CN115715055A - Circuit board manufacturing method for preventing laser drilling from exploding board - Google Patents
Circuit board manufacturing method for preventing laser drilling from exploding board Download PDFInfo
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- CN115715055A CN115715055A CN202211485114.0A CN202211485114A CN115715055A CN 115715055 A CN115715055 A CN 115715055A CN 202211485114 A CN202211485114 A CN 202211485114A CN 115715055 A CN115715055 A CN 115715055A
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- copper foil
- circuit board
- laser drilling
- manufacturing
- smooth surface
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Abstract
The invention discloses a circuit board manufacturing method for preventing laser drilling from exploding, which belongs to the technical field of circuit boards, wherein the smooth surface of a copper foil is processed, so that the roughness of the smooth surface of the copper foil is improved to form a bonding surface, the smooth surface of the original copper foil can be bonded with the circuit board, a brown film is generated on the rough surface through shape browning treatment of the rough surface of the copper foil, the laser drilling is carried out from the rough surface with the brown film, the laser drilling is stable, the problem of plate explosion of subsequent workpieces is avoided, and the yield of products is greatly improved while the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a circuit board manufacturing method for preventing laser drilling from exploding.
Background
At present, the process of forming blind vias on a printed circuit board usually adopts two methods, i.e. copper window forming and direct blind via forming. The copper window opening process comprises the following steps: the method comprises the steps of pressing, chemical cleaning, dry film pressing, aligning, exposing, etching, film removing and laser drilling. The disadvantages of the above process are: the production process is long, and more auxiliary materials are used; limited by the process capability, the requirement of increasingly fine circuit layout in the industry cannot be met. The flow of the direct blind hole opening mode is as follows: pressing, browning and laser drilling. The disadvantages of the above process are: because traditional copper foil is more smooth, lead to radium-shine drilling unstable, follow-up forging the board problem of exploding appears, leads to the work piece to scrap.
Disclosure of Invention
In order to overcome the defects of the prior art, one of the purposes of the invention is to provide a circuit board manufacturing method which has simple production flow and stable laser drilling and can avoid the occurrence of board explosion of workpieces.
One of the purposes of the invention is realized by adopting the following technical scheme:
a circuit board manufacturing method for preventing laser drilling from exploding comprises the following steps:
and (3) copper foil treatment: processing the smooth surface of the copper foil to improve the roughness of the smooth surface of the copper foil to form a bonding surface;
and (3) laminating: sticking the bonding surface of the copper foil to the circuit board;
browning: carrying out chemical treatment on the rough surface of the copper foil to generate a layer of compact organic brown film on the rough surface;
laser drilling: and directly drilling the circuit board adhered with the copper foil by using high-intensity laser to form blind holes.
Further, in the laser drilling step, the laser contacts the browning film firstly, then contacts the copper foil, and finally contacts the circuit board.
Further, in the laser drilling step, the blind hole penetrates through the copper foil, and the tail end of the blind hole is located inside the circuit board.
Furthermore, the roughness of the bonding surface is 1um-2.5um.
Further, in the step of processing the copper foil, the smooth surface of the copper foil is mechanically processed, and the roughness of the smooth surface is improved by adopting one or more modes of mechanical polishing and sand blasting coarsening.
Further, in the step of processing the copper foil, the smooth surface of the copper foil is chemically processed, and the roughness of the smooth surface is improved by adopting one or more modes of heat treatment, tinning and silicon coating.
Further, the roughness of the rough surface is larger than that of the bonding surface.
Further, in the pressing step, a pressing machine is adopted to press and stick the copper foil to the circuit board.
Compared with the prior art, the manufacturing method of the circuit board for preventing the laser drilling from exploding the board has the advantages that the smooth surface of the copper foil is processed, so that the roughness of the smooth surface of the copper foil is improved to form a bonding surface, the smooth surface of the original copper foil can be bonded with the circuit board, the brown film is generated on the rough surface through the shape-advancing brown treatment of the rough surface of the copper foil, the laser drilling is carried out from the rough surface with the brown film during the laser drilling, the laser drilling is stable, the problem of board explosion of subsequent workpieces is avoided, and the yield of products is greatly improved while the production efficiency is improved.
Drawings
FIG. 1 is a schematic structural diagram of a circuit board manufactured by the method for manufacturing a circuit board for preventing laser drilling from exploding;
FIG. 2 is a flow chart of a method for manufacturing a circuit board for preventing laser drilling from exploding.
In the figure: 10. a circuit board; 20. copper foil; 30. and (4) blind holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present, secured by the intervening elements. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly disposed on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the manufacturing process of the printed circuit board, blind holes are required to be manufactured on the circuit board, and the blind holes play a role in conducting left and right, so that the reliability of the circuit board can be ensured. As shown in fig. 1, the printed circuit board includes a circuit board 10 and a copper foil 20. The copper foil 20 is adhered to the circuit board 10. The printed circuit board is also provided with a blind hole 30, the blind hole 30 penetrates through the copper foil 20, and the tail end of the blind hole 30 is positioned on the circuit board 10.
Referring to fig. 2, the present invention further relates to a method for manufacturing the printed circuit board, which can prevent the workpiece from being exploded after laser drilling.
A circuit board manufacturing method for preventing laser drilling from exploding comprises the following steps:
treatment of the copper foil 20: treating the smooth surface of the copper foil 20 to improve the roughness of the smooth surface of the copper foil 20 to form a bonding surface;
and (3) laminating: sticking the bonding surface of the copper foil 20 to the circuit board 10;
browning: chemically treating the rough surface of the copper foil 20 to form a dense organic brown film on the rough surface;
laser drilling: the circuit board 10 to which the copper foil 20 is attached is directly drilled using a high-intensity laser to form blind vias 30.
Specifically, in the step of processing the copper foil 20, the smooth surface of the copper foil 20 is mechanically processed, and the roughness of the smooth surface is improved by one or more of mechanical polishing and sand blasting roughening. The matte side of the copper foil 20 may also be chemically treated to increase the roughness of the matte side by one or more of heat treatment, tin plating, and silicon patterning. The roughness of the bonding surface is 1um-2.5um. The roughness of the rough surface is greater than that of the bonding surface.
Specifically, in the pressing step, the copper foil 20 is pressed and adhered to the circuit board 10 by using a pressing machine.
Specifically, in the laser drilling step, the laser contacts the browning film, contacts the copper foil 20, and contacts the circuit board 10. The blind via 30 penetrates the copper foil 20 and the end of the blind via 30 is located inside the circuit board 10.
Compared with the prior art, the manufacturing method of the circuit board 10 for preventing laser drilling from exploding the board has the advantages that the smooth surface of the copper foil 20 is processed, so that the roughness of the smooth surface of the copper foil 20 is improved to form a bonding surface, the original smooth surface of the copper foil 20 can be bonded with the circuit board 10, a brown film is generated on the rough surface through shape-advancing brown processing of the rough surface of the copper foil 20, the laser drilling is carried out from the rough surface with the brown film during laser drilling, the laser drilling is stable, the problem of board explosion caused by subsequent workpiece forging is avoided, the production efficiency is improved, and the yield of products is greatly improved.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, variations and modifications can be made without departing from the spirit of the invention, and all equivalent modifications and changes can be made to the above embodiments according to the essential technology of the invention, which falls into the protection scope of the invention.
Claims (8)
1. A circuit board manufacturing method for preventing laser drilling from exploding is characterized by comprising the following steps:
and (3) processing the copper foil: processing the smooth surface of the copper foil to improve the roughness of the smooth surface of the copper foil to form a bonding surface;
and (3) laminating: sticking the bonding surface of the copper foil to the circuit board;
browning: chemically treating the rough surface of the copper foil to generate a layer of compact organic brown film on the rough surface;
laser drilling: and directly drilling the circuit board adhered with the copper foil by using high-intensity laser to form blind holes.
2. The method for manufacturing a circuit board for preventing laser drilling and plate explosion according to claim 1, wherein the method comprises the following steps: in the laser drilling step, the laser contacts the browning film firstly, then contacts the copper foil and finally contacts the circuit board.
3. The method for manufacturing a circuit board capable of preventing laser drilling from exploding the board according to claim 1, wherein the method comprises the following steps: in the laser drilling step, the blind hole penetrates through the copper foil, and the tail end of the blind hole is located in the circuit board.
4. The method for manufacturing a circuit board for preventing laser drilling and plate explosion according to claim 1, wherein the method comprises the following steps: the roughness of the bonding surface is 1um-2.5um.
5. The method for manufacturing a circuit board capable of preventing laser drilling from exploding the board according to claim 1, wherein the method comprises the following steps: in the step of processing the copper foil, the smooth surface of the copper foil is mechanically processed, and the roughness of the smooth surface is improved by adopting one or more modes of mechanical polishing and sandblasting coarsening.
6. The method for manufacturing a circuit board capable of preventing laser drilling from exploding the board according to claim 1, wherein the method comprises the following steps: in the step of processing the copper foil, the smooth surface of the copper foil is chemically processed, and the roughness of the smooth surface is improved by adopting one or more modes of heat treatment, tinning and silicon coating.
7. The method for manufacturing a circuit board for preventing laser drilling and plate explosion according to claim 1, wherein the method comprises the following steps: the roughness of the rough surface is greater than that of the bonding surface.
8. The method for manufacturing a circuit board for preventing laser drilling and plate explosion according to claim 1, wherein the method comprises the following steps: and in the pressing step, the copper foil is pressed and adhered to the circuit board by adopting a pressing machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211485114.0A CN115715055A (en) | 2022-11-24 | 2022-11-24 | Circuit board manufacturing method for preventing laser drilling from exploding board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211485114.0A CN115715055A (en) | 2022-11-24 | 2022-11-24 | Circuit board manufacturing method for preventing laser drilling from exploding board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115715055A true CN115715055A (en) | 2023-02-24 |
Family
ID=85234578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211485114.0A Pending CN115715055A (en) | 2022-11-24 | 2022-11-24 | Circuit board manufacturing method for preventing laser drilling from exploding board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115715055A (en) |
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2022
- 2022-11-24 CN CN202211485114.0A patent/CN115715055A/en active Pending
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