated circuit board, what the VPX integrated circuit board ran is the application of solidification itself, and the operation in-process makes central processing unit's rate of utilization reach and predetermines high rate of utilization, and the test duration is when predetermineeing short duration of use, can realize the VPX integrated circuit board test task of high strength high load like this, thereby the temperature variation condition in the more real effectual record and the feedback VPX integrated circuit board operation process, and then make the test result of VPX integrated circuit board more accurate true and laminating reality, and realize liquid cooling through the test and improve, further guarantee the job stabilization nature of VPX equipment through the test.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic step diagram of a method for testing liquid cooling parameters of a VPX device according to a first embodiment of the present invention.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
The invention provides a method and a system for testing liquid cooling parameters of VPX equipment.
As shown in fig. 1, in a first embodiment of a liquid cooling parameter testing method of a VPX device according to the present invention, the liquid cooling parameter testing method of a VPX device is applied to a liquid cooling parameter testing system of a VPX device; the system comprises VPX equipment, a control module, a display module and a parameter acquisition assembly; the VPX equipment comprises a VPX board card; the VPX board card is provided with a liquid cooling pipeline; the liquid cooling pipeline is used for circulating liquid cooling fluid (such as water); the VPX board card and the parameter acquisition assembly are in communication connection with the control module; the parameter acquisition assembly comprises a temperature sensor and a flow velocity sensor provided with a liquid cooling pipeline; an application program (namely an actual service program when the VPX equipment is applied) is solidified in a storage module of the VPX board; the embodiment comprises the following steps:
step S110: the control module generates first test information and sends the first test information to the VPX board card, wherein the first test information comprises a preset high utilization rate (for example, 90%) and a preset short use duration (for example, 5 minutes).
Step S120: the VPX board card executes a first test task based on the first test information: and the VPX board card runs the application program so that the utilization rate of a central processing unit of the VPX board card reaches the preset high utilization rate, and the test duration is the preset short service duration.
Specifically, the VPX board executes a first test task, namely running a self-solidified application program, and in the running process, the utilization rate of the central processing unit reaches a preset high utilization rate, and the test duration is a preset short utilization time, so that the high-strength and high-load VPX board test task can be realized.
Step S130: the temperature sensor acquires real-time temperature values of monitoring points of the VPX board card during execution of a first test task, and sends the real-time temperature values to the control module.
Specifically, the monitoring point of the VPX board card includes a central processing unit, an image processor, a bridge chip, a memory module and a storage module.
Specifically, the temperature value of each monitoring point during the first test task is obtained to judge whether the temperature of each monitoring point exceeds the standard or not. In addition, control module can also with the temperature value of each monitoring point and corresponding first test information display in display module can make like this that the managers knows the real-time temperature value variation condition of each monitoring point in the test procedure in real time.
Step S140: and the control module marks the monitoring points of which the real-time temperature values are greater than the temperature threshold value as abnormal points.
Specifically, if yes, it is stated that the temperature of the monitoring point exceeds the standard abnormally, that is, the temperature test is not passed, so the monitoring point with the real-time temperature value greater than the temperature threshold value is marked as the abnormal point. So that the manager can perform heat dissipation temperature optimization aiming at the abnormal points subsequently.
Step S150: the control module generates pipeline improvement information corresponding to the abnormal point based on the real-time flow rate value acquired by the flow rate sensor to serve as liquid cooling improvement information, wherein the pipeline improvement information comprises pipeline inner diameter expansion information and/or pipeline path adjustment information.
Specifically, when the VPX board has an abnormal temperature, that is, the liquid cooling heat dissipation test does not pass, a targeted improvement is required, so that the flow rate data in the liquid cooling pipeline collected by the flow rate sensor can be combined to generate targeted improvement suggestion information (pipeline inner diameter expansion and/or pipeline path adjustment).
The liquid cooling parameter testing method of the VPX equipment is more complete, and can be used for reliably detecting the temperature change state of the VPX board card in the actual operation process in real time; when the VPX board is tested, the VPX board runs a self-solidified application program, the utilization rate of a central processing unit is enabled to reach a preset high utilization rate in the running process, and the duration of the test is the preset short use time, so that a high-strength and high-load VPX board test task can be realized, the temperature change condition in the VPX board running process is more truly and effectively recorded and fed back, the test result of the VPX board is more accurate, true and practical in fitting, the improvement of liquid cooling is realized through the test, and the working stability of VPX equipment is further ensured through the test.
In a second embodiment of the liquid cooling parameter testing method of the VPX device, based on the first embodiment, a monitoring point of a VPX board card includes a central processing unit, an image processor, a bridge chip, a memory module and a storage module; step S140, including the steps of:
step S210: and the control module acquires the temperature threshold corresponding to each monitoring point.
Specifically, the temperature threshold is a threshold for safe operation corresponding to each monitoring point, that is, the monitoring points need to operate below the corresponding temperature threshold to ensure normal operation of the VPX board.
Step S220: the control module judges whether the following conditions are met: the duration that the real-time temperature value of any monitoring point is greater than the corresponding temperature threshold value is greater than a first preset duration (for example, 1 minute), wherein the first preset duration is less than the preset short service duration.
If yes, go to step S230: and marking the monitoring points with the duration time of the real-time temperature value being greater than the temperature threshold value and being greater than the first preset duration as abnormal points.
Specifically, if yes, it is stated that the temperature of the monitoring point exceeds the standard abnormally, that is, the temperature test is not passed, so the monitoring point with the duration of the real-time temperature value being greater than the temperature threshold value being greater than the first preset duration is marked as the abnormal point. So that the manager can perform heat dissipation temperature optimization for the abnormal points subsequently.
If not, go to step S240: and the control module generates test result normal information.
Specifically, if the detection result is no, it is indicated that no monitoring point with overproof temperature exists, and it is indicated that the VPX equipment passes the temperature test.
In a third embodiment of the method for testing liquid cooling parameters of a VPX device provided by the present invention, based on the second embodiment, the present embodiment further includes the following steps:
step S310: the control module generates second test information and sends the second test information to the VPX board card, wherein the second test information comprises a preset low utilization rate (50%) and a preset long service life (60 minutes), the preset low utilization rate is smaller than the preset high utilization rate, and the preset long service life is longer than the preset short service life.
Step S320: the VPX board card executes a second test task based on the second test information, wherein the second test task is as follows: and the VPX board card runs the application program so that the utilization rate of a central processing unit of the VPX board card reaches the preset low utilization rate, and the test duration is the preset long use duration.
Specifically, the VPX board executes a second test task, that is, runs a self-cured application program, and in the running process, the utilization rate of the central processing unit reaches a preset low utilization rate, and the test duration is a preset long use duration, so that the test task of running the VPX board for a long time can be realized.
Step S330: and the temperature sensor acquires real-time temperature values of each monitoring point of the VPX board card during the execution of a second test task and sends the real-time temperature values to the control module.
Step S340: the control module judges whether the following conditions are met: the duration that the real-time temperature value of any monitoring point is greater than the temperature threshold value is greater than the first preset duration.
If yes, go to step S350: and marking the monitoring points with the duration time of the real-time temperature value being greater than the temperature threshold value and being greater than the first preset duration as abnormal points.
Specifically, if yes, it is stated that the temperature of the monitoring point exceeds the standard abnormally, that is, the temperature test is not passed, so the monitoring point with the duration of the real-time temperature value being greater than the temperature threshold value being greater than the first preset duration is marked as the abnormal point. So that the manager can perform heat dissipation temperature optimization for the abnormal points subsequently.
In a fourth embodiment of the method for testing liquid cooling parameters of a VPX device provided by the present invention, based on the second embodiment, the present embodiment further includes the following steps:
step S410: the control module generates third test information and sends the third test information to the VPX board card, wherein the third test information comprises the preset low utilization rate, a preset interval duration (for example, 30 minutes), a preset duration (10 minutes) and preset times (5 times).
Step S420: the VPX board card executes a third test task based on the third test information, wherein the third test task is as follows: the VPX board card runs the application program once every preset interval duration, the running duration of the application program is the preset duration, the running times of the application program are the preset times, and the utilization rate of a central processing unit of the VPX board card reaches the preset low utilization rate.
Specifically, the VPX board executes a third test task, that is, runs the application program that is self-cured, and in the running process, the utilization rate of the central processing unit reaches a preset low utilization rate, the VPX board runs the application program once every preset interval duration, the duration of each running of the application program is a preset duration, and the running frequency of the application program is a preset frequency, so that the test task of periodically and circularly running the VPX board can be realized.
Step S430: and the temperature sensor acquires real-time temperature values of each monitoring point of the VPX board card during the execution of a third test task, and sends the real-time temperature values to the control module.
Step S440: the control module judges whether the following conditions are met: the duration that the real-time temperature value of any monitoring point is greater than the temperature threshold value is greater than a first preset duration.
If yes, go to step S450: and the control module marks the monitoring points of which the duration time of the real-time temperature value greater than the temperature threshold value is greater than the first preset time as abnormal points.
Specifically, if yes, it is stated that the temperature of the monitoring point exceeds the standard abnormally, that is, the temperature test is not passed, so the monitoring point with the duration of the real-time temperature value being greater than the temperature threshold value being greater than the first preset duration is marked as the abnormal point. So that the manager can perform heat dissipation temperature optimization aiming at the abnormal points subsequently.
In a fifth embodiment of the method for testing a liquid cooling parameter of a VPX device, based on the first embodiment, step S130 further includes the following steps:
step S510: the control module generates and displays a board card live image in the display module, wherein the board card live image comprises a VPX board card outline, and a liquid cooling pipeline path and a monitoring point in the VPX board card outline, temperature values of the liquid cooling pipeline path and the monitoring point are expressed by different colors, the color is darker when the temperature value is higher, and the color is lighter when the temperature value is lower.
Specifically, through generating the live image of the board card, can carry out visual display with each monitoring point position of the VPX board card of inlet wire test and the real-time temperature value that corresponds, express the temperature value of liquid cooling pipeline route and monitoring point through different colours, the higher the temperature value the darker the colour, the lower the temperature value the lighter the colour, and then make managers know the temperature variation condition of VPX board card in the test procedure directly perceivedly.
In a sixth embodiment of the method for testing liquid cooling parameters of a VPX device, which is provided by the present invention, based on the second embodiment, a plurality of VPX boards are provided for the VPX device; the application type corresponding to each VPX board card is calculation type or read-write type; step S210, then, the following steps are included:
step S610: the control module obtains the application type of the application program of the VPX board card executing the first test task.
Step S620: when the application type of the application program of the VPX board card executing the first test task is a calculation type, the control module judges whether the following conditions are met: the duration that the real-time temperature value of the monitoring point corresponding to any one of the central processor, the image processor and the bridge piece is greater than the temperature threshold value is greater than the first preset duration.
Specifically, when the application type of the application program of the VPX board executing the first test task is a compute class, the compute class application program occupies a central processing unit, an image processor and a bridge chip more greatly during operation; therefore, the control module only judges the real-time temperature value of the monitoring point corresponding to any one of the central processing unit, the image processor and the bridge piece, the heating values of the rest memory module and the storage module are not higher than the heating values of the central processing unit, the image processor and the bridge piece, and the temperature judgment is not needed, so that the computing resources are saved, the testing process is optimized, and the testing efficiency is improved.
If yes, go to step S630: and marking the monitoring points with the duration time of the real-time temperature value being greater than the temperature threshold value and being greater than the first preset duration as abnormal points.
Step 640: when the application type of the application program of the VPX board card executing the first test task is read-write type, the control module judges whether the following conditions are met: the duration that the real-time temperature value of the monitoring point corresponding to any one of the memory module and the storage module is greater than the temperature threshold is greater than the first preset duration.
If yes, go to step S650: and marking the monitoring points of which the duration time of the real-time temperature value greater than the temperature threshold value is greater than the first preset time as abnormal points.
Specifically, when the application type of the application program of the VPX board executing the first test task is read-write type, the read-write type application program occupies a higher memory module and a higher storage module during operation; therefore, the control module only judges the real-time temperature value of the monitoring point corresponding to any one of the memory module and the storage module, the heating values of the rest central processing unit, the image processor and the bridge piece are not higher than the heating values of the memory module and the storage module, and temperature judgment is not needed, so that the computing resources are saved, the testing process is optimized, and the testing efficiency is improved.
In a seventh embodiment of the method for testing liquid cooling parameters of a VPX device provided by the present invention, based on the second embodiment, the system further includes a liquid pump communicated with the liquid cooling pipeline; the liquid pump is used for pumping the liquid cooling fluid into the liquid cooling pipeline and enabling the liquid cooling fluid to circularly flow in the liquid cooling pipeline; the acquisition assembly further comprises a flow velocity sensor, a flow sensor and a pressure sensor which are arranged on the liquid cooling pipeline; step S120, the following steps are also included thereafter:
step S710: the control module acquires a normal flow speed interval, a normal flow interval and a normal pressure interval.
Step S720: the flow rate sensor acquires a real-time flow rate value of the liquid cooling fluid in the liquid cooling pipeline and sends the real-time flow rate value to the control module.
Step S730: the flow sensor acquires a real-time flow value of the liquid cooling fluid in the liquid cooling pipeline and sends the real-time flow value to the control module.
Step S740: and the pressure sensor acquires the real-time pressure value of the liquid cooling pipeline and sends the real-time pressure value to the control module.
Step S750: and the control module displays the temperature value of each monitoring point and the corresponding flow velocity value, flow value and pressure value on the display module.
Specifically, the temperature value of each monitoring point and the corresponding flow velocity value, flow value and pressure value are displayed on the display module, so that managers can visually know parameters of the liquid cooling pipeline during testing.
Step S760: the control module judges whether the following conditions are met: the real-time flow rate value falls into the normal flow rate interval, and the real-time pressure value falls into the normal pressure interval.
If not, executing step S770: and the control module generates liquid cooling abnormal information and displays the information on the display module.
Specifically, if not, it is stated that the flow rate value does not fall within the normal flow rate interval, or the real-time pressure value does not fall within the normal pressure interval, that is, it is stated that the liquid cooling pipeline and the liquid cooling pump are not normally operated, so that the control module generates abnormal liquid cooling information, thereby reminding a manager to perform an inspection.
In an eighth embodiment of the liquid cooling parameter testing method of the VPX device, based on the seventh embodiment, the control module is electrically connected to the liquid pump; step S150, including the steps of:
step S810: the control module obtains a first flow rate value and a second flow rate value, wherein the first flow rate value is smaller than the real-time flow rate value, and the second flow rate value is larger than the real-time flow rate value.
Step S820: the control module adjusts the rotating speed of the liquid pump to control the real-time flow rate value of the liquid cooling fluid to be reduced to the first flow rate value.
Step S830: and when the real-time flow rate value of the liquid cooling fluid is reduced to the first flow rate value and maintained for a second preset time (10 seconds), the control module judges whether the real-time temperature value corresponding to the abnormal point is reduced or increased.
Step S840: if the liquid pump is lowered, the control module adjusts the rotating speed of the liquid pump to control the real-time flow rate value of the liquid cooling fluid to reduce a preset flow rate value (for example, 5 cm/s) every other second preset duration until the real-time temperature value is reduced to a first preset minimum temperature value (the first preset minimum temperature value is the lowest value of the collected real-time temperature values in the process of reducing the real-time flow rate value, that is, if the real-time flow rate value is continuously reduced after the first preset minimum temperature value is reached, the real-time temperature value is increased, in this case, the previous collected real-time temperature value is the first preset minimum temperature value), and the corresponding real-time flow rate value when the real-time flow rate value is reduced to the first preset minimum temperature value is marked as a target flow rate value.
Specifically, if the real-time flow rate value of the liquid cooling fluid is reduced to the first flow rate value and maintained for a second preset time, and the real-time temperature value corresponding to the abnormal point is reduced, it is proved that the reduction of the flow rate can improve the heat dissipation effect of the liquid cooling, so that the flow rate of the liquid cooling fluid in the liquid cooling pipeline can be continuously reduced step by step (by 5cm/s each time) until the real-time temperature value is reduced to the first preset minimum temperature value, and the real-time flow rate value corresponding to the reduction to the first preset minimum temperature value is marked as a target flow rate value, so that the optimal flow rate value of the heat dissipation capacity can be obtained.
Step S850: if the liquid pump rises, the control module adjusts the rotating speed of the liquid pump to control the real-time flow rate value of the liquid cooling fluid to rise to the second flow rate value.
Specifically, if the real-time temperature value rises, it is indicated that the reduction of the flow rate can reduce the heat dissipation effect on the contrary, so that the flow rate can be increased to judge whether the heat dissipation effect is increased after the flow rate is increased.
Step S860: and after the real-time flow rate value of the liquid cooling fluid is increased to a second flow rate value and maintained for a second preset time, the control module judges whether the real-time temperature value corresponding to the abnormal point is reduced or not.
Step S870: if the real-time temperature value corresponding to the abnormal point decreases, the control module adjusts the rotating speed of the liquid pump to control the real-time flow rate value of the liquid cooling fluid to increase the preset flow rate value every other second preset duration until the real-time temperature value decreases to a second preset minimum temperature value (the second preset minimum temperature value is the lowest value of the collected real-time temperature values in the process of increasing the real-time flow rate value, that is, if the real-time flow rate value continues to increase after reaching the second preset minimum temperature value, the real-time temperature value increases, in this case, the previous collected real-time temperature value is the second preset minimum temperature value), and the real-time flow rate value corresponding to the decrease to the second preset minimum temperature value is marked as a target flow rate value.
Specifically, if the real-time flow rate value of the liquid cooling fluid is increased to the second flow rate value and maintained for a second preset duration, and the real-time temperature value corresponding to the abnormal point is decreased, it is proved that the increase of the flow rate can improve the liquid cooling heat dissipation effect, so that the flow rate of the liquid cooling fluid in the liquid cooling pipeline can be continuously increased step by step (by 5cm/s at each time) until the real-time temperature value is decreased to the second preset minimum temperature value, and the real-time flow rate value corresponding to the time when the real-time temperature value is decreased to the second preset minimum temperature value is marked as a target flow rate value, so that the optimal flow rate value of the heat dissipation capability can be obtained.
In a ninth embodiment of the method for testing liquid cooling parameters of a VPX device provided by the present invention, based on the eighth embodiment, step S850 further includes the following steps:
step S910: and after the real-time flow rate value of the liquid cooling fluid is increased to a second flow rate value and maintained for a second preset time, the control module judges whether the real-time temperature value corresponding to the abnormal point is increased.
Specifically, if the real-time flow rate value of the liquid cooling fluid is increased to the second flow rate value and the second preset duration is maintained, and then the real-time temperature value corresponding to the abnormal point is increased, it is proved that the increase flow rate cannot increase the heat dissipation effect of the liquid cooling fluid, that is, the current real-time flow rate value corresponds to the optimal heat dissipation capability, and the heat dissipation capability of the liquid cooling pipeline needs to be increased from other angles, so as to solve the problem that the temperature of the abnormal point is too high.
If yes, go to step S920: the control module generates pipeline inner diameter expansion information.
Specifically, the control module generates the pipeline inner diameter expansion information, namely, advises the manager of the overlarge inner diameter of the liquid cooling pipeline, so that the heat dissipation capacity of the liquid cooling pipeline is improved, and the problem that the temperature of an abnormal point is too high is solved.
In a tenth embodiment of the method for testing liquid cooling parameters of a VPX device provided by the present invention, based on the ninth embodiment, step S910 further includes the following steps:
if yes, go to step S1010: the control module acquires a pipeline path walking diagram of the VPX board card, wherein the pipeline path walking diagram of the VPX board card is also marked with the position of the abnormal point.
Specifically, if so, it is described that the liquid cooling heat dissipation effect cannot be improved by the increasing flow rate, that is, the current real-time flow rate value corresponds to the optimal heat dissipation capability, and the heat dissipation capability of the liquid cooling pipeline needs to be increased from other angles to solve the problem of the over-high temperature of the abnormal point.
Step S1020: and the control module judges whether the closest distance between the abnormal point and the pipeline is greater than a preset distance value (for example, 3 cm) or not based on a pipeline path walking graph of the VPX board card.
Step S1030: if the closest distance between the abnormal point and the pipeline is larger than a preset distance value, the control module generates pipeline path adjusting information (the pipeline path adjusting information is used for reducing the distance between the abnormal point and the liquid cooling pipeline).
Specifically, when the closest distance between the abnormal point and the pipeline is larger than the preset distance value, the distance between the abnormal point and the liquid cooling pipeline is too large, the heat dissipation capacity can be improved by reducing the distance between the abnormal point and the liquid cooling pipeline, and therefore the problem that the temperature of the abnormal point is too high is solved.
In an eleventh embodiment of the method for testing liquid cooling parameters of a VPX device provided by the present invention, based on the first embodiment, the system further includes an environmental variable control component; the environment variable control assembly comprises a test room, wherein an air temperature adjusting device (such as an air conditioner) is arranged in the test room and is used for adjusting the temperature in the test room; the VPX equipment to be tested is arranged in the test room; step S110, the method further includes the following steps:
step S1110: the control module obtains the maximum application environment temperature value of the VPX equipment to be tested.
Step S1120: the control module controls the air temperature adjusting device to be started so that the ambient temperature of the VPX equipment to be tested reaches and maintains the maximum application ambient temperature value.
Step S1130: step S120, and subsequent steps, are performed.
Specifically, the maximum application environment temperature value in this embodiment is a maximum environment temperature value corresponding to the VPX device in an actual use process, and the environment temperature when the VPX device is tested is set as the maximum application environment temperature value, so that the accuracy of a test result can be ensured, and further, the working stability of the VPX device in an actual operation process is ensured.
The invention also provides a VPX equipment liquid cooling parameter testing system, which is applied to the VPX equipment liquid cooling parameter testing method, and comprises the VPX equipment, a control module and a parameter acquisition assembly; the VPX equipment comprises a VPX board card; the VPX board card is provided with a liquid cooling pipeline; the liquid cooling pipeline is used for circulating liquid cooling fluid; the VPX board card and the parameter acquisition assembly are in communication connection with the control module; the parameter acquisition assembly comprises a temperature sensor and a flow velocity sensor arranged on the liquid cooling pipeline; and an application program is solidified in the storage module of the VPX board card.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention or portions thereof contributing to the prior art may be embodied in the form of a software product, where the computer software product is stored in a storage medium (such as a ROM/RAM, a magnetic disk, and an optical disk), and includes several instructions for enabling a terminal (which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to execute the methods according to the embodiments of the present invention.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A VPX equipment liquid cooling parameter test method is characterized in that the method is applied to a VPX equipment liquid cooling parameter test system; the system comprises VPX equipment, a control module and a parameter acquisition assembly; the VPX equipment comprises a VPX board card; the VPX board card is provided with a liquid cooling pipeline; the liquid cooling pipeline is used for circulating liquid cooling fluid; the VPX board card and the parameter acquisition assembly are in communication connection with the control module; the parameter acquisition assembly comprises a temperature sensor and a flow velocity sensor arranged on the liquid cooling pipeline; an application program is solidified in a storage module of the VPX board card; the method comprises the following steps:
the control module generates first test information and sends the first test information to the VPX board card, wherein the first test information comprises a preset high utilization rate and a preset short service duration;
the VPX board card executes a first test task based on the first test information, wherein the first test task is as follows: the VPX board card runs the application program to enable the utilization rate of a central processing unit of the VPX board card to reach the preset high utilization rate, and the test duration is the preset short utilization duration;
the temperature sensor acquires real-time temperature values of monitoring points of the VPX board card during execution of a first test task and sends the real-time temperature values to the control module;
the control module marks the monitoring points of which the real-time temperature values are greater than the temperature threshold as abnormal points;
the control module generates pipeline improvement information corresponding to the abnormal point based on the real-time flow rate value acquired by the flow rate sensor to serve as liquid cooling improvement information, wherein the pipeline improvement information comprises pipeline inner diameter expansion information and/or pipeline path adjustment information.
2. The VPX device liquid cooling parameter testing method according to claim 1, wherein a monitoring point of a VPX board card comprises a central processing unit, an image processor, a bridge chip, a memory module and a storage module; the control module marks the monitoring points with the real-time temperature values larger than the temperature threshold as abnormal points, and the method comprises the following steps:
the control module acquires a temperature threshold corresponding to each monitoring point;
the control module judges whether the following conditions are met: the duration that the real-time temperature value of any monitoring point is greater than the corresponding temperature threshold value is greater than a first preset duration, wherein the first preset duration is less than the preset short service duration;
if so, the control module marks the monitoring points of which the duration time of the real-time temperature value greater than the temperature threshold value is greater than the first preset time as abnormal points;
if not, the control module generates normal test result information.
3. The method for testing the liquid cooling parameters of the VPX equipment according to claim 2, further comprising:
the control module generates second test information and sends the second test information to the VPX board card, wherein the second test information comprises a preset low utilization rate and a preset long service life, the preset low utilization rate is smaller than the preset high utilization rate, and the preset long service life is longer than the preset short service life;
the VPX board card executes a second test task based on the second test information, wherein the second test task is as follows: the VPX board card runs the application program to enable the utilization rate of a central processing unit of the VPX board card to reach the preset low utilization rate, and the test duration is the preset long use duration;
the temperature sensor acquires real-time temperature values of monitoring points of the VPX board card during execution of a second test task and sends the real-time temperature values to the control module;
the control module judges whether the following conditions are met: the duration that the real-time temperature value of any monitoring point is greater than the temperature threshold value is greater than the first preset duration;
if so, marking the monitoring points with the duration time of the real-time temperature value being greater than the temperature threshold value and being greater than the first preset duration as abnormal points.
4. The method for testing the liquid cooling parameters of the VPX equipment according to claim 2, further comprising:
the control module generates third test information and sends the third test information to the VPX board card, wherein the third test information comprises the preset low utilization rate, the preset interval duration, the preset duration and the preset times;
the VPX board card executes a third test task based on the third test information, wherein the third test task is as follows: the VPX board card runs the application program once every the preset interval duration, the running duration of the application program is the preset duration, the running times of the application program are the preset times, and the utilization rate of a central processing unit of the VPX board card reaches the preset low utilization rate;
the temperature sensor acquires real-time temperature values of monitoring points of the VPX board card during the execution of a third test task and sends the real-time temperature values to the control module;
the control module judges whether the following conditions are met: the duration that the real-time temperature value of any monitoring point is greater than the temperature threshold value is greater than the first preset duration;
if yes, the control module marks the monitoring points of which the duration time of the real-time temperature value greater than the temperature threshold value is greater than the first preset time as abnormal points.
5. The method for testing the liquid cooling parameters of the VPX equipment according to claim 2, wherein a plurality of VPX board cards are arranged on the VPX equipment; the application type corresponding to each VPX board card is a calculation type or a read-write type; the control module acquires the temperature threshold corresponding to each monitoring point, and then the method further comprises the following steps:
the control module acquires an application type of an application program of a VPX board card executing a first test task;
when the application type of the application program of the VPX board card executing the first test task is a calculation type, the control module judges whether the following conditions are met: the duration that the real-time temperature value of the monitoring point corresponding to any one of the central processor, the image processor and the bridge piece is greater than the temperature threshold value is greater than the first preset duration;
if so, marking the monitoring points of which the duration time of the real-time temperature values which are greater than the temperature threshold value is greater than the first preset duration as abnormal points;
when the application type of the application program of the VPX board card executing the first test task is read-write type, the control module judges whether the following conditions are met: the duration that the real-time temperature value of the monitoring point corresponding to any one of the memory module and the storage module is greater than the temperature threshold value is greater than the first preset duration;
if yes, marking the monitoring points of which the duration time of the real-time temperature value greater than the temperature threshold value is greater than the first preset time as abnormal points.
6. The method for testing liquid cooling parameters of a VPX apparatus according to claim 2, wherein the system further comprises a liquid pump in communication with the liquid cooling conduit; the liquid pump is used for pumping the liquid cooling fluid into the liquid cooling pipeline and enabling the liquid cooling fluid to circularly flow in the liquid cooling pipeline; the collecting assembly further comprises a flow sensor and a pressure sensor which are arranged on the liquid cooling pipeline; the VPX board card executes a first test task based on the first test information, and then the VPX board card further comprises:
the control module acquires a normal flow speed interval, a normal flow interval and a normal pressure interval;
the flow velocity sensor acquires a real-time flow velocity value of the liquid cooling fluid in the liquid cooling pipeline and sends the real-time flow velocity value to the control module;
the flow sensor acquires a real-time flow value of the liquid cooling fluid in the liquid cooling pipeline and sends the real-time flow value to the control module;
the pressure sensor acquires a real-time pressure value of the liquid cooling pipeline and sends the real-time pressure value to the control module;
the control module judges whether the following conditions are met: the real-time flow rate value falls into the normal flow rate interval, and the real-time pressure value falls into the normal pressure interval;
if not, the control module generates liquid cooling abnormal information.
7. The method for testing liquid cooling parameters of a VPX apparatus according to claim 6, wherein the control module is electrically connected to the liquid pump; the control module generates pipeline improvement information corresponding to the abnormal point based on the real-time flow rate value acquired by the flow rate sensor, and comprises:
the control module acquires a first flow rate value and a second flow rate value, wherein the first flow rate value is smaller than the real-time flow rate value, and the second flow rate value is larger than the real-time flow rate value;
the control module adjusts the rotating speed of the liquid pump to control the real-time flow rate value of the liquid cooling fluid to be reduced to the first flow rate value;
when the real-time flow rate value of the liquid cooling fluid is reduced to a first flow rate value and maintained for a second preset time, the control module judges whether the real-time temperature value corresponding to the abnormal point is reduced or increased;
if the liquid pump is lowered, the control module adjusts the rotating speed of the liquid pump to control the real-time flow rate value of the liquid cooling fluid to reduce preset flow rate values every other second preset duration until the real-time temperature value corresponding to the abnormal point is reduced to a first preset minimum temperature value, and marks the corresponding real-time flow rate value when the real-time temperature value is reduced to the first preset minimum temperature value as a target flow rate value;
if the liquid pump rises, the control module adjusts the rotating speed of the liquid pump to control the real-time flow rate value of the liquid cooling fluid to rise to the second flow rate value;
when the real-time flow rate value of the liquid cooling fluid is increased to a second flow rate value and maintained for a second preset time, the control module judges whether the real-time temperature value corresponding to the abnormal point is reduced or not;
if the real-time temperature value corresponding to the abnormal point is decreased, the control module adjusts the rotating speed of the liquid pump to control the real-time flow rate value of the liquid cooling fluid to be increased by a preset flow rate value every second preset time period until the real-time temperature value is decreased to a second preset minimum temperature value, and marks the real-time flow rate value corresponding to the time when the real-time temperature value is decreased to the second preset minimum temperature value as a target flow rate value.
8. The method of claim 7, wherein if the liquid cooling parameter of the VPX apparatus rises, the control module adjusts a rotation speed of the liquid pump to control a real-time flow rate value of the liquid cooling fluid to rise to the second flow rate value, and then the method further comprises:
when the real-time flow rate value of the liquid cooling fluid is increased to a second flow rate value and is maintained for a second preset time, the control module judges whether the real-time temperature value corresponding to the abnormal point rises or not;
and if so, the control module generates the pipeline inner diameter expansion information.
9. The method of claim 8, wherein after the real-time flow rate of the liquid-cooled fluid is increased to a second flow rate and maintained for a second predetermined duration, the control module determines whether the real-time temperature value corresponding to the abnormal point is increased, and then further comprising:
if so, the control module acquires a pipeline path walking graph of the VPX board card, wherein the pipeline path walking graph of the VPX board card is marked with the position of the abnormal point;
the control module judges whether the closest distance between the abnormal point and the pipeline is larger than a preset distance value or not based on a pipeline path walking graph of the VPX board card;
and if the closest distance between the abnormal point and the pipeline is greater than a preset distance value, the control module generates pipeline path adjustment information.
10. A VPX device liquid cooling parameter testing system, which is characterized in that the VPX device liquid cooling parameter testing method according to any one of claims 1 to 9 is applied, and the system comprises a VPX device, a control module and a parameter acquisition assembly; the VPX equipment comprises a VPX board card; the VPX board card is provided with a liquid cooling pipeline; the liquid cooling pipeline is used for circulating liquid cooling fluid; the VPX board card and the parameter acquisition assembly are in communication connection with the control module; the parameter acquisition assembly comprises a temperature sensor and a flow velocity sensor arranged on the liquid cooling pipeline; and an application program is solidified in the storage module of the VPX board card.
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