CN115667352A - 环氧树脂组合物及其固化物 - Google Patents

环氧树脂组合物及其固化物 Download PDF

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Publication number
CN115667352A
CN115667352A CN202180039564.4A CN202180039564A CN115667352A CN 115667352 A CN115667352 A CN 115667352A CN 202180039564 A CN202180039564 A CN 202180039564A CN 115667352 A CN115667352 A CN 115667352A
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CN
China
Prior art keywords
epoxy resin
resin composition
group
parts
phenol
Prior art date
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Pending
Application number
CN202180039564.4A
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English (en)
Chinese (zh)
Inventor
宗正浩
石原一男
柳起焕
林清来
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Kukdo Chemical Co Ltd
Original Assignee
Nippon Steel and Sumikin Chemical Co Ltd
Kukdo Chemical Co Ltd
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Filing date
Publication date
Application filed by Nippon Steel and Sumikin Chemical Co Ltd, Kukdo Chemical Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Publication of CN115667352A publication Critical patent/CN115667352A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
CN202180039564.4A 2020-06-04 2021-05-28 环氧树脂组合物及其固化物 Pending CN115667352A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020097542 2020-06-04
JP2020-097542 2020-06-04
PCT/JP2021/020524 WO2021246339A1 (ja) 2020-06-04 2021-05-28 エポキシ樹脂組成物及びその硬化物

Publications (1)

Publication Number Publication Date
CN115667352A true CN115667352A (zh) 2023-01-31

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CN202180039564.4A Pending CN115667352A (zh) 2020-06-04 2021-05-28 环氧树脂组合物及其固化物

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US (1) US20230227601A1 (https=)
JP (1) JP7773464B2 (https=)
KR (1) KR102847516B1 (https=)
CN (1) CN115667352A (https=)
WO (1) WO2021246339A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118325286A (zh) * 2024-04-25 2024-07-12 咸阳新伟华绝缘材料有限公司 一种防潮改性环氧树脂、复合材料及其制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021251289A1 (https=) * 2020-06-11 2021-12-16
KR102904232B1 (ko) * 2025-04-23 2025-12-29 대성이앤씨 주식회사 표면마모에 의한 변색을 방지하는 폴리머몰탈 바닥재 조성물 및 이를 이용한 바닥재 시공 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61123618A (ja) * 1984-11-20 1986-06-11 Sanyo Kokusaku Pulp Co Ltd 新規エポキシ樹脂およびその製造法
JPH05339341A (ja) * 1992-06-11 1993-12-21 Toto Kasei Kk エポキシ樹脂組成物
CN103724596A (zh) * 2012-10-11 2014-04-16 新日铁住金化学株式会社 环氧树脂组合物和固化物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH072830B2 (ja) * 1986-10-16 1995-01-18 日本石油化学株式会社 フエノ−ル樹脂の製造法
JP3482566B2 (ja) * 1993-12-08 2003-12-22 東都化成株式会社 新規な共縮合樹脂、該共縮合樹脂をエポキシ化したエポキシ樹脂及び該エポキシ樹脂組成物
JP3986025B2 (ja) * 1994-11-15 2007-10-03 大日本インキ化学工業株式会社 エポキシ樹脂組成物及び半導体封止材料
JP3820834B2 (ja) 2000-02-28 2006-09-13 大日本インキ化学工業株式会社 格子状通電端子配設半導体装置に用いられる回路基板用樹脂組成物、格子状通電端子配設半導体装置用回路基板及び格子状通電端子配設半導体装置
US20040242834A1 (en) * 2001-09-28 2004-12-02 Ryuichi Ueno Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition
JP5255810B2 (ja) 2007-10-12 2013-08-07 Ｊｆｅケミカル株式会社 ジシクロペンタジエン類変性フェノール樹脂の製造方法
JP6406847B2 (ja) 2014-03-26 2018-10-17 新日鉄住金化学株式会社 変性多価ヒドロキシ樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP7132784B2 (ja) * 2018-07-26 2022-09-07 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物、プリプレグ、積層板およびプリント配線板
US11884773B2 (en) * 2018-12-19 2024-01-30 Nippon Steel Chemical & Material Co., Ltd. Phenolic resin, epoxy resin, epoxy resin composition and cured product of same
JPWO2021251289A1 (https=) * 2020-06-11 2021-12-16

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61123618A (ja) * 1984-11-20 1986-06-11 Sanyo Kokusaku Pulp Co Ltd 新規エポキシ樹脂およびその製造法
JPH05339341A (ja) * 1992-06-11 1993-12-21 Toto Kasei Kk エポキシ樹脂組成物
CN103724596A (zh) * 2012-10-11 2014-04-16 新日铁住金化学株式会社 环氧树脂组合物和固化物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118325286A (zh) * 2024-04-25 2024-07-12 咸阳新伟华绝缘材料有限公司 一种防潮改性环氧树脂、复合材料及其制备方法

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Publication number Publication date
WO2021246339A1 (ja) 2021-12-09
JP7773464B2 (ja) 2025-11-19
US20230227601A1 (en) 2023-07-20
TW202208483A (zh) 2022-03-01
KR102847516B1 (ko) 2025-08-20
JPWO2021246339A1 (https=) 2021-12-09
KR20230013056A (ko) 2023-01-26

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