CN115734561A - Hot side pulling device for electronic assembly - Google Patents

Abstract

The invention provides a hot side pulling device of an electronic component, comprising: the electronic component comprises a shell, a liquid inlet interface, a liquid outlet interface, a partition wall and a plurality of guide walls, wherein the shell comprises a contact wall and a heat dissipation wall which are opposite, and side walls which are respectively connected with the contact wall and the heat dissipation wall, the contact wall can be arranged on the heating surface of the electronic component, and a plurality of fins are formed on the heat dissipation wall; the liquid inlet interface and the liquid outlet interface are formed on the side wall; the partition wall is formed in the shell and is connected with the contact wall, the heat dissipation wall and the inner surface of the side wall to divide the inner area of the shell into a liquid inlet flow channel and a liquid outlet flow channel, wherein the liquid inlet flow channel is communicated with the liquid inlet interface, and the liquid outlet flow channel is communicated with the liquid outlet interface; one side of the partition wall, which is far away from the liquid inlet interface, is provided with a pore channel for communicating the liquid inlet flow channel and the liquid outlet flow channel; the guide walls are respectively formed in the liquid inlet flow passage and the liquid outlet flow passage and connected with the inner surface of the contact wall. The technical scheme of the invention can ensure that the electronic component does not generate heat accumulation, and effectively maintains the efficiency and the service life of the electronic component.

Description

Hot side pulling device for electronic assembly

Technical Field

The present invention relates to contact and conductive electronic components, and more particularly to a hot side pull out apparatus for an electronic component.

Background

Due to the trend of reduced size and improved functions of personal computers, cloud servers, automotive electronic devices, and the like, the heat density of electronic components (such as Central Processing Units (CPUs), graphic Processing Units (GPUs), memories, communication circuits, power circuits, and the like) is increasing, and the performance, cost, and life of the electronic components are affected by overheating and poor system heat dissipation, so that the heat dissipation problem of the electronic components becomes a key factor for designing computer systems.

Taking a server as an example, the conventional heat dissipation technology includes: air cooling, liquid cooling, and thermoelectricity. The air cooling mainly uses a fan and a specific air channel to blow cold air to the heating component or draw hot air out of the heating component. The liquid cooling mainly comprises an immersion type and a heat pipe type, wherein the immersion type is that all chips are immersed in cooling liquid of a closed container, the cooling liquid is subjected to thermal change steam, the steam is radiated to a heat radiation plate through a closed pipeline, and the radiated steam is condensed into liquid to flow back to the closed container of the chips; the heat pipe is to arrange a cooling pipeline on a chip or through a heat dissipation fin of the chip, pump conveys the heat-absorbed cooling liquid to a heat dissipation plate for heat dissipation, and then conveys the heat-dissipated cooling liquid to the chip for heat absorption. Thermoelectric is mainly to use the cold side of the thermoelectric refrigeration chip to provide cold energy to cool the server, and then to use air cooling or liquid cooling to remove the heat of the hot side of the refrigeration chip.

In the above-mentioned various heat dissipation technologies, the immersion heat dissipation belongs to three-dimensional (stereo) heat conduction, but the cost of installation and operation is extremely high; the fin radiation and the heat pipe radiation belong to one-dimensional (linear) heat conduction, and heat generated by high-frequency operation of a chip cannot be immediately discharged, so that heat accumulation is caused; the thermoelectric heat dissipation refrigeration chip can theoretically provide a cold surface with extremely low temperature to exchange heat with a heating electronic component, the refrigeration chip can rapidly grow in the application markets of precise temperature control of optical communication, heat circulation of biomedical and semiconductor processing equipment, small consumer refrigerators and the like, but if the heat of the hot surface of the refrigeration chip cannot be rapidly discharged, the heat of the hot surface of the refrigeration chip flows back, so that the temperature of the cold surface of the refrigeration chip rises back to be incapable of reaching the required cold degree for heat dissipation or temperature reduction, and if the temperature of the hot surface rises continuously, the refrigeration chip can be damaged.

How to solve the problem of heat dissipation of the existing electronic component is the main purpose of developing the invention.

Disclosure of Invention

In order to solve various problems of heat dissipation of the existing electronic component, the invention provides a hot side pulling device of the electronic component, comprising: the shell comprises a contact wall, a heat dissipation wall and side walls, wherein the contact wall and the heat dissipation wall are opposite, the side walls are respectively connected with the contact wall and the heat dissipation wall, the contact wall can be arranged on the heat surface of the electronic component, and a plurality of fins are formed on the heat dissipation wall; the liquid inlet interface and the liquid outlet interface are formed on the side wall; the partition wall is formed in the shell and is connected with the inner surfaces of the contact wall, the heat dissipation wall and the side wall to divide the inner area of the shell into a liquid inlet channel and a liquid outlet channel, wherein the liquid inlet channel is communicated with the liquid inlet interface, the liquid outlet channel is communicated with the liquid outlet interface, and one side of the partition wall, which is far away from the liquid inlet interface, is provided with a pore channel communicated with the liquid inlet channel and the liquid outlet channel; the guide walls are respectively formed in the liquid inlet flow passage and the liquid outlet flow passage and connected with the inner surface of the contact wall.

In one embodiment, the housing is made of a metal material.

In one embodiment, the fins are separated from each other by a distance.

In one embodiment, the liquid inlet and the liquid outlet are formed on the same side of the sidewall.

In an embodiment, the number of the partition walls is plural, and the partition walls further divide the housing into intermediate flow passages between the liquid inlet flow passage and the liquid outlet flow passage.

In one embodiment, the guide wall is further formed on the intermediate flow channel.

In one embodiment, the guide wall forms a plurality of protruding strips.

In one embodiment, the partition wall forms a plurality of protruding strips.

In one embodiment, the protruding strips are inclined toward the heat dissipation wall or the contact wall.

In one embodiment, the hot side pulling device of an electronic device further comprises: and the heat conducting pad or the heat radiating paste is clamped between the contact wall and the heating surface.

In the hot side pulling device of the electronic component, the contact wall is in contact with the heating surface of the electronic component, and the heat of the electronic component is quickly conducted to the guide wall, the partition wall, the side wall, the radiating wall and the fins; the partition wall divides the inner area of the shell into a liquid inlet flow channel and a liquid outlet flow channel, so that the heat absorption capacity of the cooling liquid is increased; the guide wall divides the cooling liquid and improves the solid-liquid heat exchange area, so that the cooling liquid absorbs heat uniformly and fully; the fins on the radiating wall increase the solid-gas heat exchange area and conduct the residual heat unabsorbed by the cooling liquid to the air. By the simultaneous action of liquid cooling and air cooling, the hot surface drawing device of the electronic component can quickly conduct the heat of the hot surface of the electronic component to the cooling liquid and the air, ensure that the electronic component does not generate heat accumulation, and effectively maintain the efficiency and the service life of the electronic component.

Drawings

Fig. 1A is a perspective side view of a hot side pull out device of an electronic assembly in accordance with one embodiment of the present invention;

FIG. 1B is a sectional view of section II' of FIG. 1A;

FIG. 1C is a cross-sectional view of section JJ' of FIG. 1A;

FIG. 1D is a cross-sectional view taken at section KK' of FIG. 1A;

FIG. 2 is one of cross-sectional views of a coolant flow path of a hot-side pullout apparatus for an electronic assembly in accordance with other embodiments of the invention;

fig. 3 is a second cross-sectional view of the coolant flow path of the hot-side drawing apparatus of the electronic component according to another embodiment of the present invention.

Description of reference numerals:

1, a hot side pulling device of the electronic component; 10, an electronic component; 11, a shell; 12, a liquid inlet interface; 13, a liquid outlet interface; 14, a dividing wall; 15, a guide wall; 101, a heat-generating surface; 111 contact wall; 112, a heat dissipation wall; 113 side wall; 114, a liquid inlet flow channel; 115, a liquid outlet flow passage; 116, an intermediate flow channel; 140, a pore channel; 141,151 convex strips; 1121, fins.

Detailed Description

The embodiments of the present invention will be described in more detail with reference to the drawings and reference numerals, so that those skilled in the art can implement the invention after reading the description. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Unless the context clearly dictates otherwise, the terms herein include the singular and the plural, and the term "and/or" includes any and all combinations of one or more of the associated listed items; when an element is "connected" or "coupled" to another element, it includes the direct connection of the two elements or the connection of intermediate elements through which fluid can pass; the term "hot side" refers to flat generated or conducted heat.

Fig. 1A is a perspective side view of a hot side pull out device of an electronic assembly in accordance with one embodiment of the present invention; fig. 1B is a sectional view of section II ' in fig. 1A, fig. 1C is a sectional view of section JJ ' in fig. 1A, and fig. 1D is a sectional view of section KK ' in fig. 1A. As shown in fig. 1A to 1D, the electronic component 10 may be a thermoelectric cooling chip, a chip in a computer, a memory, and other components that generate heat, and the hot-side drawing apparatus 1 of the electronic component includes: the shell 11, the liquid inlet port 12, the liquid outlet port 13, the partition wall 14 and a plurality of guide walls 15. The housing 11 has a contact wall 111 and a heat dissipation wall 112 opposite to each other, and a sidewall 113 respectively connecting the contact wall 111 and the heat dissipation wall 112, wherein the contact wall 111 can be disposed on the heat generating surface 101 of the electronic component 10, and a plurality of fins 1121 are formed on the heat dissipation wall 112. The inlet port 12 and the outlet port 13 are formed in the sidewall 113. The partition wall 14 is formed in the housing 11, and connects the inner surfaces of the contact wall 111, the heat dissipation wall 112 and the side wall 113 to divide the interior of the housing 11 into a liquid inlet channel 114 and a liquid outlet channel 115, wherein the liquid inlet channel 114 is connected to the liquid inlet port 12, the liquid outlet channel 115 is connected to the liquid outlet port 13, and a duct 140 is formed on one side of the partition wall 14 away from the liquid inlet port 12 and is connected to the liquid inlet channel 114 and the liquid outlet channel 115. The plurality of guide walls 15 are formed in the inlet flow path 114 and the outlet flow path 115, respectively, and connected to the inner surface of the contact wall 111.

In this embodiment, each part of the hot-side drawing device 1 of the electronic component may be made of a metal material with high thermal conductivity (for example, but not limited to, aluminum, copper, aluminum-magnesium alloy, and copper alloy), and taking aluminum as an example, an aluminum ingot is processed into the hot-side drawing device 1 of the electronic component through steps of extrusion molding (aluminum extrusion), computer Numerical Control (CNC) equipment processing, welding, plasma cleaning, and the like, and then the liquid pressure test is performed to test the tightness of the hot-side drawing device 1 of the refrigeration chip capable of withstanding the conveying pressure of the cooling liquid. The size of the outer surface of the contact wall 111 may be designed depending on the number and size of the corresponding electronic components 10, the area of the outer surface of the contact wall 111 being larger than the area of one or more (e.g., but not limited to, two, three, four) heat generating surfaces 101; the fins 1121 of the heat dissipation wall 112 are plate-shaped and are arranged in parallel at a certain distance; the side wall 113 is a rectangular frame body, and is respectively jointed with the four sides of the contact wall 111 and the heat dissipation wall 112; the liquid inlet ports 12 and the liquid outlet ports 13 are formed on the same side of the side wall 113, the number of the partition walls 14 is three, the partition walls 14 located on both sides further divide the middle runner 116 located between the liquid inlet runner 114 and the liquid outlet runner 115 in the housing 11, a duct 140 is formed on one side of the partition wall 14 dividing the liquid inlet runner 114 and the middle runner 116, which is far away from the liquid inlet port 12, a duct 140 is formed on one side of the partition wall 14 in the center of the middle runner 116, which is close to the liquid inlet port 12, and a duct 140 is formed on one side of the partition wall 14 dividing the middle runner 116 and the liquid outlet runner 115, which is far away from the liquid inlet port 12; the guide wall 15 is further formed at the intermediate runner 116; the partition wall 14 and the guide wall 15 are formed with a plurality of ribs 141,151 inclined toward the heat dissipating wall 112.

It is worth to be noted that, since the thermal conductivity of the liquid is lower than that of the solid, the flow rate of the cooling liquid is too high, the staying time in the shell 11 is short, and the heat absorption capacity is less; the flow rate of the cooling liquid is too low, the stay time in the shell 11 is long, the heat absorption capacity is large, and the heat dissipation rate is low; therefore, too fast or too slow a flow rate of the cooling fluid may reduce the contact surface heat conduction rate, causing heat accumulation on the heat generating surface 101 and resulting in an increase in the temperature of the electronic component 10. In the present embodiment, the cross section perpendicular to the coolant flowing direction is the same as the cross sections of the inlet port 12 and the outlet port 13 through which the coolant passes, and the cross sections of the inlet flow channel 114 and the outlet flow channel 115 are 90% to 99% of the cross sections of the inlet port 12 and the outlet port 13. The sectional area of the duct 140 on the partition wall 14 is 90% -99% of the liquid inlet port 12 and the liquid outlet port 13, so as to generate the cooling liquid flow with heat absorption and heat removal effects.

After the refrigeration chip is powered on, heat generated by the heat-generating surface 101 is conducted to the contact wall 111, the thermal conductivity of the solid is higher than that of liquid and gas, the contact wall 111 can rapidly and sequentially conduct the heat to the flow guide walls 15, the convex strips 141,151, the partition walls 14, the side walls 113, the heat-radiating walls 112 and the fins 1121, the cooling liquid flows into the shell from the liquid inlet port 12, flows through the liquid inlet flow channel 114, the pore channel 140, the middle flow channel 116 and the liquid outlet flow channel 115 and flows along the 1258585 (zigzag) shaped flow channel in the shell 11 to absorb the heat of the side walls 113, the partition walls 14, the flow guide walls 15, the convex strips 141,151, the heat-radiating walls 112 and the fins 1121, and the cooling liquid after heat absorption flows out of the shell 11 from the liquid outlet port 13.

The partition walls 14 divide the liquid inlet channel 114 and the liquid outlet channel 115, so that the cooling liquid can flow through the inside of the housing 11 to absorb heat, and the number of the partition walls 14 and the intermediate channels 116 can prolong the time of the cooling liquid staying in the housing 11, thereby increasing the heat absorption capacity of the cooling liquid. The flow guide walls 15 and the raised strips 151 greatly increase the solid-liquid heat exchange area, the multiple layers of raised strips 141 and 151 can shunt the cooling liquid to absorb the heat of the partition walls 14, the flow guide walls 15 and the raised strips 141 and 151 under the condition of not influencing the flow rate of the cooling liquid, and gaps (0.1 to 1.0 mm) between the top ends of the flow guide walls 15 and the heat dissipation walls 112 and between the front ends of the raised strips 141 and 15 and the side walls 113 can be used for the cooling liquid to simultaneously absorb the heat through the flow guide walls 15 and the raised strips 141 and 151 at different positions, so that the cooling liquid can uniformly and fully absorb the heat in the shell 11.

If the cooling liquid does not completely absorb the heat conducted from the heating surface 101, the remaining heat will be conducted to the air from the side wall 113, the heat dissipation wall 112 and the surfaces of the fins 1121, the fins 1121 on the heat dissipation wall 112 greatly increase the heat dissipation surface area, and the space formed by the temperature difference between the fins 1121 and the air and the distance between the fins 1121 can induce the air flow, discharge the hot air and introduce the cold air, so as to increase the heat exchange rate of the gas, or a fan (not shown) can be additionally installed at one side of the fins, so as to force the air to pass between the surface of the fins 1121 and the fins 1121, thereby further improving the air cooling effect; by the simultaneous action of liquid cooling and air cooling, the hot side pull-out device 1 of the electronic component can rapidly discharge heat generated by the heat generating surface 101 to the cooling liquid and air, thereby ensuring that the electronic component 10 does not generate heat accumulation and effectively maintaining the efficiency and the service life of the electronic component.

If the contact wall 111 and the heat-generating surface 101 are not in close contact with each other, air entering between the two surfaces will affect heat conduction, and the heat-side pulling device of the electronic component of the present invention may further sandwich a heat-conducting pad or a heat-dissipating paste (such as silver paste or copper paste, not shown) containing a component with high thermal conductivity (such as carbon fiber, metal particles, and graphene) between the contact wall 111 and the heat-generating surface 101, so as to improve the heat-conducting efficiency between the heat-generating surface 101 and the contact wall 111.

In other embodiments, the fins on the heat dissipation wall may be in the form of a wave-shaped plate or a plurality of spaced apart cylindrical bodies; the cooling liquid flows into the shell from the liquid inlet interface positioned on one side of the side wall, flows in a reciprocating manner in the shell along the 12585-shaped flow channel, and flows out of the shell from the liquid outlet interface positioned on the opposite side of the side wall.

Fig. 2 and 3 are sectional views of coolant flow channels of hot-side drawing devices of electronic assemblies according to other embodiments of the present invention. As shown in fig. 2 and 3, the partition wall 14 connects the contact wall 111 and the heat dissipation wall 112, a liquid inlet channel 114 (or a liquid outlet channel 115) is formed between the partition wall 14 and the side wall 113, the guide wall 15 is formed on the contact wall 111, two sides of the guide wall 15 are formed with protruding strips 151, one protruding strip 151 inclines towards the heat dissipation wall 112, and the other protruding strip 151 inclines towards the contact wall 111 (as shown in fig. 2); or two convex strips 151 are formed on two sides of the flow guiding wall 15, and the two convex strips 151 are all inclined towards the heat dissipating wall 112 (as shown in fig. 3); the arrangement and configuration of the flow guide walls 15 and the raised strips 151 can increase the solid-liquid heat exchange area, so that the cooling liquid can uniformly and fully absorb the heat conducted by the heating surface of the electronic component.

In summary, in the hot side pulling device of the electronic component of the present invention, the contact wall contacts the heat generating surface of the electronic component to rapidly conduct the heat of the electronic component to the flow guide wall, the partition wall, the side wall, the heat dissipating wall and the fins; the partition wall divides the inner area of the shell into a liquid inlet flow channel and a liquid outlet flow channel, so that the heat absorption capacity of the cooling liquid is increased; the guide wall divides the cooling liquid and improves the solid-liquid heat exchange area, so that the cooling liquid absorbs heat uniformly and fully; the fins on the radiating surface of the shell increase the solid-gas heat exchange area and transfer the residual heat unabsorbed by the cooling liquid to the air. By the simultaneous action of liquid cooling and air cooling, the hot-face drawing device of the electronic component can quickly discharge heat generated by the electronic component to cooling liquid and air in a face conduction mode, thereby ensuring that the electronic component does not generate heat accumulation and effectively maintaining the efficiency and the service life of the electronic component.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Modifications, combinations, and variations of the above-described embodiments can be made by one skilled in the art without departing from the spirit and scope of the invention. Accordingly, it will be appreciated by those skilled in the art that various modifications, combinations, or changes in form and detail can be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. A hot-side pullout apparatus for an electronic component, comprising:

the heat dissipation device comprises a shell, a heat dissipation component and a heat dissipation component, wherein the shell comprises a contact wall and a heat dissipation wall which are opposite, and side walls which are respectively connected with the contact wall and the heat dissipation wall, the contact wall can be arranged on a heating surface of an electronic component, and a plurality of fins are formed on the heat dissipation wall;

the liquid inlet interface and the liquid outlet interface are formed on the side wall;

the separation wall is formed in the shell and is connected with the contact wall, the heat dissipation wall and the inner surface of the side wall to divide the inner area of the shell into a liquid inlet channel and a liquid outlet channel, wherein the liquid inlet channel is communicated with the liquid inlet interface, the liquid outlet channel is communicated with the liquid outlet interface, and one side of the separation wall, which is far away from the liquid inlet interface, is provided with a pore channel communicated with the liquid inlet channel and the liquid outlet channel; and

and the guide walls are respectively formed in the liquid inlet flow channel and the liquid outlet flow channel and connected with the inner surface of the contact wall.

2. The hot-face extraction apparatus for electronic components of claim 1 wherein the housing is formed of a metallic material.

3. The hot-face extraction apparatus of an electronic assembly as claimed in claim 1 wherein the plurality of fins are spaced apart from one another by a distance.

4. The device of claim 1, wherein the fluid inlet and the fluid outlet are formed on the same side of the sidewall.

5. The hot-side pulling apparatus for electronic component of claim 1, wherein the number of the dividing walls is plural, and the plural dividing walls divide the housing into intermediate flow paths between the liquid inlet flow path and the liquid outlet flow path.

6. The hot-side pullout apparatus for an electronic component according to claim 5, wherein the flow guide walls are formed in the intermediate flow path.

7. The hot-face extraction apparatus for electronic components of claim 1 wherein the plurality of flow guide walls define a plurality of ribs.

8. The hot-side pullout apparatus for electronic assembly according to claim 7, wherein the plurality of partition walls form a plurality of ribs.

9. The hot-side pulling apparatus for an electronic component according to claim 7 or 8, wherein the plurality of ribs are inclined toward the heat dissipation wall or the contact wall.

10. The hot-side pullout apparatus for an electronic component according to claim 1, further comprising: and the heat conducting pad or the heat radiating paste is clamped between the contact wall and the heating surface.

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