CN117270653A - Liquid flow type heat radiator - Google Patents

Abstract

A liquid flow type heat dissipating device comprises a base, a sealing cover, a flow guide plate, a heat conducting box, an impeller and a driving assembly. The base comprises a bottom and an annular wall. The annular wall portion is connected to the bottom portion. The bottom is provided with a water inlet flow channel and a water outlet flow channel. The two opposite sides of the sealing cover are respectively provided with an impeller accommodating chamber and a driving component accommodating chamber. The sealing cover is arranged on the base. The sealing cover is provided with a water inlet channel and a water outlet channel. The water outlet channel is communicated with the impeller accommodating chamber. The impeller accommodating chamber is positioned at one side of the guide plate, and the water inlet flow channel and the water outlet flow channel are positioned at the other side of the guide plate. The guide plate is provided with a water inlet communication port and a water outlet communication port. The heat conducting box is arranged on the base and is provided with a heat exchange chamber. The impeller is rotatably positioned in the impeller receiving chamber. The driving assembly is positioned in the driving assembly accommodating chamber.

Description

Liquid flow cooling device

Technical field

The present invention relates to a heat dissipation device, in particular to a liquid flow heat dissipation device.

Background technique

When a computer is operating, the heat source inside the computer, such as the central processing unit, will generate heat due to high-speed operations. Therefore, computers must be equipped with cooling devices to quickly and effectively take away the heat generated by the heat source and keep the temperature of the heat source within the design range specified by the manufacturer. Cooling devices are generally divided into air-cooled and liquid-cooled. An air-cooling cooling device refers to installing heat sink fins on the heat source and installing a fan on the computer to take away the heat generated by the heat source through the air flow generated by the fan. However, the fan generates noise when running, and it is difficult to cool high-heat heat sources, such as the processors of competitive computers. Therefore, current competitive computers generally use liquid cooling. A liquid-cooled cooling device refers to installing a water-cooling head and a water-cooling radiator on a computer. The water-cooling head is in thermal contact with the heat source and is connected to the water-cooling radiator through a flow tube. There is a pump in the water-cooling head. The driving of the pump can drive the heat-absorbing coolant to flow from the water-cooling head to the water-cooling radiator. After the water-cooling radiator dissipates heat, it flows back from the water-cooling radiator to the water-cooling head.

However, due to the large number of shell parts of the current water-cooling head, the assembly efficiency is not good, and the waterproof design is difficult to complete. For example, if a water-cooling head originally designed for a single heat source is modified into a water-cooling head for multiple heat sources, it may be difficult to enhance the waterproof performance after the structural change, causing the modified water-cooling to lose its waterproofing effect, resulting in water-cooling failure. fluid leakage.

Contents of the invention

The present invention provides a liquid flow heat dissipation device, thereby improving the assembly efficiency of a water-cooled head and increasing the flexibility of future modifications of the water-cooled head.

A liquid flow heat dissipation device disclosed in an embodiment of the present invention includes a base, a cover, a deflector, a heat conduction box, an impeller and a driving component. The base includes a bottom and an annular wall. The annular wall is connected to the bottom, and the bottom and the annular wall together form a storage space. The bottom has an inlet channel and an outlet channel. Opposite sides of the cover have an impeller accommodating chamber and a driving assembly accommodating chamber respectively. The cover is installed on the base. The impeller accommodating chamber is closer to the storage space than the driving component accommodating chamber. The driving component accommodating chamber is not connected to the storage space and the impeller accommodating chamber. The cover has a water inlet channel and a water outlet channel. The water outlet channel is connected to the impeller accommodation chamber. The guide plate is between the bottom and the cover, and the impeller accommodation chamber is located on one side of the guide plate, and the inlet and outlet channels are located on the other side of the guide plate. The guide plate has an inlet connection. mouth and a water outlet. The thermally conductive box is installed on a side of the bottom of the base away from the annular wall, and the thermally conductive box has a heat exchange chamber. The water inlet channel is connected to the heat exchange chamber through the water inlet communication port and the water inlet channel. The impeller accommodating chamber is connected to the heat exchange chamber through the water outlet communication port and the outlet water channel. The impeller is rotatably located in the impeller receiving chamber. The driving component is located in the driving component receiving chamber and is used to drive the impeller to rotate relative to the cover. The bottom and the annular wall are integrally formed, and the baffle and at least part of the impeller are located in the storage space and surrounded by the annular wall.

According to the liquid flow heat dissipation device of the above embodiment, since the annular wall and the bottom of the base are an integral structure and are bowl-shaped, the guide plate and the impeller are placed in the bowl-shaped base, which can simplify the base and the cover. The assembly procedure between the heat dissipation device and the deflector reduces the difficulty of assembling the liquid flow heat dissipation device.

In addition, because the annular wall and the bottom of the base are an integral structure and are bowl-shaped, and most of the bottom of the storage space is closed by the bottom, only a small part is designed with inlet and outlet water channels connected to the heat exchange chamber. road. Therefore, if the original heat-conducting box of the liquid flow heat dissipation device needs to be modified into a larger-sized heat-conducting box, because the pairing is simple and only requires hole-to-hole, there is no integration problem at the overall structural level faced by the conventional design, so it can be used The liquid flow cooling device increases the flexibility of future modifications.

The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide further explanation of the patent application scope of the present invention.

Description of the drawings

Figure 1 is a three-dimensional schematic view of a liquid flow heat dissipation device according to the first embodiment of the present invention;

Figure 2 is an exploded schematic diagram of Figure 1;

Figure 3 is an exploded schematic diagram of Figure 2 from another perspective;

4 to 10 are schematic diagrams of working fluid flow in the liquid flow heat dissipation device of FIG. 1 .

【Symbol Description】

10: Liquid flow cooling device

100: Base

110: Bottom

111: Inlet water channel

1111: Arc segment

1112: Straight line segment

112: Outlet water channel

1121: Central Department

1122: Extension

120: Ring wall

200: Blocked

210: Water inlet channel

220: Water outlet channel

300: deflector

310: Water inlet connection port

320: Water outlet connection port

330: First diversion channel

340: Second diversion channel

400: Thermal box

410: Box

411: Cooling fins

420: Cover

421: First opening

422: Second opening

500: Impeller

600: Drive components

710: First seal

720: Second seal

730: Third seal

740: Fourth seal

800: Control circuit board

850: Light emitting component

910: Water inlet connector

920: Water outlet connector

950: Mask

S1: storage space

S2: Impeller housing chamber

S3: Drive assembly housing chamber

S4: Heat exchange chamber

C1, C2: Center

A～N: direction

Detailed ways

See Figure 1 to Figure 3. FIG. 1 is a schematic three-dimensional view of a liquid flow heat dissipation device 10 according to a first embodiment of the present invention. Figure 2 is an exploded schematic diagram of Figure 1. Figure 3 is an exploded schematic diagram of Figure 2 from another perspective.

The liquid flow heat dissipation device 10 of this embodiment is, for example, a water block, and is used to thermally couple with at least one heat source (not shown) to remove the heat generated by the heat source through the working fluid. The heat source is, for example, a central processing unit or an image processor. The liquid flow heat dissipation device 10 includes a base 100, a cover 200, a guide plate 300, a heat conduction box 400, an impeller 500 and a driving assembly 600. The base 100 includes a bottom 110 and an annular wall 120 . The annular wall part 120 is connected to the bottom 110, and the bottom 110 and the annular wall part 120 together surround a storage space S1.

The bottom 110 has an inlet channel 111 and an outlet channel 112 . The water inlet channel 111 of the bottom 110 includes an arc segment 1111 and a straight segment 1112. The arc segment 1111 takes the center C1 of the bottom 110 as the center of the circle. The straight section 1112 is connected to the middle section of the arc section 1111 and extends in a direction away from the center C1 of the bottom 110 so that the water inlet channel is, for example, Y-shaped. The water outlet channel 112 of the bottom 110 includes a central part 1121 and an extension part 1122. The central portion 1121 is, for example, in the shape of a round hole and is located at the center C1 of the bottom 110 . The arc segment 1111 surrounds the outside of the central portion 1121 . The extension portion 1122 is connected to the central portion 1121 and extends toward the periphery of the bottom 110 .

In other embodiments, the straight section of the water inlet channel can also be changed to a non-straight section, as long as it extends in a direction away from the center C1 of the bottom 110 .

Opposite sides of the cover 200 have an impeller accommodating chamber S2 and a driving component accommodating chamber S3 respectively. The cover 200 is installed on the base 100 . The impeller accommodating chamber S2 is closer to the storage space S1 than the driving component accommodating chamber S3. The driving component accommodating chamber S3 is not connected to the storage space S1 and the impeller accommodating chamber S2. The cover 200 has a water inlet channel 210 and a water outlet channel 220 . The water outlet channel 220 communicates with the impeller accommodation chamber S2.

The baffle 300 is between the bottom 110 and the cover 200 , and the impeller accommodating chamber S2 is located on one side of the baffle 300 . The inlet water channel 111 and the water outlet channel 112 are located on the other side of the guide plate 300 . The guide plate 300 has a water inlet communication port 310 and a water outlet communication port 320. The water outlet communication port 320 of the guide plate 300 is closer to the center C2 of the guide plate 300 than the water inlet communication port 310 . In addition, the water outlet communication port 320 of the guide plate 300 has a first guide channel 330 and a second guide channel 340. The shape of the first guide channel 330 matches the shape of the water inlet channel 111 and connects the water inlet communication port 310 of the guide plate 300 and the first opening 421 of the cover 420 . The shape of the second guide channel 340 matches the shape of the water outlet channel 112 . The shape of the extension portion 1122 communicates with the water outlet communication port 320 of the guide plate 300 and the second opening 422 of the cover 420 .

The thermally conductive box 400 is installed on the side of the bottom 110 of the base 100 away from the annular wall 120, and the thermally conductive box 400 has a heat exchange chamber S4. Specifically, the thermally conductive box 400 includes a box body 410 and a cover body 420 . The cover 420 is fixed to the box 410 by, for example, welding, pressing, gluing, screwing, or other combination methods. The box body 410 is fixed to the bottom 110 of the base 100 by, for example, welding, pressing, gluing, screwing, or other combination methods. The box body 410 has a plurality of heat dissipation fins 411 to increase the heat exchange efficiency between the box body 410 and the working fluid. The cover 420 has a first opening 421 and a second opening 422 . The first opening 421 is, for example, elongated. The second opening 422 is, for example, hole-shaped, and the size of the second opening 422 of the cover 420 is smaller than the size of the first opening 421 .

In this embodiment, the opposite ends of the arc-shaped section 1111 of the water inlet channel 111 of the base 100 are connected to the heat exchange chamber S4 through the first opening 421 of the cover 420 . One end of the straight segment 1112 away from the arc segment 1111 is connected to the water inlet communication port 310 of the guide plate 300 , and the water inlet communication port 310 of the guide plate 300 is connected to the water inlet channel 210 of the cover 200 . That is to say, the water inlet channel 210 communicates with the heat exchange chamber S4 through the water inlet communication port 310, the arc section 1111 of the water inlet channel 111, and the first opening 421 of the cover 420. The central part 1121 of the water outlet channel 112 of the base 100 is connected to the impeller accommodation chamber S2 through the water outlet communication port 320, and one end of the extension part 1122 of the water outlet channel 112 away from the central part 1121 passes through the second opening 422 of the cover 420. Connected to heat exchange chamber S4. That is to say, the impeller accommodating chamber S2 is connected to the heat exchange chamber S4 through the water outlet communication port 320, the outlet water channel 112 and the second opening 422.

In this embodiment, the liquid flow heat dissipation device 10 may further include a first seal 710 , a second seal 720 , a third seal 730 and a fourth seal 740 . The first seal 710 is sandwiched between the base 100 and the guide plate 300 to prevent the working fluid from flowing from the water inlet communication port 310 of the guide plate 300 to the water inlet channel 111 of the base plate from leaking, or from leaking from the base 100 The working fluid flowing through the outlet communication port 320 of the baffle 300 is leaked from the outlet channel 112 . The second seal 720 is sandwiched between the deflector 300 and the cover 200 to prevent the working fluid flowing from the water inlet channel 210 of the cover 200 into the water inlet communication port 310 of the deflector 300 from leaking, or to prevent self-guiding. The working fluid flowing from the water outlet communication port 320 of the flow plate 300 to the impeller accommodating chamber S2 of the cover 200 leaks out. The third seal 730 is sandwiched between the cover 420 and the bottom 110 of the base 100 and surrounds the first opening 421 to prevent the working fluid flowing from the inlet channel 111 of the base 100 to the heat exchange chamber S4 from leaking. The fourth seal 740 is sandwiched between the cover 420 and the bottom 110 of the base 100 and surrounds the first opening 421 and the second opening 422 to prevent flow from the inlet channel 111 of the base 100 to the heat exchange chamber S4 Fluid leakage or working fluid flowing from the heat exchange chamber S4 to the water outlet channel 112 of the base 100 leaks.

The impeller 500 is rotatably located in the impeller accommodating chamber S2 to drive the working fluid to flow in from the water inlet channel 210 and to flow out from the water outlet channel 220 . The driving assembly 600 is located in the driving assembly receiving chamber S3. The driving assembly 600 includes, for example, a stator and a rotor. The stator and the rotor are disposed on the cover 200 and the impeller 500 respectively, and the stator and the rotor are used to generate a rotating magnetic field that drives the rotor to rotate, so that the driving assembly 600 drives the impeller 500 to rotate relative to the cover 200 .

In this embodiment, the bottom 110 and the annular wall portion 120 are, for example, an integrated structure made by injection molding, and the guide plate 300 and at least part of the impeller 500 are located in the storage space S1 and are surrounded by the annular wall portion 120 Surrounded within. However, the design that the bottom 110 and the annular wall portion 120 are integrally formed is not intended to limit the present invention. In other embodiments, the bottom 110 and the annular wall portion 120 can also be composed of two independent components.

In this embodiment, the liquid flow heat dissipation device 10 may further include a control circuit board 800 . The control circuit board 800 is fixed on the top of the cover 200 and is electrically connected to the driving assembly 600 to control the rotation speed of the impeller 500 through the driving assembly 600 .

In this embodiment, the liquid flow heat dissipation device 10 may also include a plurality of light-emitting elements 850 . Some light-emitting elements 850 are disposed on the control circuit board 800 and are used to illuminate in a direction away from the cover 200 .

In this embodiment, the liquid flow heat dissipation device 10 may further include a water inlet connector 910 and a water outlet connector 920 . One end of the water inlet connector 910 is disposed in the water inlet channel 210 of the cover, and the other end of the water inlet connector 910 is used to connect to the flow pipe. One end of the water outlet connector 920 is disposed in the water outlet channel 220 of the cover, and the other end of the water outlet connector 920 is used to connect to the flow pipe.

In this embodiment, the liquid flow heat dissipation device 10 may further include a cover 950 . The cover 950 is fixed to the annular wall 120 of the base 100 through buckles, for example, and covers the cover 200 and the driving assembly 600 . The cover 950 has the function of protecting the control circuit board 800 and the driving component 600, and can also be used as a place for decoration and lighting effects.

In this embodiment, the liquid flow heat dissipation device 10 is equipped with a cover 950, but it is not limited to this. In other embodiments, mask 950 may be omitted.

In this embodiment, because the base 100 and the heat conduction box 400 are only connected to the inlet channel 111 through the first opening 421 and the water outlet channel 112 through the second opening 422, the pairing is simple and does not require conventional designs. The liquid flow heat dissipation device 10 is faced with the integration problem at the overall structural level, so the flexibility of future modifications can be increased.

See Figure 4 through Figure 10. 4 to 10 are schematic diagrams of the working fluid flow of the liquid flow heat dissipation device 10 of FIG. 1 . As shown in FIG. 4 , when the liquid flow heat dissipation device 10 is operating, the working fluid flows through the water inlet channel 210 along directions A, B, and C, and then passes through the water inlet communication port 310 of the guide plate 300 along direction D. Then, as shown in FIG. 5 , the working fluid passing through the water inlet communication port 310 of the guide plate 300 is guided by the first guide channel 330 and the inlet channel 111 and flows through the straight section 1112 of the inlet channel 111 along the direction E. with arc segment 1111. Then, as shown in FIGS. 5 and 6 , the working fluid flows along the direction F at the opposite ends of the arc segment 1111 and passes through the first opening 421 of the cover 420 . Then, as shown in FIGS. 6 and 7 , the working fluid passing through the first opening 421 of the cover 420 first flows into the gap of the heat dissipation fins 411 along the direction F, and then flows into the channels around the heat dissipation fins 411 along the direction G. Then, the working fluid in the channels around the heat dissipation fins 411 flows through the second opening 422 of the cover 420 along the directions H and I in sequence.

Then, as shown in FIGS. 7 and 8 , the working fluid passing through the second opening 422 of the cover 420 will flow to the extension portion 1122 of the water outlet channel 112 , and then pass through the extension portion 1122 and the second guide channel of the guide plate 300 340 and flows toward the central portion 1121 of the outflow channel 112 along the direction J. Next, as shown in FIGS. 8 and 9 , the working fluid in the central portion 1121 of the water outlet channel 112 flows through the water outlet communication port 320 of the guide plate 300 in the direction K. Then, as shown in FIGS. 9 and 10 , the working fluid flowing through the water outlet communication port 320 of the baffle 300 will be thrown into the space around the impeller 500 along the direction L, flow into the water outlet channel 220 along the direction M, and flow out along the direction N. Water outlet channel 220.

According to the liquid flow heat dissipation device of the above embodiment, since the annular wall and the bottom of the base are an integral structure and are bowl-shaped, the guide plate and the impeller are placed in the bowl-shaped base, which can simplify the base and the cover. The assembly procedure between the heat dissipation device and the deflector reduces the difficulty of assembling the liquid flow heat dissipation device.

In addition, because the annular wall and the bottom of the base are an integral structure and are bowl-shaped, and most of the bottom of the storage space is closed by the bottom, only a small part is designed with inlet and outlet water channels connected to the heat exchange chamber. road. Therefore, if the original heat-conducting box of the liquid flow heat dissipation device needs to be modified into a larger-sized heat-conducting box, because the pairing is simple and only requires hole-to-hole, there is no integration problem at the overall structural level faced by the conventional design, so it can be used The liquid flow cooling device increases the flexibility of future modifications. On the contrary, conventionally designed bases mostly adopt an outer cover design, and the heat transfer plate is an open design, and the two together form a complete sealed cavity. Once the size or shape of the heat transfer plate changes, the base cannot form a closed cavity with the heat transfer plate, resulting in a problem that must be redesigned.

Although the present invention has been disclosed in the foregoing embodiments, they are not intended to limit the present invention. Anyone familiar with similar arts can make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, The scope of patent protection of the present invention must be determined by the claims attached to this specification.

Claims (13)

1. A liquid flow heat sink comprising:

the base comprises a bottom and an annular wall part, the annular wall part is connected with the bottom, the bottom and the annular wall part jointly encircle a storage space, and the bottom is provided with a water inlet flow channel and a water outlet flow channel;

the sealing cover is provided with an impeller accommodating cavity and a driving component accommodating cavity, the sealing cover is arranged on the base, the impeller accommodating cavity is closer to the storage space than the driving component accommodating cavity, the driving component accommodating cavity is not communicated with the storage space and the impeller accommodating cavity, the sealing cover is provided with a water inlet channel and a water outlet channel, and the water outlet channel is communicated with the impeller accommodating cavity;

the guide plate is arranged between the bottom and the sealing cover, the impeller accommodating cavity is positioned on one side of the guide plate, the water inlet flow channel and the water outlet flow channel are positioned on the other side of the guide plate, and the guide plate is provided with a water inlet communication port and a water outlet communication port;

the heat conduction box is arranged at one side of the bottom of the base far away from the annular wall part and is provided with a heat exchange chamber, the water inlet channel is communicated with the heat exchange chamber through the water inlet communication port and the water inlet flow channel, and the impeller accommodating chamber is communicated with the heat exchange chamber through the water outlet communication port and the water outlet flow channel;

an impeller rotatably disposed in the impeller receiving chamber; and

the driving component is positioned in the driving component accommodating cavity and used for driving the impeller to rotate relative to the sealing cover;

wherein the bottom and the annular wall are integrally formed, and the baffle and at least part of the impeller are located in the storage space and surrounded by the annular wall.

2. The fluid flow type heat dissipating device as set forth in claim 1, wherein the water inlet channel of the bottom comprises an arc segment and a straight line segment, the arc segment is centered on the center of the bottom, the straight line segment is connected to the middle segment of the arc segment and extends in a direction away from the center of the bottom, opposite ends of the arc segment are both communicated with the heat exchange chamber, and an end of the straight line segment away from the arc segment is communicated with the water inlet communication port of the deflector.

3. The liquid flow type heat dissipating device as set forth in claim 2, wherein the water outlet channel of the bottom portion comprises a central portion and an extension portion, the central portion is located at the center of the bottom portion, the arc-shaped section surrounds the outer side of the central portion, the extension portion is connected to the central portion and extends toward the periphery of the bottom portion, one end of the extension portion away from the central portion is communicated with the heat exchange chamber, and the central portion is communicated with the impeller accommodating chamber.

4. The fluid flow type heat dissipating device as defined in claim 3, wherein the heat conducting box comprises a box body and a cover body, the cover body is fixed on the box body, the box body is fixed on the bottom of the base, the box body is provided with a plurality of heat dissipating fins, the cover body is provided with a first opening and a second opening, opposite ends of the arc-shaped section are communicated with the heat exchanging chamber through the first opening, and the impeller accommodating chamber is communicated with the heat exchanging chamber through the second opening.

5. The liquid flow type heat dissipating device as set forth in claim 4, wherein the second opening of the cover has a smaller size than the first opening.

6. The liquid flow heat sink as recited in claim 4 further comprising a first seal and a second seal, the first seal sandwiched between the base and the baffle, the second seal sandwiched between the baffle and the cover.

7. The liquid flow heat sink as recited in claim 6 further comprising a third seal sandwiched between the cover and the bottom of the base and surrounding the first opening.

8. The heat sink of claim 6, further comprising a fourth seal sandwiched between the cover and the bottom of the base and surrounding the first and second openings.

9. The liquid flow type heat dissipating device as set forth in claim 4, wherein the baffle has a first flow guiding channel and a second flow guiding channel, the first flow guiding channel having a shape matching the shape of the water inlet channel and communicating the water inlet communication port of the baffle with the first opening of the cover, the second flow guiding channel having a shape matching the shape of the extension portion of the water outlet channel and communicating the water outlet communication port of the baffle with the second opening of the cover.

10. The liquid flow type heat dissipating device as set forth in claim 1, wherein the water outlet of the baffle is closer to the center of the baffle than the water inlet.

11. The liquid flow heat sink as recited in claim 1 further comprising a shroud secured to the annular wall of the base and covering the cover and the drive assembly.

12. The liquid flow type heat dissipating device as set forth in claim 1, further comprising a control circuit board secured to the top of the cover and electrically connected to the driving assembly.

13. The liquid flow heat sink as recited in claim 12 further comprising at least one light emitting element disposed on the control circuit board.