CN115709151A - Electronic components rubber coating equipment - Google Patents
Electronic components rubber coating equipment Download PDFInfo
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- CN115709151A CN115709151A CN202211221031.0A CN202211221031A CN115709151A CN 115709151 A CN115709151 A CN 115709151A CN 202211221031 A CN202211221031 A CN 202211221031A CN 115709151 A CN115709151 A CN 115709151A
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Abstract
The application discloses electronic components rubber coating equipment includes: the landing leg, the rubber column of setting in the landing leg top, the installation base station of setting on the rubber column, the conveying frame of setting in installation base station top, the electronic lead screw that the symmetry set up on the conveying frame is used for the regulation of support frame, the conveyer belt that sets up on the conveying frame is used for electronic components's transport work, the support frame that sets up on the conveying frame and link to each other with electronic lead screw, the rubber coating subassembly that sets up on the support frame is used for electronic components's rubber coating, two mount tables that set up in conveying frame top are used for the installation of electronic components centre gripping platform. From this, can change electronic components clamping table according to electronic components's size, improve electronic components rubber coated efficiency greatly, can carry out the rubber coating work of the electronic components of different grade type simultaneously, promote different grade type electronic components's adaptability.
Description
Technical Field
The application relates to the technical field of electronic components, in particular to electronic component gluing equipment.
Background
The electronic component is a component of an electronic component and a small machine or instrument, is usually composed of a plurality of parts and can be commonly used in the similar products; it is a general name of electronic devices such as capacitor, transistor, balance spring and spiral spring. Diodes and the like are common.
At present, when electronic components are processed, if the electronic components are glued, gluing equipment for the electronic components is needed to glue the electronic components. However, the existing gluing equipment for electronic components can only be used in a single size, if electronic component frames in different sizes are needed to be glued, different electronic component clamping tables are needed, the processing efficiency of the electronic components is reduced, and the existing gluing equipment cannot glue electronic components in different types at the same time, so that the adaptive capacity of the electronic components is reduced.
Content of application
The present application is directed to solving, at least in part, one of the technical problems in the art described above.
Therefore, an aim at of this application provides an electronic components rubber coating equipment, can change the electronic components clamping table according to electronic components's size, has improved electronic components rubber coated efficiency greatly, can carry out the rubber coating work of the electronic components of different grade type simultaneously, has promoted different grade type electronic components's adaptability.
In order to achieve the above object, a first aspect of the present application provides an electronic component gluing device, which includes: the automatic gluing device comprises a conveying frame, an electric screw rod, a conveying belt, a supporting frame, a gluing assembly and a mounting table, wherein a moving chute and a mounting partition plate are arranged on the conveying frame; the electric screw rods are symmetrically arranged in the movable sliding grooves and are connected with the mounting partition plate, and the electric screw rods are used for adjusting the supporting frame so as to adjust the distance of the gluing component; the conveying belt is arranged on the conveying frame and used for conveying the electronic element to be glued so as to process the electronic element; the supporting frame is arranged on the conveying frame and connected with the electric lead screw;
the gluing assembly is arranged on the support frame and is used for gluing the electronic component to be glued;
the mounting table is arranged on the conveying frame and used for mounting the electronic component clamping table so as to mount the electronic component to be glued.
According to the electronic component gluing equipment, the electronic component clamping table can be replaced according to the size of the electronic component, the gluing efficiency of the electronic component is greatly improved, the gluing work of the electronic components of different types can be carried out simultaneously, and the adaptation capability of the electronic components of different types is improved.
In addition, the electronic component gluing equipment provided by the application can also have the following additional technical characteristics:
in an embodiment of the present application, the electronic component gluing device further includes: landing leg and rubber column, wherein, the landing leg setting is in the below of rubber column, the rubber column is used for electronic components rubber coating equipment provides the buffering, in order to steadily support electronic components rubber coating equipment.
In an embodiment of the present application, the electronic component gluing device further includes: the installation base station, wherein, the installation base station sets up the top of rubber column is used for the support of conveying frame to steadily support and treat rubber coating electronic components, wherein, the installation slip table is located in the installation spout.
In an embodiment of the application, still be provided with balanced vaulting pole on the transfer frame, wherein, balanced vaulting pole is used for the balanced support of conveyer belt to balanced transport electronic components.
In one embodiment of the application, the support frame comprises a support sliding block, a support vertical rod, an adjusting transverse rod and an adjusting sliding groove, wherein the support sliding block is symmetrically positioned in the moving sliding groove and is connected with the electric lead screw; the plurality of supporting vertical rods are arranged above the supporting sliding block; the adjusting cross rod is arranged above the supporting vertical rod; the adjusting sliding groove is arranged in the adjusting cross rod.
In one embodiment of the application, the gluing assembly comprises an equipment main body, an adjusting push rod, a grabbing structure, an air duct, a mounting frame and a gluing device, wherein the equipment main body is arranged in the adjusting chute; the adjusting push rod is arranged below the equipment main body; the grabbing structure is arranged below the adjusting push rod; one end of the air duct is connected with the equipment main body; the other end of the air duct is connected with the gluing device; the mounting frame is arranged on the grabbing structure; the gluing device is arranged in the mounting frame.
In one embodiment of the present application, the mounting stage includes a first mounting stage, a second mounting stage, and mounting screw holes, wherein the first mounting stage and the second mounting stage are disposed above the transfer frame; the installation screw hole is arranged on the first installation platform and the second installation platform.
After adopting above-mentioned technical scheme, this application compares advantage that has with prior art: can change electronic components clamping table according to electronic components's size, improve electronic components rubber coated efficiency greatly, can carry out the rubber coating work of the electronic components of different grade type simultaneously, promote different grade type electronic components's adaptability.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of an electronic component gluing device according to an embodiment of the application;
fig. 2 is a front view of an electronic component gluing device according to an embodiment of the present application;
fig. 3 is a side view of an electronic component gluing apparatus according to an embodiment of the present application;
fig. 4 is a top view of an electronic component gluing device according to an embodiment of the present application;
fig. 5 is a sectional view 1 of an electronic component gluing apparatus according to an embodiment of the present application;
fig. 6 is a cross-sectional view 2 of an electronic component gluing device according to an embodiment of the present application;
fig. 7 is a regulating structure diagram of the electronic component gluing device according to an embodiment of the application;
fig. 8 is a diagram of a glue spreading assembly of an electronic component gluing device according to an embodiment of the application.
As shown in the figure: the rubber coating machine comprises a supporting leg 1, a rubber column 2, an installation base station 3, a conveying frame 4, an electric lead screw 5, a conveying belt 6, a supporting frame 7, a rubber coating assembly 8, an installation table 9, a movable sliding groove 40, an installation separation plate 41, a balance supporting rod 42, a supporting sliding block 70, a supporting vertical rod 71, a regulating cross rod 72, a regulating sliding groove 73, an equipment main body 80, a regulating push rod 81, a grabbing structure 82, an air guide pipe 83, an installation frame 84, a rubber coating device 85, a first installation table 90, a second installation table 91 and a screw installation hole 92.
Detailed Description
Reference will now be made in detail to the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application. On the contrary, the embodiments of the application include all changes, modifications and equivalents coming within the spirit and terms of the claims appended hereto.
The electronic component gluing device according to the embodiment of the application is described below with reference to the accompanying drawings.
The electronic gluing equipment provided by the embodiment of the application can be applied to electronic processing factories, substitute factories and the like, and is used for gluing electronic components with different sizes during processing the electronic components.
Fig. 1 is a schematic structural diagram of an electronic component gluing device according to an embodiment of the present application, and fig. 8 is a diagram of a gluing component of the electronic component gluing device according to an embodiment of the present application.
As shown in fig. 1 and 7, the electronic component gluing device according to the embodiment of the present application may include: conveying frame 4, electronic lead screw 5, conveyer belt 6, support frame 7, rubber coating subassembly 8 and mount table 9.
The conveying frame 4 is provided with a moving chute 40 and an installation partition plate 41, the electric screw rods 5 are symmetrically arranged in the moving chute 40, the electric screw rods 5 are connected with the installation partition plate 41 and used for adjusting the supporting frame 7 to adjust the distance of the gluing component 8, the conveying belt 6 is arranged on the conveying frame 4 and used for conveying electronic components to be glued so as to process the electronic components, the supporting frame 7 is arranged on the conveying frame 4, and the supporting frame 7 is connected with the electric screw rods 5.
Further, the gluing component 8 is arranged on the support frame 7 and used for gluing the electronic component to be glued.
Further, a mounting table 9 is provided on the transfer frame 4 for mounting of the electronic component holding table to mount the electronic component to be glued.
It should be noted that the adjusting push rod described in the above embodiments can be automatically controlled by the controller.
Specifically, when the electronic component gluing device is used, a related person can place the electronic component gluing device at a designated position through the support leg 1, after placing at the designated position, the rubber column 2 is installed on the support leg 1, after the rubber column 2 is installed on the support leg 1, the supporting and buffering work of the installation base 3 is performed through the rubber column 2 arranged on the support leg 1, the installation base 3 is installed above the rubber column 2, after the installation base 3 is installed above the rubber column 2, the supporting work of the transmission frame 4 is performed through the installation base 3 arranged above the rubber column 2, the transmission frame 4 is installed on the installation base 3, after the transmission frame 4 is installed on the installation base 3, the installation work of the electric screw 5 and the transmission belt 6 is performed through the transmission frame 4 arranged on the installation base 3, and the installation work of the electric screw 5 is performed through the moving chute 40 arranged on the transmission frame 4.
After the electric screw 5 is installed in the moving chute 40, the electric screw 5 is supported through the installation partition plate 41 arranged on the transmission frame 4, the electric screw 5 is installed on the transmission frame 4, the electric screw 5 symmetrically arranged on the moving chute 40 and connected with the installation partition plate 41 is used for adjusting the support frame 7, the conveyer belt 6 is installed on the transmission frame 4, the transmission work of the electronic components to be processed is carried out through the conveyer belt 6 arranged on the transmission frame 4, so as to process the electronic components, the support frame 7 is installed on the transmission frame 4, the support and adjustment work of the gluing component 8 are carried out through the support frame 7 arranged on the transmission frame 4 and connected with the electric screw 5, the gluing component 8 is installed on the support frame 7 through the gluing component 8 arranged on the support frame 7, the gluing component is operated, the installation table 9 is installed on the transmission frame 4, the electronic components to be assembled through the electronic components, and the installation table 9 of the electronic components to be assembled, and the electronic components can be assembled by the electronic components.
Further, after the electronic component gluing device is assembled, a related person puts the electronic component to be glued on the conveyor belt 6, after the electronic component to be glued is placed on the conveyor belt 6, the controller controls the electronic component gluing device to work, the controller controls the conveyor belt 6 to work, the conveyor belt 6 transmits the electronic component to be glued when working, the controller controls the electric lead screw 5 to rotate, when the electric lead screw 5 rotates, the supporting slide block 70 of the supporting frame 7 is driven to slide along the moving chute 40, after the supporting slide block 70 slides to a proper position, the controller controls the device main body 80 of the gluing assembly 8 to move along the adjusting chute 73 of the adjusting cross rod 72, after the gluing assembly 8 moves to the upper side of the electronic component to be glued, the controller controls the adjusting push rod 81 to extend and retract, when the adjusting push rod 81 extends and retracts, the grabbing structure 82 is driven to descend, after the grabbing structure 82 descends to the electronic component to be glued, the electronic component to be glued is grabbed on the electronic component clamping table, after the electronic component to be glued is placed on the electronic component clamping table, and the air guide tube is provided with air pressure by the controller 83 for the electronic component to be glued so as to obtain a target electronic component to be glued.
After the target electronic component is obtained, the controller controls the grabbing structure 82 of the gluing component 8 to grab the target electronic component onto the conveying belt 6, and the conveying belt 6 conveys the target electronic component out, so that the gluing work of the electronic component can be completed.
Referring to fig. 1 to 8, in an embodiment of the present application, the electronic component gluing device may further include: landing leg 1 and rubber column 2, wherein, landing leg 1 sets up in the below of rubber column 2, and rubber column 2 for electronic components rubber coating equipment provides the buffering, with steadily supporting electronic components rubber coating equipment.
Particularly, when electronic components rubber coating equipment placed, relevant personnel accessible set up landing leg 1 in 2 below rubber column, carry out electronic components's the work of placing, when electronic components rubber coating equipment needs the buffering, relevant personnel accessible rubber column 2 provides the buffering for electronic components rubber coating equipment to carry out the steady support work of electronic components rubber coating equipment.
In an embodiment of the present application, as shown in fig. 1 to 6, the electronic component gluing device further includes: and the mounting base station 3 is arranged above the rubber column 2 and used for supporting the conveying frame so as to stably support the electronic component to be glued.
Specifically, when the support is needed, the relevant person can perform the support work of the transfer rack 4 through the mounting base 3 disposed above the rubber column 2, thereby stably supporting the work of the electronic component to be glued.
Referring to fig. 1 to 8, in an embodiment of the present application, a balance brace 42 is further disposed on the transport frame 4, wherein the balance brace 42 is used for balancing and supporting the conveyor belt 6 to balance and convey the electronic components.
Specifically, when the conveyer belt 6 needs to be supported in a balanced manner, the relevant person can perform the balanced support of the conveyer belt 6 through the balance support rods 42 on the conveying frame 4, connect the conveyer belt 6 with the conveying frame 4 of the balance support rods 42 respectively, and after the conveyer belt 6 is connected with the balance support rods 42 and the conveying frame 4, the balanced support work of the conveyer belt 6 can be completed.
Referring to fig. 1-8, in one embodiment of the present application, the support frame 7 includes a support slider 70, a support vertical rod 71, an adjustment cross rod 72, and an adjustment sliding slot 73.
The supporting sliding blocks 70 are symmetrically located in the moving sliding grooves 40, the supporting sliding blocks 70 are connected with the electric screw rods 5, the supporting vertical rods 71 are arranged above the supporting sliding blocks 70, the adjusting transverse rods 72 are arranged above the supporting vertical rods 71, and the adjusting sliding grooves 73 are arranged in the adjusting transverse rods 72.
Particularly, when electronic components rubber coating equipment uses, relevant personnel accessible symmetry sets up the support slide 70 that links to each other with electric screw 5 in removing spout 40, carry out the support work of support frame 7, through the support montant 71 that sets up in support slide 70 top, adjust the support work of horizontal pole 72, through the regulation horizontal pole 72 that sets up in support montant 71 top, carry out the support work of rubber coating subassembly 8, through setting up the regulation spout 73 in adjusting horizontal pole 72, carry out the regulation work of rubber coating subassembly 8, alright in order to accomplish the use work of electronic components rubber coating equipment.
In one embodiment of the present application, as shown in fig. 1-8, the glue application assembly 8 includes an apparatus body 80, an adjustment push rod 81, a grasping structure 82, an air duct 83, a mounting bracket 84, and a glue application device 85.
Wherein, the equipment main part 80 sets up in adjusting spout 73, and adjusting push rod 81 sets up the below at equipment main part 80, snatchs the structure 82 and sets up the below at adjusting push rod 81, and the one end and the equipment main part 80 of air duct 83 link to each other, and the other end and the rubber coating device 85 of air duct 83 link to each other, and mounting bracket 84 sets up on snatching the structure 82, and rubber coating device 85 sets up in mounting bracket 84.
Specifically, when the gluing assembly 8 is used, the relevant personnel can pass through the device main body 80 arranged in the adjusting chute 73, the moving work of the gluing assembly 8 is carried out, so that the adjusting work of the gluing assembly 8 is carried out, the height adjusting work of the gluing assembly 8 is carried out through the adjusting push rod 81 arranged below the device main body 80, so that the grabbing work of the electronic component to be glued is carried out, the grabbing work of the electronic component to be glued is carried out through the grabbing structure 82 arranged below the adjusting push rod 81, the controller controls the grabbing structure 82 to grab the electronic component to be processed onto the electronic component clamping table above the mounting table 9, so that the gluing work of the electronic component can be carried out, one end of the air guide pipe 83 is connected with the device 85, the air supply of the gluing assembly 8 is carried out, the gluing of the electronic component can be completed, the mounting frame supporting work of the gluing device 85 is carried out through the air guide pipe 84 arranged on the grabbing structure 82, the gluing device 85 is arranged in the mounting frame 84, the gluing work of the electronic component can be carried out, and the using work of the gluing assembly 8 can be completed.
In one embodiment of the present application, as shown in fig. 1-8, mounting table 9 includes a first mounting table 90, a second mounting table 91, and mounting screw holes 92.
Wherein the first mount table 90 and the second mount table 91 are provided above the conveyance rack 4, and the mounting screw holes 92 are provided on the first mount table 90 and the second mount table 91.
Particularly, when installing the electronic component clamping table, the relevant personnel accessible sets up first mount table 90 and second mount table 91 in conveying frame 4 top, carry out the installation of electronic component clamping table, through setting up installation screw 92 on first mount table 90 and second mount table 91, carry out the fixed work of electronic component clamping table, place the electronic component clamping table respectively on first mount table 90 and second mount table 91, the electronic component plays the price clamping table and places the back, use the bolt to install the electronic component clamping table in installation screw 92, alright in order to accomplish the installation work of electronic component clamping table.
To sum up, the electronic components rubber coating equipment of this application embodiment can use in electronic processing factory, generation factory etc. can change electronic components grip slipper according to electronic components's size, has improved electronic components rubber coated efficiency greatly, can carry out the rubber coating work of the electronic components of different grade type simultaneously, has promoted different grade type electronic components's adaptability.
In the description of the present application, it is to be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are intended to be inclusive and mean, for example, that is, permanently connected, removably connected, or integral, that is, mechanically connected, electrically connected, directly connected, indirectly connected through an intervening medium, and that is open to two elements or that is in a relationship between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the same embodiment or example must be referred to by the same schematic representation of the above terms. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.
Claims (7)
1. The utility model provides an electronic components rubber coating equipment which characterized in that includes: a conveying frame (4), an electric screw (5), a conveying belt (6), a supporting frame (7), a gluing component (8) and a mounting table (9), wherein,
the conveying frame (4) is provided with a movable sliding chute (40) and a mounting partition plate (41);
the electric screw rods (5) are symmetrically arranged in the movable sliding groove (40), and the electric screw rods (5) are connected with the mounting partition plate (41) and used for adjusting the supporting frame (7) so as to adjust the distance of the gluing component (8);
the conveying belt (6) is arranged on the conveying frame (4) and is used for conveying the electronic element to be glued so as to process the electronic element;
the supporting frame (7) is arranged on the conveying frame (4), and the supporting frame (7) is connected with the electric screw rod (5);
the gluing component (8) is arranged on the support frame (7) and is used for gluing the electronic component to be glued;
the mounting table (9) is arranged on the conveying frame (4) and used for mounting the electronic component clamping table so as to mount the electronic component to be glued.
2. The electronic component gluing device of claim 1, further comprising: landing leg (1) and rubber column (2), wherein, landing leg (1) sets up the below of rubber column (2), wherein, rubber column (2) are used for electronic components rubber coating equipment provides the buffering, with the steady support electronic components rubber coating equipment.
3. The electronic component gluing device as claimed in claim 2, further comprising: a mounting base (3) in which,
the mounting base station (3) is arranged above the rubber column (2) and used for supporting the conveying frame so as to stably support the electronic component to be glued.
4. The gluing equipment for electronic components according to claim 1, wherein a balance brace (42) is further arranged on the conveying rack (4), wherein the balance brace (42) is used for balance support of the conveying belt (6) so as to balance conveying of the electronic components.
5. The gluing equipment for electronic components according to claim 1, wherein the supporting frame (7) comprises a supporting slide block (70), a supporting vertical rod (71), an adjusting cross rod (72) and an adjusting sliding groove (73), wherein,
the supporting sliding blocks (70) are symmetrically positioned in the moving sliding grooves (40), and the supporting sliding blocks (70) are connected with the electric screw rod (5);
the plurality of vertical support rods (71) are arranged above the support sliding block (70);
the adjusting cross rod (72) is arranged above the supporting vertical rod (71);
the adjusting sliding groove (73) is arranged in the adjusting cross rod (72).
6. Gluing device for electronic components according to claim 5, wherein the gluing assembly (8) comprises a device body (80), an adjusting push rod (81), a gripping structure (82), a gas tube (83), a mounting bracket (84) and a gluing device (85),
the device body (80) is arranged in the adjusting chute (73);
the adjusting push rod (81) is arranged below the device main body (80);
the grabbing structure (82) is arranged below the adjusting push rod (81);
one end of the air duct (83) is connected with the equipment main body (80); the other end of the air duct (83) is connected with the gluing device (85);
the mounting frame (84) is arranged on the grabbing structure (82);
the gluing device (85) is arranged in the mounting frame (84).
7. Electronic component gluing device according to claim 4, wherein the mounting table (9) comprises a first mounting table (90), a second mounting table (91) and mounting screw holes (92),
the first mounting table (90) and the second mounting table (91) are arranged above the conveying rack (4);
the mounting screw hole (92) is formed in the first mounting table (90) and the second mounting table (91).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211221031.0A CN115709151A (en) | 2022-10-08 | 2022-10-08 | Electronic components rubber coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211221031.0A CN115709151A (en) | 2022-10-08 | 2022-10-08 | Electronic components rubber coating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115709151A true CN115709151A (en) | 2023-02-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211221031.0A Pending CN115709151A (en) | 2022-10-08 | 2022-10-08 | Electronic components rubber coating equipment |
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| Country | Link |
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| CN (1) | CN115709151A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117443671A (en) * | 2023-12-25 | 2024-01-26 | 硕泰(江苏)精密制造有限公司 | High-efficient rubber coating device of electronic components |
-
2022
- 2022-10-08 CN CN202211221031.0A patent/CN115709151A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117443671A (en) * | 2023-12-25 | 2024-01-26 | 硕泰(江苏)精密制造有限公司 | High-efficient rubber coating device of electronic components |
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