CN115666111B - Heat radiation structure and wireless endoscope with same - Google Patents
Heat radiation structure and wireless endoscope with same Download PDFInfo
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- CN115666111B CN115666111B CN202211653090.5A CN202211653090A CN115666111B CN 115666111 B CN115666111 B CN 115666111B CN 202211653090 A CN202211653090 A CN 202211653090A CN 115666111 B CN115666111 B CN 115666111B
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Abstract
The invention is suitable for the technical field of endoscopes, and particularly relates to a heat dissipation structure and a wireless endoscope with the same, wherein the heat dissipation structure is used for heat dissipation of the wireless endoscope, and comprises the following components: a heat conduction part, a heat transfer part and a heat exchange part; the heat transfer part is attached along the inner wall surface of the shell of the wireless endoscope, the heat transfer part and the shell form an integrated structure, and the heat transfer part is opposite to the back surface of the chip set packaged in the shell; the heat conducting part is arranged between the heat transfer part and the chip set, is in contact with the back surface of the chip set and is used for guiding heat generated by the operation of the chip set to the heat transfer part. In the use process of the wireless endoscope, the problem that the traditional plastic shell can not transfer the heat of the chip set is solved by the way that the heat transfer part and the shell are integrally formed; because the heat transfer part is arranged on the inner wall of the shell, the risk that water drops and dust enter the equipment is avoided.
Description
Technical Field
The invention belongs to the technical field of endoscopes, and particularly relates to a heat dissipation structure and a wireless endoscope with the same.
Background
Minimally invasive surgery is a common solution for surgical procedures. The endoscope system is a necessary surgical instrument for minimally invasive surgery, and small and portable wireless endoscope equipment plays an increasingly important role in surgical operation along with the gradual improvement of the existing 5G transmission technology.
The portable and small characteristics of the endoscope equipment are focused on the current situation that the structures among all modules of the wireless endoscope are compact. The heat dissipation problem of each internal chipset has been one of the focus issues that are being paid much attention by developers. At present, heat dissipation is limited by the following points: the plastic shell is not heat-conducting; the internal structure is compact, and the space is cramped, and conventional radiator is difficult to install.
Disclosure of Invention
The embodiment of the invention aims to provide a heat dissipation structure to solve the problem that heat generated by a chip is difficult to dissipate due to the fact that the internal space of an existing wireless endoscope is narrow. It should be noted that, the present invention takes the heat dissipation adjustment of the wireless endoscope as an example, and the heat dissipation structure described in the present invention is also applicable to virtually all endoscope heat dissipation technologies.
The embodiment of the present invention is implemented as follows, in which a heat dissipation structure is used for heat dissipation of a wireless endoscope, and the heat dissipation structure includes: a heat conduction part, a heat transfer part and a heat exchange part;
the heat transfer part is attached along the inner wall surface of the shell of the wireless endoscope, the heat transfer part and the shell form an integrated structure, and the heat transfer part is opposite to the back surface of the chip set packaged in the shell;
the heat conducting part is arranged between the heat transfer part and the chip set, is in contact with the back surface of the chip set and is used for guiding heat generated by the operation of the chip set to the heat transfer part;
the heat exchange part is arranged on the outer wall of one side, attached to the shell and the heat transfer part, of the outer wall, and the heat exchange part can exchange heat transferred by the heat transfer part to an external refrigerant.
It is another object of an embodiment of the present invention to provide a wireless endoscope, which includes a housing, a heat dissipation structure as described above, and an endoscope head and a driving main board enclosed in the housing; the drive mainboard is provided with a chip set, and the heat dissipation structure is used for heat dissipation of the chip set.
According to the heat dissipation structure provided by the embodiment of the invention, the heat transfer part can be made of the aluminum alloy radiating fins, and the problem that the plastic shell cannot transfer the heat of the chip set is solved in the using process of the wireless endoscope in a mode that the aluminum alloy radiating fins and the shell are integrally formed; because the aluminum alloy radiating fins are arranged on the inner wall of the shell, the risk that water drops and dust enter the equipment is avoided; the aluminum alloy radiating fins and the shell are integrally formed, and a radiator does not need to be additionally and independently installed.
Drawings
FIG. 1 is a sectional view of a wireless endoscope provided by embodiments of the present invention;
FIG. 2 is a front view of a wireless endoscope provided by embodiments of the present invention;
FIG. 3 is a top view of a wireless endoscope provided by embodiments of the present invention;
FIG. 4 is a rear elevation view of a wireless endoscope provided by embodiments of the present invention;
FIG. 5 is a side view of a wireless endoscope provided by embodiments of the present invention;
FIG. 6 is a perspective view of a wireless endoscope according to an embodiment of the present invention;
fig. 7 is a partially enlarged view of an aluminum alloy heat sink of the wireless endoscope in the embodiment of the present invention.
In the drawings: 100-driving a main board; 101-a chipset; 110-aluminum alloy heat sink fins; 111-a transition lobe; 112-a heat transfer portion; 113-a connecting portion; 114-a seal; 120-a thermally conductive portion; 200-an integrally formed structure; 210-an upper shell; 211-heat dissipating fins; 212-a vent; 220-lower shell.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
Specific implementations of the present invention are described in detail below with reference to specific embodiments.
As shown in fig. 1, it is a schematic sectional view of a wireless endoscope that can embody a heat dissipation mechanism; the heat radiation structure is used for the heat dissipation of wireless endoscope, the heat radiation structure includes: a heat conduction portion 120, a heat transfer portion 112, and a heat exchange portion;
the heat transfer portion 112 is attached along the inner wall surface of the housing of the wireless endoscope, the heat transfer portion 112 and the housing form an integrated structure 200, and the heat transfer portion 112 is opposite to the back surface of the chip set 101 packaged in the housing, as shown in fig. 7;
the heat conduction portion 120 is disposed between the heat transfer portion 112 and the chip set 101, and contacts with a back surface of the chip set 101, for guiding heat generated by operation of the chip set 101 to the heat transfer portion 112;
the heat exchange portion is disposed on an outer wall of the housing attached to the heat transfer portion 112, and the heat exchange portion can exchange heat transferred by the heat transfer portion 112 to an external refrigerant.
In this embodiment, the heat transfer portion 112 can be made of an aluminum alloy heat sink 110, and in the use process of the wireless endoscope, the problem that the plastic housing cannot transfer heat of the chip set 101 is solved by integrally forming the aluminum alloy heat sink 110 and the housing; because the aluminum alloy radiating fins 110 are arranged on the inner wall of the shell, the risk that water drops and dust enter the equipment is eliminated; the aluminum alloy heat sink 110 is integrally formed with the housing without an additional separate heat sink.
In an example of the present embodiment, the heat transfer portion 112 is attached along an inner wall surface of a housing of the wireless endoscope, and the heat transfer portion 112 does not completely cover the inner wall of the housing, and may be only directed to one inner wall surface opposite to the chip set 101; this way of attaching the arrangement can be achieved by: the heat transfer part 112, specifically the aluminum alloy heat sink 110, is processed according to the contour shape of the housing, the shape of the aluminum alloy heat sink 110 is fitted to the curved surface of the inner wall of the housing, and the aluminum alloy heat sink 110 is embedded in the inner wall of the housing in the form of a metal insert block in the process of injection molding of the housing to form a whole with the housing. The outer shell can be an ABS (Acrylonitrile Butadiene Styrene) outer shell, which is a thermoplastic high polymer structure material with high strength, good toughness and easy processing and forming, also called ABS resin; the vent 212 may also be formed in the process; namely, the ABS shell is provided with discontinuous vent holes 212 (see figure 2), and the vent holes 212 have the decoration effect on the appearance of the product, so that the use comfort is improved;
the chip set 101 may be formed by one or more chips, the heat generated by the chip is directly or directly conducted to the heat transfer portion 112, i.e. the aluminum alloy heat sink 110, and is contacted with an external coolant via the ventilation holes 212 on the ABS housing to realize heat exchange, the external coolant may be air in an external space, where the external refers to a peripheral or peripheral space on one side of the housing opposite to the chip set 101; thereby dissipating heat into the outside air. In terms of the product assembly steps, the step of installing a heat dissipation structure is omitted, the operation difficulty of assembly is greatly reduced, and in terms of heat dissipation effect, the heat dissipation efficiency of the chip set 101 can be remarkably improved by a large-area attaching mode and the cooperation of the aluminum alloy heat dissipation fins 110 with high heat conductivity coefficients.
In an example of the present embodiment, the discontinuous ventilation holes 212 are formed in the outer shell, so that when part of the ventilation holes 212 are blocked, the remaining unblocked ventilation holes 212 can dissipate heat, thereby ensuring stability and reliability of heat dissipation.
As shown in fig. 1 and 7, in an example of the present embodiment, when the housing of the wireless endoscope is composed of a cylinder and an outer cover, an outer wall attached to the heat transfer portion 112 is disposed on one side of the cylinder, which is opposite to the back surface of the chip set 101, so as to facilitate heat dissipation of the chip set 101; the heat transfer part 112 is an aluminum alloy heat sink 110, and the aluminum alloy heat sink 110 is embedded in the inner wall of the barrel in the form of a metal insert during the injection molding of the barrel, so as to form an integral body with the barrel.
As shown in fig. 6, in one example of the present embodiment, when the housing of the wireless endoscope is composed of an upper case 210 and a lower case 220 which are butted; the outer wall attached to the heat transfer portion 112 is located on the upper case 210, and the side of the outer wall is opposite to the back surface of the chip set 101, so that heat dissipation of the chip set 101 is facilitated; the aluminum alloy heat sink 110 is embedded in the inner wall of the upper case 210 in the form of a metal insert during the process of injection molding the upper case 210, and is formed integrally with the upper case 210. In terms of the step of assembling the product, the step of additionally installing a heat dissipation structure is omitted, and the operation difficulty of the integral assembly of the wireless endoscope is greatly reduced.
In one embodiment, as shown in fig. 1, the thermal conductor 120 includes a thermal conductor disposed on the back of the chipset 101.
Specifically, as shown in fig. 7, in an example of the present embodiment, the heat conducting member may be silicone grease, a copper sheet, a silver sheet, or a graphene heat conducting film, and the graphene heat conducting film is preferred in the present embodiment.
In one example of the present embodiment, the heat conducting portion 120 further includes a transition protrusion 111, and the transition protrusion 111 is disposed between the heat transferring portion 112 and the heat conducting member for supporting the housing and conducting heat.
In this example, on the one hand, the transition protrusion 111 may serve as a reinforcing rib to improve the structural strength of the housing, and on the other hand, the transition protrusion 111 may transfer the heat transferred by the heat conducting member to the aluminum alloy heat sink 110 more quickly.
In one example of the embodiment, the heat transfer portion 112 is an arc patch attached to the inner wall of the housing, and the arc patch and the transition protrusion 111 are made of aluminum alloy; this arc paster of making by aluminum alloy, it is that aluminum alloy fin 110 is as the main part of heat transfer portion 112, and the heat dissipation face is wide, and the heat dissipation is more even, also can avoid local heat dissipation inequality to lead to the risk of appearing burning.
As shown in fig. 2 to 5, in one embodiment, the heat exchange portion includes heat dissipation fins 211 and ventilation holes 212, the heat dissipation fins 211 are disposed on an outer wall of the housing on a side where the heat transfer portion 112 is attached, the ventilation holes 212 are opened on the outer wall of the housing, and the ventilation holes 212 communicate with the heat transfer portion 112.
In this embodiment, the shell is provided with discontinuous ventilation holes 212, the ventilation holes 212 have a product appearance decoration effect, heat generated by the chipset 101 is conducted into the aluminum alloy cooling fins 110 through the graphene heat-conducting film, and the heat is dissipated into the external air by the contact between the ventilation holes 212 on the shell and the external air.
In one embodiment, a seal is provided around the port of the heat transfer portion 112, and the seal is used to seal the housing.
In this embodiment, a gap is left at the port of the heat transfer portion 112, a sealing member is provided in the gap to form a sealing portion 114, and the sealing portion 114 seals the connection portion of the housing; and the seal can be removed and replaced in order to maintain good sealing properties against the housing;
in an example of this embodiment, the sealing element is one of a sealing paste, a sealing ring, and a sealant; the sealing paste can be adhesive tape with waterproof performance on the market; the sealing cotton can also be used for playing a role in sound insulation.
In one example of the present embodiment, the heat exchanging portion further includes: a semiconductor refrigeration sheet; the semiconductor refrigeration plate and the driving main board 100 can share one power supply, and can also be connected with an independent power supply; the semiconductor refrigerating sheet is provided with a cold end and a hot end, the cold end faces one side of the chip set 101, and air near the chip set 101 is refrigerated through the cold end; the hot side facing away from the side of chipset 101; the heat of the cold end of the semiconductor cooling plate, which may be disposed in the heat transfer portion 112 or in the upper case 210, is exchanged toward the vent hole 212 through the hot end.
In one example of the present embodiment, the heat exchanging portion further includes: a micro fan; the micro fan is arranged on the side surface of the transition bulge 111, and the air outlet of the micro fan faces the vent hole 212; for auxiliary heat dissipation, the outlet air of the micro fan can be arranged along the heat dissipation direction of the heat transfer part 112; and also serves to form an air curtain-like structure inside the ventilation hole 212 to reduce or prevent water drops, dust, etc. from entering the inside of the housing.
In another embodiment, as shown in fig. 1, in order to facilitate clear and efficient implementation of the above heat dissipation structure, there is provided a wireless endoscope comprising a housing, the heat dissipation structure as described above, and an endoscope head and a driving main board 100 enclosed in the housing; the driving main board 100 is provided with a chip set 101, and the heat dissipation structure is used for heat dissipation of the chip set 101.
In the use process of the wireless endoscope of the embodiment, the problem that the traditional plastic shell cannot transfer heat of the chip set 101 is solved by arranging the aluminum alloy radiating fins 110 of the radiating structure and the shell into an integral forming mode; because the aluminum alloy radiating fins 110 are arranged on the inner wall of the shell, the risk that water drops and dust enter the shell is avoided; the aluminum alloy radiating fins 110 and the shell are integrally formed, and a radiator does not need to be additionally and independently installed; the cost can be reduced, and the assembly efficiency can be improved.
In one embodiment, the chip set 101 is electrically connected with an illumination element that provides illumination for the endoscope head.
In an example of the present embodiment, the illumination element is an OLED lamp, and may also be an led array, a laser lamp, and the like, and the present example is not limited thereto.
In one embodiment, as shown in fig. 6 to 7, the housing includes an upper case 210 and a lower case 220, the upper case 210 and the heat transfer part 112 are integrally formed, a port of the heat transfer part 112 is provided with a connection part 113, and the upper case 210 is coupled to the lower case 220 through the connection part 113.
In an example of the present embodiment, the connection portion 113 may also be provided at a port of the upper case 210; so that the port of the heat transfer portion 112 is recessed in the end surface of the upper case 210; and forms a gap in which the sealing portion 114 can be provided; the present embodiment is not limited thereto.
In one example of this embodiment, the connecting portion 113 includes at least a snap and a bayonet; or the connecting part 113 at least comprises a threaded hole, a screw column and a screw;
in this example, the bayonet is provided at the port of the heat transfer portion 112, and the snap fit with the bayonet is provided at the port of the lower case 220, or the bayonet is provided at the port of the heat transfer portion 112, and the bayonet fit with the snap fit is provided at the port of the lower case 220 at the port of the heat transfer portion 112; alternatively, the screw hole is provided at the port of the heat transfer portion 112, and the port of the lower case 220 is provided with a through hole for allowing a screw to pass therethrough, the screw passing through the through hole being in threaded engagement with the screw hole; or, the screw column is arranged on the inner end surface of the port of the heat transfer part 112, and the screw passes through the through hole and is in threaded connection with the screw column; or, set up the via hole that the screw hole replacement was equipped with at the port of inferior valve 220, the screw passes the screw hole and screw post threaded connection, realizes fixed the encapsulation of shell.
The embodiment of the invention provides a heat dissipation structure, and provides a wireless endoscope based on the heat dissipation structure, and the heat dissipation structure solves the problem that the traditional plastic shell can not transfer the heat of the chip set 101 in a way that the heat transfer part 112 (namely the aluminum alloy heat dissipation sheet 110) of the heat dissipation structure is integrally formed with the shell in the use process of the wireless endoscope; because the aluminum alloy radiating fins 110 are arranged on the inner wall of the shell, the risk that water drops and dust enter the wireless endoscope is avoided; the aluminum alloy radiating fins 110 and the shell are integrally formed, so that a radiator does not need to be additionally and independently installed, and the integral assembly difficulty and the integral cost are reduced.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. A heat dissipation structure for heat dissipation of a wireless endoscope, the heat dissipation structure comprising: a heat conduction part, a heat transfer part and a heat exchange part;
the heat transfer part is attached along the inner wall surface of the shell of the wireless endoscope, the heat transfer part and the shell form an integrated structure, and the heat transfer part is opposite to the back surface of the chip set packaged in the shell;
the heat conducting part is arranged between the heat transfer part and the chip set, is in contact with the back surface of the chip set and is used for guiding heat generated by the operation of the chip set to the heat transfer part;
the heat exchange part is arranged on the outer wall of one side, attached to the heat transfer part, of the shell, and can exchange heat transferred by the heat transfer part to an external refrigerant;
the heat exchange part comprises heat radiating fins and air vents, the heat radiating fins are arranged on the outer wall of one side, attached to the heat transfer part, of the shell, the air vents are formed in the outer wall of the shell and communicated with the heat transfer part, sealing elements are arranged on the inner periphery of ports of the heat transfer part, and the shell is sealed through the sealing elements;
the heat exchange portion further includes: a semiconductor refrigeration sheet; the semiconductor refrigerating sheet is provided with a cold end and a hot end, wherein the cold end faces one side of the chip set and is used for refrigerating air near the chip set through the cold end; the hot end is away from one side of the chipset; and the heat at the cold end of the semiconductor refrigerating sheet is transferred to the direction of the vent hole through the hot end.
2. The heat dissipating structure of claim 1, wherein the heat conducting portion comprises a heat conducting member disposed on a back surface of the chip set.
3. The heat dissipating structure of claim 2, wherein the heat conducting portion further comprises a transition protrusion disposed between the heat transferring portion and the heat conducting member for supporting the housing and conducting heat.
4. The heat dissipation structure of claim 3, wherein the heat transfer portion is an arc patch attached to the inner wall of the housing, and the arc patch and the transition protrusion are made of aluminum alloy; the heat conducting piece is a silicone grease, a copper sheet or a graphene heat conducting film.
5. A wireless endoscope, comprising a housing, a heat dissipating structure according to any of claims 1-4, and an endoscope head and a drive board enclosed within the housing; the drive mainboard is provided with a chip set, and the heat dissipation structure is used for heat dissipation of the chip set.
6. The wireless endoscope of claim 5, wherein an illumination element is electrically connected to the chipset, the illumination element providing illumination to the endoscope head.
7. The wireless endoscope of claim 5 or 6, wherein the housing comprises an upper shell and a lower shell, the upper shell and the heat transfer portion are integrally formed, a port of the heat transfer portion is provided with a connecting portion, and the upper shell is joined to the lower shell through the connecting portion.
8. The wireless endoscope of claim 7, wherein the connecting portion comprises at least a snap and a bayonet; or the connecting part at least comprises a threaded hole, a screw column and a screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211653090.5A CN115666111B (en) | 2022-12-22 | 2022-12-22 | Heat radiation structure and wireless endoscope with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211653090.5A CN115666111B (en) | 2022-12-22 | 2022-12-22 | Heat radiation structure and wireless endoscope with same |
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| Publication Number | Publication Date |
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| CN115666111A CN115666111A (en) | 2023-01-31 |
| CN115666111B true CN115666111B (en) | 2023-02-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211653090.5A Active CN115666111B (en) | 2022-12-22 | 2022-12-22 | Heat radiation structure and wireless endoscope with same |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117320422B (en) * | 2023-11-28 | 2024-07-23 | 合众新能源汽车股份有限公司 | Intelligent cabin domain controller and vehicle |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201081096Y (en) * | 2007-09-06 | 2008-07-02 | 太原浩辰世纪科技发展有限公司 | Portable button type illuminating source |
| JP2010022815A (en) * | 2008-06-18 | 2010-02-04 | Olympus Corp | Endoscope apparatus |
| CN201875615U (en) * | 2010-12-09 | 2011-06-22 | 上海理工大学 | Minitype LED (light-emitting diode) endoscope lighting source |
| JP2014158610A (en) * | 2013-02-20 | 2014-09-04 | Hoya Corp | Light source device for endoscope |
| CN105407790B (en) * | 2013-06-28 | 2018-10-23 | 光立方株式会社 | Endoscope illuminator module |
| CN104043199B (en) * | 2014-07-01 | 2017-02-01 | 王翔宇 | Light source equipment used for treating vagina inflammatory diseases of gynecology |
| CN204991219U (en) * | 2015-09-30 | 2016-01-20 | 深圳市鸿城科技有限公司 | Connection structure of coiled pipe |
| CN209644945U (en) * | 2018-12-28 | 2019-11-19 | 周媛媛 | A kind of ultrasonic endoscope |
| US20210369091A1 (en) * | 2019-12-13 | 2021-12-02 | 3M Endoscopy LLC | Disposable light handle for endoscopy |
| CN111887788B (en) * | 2020-09-29 | 2020-12-15 | 上海安翰医疗技术有限公司 | Impedance detection method for capsule endoscope and capsule endoscope |
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