CN115696777A - QFN packaging method of power conversion module - Google Patents
QFN packaging method of power conversion module Download PDFInfo
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- CN115696777A CN115696777A CN202211277592.2A CN202211277592A CN115696777A CN 115696777 A CN115696777 A CN 115696777A CN 202211277592 A CN202211277592 A CN 202211277592A CN 115696777 A CN115696777 A CN 115696777A
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Abstract
The invention relates to the technical field of QFN (quad flat no-lead) packaging, and discloses a QFN packaging method of a power conversion module, which solves the problems that the internal heat conduction effect of the conventional QFN packaging structure is poor, and the short circuit and unstable connection are easily caused by the connection with a PCB (printed circuit board). The QFN packaging structure comprises a power conversion module PCB and a plurality of QFN packaging bodies, wherein each QFN packaging body consists of a packaging base, a chip and a plastic packaging body, a plurality of first pins are arranged on the side edge of the top end of the packaging base, a plurality of second pins are arranged on the side edge of the top end of the chip, and the first pins are connected with the second pins through metal wires; the power supply conversion module with the QFN packaging structure can improve the internal heat conduction effect, so that heat on a chip is dissipated quickly, the connection stability between internal pins and the stability of connection between a QFN packaging body and a power supply conversion module PCB can be improved, and meanwhile, the phenomenon of tin climbing can be avoided, and short circuit is avoided.
Description
Technical Field
The invention belongs to the technical field of QFN (quad Flat No-lead) packaging, and particularly relates to a QFN packaging method of a power conversion module.
Background
QFN is a leadless package, square or rectangular in shape. QFN packages provide excellent electrical performance because they do not have gull-wing leads as do conventional SOIC and TSOP packages, the electrical path between the inner leads and the pads is short, the self-inductance and wiring resistance within the package is low. In addition, it provides excellent heat dissipation through the exposed leadframe pad, which has direct heat dissipation paths for dissipating heat within the package. Typically, heat-dissipating pads are soldered directly to the circuit board, and heat-dissipating vias in the PCB help to spread excess power dissipation into the copper ground plate, thereby absorbing excess heat.
However, in the current QFN package structure, the leads of the chip therein are still connected with the leads on the package base through the filament leads, the connection position is a single solder joint, which is prone to poor contact, and the heat conduction effect is not good, so that the heat on the chip cannot be quickly transferred to the leads on the package base, thereby affecting the heat dissipation performance; in addition, when the conventional QFN package structure is connected to a PCB, if the amount of tin is too much, a tin-climbing phenomenon may occur, which may cause a short circuit easily, and if the amount of tin is too little, the QFN package structure may cause disadvantages of poor connection stability and low connection strength, which may cause the connection to fall off easily.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the QFN packaging method of the power conversion module, which effectively solves the problems that the internal heat conduction effect of the conventional QFN packaging structure is poor, and the connection with a PCB (printed circuit board) is easy to cause short circuit and unstable in connection.
In order to achieve the purpose, the invention provides the following technical scheme: a QFN packaging method of a power conversion module comprises a power conversion module PCB and a plurality of QFN packaging bodies, wherein the QFN packaging bodies are connected to the top end of the power conversion module PCB, each QFN packaging body is composed of a packaging base, a chip and a plastic packaging body, the chip base is connected to the top end of the packaging base, the chip is connected to the top end of the chip base, the plastic packaging body is connected to the top ends of the packaging base and the chip, a plurality of first pins which are inserted into the packaging base are arranged on the side edge of the top end of the packaging base, a plurality of second pins matched with the first pins are arranged on the side edge of the top end of the chip, and the first pins are connected with the second pins through metal wires.
Preferably, the QFN package is connected to the top end of the power conversion module PCB through solder, and the top end of the power conversion module PCB is provided with a plurality of printed pins matched with the first pins.
Preferably, the first pins are composed of inserting sections and exposed sections, the inserting sections are fixedly connected to the top ends of the exposed sections, the inserting sections are inserted into the packaging base in a penetrating mode, and the exposed sections are located at the bottom ends of the side edges of the packaging base.
Preferably, the bottom end of the exposed section is provided with a soldering tin filling groove which is of an arc structure, the bottom surface of the soldering tin filling groove is provided with an etching layer, and the etching layer is of an irregular etching surface structure.
Preferably, the top end of the packaging base is provided with a first chip holder matched placing groove, the top end of the chip holder is provided with a second chip matched placing groove, and four corners of the top end of the packaging base are fixedly provided with T-shaped limiting connecting support arms matched with the plastic package body.
Preferably, the top end of the first pin is provided with a first connecting clamping groove matched with the metal wire, and the top end of the second pin is provided with a second connecting clamping groove matched with the metal wire.
Preferably, the metal wire comprises first connection contact piece, second connection contact and linkage segment, first connection contact piece fixed connection in the bottom of linkage segment and with connection card groove one phase-match, second connection contact fixed connection in the top of linkage segment and with connection card groove two phase-matches, first connection contact piece, second connection contact and linkage segment are the copper product.
Preferably, the QFN packaging method of the power conversion module includes the following steps:
step one, arranging a soldering tin filling groove at the bottom end of a first pin, and etching the bottom end of the soldering tin filling groove to form an etching layer with an irregular etching surface structure;
step two, arranging a first placing groove in the middle of the top end of the packaging base, arranging a plurality of through holes on the side edge of the top of the packaging base, wherein the inner diameters of the through holes are the same as the outer diameters of the first pins, and inserting the first pins into the through holes;
step three, fixedly mounting T-shaped limiting connecting support arms at four corners of the top end of the packaging base, wherein the T-shaped limiting connecting support arms are made of aluminum alloy;
step four, arranging a second placing groove at the top end of the chip holder, connecting the chip holder to the inside of the first placing groove, and placing the chip in the second placing groove so that a second pin on the chip is positioned at the top end;
step five, clamping and fixing a plurality of metal wires through an auxiliary clamping plate, enabling the metal wires to be arranged at equal intervals, enabling the width between the metal wires to be the same as the width between the first pin and the second pin, enabling the first connecting contact piece to be attached to the first pin and located inside the first connecting clamping groove, and enabling the second connecting contact piece to be attached to the second pin and located inside the second connecting clamping groove;
step six, respectively connecting the metal lead with the first pin and the second pin in a soldering manner, and taking down the auxiliary clamping plate after the connection and fixation;
step seven, mounting and fixing a packaging mold sleeve at the top end of the packaging base, and pouring a hot-melted plastic package body in the packaging mold sleeve to realize integral packaging of the chip base and the chip;
and step eight, connecting the QFN packaging body with a printing pin on the PCB of the power conversion module through soldering tin, and filling the soldering tin into the soldering tin filling groove.
Preferably, in the second step, when the first lead is mounted, the flared end of the solder-filled groove is exposed while being positioned on the outer side of the package base.
Preferably, in the second step and the fourth step, glue connection structures are arranged between the first pins and the through holes, between the chip holders and the second placing grooves, and between the chips and the second placing grooves.
Compared with the prior art, the invention has the beneficial effects that:
(1) In operation, the power conversion module with the QFN packaging structure can improve the internal heat conduction effect, so that heat on a chip is dissipated quickly, the connection stability between internal pins and the stability of connection between a QFN packaging body and a PCB (printed circuit board) of the power conversion module can be improved, and the phenomenon of tin climbing can be avoided, thereby avoiding the condition of short circuit.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.
In the drawings:
FIG. 1 is a schematic diagram of a partial structure of a power conversion module according to the present invention;
FIG. 2 is a schematic view of a connection structure of a chip, a chip carrier and a package base according to the present invention;
FIG. 3 is a schematic diagram of a package base structure according to the present invention;
FIG. 4 is a schematic view of a connection structure of a chip and a chip carrier according to the present invention;
FIG. 5 is a cross-sectional view of a QFN package of the present invention;
FIG. 6 is an enlarged view of a portion of the invention at A in FIG. 5;
FIG. 7 is a schematic view of a connection structure of a first lead and a printed lead according to the present invention;
FIG. 8 is a schematic view of a solder filled trench structure according to the present invention;
FIG. 9 is a schematic diagram of a first lead structure according to the present invention;
FIG. 10 is a schematic view of a metal wire structure according to the present invention;
in the figure: 1. a power conversion module PCB board; 2. a QFN package; 3. a package base; 4. a chip holder; 5. a chip; 6. molding the body; 7. a first pin; 8. a second pin; 9. a metal wire; 10. soldering tin; 11. printing pins; 12. inserting sections; 13. an exposed section; 14. filling the groove with soldering tin; 15. etching the layer; 16. placing the first groove; 17. placing a second groove; 18. the T-shaped limit is connected with the support arm; 19. the first connecting clamping groove; 20. the second connecting clamping groove; 21. a first connection pad; 22. a second connection contact; 23. and (4) connecting the sections.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments; all other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In a first embodiment, as shown in fig. 1 to 10, a QFN packaging method of a power conversion module according to the present invention includes a power conversion module PCB 1 and a plurality of QFN packages 2, where the QFN packages 2 are connected to a top end of the power conversion module PCB 1, each QFN package 2 includes a packaging base 3, a die pad 4, a chip 5, and a plastic package 6, the die pad 4 is connected to a top end of the packaging base 3, the chip 5 is connected to a top end of the die pad 4, the plastic package 6 is connected to top ends of the packaging base 3 and the chip 5, a plurality of first pins 7 penetrating the packaging base 3 are disposed on a side edge of the top end of the packaging base 3, a plurality of second pins 8 matching with the first pins 7 are disposed on a side edge of the top end of the chip 5, and the first pins 7 are connected to the second pins 8 through metal wires 9.
In the second embodiment, as shown in fig. 1 to 10, a QFN package 2 is connected to a top end of a power conversion module PCB 1 through a solder 10, the top end of the power conversion module PCB 1 is provided with a plurality of printed pins 11 matching with the first pins 7, the first pins 7 are composed of an insertion section 12 and an exposed section 13, the insertion section 12 is fixedly connected to a top end of the exposed section 13, the insertion section 12 is inserted into the package base 3, the exposed section 13 is located at a bottom end of a side of the package base 3, a solder filling groove 14 is formed at a bottom end of the exposed section 13, the solder filling groove 14 is an arc-shaped structure, an etching layer 15 is disposed at a bottom surface of the solder filling groove 14, the etching layer 15 is an irregular etched surface structure, a first placing groove 16 matching with the die pad 4 is formed at a top end of the package base 3, a second placing groove 17 matched with the chip 5 is formed in the top end of the chip holder 4, T-shaped limiting connecting support arms 18 matched with the plastic package body 6 are fixedly arranged at four corners of the top end of the package base 3, a first connecting clamping groove 19 matched with the metal wire 9 is formed in the top end of the first pin 7, a second connecting clamping groove 20 matched with the metal wire 9 is formed in the top end of the second pin 8, the metal wire 9 consists of a first connecting contact piece 21, a second connecting contact piece 22 and a connecting section 23, the first connecting contact piece 21 is fixedly connected to the bottom end of the connecting section 23 and matched with the first connecting clamping groove 19, the second connecting contact piece 22 is fixedly connected to the top end of the connecting section 23 and matched with the second connecting clamping groove 20, and the first connecting contact piece 21, the second connecting contact piece 22 and the connecting section 23 are made of copper materials;
the metal wire 9 with the strip structure can improve the heat conduction efficiency, meanwhile, the contact area between the metal wire 9 and the first pin 7 and the contact area between the metal wire 9 and the second pin 8 can be improved, when soldering tin is connected, the stability of connection between the metal wire 9 and the first pin 7 and the stability of connection between the metal wire 9 and the second pin 8 are guaranteed, the unstable connection condition is avoided, the heat generated during the working of the chip 5 is transferred to the second pin 8 and then transferred to the first pin 7 through the second pin 8, and finally transferred to the power conversion module PCB board 1 through the first pin 7, so that the heat is quickly transferred, the heat dissipation effect is effectively improved, the encapsulation base 3 is subjected to T-shaped limiting connection support arm 18 when the chip 5 is integrally encapsulated, the connection strength between the encapsulation base 3 and the encapsulation body 6 can be improved, the limitation on the encapsulation body 6 is realized, the phenomenon that the encapsulation body 6 is separated from the encapsulation base 3 or loosened in the later-use process is avoided, when the QFN encapsulation body 2 is connected with the power conversion module PCB board 1, the soldering tin 10 is filled with the soldering tin filling groove 14, the connection strength and the stability can be guaranteed, and the irregular short circuit of the soldering tin surface 15 can be prevented from being etched, and the first pin 7 can not being broken away from being etched.
In a third embodiment, as shown in fig. 1 to 10, a QFN packaging method for a power conversion module includes the following steps:
step one, forming a soldering tin filling groove 14 at the bottom end of a first pin 7, and etching the bottom end of the soldering tin filling groove 14 to form an etching layer 15 with an irregular etching surface structure;
step two, a first placing groove 16 is formed in the middle of the top end of the packaging base 3, a plurality of through holes are formed in the side edge of the top of the packaging base 3, the inner diameters of the through holes are the same as the outer diameters of the first pins 7, and the first pins 7 are inserted into the through holes;
step three, fixedly mounting T-shaped limiting connecting support arms 18 at four corners of the top end of the packaging base 3, wherein the T-shaped limiting connecting support arms 18 are made of aluminum alloy materials;
fourthly, a second placing groove 17 is formed in the top end of the chip seat 4, the chip seat 4 is connected to the inside of the first placing groove 16, and the chip 5 is placed in the second placing groove 17, so that the second pins 8 on the chip 5 are located at the top end;
step five, clamping and fixing a plurality of metal leads 9 through an auxiliary clamping plate, enabling the metal leads 9 to be arranged at equal intervals, enabling the width between the metal leads 9 to be the same as the width between the first pins 7 and the second pins 8, enabling the first connecting contact piece 21 to be attached to the first pins 7 and to be located inside the first connecting clamping groove 19, and enabling the second connecting contact piece 22 to be attached to the second pins 8 and to be located inside the second connecting clamping groove 20;
sixthly, the metal lead 9 is respectively connected with the first pin 7 and the second pin 8 in a soldering manner, and the auxiliary clamping plate is taken down after the connection and fixation;
seventhly, mounting and fixing a packaging mold sleeve at the top end of the packaging base 3, and pouring a hot-melted plastic package body 6 in the packaging mold sleeve to realize integral packaging of the chip base 4 and the chip 5;
and step eight, connecting the QFN package 2 with the printed pins 11 on the power conversion module PCB 1 through soldering tin 10, so that the soldering tin 10 is filled in the soldering tin filling grooves 14.
In a fourth embodiment, as shown in fig. 1 to 10, when the first lead 7 is mounted, the flared end of the solder filling groove 14 is located at the outer side of the package base 3 and exposed, and adhesive connection structures are respectively formed between the first lead 7 and the through hole, between the chip holder 4 and the second placement groove 17, and between the chip 5 and the second placement groove 17.
In operation, the power conversion module with the QFN packaging structure can improve the internal heat conduction effect, so that heat on a chip can be dissipated quickly, the connection stability between internal pins and the stability of connection between a QFN packaging body and a PCB (printed circuit board) of the power conversion module can be improved, and the phenomenon of tin climbing can be avoided, thereby avoiding the condition of short circuit.
Claims (10)
1. A power conversion module comprises a power conversion module PCB (1) and a plurality of QFN packaging bodies (2), and is characterized in that: the QFN packaging body (2) is connected to the top end of a power conversion module PCB (1), the QFN packaging body (2) is composed of a packaging base (3), a chip seat (4), a chip (5) and a plastic package body (6), the chip seat (4) is connected to the top end of the packaging base (3), the chip (5) is connected to the top end of the chip seat (4), the plastic package body (6) is connected to the top ends of the packaging base (3) and the chip (5), a plurality of first pins (7) penetrating into the packaging base (3) are arranged on the side edge of the top end of the packaging base (3), a plurality of second pins (8) matched with the first pins (7) are arranged on the side edge of the top end of the chip (5), and the first pins (7) and the second pins (8) are connected through metal wires (9).
2. The power conversion module of claim 1, wherein: the QFN packaging body (2) is connected to the top end of the power conversion module PCB (1) through soldering tin (10), and a plurality of printing pins (11) matched with the first pins (7) are arranged on the top end of the power conversion module PCB (1).
3. The power conversion module of claim 1, wherein: the first pin (7) is composed of an inserting section (12) and an exposed section (13), the inserting section (12) is fixedly connected to the top end of the exposed section (13), the inserting section (12) is inserted into the packaging base (3), and the exposed section (13) is located at the bottom end of the side edge of the packaging base (3).
4. The power conversion module of claim 3, wherein: the bottom end of the exposed section (13) is provided with a soldering tin filling groove (14), the soldering tin filling groove (14) is of an arc-shaped structure, an etching layer (15) is arranged on the bottom surface of the soldering tin filling groove (14), and the etching layer (15) is of an irregular etching surface structure.
5. The power conversion module of claim 1, wherein: the chip packaging structure is characterized in that a first placing groove (16) matched with the chip base (4) is formed in the top end of the packaging base (3), a second placing groove (17) matched with the chip (5) is formed in the top end of the chip base (4), and T-shaped limiting connecting support arms (18) matched with the plastic packaging body (6) are fixedly arranged at four corners of the top end of the packaging base (3).
6. The power conversion module of claim 1, wherein: the top end of the first pin (7) is provided with a first connecting clamping groove (19) matched with the metal wire (9), and the top end of the second pin (8) is provided with a second connecting clamping groove (20) matched with the metal wire (9).
7. The power conversion module of claim 6, wherein: the metal wire (9) comprises a first connecting piece (21), a second connecting piece (22) and a connecting section (23), the first connecting piece (21) is fixedly connected to the bottom end of the connecting section (23) and is matched with a first connecting clamping groove (19), the second connecting piece (22) is fixedly connected to the top end of the connecting section (23) and is matched with a second connecting clamping groove (20), and the first connecting piece (21), the second connecting piece (22) and the connecting section (23) are made of copper materials.
8. The power conversion module of claim 1, wherein: the QFN packaging method of the power conversion module comprises the following steps:
step one, forming a soldering tin filling groove (14) at the bottom end of a first pin (7), and etching the bottom end of the soldering tin filling groove (14) to form an etching layer (15) with an irregular etching surface structure;
step two, a first placing groove (16) is formed in the middle of the top end of the packaging base (3), a plurality of through holes are formed in the side edge of the top of the packaging base (3), the inner diameter of each through hole is identical to the outer diameter of each first pin (7), and the first pins (7) are inserted into the through holes;
step three, fixedly mounting T-shaped limiting connecting support arms (18) at four corners of the top end of the packaging base (3), wherein the T-shaped limiting connecting support arms (18) are made of aluminum alloy materials;
fourthly, a second placing groove (17) is formed in the top end of the chip seat (4), the chip seat (4) is connected to the inside of the first placing groove (16), and the chip (5) is placed in the second placing groove (17), so that a second pin (8) on the chip (5) is located at the top end;
fifthly, clamping and fixing a plurality of metal wires (9) through an auxiliary clamping plate, enabling the metal wires (9) to be arranged at equal intervals, enabling the width between the metal wires (9) to be the same as the width between the first pins (7) and the second pins (8), enabling the first connecting contact piece (21) to be attached to the first pins (7) and located inside the first connecting clamping groove (19), and enabling the second connecting contact piece (22) to be attached to the second pins (8) and located inside the second connecting clamping groove (20);
sixthly, the metal lead (9) is respectively connected with the first pin (7) and the second pin (8) in a soldering manner, and the auxiliary clamping plate is taken down after the connection and fixation;
seventhly, mounting and fixing a packaging mold sleeve at the top end of the packaging base (3), and pouring a hot-melted plastic package body (6) in the packaging mold sleeve to realize integral packaging of the chip base (4) and the chip (5);
and step eight, connecting the QFN package body (2) with a printed pin (11) on the power conversion module PCB (1) through soldering tin (10), and filling the soldering tin (10) in a soldering tin filling groove (14).
9. The QFN packaging method of a power conversion module according to claim 8, wherein: in the second step, when the first pin (7) is installed, the flared end of the solder filling groove (14) is kept at the outer side edge of the packaging base (3) and is exposed.
10. The QFN packaging method of a power conversion module according to claim 8, wherein: in the second step and the fourth step, glue connection structures are arranged between the first pins (7) and the through holes, between the chip holders (4) and the second placing grooves (17) and between the chips (5) and the second placing grooves (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211277592.2A CN115696777A (en) | 2022-10-19 | 2022-10-19 | QFN packaging method of power conversion module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211277592.2A CN115696777A (en) | 2022-10-19 | 2022-10-19 | QFN packaging method of power conversion module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115696777A true CN115696777A (en) | 2023-02-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211277592.2A Pending CN115696777A (en) | 2022-10-19 | 2022-10-19 | QFN packaging method of power conversion module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115696777A (en) |
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2022
- 2022-10-19 CN CN202211277592.2A patent/CN115696777A/en active Pending
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