JP7487038B2 - Manufacturing method of a jig, a jig, a manufacturing device for a three-dimensional object, and a manufacturing method of a three-dimensional object - Google Patents

Description

This disclosure relates to a method for manufacturing a jig used to correct warping of a three-dimensional object.

Various techniques have been proposed to suppress warping of three-dimensional objects.

For example, the technology described in Patent Document 1 below is a modeling method for manufacturing a model by sequentially stacking material layers on a stage, the material layers being arranged with a structural material that constitutes a three-dimensional model and a support material that constitutes a support body for supporting the modeling of the structure, based on slice data generated from shape data of the three-dimensional model, and is characterized in that the material layers are stacked on the model manufactured on the stage while applying a load that is smaller than the load that causes deformation of the model manufactured on the stage.

According to the description in the following Patent Document 1, this molding method makes it possible to stably manufacture three-dimensional objects by preventing the application of excessive load to the object during stacking, which would cause deformation of the object.

JP 2018-094775 A

However, with this modeling method, a load that is smaller than the load that would cause deformation in the model during stacking is applied, so previous modeling methods need to be changed.

The present disclosure has been made in consideration of the above-mentioned points, and aims to provide a method for manufacturing a jig used to correct warping of a three-dimensional object, utilizing the three-dimensional additive manufacturing technology without modifying it.

The present specification relates to a method for manufacturing a jig used for correcting warping of a first three-dimensional object having an uneven surface that is formed on a first substrate by three-dimensional additive manufacturing by pressing the first three-dimensional object in a direction approaching the first three-dimensional object, the jig being manufactured to include a second substrate and a second three-dimensional object having an uneven surface provided on the second substrate, and the jig is heated in a state in which the uneven surface of the first three-dimensional object and the uneven surface of the second three-dimensional object are fitted together, and the first substrate and the second substrate are pressed against each other by pressing the first substrate against the uneven surface of the second substrate. The present invention discloses a method for manufacturing a jig, the method comprising: a data creation process for creating 3D data that has a distance from at least a top surface of the uneven surface of the first three-dimensional object to a second substrate in a state in which the uneven surface of the first three-dimensional object is fitted to the uneven surface of the second three-dimensional object by pressing them in a direction toward each other, and a manufacturing process for manufacturing the jig by additively manufacturing the second three-dimensional object on the second substrate with a resin material based on the 3D data.

This disclosure provides a method for manufacturing a jig used to correct warping of a three-dimensional object, without modifying the three-dimensional additive manufacturing technology.

FIG. 1 is a diagram illustrating a three-dimensional object manufacturing apparatus. FIG. 2 is a block diagram showing a control device. FIG. 2 is a block diagram showing a control device. 1 is a cross-sectional view showing two three-dimensional objects formed by layer-by-layer manufacturing on a first substrate, and a jig. FIG. 4A to 4C are cross-sectional views showing three-dimensional objects formed by layer-by-layer manufacturing on a first substrate and a jig. 1 is a flowchart showing the flow of a method for manufacturing a three-dimensional object and a jig. 11 is a diagram for explaining a data creation process of the jig manufacturing method. FIG. 11 is a diagram for explaining a data creation process of the jig manufacturing method. FIG. 11 is a diagram for explaining a data creation process of the jig manufacturing method. FIG. FIG.

A preferred embodiment of the present disclosure will be described in detail below with reference to the drawings.

Figure 1 shows a three-dimensional object manufacturing apparatus 10. The three-dimensional object manufacturing apparatus 10 includes a conveying device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 26, and a control device (see Figures 2 and 3) 27. The three-dimensional object manufacturing apparatus 10 further includes a transfer unit 200, a heating unit 214, and a heat press unit 130. The conveying device 20, the first modeling unit 22, the second modeling unit 24, the mounting unit 26, the transfer unit 200, the heating unit 214, and the heat press unit 130 are arranged on a base 28 of the three-dimensional object manufacturing apparatus 10. The base 28 is generally rectangular in shape, and in the following description, the longitudinal direction of the base 28 is referred to as the X-axis direction, the lateral direction of the base 28 is referred to as the Y-axis direction, and the direction perpendicular to both the X-axis direction and the Y-axis direction is referred to as the Z-axis direction. The Z-axis direction is the up-down direction.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. Furthermore, the X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by the drive of the electromagnetic motor 38. The Y-axis slide mechanism 32 includes a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. Therefore, the Y-axis slide rail 50 is movable in the X-axis direction. A stage 52 is held on the Y-axis slide rail 50 so that it can slide in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to any position in the Y-axis direction when driven by the electromagnetic motor 56. As a result, the stage 52 moves to any position on the base 28 when driven by the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The stage 52 has a base 60, a holding device 62, and a lifting device 64. The base 60 is formed in a flat plate shape, and a first substrate 300 (see FIG. 4) is placed on the upper surface. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. The first substrate 300 is fixedly held by clamping both edges in the X-axis direction of the first substrate 300 placed on the base 60 between the holding devices 62. The lifting device 64 is disposed below the base 60, and raises and lowers the base 60 in the Z-axis direction.

The first substrate 300 is made of a metal such as iron or stainless steel.

The first modeling unit 22 is a unit that models circuit wiring 308 (see FIG. 4) on the first substrate 300 placed on the base 60 of the stage 52, and has a first printing section 72 and a baking section 74. The first printing section 72 has an inkjet head (see FIG. 2) 76, and ejects metal ink in a line shape onto the first substrate 300 placed on the base 60. The metal ink is a dispersion of metal particles in a solvent. The inkjet head 76 ejects the metal ink from multiple nozzles, for example, by a piezo method using a piezoelectric element.

The baking section 74 has a laser irradiation device 78 (see FIG. 2). The laser irradiation device 78 is a device that irradiates a laser onto the metal ink discharged onto the first substrate 300, and the metal ink irradiated with the laser is baked to form the circuit wiring 308. Note that baking of the metal ink is a phenomenon in which the application of energy causes the evaporation of the solvent and the decomposition of the metal particle protective film, and the metal particles come into contact or fuse together, thereby increasing the conductivity. Then, the metal ink is baked to form the metal circuit wiring 308.

The second modeling unit 24 is a unit that models a resin layer 306 (see FIG. 4) on the first substrate 300 placed on the base 60 of the stage 52, and has a second printing unit 84 and a curing unit 86. The second printing unit 84 has an inkjet head (see FIG. 2) 88, and ejects ultraviolet curable resin onto the first substrate 300 placed on the base 60. The ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays. The inkjet head 88 may be, for example, a piezo type that uses a piezoelectric element, or a thermal type that heats the resin to generate bubbles and ejects the resin from multiple nozzles.

The curing section 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the upper surface of the UV-curable resin discharged onto the first substrate 300 by the inkjet head 88, for example by leveling the surface of the UV-curable resin while scraping off excess resin with a roller or blade, thereby making the thickness of the UV-curable resin uniform. The irradiation device 92 has a mercury lamp or LED as a light source, and irradiates the UV-curable resin discharged onto the first substrate 300 with UV rays. This causes the UV-curable resin discharged onto the first substrate 300 to harden, forming a resin layer 306.

The mounting unit 26 is a unit that mounts the first electronic component (see FIG. 4) 310 and the second electronic component (see FIG. 4) 312 on the first substrate 300 placed on the base 60 of the stage 52, and has a supply unit 100 and a mounting unit 102. The supply unit 100 has a first tape feeder (see FIG. 2) 110 that feeds the taped first electronic components 310 one by one, and a second tape feeder (see FIG. 2) 111 that feeds the taped second electronic components 312 one by one, and supplies the first electronic component 310 and the second electronic component 312 at each supply position. The supply of the first electronic component 310 and the second electronic component 312 is not limited to the supply by the first tape feeder 110 and the second tape feeder 111, but may be supplied by a tray. In addition, the first electronic component 310 and the second electronic component 312 may be supplied by both a tape feeder and a tray, or by some other method.

The mounting unit 102 has a mounting head 112 (see FIG. 2 ) and a moving device 114 (see FIG. 2 ). The mounting head 112 has a suction nozzle (not shown) for suctioning and holding the first electronic component 310 or the second electronic component 312 (hereinafter referred to as the first electronic component 310, etc.). The suction nozzle suctions and holds the first electronic component 310, etc. by sucking air when negative pressure is supplied from a positive/negative pressure supply device (not shown). Then, the first electronic component 310, etc. is released when a slight positive pressure is supplied from the positive/negative pressure supply device. The moving device 114 moves the mounting head 112 between each of the supply positions of the first tape feeder 110 and the second tape feeder 111 and the first substrate 300 placed on the base 60. As a result, in the mounting section 102 , the first electronic component 310 etc. is held by the suction nozzle, and the first electronic component 310 etc. held by the suction nozzle is mounted onto the first board 300 .

The transfer unit 200 is a unit that transfers a conductive adhesive (not shown) onto the first substrate 300 placed on the base 60 of the stage 52. The conductive adhesive is a conductive paste that hardens when heated.

The transfer unit 200 further includes a supply section 202 and a transfer section 204. The supply section 202 includes an adhesive supply device 208 (see FIG. 3). The adhesive supply device 208 includes a dip dish (not shown) into which conductive adhesive is dispensed, and supplies the conductive adhesive in a uniform thickness state by being spread out by a squeegee (not shown) on the dip dish.

The transfer unit 204 has a transfer head 210 (see FIG. 3) and a moving device (see FIG. 3) 212. The transfer head 210 has a plurality of dip needles (not shown) for transferring the conductive adhesive. The dip needles are dipped into the conductive adhesive in the dip dish of the adhesive supply device 208. As a result, the conductive adhesive adheres to the tip of the dip needle. The moving device 212 moves the transfer head 210 between the dip dish of the adhesive supply device 208 and the first substrate 300 placed on the base 60. As a result, in the transfer unit 204, the conductive adhesive adhered to the tip of the dip needle is transferred onto the first substrate 300.

The heating unit 214 has an irradiation device (see FIG. 3) 216. The irradiation device 216 has an infrared lamp or an infrared heater, and irradiates infrared rays onto the first substrate 300. This causes the conductive adhesive transferred onto the first substrate 300 to harden by heating. Note that the heating unit 214 may have an electric furnace instead of the irradiation device 216.

The heating press section 130 is a hot air drying oven. A detailed explanation will be given later.

As shown in Fig. 2 and Fig. 3, the control device 27 includes a controller 120 and a plurality of drive circuits 122. As shown in Fig. 2, the plurality of drive circuits 122 are connected to the electromagnetic motors 38, 56, the holding device 62, the lifting device 64, the inkjet head 76, the laser irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the first tape feeder 110, the second tape feeder 111, the mounting head 112, and the moving device 114. Furthermore, as shown in Fig. 3, the plurality of drive circuits 122 are connected to the adhesive supply device 208, the transfer head 210, the moving device 212, and the irradiation device 216. The controller 120 includes a CPU 124, a ROM 126, a RAM 128, etc., and is mainly a computer, and is connected to the plurality of drive circuits 122. As a result, the operation of the transport device 20, the first modeling unit 22, the second modeling unit 24, the mounting unit 26, the transfer unit 200, and the heating unit 214 is controlled by the controller 120.

The heating press section 130 is a hot air drying oven that operates independently, but it may be connected to the control device 27 and controlled by the controller 120.

The RAM 128 also stores the first data D1 and the second data D2. A detailed description of the first data D1 and the second data D2 will be given later.

In the three-dimensional object manufacturing apparatus 10, as shown in FIG. 4, the base 60
The three-dimensional objects 302A and 302B are layered on the first substrate 300 placed on the substrate 302, and then warping of the three-dimensional objects 302A and 302B is corrected. For this purpose, a jig 400 is moved downward in the Z1 direction from above the three-dimensional objects 302A and 302B and placed on the uneven surface 314 formed by the resin layer 306, the first electronic component 310, and the second electronic component 312.

The jig 400 has a second substrate 402 and a concave-convex inverted object 404. The second substrate 402 is made of a metal such as iron or stainless steel, as is the first substrate 300. The concave-convex inverted object 404 is formed on the second substrate 402 with a resin layer 406 formed by hardening an ultraviolet curable resin by additive manufacturing, as is the resin layer 306. Furthermore, the jig 400 has a concave-convex surface 408 formed by the resin layer 406 of the concave-convex inverted object 404. The concave-convex shape of the surface 408 of the concave-convex inverted object 404 is in an inverted relationship with the concave-convex shape of the surface 314 of the three-dimensional objects 302A and 302B, which are in an additive manufacturing state on the first substrate 300.

5, when the jig 400 is placed on the three-dimensional objects 302A and 302B on the first substrate 300, the uneven surface 314 of the three-dimensional objects 302A and 302B and the uneven surface 408 of the uneven inverted object 404 of the jig 400 can be placed in a fitted state. When the jig 400 is placed on the three-dimensional objects 302A and 302B in such a fitted state, the first substrate 300 is pressurized in the upward direction Z2, and the second substrate 402 is pressurized in the downward direction Z1, so that the first substrate 300 and the second substrate 402 are pressed in a direction approaching each other. As a result, the three-dimensional objects 302A and 302B are placed in a flat state. Furthermore, the three-dimensional objects 302A and 302B are heated together with the first substrate 300 and the jig 400. This corrects the warping of the three-dimensional objects 302A and 302B.

Then, as shown in FIG. 4, when the jig 400 is moved in the upward direction Z2 and separated from the uneven surfaces 314 of the three-dimensional objects 302A and 302B, the three-dimensional objects 302A and 302B are peeled off from the first substrate 300. In this way, the three-dimensional object manufacturing apparatus 10 manufactures the three-dimensional objects 302A and 302B.

The method for manufacturing the three-dimensional objects 302A, 302B and the method for manufacturing the jig 400 will be described in detail below with reference to the flowchart shown in FIG. 6. As shown in FIG. 6, the manufacturing method 140 for a three-dimensional object is composed of a modeling process S10, a data creation process S12, a manufacturing process S14, and a hot pressing process S16. Note that the modeling process S10 may be performed between the data creation process S12 and the manufacturing process S14, or between the manufacturing process S14 and the hot pressing process S16, unlike the flowchart shown in FIG. 6.

In contrast, the jig manufacturing method 150 is composed of the above-mentioned data creation process S12 and manufacturing process S14. In other words, in the flowchart shown in FIG. 6, the jig manufacturing method 150 is included in the three-dimensional object manufacturing method 140.

However, when the jig manufacturing method 150 is performed in a three-dimensional object manufacturing apparatus different from the three-dimensional object manufacturing apparatus 10 in which the modeling process S10 and the hot pressing process S16 are performed, the jig manufacturing method 150 is separated from the three-dimensional object manufacturing method 140 and becomes a method separate from the three-dimensional object manufacturing method 140. This is also true when an existing jig 400 is used. In other words, in these cases, the jig manufacturing method 150 is excluded from the three-dimensional object manufacturing method 140, and therefore the three-dimensional object manufacturing method 140 is composed of the modeling process S10 and the hot pressing process S16.

In the modeling process S10, three-dimensional additive manufacturing is performed. As a result, as shown in FIG. 4, three-dimensional objects 302A and 302B are additively manufactured on the first substrate 300 placed on the base 60. Specifically, the first substrate 300 is placed on the base 60 of the stage 52, and a temperature-sensitive adhesive sheet 304 is attached to the upper surface of the first substrate 300. Thereafter, the stage 52 is moved below the second modeling unit 24. In the second modeling unit 24, ultraviolet curing resin is ejected in a thin film form from the inkjet head 88 onto the upper surface of the temperature-sensitive adhesive sheet 304 of the first substrate 300. Next, the ultraviolet curing resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curing resin is uniform. Next, the irradiation device 92 irradiates the ultraviolet curing resin with ultraviolet light. As a result, the ultraviolet curing resin is hardened, and a thin-film resin layer 306 is formed on the first substrate 300.

Furthermore, ultraviolet curing resin is discharged in a thin film form from the inkjet head 88 onto the upper surface of the thin-film resin layer 306. Next, the ultraviolet curing resin is flattened by the flattening device 90, and then the ultraviolet curing resin is irradiated with ultraviolet light from the irradiation device 92, so that the thin-film resin layer 306 is laminated on the upper surface of the thin-film resin layer 306. In this way, the discharge of ultraviolet curing resin onto the upper surface of the thin-film resin layer 306 and the irradiation of ultraviolet light are repeated, and multiple resin layers 306 are laminated to form the laminated resin layer 306. The resin layer 306 and the first substrate 300 are attached to each other by the adhesive force of the temperature-sensitive adhesive sheet 304 interposed therebetween.

When the resin layer 306 is formed by the above-mentioned procedure, the stage 52 is moved to below the first modeling unit 22. In the first modeling unit 22, metal ink is ejected in lines from the inkjet head 76 onto the upper surface of the resin layer 306 according to the circuit pattern. Next, the laser irradiation device 78 irradiates the metal ink with a laser. This causes the metal ink to be baked, and metal circuit wiring 308 is formed on the upper surface of the resin layer 306.

In this way, multiple layers of resin layer 306 and layers of circuit wiring 308 are formed. Furthermore, at this time, a recess 313 is formed on the upper surface of resin layer 306. A part of circuit wiring 308 is exposed in recess 313, and a first electronic component 310 or a second electronic component 312 is attached to the exposed upper surface of circuit wiring 308.

To achieve this, the stage 52 is moved below the transfer unit 200. In the transfer unit 200, the conductive adhesive supplied by the adhesive supply device 208 is applied to the tip of the dip needle of the transfer head 210. As the transfer head 210 moves by the moving device 212, the applied conductive adhesive is transferred to multiple predetermined locations on the upper surface of the circuit wiring 308 in the recess 313 of the resin layer 306.

Then, the stage 52 is moved below the mounting unit 26. In the mounting unit 26, the first electronic component 310 or the second electronic component 312 supplied by the first tape feeder 110 or the second tape feeder 111 is held by the suction nozzle of the mounting head 112. As the mounting head 112 moves by the moving device 114, the held first electronic component 310 or the second electronic component 312 is attached to the upper surface of the circuit wiring 308 in the recess 313 of the resin layer 306 via a conductive adhesive. Then, the stage 52 is moved below the heating unit 214. In the heating unit 214, the irradiation device 216 irradiates infrared rays onto the first substrate 300. This hardens the conductive adhesive, and the first electronic component 310 or the second electronic component 312 is fixed.

The modeling step S10 is performed by the controller 120 controlling the three-dimensional object manufacturing apparatus 10 based on the first data D1 stored in the RAM 128. The first data D1 includes three data obtained by slicing the resin layer 306 and the circuit wiring 308.
In addition to data for the D printer, the data includes three-dimensional data for the temperature-sensitive adhesive sheet 304, the resin layer 306, the circuit wiring 308, the first electronic component 310, and the second electronic component 312.

In the data creation process S12, data for manufacturing the jig 400 by three-dimensional additive manufacturing is created. Specifically, first, the three-dimensional data for the temperature-sensitive adhesive sheet 304, the resin layer 306, the circuit wiring 308, the first electronic component 310, and the second electronic component 312 are combined and converted into a solid. As a result, as shown in FIG. 7, solid models of the three-dimensional objects 302A and 302B are created in an additive manufacturing state on the first substrate 300.

Next, a solid model of the concave-convex inverted object 404 is created. To do this, as shown in FIG. 8, a rectangular solid model that serves as the basis for the concave-convex inverted object 404 is prepared by placing it on the first substrate 300, and the solid models of the three-dimensional objects 302A and 302B are removed from the rectangular solid model.

The solid model of the uneven inverted object 404 created in this manner includes, as the height L3 of the uneven surface 408 of the uneven inverted object 404, values calculated by subtracting the height L2 of each top surface 316 of the uneven surface 314 of the three-dimensional objects 302A and 302B from the height L1 of the rectangular solid model that is the basis of the uneven inverted object 404.

The height L3 of the uneven surface 408 of the uneven inverted object 404 is equal to the distance from each top surface 316 of the uneven surface 314 of the three-dimensional objects 302A and 302B to the second substrate 402 of the jig 400 when the first substrate 300 on which the three-dimensional objects 302A and 302B are layered and the second substrate 402 of the jig 400 are pressed toward each other (i.e., the hot press process S16 described below).

Furthermore, as shown in FIG. 9, the solid model of the concave-convex inverted object 404 is rotated, for example, 180° around the Y axis with the center of the concave-convex inverted object 404 in the X axis direction as the center. The three-dimensional data of the solid model of the concave-convex inverted object 404 in this state is converted into data for a 3D printer in which each layer of the concave-convex inverted object 404 (i.e., the resin layer 406) is sliced, and stored in the RAM 128 of the controller 120 as second data D2.

In the manufacturing process S14, the controller 120 controls the three-dimensional object manufacturing device 10 based on the second data D2 stored in the RAM 128, thereby manufacturing the jig 400. At this time, as shown in FIG. 10, in the jig 400, an uneven inverted object 404 (i.e., a resin layer 406) having an uneven surface 408 is formed on the upper surface of the second substrate 402. The formation procedure is similar to the formation procedure of the resin layer 306 of the above-mentioned three-dimensional objects 302A and 302B (i.e., three-dimensional additive manufacturing), so a detailed description thereof will be omitted. However, the heat-sensitive adhesive sheet 304 is not used in the formation of the uneven inverted object 404.

In the hot pressing step S16, warping of the three-dimensional objects 302A and 302B is corrected. To do this, first, as shown in Figs. 4 and 5, a jig 400 is placed on the three-dimensional objects 302A and 302B that have been layered on the first substrate 300. At this time, the uneven surface 408 of the uneven inverted object 404 that has been layered on the second substrate 402 of the jig 400 is fitted into the uneven surface 314 of the three-dimensional objects 302A and 302B. Furthermore, the first substrate 300 and the second substrate 402 are pressed in a direction approaching each other by being clamped by a tool such as a clamp. That is, the first substrate 300 is pressed in the upward direction Z2, and the second substrate 402 is pressed in the downward direction Z1. By this pressing,
The three-dimensional objects 302A and 302B are placed in a flat state. Note that such tightening and other operations may be performed on the base 60 of the stage 52, or on a pedestal provided outside the base 28.

Next, the three-dimensional objects 302A and 302B are set in the heating press unit 130 and dried with hot air while still in the flattened state from pressing the first substrate 300 and the second substrate 402. This straightens out any warping of the three-dimensional objects 302A and 302B. Furthermore, the temperature rise caused by the hot air drying causes the temperature-sensitive adhesive sheet 304 to lose its adhesive force, changing into a state in which it can be easily peeled off from the first substrate 300 and the three-dimensional objects 302A and 302B.

When the hot air drying is completed, the three-dimensional objects 302A and 302B are removed from the heating press section 130 while still flattened by pressing the first substrate 300 and the second substrate 402. Then, tools such as clamps that fastened the first substrate 300 and the second substrate 402 are removed, and the jig 400 is removed from the three-dimensional objects 302A and 302B as shown in Figures 5 to 4. In this state, the three-dimensional objects 302A and 302B are peeled off from the temperature-sensitive adhesive sheet 304 on the first substrate 300. Note that such operations after the hot air drying may be performed on the base 60 of the stage 52, or on a pedestal provided outside the base 28.

As described above in detail, in this embodiment, the jig manufacturing method 150 is executed by the three-dimensional object manufacturing device 10, so that the manufacturing method of the jig 400 used to correct the warping of the three-dimensional objects 302A and 302B can be provided by utilizing the three-dimensional additive manufacturing technology without modifying it.

Incidentally, in this embodiment, the heat press unit 130 is an example of a "correction device." The three-dimensional objects 302A and 302B are an example of a "first three-dimensional object." The concave-convex inverted object 404 is an example of a "second three-dimensional object." The ultraviolet curable resin of the resin layer 406 is an example of a "resin material." The second data D2 is an example of "3D data." The height L3 is an example of "the distance from the top surface of the concave-convex surface of the first three-dimensional object to the second substrate when the first substrate and the second substrate are pressed together." The downward direction Z1 or the upward direction Z2 is an example of a "proximity direction."

The present disclosure is not limited to the above-described embodiment, and various modifications are possible without departing from the spirit of the present disclosure.
For example, in the data creation step S12, in consideration of the thinness of the heat-sensitive adhesive sheet 304, solid models of the three-dimensional objects 302A and 302B may be created assuming that the heat-sensitive adhesive sheet 304 does not exist.

When the jig 400 is placed on the three-dimensional objects 302A and 302B that have been layered on the first substrate 300, unlike in FIG. 5, it is possible to correct the warping of the three-dimensional objects 302A and 302B even if the concave-convex inverted object 404 of the jig 400 does not come into contact with the top surface of the first substrate 300. In such a case, in the data creation process S12, the portion of the solid model of the concave-convex inverted object 404 that exists above the area that is in contact with the top surface of the first substrate 300 is removed.

The hot press unit 130 may also have a pressing function. In such a case, the three-dimensional objects 302A, 302B are set in the hot press unit 130 with the jig 400 stacked on top of each other, without being pressed via the first substrate 300 and the second substrate 402 of the jig 400. In other words, the three-dimensional objects 302A, 302B are pressed in the hot press unit 130 via the first substrate 300 and the second substrate 402 by the pressing function of the hot press unit 130.

10: 3D object manufacturing device, 130: heat press unit, 140: 3D object manufacturing method, 150: jig manufacturing method, 300: first substrate, 302A: 3D object, 302B: 3D object, 304: temperature-sensitive adhesive sheet, 314: uneven surface, 316: top surface, 400: jig, 402: second substrate, 404: uneven inverted object, 406: resin layer, 408: uneven surface, D2: second data, L3: height of uneven surface of uneven inverted object, S10: modeling process, S12: data creation process, S14: manufacturing process, S16: heat press process, Z1: downward direction, Z2: upward direction

Claims (4)

1. A method for manufacturing a jig used in correcting warpage of a first three-dimensional object, the first three-dimensional object having a concave-convex surface that is additively manufactured on a first substrate by three-dimensional additive manufacturing, by pressing the first three-dimensional object in a direction approaching the first three-dimensional object, the jig comprising:
manufacturing the jig by using a second substrate and a second three-dimensional object having a concave-convex surface provided on the second substrate;
The jig is
a concave-convex surface of the first three-dimensional object and a concave-convex surface of the second three-dimensional object are fitted together and heated, and the first substrate and the second substrate are pressed in a direction in which they approach each other, thereby correcting warpage of the first three-dimensional object;
a data creating process for creating 3D data having a distance from at least a top surface of the uneven surface of the first three-dimensional object to the second substrate in a state in which the uneven surface of the first three-dimensional object and the uneven surface of the second three-dimensional object are fitted together;
and a manufacturing process for manufacturing the jig by additively manufacturing the second three-dimensional object on the second substrate using a resin material based on the 3D data by three-dimensional additive manufacturing. A jig used for correcting warpage of a first three-dimensional object having a concave-convex surface that is formed on a first substrate by three-dimensional additive manufacturing by pressing the first three-dimensional object in a direction approaching the first three-dimensional object, the jig comprising:
The jig is
the method comprises: a second substrate; and a second three-dimensional object having an uneven surface provided on the second substrate; the uneven surface of the first three-dimensional object and the uneven surface of the second three-dimensional object are fitted together and heated; and the first substrate and the second substrate are pressed in a direction in which they approach each other, thereby correcting warpage of the first three-dimensional object;
A jig in which the second three-dimensional object is layered on the second substrate using three-dimensional additive manufacturing with a resin material. A three-dimensional object manufacturing apparatus that manufactures the jig by the jig manufacturing method according to claim 1, and also manufactures the first three-dimensional object on the first substrate by three-dimensional additive manufacturing,
a correction device that corrects warping of the first three-dimensional object using the jig by heating the uneven surface of the second three-dimensional object, which is additively manufactured on the second substrate, in a state in which the uneven surface of the first three-dimensional object, which is additively manufactured on the first substrate, is fitted into the uneven surface of the second three-dimensional object, which is additively manufactured on the first substrate, and pressing the first substrate and the second substrate in a direction in which they approach each other. The data creating step and the manufacturing step included in the jig manufacturing method according to claim 1 ;
a modeling step of modeling the first three-dimensional object on the first substrate via a heat-sensitive adhesive sheet by three-dimensional additive manufacturing;
a heating and pressing process in which the uneven surface of the second three-dimensional object, which is additively manufactured on the first substrate, is fitted with the uneven surface of the first three-dimensional object, which is additively manufactured on the first substrate, and the uneven surface of the second three-dimensional object, which is additively manufactured on the second substrate, is heated while the first substrate and the second substrate are pressed in a direction toward each other, thereby correcting warping of the first three-dimensional object using the jig and at the same time peeling the first three-dimensional object from the first substrate with the heat-sensitive adhesive sheet.

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