CN115732618A - Protective film forming apparatus - Google Patents

Abstract

The invention provides a protective film forming apparatus capable of forming a protective film with a flat surface without causing burden to elements. The protective film forming apparatus includes: a resin supply unit configured to supply a liquid curable resin to a surface of the substrate on which the element is mounted; a substrate holding unit that holds a substrate to which a curable resin is supplied; a support part arranged opposite to the substrate holding part; a tape supply unit for supplying an adhesion preventing tape between the substrate holding unit and the support unit; a pressing part which presses the substrate toward the supporting part, presses the curable resin supplied to the substrate against the adhesion preventing tape, and spreads the curable resin on the substrate; a curing section that cures the curable resin spread on the substrate; and a curing control section that controls to increase a speed at which the curing section cures the curable resin while the substrate is pressed by the pressing section and the curable resin is pressed against and spread on the adhesion preventing tape by the pressing section.

Description

Protective film forming apparatus

Technical Field

The present invention relates to a protective film forming apparatus.

Background

In recent years, development of large-sized display devices and illumination devices has been advanced in which LED modules each having a plurality of Light Emitting Diode (LED) elements mounted thereon are arranged and spread over a substrate in a plurality of rows and a plurality of columns. Various modules have been developed in which a plurality of functional elements are combined. In such a display device, an illumination device, or a module, the element is sealed with a sealing member such as a curable resin from the viewpoint of protection such as deterioration suppression.

The resin as the sealing member is applied in a liquid state to the surface of the substrate on which the element is mounted, and then cured by heat, light, or the like. In this case, the thickness of the seal member is likely to be different between the center portion and the end portion, for example. In particular, it is difficult to control the thickness of the end portion, and therefore, for example, when the LED module is fully covered, the difference in thickness of the end portion becomes a step, which may affect the display of the display device. Further, in an illumination module such as a backlight, there is a possibility that a variation in illuminance distribution occurs, and in other modules, it is difficult to mount the module in a thin package. In order to solve such a problem, attempts have been made to use a sheet-like sealing member having a constant thickness instead of a liquid sealing member. For example, in the technique disclosed in patent document 1, a sheet-like sealing member having a constant thickness is used for each module, and it is desired to make the seams between the modules inconspicuous.

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent laid-open No. 2021-9937

Disclosure of Invention

[ problems to be solved by the invention ]

However, when the sheet-like sealing member is used, a high pressure is required to push the sheet-like sealing member into a gap between irregularities of the mounted element, and thus, the element is not only burdened but also may be misaligned or laterally rotated. On the other hand, if the pressure pushing the sealing member is insufficient, the sealing member may not sufficiently enter the gap between the elements, and the elements may not be protected. Further, when the thickness of the sheet-like sealing member is thin relative to the height of the element, the surface of the sealing member may become uneven due to the unevenness of the element. In particular, when the thicknesses of the elements arranged in the module are different, these influences become large.

The invention aims to provide a protective film forming device which can form a protective film with a flat surface without causing burden to elements.

[ means for solving the problems ]

The protective film forming apparatus of the present invention includes: a resin supply unit configured to supply a liquid curable resin to a surface of the substrate on which the element is mounted; a substrate holding section that holds the substrate to which the curable resin is supplied; a support portion provided to face the substrate holding portion; a tape supply unit configured to supply an adhesion preventing tape between the substrate holding unit and the support unit; a pressing portion that presses the substrate toward the support portion, presses the curable resin supplied to the substrate against the adhesion preventing tape, and stretches the curable resin on the substrate; a curing section that cures the curable resin; and a curing control unit that controls the curing unit to increase a speed at which the curable resin is cured while the curable resin is pressed against the adhesion prevention tape by the pressing unit and is spread on the substrate.

[ Effect of the invention ]

The protective film forming apparatus of the present invention can form a protective film having a flat surface without imposing a burden on an element.

Drawings

Fig. 1 (a) and 1 (B) are side views showing a workpiece according to the first embodiment.

Fig. 2 is a side view showing a protective film forming apparatus according to a first embodiment.

Fig. 3 is a front view showing a cured part and the periphery thereof of the protective film forming apparatus according to the first embodiment.

Fig. 4 is a perspective view showing a substrate holding portion according to the first embodiment.

Fig. 5 is a three-side view showing the substrate holder according to the first embodiment.

Fig. 6 (a) to 6 (F) are diagrams illustrating a protective film forming flow according to the first embodiment.

Fig. 7 is a block diagram showing a control device according to the first embodiment.

Fig. 8 is a flowchart showing a protective film formation procedure of the first embodiment.

Fig. 9 is a front view showing a contact portion according to another embodiment.

Fig. 10 is a front view showing a cured portion according to each embodiment.

Fig. 11 (a) to 11 (D) are plan views, side views, and arrangement examples showing heaters or irradiation portions of the curing unit according to the respective embodiments.

Fig. 12 (a) to 12 (C) are diagrams illustrating a method of controlling the heater or the irradiation unit during pressing according to each embodiment.

Fig. 13 (a) to 13 (D) are diagrams illustrating a protective film formation flow according to another embodiment.

Fig. 14 is a front view of the protection forming device showing the operation of peeling the adhesion preventing tape in each embodiment.

[ description of symbols ]

1: workpiece

2: protective film

3: protective film forming apparatus

8: control device

11: supporting substrate

12: flexible substrate

13: light emitting element

31: turning part

32: resin supply part

32a: nozzle with a nozzle body

33: substrate holding part

34: support part

35: tape supply unit

36: pressing part

37: cured part

81: turnover part control part

82: resin supply control part

83: with suction control unit

84: tape supply amount control unit

85: press control unit

86: curing control part

87: storage unit

88: setting part

89: input/output control unit

91: input device

92: output device

311: arm(s)

311a: driving mechanism

312: XYZ moving mechanism

331: step difference part

331a: substrate holding surface

332: foot part

332a: spring part

333: abutting part

341: base station

341a: upper surface of the base 341

342: holding member

342a: upper surface of the holding member 342

343: foot part

351: supply reel

352: recovery reel

401: base seat

402: contact plate

411: heaters or UV light sources

412: heater or UV light source off

413: heater or UV light source on

L: a predetermined distance

R: curable resin

S01 to S10: step (ii) of

T: anti-adhesion belt

And TS: with a support part

X, Y, Z, θ, α: direction of rotation

Detailed Description

(A) First embodiment

A first embodiment (hereinafter, referred to as the present embodiment) of the present invention will be specifically described with reference to the drawings. First, a protective film formation target and a protective film will be described, and then a protective film formation apparatus will be described. The drawings schematically show the present embodiment.

[ object of formation of protective film ]

As shown in fig. 1 (a), a work 1 to be coated with a protective film according to the present embodiment includes: a support substrate 11, a flexible substrate 12 supported on one surface of the support substrate 11, and light emitting elements 13 arranged and mounted on the surface of the flexible substrate 12. The work 1 is a module substrate which is formed by peeling the support substrate 11 after the formation of the protective film 2 described later, and is laid in a matrix of a plurality of rows and a plurality of columns to constitute a display device.

The support substrate 11 is, for example, a glass substrate. The flexible substrate 12 is made of, for example, polyimide, and is supported on one surface of the support substrate 11. The flexible substrate 12 is a substrate for supporting the light emitting element 13 by forming the protective film 2 after mounting the light emitting element 13 and removing the supporting substrate 11. The light emitting element 13 is, for example, an LED element, and is mounted on the surface of the flexible substrate 12. The light emitting element 13 of the present embodiment is, in particular, a micrometer-sized LED element, and has a height of, for example, 25 μm.

[ protective film ]

As shown in fig. 1 (B), a protective film 2 for sealing the light-emitting element 13 is formed on the work 1. The protective film 2 is a film formed by curing a liquid curable resin R. The curable resin R is, for example, a thermosetting resin which is cured by heat. The viscosity of the curable resin R in an initial state is, for example, 4000mPa · s. The curable resin R is supplied to the surface of the work 1 on the side where the light emitting elements 13 are provided, and spreads over the work 1 as described later. Then, the curable resin R spread on the work 1 is cured, thereby forming the protective film 2 on the work 1. The thickness of the protective film 2 is, for example, 50 μm to 300 μm. The protective film 2 is not formed on the entire surface of the workpiece 1, and is not formed on the outer peripheral portion of the workpiece 1. The outer peripheral portion where the protective film 2 is not formed, that is, the portion outside the protective film forming region, is a portion that is to be cut out in a post-process so as not to function as a module or a portion connected to a connection terminal outside the module. The portion outside the protective film forming region is used for allowing the protrusion when forming the protective film or holding the workpiece 1 in forming the protective film 2.

[ protective film Forming apparatus ]

[ Structure ]

The protective film forming apparatus 3 supplies a curable resin R to the work 1, and spreads and cures the curable resin R on the work 1, thereby forming the protective film 2 on the work 1. As shown in fig. 2 and 3, the protective film forming apparatus 3 includes: an inverting unit 31 that holds the workpiece 1 carried in from the outside and inverts the workpiece 1 after the curable resin R is supplied; a resin supply unit 32 for supplying a curable resin R to one surface of the workpiece 1; a substrate holding unit 33 that receives the work 1 to which the curable resin R has been supplied from the inverting unit 31 and holds the work 1 in an inverted state; a support portion 34 provided opposite to the substrate holding portion 33; a tape supply unit 35 that supplies an adhesion preventing tape T for preventing the curable resin R from adhering to the support unit 34, between the substrate holding unit 33 and the support unit 34; a pressing portion 36 that presses the other surface of the workpiece 1 toward the supporting portion 34 and presses the curable resin R to the supporting portion 34 via the adhesion preventing tape T; and a curing unit 37 for curing the curable resin R to form the protective film 2 on the work 1. The protective film forming apparatus 3 is provided with a control device 8 for controlling these respective components.

In fig. 3, the pressing direction of the pressing portion 36 against the workpiece 1 is defined as the Z direction, the feeding direction of the tape supply portion 35 against the adhesion preventing tape T is defined as the X direction, and the direction orthogonal to the Z direction and the X direction is defined as the Y direction in a plane orthogonal to the Z direction. The Y direction is a direction passing through the paper surface in the figure. For example, when the protective film forming apparatus 3 is provided so that the Z direction is the vertical direction, the XY plane is a horizontal plane. In this case, the Z direction is the height direction, the installation surface side is referred to as the lower side, and the opposite side is referred to as the upper side. That is, the lower direction means the direction of gravity. The rotation direction parallel to the XY plane is referred to as the θ direction, and the rotation direction parallel to the YZ plane is referred to as the α direction.

As shown in fig. 2, the reversing section 31 holds the work 1 carried in from the outside by a not-shown conveying member or the like so that the surface on which the light emitting element 13 is mounted, that is, the surface to which the curable resin R is supplied, faces upward. Further, after supplying the curable resin R to the work 1, the inverting unit 31 inverts the work 1 so that the surface on which the curable resin R is supplied faces downward, and delivers the work to the substrate holding unit 33. After the protective film 2 is formed on the workpiece 1, the reversing unit 31 receives the workpiece 1 from the substrate holding unit 33, reverses the workpiece, and returns the workpiece to the original position. The workpiece 1 returned to the original position with the protective film 2 formed thereon is collected from the reversing section 31 by a conveying member, not shown, for example, which conveys the workpiece 1 to the outside from the protective film forming apparatus 3.

The turning section 31 includes: an arm 311 that holds the workpiece 1 from the support substrate 11 side by, for example, vacuum suction; and an XYZ movement mechanism 312 that supports the arm 311 and moves the arm 311 in the XYZ direction. The arm 311 is, for example, a rectangular parallelepiped arm extending in a direction parallel to the XY plane. An end of the arm 311 is opened with a suction hole for holding the workpiece 1. The suction hole is connected to an air pressure circuit, not shown, and the arm 311 sucks and holds the workpiece 1 by negative pressure generated in the air pressure circuit. Further, the arm 311 releases the held workpiece 1 by releasing the negative pressure. Further, the arm 311 is provided rotatably in the α direction by a drive mechanism 311a provided at the other end, and turns the workpiece 1 held by the suction hole by 180 °. The XYZ movement mechanism 312 includes, for example, a motor, a linear guide, a ball screw, and the like, and moves the arm 311 in the XYZ direction.

The resin supply unit 32 is connected to a resin supply device, not shown, including a liquid feeding device, a valve, and the like, for example, and discharges the curable resin R in a liquid state from the nozzle 32 a. The nozzle 32a of the present embodiment is provided above the inverting unit 31, and faces the surface of the work 1 held by the inverting unit 31 on which the protective film is formed, that is, the surface on which the light emitting element 13 is mounted. The resin supply unit 32 can be moved in the XYZ direction by a drive mechanism, not shown, and can supply the curable resin R in a liquid state to an arbitrary portion of the surface of the work 1 held by the inverting unit 31 on the side on which the light emitting element 13 is mounted. Therefore, the curable resin R discharged from the nozzle 32a is supplied to the surface of the workpiece 1 on which the light-emitting element 13 is mounted.

The substrate holding unit 33 holds the workpiece 1 transferred to and from the reversing unit 31. As shown in fig. 2, the substrate holding portion 33 is provided at a position where the workpiece 1 can be transferred to and from the reversing portion 31, for example, at a position in the Y direction and in parallel with the reversing portion 31. The substrate holding portion 33 is supported by a guide, not shown, and is disposed above the supporting portion 34 so as to be vertically movable while being held in parallel. The substrate holding portion 33 is biased in a direction away from the support portion 34 by a spring portion 332a which is an elastic member having elasticity. That is, the substrate holding portion 33 is supported by the spring portion 332a and is disposed to be spaced from the support portion 34.

The substrate holding portion 33 includes a pair of leg portions 332. The leg 332 is a member protruding downward from the lower surface of the substrate holding portion 33. I.e. towards the support 34. The lower end of the leg portion 332 is connected to an upper surface 341a of a base 341 of the support portion 34 described later via a spring portion 332 a.

As shown in fig. 4 and 5, the substrate holding portion 33 is a frame. That is, the substrate holding portion 33 is a plate-like member having an opening in the center of the frame body with a size corresponding to the size of the workpiece 1, and holds the workpiece 1 by the step portion 331 provided in the opening. The step 331 is provided to protrude from an inner surface of the opening to narrow a lower side of the opening, and an upper surface of the protruding portion abuts on an outer peripheral portion of the workpiece 1 to hold the workpiece 1. Therefore, hereinafter, the upper surface of the step portion 331 is also referred to as a substrate holding surface 331a. As described above, the protective film 2 is not formed on the entire surface of the workpiece 1 but is formed in a predetermined region. That is, there is a region where the protective film 2 should be formed, that is, a protective film forming region. Therefore, the protective film 2 is formed on the work 1 by curing the curable resin R extending in the protective film forming region. The protective film forming area is set according to the size of the work 1. The opening having a size corresponding to the size of the workpiece 1 in the substrate holding portion 33 is an opening having a size including at least the protective film forming region. That is, the opening is provided for exposing a region where the curable resin R extends on the work 1.

The lower surface of the substrate holding portion 33 where the pair of leg portions 332 are connected serves as an abutting portion 333 that abuts against the adhesion preventing tape T held by the support portion 34 described later. The adhesion preventing tape T is supplied between the substrate holding portion 33 and the supporting portion 34, and between the pair of leg portions 332 and the spring portions 332a provided at the lower ends thereof, as will be described later. Therefore, the abutting portion 333 is a portion that serves as a stopper portion that abuts against the support portion 34 via the adhesion preventing tape T to stop the substrate holding portion 33 when the substrate holding portion 33 is pressed against the biasing force of the spring portion 332a toward the support portion 34. The contact surface of the contact portion 333 is lower than the substrate holding surface 331a. That is, the substrate holding surface 331a is spaced further from the support portion 34 than the contact surface of the contact portion 333. The distance in the height direction (Z direction) between the contact part 333 and the substrate holding surface 331a is set to be a desired thickness of the protective film 2. Thus, a predetermined gap is formed between the substrate holding surface 331a and the surface of the adhesion preventing tape T, and thus a predetermined gap is formed between the surface of the workpiece 1 to which the curable resin R is supplied and the surface of the adhesion preventing tape T in a state where the workpiece 1 is held on the substrate holding surface 331a.

The supporting portion 34 is provided opposite to the substrate holding portion 33, and supports the surface of the workpiece 1 pressed by the pressing portion 36 to which the curable resin R is supplied, via the adhesion preventing tape T. The support portion 34 includes a base 341 and a holding member 342 provided on an upper surface 341a of the base 341 and holding the anti-adhesion tape T. The base 341 is a base of the support portion 34 and a table supporting the holding member 342. The holding member 342 is detachably supported by the base 341. The holding member 342 has a flat surface that is in contact with the curable resin R through the adhesion preventing tape T. The adhesion preventing tape T is a tape that prevents the curable resin R from directly contacting and adhering to the holding member 342.

The holding member 342 is, for example, a gas-permeable porous plate-like member in which fine spaces communicating with each other as a whole are densely and substantially uniformly formed, and includes sintered ceramics or sintered metal. Therefore, the holding member 342 of the present embodiment has fine holes opened substantially uniformly over the entire surface. The holding member 342 is connected to an air pressure circuit, not shown, and the holding member 342 including the air-permeable porous material can apply a negative pressure to its surface by the negative pressure generated by the air pressure circuit. Thereby, the holding member 342 sucks and holds the adhesion preventing tape T. Also, the holding member 342 releases the held adhesion preventing tape T by releasing the negative pressure. As described above, since the holding member 342 of the present embodiment is air-permeable and porous, fine holes are opened substantially uniformly over the entire surface, and when negative pressure is applied to the holding member 342 from the back surface thereof, negative pressure is generated in all the fine holes, so that the adhesion preventing tape T can be sucked and held over the entire surface.

As shown in fig. 3, the tape supply unit 35 is provided with a supply reel 351 and a take-up reel 352 provided at positions sandwiching the substrate holding unit 33 in the X direction, and supplies the anti-adhesion tape T between the workpiece 1 held by the substrate holding unit 33 and the holding member 342 of the support unit 34. The supply reel 351 is freely attachable and detachable and is rotatable, and a braking force is applied to the rotation thereof by a tension mechanism not shown. The take-up reel 352 is freely attachable and rotatable, and is rotationally driven by a motor not shown. The anti-adhesion tape T is wound around the supply reel 351, drawn out by the rotational driving of the take-up reel 352, and wound around the take-up reel 352 to be taken up. That is, the anti-adhesion tape T is fed to the holding member 342 of the support portion 34 by the cooperation of the supply reel 351 and the take-up reel 352. In addition, tape supporting portions TS are provided on both sides of the supporting portion 34 in a path in which the adhesion preventing tape T fed out from the supply reel 351 is wound around the take-up reel 352. The tape supporting section TS supports the anti-adhesion tape T at a height at which the anti-adhesion tape T fed to the holding member 342 of the supporting section 34 is fed so as to be slightly in contact with the upper surface 342a of the holding member 342 or to form a gap therebetween.

The adhesion preventing tape T prevents the curable resin R supplied to the side of the workpiece 1 on which the light emitting element 13 is mounted from adhering to the holding member 342 of the support portion 34 when pressed against the support portion 34 by the pressing portion 36. The adhesion preventing tape T is a tape having liquid repellency to the curable resin R, and is, for example, a tape in which a silicone coating is applied to the surface of a substrate made of polyethylene terephthalate (PET). Accordingly, after the protective film is formed, the adhesive force generated by curing the curable resin R is weakened to act on the adhesion preventing tape T, and the adhesion preventing tape T is easily peeled from the workpiece 1.

In order to prevent the curable resin R from sticking to the holding member 342 by winding out of the adhesion preventing tape T, the width of the adhesion preventing tape T is preferably larger than the width of the holding member 342. Further, according to the study of the inventors, when the adhesion preventing tape T is too thin, when the curable resin R is pressed or heated, warpage or wrinkles are concentrated on the adhesion preventing tape T, and the state of the warpage or wrinkles is transferred to the curable resin R, thereby generating deformation or unevenness on the surface of the protective film 2 formed by curing the curable resin R. Further, the unevenness on the surface of the support portion 34 may be transferred. Therefore, the thickness of the anti-adhesion tape T is preferably as thick as 190 μm or more, for example.

However, if the thickness of the anti-sticking tape T is too large, the length of the tape that can be wound around the supply reel 351 or the take-up reel 352 becomes short, and the supply reel 351 or the take-up reel 352 must be frequently replaced. Further, the flexibility of the adhesion preventing tape is lost, and there is a possibility that it is difficult to supply the adhesion preventing tape T in parallel to the holding member 342 or the adhesion preventing tape T cannot be brought into close contact with the holding member 342. Therefore, the thickness of the adhesion preventing tape T is selected so that, in consideration of heat resistance, flexibility, and surface hardness, the adhesion preventing tape T is not warped or wrinkled and concentrated on the adhesion preventing tape T when the curable resin R is pressed or heated, or the unevenness on the surface of the support portion 34 is not transferred.

The pressing portion 36 is a plate-shaped member that presses the workpiece 1 held by the substrate holding portion 33, and presses the substrate holding portion 33 against the adhesion preventing tape T. The pressing portion 36 is provided on the opposite side of the supporting portion 34 to the substrate holding portion 33. The pressing portion 36 includes a flat pressing surface facing the workpiece 1. The pressing portion 36 is lowered or raised by a driving mechanism, not shown, including an air cylinder or the like, for example. Thereby, the pressing portion 36 presses the workpiece 1 held by the substrate holding portion 33, and the curable resin R supplied to the workpiece 1 is pressed against the surface of the adhesion preventing tape T held by the supporting portion 34. At this time, the curable resin R supplied to the workpiece 1 is spread between the surface of the adhesion preventing tape T and the surface of the workpiece 1.

More specifically, as shown in fig. 6 (C), the substrate holding portion 33 is pressed via the workpiece 1 by the pressing of the pressing portion 36, and the spring portion 332a of the leg portion 332 of the substrate holding portion 33 connected to the supporting portion 34 contracts. The leg portion 332 contracts the spring portion 332a, thereby narrowing the distance from the substrate holding surface 331a of the substrate holding portion 33 to the adhesion preventing tape T. The substrate holding portion 33 pushed down by the pressing portion 36 is stopped by the contact portion 333 contacting the surface of the adhesion preventing tape T held by the holding member 342 of the supporting portion 34. At this time, the distance from the surface of the adhesion preventing tape T held by the holding member 342 to the surface (substrate holding surface 331 a) of the workpiece 1 to which the curable resin R is supplied is, for example, 50 μm to 300 μm, and the curable resin R extends in the gap. Therefore, the distance is the height of the protective film 2 formed by curing the curable resin R. The distance is determined according to the height (thickness) of the protective film 2 required. That is, the distance is a predetermined gap between the surface of the workpiece 1 to which the curable resin R is supplied and the surface of the adhesion preventing tape T. The distance is set by the substrate holding portion 33 contacting the support portion 34 via the adhesion preventing tape T. As described above, the outer peripheral portion of the surface of the work 1 to which the curable resin R is supplied abuts on the substrate holding surface 331a. The abutting portion 333 is a lower surface of a portion of the substrate holding portion 33 connecting the pair of leg portions 332, and a distance from a surface (contact surface) abutting against the supporting portion 34 to the substrate holding surface 331a is a height of the abutting portion 333 (indicated by L in fig. 5). Therefore, the height of the contact portion 333 is a distance from the surface of the adhesion preventing tape T held by the holding member 342 to the surface (substrate holding surface 331 a) of the workpiece 1 to which the curable resin R is supplied, and is the height of the protective film 2. Therefore, the height of the abutting portion 333 is set according to the required height (thickness) of the protective film 2.

In this way, when the substrate holding portion 33 is pressed by the pressing portion 36, a predetermined gap can be secured between the surface of the workpiece 1 to which the curable resin R is supplied and the surface of the adhesion preventing tape T by the abutment of the abutment portion 333. The contact portion 333 is a back surface (a surface on the support side, a lower surface) of a portion of the substrate holding portion 33 that straddles the support portion 34. The contact surface of the contact portion 333 may be the entire part of the support portion 34 or may be provided only in a part thereof.

As shown in fig. 3 and 6 (a) to 6 (F), the curing section 37 cures the curable resin R spread on the work 1 by the pressing section 36, thereby forming the protective film 2 on the work 1. In the present embodiment, the curable resin R is a thermosetting resin, and accordingly, the curing unit 37 is, for example, a heater that generates heat by applying a voltage. The cured portion 37 is provided inside the pressing portion 36. Thereby, the heat of the curing portion 37 is conducted to the curable resin R through the pressing portion 36 and the support substrate 11 and the flexible substrate 12 of the workpiece 1, and the curable resin R is cured.

The control device 8 is a device for controlling the protective film forming device 3. The control device 8 includes, for example, a dedicated electronic circuit or a computer or the like operated by a predetermined program. That is, the control device 8 controls the operations of the reversing section 31, the resin supply section 32, the support section 34, the tape supply section 35, the pressing section 36, the curing section 37, and the like, thereby controlling the operations of the protective film forming apparatus 3.

As shown in fig. 7, the control device 8 includes an inverting section control section 81, a resin supply control section 82, a tape suction control section 83, a tape supply amount control section 84, a pressing control section 85, a curing control section 86, a storage section 87, a setting section 88, and an input/output control section 89.

The inverting unit controller 81 controls the suction operation and the inverting operation of the arm 311 of the inverting unit 31 and the movement operation of the XYZ movement mechanism 312. The resin supply control unit 82 controls the amount, supply timing, and supply position of the curable resin R to be supplied to the surface of the work 1 on which the light emitting element 13 is provided. The amount of the curable resin R to be supplied is determined in accordance with the size of the work 1, that is, the size of the region where the protective film is to be formed (protective film forming region) and the thickness of the protective film. The curable resin R may be supplied in a dot or line shape. The number of the dots or lines may be single or plural, and the supply amount of each dot or each line is determined according to the number. In this case, the spread state of the curable resin R is observed in advance, and the positions of the respective points, the respective lines, or the respective supply amounts are determined so that the entrainment of the bubbles or the protrusion from the protective film forming region is within a tolerance. Control is performed in accordance with the supply state thus determined.

The tape suction control unit 83 controls the suction operation of the holding member 342 with respect to the adhesion preventing tape T by controlling the air pressure circuit connected to the support unit 34. For example, before the curable resin R supplied to the workpiece 1 is pressed against the holding member 342, the adhesion preventing tape T is adsorbed to the holding member 342. Thus, when the adhesion preventing tape T is closely attached to the entire surface of the holding member 342 and the contact portions 333 of the substrate holding portions 33 are in contact with each other or heated to cure the curable resin R, wrinkles are prevented from being concentrated on the adhesion preventing tape T, and the wrinkles are prevented from being transferred to the protective film 2. After the curing of the curable resin R of the workpiece 1 is completed, the tape suction control unit 83 releases the suction of the adhesion preventing tape T before the workpiece 1 is separated from the support 34, and releases the adhesion preventing tape T from the holding member 342. The tape supply amount control unit 84 controls the feeding of the adhesion preventing tape T. For example, after the formation of the protective film of one workpiece 1 is completed, the adhesion preventing tape T is sent out, and the portion against which the curable resin R is pressed is replaced with an unused portion. In this way, the tape supply amount control unit 84 performs control in coordination with the tape suction control unit 83.

The pressing control unit 85 controls a driving mechanism, not shown, provided in the pressing unit 36. For example, by lowering the pressing portion 36 at a predetermined speed, the surface of the workpiece 1 on the side not supplied with the curable resin R is pressed against the pressing portion 36, and the workpiece 1 held by the substrate holding portion 33 is opposed to the supporting portion 34 at a predetermined interval against the biasing force of the spring portion 332 a. Similarly, after the protective film 2 is formed, the pressing portion 36 is raised so as to be separated from the workpiece 1.

The curing control section 86 controls the curing section 37 to cure the curable resin R. In the control, the curing speed of the curable resin R, that is, the speed of curing the curable resin R is controlled. The curing control unit 86 of the present embodiment controls the temperature of the curing unit 37 so as to be a curing temperature necessary for thermally curing the curable resin R, corresponding to the curable resin R being a thermosetting resin.

In the case of a thermosetting resin, the viscosity decreases and the fluidity increases until the temperature reaches the temperature at which curing starts (curing start temperature) after the thermosetting resin is heated from an initial state, that is, a state at room temperature. At the curing initiation temperature, gelation starts, the viscosity increases, and the fluidity decreases. As the curing temperature is approached, gelation proceeds, viscosity rises, and finally curing (solidification) is performed. Therefore, the fluidity of the curable resin R can be improved by heating at a temperature not higher than the curing start temperature. When the control of heating at the curing start temperature or lower is performed, the curable resin R is not cured. That is, the speed at which curing proceeds can be said to be zero. The flowability of the curable resin R can be reduced by heating the curable resin R at a curing temperature equal to or higher than the curing start temperature. In addition, the curable resin R can be cured. When heating is controlled at a curing temperature not lower than the curing start temperature, the curing of the curable resin R proceeds, and thus the speed of curing is increased. In this way, the speed of curing the curable resin R is controlled.

In the present embodiment, the curing control unit 86 heats the curing unit 37 to, for example, 120 ℃. The temperature is lower than the temperature at which the curable resin R is cured. Thereby, the temperature of the pressing portion 36 becomes 120 ℃. In this state, the workpiece 1 is sandwiched between the pressing portion 36 and the supporting portion 34. Thereby, the curable resin R supplied to the workpiece 1 is heated and starts to spread. Since the curable resin R is pressed by the pressing portion 36, it continues to spread on the work 1. While the curable resin R is spreading on the workpiece 1, the curing control section 86 controls the temperature of the curing section 37 to be increased to, for example, 170 ℃. The temperature is a temperature at which the curable resin R is cured. In this way, control is performed to increase the speed of curing the curable resin R.

Hereinafter, the temperature at which the temperature of the curing unit 37 is raised in advance may be referred to as a first temperature, and the temperature higher than the first temperature and raised to complete curing of the curable resin R may be referred to as a second temperature. That is, in the present embodiment, when the curable resin is pressed against the adhesion preventing tape by the pressing portion and spread on the substrate to reach a predetermined position (the outer edge of the protective film forming region), the temperature of the curing portion is controlled so as to be a first temperature in advance, and when the curable resin reaches the predetermined position (the outer edge of the protective film forming region), a part of the plurality of heaters is controlled so that the temperature of the position of the curing portion corresponding to the predetermined position becomes a second temperature higher than the first temperature, thereby accelerating the curing of the curable resin R.

The storage unit 87 stores information necessary for control in the present embodiment. The information stored in the storage unit 87 includes position coordinates such as the positions of the respective components, the heating temperature of the curing unit 37, the amount of the anti-adhesion tape T to be fed, and the like. The setting unit 88 is a processing unit that sets information in the storage unit 87 in response to an input. The input/output control unit 89 is an interface for controlling conversion of signals and input/output with each unit to be controlled.

The input device 91 and the output device 92 are connected to the control device 8. The input device 91 is an input means for an operator to operate switches, a touch panel, a keyboard, a mouse, and the like of the protective film forming apparatus 3 via the control device 8. The operator can input various kinds of information set in the storage unit 87 through the input device 91. The output device 92 is an output means such as a display, a lamp, and a meter, which displays information for confirming the state of the device to be visible to the operator. For example, the output device 92 may display an input screen of information from the input device 91.

[ Effect ]

Next, an operation example of the present embodiment will be described with reference to fig. 6 (a) to 6 (F) and fig. 8. Fig. 8 is a flowchart showing a procedure of forming the protective film 2. As a premise, the following are assumed: the work 1 in a state where the curable resin R is not supplied is carried into the protective film forming apparatus 3 from a conveying member not shown, and the work 1 is sucked and held from the support substrate 11 side by the arm 311 in the reversing section 31 of the protective film forming apparatus 3. And set as follows: the adhesion preventing tape T is supplied to the supporting portion 34 by the tape supply amount control portion 84. Further, the method comprises the following steps: the temperature of the curing unit 37 is raised to, for example, 120 ℃ by the curing control unit 86 to be a first temperature, i.e., a standby temperature. The first temperature is preferably lower than the curing temperature of the curable resin R. More preferably, the temperature is lower than the curing start temperature (gelation start temperature) of the curable resin R. By raising the temperature of the curing section 37 in advance in this way, the pressing section 36 can be preheated in advance, and when pressing the curable resin R, the temperature at which the stretching of the curable resin R is promoted can be reached without reheating.

Under the control of the resin supply control unit 82, the nozzle 32a of the resin supply unit 32 supplies the curable resin R to the surface of the work 1 on the side where the light emitting element 13 is provided (step S01). The curable resin R is supplied to the workpiece 1, for example, in a dot or line shape to one site or a plurality of sites. Thus, when the pressing portion 36 is used for the pushing, the protective film 2 can be formed in the protective film forming region which is a predetermined region. In addition, the curable resin R is supplied to the inside of the outer peripheral portion of the work 1. After the curable resin R is supplied, the inverting unit 31 inverts the work 1 by 180 ° by the arm 311 under the control of the inverting unit control unit 81, faces the surface to which the curable resin R is supplied downward, and moves the work 1 above the substrate holding unit 33 by the XYZ movement mechanism 312. In addition, the arm 311 may be moved by the XYZ movement mechanism 312 in advance until the position where the arm 311 is reversed is a position above the substrate holder 33, and the reversing unit 31 may move the arm 311 at this position.

Then, in a state where the workpiece 1 is positioned above the substrate holding portion 33, as shown in fig. 6 (a), the arm 311 is lowered to bring the workpiece 1 into contact with the substrate holding surface 331a of the step portion 331 in the opening of the substrate holding portion 33, and the suction of the workpiece 1 is released, whereby the workpiece 1 is delivered to the substrate holding portion 33 (step S02). The work 1 is held by the substrate holding portion 33 by bringing the surface to which the curable resin R is supplied downward and bringing the outer peripheral portion thereof into contact with the substrate holding surface 331a of the step portion 331. The curable resin R faces the surface of the adhesion preventing tape T held by the support portion 34 through the opening of the substrate holding portion 33. Since the curable resin R is supplied to the inside of the outer peripheral portion of the workpiece 1, it does not adhere to the substrate holding surface 331a and faces an adhesion prevention tape T, which will be described later, through the opening of the substrate holding portion 33. After the transfer of the workpiece 1, the inverting unit 31 retracts the arm 311 from above the substrate holding unit 33 by the XYZ-movement mechanism 312.

Next, as indicated by a broken line arrow in fig. 6B, the tape suction control unit 83 controls an unillustrated air-pressure circuit to suction-hold the adhesion-preventing tape T to the holding member 342 (step S03). Then, as shown in fig. 6 (C), the pressing portion 36 is lowered from above the substrate holding portion 33 by the pressing control portion 85, and the flat pressing surface of the pressing portion 36 presses the surface of the work 1 to which the curable resin R is not supplied. The pressed workpiece 1 presses the substrate holding surface 331a, which is in contact with the pressed workpiece 1, and thereby the substrate holding portion 33 also moves down together with the workpiece 1. The pressing part 36 continuously presses the workpiece 1 together with the substrate holding part 33, and sandwiches the workpiece 1 between the holding member 342 of the supporting part 34 (step S04). At this time, the curable resin R supplied to the workpiece 1 is pressed against the surface of the adhesion preventing tape T held by the holding member 342, and extends in the XY direction between the workpiece 1 and the adhesion preventing tape T. Then, the spring portion 332a of the leg portion 332 contracts, and the abutting portion 333 of the substrate holding portion 33 abuts on the adhesion preventing tape T held by the holding member 342 of the support portion 34, so that a predetermined distance is secured between the surface of the work 1 on the side to which the curable resin R is supplied and the surface of the adhesion preventing tape T. That is, the curable resin R extends between the distances.

As described above, the temperature of the cured portion 37 provided inside the pressing portion 36 is raised to 120 ℃. Accordingly, the pressing portion 36 is also heated to 120 ℃, and thus the heat is conducted to the curable resin R via the support substrate 11 and the flexible substrate 12 of the workpiece 1 that are pressed in contact with the pressing portion 36. Although the curable resin R is heated, curing is not advanced, and the curable resin R spreads on the workpiece 1 in a state where fluidity is improved.

Further, the curing control section 86 controls the curing section 37 to raise the temperature to 170 ℃. As a result, as shown in fig. 6D, the curing of the curable resin R spread on the work 1 is completed, and the protective film 2 is formed (step S05).

After the protective film 2 is formed, the pressing portion 36 is raised by the pressing control portion 85, and the suction holding of the adhesion preventing tape T by the holding member 342 is released by the tape suction control portion 83 (step S06). As the pressing portion 36 rises, the substrate holding portion 33 pressed by the pressing portion 36 together with the workpiece 1 rises by the urging force of the spring portion 332 a. Then, the step 331 of the substrate holding portion 33 pushes up the workpiece 1. At this time, the adhesion preventing tape T is closely attached to the protective film 2 formed on the work 1, and therefore, the adhesion preventing tape T is also pulled upward. This is caused by the following: the adhesion preventing tape T is pressed against the protective film 2 by the atmospheric pressure, and thus is adhered to the protective film 2.

On the other hand, since tension is applied to the adhesion preventing tape T by the tension mechanism of the supply reel 351 and the tape support portions TS are provided on both sides of the support portion 34, the phenomenon that the adhesion preventing tape T is pulled up along with the workpiece 1 is suppressed. Therefore, as shown in fig. 14, a force of pulling up the anti-adhesion tape T upward is applied with the tape support portion TS as a fulcrum, but the protective film 2 adhering to the anti-adhesion tape T is peeled off from the edge thereof along with the rise of the work 1 because of the tension applied to itself and the resistance to the force by the tape support portion TS. Finally, as shown in fig. 6 (E), the protective film 2 is completely peeled off from the adhesion preventing tape T (step S07). After the protective film 2 is peeled off, the take-up reel 352 is rotationally driven to wind the anti-adhesion tape T having a length corresponding to the holding member 342, and a new anti-adhesion tape T is supplied to the holding member 342 (step S08).

Finally, as shown in fig. 6 (F), the XYZ movement mechanism 312 moves the arm 311 of the inverting section 31 above the substrate holding section 33 under the control of the inverting section control section 81, and holds the workpiece 1 on which the protective film 2 is formed from the support substrate 11 side (step S09). Then, the inverting section 31 picks up the workpiece 1 from the substrate holding section 33 by the XYZ movement mechanism 312, retracts from above, and inverts the arm 311 (step S10). Thereby, the work 1 with the protective film 2 formed thereon can be obtained. Subsequently, the work 1 on which the protective film 2 is formed is carried out of the protective film forming apparatus 3 by a carrying member not shown.

[ Effect ]

The first embodiment having the above-described configuration has the following effects.

(1) The protective film forming apparatus 3 of the present embodiment includes: a resin supply unit 32 for supplying a liquid curable resin R to a surface of the substrate on which the element is mounted; a substrate holding unit 33 for holding the substrate to which the curable resin R is supplied; a support portion 34 provided to face the substrate holding portion 33; a tape supply unit 35 that supplies the adhesion preventing tape T between the substrate holding unit 33 and the support unit 34; a pressing part 36 for pressing the substrate toward the supporting part 34, pressing the curable resin R supplied to the substrate against the adhesion preventing tape T, and spreading the curable resin R on the substrate; a curing section 37 for curing the curable resin R spread on the substrate; and a curing control section 86 that controls the curing section 37 to increase the speed at which the curable resin R is cured while the substrate is pressed by the pressing section 36, and the curable resin R is pressed against the adhesion preventing tape T by the pressing section 36 and is spread on the substrate.

Thus, a protective film having a flat surface can be formed without imposing a burden on the element. That is, since the liquid curable resin R is pressed against the element mounted on the work 1, the pressure applied to the element is relatively low, and the possibility of damaging the element can be reduced. Further, the possibility of occurrence of positional deviation or lateral rotation of the element can be reduced. Further, the gap between the elements can be easily filled with the curable resin R as the sealing member, and thus the possibility of insufficient sealing can be reduced. Since the liquid curable resin R is pressed against the holding member 342 of the flat support portion 34 and cured, the protective film 2 having a flat surface can be formed without being affected by the irregularities of the elements mounted on the workpiece 1.

(2) In particular, the curing control section 86 controls the curing section 37 to cure the curable resin R. In particular, the speed of curing the curable resin R is controlled. More specifically, during the period in which the curable resin R is spread on the substrate, control is performed to increase the speed at which the curing portion 37 cures the curable resin R. In the present embodiment, the curing unit 37 previously heated to the first temperature is controlled to the second temperature higher than the first temperature, and the speed of curing the curable resin R (curing speed) is controlled in two stages, whereby the curable resin R can be sufficiently spread over the work 1 and then cured to form the protective film 2. In this way, since the curing control section 86 controls the curing speed of the curable resin R in two stages, the curable resin R can be rapidly and reliably spread in the gap between the workpiece 1 and the adhesion preventing tape T formed by the abutting section 333, and the time until the curing of the curable resin R is completed can be shortened. The control of the curing speed of the curable resin R is not limited to the above two-stage control, and the number of times may be subdivided or continuously changed, or the protective film forming region may be divided into a plurality of regions such as an inner region and an outer edge. Further, these components may be combined to control the curing speed more precisely.

That is, the curable resin R can extend to a position (predetermined position) of an end portion of the protective film formation region of the element before curing, and the protective film 2 can be formed on the work 1. When the curable resin R is expanded, the curable resin R is heated at a temperature (first temperature) lower than the curing temperature. This makes the curable resin R spread in a state of low viscosity and easy to flow, and therefore, the curable resin R can be spread reliably and quickly in the protective film formation region on the work 1. Further, the air bubbles can be easily discharged, and the generation of voids can be suppressed. The curing control unit 86 controls the temperature of the curing unit 37 to be raised to a temperature (second temperature) at which the curable resin R is cured and heated while the curable resin R is spread on the workpiece 1. That is, the speed of curing the curable resin R is increased. Thus, it is possible to: the curable resin R spreads until the curing portion 37 reaches the curing temperature of the curable resin R, and reaches a temperature close to the curing temperature at a timing when the curable resin R spreads over the protective film forming region on the workpiece 1, thereby ending the spreading. This makes it possible to sufficiently spread the curable resin R over the protective film formation region and to suppress the curable resin R from protruding from the protective film formation region. Further, since the temperature of pressing portion 36 is raised from the state in which the temperature is raised in advance to the curing temperature of curable resin R, the time for raising the temperature to the curing temperature can be shortened. Further, since the stretching and the curing are controlled so as to overlap with each other, the time until the curing of the curable resin R is completed can be shortened.

In this way, the curing control section 86 performs control to increase the speed of curing the curable resin R while the curable resin R is spread on the work 1. Thereby, the following can be avoided: for example, if the curable resin R is heated at the curing temperature from the time point when the curable resin R starts to spread, the viscosity of the curable resin R increases or the curable resin R cures before the curable resin R spreads over the entire protective film formation region, and a desired protective film cannot be formed; or the bubbles cannot completely come out and become voids. Further, for example, in the case where heating is not performed before the curable resin R spreads over the protective film formation region, the curable resin R may protrude from the protective film formation region due to a flow during extension of the curable resin R, but the protrusion can be suppressed. Further, the time until the curing of the curable resin R is completed can be shortened as compared with the case where the heating of the curing portion 37 is started after the extension of the curable resin R to the protective film forming region on the work 1 is completed.

As described above, according to the present embodiment, high quality and high productivity can be ensured.

(3) In the present embodiment, the adhesion preventing tape T is interposed between the support portion 34 and the workpiece 1, and therefore the curable resin R can be prevented from directly adhering to the support portion 34. This prevents a part of the protective film 2 from remaining on the support 34 when the protective film 2 is peeled off, which may cause an obstacle when the protective film 2 is formed next time or later. Further, even if there are slight irregularities on the surface of the holding member 342 of the support portion 34, the surface of the curable resin R is prevented from being affected by the adhesion preventing tape T. That is, even if foreign matter adheres to the surface of the holding member 342, the unevenness caused by the foreign matter can be absorbed by the adhesion preventing tape T, and the phenomenon that the unevenness is transferred to the surface of the protective film can be suppressed. Further, since it is not necessary to extremely reduce the surface roughness of the holding member 342, the holding member 342 can be prepared at low cost. Even in the case where an opening for suction-holding the adhesion preventing tape T of the holding member 342 is provided, the opening can be prevented from being transferred. This is also the same as the case of suppressing the influence of the fine openings generated on the surface when the holding member 342 is a porous member.

(4) The protective film forming apparatus 3 of the present embodiment may include an abutting portion 333, and the abutting portion 333 may form a predetermined gap between the surface of the substrate to which the curable resin R is supplied and the surface of the adhesion preventing tape T when the substrate holding portion 33 abuts against the supporting portion 34. The abutting portion 333 located at a predetermined interval (height separated by a predetermined distance L) from the height of the substrate holding surface 331a abuts on the support portion 34, whereby a gap in which the curable resin R extends can be ensured with the height of the substrate holding surface 331a as a reference. That is, a gap through which the curable resin R spreads can be secured between the surface of the workpiece 1 on which the elements are mounted and the surface of the adhesion preventing tape T, with the height of the surface of the workpiece 1 on which the elements are mounted as a reference. This makes it possible to maintain the thickness of the protective film 2 constant without being affected by variations in the thickness of the workpiece 1 (the thickness of the support substrate 11 + the thickness of the flexible substrate 12). In addition, the predetermined gap that becomes the thickness of the protective film 2 is formed from the height of the substrate holding surface 331a to the height of the abutting portion 333. That is, the predetermined gap that becomes the thickness of the protective film 2 is determined according to the shape of the substrate holding portion 33. Therefore, unlike the case where the gap to be the thickness of the protective film 2 is adjusted by the degree of pressing, for example, it is not necessary to precisely control the pressing force, and therefore control is easy. Since the curable resin R can be cured after being spread and filled in the gap of the predetermined interval, the protective film can be formed without variation in film thickness in the region where the protective film 2 is to be formed, as compared with the case where the curable resin R is applied and cured in an open state.

(5) The substrate holding portion 33 holds the substrate with the surface of the substrate to which the curable resin R is supplied facing downward. Accordingly, the liquid curable resin R supplied to the workpiece 1 is extended downward by gravity, and at the initial stage of pressing, the area in contact with the adhesion prevention tape T is reduced, and the curable resin R is gradually spread and extended so as to have a predetermined interval, so that the possibility of air bubbles entering when the curable resin R is spread on the workpiece 1 can be reduced. In order to prevent such air bubbles from being mixed, it is also conceivable to spread the curable resin R in a reduced-pressure space, but this is not essential, and a large-scale apparatus such as a vacuum chamber or an exhaust-gas cavity is not necessary, and therefore, a corresponding increase in cost can be suppressed. In addition, the workpiece 1 of the present embodiment is pressed from above in a state in which the periphery is not enclosed and sealed by members, but is open to the atmosphere. Accordingly, the gas present between the workpiece 1 and the adhesion preventing tape T is easily pushed out to the outside along with the expansion of the curable resin R, and therefore, the possibility of air bubbles being caught when the curable resin R expands can be reduced.

(6) The resin supply section 32 supplies the curable resin R to the substrate from above the substrate, and the protective film forming apparatus further includes an inverting section 31 that inverts the substrate to which the curable resin R is supplied so that the surface of the substrate to which the curable resin R is supplied faces downward, and delivers the substrate to the substrate holding section 33. This makes it possible to supply the curable resin R from above, and thus the supply amount can be easily adjusted as compared with the case of supplying from below. For example, in the case of feeding from below, depending on the viscosity of the curable resin R, the curable resin R may be pulled toward the nozzle 32a of the resin feeder 32 by gravity, and the feeding amount may be unexpectedly reduced.

(7) The support portion 34 further includes a holding member 342 that holds the adhesion preventing tape T to which tension is applied by suction. Thus, the entire surface of the anti-adhesion tape T is held by suction in a state where wrinkles are not present, and therefore, even in a situation where the anti-adhesion tape T contracts when the curable resin R is pushed out or cured, the formation of wrinkles in the anti-adhesion tape T can be reduced. Therefore, the wrinkles can be reduced from being transferred to the protective film 2.

(8) The holding member 342 is air-permeable and porous. Therefore, the opening of the surface for suction is minute, and there is little possibility that the surface unevenness formed by the opening is transferred to the protective film 2 via the adhesion preventing tape T. Further, since the anti-adhesion tape T can be uniformly sucked and held over the entire surface of the holding member 342, a wrinkle-free state can be further maintained.

(9) The curable resin R is a thermosetting resin, and the curing unit 37 is a heater. Thus, the curing state can be easily adjusted by adjusting the temperature at which the curable resin R is heated.

(10) There may be a plurality of heaters provided to the curing part 37. The heater includes a heating wire, a halogen lamp, or the like, but a halogen lamp having high responsiveness is preferable. In this case, as shown in fig. 11a to 11D, the heaters are preferably arranged concentrically in a matrix shape (matrix, zigzag) or a frame shape. Fig. 11 (a) shows a case where heaters are arranged in a matrix. The upper stage of fig. 11 (a) shows a horizontal cross section of the cured portion 37, and the lower stage shows a vertical cross section of the cured portion 37. A plurality of heaters are denoted by 411, and each heater 411 is held by the base 401 and covered by the contact plate 402 that is in contact with the pressing portion 36 or the workpiece 1. Fig. 11 (B) shows a case where a plurality of heaters are arranged in a zigzag manner. Fig. 11 (C) shows a case where a plurality of frame-shaped heaters are concentrically arranged, and fig. 11 (D) shows a case where a plurality of heaters are concentrically arranged. In the case where a plurality of heaters are provided, the respective heaters may be individually or in groups subjected to heating control as needed. For example, when the curable resin R is spread, the speed of spreading or spreading is controlled so that the heating is locally performed, and a portion having a high viscosity and a portion having an original viscosity are mixed. In this case, after a predetermined time has elapsed, heating may be performed by a different heat amount from the previous heating, and the viscosity of the portion that has not been heated may be increased by a time difference. For example, the viscosity of the curable resin R gradually extending to the entire protective film forming region to be sealed may be increased as a whole by heating all of the plurality of heaters. In this case, the heating intensity (energy amount (heat amount × time)) may be locally changed.

For example, when or immediately before the curable resin R extends to reach the outer edge of the protective film formation region of the workpiece 1, only the outer edge of the protective film formation region is heated or the heating intensity is increased (the amount of energy (heat amount × time)) to prevent protrusion.

(11) Fig. 12 (a) to 12 (C) show an example of controlling the curing unit 37 having the structure of fig. 11 (a). In fig. 12 (a) to 12 (C), the upper stage represents a vertical cross section, and the lower stage represents a horizontal cross section. In this figure, the pressing of the workpiece 1 by the curing unit 37 is illustrated. Fig. 12 (a) shows a case where the curable resin R is pushed and spread. After that, the distance between the workpiece 1 and the adhesion preventing tape T becomes a predetermined interval, and the operation of pushing the curable resin R by the curing unit 37 is stopped. In the space formed in this state, the curable resin R continues to spread. Fig. 12 (B) shows a case where the curable resin R spreads and the outer edge thereof reaches the outer edge of the workpiece 1 (the outer edge of the protective film forming region, a predetermined position). Fig. 12 (C) shows a case where the entire surface of the stretched curable resin R is cured.

For example, as shown in fig. 12 (a) to 12 (C), in order to stop the extension just at the outer edge of the protective film forming region, when the curable resin R reaches the outer edge of the protective film forming region, or when the curable resin R reaches the vicinity of the outer edge of the protective film forming region, the heater of the outer peripheral portion is turned ON (ON) or controlled to increase the temperature, thereby promoting the curing of the outer peripheral portion of the resin. That is, the viscosity of the curable resin R is increased to accelerate the curing speed, thereby stopping the stretching. Therefore, this temperature is not lower than the curing initiation temperature. When the resin has been completely stretched in the protective film forming region, all the heaters are turned on or heated to cure the entire curable resin R. In fig. 12 (a) to 12 (C), the heater that has been turned OFF (OFF) is denoted by 412, and the heater that has been turned on is denoted by 413. This state is also the same when the heater described later is replaced with an Ultraviolet (UV) light source (light irradiation unit).

The timing of heating may be determined by detecting the resin with an image sensor, a laser sensor, or the like, or by experiments or the like in advance. By controlling the plurality of heaters in this manner, the protrusion can be further suppressed without hindering the discharge of the void.

(12) In a path along which the adhesion preventing tape T fed out from the supply reel 351 is wound around the take-up reel 352, tape support portions TS are provided above the adhesion preventing tape T on both sides of the support portion 34 in the X direction. This makes it possible to easily peel the adhesion preventing tape T, which is in close contact with the protective film 2 formed on the work 1, from the protective film 2. This is because the tape support section TS presses the adhesion preventing tape T, and thus the adhesion preventing tape T can be peeled from the outer peripheral side of the protective film 2.

(B) Second embodiment

A second embodiment of the invention of the present application will be explained below.

In the first embodiment, the curable resin R is a thermosetting resin that is cured by heat, but in the second embodiment, the curable resin R is a photocurable resin that is cured by light. Correspondingly, the curing unit 37 is not a heater but a light irradiation device. For example, the photocurable resin may be an ultraviolet curable resin, and the light may be ultraviolet light. In this case, the light irradiation device is an ultraviolet light source. The ultraviolet light source may use an LED or a lamp capable of irradiating ultraviolet light. The photocurable resin starts to cure upon receiving light of a wavelength at which the resin cures. The curing of the photocurable resin is gradually advanced. That is, the viscosity of the photocurable resin changes. The speed of curing is changed depending on the intensity and time of light to be irradiated. The curing controller 86 controls the intensity or irradiation time of the light irradiated by the curing unit 37, and changes the energy amount of the irradiated light by changing the intensity or irradiation time of the light when the curable resin R is stretched, so as to achieve a viscosity optimal for the stretching of the curable resin R in the protective film forming region.

More specifically, when the viscosity of the curable resin R is suitable for extending in the initial state, the irradiation with light is started after the curable resin R extends over the entire protective film formation region, which is a predetermined region, to cure the curable resin R. When the viscosity of the curable resin R is low and is not suitable for stretching in the initial state, the curable resin R is adjusted to a desired viscosity by proceeding curing by irradiating the curable resin R with light of a weak intensity, for a short time, or from a distance in a state where stretching is started. At this time, the energy amount of the light irradiated to the curable resin R is set as a first energy amount. When the curable resin R extends to the outer edge of the protective film formation region or its vicinity, light irradiation is performed for a necessary intensity and time to further cure the curable resin R. When the curable resin R is spread over the protective film formation region and is finished, light irradiation is performed for a time and at an intensity sufficient for complete curing of the curable resin R, and curing of the curable resin R is completed. The energy amount of the light irradiated when the curable resin R is completely cured is set to a second energy amount. The second amount of energy is greater than the first amount of energy. This can shorten the stretching time, suppress the protrusion from the protective film formation region, or shorten the curing time.

The curable resin R is irradiated with light from the curing section 37 through the pressing section 36 and the substrate of the workpiece 1. Therefore, the paths of light of the curing portion 37, the pressing portion 36, and the substrate are materials through which light of at least a wavelength for curing the photocurable resin R can pass.

When light is irradiated from a distant state toward the substrate holding portion 33, the viscosity of the curable resin R can be adjusted to a viscosity suitable for spreading at the time of starting pressing of the resin. In this case, since the intensity of light, time, and distance changes, the viscosity can be adjusted by the height position of the curing part. This can shorten the stretching time or suppress the protrusion from the protective film formation region.

In the second embodiment, the curing unit 37 may have a plurality of irradiation units such as UV light sources for irradiating light. In this case, as in the heater of the first embodiment, the irradiation portions are preferably concentrically arranged in a matrix shape (matrix, zigzag) or a frame shape as shown in 411 in fig. 11a to 11D. When a plurality of irradiation units are provided, the irradiation control may be performed individually or in groups for each irradiation unit as needed. For example, when the curable resin R is spread, the speed of spreading or spreading is controlled so that the irradiation is locally performed, and a portion having a high viscosity and a portion having an original viscosity are mixed. In this case, after a predetermined time has elapsed, irradiation by an irradiation unit different from the previous irradiation may be performed to increase the viscosity of a portion not previously irradiated with light by a time difference. For example, the viscosity of the curable resin R gradually extending over the entire protective film forming region to be sealed may be increased by irradiating all of the plurality of irradiation portions. In this case, the irradiation intensity may be locally changed. For example, when the curable resin R spreads to reach the outer edge of the protective film formation region of the workpiece 1 or immediately before reaching, only the outer edge of the protective film formation region is irradiated or the irradiation intensity is strengthened (increased energy amount (illuminance × time)) to prevent protrusion. Such irradiation control can be performed in the same manner as the heater of the first embodiment (see fig. 12 a to 12C). The timing of irradiation may be determined by an image sensor, a laser sensor, or the like, or may be determined in advance by an experiment or the like. By controlling the plurality of irradiation portions in this manner, protrusion can be suppressed without hindering discharge of the void.

Further, the light intensity or the irradiation range may be controlled by providing a light guide lens in an irradiation portion of a UV light source or the like or providing a cylindrical reflector to the light source.

As described above, while the curable resin R in the first embodiment is a thermosetting resin and heat is controlled, the same effect as in the first embodiment can be obtained by controlling light irradiation using the curable resin R in the second embodiment as a photocurable resin.

(C) Other embodiments

The present invention is not limited to the above-described embodiments, and constituent elements may be modified and embodied in the implementation stage without departing from the gist thereof. Further, various inventions can be formed by appropriate combinations of a plurality of constituent elements disclosed in the above embodiments. For example, some constituent elements may be deleted from all the constituent elements shown in the embodiments. Further, the constituent elements of the different embodiments may be appropriately combined. Specifically, other embodiments described below are also included.

(1) In the above embodiment, the resin supply portion 32 supplies the curable resin R from above the workpiece 1, but is not limited thereto. For example, in the case where the curable resin R has a viscosity of such a degree that the curable resin R does not sag due to gravity, the curable resin R discharged from the nozzle 32a may be supplied from below the workpiece 1 without being affected by, for example, a decrease in the amount of the curable resin R supplied due to, for example, the curable resin R sagging and adhering to the nozzle 32 a. At this time, the inverting part 31 holds the work 1 so that the surface of the work 1 on which the light emitting element 13 is mounted faces downward from the beginning. The inverting unit 31 can transfer the work 1, to which the curable resin R is supplied to the downward surface, to the substrate holding unit 33 while maintaining this state. Therefore, the turnover mechanism does not need to be provided, and the turnover part 31 can be simplified. Further, since the work 1 to which the curable resin R is supplied is not inverted, the state of the curable resin R supplied is not affected by the centrifugal force. Moreover, since time for flipping is not required, the tapping time can be shortened. Further, since a space for turning is not required, the interval between the substrate holding portion 33 and the pressing portion 36 can be narrowed. This can reduce the size of the device, shorten the moving time of the pressing portion 36, and shorten the tact time. Further, by performing θ rotation instead of α rotation, the arm 311 of the inverting unit 31 can deliver the workpiece 1 to the substrate holding unit 33 with the surface to which the curable resin R is supplied facing downward. In this case, since the horizontal movement for the delivery can be performed during the θ rotation, the movement mechanism can be simplified.

(2) In the above embodiment, the holding member 342 is a porous member in which numerous holes are randomly arranged, but the present invention is not limited to this. The air permeability of the adhesion preventing tape T may be maintained, and the opening for ensuring the air permeability may be of a size and shape that does not exceed the adhesion preventing tape T and affect the curable resin R. For example, the holding member 342 may be a metal plate provided with numerous holes.

(3) In the above embodiment, the adhesion preventing tape T is suction-held via the holding member 342, but if the adhesion preventing tape T is not in a state where the shrinkage occurs when the curable resin R is pushed out or cured, the adhesion preventing tape T may not be suction-held. For example, in the case where the anti-adhesion tape T is thick and is difficult to deform or shrink, in the case where the anti-adhesion tape T is difficult to deform or shrink due to the material of the anti-adhesion tape T, or in the case where the anti-adhesion tape T is difficult to deform or shrink due to the low heating temperature for curing, the anti-adhesion tape T may not be held by suction.

(4) In the above embodiment, the leg portion 332 is a member extending from the lower surface of the substrate holding portion 33, and includes the spring portion 332a at the lower end, but the present invention is not limited thereto. The substrate holding portion 33 may be supported so as to be spaced apart from the supporting portion 34 and may be provided so as to be contactable with and separable from the supporting portion 34, and the spring portion 332a may be provided at any position of the substrate holding portion 33 other than the leg portion 332. The spring portion 332a may be an elastic member such as rubber. Further, the air cylinder may be a cylinder that moves up and down while supporting the substrate holding portion 33. When the substrate holding portion 33 is pressed by the pressing portion 36 to move closer to the supporting portion 34, the air pressure is controlled so as not to hinder the movement. The air cylinder functions as a driving unit that raises the substrate holding unit 33 in order to peel the protective film 2 from the adhesion preventing tape T, instead of the spring unit 332 a.

(5) In the above embodiment, the contact portion 333 on the lower surface of the substrate holding portion 33 is brought into contact with the adhesion preventing tape T stretched and held on the holding member 342 to form a desired gap. However, as shown in fig. 9, a leg portion 343 which is provided upright may be provided on the upper surface 341a of the base 341, and a predetermined gap similar to that in the above-described embodiment may be secured by an upper portion of the leg portion 343 coming into contact with the leg portion 332 of the substrate holding portion 33 pressed by the pressing portion 36. Instead of the leg 332, the contact portion 333 may be contacted. Thus, the substrate holding portion 33 abuts on the support portion 34, and the lowering of the substrate holding portion 33 is prevented. The distance of the gap between the work 1 and the adhesion preventing tape T, which is the height of the protective film 2, is set by the leg portion 343 that stands upright and the substrate holding portion 33 that abuts on the leg portion 343. Therefore, the portion where the substrate holding portion 33 and the supporting portion 34 are brought into contact with each other is included in the contact portion. That is, in the above embodiment, a combination of the leg portion 332 and the leg portion 343 erected on the base 341, or a combination of the abutting portion 333 and the leg portion 343 erected on the base 341 is considered as an abutting portion. Therefore, when the leg portion 332 or the abutting portion 333 which is a part of the substrate holding portion 33 abuts against the leg portion 343 which is a part of the supporting portion 34, a predetermined gap is formed by the abutting portion which is a combination of these. At this time, the thickness of the protective film 2 can be determined by the position where the leg portion 343 erected on the base 341 abuts on the substrate holding portion 33. That is, since the distance from the base 341 to the substrate holding portion 33 in contact with the leg 343 of the leg 343 that is provided upright can be used to determine the thickness of the protective film 2, the leg 343 that is provided upright on the base 341 can be replaced as long as necessary, and the thickness of the protective film 2 can be easily changed.

(6) In the above embodiment, it is not always necessary to form a necessary gap by abutment of the abutting portion 333. The movement of the pressing part 36 can be controlled to set the distance of the gap between the work 1 and the anti-adhesion tape T, which is the height of the protective film 2. In this case, the abutting portion 333 or the leg portion 343 does not need to be prepared. Therefore, the thickness of the protective film 2 is easily set by the module.

(7) In the above embodiment, the light emitting element 13 is used as the element of the flexible substrate 12 mounted on the workpiece 1, but the present invention is not limited to this and any element may be used. For example, the electronic component may be an arithmetic element, a memory element, an image pickup element, a resistor, a capacitor, or the like. These elements may be combined as a module. The support substrate 11 and the flexible substrate 12 may be formed as an integrated substrate.

(8) In the above embodiment, the pressing portion 36 may include an adsorption hole connected to an air pressure circuit, not shown, in a central portion of a surface of the pressing portion contacting the workpiece 1. The work 1 is attracted to the flat surface of the pressing portion 36 by the negative pressure generated by the air pressure circuit, and thereby thermal deformation of the work 1 due to heating can be suppressed. The workpiece 1 is thermally deformed when heated regardless of its material. This phenomenon becomes remarkable particularly in the case where the thickness of the workpiece 1 is thin. For example, even if the outer peripheral portion of the workpiece 1 is clamped, thermal deformation is likely to occur when the central portion is free without any support. On the other hand, in the embodiment, the central portion of the workpiece 1 is sucked and held by the pressing portion 36, so that the deformation can be suppressed.

(9) In the above embodiment, the solidified portion 37 is provided inside the pressing portion 36, but the present invention is not limited to this. The curing part 37 may be configured to be lifted independently of the pressing part 36. For example, as shown in fig. 10, by providing a curing portion 37 above the pressing portion 36 and bringing the curing portion 37 into contact with and away from the pressing portion 36, the curable resin R can be cured by heating or irradiating light to the workpiece 1 through the pressing portion 36, as in the above-described embodiment.

(10) When the cured portion 37 and the pressing portion 36 are independent, the temperature of the cured portion 37 may be controlled to be changed when, during, or until the cured portion 37 and the pressing portion 36 are brought into contact with each other. By changing the temperature at which heating is performed in this manner, the speed at which the curable resin R is cured can be changed, and stretching and curing of the curable resin R can be optimized. For example, the curing control unit 86 may control the curing unit 37 to the curing temperature of the thermosetting curable resin R in advance, and gradually bring the curing unit 37 closer to the workpiece 1 with the pressing unit 36 pressing the workpiece 1, thereby gradually changing the temperature at which the workpiece 1 is heated. That is, the workpiece 1 can be heated gradually by bringing the solidified portion 37 closer to the workpiece 1. The work 1 can be heated in stages by intermittently moving the curing section 37 closer to the pressing section 36. This controls the fluidity of the curable resin R during stretching, and thus the curable resin R can be cured to suppress stretching of the curable resin R when the curable resin R is intended to stretch out of the protective film formation region. Further, since stretching and curing can be performed simultaneously, the time until the curable resin R is completely cured can be shortened. Such control can be applied even if the heating is replaced with an operation based on irradiation of light.

(11) In the above embodiment, the pressing portion 36 has a flat surface that presses the entire workpiece 1. However, the shape of the pressing portion 36 is not limited thereto, and may be any shape as long as it can press the workpiece 1 and sandwich it with the substrate holding portion 33. For example, as shown in fig. 13 (a) to 13 (D), the pressing portion 36 may be a pair of rail-shaped or rectangular frame-shaped members that press the outer peripheral portion of the workpiece 1, and the solidified portion 37 may be configured to be able to move up and down so as to slide in an opening portion inside the pressing portion 36. At this time, the curing portion 37 may directly give heat or light for curing to the workpiece 1 without passing through the pressing portion 36. This enables efficient curing. Therefore, the time until the curable resin R is completely cured can be shortened. Further, the fluidity of the curable resin R during stretching can be controlled more precisely, and the curable resin R can be cured to further suppress the stretching when the curable resin R is intended to stretch out of the protective film formation region. Further, in the case where light is used for curing as described in the second embodiment, it is not necessary to use the pressing portion 36 as a translucent member.

(12) In the above-described embodiment, the pressing portion 36 provided above presses the workpiece 1 held by the substrate holding portion 33 against the support portion 34 provided below, but the present invention is not limited thereto. For example, the workpiece 1 held by the substrate holding portion 33 may be pressed against the support portion 34 provided at the upper side by the pressing portion 36 provided at the lower side. In this case, the support portion 34 does not directly press the workpiece 1, but only the substrate holding portion 33 needs to be pressed from below. Further, the workpiece 1 held by the substrate holding portion 33 may be pressed against the support portion 34 provided on the side by a pressing portion 36 provided on the side.

(13) The operation of starting irradiation of light when the pressing portion 36 including the cured portion 37 of the second embodiment is moved from a distant state toward the substrate holding portion 33 may be replaced with heating. The same effects as in the second embodiment can be obtained.

Claims (14)

1. A protective film forming apparatus comprising:

a resin supply unit configured to supply a liquid curable resin to a surface of the substrate on which the element is mounted;

a substrate holding section that holds the substrate to which the curable resin is supplied;

a support portion provided to face the substrate holding portion;

a tape supply unit configured to supply an adhesion preventing tape between the substrate holding unit and the support unit;

a pressing portion that presses the substrate toward the support portion, presses the curable resin supplied to the substrate against the adhesion preventing tape, and stretches the curable resin on the substrate;

a curing section that cures the curable resin; and

and a curing control unit that controls the curing unit to increase a speed at which the curable resin is cured while the curable resin is pressed against the adhesion prevention tape by the pressing unit and spread on the substrate.

2. The protective film forming apparatus according to claim 1, comprising:

and an abutting portion that presses the substrate by the pressing portion, wherein a predetermined gap is formed between a surface of the substrate to which the curable resin is supplied and a surface of the adhesion preventing tape when the substrate holding portion abuts against the supporting portion.

3. The protective film forming apparatus according to claim 1, wherein the protective film forming apparatus is a film forming apparatus

The substrate holding section holds the substrate with a surface of the substrate to which the curable resin is supplied facing downward, and has an opening for exposing a region where the curable resin extends on the substrate.

4. The protective film forming apparatus according to claim 1, wherein

The resin supply section supplies the curable resin to the substrate from above the substrate,

the protective film forming apparatus further includes: and an inverting unit that inverts the substrate to which the curable resin is supplied so that the surface of the substrate to which the curable resin is supplied faces downward, and delivers the substrate to the substrate holding unit.

5. The protective film forming apparatus according to claim 1, wherein

The substrate holding portion is supported by an elastic member or an air cylinder.

6. The protective film forming apparatus according to claim 1, wherein the protective film forming apparatus is a film forming apparatus

The support portion further includes a holding member that holds the adhesion preventing tape.

7. The protective film forming apparatus according to claim 6, wherein

The holding member is air-permeable and porous.

8. The protective film forming apparatus according to claim 1, wherein

A supply reel and a take-up reel are disposed at positions sandwiching the substrate holding section in the tape supply section,

a tape support portion provided on both sides of the support portion in a path in which the anti-adhesion tape fed out from the supply reel is wound around the take-up reel,

the anti-adhesion tape is supported by the tape support portion at a height at which the anti-adhesion tape is fed out so as to be slightly in contact with the support portion or to form a gap.

9. The protective film forming apparatus according to claim 1, wherein

The curable resin is a thermosetting resin,

the curing part is a heater, and the curing part is a heating part,

the curing control unit controls the temperature of the curing unit to be a first temperature in advance, and controls the temperature of the curing unit to be a second temperature higher than the first temperature while the curable resin is pressed against the adhesion prevention tape by the pressing unit and spread on the substrate.

10. The protective film forming apparatus according to claim 1, wherein

The curable resin is a thermosetting resin,

the curing part includes a plurality of heaters, and the curing part includes a plurality of heaters,

the curing control unit controls the temperature of the curing unit to be a first temperature in advance, and controls a part of the plurality of heaters so that the temperature of the curing unit becomes a second temperature higher than the first temperature while the curable resin is pressed against the adhesion prevention tape by the pressing unit and spread on the substrate.

11. The protective film forming apparatus according to claim 1, wherein

The curable resin is a thermosetting resin,

the curing part includes a plurality of heaters, and the curing part includes a plurality of heaters,

the curing control unit controls the temperature of the curing unit to be a first temperature in advance, and controls a part of the plurality of heaters so that the temperature of a position of the curing unit corresponding to the predetermined position becomes a second temperature higher than the first temperature when the curable resin is pressed against the adhesion prevention tape by the pressing unit and spread on the substrate to reach the predetermined position.

12. The protective film forming apparatus according to claim 1, wherein

The curable resin is a photocurable resin,

the curing part is a light irradiation device,

the curing control unit controls, when the pressing unit presses the curable resin against the adhesion prevention tape and the curable resin starts to spread on the substrate, irradiation of the curable resin with light from the curing unit to a first energy amount and irradiation of the curable resin with light, and controls, during a period in which the curable resin spreads on the substrate, irradiation of the curable resin with light from the curing unit to a second energy amount larger than the first energy amount.

13. The protective film forming apparatus according to claim 1, wherein

The curable resin is a photocurable resin,

the curing part includes a plurality of light irradiation devices,

the curing control unit controls, when the pressing unit presses the curable resin against the adhesion prevention tape and the curable resin starts to spread on the substrate, the light irradiation from the curing unit to a first energy amount and irradiates the curable resin with light, and controls a part of the plurality of light irradiation devices to irradiate the curable resin to a second energy amount larger than the first energy amount while the curable resin spreads on the substrate.

14. The protective film forming apparatus according to claim 1, wherein

The curable resin is a photocurable resin,

the curing part comprises a plurality of light irradiation devices,

the curing control unit controls the light irradiation device to irradiate the curable resin with light at a first energy amount when the curable resin is pressed against the adhesion prevention tape by the pressing unit and starts to spread on the substrate, and controls a part of the light irradiation device to irradiate the curable resin with light at a position corresponding to the predetermined position of the curing unit at a second energy amount larger than the first energy amount when the curable resin spreads on the substrate and reaches the predetermined position.

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