CN117270653A

CN117270653A - Liquid flow type heat radiator

Info

Publication number: CN117270653A
Application number: CN202210677980.3A
Authority: CN
Inventors: 蔡水发; 吴远; 林韦汝
Original assignee: Cooler Master Co Ltd
Current assignee: Cooler Master Co Ltd
Priority date: 2022-06-15
Filing date: 2022-06-15
Publication date: 2023-12-22
Also published as: TWM634997U

Abstract

A liquid flow type heat dissipating device comprises a base, a sealing cover, a flow guide plate, a heat conducting box, an impeller and a driving assembly. The base comprises a bottom and an annular wall. The annular wall portion is connected to the bottom portion. The bottom is provided with a water inlet flow channel and a water outlet flow channel. The two opposite sides of the sealing cover are respectively provided with an impeller accommodating chamber and a driving component accommodating chamber. The sealing cover is arranged on the base. The sealing cover is provided with a water inlet channel and a water outlet channel. The water outlet channel is communicated with the impeller accommodating chamber. The impeller accommodating chamber is positioned at one side of the guide plate, and the water inlet flow channel and the water outlet flow channel are positioned at the other side of the guide plate. The guide plate is provided with a water inlet communication port and a water outlet communication port. The heat conducting box is arranged on the base and is provided with a heat exchange chamber. The impeller is rotatably positioned in the impeller receiving chamber. The driving assembly is positioned in the driving assembly accommodating chamber.

Description

Liquid flow type heat radiator

Technical Field

The present invention relates to a heat dissipating device, and more particularly, to a liquid flow heat dissipating device.

Background

When the computer is running, heat is generated by a heat source, such as a cpu, in the computer due to the high-speed operation. Therefore, the computer is required to be provided with a cooling device to quickly and effectively remove the heat generated by the heat source and maintain the temperature of the heat source within the design range specified by the manufacturer. Cooling devices are generally classified into air-cooled and liquid-cooled. The air-cooled cooling device is characterized in that a heat source is provided with radiating fins, and a computer is provided with a fan, so that heat generated by the heat source is taken away through air flow generated by the fan. However, since the fan is noisy when it is operated, it is difficult to cool a heat source having a high heat generation amount, such as a processor of a sports computer. Therefore, computers for athletic use currently generally employ liquid cooling. The liquid cooling device is characterized in that a water cooling head and a water cooling row are arranged on a computer, and the water cooling head is in thermal contact with a heat source and is connected with the water cooling row through a flow pipe. The water cooling head is internally provided with a pump, and the driving of the pump can drive the cooling liquid absorbing heat to flow from the water cooling head to the water cooling row, and the cooling liquid flows back to the water cooling head from the water cooling row after the heat dissipation of the water cooling row.

However, the number of the shells of the conventional water cooling head is large, so that the assembly efficiency is poor, and the waterproof design is difficult to complete. For example, if the original design is changed to a water-cooling head applied to a single heat source, the water-cooling head after the change of the structure may be difficult to reinforce, so that the water-cooling head after the change loses the waterproof effect, resulting in leakage of the water-cooling liquid.

Disclosure of Invention

The invention provides a liquid flow type heat dissipating device, which is used for improving the assembly efficiency of a water cooling head and improving the flexibility of the water cooling head for later modification.

The liquid flow type heat dissipating device disclosed by the embodiment of the invention comprises a base, a sealing cover, a flow guide plate, a heat conducting box, an impeller and a driving component. The base comprises a bottom and an annular wall. The annular wall part is connected to the bottom, and the bottom and the annular wall part jointly encircle a storage space. The bottom is provided with a water inlet flow channel and a water outlet flow channel. The two opposite sides of the sealing cover are respectively provided with an impeller accommodating chamber and a driving component accommodating chamber. The sealing cover is arranged on the base. The impeller accommodating chamber is closer to the storage space than the driving component accommodating chamber. The drive assembly accommodating chamber is not communicated with the storage space and the impeller accommodating chamber. The sealing cover is provided with a water inlet channel and a water outlet channel. The water outlet channel is communicated with the impeller accommodating chamber. The guide plate is arranged between the bottom and the sealing cover, the impeller accommodating chamber is arranged on one side of the guide plate, the water inlet flow channel and the water outlet flow channel are arranged on the other side of the guide plate, and the guide plate is provided with a water inlet communication port and a water outlet communication port. The heat conducting box is arranged on one side, far away from the annular wall part, of the bottom of the base, and is provided with a heat exchange cavity. The water inlet channel is communicated with the water inlet flow channel through the water inlet communication port and is communicated with the heat exchange chamber. The impeller accommodating chamber is communicated with the heat exchange chamber through the water outlet communication port and the water outlet flow passage. The impeller is rotatably positioned in the impeller receiving chamber. The driving component is positioned in the driving component accommodating chamber and used for driving the impeller to rotate relative to the sealing cover. Wherein, the bottom and the annular wall part are integrally formed, and the guide plate and at least part of the impellers are positioned in the storage space and are surrounded by the annular wall part.

According to the liquid flow type heat dissipating device of the embodiment, the annular wall part and the bottom part of the base are integrally formed and are bowl-shaped, so that the guide plate and the impeller are placed in the bowl-shaped base, the assembly procedure among the base, the sealing cover and the guide plate can be simplified, and the assembly difficulty of the liquid flow type heat dissipating device is further reduced.

In addition, because the annular wall part and the bottom of the base are of an integrally formed structure and are bowl-shaped, and most of the lower part of the storage space is sealed by the bottom, only a small part of the storage space is provided with a water inlet flow channel and a water outlet flow channel which are communicated with the heat exchange chamber. Therefore, if the original heat conduction box of the liquid flow type heat dissipation device is required to be modified into a heat conduction box with a larger size, the liquid flow type heat dissipation device can be improved in flexibility of future modification because the liquid flow type heat dissipation device is simple and convenient to pair and only needs holes to holes without the problem of combining the whole structure layers faced by the conventional design.

The foregoing description of the invention and the following description of embodiments are provided to illustrate and explain the principles of the invention and to provide further explanation of the invention as claimed.

Drawings

Fig. 1 is a schematic perspective view of a liquid flow type heat dissipating device according to a first embodiment of the present invention;

FIG. 2 is an exploded view of FIG. 1;

FIG. 3 is an exploded view of the other view of FIG. 2;

fig. 4 to 10 are schematic diagrams illustrating the flow of working fluid of the liquid flow type heat dissipating device of fig. 1.

[ symbolic description ]

10: liquid flow type heat radiator

100: base seat

110: bottom part

111: water inlet flow passage

1111: arc-shaped section

1112: straight line segment

112: water outlet flow channel

1121: central portion

1122: extension part

120: annular wall

200: sealing cover

210: water inlet channel

220: water outlet channel

300: deflector plate

310: water inlet communication port

320: water outlet communication port

330: first drainage channel

340: second drainage channel

400: heat conduction box

410: box body

411: heat radiation fin

420: cover body

421: a first opening

422: a second opening

500: impeller wheel

600: driving assembly

710: first sealing member

720: second sealing member

730: third seal member

740: fourth sealing member

800: control circuit board

850: light-emitting element

910: water inlet joint

920: water outlet joint

950: mask cover

S1: storage space

S2: impeller accommodating chamber

S3: drive assembly accommodation chamber

S4: heat exchange chamber

C1, C2: center of the machine

A-N: direction of

Detailed Description

Please refer to fig. 1 to 3. Fig. 1 is a schematic perspective view of a liquid flow heat dissipating device 10 according to a first embodiment of the present invention. Fig. 2 is an exploded view of fig. 1. Fig. 3 is an exploded view of the other view of fig. 2.

The liquid flow heat dissipating device 10 of the present embodiment is, for example, a water-cooled head, and is thermally coupled to at least one heat source (not shown) to remove heat generated by the heat source through the working fluid. The heat source is, for example, a CPU or an image processor. The liquid flow type heat dissipating device 10 comprises a base 100, a cover 200, a baffle 300, a heat conducting box 400, an impeller 500 and a driving assembly 600. The base 100 includes a bottom 110 and an annular wall 120. The annular wall 120 is connected to the bottom 110, and the bottom 110 and the annular wall 120 together define a storage space S1.

The bottom 110 has an inlet channel 111 and an outlet channel 112. The water inlet channel 111 of the bottom 110 includes an arc-shaped section 1111 and a straight section 1112. The arc-shaped section 1111 is centered on the center C1 of the bottom 110. The straight line section 1112 is connected to the middle section of the arc-shaped section 1111 and extends away from the center C1 of the bottom 110, so that the water inlet channel is, for example, Y-shaped. The outlet flow passage 112 of the bottom portion 110 includes a central portion 1121 and an extending portion 1122. The central portion 1121 is, for example, circular and is located at the center C1 of the bottom portion 110. Arcuate segment 1111 surrounds the outside of central portion 1121. The extension 1122 is connected to the central portion 1121 and extends toward the periphery of the bottom 110.

In other embodiments, the straight line segment of the water inlet channel may be changed to a non-straight line segment, as long as the straight line segment extends in a direction away from the center C1 of the bottom 110.

The cover 200 has an impeller housing chamber S2 and a driving assembly housing chamber S3 on opposite sides thereof. The cover 200 is mounted on the base 100. The impeller housing chamber S2 is closer to the storage space S1 than the drive assembly housing chamber S3. The driving component accommodating chamber S3 is not communicated with the storage space S1 and the impeller accommodating chamber S2. The cover 200 has a water inlet channel 210 and a water outlet channel 220. The water outlet passage 220 communicates with the impeller accommodating chamber S2.

The baffle 300 is disposed between the bottom 110 and the cover 200, and the impeller accommodating chamber S2 is located at one side of the baffle 300. And the water inlet channel 111 and the water outlet channel 112 are positioned at the other side of the guide plate 300. The baffle 300 has a water inlet communication port 310 and a water outlet communication port 320. The water outlet communication port 320 of the baffle 300 is closer to the center C2 of the baffle 300 than the water inlet communication port 310. In addition, the water outlet 320 of the baffle 300, the baffle 300 has a first guiding channel 330 and a second guiding channel 340. The shape of the first diversion channel 330 is matched with the shape of the water inlet channel 111 and is communicated with the water inlet communication opening 310 of the diversion plate 300 and the first opening 421 of the cover 420, and the shape of the second diversion channel 340 is matched with the shape of the extension 1122 of the water outlet channel 112 and is communicated with the water outlet communication opening 320 of the diversion plate 300 and the second opening 422 of the cover 420.

The heat conduction box 400 is installed on the side of the bottom 110 of the base 100 far from the annular wall 120, and the heat conduction box 400 has a heat exchange chamber S4. In detail, the heat conduction box 400 includes a box body 410 and a cover body 420. The cover 420 is fixed to the case 410 by welding, pressing, gluing, screwing, or other bonding methods. The case 410 is fixed to the bottom 110 of the base 100 by welding, pressing, gluing, screwing, or the like. The case 410 has a plurality of heat dissipation fins 411 to increase the heat exchange efficiency between the case 410 and the working fluid. The cover 420 has a first opening 421 and a second opening 422. The first opening 421 is, for example, elongated. The second opening 422 is, for example, in a hole shape, and the size of the second opening 422 of the cover 420 is smaller than the size of the first opening 421.

In the present embodiment, opposite ends of the arc-shaped section 1111 of the water inlet channel 111 of the base 100 are communicated with the heat exchange chamber S4 through the first opening 421 of the cover 420. One end of the straight line section 1112 far from the arc section 1111 is communicated with the water inlet communication port 310 of the deflector 300, and the water inlet communication port 310 of the deflector 300 is communicated with the water inlet channel 210 of the cover 200. That is, the water inlet channel 210 is communicated with the heat exchange chamber S4 through the water inlet communication port 310, the arc-shaped section 1111 of the water inlet flow channel 111 and the first opening 421 of the cover 420. The central portion 1121 of the water outlet flow channel 112 of the base 100 communicates with the impeller accommodating chamber S2 through the water outlet communication port 320, and one end of the extension portion 1122 of the water outlet flow channel 112, which is far from the central portion 1121, communicates with the heat exchange chamber S4 through the second opening 422 of the cover 420. That is, the impeller housing chamber S2 is communicated with the heat exchange chamber S4 through the water outlet communication port 320, the water outlet flow passage 112 and the second opening 422.

In this embodiment, the liquid flow heat dissipation device 10 further includes a first sealing member 710, a second sealing member 720, a third sealing member 730, and a fourth sealing member 740. The first sealing member 710 is sandwiched between the base 100 and the baffle 300 to prevent the working fluid flowing from the water inlet communication port 310 of the baffle 300 to the water inlet channel 111 of the bottom plate from leaking out, or to prevent the working fluid flowing from the water outlet channel 112 of the base 100 to the water outlet communication port 320 of the baffle 300 from leaking out. The second sealing member 720 is sandwiched between the baffle 300 and the cover 200 to prevent the working fluid flowing from the water inlet channel 210 of the cover 200 to the water inlet communication port 310 of the baffle 300 from leaking, or to prevent the working fluid flowing from the water outlet communication port 320 of the baffle 300 to the impeller housing chamber S2 of the cover 200 from leaking. The third sealing member 730 is sandwiched between the cover 420 and the bottom 110 of the base 100 and surrounds the first opening 421 to prevent the working fluid flowing from the water inlet channel 111 of the base 100 to the heat exchange chamber S4 from leaking. The fourth sealing member 740 is disposed between the cover 420 and the bottom 110 of the base 100 and surrounds the first opening 421 and the second opening 422 to prevent the working fluid flowing from the water inlet channel 111 of the base 100 to the heat exchange chamber S4 from leaking or the working fluid flowing from the heat exchange chamber S4 to the water outlet channel 112 of the base 100 from leaking.

The impeller 500 is rotatably disposed in the impeller housing chamber S2 to drive the working fluid to flow in from the water inlet channel 210 and flow out from the water outlet channel 220. The driving assembly 600 is located in the driving assembly receiving chamber S3. The driving assembly 600 includes, for example, a stator and a rotor. The stator and the rotor are respectively disposed on the cover 200 and the impeller 500, and the stator and the rotor are used for generating a rotating magnetic field for driving the rotor to rotate, so that the driving assembly 600 drives the impeller 500 to rotate relative to the cover 200.

In the present embodiment, the bottom 110 and the annular wall 120 are integrally formed, for example, by injection molding, and the baffle 300 and at least part of the impeller 500 are located in the storage space S1 and surrounded by the annular wall 120. However, the design that the bottom portion 110 and the annular wall portion 120 are integrally formed is not intended to limit the present invention, and in other embodiments, the bottom portion 110 and the annular wall portion 120 may be formed by two separate components.

In this embodiment, the liquid flow heat sink 10 may further include a control circuit board 800. The control circuit board 800 is fixed on top of the cover 200 and electrically connected to the driving assembly 600 to control the rotation speed of the impeller 500 through the driving assembly 600.

In this embodiment, the liquid flow heat dissipation device 10 may further include a plurality of light emitting elements 850. The light emitting elements 850 are disposed on the control circuit board 800 and are used for illuminating in a direction away from the cover 200.

In this embodiment, the liquid flow heat dissipating device 10 further includes a water inlet connector 910 and a water outlet connector 920. One end of the water inlet connector 910 is disposed in the water inlet channel 210 of the cover, and the other end of the water inlet connector 910 is connected to the flow pipe. One end of the water outlet joint 920 is disposed in the water outlet channel 220 of the cover, and the other end of the water outlet joint 920 is connected to the flow tube.

In this embodiment, the liquid flow heat sink 10 may further comprise a mask 950. The cover 950 is fastened to the annular wall 120 of the base 100, for example, by a snap fit, and covers the cover 200 and the driving assembly 600. The shade 950 has the function of protecting the control circuit board 800 and the driving component 600, and can also be used as a mounting place for decoration and lighting effect.

In the present embodiment, the liquid flow heat dissipation device 10 is provided with a mask 950, but not limited thereto. In other embodiments, the mask 950 may be omitted.

In the present embodiment, the base 100 and the heat conduction box 400 are only in butt joint with the water inlet channel 111 through the first opening 421 and in butt joint with the water outlet channel 112 through the second opening 422, so that the pairing is simple and convenient, and the combination problem of the whole structural layer faced by the conventional design is avoided, so that the flexibility of the liquid flow type heat dissipation device 10 can be increased.

Please refer to fig. 4 to fig. 10. Fig. 4 to 10 are schematic diagrams illustrating the flow of working fluid of the liquid flow heat sink 10 of fig. 1. As shown in fig. 4, when the liquid flow type heat sink 10 is operated, the working fluid flows through the water inlet channel 210 in the direction A, B, C and then passes through the water inlet communication port 310 of the deflector 300 in the direction D. Next, as shown in fig. 5, the working fluid passing through the water inlet communication port 310 of the deflector 300 is guided by the first guiding channel 330 and the water inlet channel 111, and flows through the straight line section 1112 and the arc section 1111 of the water inlet channel 111 along the direction E. Next, as shown in fig. 5 and 6, the working fluid flows in the direction F at opposite ends of the arc-shaped section 1111 and passes through the first opening 421 of the cover 420. Next, as shown in fig. 6 and 7, the working fluid passing through the first opening 421 of the cover 420 flows into the gaps of the heat sink 411 in the direction F, and then flows into the channels around the heat sink 411 in the direction G. Next, the working fluid in the channels around the heat sink fins 411 flows through the second opening 422 of the cover 420 in the direction H, I sequentially.

Next, as shown in fig. 7 and 8, the working fluid passing through the second opening 422 of the cover 420 flows to the extension 1122 of the water outlet flow path 112, and flows to the central portion 1121 of the water outlet flow path 112 along the direction J through the guidance of the extension 1122 and the second guiding path 340 of the guiding plate 300. Next, as shown in fig. 8 and 9, the working fluid in the central portion 1121 of the outlet flow channel 112 flows through the outlet communication port 320 of the baffle 300 in the direction K. Next, as shown in fig. 9 and 10, the working fluid flowing through the water outlet communication port 320 of the baffle 300 is thrown to the space around the impeller 500 in the direction L, flows into the water outlet passage 220 in the direction M, and flows out of the water outlet passage 220 in the direction N.

In addition, because the annular wall part and the bottom of the base are of an integrally formed structure and are bowl-shaped, and most of the lower part of the storage space is sealed by the bottom, only a small part of the storage space is provided with a water inlet flow channel and a water outlet flow channel which are communicated with the heat exchange chamber. Therefore, if the original heat conduction box of the liquid flow type heat dissipation device is required to be modified into a heat conduction box with a larger size, the liquid flow type heat dissipation device can be improved in flexibility of future modification because the liquid flow type heat dissipation device is simple and convenient to pair and only needs holes to holes without the problem of combining the whole structure layers faced by the conventional design. On the contrary, the base of the conventional design mostly adopts the design of an outer cover, and the heat conducting plate is of an open design, so that the two components together form a complete closed cavity. Once the size or shape of the thermally conductive plate is changed, the base cannot form a closed cavity with the thermally conductive plate, resulting in a problem that redesign is necessary.

Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, but rather is capable of modification and variation without departing from the spirit and scope of the present invention.

Claims

1. A liquid flow heat sink comprising:

the base comprises a bottom and an annular wall part, the annular wall part is connected with the bottom, the bottom and the annular wall part jointly encircle a storage space, and the bottom is provided with a water inlet flow channel and a water outlet flow channel;

the sealing cover is provided with an impeller accommodating cavity and a driving component accommodating cavity, the sealing cover is arranged on the base, the impeller accommodating cavity is closer to the storage space than the driving component accommodating cavity, the driving component accommodating cavity is not communicated with the storage space and the impeller accommodating cavity, the sealing cover is provided with a water inlet channel and a water outlet channel, and the water outlet channel is communicated with the impeller accommodating cavity;

the guide plate is arranged between the bottom and the sealing cover, the impeller accommodating cavity is positioned on one side of the guide plate, the water inlet flow channel and the water outlet flow channel are positioned on the other side of the guide plate, and the guide plate is provided with a water inlet communication port and a water outlet communication port;

the heat conduction box is arranged at one side of the bottom of the base far away from the annular wall part and is provided with a heat exchange chamber, the water inlet channel is communicated with the heat exchange chamber through the water inlet communication port and the water inlet flow channel, and the impeller accommodating chamber is communicated with the heat exchange chamber through the water outlet communication port and the water outlet flow channel;

an impeller rotatably disposed in the impeller receiving chamber; and

the driving component is positioned in the driving component accommodating cavity and used for driving the impeller to rotate relative to the sealing cover;

wherein the bottom and the annular wall are integrally formed, and the baffle and at least part of the impeller are located in the storage space and surrounded by the annular wall.

2. The fluid flow type heat dissipating device as set forth in claim 1, wherein the water inlet channel of the bottom comprises an arc segment and a straight line segment, the arc segment is centered on the center of the bottom, the straight line segment is connected to the middle segment of the arc segment and extends in a direction away from the center of the bottom, opposite ends of the arc segment are both communicated with the heat exchange chamber, and an end of the straight line segment away from the arc segment is communicated with the water inlet communication port of the deflector.

3. The liquid flow type heat dissipating device as set forth in claim 2, wherein the water outlet channel of the bottom portion comprises a central portion and an extension portion, the central portion is located at the center of the bottom portion, the arc-shaped section surrounds the outer side of the central portion, the extension portion is connected to the central portion and extends toward the periphery of the bottom portion, one end of the extension portion away from the central portion is communicated with the heat exchange chamber, and the central portion is communicated with the impeller accommodating chamber.

4. The fluid flow type heat dissipating device as defined in claim 3, wherein the heat conducting box comprises a box body and a cover body, the cover body is fixed on the box body, the box body is fixed on the bottom of the base, the box body is provided with a plurality of heat dissipating fins, the cover body is provided with a first opening and a second opening, opposite ends of the arc-shaped section are communicated with the heat exchanging chamber through the first opening, and the impeller accommodating chamber is communicated with the heat exchanging chamber through the second opening.

5. The liquid flow type heat dissipating device as set forth in claim 4, wherein the second opening of the cover has a smaller size than the first opening.

6. The liquid flow heat sink as recited in claim 4 further comprising a first seal and a second seal, the first seal sandwiched between the base and the baffle, the second seal sandwiched between the baffle and the cover.

7. The liquid flow heat sink as recited in claim 6 further comprising a third seal sandwiched between the cover and the bottom of the base and surrounding the first opening.

8. The heat sink of claim 6, further comprising a fourth seal sandwiched between the cover and the bottom of the base and surrounding the first and second openings.

9. The liquid flow type heat dissipating device as set forth in claim 4, wherein the baffle has a first flow guiding channel and a second flow guiding channel, the first flow guiding channel having a shape matching the shape of the water inlet channel and communicating the water inlet communication port of the baffle with the first opening of the cover, the second flow guiding channel having a shape matching the shape of the extension portion of the water outlet channel and communicating the water outlet communication port of the baffle with the second opening of the cover.

10. The liquid flow type heat dissipating device as set forth in claim 1, wherein the water outlet of the baffle is closer to the center of the baffle than the water inlet.

11. The liquid flow heat sink as recited in claim 1 further comprising a shroud secured to the annular wall of the base and covering the cover and the drive assembly.

12. The liquid flow type heat dissipating device as set forth in claim 1, further comprising a control circuit board secured to the top of the cover and electrically connected to the driving assembly.

13. The liquid flow heat sink as recited in claim 12 further comprising at least one light emitting element disposed on the control circuit board.