CN115575795A - Aging test device and method for circuit board card - Google Patents
Aging test device and method for circuit board card Download PDFInfo
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- CN115575795A CN115575795A CN202211160320.4A CN202211160320A CN115575795A CN 115575795 A CN115575795 A CN 115575795A CN 202211160320 A CN202211160320 A CN 202211160320A CN 115575795 A CN115575795 A CN 115575795A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2803—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] by means of functional tests, e.g. logic-circuit-simulation or algorithms therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2817—Environmental-, stress-, or burn-in tests
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Abstract
The invention discloses an aging test device and method for a circuit board card. The aging test device comprises a controller, an aging processing module, a parameter monitoring module and a heat dissipation module, wherein the aging processing module, the parameter monitoring module and the heat dissipation module are respectively in communication connection with the controller; the aging processing module is used for providing circuit board card signal excitation according to the set power parameters configured by the controller; the parameter monitoring module is used for acquiring actual working parameters of the circuit board card, wherein the actual working parameters comprise the actual working temperature of the circuit board card and are sent to the controller; the controller is used for controlling the working state of the aging processing module and/or the heat dissipation module when the actual working temperature exceeds the set temperature range until the actual working temperature of the circuit board card is adjusted to be within the set temperature range. The invention provides a signal excitation and test environment for the board card, realizes the live-line aging test of the circuit board card, and realizes the accurate test of the aging of the circuit board card by obtaining diversified parameter data.
Description
Technical Field
The invention relates to the technical field of aging tests, in particular to an aging test device and method for a circuit board card.
Background
Distributed Control System (DCS) is widely applied to the field of high-end industrial Control, and a circuit board card in the DCS plays a key role in connecting a DCS controller and field electrical equipment. The test of the power station DCS system board card has the requirements of high reliability and high test coverage rate, and the circuit board card can work normally and stably and directly influences the working stability of the whole instrument control system.
The aging test can apply environmental stress to the product through high temperature or other methods, and can find out potential defects which cannot be found by conventional monitoring means of the product. Therefore, the market needs a burn-in test device for circuit boards.
On the other hand, in the existing aging test device, the tested product is only placed in high temperature or other environmental stresses, and the test of the working state is not carried out in the test environment, so that the defect that the tested product has a single test result and cannot be completely exposed in a complex working environment is obtained.
Disclosure of Invention
The invention aims to overcome the defects that a circuit board card in the prior art lacks an aging test device and the function of the existing aging test device is single, and provides an aging test device and an aging test method for the circuit board card.
The invention solves the technical problems through the following technical scheme:
a first aspect provides an aging test device for a circuit board card, the aging test device comprising a controller, an aging processing module, a parameter monitoring module and a heat dissipation module, the aging processing module, the parameter monitoring module and the heat dissipation module being respectively in communication connection with the controller, the aging processing module being electrically connected with the circuit board card;
the aging processing module is used for providing the circuit board card signal excitation according to the set power parameter configured by the controller;
the parameter monitoring module is used for acquiring actual working parameters of the circuit board card, and the actual working parameters comprise the actual working temperature of the circuit board card and are sent to the controller;
the controller is used for controlling the working state of the aging processing module and/or the heat dissipation module when the actual working temperature exceeds a set temperature range until the actual working temperature of the circuit board card is adjusted to be within the set temperature range.
Preferably, the controller is further configured to input the actual operating temperature parameter into a preset filtering fitting model according to a time sequence, and output an actual operating temperature parameter for filtering interference, and the controller determines whether the actual operating temperature of the circuit board exceeds a set temperature range based on the actual operating temperature parameter for filtering interference.
Preferably, the aging test device further comprises a noise filtering module, and the noise filtering module is in communication connection with the controller;
the noise filtering module is used for collecting an environmental noise signal of the circuit board card and sending the environmental noise signal to the controller;
the controller is further used for inputting the environmental noise signal into a preset environmental noise fitting model, filtering out an abnormal environmental noise signal based on the preset environmental noise fitting model, and judging whether the aging test device normally operates based on the abnormal environmental noise signal;
the noise filtering module is used for collecting an environmental noise signal of the circuit board card and sending the environmental noise signal to the controller;
the controller is further used for inputting the environmental noise signal to a preset environmental noise fitting model and judging whether the environmental noise signal is abnormal or not based on an output result of the preset environmental noise fitting model;
when the environmental noise signal is abnormal, determining that the circuit board card is over-temperature, and generating an adjusting instruction to increase the output power of the heat dissipation module.
Preferably, the preset environmental noise fitting model is constructed by a self-adaptive filtering algorithm.
Preferably, the controller is further configured to control the aging processing module to stop providing signal excitation to the circuit board when the abnormal duration of the environmental noise signal exceeds a preset abnormal noise duration.
Preferably, the controller is further configured to control the aging processing module to configure the circuit board card to operate at a first rated power, and to control the output power of the heat dissipation module to be increased when the actual operating temperature of the circuit board card exceeds a temperature threshold;
the controller is further configured to reduce the power configuration provided by the aging processing module to the circuit board card to reduce signal excitation if the actual operating temperature of the circuit board card obtained by the parameter monitoring module within a set time still exceeds the set temperature range when the output power of the heat dissipation module reaches a second rated power.
Preferably, the controller is further configured to control the aging processing module to stop providing the signal excitation to the circuit board if the actual working temperature of the circuit board still exceeds the temperature threshold within a second preset time period after the power configuration provided by the aging processing module to the circuit board card reduces the signal excitation.
Preferably, the aging test device further comprises a display module, and the display module is connected with the controller;
the controller is further used for generating abnormal reminding information of the circuit board card when the actual working temperature of the circuit board exceeds a temperature threshold and/or the environmental noise signal is abnormal and controlling the display module to display; and/or the presence of a gas in the gas,
the display module is further used for displaying the actual working parameters of the circuit board and/or the environmental noise signals.
Preferably, the aging test device further comprises a data storage module, and the data storage module is connected with the controller;
the data storage module is used for storing the working parameters of the circuit board card and/or the abnormal data of the working state of the circuit board card.
A second aspect provides a method for testing the aging of a circuit board, which is implemented by using the apparatus for testing the aging of a circuit board, and includes:
providing the circuit board card signal excitation according to the set power parameter configured by the controller;
acquiring actual working parameters of the circuit board card, wherein the actual working parameters comprise the actual working temperature of the circuit board card and are sent to the controller;
and when the actual working temperature exceeds a set temperature range, controlling the working state of the aging processing module and/or the heat dissipation module until the actual working temperature of the circuit board card is adjusted to be within the set temperature range.
The positive progress effects of the invention are as follows: the automatic aging test device for the circuit board card is designed and developed by utilizing the principle of self-heating of the circuit board card under work, provides signal excitation and test environment for the board card, controls and adjusts the working temperature of the circuit board card by adopting a self-adaptive filtering algorithm and a classical control algorithm, realizes an electrified aging test of the circuit board card for a specified time, and can control the aging temperature of the circuit board card within the precision range of +/-2 ℃ of target temperature or even higher precision. By obtaining diversified parameter data, the aging of the circuit board card is accurately tested, the purposes that the charged aging test of a plurality of sets of circuit board cards within a specified time length needs to expose all aspects of defects of trial-manufactured products and evaluate reliability indexes of the products are achieved, and the aging test efficiency and timeliness of the circuit board cards and the effectiveness and reliability of test results are improved to a great extent.
The method has good detection capability on the mutation type fault of the control system, does not need the statistical characteristic of system noise, and has good real-time performance
Drawings
Fig. 1 is a first module schematic diagram of an aging test apparatus for a circuit board card according to embodiment 1 of the present invention;
fig. 2 is a second block diagram of the aging test apparatus for circuit boards according to embodiment 1 of the present invention;
fig. 3 is a schematic view of a heat dissipation module of the aging test apparatus for circuit boards according to embodiment 1 of the present invention;
fig. 4 is an identification schematic diagram of an adaptive digital filter system of the aging test apparatus for circuit boards according to embodiment 1 of the present invention;
fig. 5 is a flowchart of a method for testing the aging of a circuit board card according to embodiment 2 of the present invention;
fig. 6 is a flowchart of a working timing of the aging test method for the circuit board card according to embodiment 2 of the present invention;
fig. 7 is a schematic diagram illustrating a temperature adjustment flow of a method for testing the aging of a circuit board according to embodiment 2 of the present invention.
Detailed Description
The invention is further illustrated by the following examples, which are not intended to limit the scope of the invention.
Example 1
The embodiment provides an aging test device 200 for a circuit board card, wherein the aging test device 200 comprises a controller 204, an aging processing module 201 module, a parameter monitoring module 202 and a heat dissipation module 203 which are respectively in communication connection with the controller 204, and the aging processing module 201 module is electrically connected with the circuit board card;
the aging processing module 201 is configured to provide the circuit board card signal excitation according to a set power parameter configured by the controller 204;
the parameter monitoring module 202 is configured to obtain actual working parameters of the circuit board card, where the actual working parameters include an actual working temperature of the circuit board card and are sent to the controller 204;
the controller 204 is configured to control the working state of the aging processing module 201 module and/or the heat dissipation module 203 when the actual working temperature exceeds a set temperature range, until the actual working temperature of the circuit board card is adjusted to be within the set temperature range.
Specifically, the aging test device 200 of the circuit board card adopts a cabinet frame type fixed structure and is formed by combining three unit cabinets, and the cabinet body bears the clamps and all instruments and meters which need to be used in the aging process of the assembly. The equipment size is distributed according to the function of the system, and the cabinet structurally comprises but is not limited to four areas: the device comprises an electrical aging unit area, a power supply instrument area, a human-computer interaction area and a multifunctional area.
The electrical aging unit area is a core unit of the system and comprises an aging processing module 201 module, a tested product of a circuit board card and a heat dissipation module 203, wherein the heat dissipation module 203 adopts a temperature sensor and a heat dissipation fan, and the main function of the unit area is to provide a working excitation condition for the circuit board card product, collect the actual working temperature of the circuit board card and control the work of the heat dissipation fan, so that the aging temperature of the circuit board card is controlled within the range of 70 +/-2 ℃.
In an embodiment, as shown in fig. 2, taking two circuit boards arranged in the aging test device 200 as an example, each circuit board is independently arranged in a board clamp, a heat dissipation base is further arranged below the board clamp, a temperature acquisition module for acquiring the working temperature of the circuit board is arranged at the heat dissipation base, and a fan is arranged at the heat dissipation base and controlled by the heat dissipation module; correspondingly, a plurality of current and voltage sensors can be arranged on the circuit board card according to actual requirements to serve as parameter monitoring modules, working parameters of the circuit board card such as working temperature, current, voltage and power can be obtained, the working parameters can be collected according to time sequence through a time sequence control system, the collected working parameters are transmitted to a controller, a core control board can be used as one of the controllers, a direct current power supply provides power for the modules, and a power distributor serves as an aging processing module to provide signal excitation for the circuit board card according to instructions of the controller.
In one embodiment, as shown in fig. 3, the temperature sensor for collecting the circuit board card may adopt a temperature collecting sensor PT100 having a good and uniform temperature-resistance conversion characteristic, and optionally a three-wire PT100 temperature sensor, and convert an analog of the PT100 temperature sensor into a digital signal through a MAX31865 chip, and transmit the digital signal to an ARM (Advanced RISC Machines microprocessor) controller through an STM32 SPI (Serial Peripheral Interface).
In one embodiment, the controller 204 in the burn-in test apparatus 200 of the circuit board card is designed by using an architecture of ARM + FPGA (Field Programmable Gate Array), and the controller 204 includes the following functional circuits: the circuit comprises an Ethernet interface, 1 path of PWM (pulse width modulation) output, 4 paths of TTL (Transistor-Logic circuit) input, 16 paths of TTL output, 4 paths of MOS (metal-oxide semiconductor field effect Transistor) tubes (analog relays), 1 path of PWM,1 path of temperature, 1 path of current and 4 paths of voltage acquisition.
In one embodiment, after the burn-in is started, the burn-in testing apparatus 200 enters an automatic testing and controlling process, the temperature sensor collects and uploads temperature data of the circuit board card in real time to the controller 204, and the controller 204 performs adaptive adjustment and control according to the working state of the circuit board card. The heat dissipation module 203 is responsible for controlling the actual working temperature of the circuit board card, and the temperature of the component is adjusted by adopting a double-closed-loop control strategy, so that the temperature of the component is kept within a certain range.
As an implementation manner, the controller 204 is further configured to input the actual operating temperature parameter into a preset filtering fitting model according to a time sequence, and output an actual operating temperature parameter for interference filtering, and the controller 204 determines whether the actual operating temperature of the circuit board exceeds a set temperature range based on the actual operating temperature parameter for interference filtering.
As an implementation manner, the preset environmental noise fitting model is constructed by an adaptive filtering algorithm.
Specifically, due to factors such as the influence of a test environment and the increase of circuit noise under a high-temperature condition, when the temperature of a circuit board card product is acquired, a noise interference phenomenon easily occurs, so that the effective real-time performance of a control strategy is influenced, and therefore the acquired temperature needs to be filtered.
The adaptive digital filter is used for modeling the acquired working temperature data of the circuit board card by using the adaptive digital filter in a time sequence, so that a fitting model of the measured parameters of the system is obtained, and whether the system is abnormal or not is judged by analyzing a residual sequence of the fitting model.
Let W (t) be the input of the adaptive digital filter, y (t) be its output, X (t) be the input of the adaptive digital filter system, i.e. the ambient noise process variable to be detected, M be the order of the adaptive digital filter, e (t) be the difference between X (t) and y (t), as shown in fig. 4,
is an estimate of state X (t), where the estimate of the current time is the measurement of the previous time and has the following relationship:
e(t)＝X(t)-y(t)
wherein:
W(t)＝[ω(t),ω(t-1),…,ω(t-M+1)] T
Φ t+1 ＝Φ t +2γW(t)e(t)
Wherein:
Taking the time delay Δ L =1, a fitting model of the state X (t) can be obtained as follows:
for a stationary time sequence { e (k), k =1,2,3, \8230 }, the adaptive digital filter will converge asymptotically, and it can be demonstrated that the prediction error sequence { e (k) } is a zero-mean, white gaussian noise with a constant variance
After the adaptive digital filter converges to a stable time sequence { X (k) }, when abnormal data X (k) caused by a sudden component failure or a sensor failure enters the system shown in fig. 2, a prediction error { e (k) } will change immediately, and its white noise performance will be also destroyed.
Therefore, it is possible to detect an abnormal situation and whether a failure occurs in the burn-in test apparatus 200 based on this feature, and the 3 σ criterion is adopted as the detection criterion, and the determination method is calculated using the statistics defined as follows:
defining statistics:
an index function to discriminate white noise performance of the error sequence { e (j), j = t-N + 1, t-N +2, \ 8230;, k }.
Wherein
The sample variance of { e (t) } is calculated by:
wherein P can be freely selected, but should be
It can be verified that δ (t) approximately obeys X 2 Distribution with P degree of freedom, so it can be used whether delta (t) obeys X 2 The distribution to determine a white noise property of { e (t) }. If some inputs { e (k) } do not have white noise property continuously, it can be determined that the input of the aging test apparatus 200 is abnormal data, that is, the aging test apparatus 200 has a fault; if there are a few data in a continuous input signal { e (k) } that are individual or discontinuous and do not have white noise property, but the white noise property of the entire data is not greatly affected, it can be determined that the data are bad data, which indicates that the degradation testing apparatus 200 has not failed.
The environmental noise fitting model adopted in the embodiment has good detection capability on the mutation type faults of the aging test device 200, does not need the statistical characteristic of system noise, has good real-time performance, and has strong robustness on the mismatch of the system model.
In an implementation manner, the burn-in test apparatus 200 further includes a noise filtering module, which is communicatively connected to the controller 204;
the noise filtering module is used for collecting an environmental noise signal of the circuit board card and sending the environmental noise signal to the controller;
the controller 204 is further configured to input the environmental noise signal into a preset environmental noise fitting model, and based on the filtered abnormal environmental noise signal of the preset environmental noise fitting model, determine whether the aging test apparatus 200 is operating normally based on the abnormal environmental noise signal.
As an implementation manner, the controller 204 is further configured to control the aging processing module 201 to stop providing the signal excitation to the circuit board when the abnormal duration of the environmental noise signal exceeds the preset abnormal duration of the noise.
Specifically, when the environmental noise fitting model finds that a fault exists in the burn-in tester 200, if the fault cannot be processed for a long time, the damage of the circuit board card may be caused, and even the working safety of the burn-in tester 200 is endangered, so that the burn-in tester 200 can timely stop providing signal excitation to the circuit board to control the fault development trend by presetting abnormal noise duration.
As an implementation manner, the controller 204 is further configured to control the aging processing module 201 to configure the circuit board card to operate at a first rated power, and to control to increase the output power of the heat dissipation module 203 when the actual operating temperature of the circuit board card exceeds a temperature threshold;
the controller 204 is further configured to, when the output power of the heat dissipation module 203 reaches a second rated power, decrease the power configuration provided by the aging processing module 201 to the circuit board to reduce signal excitation if the actual operating temperature of the circuit board, obtained by the parameter monitoring module 202 within a set time, still exceeds the set temperature range.
Specifically, in an embodiment, the heat dissipation module 203 employs a heat dissipation fan, and compared with the case that the actual working temperature of the tested product is controlled by the heat dissipation module 203 alone, when the actual working temperature of the tested circuit board card reaches or exceeds a temperature threshold, the present embodiment improves the output power of the heat dissipation module 203 and adjusts the signal excitation on the circuit board card, thereby adjusting the actual working temperature of the circuit board card in a diversified manner, and maintaining the environmental stability of the aging test as much as possible. Meanwhile, when the cooling fan reaches the rated power, the cooling fan is maintained at the rated power for a long time to work, and the cooling fan becomes a potential safety hazard.
As an implementation manner, the controller 204 is further configured to control the aging processing module 201 to stop providing the signal excitation to the circuit board if the actual working temperature of the circuit board still exceeds the temperature threshold within a second preset time period after the power configuration provided by the aging processing module 201 to the circuit board card is configured to reduce the signal excitation.
Specifically, in order to ensure a safe and stable operation environment of the aging test apparatus 200, a second preset duration is set, so that a complex fault condition that cannot be processed by the heat dissipation module 203 and the reduction of signal excitation on the circuit board card is found in time. In one embodiment, a communication module may be disposed in the aging testing apparatus 200 for notifying a corresponding worker of a complex fault occurring in the aging testing apparatus 200 so that the worker can adjust and recover the aging testing apparatus 200 in time, thereby improving the working efficiency of the aging testing apparatus 200.
As an implementation manner, the burn-in test apparatus 200 further includes a display module 205, wherein the display module 205 is connected to the controller 204;
the controller 204 is further configured to generate an abnormal reminding message indicating that the circuit board card is abnormal and control the display module 205 to display the abnormal reminding message when the actual working temperature of the circuit board exceeds the temperature threshold and/or the environmental noise signal is abnormal; and/or the presence of a gas in the gas,
the display module 205 is further configured to display the actual operating parameter of the circuit board and/or the ambient noise signal.
Specifically, the display module 205 is used for a worker to observe the working parameters of the circuit board under test and whether the circuit board is in an abnormal working state or not, and particularly displays the actual working temperature of the circuit board. In an embodiment, the display module 205 may display an actual working temperature curve of the circuit board card within a preset time period according to a signal of the controller 204, and if a condition that the temperature exceeds a temperature threshold value occurs within the time period, display a corresponding time point at which an abnormal working state occurs on the display module 205, so that a worker can call a corresponding working parameter to perform detection and debugging.
In one embodiment, the display module 205 may also be used as a human-machine interface, and a user can directly operate and control the aging testing apparatus 200 on the display module 205, including but not limited to performing parameter configuration, including information such as system configuration information, aging conditions and parameter limits, where the aging conditions are used to configure the component environment during the aging process, and the parameter limits set the threshold values for automatic system protection and alarm; equipment control, including program control of part of parameters of each instrument in the aging test device 200 and management of aging processes of each component operating console; and database operations, i.e., recording real-time data as a database during the aging process; after aging is complete, historical data may be retrieved and formatted output and data analysis may be supported.
As an implementation manner, the burn-in test apparatus 200 further includes a data storage module 206, wherein the data storage module 206 is connected to the controller 204;
the data storage module 206 is configured to store the operating parameters of the circuit board card and/or the abnormal operating state data of the circuit board card.
Specifically, in order to further improve the aging test of the circuit board card, the data storage module 206 records the working parameters and abnormal states of the circuit board card in the whole aging process, the corresponding power of the heat dissipation module 203, the signal excitation of the aging processing module 201 module and other data, the data is an important reference and research basis for finding the defects of the circuit board card to be tested, and the comprehensive aging test of the circuit board card is realized through multiple dimensions of the actual working temperature, the signal excitation, the heat dissipation data and the environmental noise of the circuit board card.
The aging test device 200 for the circuit board card provided by the embodiment is designed and developed by utilizing the self-heating principle of the circuit board card under the working condition, provides signal excitation and test environment for the board card, controls and adjusts the working temperature of the circuit board card by adopting the self-adaptive filtering algorithm and the classical control algorithm, realizes the charged aging test of the circuit board card for the specified duration, and controls the aging temperature of the circuit board card within the precision range of target temperature +/-2 ℃. And through obtaining diversified parameter data, realize the accurate test to circuit board card ageing.
Example 2
The present embodiment provides a method for burn-in test of a circuit board, as shown in fig. 5, which is implemented by using the apparatus 200 for burn-in test of a circuit board described in embodiment 1, and the method for burn-in test includes:
s101, providing signal excitation of the circuit board card according to set power parameters configured by the controller 204;
s102, obtaining actual working parameters of the circuit board card, wherein the actual working parameters comprise the actual working temperature of the circuit board card and are sent to the controller 204;
and S103, when the actual working temperature exceeds a set temperature range, controlling the working state of the aging processing module 201 module and/or the heat dissipation module 203 until the actual working temperature of the circuit board card is adjusted to be within the set temperature range.
According to the aging test method of the circuit board card, the automatic aging test device of the circuit board card is designed and developed by utilizing the principle of self-heating of the circuit board card under working, signal excitation and test environments are provided for the board card, the working temperature of the circuit board card is controlled and adjusted by adopting a self-adaptive filtering algorithm and a classical control algorithm, an electrified aging test of the circuit board card for a specified time is realized, and the aging temperature of the circuit board card is controlled within the precision range of +/-2 ℃ of a target temperature. And by obtaining diversified parameter data, the aging accurate test of the circuit board card is realized.
As an achievable way, as shown in fig. 6, in the aging test method for the circuit board, firstly, the working state of the aging test apparatus for the circuit board, which is displayed by the controller and the laohua processing module, is observed by the staff, and if the working state is normal, the aging condition and the related working parameters are configured, where the working parameters include, but are not limited to, the working current, the working voltage, the working temperature, the rated power of the circuit board, the corresponding set temperature range, the set time, and the like, the output voltage of the power supply, the frequency, the power, the signal output, and the like configured to the circuit board; and then, starting an aging test flow of the circuit board card, sending each configured control parameter to the controller and supplying power to the controller, and controlling the aging processing module by the controller to provide signal excitation for the circuit board card. In the aging test process, the working state and fault information of each module and the circuit board are provided for workers to observe through the display module under the working preset condition of the controller.
When the controller acquires the working state abnormity or fault information of the circuit board card or other modules, fault information prompt is presented at the display module, the corresponding aging processing module and parameters of each module are acquired at the same time, and the fault information of the circuit board card and the corresponding state information of each module are stored in a local database for subsequent analysis and processing of the fault information.
In one embodiment, if the unit state and/or the fault information of the circuit board card reaches a preset condition for stopping the aging test, the controller performs power-off operation, the aging test module stops signal excitation on the circuit board card, and the fault information is sent to the display module. Or after the worker finds the fault information, the operation controller stops the aging test device.
And after the aging test device stops, the power supply of the aging test device is turned off, namely, the work of each module and the circuit board card is stopped.
In one embodiment, as shown in fig. 7, when the operating temperature of the circuit board is found to exceed the set temperature threshold, the controller adjusts the cooling fan in a PWM (Pulse width modulation) manner to cool and dissipate the heat of the circuit board; and/or the controller adjusts the signal excitation of the aging processing module to the circuit board card, namely adjusts the pulse duty ratio to adjust the pulse output, and adjusts the working power of the circuit board card to realize the adjustment of the working temperature of the circuit board card.
While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that this is by way of example only, and that the scope of the invention is defined by the appended claims. Various changes or modifications to these embodiments may be made by those skilled in the art without departing from the principle and spirit of this invention, and these changes and modifications are within the scope of this invention.
Claims (10)
1. The aging test device for the circuit board card is characterized by comprising a controller, an aging processing module, a parameter monitoring module and a heat dissipation module, wherein the aging processing module, the parameter monitoring module and the heat dissipation module are respectively in communication connection with the controller;
the aging processing module is used for providing the circuit board card signal excitation according to the set power parameter configured by the controller;
the parameter monitoring module is used for acquiring actual working parameters of the circuit board card, wherein the actual working parameters comprise the actual working temperature of the circuit board card and are sent to the controller;
the controller is used for controlling the working state of the aging processing module and/or the heat dissipation module when the actual working temperature exceeds a set temperature range until the actual working temperature of the circuit board card is adjusted to be within the set temperature range.
2. The device according to claim 1, wherein the controller is further configured to input the actual operating temperature parameter into a preset filter fitting model according to a time sequence, and output an actual operating temperature parameter for interference filtering, and the controller determines whether the actual operating temperature of the circuit board exceeds a set temperature range based on the actual operating temperature parameter for interference filtering.
3. The burn-in testing apparatus of a circuit board of claim 1, further comprising a noise filtering module, said noise filtering module being communicatively connected to said controller;
the noise filtering module is used for collecting an environmental noise signal of the circuit board card and sending the environmental noise signal to the controller;
the controller is further used for inputting the environmental noise signal to a preset environmental noise fitting model, filtering out an abnormal environmental noise signal based on the preset environmental noise fitting model, and judging whether the aging test device operates normally based on the abnormal environmental noise signal.
4. The device for testing the aging of circuit boards as claimed in claim 3, wherein the preset ambient noise fitting model is constructed by an adaptive filtering algorithm.
5. The device of claim 3, wherein the controller is further configured to control the aging processing module to stop providing signal excitation to the circuit board when the environmental noise signal anomaly duration exceeds a preset noise anomaly duration.
6. The device for testing the aging of the circuit board card according to claim 1, wherein the controller is further configured to control the aging processing module to configure the circuit board card to operate at a first rated power, and to control the output power of the heat dissipation module to be increased when the actual operating temperature of the circuit board card exceeds a temperature threshold;
the controller is further configured to, when the output power of the heat dissipation module reaches a second rated power, reduce the power configuration provided by the aging processing module to the circuit board to reduce signal excitation if the actual operating temperature of the circuit board, obtained by the parameter monitoring module within a set time, still exceeds the set temperature range.
7. The device of claim 6, wherein the controller is further configured to control the burn-in processing module to stop providing the signal stimulus to the circuit board if the actual operating temperature of the circuit board still exceeds the temperature threshold within a second predetermined time period after the power provided by the burn-in processing module to the circuit board is configured to reduce the signal stimulus.
8. The burn-in test apparatus for the circuit board card according to any one of claims 3 to 7, further comprising a display module, wherein the display module is connected to the controller;
the controller is also used for generating abnormal reminding information of the circuit board card when the actual working temperature of the circuit board exceeds a temperature threshold and/or the environmental noise signal is abnormal and controlling the display module to display; and/or the presence of a gas in the atmosphere,
the display module is further used for displaying the actual working parameters of the circuit board and/or the environmental noise signals.
9. The burn-in testing apparatus of a circuit board of claim 8, further comprising a data storage module, the data storage module being connected to the controller;
and the data storage module is used for storing the actual working parameters of the circuit board card and/or abnormal data when the working state of the circuit board card is abnormal.
10. A method for burn-in testing of a circuit board, which is implemented by the apparatus for burn-in testing of a circuit board according to any one of claims 1 to 9, the method comprising:
providing the circuit board card signal excitation according to the set power parameter configured by the controller;
acquiring actual working parameters of the circuit board card, wherein the actual working parameters comprise the circuit boardThe actual operating temperature of the card is sent to the controller;
and when the actual working temperature exceeds a set temperature range, controlling the working state of the aging processing module and/or the heat dissipation module until the actual working temperature of the circuit board card is adjusted to be within the set temperature range.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115753176A (en) * | 2023-01-09 | 2023-03-07 | 湖南博匠信息科技有限公司 | VPX equipment liquid cooling parameter testing method and system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115753176A (en) * | 2023-01-09 | 2023-03-07 | 湖南博匠信息科技有限公司 | VPX equipment liquid cooling parameter testing method and system |
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