JP7773464B2 - エポキシ樹脂組成物及びその硬化物 - Google Patents

エポキシ樹脂組成物及びその硬化物

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Publication number
JP7773464B2
JP7773464B2 JP2022528808A JP2022528808A JP7773464B2 JP 7773464 B2 JP7773464 B2 JP 7773464B2 JP 2022528808 A JP2022528808 A JP 2022528808A JP 2022528808 A JP2022528808 A JP 2022528808A JP 7773464 B2 JP7773464 B2 JP 7773464B2
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Japan
Prior art keywords
epoxy resin
resins
parts
group
resin composition
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JP2022528808A
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English (en)
Japanese (ja)
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JPWO2021246339A1 (https=
Inventor
正浩 宗
一男 石原
起煥 柳
▲清▼來 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kukdo Chemical Co Ltd
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Kukdo Chemical Co Ltd
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Publication of JPWO2021246339A1 publication Critical patent/JPWO2021246339A1/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
JP2022528808A 2020-06-04 2021-05-28 エポキシ樹脂組成物及びその硬化物 Active JP7773464B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020097542 2020-06-04
JP2020097542 2020-06-04
PCT/JP2021/020524 WO2021246339A1 (ja) 2020-06-04 2021-05-28 エポキシ樹脂組成物及びその硬化物

Publications (2)

Publication Number Publication Date
JPWO2021246339A1 JPWO2021246339A1 (https=) 2021-12-09
JP7773464B2 true JP7773464B2 (ja) 2025-11-19

Family

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JP2022528808A Active JP7773464B2 (ja) 2020-06-04 2021-05-28 エポキシ樹脂組成物及びその硬化物

Country Status (5)

Country Link
US (1) US20230227601A1 (https=)
JP (1) JP7773464B2 (https=)
KR (1) KR102847516B1 (https=)
CN (1) CN115667352A (https=)
WO (1) WO2021246339A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021251289A1 (https=) * 2020-06-11 2021-12-16
CN118325286B (zh) * 2024-04-25 2025-04-25 咸阳新伟华绝缘材料有限公司 一种防潮改性环氧树脂、复合材料及其制备方法
KR102904232B1 (ko) * 2025-04-23 2025-12-29 대성이앤씨 주식회사 표면마모에 의한 변색을 방지하는 폴리머몰탈 바닥재 조성물 및 이를 이용한 바닥재 시공 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024063017A (ja) 2018-12-19 2024-05-10 日鉄ケミカル＆マテリアル株式会社 フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物およびその硬化物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61123618A (ja) * 1984-11-20 1986-06-11 Sanyo Kokusaku Pulp Co Ltd 新規エポキシ樹脂およびその製造法
JPH072830B2 (ja) * 1986-10-16 1995-01-18 日本石油化学株式会社 フエノ−ル樹脂の製造法
JP2769590B2 (ja) * 1992-06-11 1998-06-25 東都化成株式会社 エポキシ樹脂組成物
JP3482566B2 (ja) * 1993-12-08 2003-12-22 東都化成株式会社 新規な共縮合樹脂、該共縮合樹脂をエポキシ化したエポキシ樹脂及び該エポキシ樹脂組成物
JP3986025B2 (ja) * 1994-11-15 2007-10-03 大日本インキ化学工業株式会社 エポキシ樹脂組成物及び半導体封止材料
JP3820834B2 (ja) 2000-02-28 2006-09-13 大日本インキ化学工業株式会社 格子状通電端子配設半導体装置に用いられる回路基板用樹脂組成物、格子状通電端子配設半導体装置用回路基板及び格子状通電端子配設半導体装置
US20040242834A1 (en) * 2001-09-28 2004-12-02 Ryuichi Ueno Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition
JP5255810B2 (ja) 2007-10-12 2013-08-07 Ｊｆｅケミカル株式会社 ジシクロペンタジエン類変性フェノール樹脂の製造方法
TWI631173B (zh) * 2012-10-11 2018-08-01 新日鐵住金化學股份有限公司 Epoxy resin composition and hardened material
JP6406847B2 (ja) 2014-03-26 2018-10-17 新日鉄住金化学株式会社 変性多価ヒドロキシ樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP7132784B2 (ja) * 2018-07-26 2022-09-07 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物、プリプレグ、積層板およびプリント配線板
JPWO2021251289A1 (https=) * 2020-06-11 2021-12-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024063017A (ja) 2018-12-19 2024-05-10 日鉄ケミカル＆マテリアル株式会社 フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物およびその硬化物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
小椋 一郎，エポキシ樹脂の化学構造と特性の関係，DIC Technical Review，日本，2001年，No.7，1-12，https://www.dic-global.com/pdf/r_and_d/review/dic_r_and_d_2001.pdf

Also Published As

Publication number Publication date
WO2021246339A1 (ja) 2021-12-09
US20230227601A1 (en) 2023-07-20
TW202208483A (zh) 2022-03-01
KR102847516B1 (ko) 2025-08-20
CN115667352A (zh) 2023-01-31
JPWO2021246339A1 (https=) 2021-12-09
KR20230013056A (ko) 2023-01-26

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