CN115704108A - 预热环和基板处理装置 - Google Patents
预热环和基板处理装置 Download PDFInfo
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- CN115704108A CN115704108A CN202110907191.XA CN202110907191A CN115704108A CN 115704108 A CN115704108 A CN 115704108A CN 202110907191 A CN202110907191 A CN 202110907191A CN 115704108 A CN115704108 A CN 115704108A
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- 230000000670 limiting effect Effects 0.000 claims description 2
- 239000010409 thin film Substances 0.000 abstract description 22
- 239000007789 gas Substances 0.000 description 134
- 239000004065 semiconductor Substances 0.000 description 13
- 238000009826 distribution Methods 0.000 description 10
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- 230000002829 reductive effect Effects 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 229910010271 silicon carbide Inorganic materials 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910004009 SiCy Inorganic materials 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
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- 239000001257 hydrogen Substances 0.000 description 2
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110907191.XA CN115704108A (zh) | 2021-08-09 | 2021-08-09 | 预热环和基板处理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202110907191.XA CN115704108A (zh) | 2021-08-09 | 2021-08-09 | 预热环和基板处理装置 |
Publications (1)
Publication Number | Publication Date |
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CN115704108A true CN115704108A (zh) | 2023-02-17 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202110907191.XA Pending CN115704108A (zh) | 2021-08-09 | 2021-08-09 | 预热环和基板处理装置 |
Country Status (1)
Country | Link |
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CN (1) | CN115704108A (zh) |
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2021
- 2021-08-09 CN CN202110907191.XA patent/CN115704108A/zh active Pending
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PB01 | Publication | ||
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TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240207 Address after: 518000, Building D, 101, Zhongke Valley Industrial Park, Zhonghuan Avenue, Shanxia Community, Pinghu Street, Longgang District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Pengxin Microintegrated Circuit Manufacturing Co.,Ltd. Country or region after: China Address before: No.16, Chuangxin Avenue, Ningxi street, Zengcheng District, Guangzhou, Guangdong 510000 Applicant before: Guangzhou integrated circuit technology Research Institute Co.,Ltd. Country or region before: China |