CN115655662B

CN115655662B - Method and system for precisely testing edge-emitting semiconductor laser

Info

Publication number: CN115655662B
Application number: CN202211279006.8A
Authority: CN
Inventors: 李万军; 向欣; 王远红
Original assignee: Wuhan Yunling Optoelectronics Co ltd
Current assignee: Wuhan Yunling Optoelectronics Co ltd
Priority date: 2022-10-19
Filing date: 2022-10-19
Publication date: 2023-12-22
Anticipated expiration: 2042-10-19
Also published as: CN115655662A

Abstract

The invention relates to a precision testing method of an edge-emitting semiconductor laser, which comprises the following steps: s1, placing a laser chip to be tested on a test carrier, and arranging a light receiving component beside the test carrier; s2, arranging a condensing lens between the test carrier and the light receiving component; s3, pushing the laser chip to be tested from multiple angles by adopting a guide system to adjust the position of the laser chip to be tested on the test carrier until the light emitting area of the laser chip to be tested is accurately aligned with the condensing lens; s4, powering on the laser chip to be tested, and collecting light emitted by the laser chip to be tested after passing through a condensing lens, so that the divergence angle of the light beam is reduced; s5, the optical performance test is carried out after the light receiving assembly receives the collected light beams. A system for precisely testing the edge-emitting semiconductor laser is also provided. The invention can solve the problem of insufficient light receiving of the traditional test system, improves the light receiving precision of the light receiving component, and remarkably improves the accuracy of the optical performance test of the edge-emitting semiconductor laser chip.

Description

Method and system for precisely testing edge-emitting semiconductor laser

Technical Field

The invention relates to the technical field of chip testing, in particular to a method and a system for accurately testing an edge-emitting semiconductor laser.

Background

With the rapid development of the optical communication industry, semiconductor laser chips are widely used as main emitting-end light sources, and the edge-emitting semiconductor laser chips have an important share. All the edge-emitting semiconductor laser chips need to be subjected to photoelectric performance test, and the positions and the divergence angles of the luminous points of the different laser chips manufactured by application scenes and processes are different, so that the requirements on the light guide part and the light receiving part of the optical performance test system are very high. Particularly, the laser chip which is suitable for the new application environment has high requirements on the optical performance test precision, and the test requirements are diversified, so that the alignment and light receiving precision of the test system needs to be improved. On one hand, the conventional side-emitting semiconductor laser chip testing system has the problem of low testing precision in the matching of the traditional light guide component and the light receiving component; on the other hand, the light receiving adaptive component is single, and if multiple optical performance characterization needs to be carried out, repeated testing is required to be carried out on a single semiconductor laser chip, so that the testing time and the cost are greatly increased; finally, traditional test systems are more complex to debug when switching products, increasing labor and time costs.

The edge-emitting semiconductor laser chip has various designs according to the application scene, and the light emitting position, the divergence angle, the chip size and the like of the laser chip for different applications are different to different degrees. Moreover, the edge-emitting semiconductor lasers with the same application conditions have different divergence angles of products due to different manufacturing processes of different manufacturers. For the reasons, the precision of the test machine is required to be very high, and the optical performance test of the laser chip is reflected in various aspects such as light guide, light receiving and the like.

The light guide is used for testing the optical performance of the light receiving component aiming at the light emitting position of the laser chip. The conventional semiconductor laser testing system generally adopts a camera picture template for guiding on the chip guiding plane, the scheme is to set the graphic characteristics of the laser chip to be tested and set the percentage range of the graphic similarity matching degree for guiding, the working logic of the scheme is to take the center of the camera as a reference, and a testing table performs left-right, up-down and angle rotation actions to place the laser chip to be tested at a preset position. The first defect of the scheme is that the normal laser chip cannot be easily identified due to overlarge similarity matching degree, so that material throwing is caused; the correction accuracy is poor when the similarity matching degree is set to be too small. The second drawback is that if the deviation of the laser chip to be corrected is large, on one hand, the maximum limit of the movable angle of the test bench may be exceeded and the chip cannot be corrected successfully, on the other hand, the movement center of the angular rotation action is the movement center of the test bench, and if the placement position of the laser chip deviates from the center greatly, the test bench performs the correction by using the rotation angle to be executed by the test bench calculated by the angular deviation of the laser chip, and the correction effect is poor. Another common guiding scheme is mechanical guiding, and the scheme is generally provided with a return-shaped push plate to perform the right-left and up-down guiding actions. The main defect of this scheme is that if the suction of testboard is less or the push pedal dynamics is too big, cause throwing material or lead to the fact the back position deviation problem easily.

The configuration of the optical performance testing section has a great influence on the measurement of the optical performance of the semiconductor laser. The traditional laser chip optical performance test method is generally characterized in that a plane light receiving photodiode component, an integrating sphere, an optical fiber collimator and the like are directly arranged in the light emitting direction of the laser chip, and the movable range of the light receiving component at the position is smaller, so that the accuracy of the laser chip test aiming at different light emitting positions and divergence angles is poor, and the debugging work is complex when different products are tested. In addition, for the laser chips with different divergence angles, the light receiving assembly has the problem of insufficient light receiving due to size limitation, so that the accuracy of optical performance test is affected.

Finally, it is difficult for the light receiving assembly of the conventional laser chip test system to precisely align the light emitting region of the laser chip; the debugging work is comparatively loaded down with trivial details when the laser chip of different luminous positions switches the test, influences efficiency. Moreover, when the traditional laser testing system tests laser chips with different light-emitting positions, camera picture template setting or mechanical guide plate position setting is required one by one, and when the traditional laser testing system is used, operation and debugging are complicated, so that the efficiency is affected. In addition, the traditional laser chip testing system has fewer matched optical testing components due to structural limitation, and if multiple optical testing performances are to be characterized, repeated testing is required to be carried out on a single chip, so that the production cost is increased.

Disclosure of Invention

The invention aims to provide a method and a system for precisely testing an edge-emitting semiconductor laser, which can at least solve part of defects in the prior art.

In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: a method for precisely testing an edge-emitting semiconductor laser comprises the following steps:

s1, placing a laser chip to be tested on a test carrier, and arranging a light receiving component beside the test carrier;

s2, a condensing lens is arranged between the test carrier and the light receiving component;

s3, pushing the laser chip to be tested from multiple angles by adopting a guide system to adjust the position of the laser chip to be tested on the test carrier until the light emitting area of the laser chip to be tested is accurately aligned with the condensing lens;

s4, powering up the laser chip to be tested, and collecting light emitted by the laser chip to be tested after passing through the condensing lens, so that the divergence angle of the light beam is reduced;

s5, the light receiving assembly receives the collected light beams and then performs optical performance test.

Further, when arranging the laser chip to be tested, the light receiving component and the condensing lens, a light reflecting mirror is also arranged, so that when the optical performance is tested, the light emitted by the laser chip to be tested passes through the light emitting mirror first, then is reflected by the light emitting mirror and then enters the condensing lens to be condensed.

Further, before the alignment system performs alignment, the alignment system is set through the working position, and the alignment system comprises an alignment baffle and an alignment push plate, wherein the setting mode is specifically as follows:

firstly, inputting the size parameters of the laser chip to be tested into an upper computer, and then inputting the gram weight value for calibrating the height of the pilot push plate;

taking a lens center mark of a monitoring camera right above the test carrier as a reference, and based on the dimension parameters input into the upper computer, calculating the horizontal working position and the working origin position of the guide push plate by the upper computer;

then, calibrating the position of the working height of the guide system, wherein the guide push plate moves downwards in small movement steps along the vertical direction from an initial point, in the whole process, the gram weight meter of the guide push plate detects the gram weight, when the guide push plate contacts the test carrier, the numerical value of the gram weight meter of the guide push plate starts to change, when the detected numerical value exceeds a set numerical value, the guide push plate stops moving in the vertical direction, and the upper computer records that the position in the vertical direction is the vertical working position of the push plate and automatically calculates the working origin position in the vertical direction;

Finally, the automatic setting of the working position of the pilot system is completed.

Furthermore, before the arrangement, the working position of the condensing lens is set by the induction detection plate, and the working position of the condensing lens is set by the induction detection plate specifically comprises:

continuously adding bias current to the forward electrode of the laser chip to be tested, and moving the induction detection plate to a position where the laser chip to be tested emits light;

when the light emitted by the laser chip to be tested irradiates the induction detection plate, a point (X, Z) with highest light intensity/heat is formed, and then the coordinate is compared with the original point coordinate (0, 0) of the induction detection plate, so that the distance difference between the X direction and the Z direction is calculated; then, according to the distance difference, the center coordinate point (0, 0) of the induction detection plate is moved to the point (X, Z) with the highest light intensity/heat quantity so as to finish the position calibration of the induction detection plate, and at the moment, the moved positions (X1, Z1) of the induction detection plate are stored in an upper computer;

the condensing lens and the sensing detection plate share the same 1-9-direction and Z-direction coordinates, and the X-direction difference is fixed X2, so that the working position of the condensing lens is calculated to be (X1-X2, Z1) from the working position of the sensing detection plate, and the working position of the condensing lens is automatically stored into a program parameter to complete automatic correction of the working position of the condensing lens.

Further, before the light receiving assembly is arranged, the working position is set by the induction detection plate, and the working position of the light receiving assembly is set by the induction detection plate specifically:

the light receiving component and the sensing detection plate share the same 1-9-direction and Z-direction coordinates, and the X-direction difference is X2 which is fixed, so that the working position of the light receiving component is calculated as (X1-X2, Z1) from the working position of the sensing detection plate, and the working position of the light receiving component is automatically stored into a program parameter to complete automatic correction of the working position of the light receiving component.

Further, the alignment system includes a plurality of alignment pushing plates for pushing the laser chip to be tested from a plurality of angles, respectively, so as to adjust the position of the laser chip to be tested on the test carrier.

Further, the guide system further comprises guide baffles, the guide pushing plates are three, the guide pushing plates work independently, the laser chips to be tested are pushed from three directions respectively, and each guide pushing plate does not move backwards after being pushed in place, so that the laser chips to be tested are accurately clamped and controlled on the positions to be tested by the aid of the guide baffles in the matching of the three directions.

Further, in the process of setting the position of the guide system, the position of the condensing lens and the position of the light receiving component, a driving mechanism is adopted to be matched with a host computer to complete automatic setting.

The embodiment of the invention provides another technical scheme that: an accurate test system of an edge-emitting semiconductor laser comprises a test carrier, a guide system, a condensing lens, a test probe and a light receiving component,

the test carrier is used for placing the laser chip to be tested,

the guide system is used for pushing the laser chip to be tested from a plurality of angles to adjust the position of the laser chip to be tested on the test carrier,

The condensing lens is used for condensing the light emitted by the laser chip to be detected,

the test probe is used for powering up the laser chip to be tested,

the light receiving assembly is used for receiving the light beams collected by the condensing lens and performing optical performance test.

Further, the light receiving assembly comprises a plane light receiving photodiode, an integrating sphere, an optical fiber collimator and a bare optical fiber.

Compared with the prior art, the invention has the beneficial effects that:

1. the alignment system can realize the accurate positioning of the laser chip to be measured.

2. The design of the condensing lens can solve the problem of insufficient light receiving of the traditional test system, improves the light receiving precision of the light receiving component, and remarkably improves the accuracy of the optical performance test of the edge-emitting semiconductor laser chip.

3. The design of the induction detection plate can improve the setting precision of the working position of the light receiving component, improve the light performance test accuracy, automatically set the position of the light receiving component and greatly reduce the debugging time of the light receiving component.

4. The design of the light reflector structure can avoid the influence of the light receiving part on reflecting the light back to the laser chip, and the test accuracy is enhanced.

5. The layout of the alignment system and the function design of automatic adjustment thereof can increase the alignment precision of the edge-emitting semiconductor laser chip, improve the test accuracy, automatically generate the working position of the push plate and greatly reduce the debugging time after switching products.

6. The function of pilot plate gram weight detects, the accessible push pedal gram weight sets up the automatic settlement that realizes the push pedal height, has avoided the risk of damaging the microscope carrier when the high debugging of push pedal, and reduces the debugging time, improves production efficiency.

7. The design of the guide system can be compatible with edge-emitting semiconductor laser chips with different design specifications, the compatibility of the test system is improved, and various product tests are realized.

8. Each guide push plate is provided with a buffer spring, the spring force is adjustable, and the damage to the chip during the chip guide can be avoided.

Drawings

FIG. 1 is a schematic diagram of a top view of an edge-emitting semiconductor laser precision testing system according to an embodiment of the present invention;

FIG. 2 is a diagram of a light receiving component of an edge-emitting semiconductor laser precision test system according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a side view of an edge-emitting semiconductor laser precision testing system according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of an edge-emitting semiconductor laser precision testing system with a light reflector according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a calibration pushing plate of an edge-emitting semiconductor laser precision testing system according to an embodiment of the present invention in an origin position;

FIG. 6 is a diagram showing the working position of a guide push plate when the light-emitting area of a laser chip to be tested of an edge-emitting semiconductor laser precision test system provided by an embodiment of the present invention is at the center;

FIG. 7 is a diagram showing the working position of a guide push plate when the light emitting area of a laser chip to be tested of an edge-emitting semiconductor laser precision test system provided by an embodiment of the present invention deviates from the center;

FIG. 8 is a schematic diagram of a guiding push plate of an edge-emitting semiconductor laser precision testing system according to an embodiment of the present invention;

fig. 9 is a schematic diagram of a condensing lens of an edge-emitting semiconductor laser precision testing system according to an embodiment of the present invention.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

Referring to fig. 1 to 9, an embodiment of the present invention provides a method for precisely testing an edge-emitting semiconductor laser, which includes the following steps: s1, placing a laser chip 2 to be tested on a test carrier 1, and arranging a light receiving component beside the test carrier 1; s2, a condensing lens 17 is arranged between the test carrier 1 and the light receiving component; s3, pushing the laser chip 2 to be tested from multiple angles by adopting a guide system to adjust the position of the laser chip 2 to be tested on the test carrier 1 until the light emitting area of the laser chip 2 to be tested is accurately aligned with the condensing lens 17; s4, powering up the laser chip 2 to be tested, wherein the light emitted by the laser chip 2 to be tested is collected after passing through the condensing lens 17, so that the divergence angle of the light beam is reduced; s5, the light receiving assembly receives the collected light beams and then performs optical performance test. In this embodiment, the test carrier 1 is used to carry the laser chip 2 to be tested and power up, so as to realize performance test under different conditions. The light receiving assembly is used for matching different light receiving assemblies to perform accurate optical performance test; the automatic calibration of the working position is realized by matching with a driving motor component. The condensing lens 17 has the function of converting the light path of the light emitted by the laser chip 2 to be tested, thereby playing the role of condensing the light beam and improving the accuracy of optical performance test; and with the driving motor, the software can automatically calibrate the working position of the condensing lens 17. The correcting system is used for adjusting the chip to be tested to an optimal position according to the different sizes and the different luminous positions of the chip, so as to realize accurate optical performance test; the automatic adjustment of the working position can be carried out by inputting chip information by matching with a driving motor, so that the debugging time is shortened. Specifically, the laser chip 2 to be tested, the condenser lens 17 and the light receiving element are on the same horizontal plane. After the laser chip 2 to be tested is placed on the test carrier 1, the test carrier 1 is provided with a test carrier temperature control plate 31, the temperature can be adjusted, and the test carrier is also provided with a test carrier negative pressure air path 32, so that the laser chip to be tested can be adsorbed after being positioned. The alignment system pushes the laser chip 2 to be tested from multiple angles, preferably, referring to fig. 1, in a top view, we can define four directions, namely front, back, left and right, and the front is blocked and positioned by the alignment baffle 4, so that only the three directions are required to be adjusted, and the alignment baffle 4 is fixed by the alignment baffle fixing screws. The left direction and the right direction are the X direction, and the Y direction is adjusted in a rear mode, so that the X direction guiding pushing plate can firstly conduct X direction guiding on the laser chip to be tested based on the preset chip size, and the luminous area of the chip is aligned to the center of the condensing lens; the Y-direction guiding push plate carries out Y-direction guiding on the laser chip to be detected, so that the light emergent cavity surface of the chip is tightly parallel to the guiding baffle plate; at this time, the light emitting area of the chip is precisely aligned with the condensing lens. For convenience of description, the left guiding push plate 5, the right guiding push plate 9 and the rear guiding push plate 13 may be defined to push the laser chip 2 to be tested from three directions respectively, and each guiding push plate does not move back after being pushed in place, so that the laser chip 2 to be tested is accurately clamped and controlled on the position to be tested by matching with the guiding baffle plate 4 from three directions. For automatic adjustment, the driving mechanisms may be configured for the push plates, which may be defined as a left guiding push plate buffer spring 6, a left guiding push plate X direction moving guide rail 7, a left guiding push plate X direction driving motor 8, a right guiding push plate buffer spring 10, a right guiding push plate X direction moving guide rail 11, a right guiding push plate X direction driving motor 12, a rear guiding push plate buffer spring 14, a rear guiding push plate Y direction moving guide rail 15, a rear guiding push plate Y direction driving motor 16, a right guiding push plate Z direction driving motor 43, and a right guiding push plate Z direction moving guide rail 44, wherein each guiding push plate is configured with a buffer spring, the spring force is adjustable, and damage to a chip during chip guiding can be avoided, for example, the right guiding push plate spring can be adjusted by a right guiding push plate spring adjusting screw 45. After the alignment is finished, the test probe is pressed down to the forward electrode of the laser chip to be tested to be electrified, and the electrical performance and the optical performance are tested. During optical performance test, light emitted by the laser chip to be tested is collected after passing through the condensing lens, so that the divergence angle of the light beam is reduced. And after the components such as the plane light receiving photodiode component, the integrating sphere, the optical fiber collimator, the bare optical fiber and the like in the light receiving component receive the collected light beams, optical performance tests such as optical power, optical spectrum and the like are carried out.

As an optimization scheme of the embodiment of the present invention, referring to fig. 1 to 9, when the laser chip to be tested, the light receiving component and the condensing lens are arranged, a light reflecting mirror 41 is further arranged, so that during an optical performance test, light emitted by the laser chip to be tested passes through the light reflecting mirror 41, and then enters the condensing lens 17 for condensing after being reflected by the light reflecting mirror 41. In this embodiment, in order to avoid the influence of the light receiving portion reflecting light back to the laser chip, the test accuracy is enhanced, and a light reflecting mirror 41 may be provided. Specifically, the laser chip to be tested, the condensing lens and the light receiving component are on the same horizontal plane. After the laser chip to be tested is placed on the test carrier, the guide system pushes the laser chip to be tested from multiple angles, preferably, referring to fig. 1, in the top view, we can define four directions of front, back, left and right, and the front is blocked and positioned by the guide baffle, so that only the three directions of left, right and back are needed to be adjusted, the left, right and left directions are the X direction, and the Y direction is adjusted in a rear mode, and thus the guide push plate in the X direction can firstly conduct X guide on the laser chip to be tested based on the preset chip size, so that the luminous area of the chip is aligned with the center of the condensing lens; the Y-direction guiding push plate carries out Y-direction guiding on the laser chip to be detected, so that the light emergent cavity surface of the chip is tightly parallel to the guiding baffle plate; at this time, the light emitting area of the chip is precisely aligned with the condensing lens. For convenience of description, a left guiding push plate, a right guiding push plate and a rear guiding push plate can be defined, driving mechanisms can be configured for the push plates for automatic adjustment, the driving mechanisms can be defined as a left guiding push plate buffer spring, a left guiding push plate X-direction moving guide rail, a left guiding push plate X-direction driving motor, a right guiding push plate buffer spring, a right guiding push plate X-direction moving guide rail, a right guiding push plate X-direction driving motor, a rear guiding push plate buffer spring, a rear guiding push plate Y-direction moving guide rail and a rear guiding push plate Y-direction driving motor, wherein each guiding push plate is provided with a buffer spring, the spring force is adjustable, and the damage to a chip during chip guiding can be avoided. After the alignment is finished, the test probe is pressed down to the forward electrode of the laser chip to be tested to be electrified, and the electrical performance and the optical performance are tested. During the optical performance test, the light beam 36 emitted by the laser chip to be tested firstly passes through the light reflecting mirror 41, the light beam 42 reflected by the light reflecting mirror 41 enters the condensing lens to be condensed, and finally the light beam 37 condensed by the condensing lens is received by the light receiving component to perform the optical performance test. Preferably, the light mirror 41 is also provided with a light mirror X-direction drive motor 38, a light mirror Z-direction drive motor 39, and a light mirror Z-direction movement guide 40.

As an optimization scheme of the embodiment of the present invention, referring to fig. 1 to 9, before the alignment system performs alignment, the alignment system is set through a working position, where the alignment system includes an alignment baffle and an alignment push plate, and the setting mode specifically includes: firstly, inputting the size parameters of the laser chip to be tested into an upper computer, and then inputting the gram weight value for calibrating the height of the pilot push plate; taking a lens center mark of a monitoring camera right above the test carrier as a reference, and based on the dimension parameters input into the upper computer, calculating the horizontal working position and the working origin position of the guide push plate by the upper computer; then, calibrating the position of the working height of the guide system, wherein the guide push plate moves downwards in small movement steps from an initial point along the vertical direction, in the whole process, the gram weight meter of the guide push plate detects the gram weight, when the guide push plate contacts the test carrier, the numerical value of the gram weight meter of the guide push plate starts to change, when the detected numerical value exceeds a set numerical value, the guide push plate stops moving in the vertical direction, and the upper computer records that the position in the vertical direction is the vertical working position of the guide push plate and automatically calculates the working origin position in the vertical direction; finally, the automatic setting of the working position of the pilot system is completed. In this embodiment, in order to fully automatically adjust the setting, an upper computer and a driving mechanism may be introduced, and the two are linked to implement automatic setting of the working position of the pilot push plate. Specifically, an upper computer program is preset, for example, a 'one-key setting pilot push plate position' is formulated on the upper computer. The size parameters of the laser chip to be measured are input into an upper computer program parameter information frame, wherein the parameters comprise the length, width, height and light-emitting area position (distance from the left end of the chip) of the laser chip to be measured, and gram weight values for calibrating the height of the guide push plate are input. After clicking the 'one-key setting guide push plate position' in the upper computer program, the guide system takes the lens center mark as a reference, and based on the input chip length, width and luminous area position information, program software can automatically calculate the horizontal working position and the working origin position of the three-way guide push plate (the working origin is compensated and set based on the working position). The alignment system then performs a position calibration of the working height, with each alignment pusher moving downward in small steps of motion from the initial point in the vertical direction, and the overall process alignment pusher gram weight meter performing gram weight detection, such as the right alignment pusher gram weight detection system 46. When the numerical value of the pilot push plate gram weight meter starts to change after the pilot push plate contacts the carrier, when the detection numerical value exceeds the set numerical value, the pilot push plate drives the click to stop the movement in the vertical direction, and the program automatically records the position in the vertical direction as the vertical working position of the pilot push plate and automatically calculates the working origin position in the vertical direction. Finally, the automatic setting of the working position of the pilot system is completed. Preferably, the monitoring camera may be a CCD lens, which is disposed directly above the test stage 1 in a top view in fig. 1 and is located at the center, and each lens has a center mark, and all the monitoring cameras may be based on the center mark, which is not shown in fig. 1.

As an optimization scheme of the embodiment of the present invention, referring to fig. 1 to 9, before the arrangement, the working position of the condensing lens is set by using an induction detection plate, and the working position of the condensing lens is set by using the induction detection plate specifically: continuously adding bias current to the forward electrode of the laser chip to be tested, and moving the induction detection plate to a position where the laser chip to be tested emits light; when the light emitted by the laser chip to be tested irradiates the induction detection plate, a point (X, Z) with highest light intensity/heat is formed, and then the coordinate is compared with the original point coordinate (0, 0) of the induction detection plate, so that the distance difference between the X direction and the Z direction is calculated; then, according to the distance difference, the center coordinate point (0, 0) of the induction detection plate is moved to the point (X, Z) with the highest light intensity/heat quantity so as to finish the position calibration of the induction detection plate, and at the moment, the moved positions (X1, Z1) of the induction detection plate are stored in an upper computer; the condensing lens and the sensing detection plate share the same 1-9-direction and Z-direction coordinates, and the X-direction difference is fixed X2, so that the working position of the condensing lens is calculated to be (X1-X2, Z1) from the working position of the sensing detection plate, and the working position of the condensing lens is automatically stored into a program parameter to complete automatic correction of the working position of the condensing lens. In this embodiment, in order to fully automatically adjust the setting, an upper computer and a driving mechanism may be introduced, and the two are linked to implement automatic setting of the working position of the pilot push plate. The driving mechanism may include a condensing lens X-direction driving motor 33, a condensing lens Z-direction driving motor 34, a condensing lens Z-direction moving rail 35, and a condensing lens X-direction moving rail 47, and power is given by these to adjust the position of the condensing lens, and they all receive instructions from the host computer. Similarly, the sensing probe plate is also provided with a driving mechanism, and specifically comprises a sensing probe plate Z-direction driving motor 48 and a sensing probe plate Z-direction moving guide rail 49. Specifically, after clicking the "one-button set condensing lens position" in the upper computer program, the test probe 3 automatically falls on the forward electrode of the laser chip 2 to be tested to continuously add bias current, and the sensing probe plate 18 moves to the position where the laser chip 2 to be tested emits light. After the light irradiates the sensing probe plate 18, there is a point (X, Z) with the highest light intensity/heat, and then the coordinate is compared with the origin coordinate (0, 0) of the sensing probe plate 18 to calculate the distance difference between the X and Z directions. Then, the central coordinate (0, 0) point of the sensing probe plate 18 is moved to the point (X, Z) with highest light intensity/heat quantity by the driving mechanism of the light receiving assembly, the automatic calibration of the position of the sensing probe plate 18 is completed, and the working position parameters (X1, Z1) are automatically stored into the program parameters. The working positions (X1-X2, Z1) of the condensing lens 17 are automatically saved into the program parameters, and the automatic correction of the working positions of the condensing lens 17 is completed. (the left movement is defined as negative, so the abscissa of the working position of the condensing lens is X1-X2).

As an optimization scheme of the embodiment of the present invention, referring to fig. 1 to 9, before the light receiving component is arranged, the setting of the working position is implemented by using an induction detection board, and the mode of setting the working position of the light receiving component by using the induction detection board specifically includes: continuously adding bias current to the forward electrode of the laser chip to be tested, and moving the induction detection plate to a position where the laser chip to be tested emits light; when the light emitted by the laser chip to be tested irradiates the induction detection plate, a point (X, Z) with highest light intensity/heat is formed, and then the coordinate is compared with the original point coordinate (0, 0) of the induction detection plate, so that the distance difference between the X direction and the Z direction is calculated; then, according to the distance difference, the center coordinate point (0, 0) of the induction detection plate is moved to the point (X, Z) with the highest light intensity/heat quantity so as to finish the position calibration of the induction detection plate, and at the moment, the moved positions (X1, Z1) of the induction detection plate are stored in an upper computer; the light receiving component and the sensing detection plate share the same 1-9-direction and Z-direction coordinates, and the X-direction difference is X2 which is fixed, so that the working position of the light receiving component is calculated as (X1-X2, Z1) from the working position of the sensing detection plate, and the working position of the light receiving component is automatically stored into a program parameter to complete automatic correction of the working position of the light receiving component. In this embodiment, the working position setting of the light receiving element (planar light receiving photodiode element, integrating sphere, optical fiber collimator, bare optical fiber, etc.) is the same as the working position setting principle of the condensing lens, and the working position of the light receiving element is automatically set by the X/Z direction working position program of the condensing lens. The X-direction distance between the light receiving components is fixed, so that the working positions of the light receiving components can be automatically set by a program at the same time.

The embodiment of the invention provides an edge-emitting semiconductor laser accurate test system, which comprises a test carrier 1, a guide system, a condensing lens 17, a test probe 3 and a light receiving component, wherein the test carrier 1 is used for placing a laser chip 2 to be tested, the guide system is used for pushing the laser chip 2 to be tested from a plurality of angles to adjust the position of the laser chip 2 to be tested on the test carrier 1, the condensing lens 17 is used for collecting light emitted by the laser chip 2 to be tested, the test probe 3 is used for powering the laser chip 2 to be tested, and the light receiving component is used for receiving a light beam collected by the condensing lens 17 and performing optical performance test. The light receiving assembly comprises a plane light receiving photodiode assembly, an integrating sphere, an optical fiber collimator and a bare optical fiber. In this embodiment, the test carrier 1 is used to carry the laser chip 2 to be tested and power up, so as to realize performance test under different conditions. The light receiving assembly is used for matching different light receiving assemblies to perform accurate optical performance test; the automatic calibration of the working position is realized by matching with a driving motor component. The condensing lens 17 has the function of converting the light path of the light emitted by the laser chip 2 to be tested, thereby playing the role of condensing the light beam and improving the accuracy of optical performance test; and with the driving motor, the software can automatically calibrate the working position of the condensing lens 17. The correcting system is used for adjusting the chip to be tested to an optimal position according to the different sizes and the different luminous positions of the chip, so as to realize accurate optical performance test; the automatic adjustment of the working position can be carried out by inputting chip information by matching with a driving motor, so that the debugging time is shortened. Specifically, the laser chip 2 to be tested, the condenser lens 17 and the light receiving element are on the same horizontal plane. After the laser chip 2 to be tested is placed on the test carrier 1, the guide system pushes the laser chip 2 to be tested from a plurality of angles, preferably, referring to fig. 1, in the top view, we can define four directions of front, back, left and right, and the front is blocked and positioned by the guide baffle 4, so that only the three directions of left, right and back are required to be adjusted, the left, right and left directions are the X direction, the Y direction is adjusted in a rear mode, and the guide push plate in the X direction firstly carries out X guide on the laser chip to be tested based on the preset chip size, so that the luminous area of the chip is aligned with the center of the condensing lens; the Y-direction guiding push plate carries out Y-direction guiding on the laser chip to be detected, so that the light emergent cavity surface of the chip is tightly parallel to the guiding baffle plate; at this time, the light emitting area of the chip is precisely aligned with the condensing lens. For convenience of description, the left guiding push plate 5, the right guiding push plate 9 and the rear guiding push plate 13 may be defined to push the laser chip 2 to be tested from three directions respectively, and each guiding push plate does not move back after being pushed in place, so that the laser chip 2 to be tested is accurately clamped and controlled on the position to be tested by matching with the guiding baffle plate 4 from three directions. For automatic adjustment, the driving mechanisms may be configured for the push plates, which may be defined as a left guiding push plate buffer spring 6, a left guiding push plate X direction moving guide rail 7, a left guiding push plate X direction driving motor 8, a right guiding push plate buffer spring 10, a right guiding push plate X direction moving guide rail 11, a right guiding push plate X direction driving motor 12, a rear guiding push plate buffer spring 14, a rear guiding push plate Y direction moving guide rail 15, a rear guiding push plate Y direction driving motor 16, a right guiding push plate Z direction driving motor 43, and a right guiding push plate Z direction moving guide rail 44, wherein each guiding push plate is configured with a buffer spring, the spring force is adjustable, and damage to a chip during chip guiding can be avoided, for example, the right guiding push plate spring can be adjusted by a right guiding push plate spring adjusting screw 45. After the alignment is finished, the test probe is pressed down to the forward electrode of the laser chip to be tested to be electrified, and the electrical performance and the optical performance are tested. During optical performance test, light emitted by the laser chip to be tested is collected after passing through the condensing lens, so that the divergence angle of the light beam is reduced. The plane light-receiving photodiode 19, integrating sphere 20, optical fiber collimator 21, bare optical fiber and other components in the light-receiving component receive the collected light beam and then perform optical performance test, such as optical power, optical spectrum and the like. Preferably, the transceiver assembly is also provided with a driving mechanism, and specifically includes an X-direction moving guide 22, an X-direction driving motor 23, a planar light receiving photodiode Z-direction driving motor 24, a planar light receiving photodiode Z-direction moving guide 25, an integrating sphere Z-direction driving motor 26, an integrating sphere Z-direction moving guide 27, an optical fiber collimator Z-direction driving motor 28, and an optical fiber collimator Z-direction moving guide 29.

Up to this point, the purpose of the above embodiment is:

firstly, the guide part adopts a three-way independent buffer push plate with a spring, and the guide structure of the light emitting surface of the laser chip adopts a thin baffle design. The three-way push plate is independently provided with the buffer spring, so that the damage to the laser chip during the movement of the push plate can be avoided; the three-way independent pushing plate works in a way of pushing rightwards, pushing leftwards and pushing upwards at last, and each pushing plate does not move backwards when moving to a working position, so that the effect is that the three-way pushing plate and the thin baffle accurately clamp and control the laser chip on the position to be tested, the guide precision is high, and the material throwing is avoided; the movement point positions of the pushing plates of the guide system are controlled by an upper computer program, and only the size, the position of the luminous point and the height calibration gram weight value of the guide plate of the laser chip to be detected are input, so that the program automatically calculates the setting of the movement point positions of the pushing plates, and the debugging time when switching products is greatly reduced; the thin baffle of the light-emitting surface is fixed on the base below the carrying platform through the fastening screw, the height is adjustable, the height of the upper edge of the baffle is generally set at 30 microns, the conventional edge-emitting semiconductor laser chip can be clamped and controlled, the light-emitting point of the laser chip can not be blocked, the height of the baffle is not limited to 30 microns, and the baffle can be adjusted according to different products. And the three-way positive push plate material is made of non-conductive rubber material with slightly soft texture, so that the damage of the push plate to the chip is directly avoided, and the influence on the test result due to the short circuit of the cavity surface of the chip caused by the conduction of the push plate is avoided.

Next, the optical performance testing section adds a condensing lens between the semiconductor laser chip to be tested and the light receiving element (planar light receiving photodiode element, integrating sphere, optical fiber collimator, bare optical fiber, etc.). The lens can collect light beams emitted by the laser chip, so that the subsequent light receiving component can receive more complete light, and due to the Bao Dangban, the lens can be adjusted to a position very close to a light emitting end of the laser chip, can be compatible with optical performance tests of edge-emitting semiconductor lasers with different divergence angles, and can greatly improve the test accuracy; in addition, due to the existence of the condensing lens, the rear end can be adapted to various types and specifications of light receiving components, and the light receiving component is not limited to the light receiving components, and the test system can realize the diversification of optical performance tests; in addition, due to the light condensation effect of the lens, the position adjustment range of the light receiving component arranged at the rear end is wider, the light receiving component is more flexible to use in a matching way, the light receiving component can be more accurately adjusted to the optimal light receiving position, and the test accuracy is improved; finally, the design thought of light beam adjustment is not limited to the linear layout from the laser chip to the condensing lens and then to the light collecting assembly, the original condensing lens can be designed into a light reflecting plate with an angle of 45 degrees, and the condensing lens and the light collecting assembly are assembled above the vertical reflecting plate.

Finally, the condensing lens component of the optical performance testing part is provided with an induction detection plate, the center of the induction detection plate and the center of the condensing lens are assembled on the same horizontal height, and the working principle is as follows: the sensing detection plate is internally provided with a coordinate mark, the sensing detection plate can receive light emitted by the laser chip and sense a coordinate point with highest light intensity/heat, then a coordinate origin preset by the detection plate is moved to the point, at the moment, the condensing lens and the sensing detection plate are at the same height, the transverse distance between the condensing lens and the sensing detection plate is fixed, then the optimal working coordinate position automatically recognized by the sensing detection plate can be fed back to an upper computer program, the upper computer program can accurately mark the optimal working position of the condensing lens after conversion, and the position of the rear-end light receiving component can also be automatically set to the optimal working position through the upper computer program. The design can improve the light receiving precision, greatly increase the accuracy of optical performance test and reduce the debugging time after switching products.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The method for precisely testing the edge-emitting semiconductor laser is characterized by comprising the following steps of:

s5, the light receiving assembly receives the collected light beams and then performs optical performance test;

before the arrangement, the working position of the condensing lens is set by the induction detection plate, and the working position of the condensing lens is set by the induction detection plate specifically comprises:

When the light emitted by the laser chip to be tested irradiates the induction detection plate, a point (X, Z) with highest light intensity/heat is formed, and then the coordinates (X, Z) are subjected to position comparison with the origin coordinates (0, 0) of the induction detection plate, so that the distance difference between the X direction and the Z direction is calculated; then, according to the distance difference, the center coordinate point (0, 0) of the induction detection plate is moved to the point (X, Z) with the highest light intensity/heat quantity so as to finish the position calibration of the induction detection plate, and at the moment, the moved positions (X1, Z1) of the induction detection plate are stored in an upper computer;

the condensing lens and the sensing detection plate share the same Y-direction and Z-direction coordinates, and the X-direction difference between the two is X2 which is fixed, so that the working position of the condensing lens is calculated as (X1-X2, Z1) from the working position of the sensing detection plate, the working position of the condensing lens is automatically stored into a program parameter to complete the automatic correction of the working position of the condensing lens,

the upper computer program can accurately mark the optimal working position of the condensing lens after conversion, the position of the rear-end light receiving component is automatically set to the optimal working position through the upper computer program,

the guide system comprises a plurality of guide pushing plates which respectively push the laser chip to be tested from a plurality of angles so as to adjust the position of the laser chip to be tested on the test carrier, and the guide pushing plates are spring buffer pushing plates.

2. The method for precisely testing the edge-emitting semiconductor laser according to claim 1, wherein: when the laser chip to be tested, the light receiving component and the condensing lens are arranged, a light reflecting mirror is also arranged, so that light emitted by the laser chip to be tested firstly passes through the light reflecting mirror and then enters the condensing lens for condensing after being reflected by the light reflecting mirror during optical performance test.

3. The method for precisely testing the edge-emitting semiconductor laser according to claim 1, wherein the alignment system is set by a working position before alignment, and the alignment system comprises an alignment baffle and an alignment push plate, and the setting method is specifically as follows:

4. The method for precisely testing the edge-emitting semiconductor laser according to claim 1, wherein the setting of the working position of the light receiving assembly is performed by using an induction detection plate before the arrangement, and the manner of setting the working position of the light receiving assembly by using the induction detection plate is specifically as follows:

the light receiving component and the sensing detection plate share the same Y-direction and Z-direction coordinates, and the X-direction difference is X2 which is fixed, so that the working position of the light receiving component is calculated as (X1-X2, Z1) from the working position of the sensing detection plate, and the working position of the light receiving component is automatically stored into a program parameter to complete automatic correction of the working position of the light receiving component.

5. The method for precisely testing the edge-emitting semiconductor laser according to claim 1, wherein: the guide system further comprises three guide baffles, the three guide baffles work independently, the laser chips to be tested are pushed from three directions respectively, and each guide baffle does not move backwards after being pushed in place, so that the laser chips to be tested are accurately clamped and controlled on the positions to be tested from the three directions by matching with the guide baffles.

6. The method for precisely testing the edge-emitting semiconductor laser according to claim 1, wherein: and in the process of setting the position of the guide system, the position of the condensing lens and the position of the light receiving component, a driving mechanism is adopted to match with a host computer to complete automatic setting.

7. A precision testing system of an edge-emitting semiconductor laser is characterized in that: the method for precisely testing the edge-emitting semiconductor laser according to any one of claims 1 to 6 comprises a test carrier, a guide system, a condensing lens, a test probe and a light receiving component,

the test carrier is used for placing the laser chip to be tested,

the test probe is used for powering up the laser chip to be tested,

8. The edge-emitting semiconductor laser precision test system according to claim 7, wherein: the light receiving assembly comprises a plane light receiving photodiode, an integrating sphere, an optical fiber collimator and a bare optical fiber.